CN212434647U

CN212434647U - Optical chip packaging structure and photoelectric device

Info

Publication number: CN212434647U
Application number: CN202020673094.XU
Authority: CN
Inventors: 姹や负; 汤为
Original assignee: Shenzhen Adaps Photonics Technology Co ltd
Current assignee: Shenzhen Adaps Photonics Technology Co ltd
Priority date: 2020-04-27
Filing date: 2020-04-27
Publication date: 2021-01-29
Anticipated expiration: 2030-04-27

Abstract

The application provides an optical chip packaging structure and an optoelectronic device. The optical chip packaging structure includes: a substrate; the photosensitive element is carried on the substrate; a support abutting against the substrate or provided on the photosensitive element; the first optical device and the support body are of an integral structure, and the first optical device is carried on one side of the support body, which is far away from the photosensitive element; and a lead wire for electrically connecting the first bonding point of the photosensitive element to the wiring inside the substrate via the lead wire. The optical chip packaging structure formed by supporting the optical device by the supporting body is simple and reliable, the process and manufacturing flow of the optical chip packaging structure is simple, and the manufacturing cost is effectively reduced. Because the optical chip packaging structure is simple, in the subsequent use process of the optical chip packaging structure, the wiring, the calibration and the like of the optical chip packaging structure can be realized without complex technology.

Description

Optical chip packaging structure and photoelectric device

Technical Field

The present application relates to the field of chip packaging technologies, and in particular, to an optical chip package structure and an optoelectronic device.

Background

At present, chips have become one of the most important electronic components in circuit design. In the chip manufacturing process, packaging is one of the main processes. The optical chip is related to an optical structure, and the traditional chip packaging process cannot package the optical chip. The existing optical chip packaging process has the disadvantages of high manufacturing cost, complex process flow and high calibration difficulty in the subsequent use process.

SUMMERY OF THE UTILITY MODEL

The application discloses optical chip packaging structure can reduce the cost of manufacture, and process flow is simple, and the calibration degree of difficulty is little.

In a first aspect, the present application provides an optical chip package structure, comprising:

a substrate;

the photosensitive element is carried on the substrate;

a support abutting against the substrate or provided on the photosensitive element;

the first optical device and the support body are of an integral structure, and the first optical device is carried on one side of the support body, which is far away from the photosensitive element; and

and a lead through which the first bonding point of the photosensitive element is electrically connected to the second bonding point of the wiring inside the substrate.

The optical chip packaging structure formed by supporting the optical device by the supporting body is simple and reliable, the process and manufacturing flow of the optical chip packaging structure is simple, and the manufacturing cost is effectively reduced. Because the optical chip packaging structure is simple, in the subsequent use process of the optical chip, the wiring, the calibration and the like of the optical chip can be realized without complex technology.

In a second aspect, the present application also provides an optoelectronic device comprising an optical chip package structure according to the first aspect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings based on the drawings without any inventive exercise.

Fig. 1 is a schematic top view of an optical chip package structure according to a first embodiment of the present disclosure.

Fig. 2 is a schematic sectional view taken along line I-I in fig. 1.

Fig. 3 is a schematic top view of an optical chip package structure according to an embodiment of the present disclosure.

Fig. 4 is a schematic sectional view taken along line II-II in fig. 3.

Fig. 5 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present disclosure.

Fig. 6 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present disclosure.

Fig. 7 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present application.

Fig. 8 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present application.

Fig. 9 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present application.

Fig. 10 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present application.

Fig. 11 is a schematic cross-sectional view illustrating an optical chip package structure according to another embodiment of the present application.

Fig. 12 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present application.

Fig. 13 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present application.

Fig. 14 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present application.

Fig. 15 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present application.

Fig. 16 is a schematic view of an optoelectronic device according to an embodiment of the present disclosure.

Fig. 17 is a schematic view illustrating a packaging method of an optical chip package structure according to an embodiment of the present application.

Fig. 18 is a schematic view illustrating an injection molding and cutting process of an optical chip package structure according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Fig. 1 and 2 are combined, and fig. 1 is a schematic top view of an optical chip package structure according to a first embodiment of the present disclosure; fig. 2 is a schematic sectional view taken along line I-I in fig. 1. The optical chip package structure 1 includes: substrate 11, light-receiving element 12, support 13, first optical device 14, and lead 15. The photosensitive element 12 is carried on the substrate 11. The support 13 is disposed on the photosensitive element 12. The first optical device 14 and the supporting body 13 are of an integral structure, and the first optical device 14 is carried on a side of the supporting body 13, which is far away from the photosensitive element 12. The lead 15 is used to electrically connect the first bonding point 123 of the photosensitive element 12 with the second bonding point 112 of the wiring inside the substrate 11. It is to be understood that, in the present embodiment, the supporting body 13 is provided on the photosensitive element 12, and in other embodiments, the supporting body 13 is provided on the substrate 11, and a form in which the supporting body 13 is provided on the substrate 11 will be described later.

It should be noted that, in order to clearly observe the positional relationship between the supporting body 13 and the first optical device 14, the supporting body 13 is shown in a perspective view in fig. 1, and does not represent that the supporting body 13 is exposed to the first optical device 14.

Specifically, the substrate 11 includes but is not limited to a lead frame or a substrate, the lead frame and the substrate both have a lead line, and the second bonding pad 112 is an exposed lead of the lead frame or the substrate. The substrate can be made of flexible circuit board, rigid-flexible circuit board or other types of circuit boards, and single-layer or multi-layer circuit boards made of various materials such as glass, ceramics and the like. The substrate 11 has a conductive circuit therein and a second bonding pad 112 exposed on the substrate 11. The second bonding pad 112 electrically connects the conductive lines.

The photosensitive element 12 is an optoelectronic device that can convert an optical signal into an electrical signal that can be read. Generally, the photosensitive element 12 operates in a specific light radiation band, and particularly, for example, the photosensitive element 12 in the ultraviolet light sensor operates in an ultraviolet light radiation band (315nm-400nm), and the photosensitive element 12 can receive light signals in different bands and convert the light signals into electric signals which can be read.

The material of the supporting body 13 may be, but is not limited to, a material having elasticity and viscosity, such as a resin material, a light-hardening material, a partial metal, a ceramic, and the like. Preferably, the support 13 is shaped like a cylinder to better support the first optical device 14.

Since the photosensitive element 12 operates in a specific optical radiation band, the first optical device 14 can pass an optical signal in a predetermined wavelength band, and light in other wavelength bands except the predetermined wavelength band cannot pass through the predetermined wavelength band.

The manner in which the lead 15 electrically connects the first bonding pad 123 of the photosensitive element 12 to the wiring inside the substrate 11 is exemplified as follows. And a second welding point 112 is arranged on the surface of the substrate 11, and the second welding point 112 is electrically connected with a circuit inside the substrate 11. The lead 15 is electrically connected to the first bonding point 123 of the photosensitive element 12 and the second bonding point 112, so as to electrically connect the first bonding point 123 of the photosensitive element 12 to a circuit inside the substrate 11, and further enable an electrical signal generated by the photosensitive element 12 to be transmitted to the circuit inside the substrate 11. If the substrate 11 is further provided with other electronic components electrically connected with the circuit inside the substrate 11, the electrical signal generated by the photosensitive element 12 can be transmitted to other electronic components, so that different functions can be realized. For example, the substrate 11 is further provided with a processor and a resistor, a current value passing through the resistor changes when the electric signal generated by the light sensing element 12 is transmitted to the processor and the resistor, and the processor can calculate the light power value received by the light sensing element 12 according to the changed current value. The lead 15 can be electrically or physically connected to the first bonding point 123 of the photosensitive element 12 and the second bonding point 112 of the substrate 11 by, but not limited to, soldering. The lead 15 may be, but not limited to, a metal material with strong solderability and conductivity, such as gold wire, copper wire or aluminum wire. It is understood that, as shown in fig. 2, the first welding points 123 are symmetrically distributed on the periphery of the photosensitive element 12, and the second welding points 112 are symmetrically distributed on the periphery of the substrate 11.

It can be understood that, in this embodiment, the optical chip package structure 1 formed by the supporting body 13 supporting the first optical device 14 is simple and reliable, and the process flow of the optical chip package structure 1 is simple, so that the manufacturing cost is effectively reduced. Because the optical chip packaging structure 1 is simple, in the subsequent use process of the optical chip packaging structure 1, the wiring, calibration and the like of the optical chip packaging structure 1 can be realized without complex technology.

In one possible embodiment, referring to fig. 2 again, the photosensitive element 12 includes a photosensitive region 121 and a non-photosensitive region 122, the non-photosensitive region 122 is disposed around the photosensitive region 121, the supporting body 13 is disposed on the non-photosensitive region 122, and the supporting body 13 is disposed around the photosensitive region 121.

The photosensitive region 121 is a region sensitive to light, and the photosensitive region 121 may receive an optical signal of a preset wavelength band and convert the optical signal of the preset wavelength band into an electrical signal, where the intensity of the electrical signal is positively correlated to the intensity of the optical signal of the preset wavelength band. By non-photosensitive region 122, it is meant a region that is not sensitive to light, and the non-photosensitive region 122 is not capable of converting an optical signal into an electrical signal.

In an embodiment, the first welding point 123 of the photosensitive element 12 is disposed in the non-photosensitive region 122 and on a side of the photosensitive element 12 facing away from the substrate 11, and a gap exists between the supporting body 13 and the first welding point 123 of the photosensitive element 12. In the present embodiment, the place where the lead 15 is connected to the photosensitive element 12 is the first bonding point 123 of the photosensitive element 12.

Specifically, a gap exists between the supporting body 13 and the first welding point 123 of the photosensitive element 12, so as to prevent the supporting body 13 from obstructing the connection between the lead 15 and the first welding point 123 of the photosensitive element 12. Then, the dimension of the support 13 in the direction perpendicular to the stacking direction of the photosensitive element 12 and the substrate 11 (i.e., the width of the support 13) is less than or equal to the minimum distance of the first welding point 123 of the photosensitive element 12 from the photosensitive region 121. In this embodiment, the stacking direction of the photosensitive element 12 and the substrate 11 is a longitudinal direction, and the supporting body 13 is a lateral direction in a direction perpendicular to the stacking direction of the photosensitive element 12 and the substrate 11. The distance between the first welding point 123 of the photosensitive element 12 and the photosensitive region 121 is in the range of 100 and 500 μm. For example, if the distance from the first welding point 123 of the photosensitive element 12 to the photosensitive region 121 is 300 μm, the width of the supporting body 13 is less than or equal to 300 μm.

In this embodiment, the first optical device 14 is disposed on an end surface of the support 13 facing away from the substrate 11. Further, the first optical device 14 protrudes from the periphery of the support body 13. At this time, an orthographic projection of the first optical device 14 on the substrate 11 covers the support 13. This arrangement facilitates alignment of the first optical device 14 and the support 13.

In a possible embodiment, please refer to fig. 3 and fig. 4 together, fig. 3 is a schematic top view of an optical chip package structure according to an embodiment of the present disclosure; fig. 4 is a schematic sectional view taken along line II-II in fig. 3. In the present embodiment, the supporting body 13 is disposed on the substrate 11, and the supporting body 13 is located on a side of the second welding point 112 of the substrate 11 facing away from the photosensitive element 12. In the figure, the connection point of the lead 15 to the substrate 11 is the second bonding point 112 of the substrate 11. This arrangement can reduce the influence of the supporting body 13 on the photosensitive element 12, and can reduce the size of the optical chip package 1 perpendicular to the plane of the substrate 11.

In an embodiment, there is a gap between the support 13 and the second welding point 112 of the substrate 11. Specifically, a gap exists between the support 13 and the second bonding point 112 of the substrate 11, so as to prevent the support 13 from obstructing the bonding of the lead 15 and the second bonding point 112 of the substrate 11. The dimension of the support 13 in the direction perpendicular to the direction in which the photosensitive element 12 and the substrate 11 are stacked (i.e., the width of the support 13) is smaller than or equal to the horizontal distance between the first welding point 123 of the photosensitive element 12 and the second welding point 112 of the substrate 11. In the present embodiment, the horizontal distance between the first welding point 123 of the photosensitive element 12 and the second welding point 112 of the substrate 11 is in the range of 100-500 μm. For example, if the horizontal distance between the first welding point 123 of the photosensitive element 12 and the second welding point 112 of the substrate 11 is 400 μm, the width of the supporting body 13 in the direction perpendicular to the stacking direction of the photosensitive element 12 and the substrate 11 should be less than or equal to 400 μm.

In one embodiment, the first optical component 14 is arranged on an end face of the support 13 facing away from the substrate 11. In the present embodiment, the outer peripheral side surface of the first optical device 14 is flush with the outer peripheral side surface of the support body 13. This arrangement can enhance the supporting strength of the supporting body 13 to the first optical device 14, and can make the optical chip package structure 1 smaller in size parallel to the plane of the substrate 11.

In one possible embodiment, please refer to fig. 5, and fig. 5 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present disclosure. In this embodiment, the support 13 is provided on the substrate 11. The support 13 has a support body 131 and an extension portion 132 protruding from one side of the support body 131, the extension portion 132 covers the peripheral side surface of the substrate 11, and the height of the extension portion 132 is greater than or equal to the thickness of the substrate 11.

Specifically, the height of the extension portion 132 needs to be greater than or equal to the thickness of the substrate 11, so that the extension portion 132 covers the substrate 11 at the outer side of the substrate 11. It can be understood that, in the present embodiment, due to the extension portion 132, the contact area between the supporting body 13 and the substrate 11 is larger, and the connection between the supporting body 13 and the substrate 11 is firmer.

It is understood that moisture, dust, etc. in the air may enter the optical chip package 1 from the joint of different materials, for example, the joint of the support 13 and the substrate 11 enters the optical chip package 1, resulting in the second bonding point 112 of the lead 15 and the substrate 11 being peeled off or the photosensitive area 121 being covered by dust. In the present embodiment, since the extension portion 132 is covered on the substrate 11, moisture and dust are not easy to enter the inside of the optical chip package structure 1 from the joint of the supporting body 13 and the substrate 11, so that the probability of the lead 15 falling off from the second bonding pad 112 of the substrate 11 and the risk of the photosensitive area 121 being covered by dust are reduced.

In this embodiment, in the optical chip package structure 1, the first optical device 14 is disposed on an end surface of the support 13 facing away from the substrate 11, and an outer peripheral side surface of the first optical device 14 is flush with an outer peripheral side surface of the support 13.

In a possible embodiment, please refer to fig. 6, and fig. 6 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present disclosure. In the present embodiment, the support 13 is disposed on the substrate 11, the substrate 11 is disposed with a bonding member 111, and the support 13 is disposed corresponding to the bonding member 11 and fixed to the substrate 11 by the bonding member 111.

Preferably, the width of the bonding element 111 in the horizontal direction should be greater than or equal to the width of the supporting body 13 in the horizontal direction, and the bonding element 111 is spaced from the lead 15 and the second bonding point 112 of the substrate 11 by a certain distance so as to avoid obstructing the bonding of the lead 15 and the second bonding point 112 of the substrate 11.

It is understood that in one embodiment, the substrate 11 is integrally formed or constructed with the bonding element 111. The bonding element 111 raises the bonding position of the substrate 11 and the supporting body 13, so that moisture and dust in the air are not easy to enter the optical chip packaging structure 1, and meanwhile, the moisture is not easy to contact the lead 15 and the second welding point 112 of the substrate 11, thereby further reducing the probability of falling off of the lead 15 and the second welding point 112 of the substrate 11 and reducing the risk of covering the photosensitive area 121 with dust.

In one possible embodiment, please refer to fig. 7, and fig. 7 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present disclosure. The substrate 11 is provided with a bonding element 111, the supporting body 13 has a supporting body 131 and an extending portion 132 protruding from one side of the supporting body 131, and the extending portion 132 covers the bonding element 111 and the outer side of the substrate 11.

Specifically, the height of the extension portion 132 should be greater than or equal to the thickness of the bonding element 111 and the substrate 11, so that the extension portion 132 can cover the bonding element 111 and the substrate 11. It can be understood that, in the present embodiment, moisture and dust in the air are not easy to enter the inside of the optical chip packaging structure 1.

In summary of the above embodiments, the optical chip package 1 may be formed into different shapes according to the structures adopted between the substrate 11 and the supporting body 13, the first optical device 14, and the arrangement of the second bonding pads 112 on the substrate 11, such as Quad Flat No-lead (QFN), Dual Flat No-lead (DFN), Land Grid Array (LGA), Ball Grid Array (BGA). The substrate 11 in the BGA package form is made of a lead frame, and the substrate 11 in the QFN, DFN, LGA package forms is made of a substrate.

In one possible embodiment, please refer to fig. 8 and 9 together, fig. 8 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present application; fig. 9 is a schematic cross-sectional view of an optical chip package structure according to another embodiment of the present application. The optical chip package structure 1 further includes an injection molded body 16, where the injection molded body 16 covers a portion of the first optical device 14, or the injection molded body 16 completely covers the first optical device 14.

It should be noted that the injection molded body 16 can be applied to the optical chip packaging structure 1 described in any one of the above embodiments, and the application is illustrated by the embodiments of fig. 8 and fig. 9, which do not represent that the application limits the application range of the injection molded body 16.

Specifically, the main components of the injection molded body 16 include, but are not limited to, epoxy resin and various additives (e.g., curing agent, modifier, mold release agent, coloring agent, flame retardant, etc.). The injection molded body 16 covers the substrate 11 and the first optical device 14, but not limited to, filling the injection molding material into the substrate 11 in a molten state, and forming the injection molded body 16 after the injection molding material is cooled and solidified. In the present embodiment, the injection conditions of the injection molded body 16 include: the injection temperature range is 145-160 ℃; the curing time in the mould is 1.5-2.5 minutes; the transmission pressure is 3-8 MPa. The injection molded part 16 provides physical and electrical protection for the substrate 11 and the first optical component 14 from external physical and electrical interference.

Specifically, referring to fig. 8, the photosensitive element 12 includes a photosensitive area 121 and a non-photosensitive area 122, and the non-photosensitive area 122 is surrounded by the photosensitive area 121. The injection molding body 16 covers the portion of the first optical device 14, and the injection molding body 16 covers the portion of the first optical device 14 corresponding to the non-photosensitive area 122 and exposes the portion of the first optical device 14 corresponding to the photosensitive area 121. As shown in fig. 8, the injection molded body 16 covers at least a portion of the substrate 11, and the injection molded body 16 does not cover the photosensitive element 12. That is, the injection molded body 16 does not affect the light received by the photosensitive element 12. Therefore, in the present embodiment, the injection-molded body 16 may be a light-transmitting material or a light-proof material (e.g., solid epoxy resin, phenolic resin filler, etc.).

In the present embodiment, as shown in fig. 8, the injection molded body 16 includes a peripheral side wall 163 and a top wall 164 connected by bending. The peripheral side wall 163 is provided around the outer peripheral side of the substrate 11, the photosensitive element 12, the support 13, and the first optical device 14. The peripheral side wall 163 is connected to the peripheral side surface of the substrate 11. The top wall 164 is attached to the first optical device 14, and a through hole 165 is formed in the top wall 164, and the through hole 165 penetrates through the top wall 164 to the surface of the first optical device 14. The through hole 165 is disposed corresponding to the photosensitive area 121, and an orthogonal projection of the top wall 164 on the substrate 11 falls outside an orthogonal projection of the photosensitive area 121 on the substrate 11, so as to avoid blocking light entering the photosensitive area 11.

As shown in fig. 9, the injection molded body 16 completely covers the substrate 11 and the photosensitive element 12. When the injection molded body 16 covers the substrate 11 and the photosensitive element 12, the injection molded body 16 is disposed corresponding to the photosensitive area 121 and the non-photosensitive area 122, and in order to reduce the influence of the injection molded body 16 on the photosensitive element 12, the injection molded body 16 is transparent.

Specifically, when the injection molded body 16 is transparent, the material of the injection molded body 16 is transparent, and the light transmittance of the injection molded body 16 is determined by the thickness of the injection molded body 16 and the wavelength of light. In one embodiment, the injection molded body 16 is transparent to light having a wavelength greater than 400 nm. Preferably, the thickness of the injection molded body 16 is 1mm, and the light transmittance of the injection molded body 16 is 98% when the light wavelength is 940 nm.

In a possible embodiment, the injection molded body 16 is further filled in a space formed by the substrate 11, the support 13, the photosensitive element 12, and the first optical device 14, and the injection molded body 16 further covers a peripheral side surface of the substrate 11 and a peripheral side surface of the support 13.

As shown in fig. 9, when the injection molded body 16 is disposed on the substrate 11, the photosensitive element 12, the support body 13, the first optical device 14, and the lead 15 are completely embedded in the injection molded body 16. It will be appreciated that in this embodiment, the complete encapsulation of the first optic 14 allows the injection molded body 16 to provide better physical protection to the first optic 14.

As shown in fig. 8 and 9, the first optical device 14 is disposed on an end surface of the support 13 facing away from the photosensitive element 12, and the first optical device 14 protrudes from a peripheral edge of the support 13.

Referring to fig. 10 and 11 together, fig. 10 is a cross-sectional view illustrating an optical chip package structure according to another embodiment of the present application; fig. 11 is a schematic cross-sectional view illustrating an optical chip package structure according to another embodiment of the present application. As shown in fig. 10 and 11, the first optical device 14 is provided on an end surface of the support 13 facing away from the substrate 11, and an outer peripheral side surface of the first optical device 14 is flush with an outer peripheral side surface of the support 13. In the present embodiment, as shown in fig. 10, the injection molded body 16 includes a peripheral sidewall 163 and a top wall 164 connected by bending, and the peripheral sidewall 163 is disposed around the peripheral sides of the substrate 11, the photosensitive element 12, the support 13, and the first optical device 14. The peripheral side wall 163 is connected to the peripheral side surface of the substrate 11. The peripheral sidewall 163 abuts against the outer peripheral side of the support 13 so that the optical chip package 1 has a small size in the lateral direction. The top wall 164 is provided with a through hole 165, and the through hole 165 penetrates the top wall 164 to the surface of the first optical device 14. The orthographic projection of the top wall 164 on the substrate 11 falls outside the orthographic projection of the photosensitive area 121 on the substrate 11 to avoid blocking light entering the photosensitive area 11.

Fig. 11 provides an optical device package 1 that is the same as the basic structure of the optical device package 1 provided in fig. 10, except that in fig. 11, the injection molded body 16 is encapsulated on the outer periphery of the substrate 11, the outer periphery of the supporting member 13, and the outer periphery of the first optical device 14, and fills the gap spaces of the substrate 11, the photosensitive chip 12, the supporting member 13, and the first optical device 14.

In a possible embodiment, please refer to fig. 12, and fig. 12 is a schematic cross-sectional view of an optical chip package structure according to still another embodiment of the present disclosure. The optical chip packaging structure 1 further comprises at least one second optical device 17, the second optical device 17 is disposed on a side of the first optical device 14 facing away from the supporting body 13, the injection molded body 16 is partially filled between the first optical device 14 and the second optical device 17, and the injection molded body 16 supports the second optical device 17.

In the schematic diagram of the present embodiment, the optical chip package structure 1 including the second optical device 17 is taken as an example to be combined with one of the optical chip package structures 1 provided in the foregoing embodiments, and should not be understood as a limitation of the optical chip package structure 1 provided in the present application.

Specifically, the light passing through the second optical device 17 is first filtered by the second optical device 17 and then enters the first optical device 14, and the light is second filtered by the first optical device 14 and then enters the photosensitive element 12.

It can be understood that, in the present embodiment, the second optical device 17 is used in combination with the first optical device 14, so that the light filtering effect is better, the light band received by the light sensing element 12 is more accurate, and the converted electrical signal is more accurate.

In a possible embodiment, referring again to fig. 12, a recess 161 is formed on a side of the injection molded body 16 facing away from the first optical device 14, and a protrusion 162 is disposed on a side wall of the recess 161, and the protrusion 162 is used for carrying the second optical device 17.

It will be appreciated that the optical transmission of the injection molded body 16 is related to the thickness of the injection molded body 16. In the present embodiment, the groove 161 exists between the first optical device 14 and the second optical device 17, and the thickness of the injection molded body 16 is reduced, so that the light transmittance of the injection molded body 16 at the part is relatively increased.

As shown in fig. 12, the first optical device 14 is disposed on an end surface of the support 13 facing away from the photosensitive element 12. Further, the first optical device 14 protrudes out of the periphery of the supporting body 13, and the injection molded body 16 completely covers the substrate 11, the photosensitive element 12, the supporting body 13 and the first optical device 14.

In other possible embodiments, please refer to fig. 13, 14 and 15 together, and fig. 13 is a schematic cross-sectional view of an optical chip package structure according to still another embodiment of the present disclosure; FIG. 14 is a cross-sectional view of an optical chip package according to still another embodiment of the present application; fig. 15 is a schematic cross-sectional view illustrating an optical chip package structure according to still another embodiment of the present application. Specifically, as shown in fig. 13, the first optical device 14 is disposed on an end surface of the support 13 facing away from the substrate 11, an outer peripheral side surface of the first optical device 14 is flush with an outer peripheral side surface of the support 13, and the injection molded body 16 completely covers the substrate 11 and the photosensitive element 12. The optical chip package structure provided in fig. 14 may be the optical chip package structure described in fig. 7 and the related description, and the description of the same is omitted here. In the present embodiment, the second optical means 17 is arranged on the injection molded part 16, in particular, the second optical means 17 is arranged on the top wall 164 of the injection molded part 16. The optical chip package structure provided in fig. 15 may be the optical chip package structure described in fig. 7 and the related description, and the description of the same is omitted here. The second optical device 17 is disposed on a surface of the top wall 164 of the package body 16 facing away from the first optical device 14.

In a possible embodiment, the photosensitive element 12 includes a photosensitive area 121 and a non-photosensitive area 122, the non-photosensitive area 122 is surrounded around the photosensitive area 121, and the orthographic projections of the first optical device 14 and the second optical device 17 on the plane of the photosensitive element 12 cover the area where the photosensitive area 121 is located.

Specifically, since the light travels in a straight line in the same homogeneous medium, the orthogonal projections of the first optical device 14 and the second optical device 17 on the plane of the photosensitive element 12 cover the area where the photosensitive region 121 is located, that is, the light received by the photosensitive region 121 of the photosensitive element 12 must be filtered by the first optical device 14 or the first optical device 14 and the second optical device 17, so as to ensure the normal operation of the photosensitive element 12.

It is understood that, if the optical chip package structure includes two or more second optical devices 17, the second optical devices 17 are stacked on the plurality of protrusions 162 of the injection molded body 16 to form a step structure, and the plurality of protrusions 162 are used for supporting the two or more second optical devices 17.

In one possible embodiment, the first optical device 14 includes any one or more of a filter, a convex mirror, a concave mirror, a prism, and a plate having a through hole.

When the optical chip package structure 1 is a micro-electro-mechanical system (MEMS) product, the first optical device 14 is a substrate with a hole, which may be, but not limited to, glass, and the hole may serve as a sound hole, so that a MEMS microphone or other pressure MEMS device may be packaged.

When the first optical device 14 is a different optical device, the corresponding optical chips have different functions. For example, when the first optical device 14 is an optical filter, the function of the optical chip may be to receive an optical signal in a specific wavelength band and calculate the power of the optical signal; for another example, when the first optical device is a convex mirror, the function of the optical chip may be to calculate a refractive index of received light or the like.

Referring to fig. 16, fig. 16 is a schematic view of an optoelectronic device 2 according to an embodiment of the present disclosure. The optoelectronic device 2 comprises an optical package structure 1 as described above. The optical package structure please refer to the above description, which is not repeated herein.

Specifically, in this embodiment, the optoelectronic device 2 may be a depth-sensing camera, as shown in fig. 16, and the optoelectronic device 2 further includes a light emitter 21. The deep camera is characterized in that the light emitter 21 emits infrared light, and the first optical device 14 and the second optical device 17 can filter light after the infrared light is reflected, so that the light sensing element 12 only receives the reflected infrared light. By calculating the time of transmission and reception of the infrared light, the distance of the reflected infrared light object from the optoelectronic device 2 can be obtained.

The application also provides a packaging method of the optical chip packaging structure 1. Next, a packaging method of the optical chip package 1 of the present application will be described in detail with reference to the optical chip package 1 provided in any of the foregoing embodiments. Referring to fig. 17, fig. 17 is a schematic view illustrating a packaging method of an optical chip package structure according to an embodiment of the present application. The packaging method of the optical chip packaging structure 1 comprises the following steps: steps S101, S102, S103, and S104, and the specific contents of steps S101, S102, S103, and S104 are as follows.

S101, providing a substrate and a plurality of photosensitive elements, and bonding the photosensitive elements to the substrate;

specifically, the process of bonding the photosensitive element 12 to the substrate 11 includes, but is not limited to, a eutectic alloy method, a resin bonding method, a tape bonding method, and the like. After the photosensitive element 12 is adhered to the substrate 11, a good ohmic contact is formed with the substrate 11, that is, a pure resistor is formed at the contact position of the photosensitive element 12 and the substrate 11, and the resistance value is small. The photosensitive element 12 has good heat dissipation performance, chemical performance and mechanical strength after being bonded to the substrate 11.

S102, providing a lead, and welding a first welding point of the photosensitive element and a second welding point of the substrate through the lead;

specifically, the support 13 may be formed on the first optical device 14 by injection molding, bonding, screen printing, glue drawing, sputtering, and the like, and the support 13 is disposed around the first optical device 14. The support 13 and the first optical device 14 are then bonded to the photosensitive element 12 or the substrate 11 by means of bonding, ultrasonic bonding, sintering, fusion bonding, or the like.

S103, providing a plurality of supporting bodies and a plurality of first optical devices, wherein the single supporting body and the single first optical device are integrally formed;

specifically, the bonding process of the lead 15 includes, but is not limited to, thermocompression bonding, thermocompression ultrasonic bonding, and ultrasonic bonding. After welding, the lead 15 has the characteristics of strong bonding force, small contact resistance, good conductivity, certain mechanical strength and the like.

And S104, bonding the support body with the photosensitive element or the substrate.

Specifically, depending on the amount of the injection molded body 16, the injection molded body 16 may be partially filled in at least a portion of the substrate 11, and the injection molded body 16 may completely cover the substrate 11 and the photosensitive element 12. The injection molded body 16 has good insulation, sealing, mechanical strength, and other features to provide physical protection for the substrate 11, the photosensitive element 12, and the first optical device 14.

It is understood that, in the present embodiment, the order of the packaging method of the optical chip package structure 1 may be changed as long as the support 13 and the first optical device 14 integrally molded are not affected to be adhered to the photosensitive element 12 or the substrate 11.

In a possible embodiment, please refer to fig. 18, and fig. 18 is a schematic view illustrating an injection molding and cutting process of an optical chip package structure according to an embodiment of the present application. The method further comprises the following steps: steps S201, S202, S203, S204, and steps S201, S202, S203, S204 will be described in detail as follows.

S201, providing the injection molding material, and coating the injection molding material on parts of the first optical devices or completely coating the plurality of first optical devices;

s203, independently separating each photosensitive element, the corresponding support body and the first optical device;

and S204, cutting off the redundant injection molding material.

In particular, in the process production, a plurality of optical chips connected together are usually packaged at one time. After the packaging is completed, each optical packaging structure needs to be separated independently, and the excess connecting material and part of the protruding resin material need to be cut off.

In a possible embodiment, as shown in fig. 18, before the step S203 of independently separating each photosensitive element and the corresponding support, and the first optical device, the method further includes: step S202, step S202 is described in detail as follows.

S202, arranging at least one second optical device on the injection molding material, wherein the second optical device is positioned on one side of the first optical device, which is far away from the support body.

Specifically, please refer to the above description for the second optical device 17, which is not described herein again.

The principle and the implementation of the present application are explained herein by applying specific examples, and the above description of the embodiments is only used to help understand the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An optical chip package, comprising:

a substrate;

the photosensitive element is carried on the substrate;

a support disposed on the substrate or on the photosensitive element;

a lead for electrically connecting a first bonding point of the photosensitive element with a second bonding point of a wiring inside the substrate.

2. The optical chip package of claim 1, wherein the photosensitive element comprises a photosensitive region and a non-photosensitive region, the non-photosensitive region is surrounded by the photosensitive region, the supporting body is disposed in the non-photosensitive region, and the supporting body is disposed around the photosensitive region.

3. The optical chip package of claim 2, wherein the first bonding pad is disposed in the non-photosensitive region and on a side of the photosensitive element facing away from the substrate.

4. The optical chip package structure of claim 3, wherein the distance between the first bonding pad and the photosensitive region is in the range of 100-500 μm, and the width of the supporting body is smaller than or equal to the distance range.

5. The optical chip package of claim 1, wherein the support is disposed on the substrate and the support is located on a side of the second bonding pad facing away from the photosensitive element.

6. The optical chip package structure as claimed in claim 5, wherein the distance between the second bonding point and the peripheral side surface adjacent to the substrate is in the range of 100-500 μm, and the width of the support is smaller than or equal to the distance range.

7. The optical chip package structure of claim 1, wherein the first optical device is disposed on an end surface of the support body facing away from the substrate, and the first optical device protrudes beyond a periphery of the support body.

8. The optical chip package structure of claim 1, wherein the first optical device is disposed on an end surface of the support body facing away from the substrate, and a peripheral side surface of the first optical device is flush with a peripheral side surface of the support body.

9. The optical chip package structure as claimed in any one of claims 5 to 8, wherein when the supporting body is disposed on the substrate, the supporting body has a supporting body and an extending portion protruding from one side of the supporting body, the extending portion covers a peripheral side surface of the substrate, and a height of the extending portion is greater than or equal to a thickness of the substrate.

10. The optical chip package structure according to any one of claims 5 to 8, wherein when the supporting body is disposed on the substrate, a bonding member is disposed on the substrate, the substrate is integrally formed with the bonding member, and the supporting body is disposed corresponding to the bonding member and bonded to the substrate through the bonding member.

11. The optical chip package of claim 1, wherein the optical chip package further comprises:

an injection molded body that encapsulates a portion of the first optical device, or the injection molded body completely encapsulates the first optical device.

12. The optical chip package structure of claim 11, wherein the photosensitive element comprises a photosensitive region and a non-photosensitive region, the non-photosensitive region is surrounded around the photosensitive region, and when the injection molding body covers the portion of the first optical device, the injection molding body covers the portion of the first optical device corresponding to the non-photosensitive region and exposes the portion of the first optical device corresponding to the photosensitive region.

13. The optical chip package structure according to any one of claims 1 or 12, wherein the optical chip package structure further comprises an injection molded body, the injection molded body includes a peripheral sidewall and a top wall connected by bending, the peripheral sidewall surrounds the substrate, the photosensitive element, the supporting body and the peripheral side of the first optical device, and the peripheral sidewall is connected to the peripheral side surface of the substrate, the top wall is attached to the first optical device, and the top wall has a through hole, the photosensitive element includes a photosensitive area and a non-photosensitive area, the non-photosensitive area surrounds the photosensitive area, the through hole corresponds to the photosensitive area, and the orthographic projection of the top wall on the substrate falls outside the orthographic projection of the photosensitive area on the substrate.

14. The optical chip package structure of claim 11, wherein the light-sensing element comprises a light-sensing area and a non-light-sensing area, the non-light-sensing area is surrounded by the light-sensing area, when the injection molded body completely covers the first optical device, the injection molded body is disposed corresponding to the light-sensing area and the non-light-sensing area, and the injection molded body is made of a light-transmitting material.

15. The optical chip package structure of claim 14, wherein the injection molded body further fills a space formed by the substrate, the support, the photosensitive element, and the first optical device, and the injection molded body further covers a peripheral side surface of the substrate and a peripheral side surface of the support.

16. The optical chip package structure according to claim 11, wherein the optical chip package structure further comprises at least one second optical device, the second optical device is disposed on a side of the first optical device facing away from the support body, and the injection molded body is partially filled between the first optical device and the second optical device, the injection molded body supports the second optical device.

17. The optical chip package of claim 16, wherein a side of the injection molded body facing away from the first optical device forms a groove, and a sidewall of the groove is provided with a protrusion for carrying the second optical device.

18. The optical chip package structure of claim 16, wherein the light sensing element comprises a light sensing region and a non-light sensing region, the non-light sensing region is surrounded by the light sensing region, and an orthographic projection of the first optical device and the second optical device on a plane where the light sensing element is located covers an area where the light sensing region is located.

19. The optical chip package structure of claim 1, wherein the first optical device comprises any one or more of a filter, a convex mirror, a concave mirror, a prism, a plate with a through hole.

20. An optoelectronic device comprising an optical chip package according to any one of claims 1 to 19.