JP2009042469A - Optical module, method of manufacturing optical module, optoelectronic composite circuit composed by using optical module and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module in which an optical wiring pattern and an electric wiring pattern are easily made, a method of manufacturing the optical module, an optoelectronic composite circuit composed by using the optical module and a method of manufacturing the optoelectronic composite circuit. <P>SOLUTION: The optoelectronic composite circuit is composed of: a circuit substrate 1 on which an electric wiring pattern 1a is formed; and a plurality of optical modules 2a and 2b which are arranged and mounted in a state that a receiving part 2a1 and a receiving part guide 2b1 are combined on the electric wiring pattern 1a, wherein adjacent two ports formed on the contact faces of the two optical modules 2a and 2b are optically coupled via an optical coupling part 4 formed by applying and hardening an adhesive for optical coupling, an electric wiring is formed by the electric wiring pattern 1a of the circuit substrate 1 and a lower face electrode of the optical modules, and the optical wiring is formed by an optical waveguide of the optical modules. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention is configured using an optical module formed by combining a semiconductor chip such as a light emitting element, a light receiving element, and an arithmetic circuit chip and an optical circuit including an optical waveguide, an optical module manufacturing method, and an optical module. The present invention relates to an optical / electronic composite circuit and a manufacturing method thereof.

  In general, an electronic circuit is formed by soldering active transistors and ICs (Integrated Circuits) and capacitors and resistors, which are passive elements, onto an electric wiring pattern formed on a printed wiring board. These transistors, ICs, capacitors and resistors are commercially available with general performance. As for the printed wiring board, a printed wiring board material formed by further applying a photoresist on an epoxy board on which a copper foil is uniformly applied is commercially available, and this printed wiring board material and a commercially available photo-etching solution Is used to etch the copper foil and form an electric wiring pattern on the printed wiring board material to obtain a printed wiring board having the electric wiring pattern required by the final user who constructs the electronic circuit. The end user can relatively easily form an electronic circuit using the printed wiring board and elements such as a transistor, an IC, a capacitor, and a resistor.

  On the other hand, some optical circuits are provided with an optical wiring pattern along with an electric wiring pattern in a substrate. As a conventional example of a substrate used in such an optical circuit, there is an IC chip mounting substrate (conventional example 1) disclosed in JP-A-2002-250830.

<Conventional example 1>
As shown in FIG. 23, the IC chip mounting substrate of Conventional Example 1 is formed by laminating a conductor circuit 1224 as an electric wiring pattern and an interlayer resin insulation layer 1222 on the upper and lower surfaces of the substrate 1221, and a solder resist layer as the outermost layer. 1234 is formed. Two optical waveguides 1250 are also formed on the upper surface of the substrate 1221. An optical element (light emitting portion 1238a of the light receiving element 1238 and light receiving portion 1239a of the light emitting element 1239) disposed on the upper surface of the IC chip mounting substrate is formed on the portion of the optical waveguide 1250 where the optical path conversion mirror is formed. An optical signal transmission optical path 1242, which is an optical wiring pattern connecting the optical waveguide 1250, is formed. The optical signal transmission optical path 1242 is formed in a direction perpendicular to the upper surface of the substrate 1221, and includes a resin composition 1242 a and a gap 1242 b and a conductor layer 1245 formed around the resin composition 1242 a. The electrodes of the IC chip 1240, the light receiving element 1238, and the light emitting element 1239 arranged on the surface of the IC chip mounting substrate are connected to the conductor circuit 1224 via the solder connection portion 1244, and the conductor circuit 1224 of each layer is They are connected to each other through via holes 1227 formed in interlayer resin insulation layer 1222. On the other hand, the solder bumps 1237 disposed on the lower surface of the IC chip mounting substrate are connected to the conductor circuit 1224, and the conductor circuits 1224 of each layer are mutually connected via via holes 1227 formed in the interlayer resin insulating layer 1222. It is connected.

  In addition, toys such as electronic blocks and my kits (both published by Gakken Co., Ltd.) are sold as learning equipment for easily assembling electronic circuits. For example, an electronic block has electrodes on four sides of a cubic block, and an active element or passive element is incorporated in the block. Furthermore, the symbol mark of the element is printed on the upper surface of the block, and the lower surface is provided with a recess that fits into the protruding portion formed on the base. When assembling an electronic circuit by arranging blocks on a table, if the blocks are fitted into a plurality of protrusions arranged in a grid, the electrodes on the four sides come into contact with the electrodes on the adjacent blocks, and the adjacent blocks are mutually connected. It is configured to be electrically connected, and there is no need to newly form an electric wiring pattern.

  As a conventional example of an optical circuit having the same concept as this electronic block, there is a hybrid type optical integrated circuit (conventional example 2) disclosed in Japanese Patent Laid-Open No. 5-129586.

<Conventional example 2>
The hybrid optical integrated circuit of Conventional Example 2 includes a semiconductor infrared laser chip 2001 (see FIG. 24), a planar lens chip 2002 (see FIG. 25), a fixed stand chip 2003 (see FIG. 26), and a spacer chip 2004 (see FIG. 27). ) And a substrate 2005 (see FIG. 27) having grooves for fitting and fixing these chips. The semiconductor infrared laser chip 2001 includes a chip base 2010 and an optical element (for example, PD (photo diode) or LED (Light Emitting Diode)) 2013 disposed on the upper surface thereof. The chip base 2020 includes a flat lens 2023 disposed on the upper surface thereof, and the fixed base chip 2003 includes a chip base 2030 having a groove 2034 having a V-shaped cross section. Each chip base 2010, 2020, 2030 and spacer chip 2004 are substantially rectangular parallelepiped members, each having one convex notch 20111, 2021, 2031 on the right side and one concave notch 2012 on the left side. , 2022 and 2032. Each notch 2011, 2012, 2021, 2022, 2031 and 2032 is formed at a position where the center line of the notch coincides with the optical axis when the chip is viewed from above.

  When a hybrid optical integrated circuit is assembled using such a chip, as shown in FIG. 27, the semiconductor infrared laser chip 2001, the planar lens chip 2002, and the fixed are fixed while meshing the convex notch and the concave notch. By sequentially fitting the base chip 2003 and the spacer chip 2004 into the groove of the substrate 2005, the optical axes of the chips 2001 and 2002 and the optical fiber 2008 are aligned at the same time.

  As a conventional example of an optical integrated circuit module formed by mounting an optical semiconductor chip on a substrate on which an optical waveguide is formed, an optical integrated circuit module (conventional example) disclosed in JP-A-2004-53636 is disclosed. 3 to Conventional Example 7).

<Conventional example 3>
When forming the optical integrated circuit module shown in FIG. 28, first, a plurality of semiconductor chips 3022 are placed in a state of being separated from each other on a base material whose surface is coated with an adhesive material. Here, the electrodes 3022a and 3022b of the semiconductor chip 3022 are arranged in contact with the adhesive material. Then, the sealing resin is coated on the back surface opposite to the surface on which the electrodes 3022a and 3022b of the semiconductor chip 3022 are formed and cured to form the sealing resin portion 3028, and then the adhesive material and the base material are attached to the semiconductor chip. Peel from 3022. Subsequently, in a state where the light emitting portion of the optical element 3023 which is a light emitting element and the light receiving portion of the optoelectronic element 3024 which is a light receiving element are opposed to each other, the optical element 3023 is not shown on the electrode 3022b of one semiconductor chip 3022. It is mounted via a resin layer, and the optoelectronic element 3024 is mounted on the electrode 3022b of the other semiconductor chip 3022 via a conductive resin layer (not shown). Thereafter, an optical waveguide 3032 is formed between the light emitting portion of the optical element 3023 and the light receiving portion of the optoelectronic element 3024 using a printing method, an insulating layer 3029 is further formed, and finally an electrode of one semiconductor chip 3022 is formed. Conductive wiring 3030 for connecting 3022a and the electrodes of the optical element 3023 is formed as necessary.

<Conventional example 4>
The optical integrated circuit module shown in FIG. 29 uses two gold wires 3037 in place of the conductive resin layer shown in FIG. 28 to form an electrode of an optical element 3023 (not shown) or an electrode of an optoelectronic element 3024 (see FIG. (Not shown) and an electrode (not shown) of the semiconductor chip 3022 connected to each other.

<Conventional Example 5>
When the optical integrated circuit module shown in FIG. 30 is formed, first, the optical element 3023 and the optoelectronic element 3024 are separated from the semiconductor chip (not shown) on the base material having the adhesive material applied to the surface. Mount. At this time, it arrange | positions so that the electrode (not shown) of a semiconductor chip, the optical element 3023, and the optoelectronic element 3024 may contact | connect an adhesive material. Subsequently, the surface of the semiconductor chip, the optical element 3023, and the optoelectronic element 3024 is covered with a sealing resin and cured to form the sealing resin portion 3028, and then the adhesive material and the base material are bonded to the semiconductor chip, the optical element 3023, and the optoelectronic element 3024. Peel from. Next, a right-angle prism 3041 is mounted on each of the light-emitting portion 3023c of the optical element 3023 and the light-receiving portion 3024c of the optoelectronic element 3024 via a light-transmitting resin 3042, and an optical waveguide 3032 is printed between these right-angle prisms 3041 using a printing method. Form. Finally, an insulating layer 3029 and a conductor wiring (not shown) are formed as the outermost layers.

<Conventional Example 6>
When the optical integrated circuit module shown in FIG. 31 is formed, first, a semiconductor chip (not shown), an optical element 3023, and an optoelectronic element 3024 are formed on these electrodes on a base material whose surface is coated with an adhesive material. 3023a, 3023b, 3024a and 3024b are placed in the opposite direction so as not to contact the adhesive material. Subsequently, after forming a transparent resin layer 3027 having a thickness enough to cover the entire surface of the semiconductor chip, the optical element 3023 and the optoelectronic element 3024, a V-shaped groove, that is, a V notch 3046 is formed above the light emitting part and the light receiving part. Form. Then, if necessary, a part of the transparent resin layer 3027 is removed to partially expose the semiconductor chip (not shown), the electrodes 3023b and 3024b of the optical element 3023 and the optoelectronic element 3024, and a conductor is exposed to the exposed portion. The wiring 3030 is formed, and the sealing resin portion 3028 is formed as the outermost layer. Finally, the adhesive material and the base material are peeled from the semiconductor chip, the optical element 3023, and the optoelectronic element 3024.

<Conventional Example 7>
When forming the optical integrated circuit module shown in FIG. 32, first, an adhesive material is applied to the surface of a base material, and a semiconductor chip (not shown), an optical element 3023, and an optoelectronic element 3024 are formed on the base material. These electrodes (not shown) are placed in the opposite direction so as not to contact the adhesive material of the substrate. Subsequently, after forming a transparent resin layer 3027 having a thickness enough to cover the entire surface of the semiconductor chip, the optical element 3023 and the optoelectronic element 3024, a V-shaped groove, that is, a V notch 3046 is formed above the light emitting part and the light receiving part. Form. Next, if necessary, a part of the transparent resin layer 3027 is removed to partially expose the semiconductor chip (not shown), the electrodes 3023 and the optoelectronic elements 3024 (not shown), and this exposed portion. Conductive wiring and an insulating layer (not shown) are formed on the substrate, and a light shielding sealing resin portion 3028 is formed as the outermost layer. Finally, the adhesive material and the base material are peeled from the semiconductor chip, the optical element 3023, and the optoelectronic element 3024.

  Further, as a conventional example of an optical module used for optical communication, there is an optical semiconductor device (conventional example 8 to conventional example 9) disclosed in Japanese Patent Application Laid-Open No. 2000-77683.

<Conventional Example 8>
As shown in FIG. 33, the optical semiconductor device 4061 includes a light receiving element 4061a, and a wedge-shaped groove 4061b1 is formed in a resin-sealed package 4061b that covers the light receiving element 4061a. One of the side surfaces of the wedge-shaped groove 4061b1 is a vertical surface parallel to the vertical direction, and the other side is a tapered surface, and this tapered surface serves as a half mirror. This figure shows an example in which an optical system for reading a recording medium 4062 such as an optical disk is formed using the optical semiconductor device 4061. This optical system is composed of an optical semiconductor device 4061 and a semiconductor laser 4060 which are arranged on the upper surface of the substrate 4041 and a recording medium 4062 which is arranged above the optical semiconductor device 4061. Here, the light emitting portion of the semiconductor laser 4060 faces the optical semiconductor device 4061, and the light receiving portion of the optical semiconductor device 4061 faces the recording medium 4062. In such a configuration, the light P4001 output from the light emitting unit first enters the resin-sealed package 4061b of the optical semiconductor device 4061, is reflected by the tapered surface of the wedge-shaped groove 4061b1, and is deflected by 90 degrees. The deflected light P4001 once jumps and reflects on the recording medium 4062, then passes through the tapered surface of the wedge-shaped groove 4061b1 and enters the light receiving element 4061a.

<Conventional Example 9>
The optical semiconductor devices 4052, 4053, 4055, and 4056 shown in FIG. 34 include a light emitting element and a light receiving element (not shown). V-shaped wedge-shaped grooves 4052a1, 4053a1, 4055a1, and 4056a1 are formed, and each side surface is a tapered surface that serves as a half mirror. This figure shows an optical system in which these optical semiconductor devices 4052, 4053, 4055, and 4056 are arranged on three circuit boards 4050, 4051, and 4054, and optical signals are transmitted and received between these circuit boards 4050, 4051, and 4054. The example which formed is shown. In this optical system, horizontal communication is performed between the optical semiconductor devices 4052 and 4053 arranged on the upper surface of the circuit boards 4050 and 4051 arranged in parallel in the horizontal direction, and the lower surface of the circuit board 4050 arranged in parallel in the vertical direction or Vertical communication is performed between the optical semiconductor devices 4056 and 4055 disposed on the upper surface of the circuit board 4054.
JP 2002-250830 A JP-A-5-129586 JP 2004-53636 A JP 2000-77683 A

However, in the IC chip mounting substrate (corresponding to Conventional Example 1) disclosed in Japanese Patent Laid-Open No. 2002-250830, it is possible to create a free optical wiring pattern in a place where the environment such as a substrate manufacturer is prepared. There was a problem that the end user was not versatile enough to freely create an optical wiring pattern and assemble an optical circuit. This problem is that the optical wiring pattern must be formed using glass or crystals such as SiO ₂ because it is necessary to transmit light, and etching performed when forming using glass or crystals such as SiO ₂ is performed. This is caused by the fact that it is very difficult compared to the etching of the copper foil performed when forming the electric wiring pattern.

  Further, the hybrid optical integrated circuit (corresponding to Conventional Example 2) disclosed in Japanese Patent Laid-Open No. 5-129586 does not have a configuration relating to electrical connection, and the hybrid type disclosed in this publication In an optical integrated circuit, the size of each chip is 0.1 to 1 mm square, which is effective for miniaturization of an optical system. However, a dedicated device (die bonder) for mounting the chip is necessary, and versatility is achieved. There was a problem of lacking.

  In addition, in the optical integrated circuit module disclosed in Japanese Patent Application Laid-Open No. 2004-53636 (corresponding to Conventional Example 3 to Conventional Example 7), the optical waveguide is formed by a printing method. Although it is possible to create a free optical wiring pattern in a well-organized place, there is a problem that the end user is not versatile enough to freely create an optical wiring pattern and assemble an optical circuit. Further, there is no description about an optical connection method between optical integrated circuit modules.

  Further, in the optical semiconductor device disclosed in Japanese Patent Application Laid-Open No. 2000-77683 (corresponding to Conventional Example 8 to Conventional Example 9), two optical semiconductor devices that perform optical communication are respectively arranged on different substrates. In addition, since the light output from the optical semiconductor device flies through the space, there is a problem that communication light is mixed, and there is a problem that adjustment of the optical axis is necessary.

  The present invention was devised to solve such problems, and an object of the present invention is to provide an optical module, an optical module, and an optical module in which an end user who forms an optical / electronic composite circuit can easily create an optical wiring pattern and an electric wiring pattern. An object of the present invention is to provide a module manufacturing method, an optical / electronic composite circuit configured using an optical module, and a manufacturing method thereof.

  In order to solve the above-mentioned problem, as shown in FIGS. 1 and 2, the optical module of the present invention includes optical circuit portions 2a and 2b having a substantially rectangular parallelepiped shape, and a plurality of optical modules formed on the lower surfaces of the optical circuit portions 2a and 2b. The lower surface electrode (not shown). The optical circuit portions 2a and 2b are provided with an element portion having an optical waveguide, and at least one of the side surface, the upper surface and the lower surface of the optical circuit portion has entrances 2a3 and 2b3 to which the optical waveguide is connected. Is formed. A convex receiving portion 2a1 or a concave receiving portion guide 2b1 combined with the receiving portion 2a1 is formed below the entrances 2a3 and 2b3 on the side surface of the optical circuit portion.

  When an optical / electronic composite circuit is formed using an optical module having such a configuration, a plurality of optical modules are mounted on a circuit board in a state where a receiving portion and a receiving portion guide are combined. Furthermore, when the optical module of the present invention is used, even if the mounting position of the optical module is shifted and a gap is generated between two adjacent entrances, the entrances are close to each other so that the optical connection can be reliably performed. An optical connection is formed between the two entrances. This optical connection part is formed by applying an optical connection adhesive between two adjacent entrances by injecting the optical connection adhesive from above into the contact part of two adjacent optical modules, and further curing it. Is done. However, when injecting the optical connection adhesive, an excessive amount may be injected, and the excessive amount may sag downward from the entrance / exit. Since the optical module of the present invention has the above-described configuration, it is possible to prevent an excessive amount hanging down from collecting on the upper surface of the receiving portion and drooping down to the circuit board, and to perform optical connection correctly.

  Further, the element portion may further include a photoelectric conversion element, and the photoelectric conversion element may be connected to the optical waveguide.

  In this case, it is possible to reduce the propagation loss at the part related to the signal conversion of electric / light.

  In addition, an entrance / exit may be formed on at least two of the side surface, the upper surface, and the lower surface of the optical circuit section, and the entrances / exits may be connected by the optical waveguide.

  In this case, the optical wiring according to the design can be formed by selecting the optical module to be used according to the design of the optical / electronic composite circuit to be manufactured.

  For example, as shown in FIG. 11, entrances 22f and 22g are respectively formed on the left side surface and the front side surface, which are adjacent surfaces of the optical circuit unit, and the end portions of the optical waveguide 22b1 are connected to the entrances 22f and 22g, respectively. When connected, the optical module can be used as a deflecting element that deflects the light propagation direction by 90 degrees.

  In addition, when each end of the optical waveguide is connected to an entrance formed on the right side surface and the left side surface which are opposite surfaces of the optical circuit unit, the optical module is an element for extending the optical transmission line. Can be used as On the other hand, as shown in FIG. 15, a plurality of optical waveguides 62b6, 62b7, and 62b8 are provided, and each end portion of the optical waveguide 62b6 is formed on the front side surface and the back side surface, which are opposite surfaces of the optical circuit unit. Optical waveguides 62b7 and 62b8, which are optical waveguide pairs that are connected to 62f and 62g and propagate light in the left-right direction via the transparent resin portion 62b3, are formed on the right side and the left side that are opposite surfaces of the optical circuit unit. When connected to the entrances 62h and 62i, the optical module can be used as an element that crosses two lights propagating in two directions.

  In addition, as shown in FIG. 13, entrances 42f, 42g, and 42h are formed on the left side that is one surface of the optical circuit section and the front side surface and the back side surface that are two surfaces adjacent to the left side surface, respectively. In this case, the optical module can be used as an optical branching element that branches light incident from the entrance / exit 42f formed on the left side into an entrance / exit 42g formed on the front side surface and an entrance / exit 42h formed on the back side surface. .

  Further, an upper surface electrode may be provided on the upper surface of the optical circuit portion.

  In this case, an optical module can be constructed in multiple stages when an optical / electronic composite circuit is formed. As a result, a high-density optical / electronic composite circuit can be formed, or a complex optical / electronic composite circuit can be formed.

  In addition, the optical circuit unit includes a module substrate having an electric wiring pattern on the upper surface, an element unit formed on the module substrate, and a sealing unit that covers the upper surface of the element unit, and the lower electrode is a module. It is formed on the lower surface of the substrate, the upper surface electrode is formed on the upper surface of the sealing portion, and the lower surface electrode and the upper surface electrode may be electrically connected.

  In this case, an electric signal or electric energy from the electrode portion of the electric wiring pattern formed on the circuit board can be supplied to the upper surface electrode via the lower surface electrode. Thereby, an electric signal and electric energy can be supplied to the lower surface electrode of the optical module of the next stage through this upper surface electrode.

  Moreover, you may further provide the conductive block arrange | positioned on the electrical wiring pattern and electrically connected. This conductive block is arranged, for example, in a state of penetrating the element portion and the sealing portion and having an upper end portion protruding from the upper surface of the sealing portion. In this case, the protruding portion is used as an upper surface electrode.

  If this conductive block is used, the lower surface electrode and the upper surface electrode can be electrically connected via the electric wiring pattern on the module substrate and the conductive block.

  Moreover, you may further provide the conductive block arrange | positioned on the electrical wiring pattern and electrically connected. The conductive block is disposed, for example, in the element portion and the sealing portion, and further includes a protrusion formed on the upper surface thereof in a state of protruding from the upper surface of the sealing portion using a conductive silicon resin. . In this case, the protrusion is used as a top electrode.

  For example, the position of the upper surface of the conductive block becomes higher than the design value due to the amount of cream solder applied, etc., and when the intermediate process product is fitted in the mold for forming the sealing portion and tightened from the vertical direction, the module substrate or The conductive block may be damaged. However, since the optical module of the present invention has the above-described configuration, the protruding portion serves as a buffer member and can prevent the module substrate and the conductive block from being damaged.

  As shown in FIGS. 4 to 6, the optical module manufacturing method of the present invention has a plurality of optical module element parts (photoelectric conversion elements 122, transparent resin parts) on the upper surface of one substrate 121 to be a module substrate after division. 125, the reflective resin portion 129 and the optical waveguide 131) and the sealing portion 134 are formed. Thereafter, when an optical module including a receiving portion is formed, as shown in FIG. 7, half dicing is performed from the upper surface side of the substrate 121 using a wide first blade to form a dicing groove 135. Full dicing is performed on the bottom surface using a blade narrower than the first blade to form a dicing line 136 to divide the optical module into a single product. On the other hand, when forming an optical module including a receiving portion guide, as shown in FIG. 8, half dicing is performed from the lower surface side of the substrate 121 using a wide first blade to form a dicing groove 135 ′, and dicing is performed. A full dicing is performed on the groove bottom surface using a second blade narrower than the first blade to form a dicing line 136 ′ to divide the optical module into a single product.

  By performing such a process, a receiving part and a receiving part guide can be formed easily.

  As shown in FIG. 17, the optical / electronic composite circuit of the present invention has a circuit board 1 on which an electric wiring pattern 1a is formed, and a receiving portion 2a1 and a receiving portion guide 2b1 combined on the electric wiring pattern 1a. It is composed of a plurality of optical modules 2a and 2b that are arranged and mounted, and an optical connection adhesive is applied and cured between two adjacent entrances formed on the contact surface of the two optical modules 2a and 2b. The optical connection is made through the formed optical connection portion 4. Further, the electric wiring pattern 1a of the circuit board 1 and the lower surface electrode of the optical module form electric wiring, and the optical wiring is formed by the optical waveguide of the optical module.

  With this configuration, the end user who forms the optical / electronic composite circuit can freely form the optical wiring pattern.

  An optical / electronic composite circuit having such a structure includes a step of applying cream solder on an electric wiring pattern formed on the upper surface of a circuit board, a step of arranging a plurality of optical modules on the electric wiring pattern, and a reflow furnace. Through which the cream solder is cured and soldered between the electrical wiring pattern and the lower electrode of the optical module, a step of applying an optical connection adhesive between two adjacent doorways, and an optical connection adhesive It can be produced by carrying out a manufacturing method comprising a step of curing an agent to form an optical connection part.

  When such a manufacturing method is performed, electrical connection is performed using solder, and optical connection is performed using an adhesive for optical connection. Therefore, both electrical connection and optical connection can be firmly connected. it can.

  As shown in FIG. 21, the optical / electronic composite circuit of the present invention includes a circuit board 501 on which an electric wiring pattern 501a is formed, and a plurality of optical modules (first optical module 510, The second optical module 520, the third optical module 530, and the fourth optical module 540), and the second optical module 520 and the second optical module 520 formed between the two adjacent entrances, for example, the right side of the first optical module 510. Are connected to each other through an optical connection portion 503 formed by applying and curing an optical connection adhesive, and an electric wiring pattern 501a on the circuit board 501 and Electrical wiring is formed by the lower surface electrode and the upper surface electrode of each optical module, and the optical waveguide of the optical module (for example, the right optical waveguide 1). Has a configuration such as an optical wiring is formed by f1 and the element portion waveguide 32b1).

  By combining a plurality of optical modules in this manner, the final user who forms the optical / electronic composite circuit can freely form the optical wiring pattern.

  An optical / electronic composite circuit having such a structure includes a step of applying cream solder on an electric wiring pattern formed on the upper surface of a circuit board, a step of arranging a plurality of optical modules on the electric wiring pattern, and an optical connection. A step of applying an optical connection adhesive between the entrance and exit, a solder application step of applying cream solder to the upper surface electrode of the optical module, and an optical connection adhesive between these entrances when there are two close entrances First adhesive coating step to be applied, when optically connecting the entrance / exit provided on the upper surface of the arranged optical module and the entrance / exit provided on the lower surface of the next-stage optical module, light is applied to the entrance / exit provided on the upper surface. A multi-layer process comprising a second adhesive application step for applying a connecting adhesive and an arrangement step for placing the optical module on the upper electrode, and passing through a reflow oven to perform the cleaning. It is manufactured by carrying out a manufacturing method comprising the steps of curing the solder and soldering between the electrical wiring pattern and the lower electrode of the optical module, and curing the optical connection adhesive to form the optical connection portion. can do. The multilayering step is performed once or a plurality of times depending on the number of stages of the optical module.

  By carrying out such a manufacturing method, a multi-stage optical / electronic composite circuit can be easily formed.

  Since the present invention is configured as described above, the final user who composes the optical / electronic composite circuit can easily create the optical wiring pattern and the electrical wiring pattern.

  DESCRIPTION OF EMBODIMENTS Embodiments of an optical module, an optical module manufacturing method, an optical / electronic composite circuit configured using the optical module, and a manufacturing method thereof will be described below with reference to the drawings.

  The optical module of the present invention includes a substantially rectangular parallelepiped optical circuit section and lower surface electrodes formed at the four corners of the lower surface of the optical circuit section. In addition, there are those provided with upper surface electrodes at the four corners of the upper surface. The presence or absence of the upper surface electrode is selected according to, for example, the usage pattern. Further, a receiving portion protruding in the lateral direction or a receiving portion guide in combination with this receiving portion is formed at the lower part of the four side surfaces of the optical circuit portion.

  FIG. 1 is an explanatory view showing Embodiment 1 of the optical module of the present invention.

  The optical module shown in the figure is provided with a receiving portion 2a1 at the lower part of the four side surfaces of the substantially rectangular parallelepiped optical circuit portion 2a. The receiving portion 2a1 forms an eaves-like convex portion projecting laterally at the lower portion of the optical circuit portion 2a. Furthermore, lower surface electrodes (not shown) are provided at the four corners of the lower surface, and upper surface electrodes 2a2 are provided at the four corners of the upper surface.

  FIG. 2 is an explanatory view showing Embodiment 2 of the optical module of the present invention.

  The optical module shown in the figure is provided with a receiving portion guide 2b1 at the lower part of the four side surfaces of the substantially rectangular parallelepiped optical circuit portion 2b. The receiving portion guide 2b1 is a concave portion having a shape combined with the receiving portion 2a1 shown in FIG. Furthermore, lower surface electrodes (not shown) are provided at the four corners of the lower surface, and upper surface electrodes 2b2 are provided at the four corners of the upper surface, respectively.

  The optical circuit portions 2a and 2b of the optical module shown in FIG. 1 and FIG. 2 will be described in detail with specific examples later, and are formed on a module substrate having an electric wiring pattern on the upper surface and the module substrate. And at least an element portion provided with an optical waveguide and a sealing portion covering the upper surface of the element portion. Further, at least one of the side surfaces, the upper surface, and the lower surface of the optical circuit portions 2a and 2b is formed with doorways 2a3 and 2b3 connected to the optical waveguide.

Hereinafter, specific examples 1 to 6 of the optical module including the receiving portion will be described.
<Specific example 1 of optical module>
FIG. 3 is an explanatory view showing a specific example 1 of the optical module, where FIG. 3 (a) is a plan view, FIG. 3 (b) is a left side view, and FIG. 3 (c) is a right side view. FIG. 4D is a cross-sectional view taken along line AA in FIG. 4A, and FIG. 4E is a bottom view.

  This optical module includes an optical circuit portion having a substantially rectangular parallelepiped shape, four upper surface electrodes 12j formed at the upper four corners of the optical circuit portion, and lower surface electrodes 12i formed at the lower four corners.

  The outer shape of the optical circuit part is a substantially rectangular parallelepiped, and the receiving part 12 forming an eaves-like convex part is formed at the lower part of the four side surfaces. Further, the optical circuit unit includes a module substrate 12a having an electric wiring pattern 12a1 on the upper surface, an element unit formed on the upper surface of the module substrate 12a, which will be described in detail later, and a sealing unit 12h that covers the surface of the element unit. It is composed of

  The element portion includes a photoelectric conversion element 12b electrically connected to a wiring end portion of the electric wiring pattern 12a1 of the module substrate 12a by, for example, die bonding using silver paste and wire bonding using a conductive wire (not shown). I have.

  The photoelectric conversion element 12b is sealed in a hemispherical transparent resin portion 12c formed using a transparent resin such as silicon resin. A groove portion 12e1 having a V-shaped cross section is formed on the top of the transparent resin portion 12c, and two concave portions having a semicircular cross section are formed at positions facing each other through the groove portion 12e1 having a V-shaped cross section. Yes. These concave portions form part of groove portions 12e2 and 12e3 described later. Moreover, although these recessed parts are demonstrated in detail later, when hardening the transparent resin part 12c, they are formed by shape | molding using a metal mold | die, for example.

  Further, the portion excluding the top of the transparent resin portion 12c and the exposed portion of the upper surface of the module substrate 12a are covered with a reflective resin portion 12d formed using a reflective resin such as an epoxy resin mixed with titanium oxide, for example. ing. On the upper surface of the reflective resin portion 12d, two groove portions 12e2 and 12e3 having a semicircular cross section facing each other through a groove portion 12e1 having a V-shaped cross section are also formed.

  By filling these two groove portions 12e2 and 12e3 with a transparent resin such as a transparent silicon resin, the right optical waveguide 12f1 and the left optical waveguide 12f2 are respectively formed. That is, one end of the right optical waveguide 12f1 is connected to the entrance / exit 12g1 provided on the right side of the optical module, and the other end is connected to the transparent resin portion 12c and faces the right tapered surface of the groove 12e1. is doing. On the other hand, the left optical waveguide 12f2 has one end connected to an entrance / exit 12g2 provided on the left side of the optical module, and the other end connected to the transparent resin portion 12c to face the left tapered surface of the groove 12e1. is doing.

  The photoelectric conversion element 12b, the transparent resin portion 12c, the reflective resin portion 12d, the right optical waveguide 12f1, and the left optical waveguide 12f2 described above constitute an element portion of the optical module of this specific example.

  The upper surface of the transparent resin portion 12c, the upper surface of the reflective resin portion 12d, and the entire upper surfaces of the right optical waveguide 12f1 and the left optical waveguide 12f2 are formed using a reflective resin such as an epoxy resin mixed with titanium, for example. Covered with the sealing portion 12h.

  Further, on the lower surface of the module substrate 12a, a lower surface electrode 12i electrically connected to an electrode portion of an electric wiring pattern formed on the upper surface of the module substrate 12a through a through hole (not shown) is formed. On the other hand, an upper surface electrode 12j connected to the electrode portion of the electric wiring pattern formed on the upper surface of the module substrate 12a is formed on the upper surface of the sealing portion 12g.

  Since the optical module of the specific example 1 has such a configuration, when the photoelectric conversion element 12b is a light receiving element, the light incident from the entrance / exit 12g1 on the right side propagates in the right optical waveguide 12f1. Then, it is reflected by the right taper surface of the groove 12e1. The right taper surface deflects light downward by 90 degrees. The deflected light is transmitted downward through the transparent resin portion 12c and enters the right light receiving area 12b1 of the photoelectric conversion element 12b.

  On the other hand, the light incident from the left side entrance 12g2 propagates through the left optical waveguide 12f2, and is then reflected by the left tapered surface of the groove 12e1. The left tapered surface deflects light downward by 90 degrees. The deflected light is transmitted downward through the transparent resin portion 12c and enters the left light receiving area 12b2 of the photoelectric conversion element 12b.

  For example, when an optical module having such a configuration is placed between two opposing lenses, light that has passed through the lens enters the optical waveguide of the optical module without entering the other lens. That is, the light that has passed through the two lenses can be blocked by the optical module.

  For example, when the photoelectric conversion element 12b is a light emitting element, the light output from the right light emitting area 12b1 of the photoelectric conversion element 12b is transmitted upward in the transparent resin part 12c on the rubber and is disposed above. Reflected by the right taper surface of the groove 12e1. The right tapered surface deflects light 90 degrees to the right. The deflected light passes through the transparent resin portion 12c in the right direction and then enters the right optical waveguide 12f1. The incident light propagates in the right optical waveguide 12f1 and is then taken out of the optical module through the right side entrance 12g1.

  On the other hand, the light output from the left light emitting area 12b2 of the photoelectric conversion element 12b is transmitted upward in the transparent resin portion 12c and reflected by the left tapered surface of the groove portion 12e1 disposed above. The left tapered surface deflects light 90 degrees to the left. The deflected light passes through the transparent resin portion 12c in the left direction and then enters the left optical waveguide 12f2. The incident light propagates through the left optical waveguide 12f2 and is then taken out of the optical module through the left-side entrance 12g2.

  Next, an embodiment of a method for manufacturing an optical module will be described.

  Here, a manufacturing method implemented when manufacturing the optical module of the specific example 1 is shown.

  4-8 is process explanatory drawing which shows one Embodiment of the manufacturing method of the optical module shown in FIG. In FIG. 4, (a) is a plan view, (b) is a front view, and (b) is a bottom view. 5, (a-1) and (c-1) are plan views, (a-2) is a front view, (b) is a sectional view, and (c-2) is (c-2). FIG. 2 is a cross-sectional view taken along line BB in FIG. In FIG. 6, (a-1) is a plan view, (a-2) is a sectional view taken along the line CC of (a-1), and (b) is a sectional view. 7, (a-1) and (b-1) are plan views, (a-2) is a sectional view taken along the line DD of (a-1), and (b-2) is (b). It is the EE sectional view taken on the line of -1). 8, (a-1) and (b-1) are plan views, (a-2) is a sectional view taken along line FF of (a-1), and (b-2) is (b). It is a GG line sectional view of -1). Here, a manufacturing method in the case where four optical modules are formed on one substrate will be described.

  In addition, since the electrical wiring pattern of a module board and a circuit board, and a lower surface electrode are very thin members, they are not illustrated in the side view and sectional drawing of FIGS.

  As shown in FIG. 4, the lower surface electrode 123 of the optical module is formed on the lower surface of the substrate 121 that is later divided into four and becomes a module substrate, and the four electric wiring patterns 121b are formed on the upper surface of the substrate 121, respectively. ing. In each electrode portion 121b1 of the electric wiring pattern 121b, one lower surface electrode 123 formed at a position facing vertically in the vertical direction through the substrate 121 is electrically connected through a through hole (not shown) formed in the substrate 121. It is connected. In such a state, the photoelectric conversion element 122 is mounted on the four electric wiring patterns 121b on the upper surface by applying, for example, a die bond using a silver paste and a wire bond using a conductive wire.

  Subsequently, as shown in FIGS. 5A-1 and 5A-2, the conductive block 126 is soldered to the electrode portions at the four corners of each electric wiring pattern 121b of the substrate 121 using, for example, silver paste. The conductive block 126 is electrically connected to the electric wiring pattern 121b. Thereafter, a transparent resin 125 ′ such as silicon resin is applied in a hemispherical shape on the photoelectric conversion element 122 with the dispenser 124, and the substrate 121 is placed in the mold 127 as shown in FIG. .

  The mold 127 is composed of two upper and lower molds, and a concave substrate holding portion 127a1 into which the substrate 121 is fitted is provided on the upper surface of the lower mold 127a. On the other hand, on the lower surface of the upper mold 127b, there are provided two first ridges 127b1 having a semicircular cross section formed so that the longitudinal direction is parallel to the left-right direction. The one first ridge 127b1 is arranged so as to pass over the two photoelectric conversion elements 122 arranged on the upper side in FIG. 5, and the other first ridge 127b1 is arranged as shown in FIG. It arrange | positions so that it may pass on the two photoelectric conversion elements 122 arrange | positioned at the middle lower side. The two first protrusions 127b1 arranged in this way are interrupted above the photoelectric conversion element 122, and the second protrusions 127b2 having a V-shaped cross section are formed in the interruption part. This 2nd protruding item | line part 127b2 is arrange | positioned in the direction orthogonal to the 1st protruding item | line part 127b1.

  When the upper mold 127b having the two protruding strips 127b1 and 127b2 and the lower mold 127a on which the substrate 121 is arranged are combined, the second protruding strip 127b2 is pressed against the top of the transparent resin 125 ′. It becomes a state.

  In such a state, a reflective resin such as an epoxy resin mixed with titanium oxide is injected into the space 127c of the mold 127, for example. Thereafter, after the transparent resin and the reflective resin are cured, the intermediate process product is taken out from the mold 127.

  As shown in FIGS. 5C-1 and 5C-2, the transparent resin portion and the reflective resin portion 129 are formed by curing the transparent resin and the reflective resin. On the top of the transparent resin portion 125, a second convex strip portion of the mold is pressed to form a groove portion 125a having a V-shaped cross section indicated as a groove portion 12e1 in FIG. In the vicinity of the right and left, the end of the first convex strip portion of the mold is pressed to form a semicircular recess 125b that forms part of the semicircular groove 12e1 shown in FIG. ing.

  In addition, a groove portion 129b having a semicircular cross section is formed on the upper surface of the reflective resin portion 129 by the first protrusions of the mold. The groove portion 129n having a semicircular cross section and the concave portion 125b having a semicircular cross section are integrally formed to form grooves indicated as groove portions 12e2 and 12e3 in FIG.

  Subsequently, as shown in FIGS. 6 (a-1) and (a-2), the dispenser 130 is filled with a transparent silicon resin or the like in the groove portion 128 having a semicircular cross section formed by the integrally formed concave portion and groove portion. The optical waveguide 131 is formed by curing.

  The substrate 121 in such a state is placed in another mold 132 as shown in FIG. The metal mold 132 includes a lower mold 132a and an upper mold 132b. On the upper surface of the lower mold 132a, a concave substrate holding portion 132a1 into which the substrate 121 is fitted is provided. On the other hand, the lower surface of the upper mold 132b is provided with a space forming portion 132b1 that is a recess for forming the space portion 133 that fills the upper surface of the reflective resin portion 129 and the optical waveguide 131 with the reflective resin. A recess (not shown) into which the upper end portion of the conductive block 126 is fitted is provided on the inner surface of the forming portion 132b1. In such a state, the space 133 in the mold 132 is filled with a reflective resin such as an epoxy resin mixed with titanium.

  Then, the sealing part is obtained by hardening the filled reflective resin. Note that the upper end portion of the conductive block 126 protrudes from the upper surface of the sealing portion by fitting the upper end portion of the conductive block 126 into the recess when forming the sealing portion. This protruding portion becomes the upper surface electrode of the optical module.

  Finally, when dicing is performed, when forming an optical module including a receiving portion, as shown in FIGS. 7A-1 and 7A-2, first, with a wide first blade, Half dicing is performed from the upper surface side of the substrate 121, and a dicing groove 135 having a depth reaching the middle of the reflective resin portion 129 from the sealing portion 134 through the optical waveguide 131 (for example, 3/4) is formed 3 in the vertical and horizontal directions. Each book is formed. Subsequently, as shown in FIGS. 7B-1 and 7B-2, full dicing is performed on the bottom surface of the dicing groove 135 with the second blade narrower than the first blade, and the dicing line 136 is set in the vertical direction. Form three each in the horizontal direction, completely cut the remaining portion of the reflective resin portion 129 and the substrate 121, divide the optical module, and obtain four optical modules.

  On the other hand, when forming an optical module having a receiving portion guide, first, as shown in FIGS. 8A-1 and 8A-2, first, a wide first blade is used from the lower surface side of the substrate 121. Half dicing is performed to form three dicing grooves 135 ′ each having a depth reaching the middle (for example, half) of the substrate 121 and the reflective resin portion 129 in the vertical and horizontal directions. Subsequently, as shown in FIGS. 8B-1 and 8B-2, full dicing is performed on the bottom surface of the dicing groove 135 ′ with a second blade narrower than the first blade, and a dicing line 136 ′ is formed. Three pieces are formed in the vertical direction and the horizontal direction, and the remaining portion of the reflective resin portion 129, the optical waveguide 131, and the sealing portion 134 are completely cut to divide the optical module to obtain four optical modules.

  Here, four optical modules are formed from one substrate, but the number of optical modules is not limited to this. Furthermore, the procedure of dicing is not limited to the procedure described with reference to FIGS. 7 and 8, and any procedure may be used as long as it can form a receiving portion and a receiving portion guide combined with the receiving portion.

  Next, specific examples of electrodes constituting the optical module will be described.

  FIG. 9 is an explanatory view showing an example of the lower surface electrode and the upper surface electrode of the optical module, where FIG. 9 (a) is a plan view, and FIG. 9 (b) is a cross-sectional view taken along line HH in FIG. The figure (c) is a bottom view.

  The lower surface electrode 123 of the optical module is formed on the lower surface of the substrate 121, and the electric wiring pattern 121 b of the substrate 121 is formed on the upper surface of the substrate 121. One lower surface electrode 123 formed at a position facing each other through the module electrode 121 is electrically connected to each electrode portion 121b1 of the electric wiring pattern 121b through a through hole 121a formed in the module electrode 121. ing.

  Further, a rectangular parallelepiped conductive block 126 penetrating the element portion 120 and the sealing portion 134 is soldered and electrically connected to the upper surface of each electrode portion 121b1 of the electric wiring pattern 121b by applying, for example, silver paste. ing.

  Here, the height of the sealing portion 134 provided on the element portion 120 is set so that the upper surface of the sealing portion 134 does not exceed the upper surface of the conductive block 126, thereby sealing the upper end portion of the conductive block 126. It protrudes from the upper surface of the portion 134. This protruding portion functions as an upper surface electrode of the optical module.

  10A and 10B are explanatory views showing another example of the lower surface electrode and the upper surface electrode of the optical module, where FIG. 10A is a plan view, and FIG. 10B is the II line of FIG. It is sectional drawing and the figure (c) is a bottom view.

  Here, as the module substrate 212, for example, a resin molded product 212a composed of a thin plate-shaped member and four rectangular parallelepiped members integrally formed at four corners on the upper surface of the thin plate-shaped member, and a surface of the resin molded product 212a. An MID (three-dimensional injection molding circuit component) composed of an electric wiring pattern 212b formed by forming a conductive film is used. Note that the rectangular parallelepiped member and the electric wiring pattern 212b formed on the surface of the rectangular parallelepiped member have the same function as the conductive block 126 constituting the optical module shown in FIG. That is, here, the module substrate 121 and the conductive block 126 of the optical module shown in FIG. 9 are integrally formed.

  Further, a protrusion 212c is formed on the upper surface of the electric wiring pattern 212b formed on the surface of the rectangular parallelepiped member using a conductive silicon resin obtained by mixing, for example, carbon fiber or the like with silicon resin. The height of the sealing portion 234 provided on the element portion 220 is set so that the upper surface of the sealing portion 234 does not exceed the upper surface of the protruding portion 212c, so that the tip portion of the protruding portion 212c is exposed. ing. This tip portion functions as an upper surface electrode.

  As an example of a method for exposing the tip portion of the protrusion 212c, a method of injecting and curing resin while the protrusion 212c is in contact with the lower surface of the upper mold when forming the sealing portion 234. There is.

Each lower surface electrode 223 formed on the lower surface of the resin molded product 212a is electrically connected to the electric wiring pattern 212b through a through hole (not shown). For example, the lower surface electrode 223 is simultaneously formed when forming the electric wiring pattern 212b. Is done.
<Specific example 2 of optical module>
FIG. 11 is an explanatory view showing a specific example 2 of the optical module, where FIG. 11 (a) is a plan view, FIG. 11 (b) is a left side view, and FIG. 11 (c) is a front view. FIG. 4D is a bottom view.

  Similar to the optical module of Example 1, this optical module includes a substantially rectangular parallelepiped optical circuit portion, an upper electrode 22d, and a lower electrode 22e, and the optical circuit portion includes a receiving portion 22 that forms an eave-like convex portion. Is formed in the lower part of the side face in all directions.

  Further, the optical circuit section includes a module substrate 22a, an element section 22b, and a sealing section 22c, as in the optical module of the first specific example. An entrance / exit 22f is formed on the left side which is one side surface of the optical circuit section, and an entrance / exit 22g is formed on the front side which is another side adjacent to the left side surface. The element portion 22b is made of a reflective resin portion formed on the upper surface of the module substrate 22a, and an L-shaped optical waveguide 22b1 is formed on the upper surface. The L-shaped optical waveguide 22b1 connects between the entrance / exit 22f formed on the left side surface of the element portion 22b and the entrance / exit 22g formed on the front side surface. A tapered surface 22b11 for reflecting light and deflecting it by 90 degrees is formed at the bent portion of the L-shaped optical waveguide 22b1.

  The element portion 22b having such a structure is formed using a mold, for example. The mold is composed of an upper mold and a lower mold, and a recess having a shape into which the module substrate 22a is fitted is provided on the upper surface of the lower mold. In addition, the lower surface of the upper mold is provided with a recess for forming a space for filling the reflective resin on the module substrate 22a when the upper mold is matched with the lower mold. Further, the upper mold recess is provided with an L-shaped ridge having a semicircular cross section for forming the L-shaped optical waveguide 22b1.

  When forming the element portion 22b using such a mold, first, the module substrate 22a is fitted into the recess of the lower mold, and the upper mold is clamped according to the lower mold. In this state, a reflective resin is injected into the space on the module substrate 22a and cured to provide a reflective surface having a semicircular L-shaped groove (a portion forming the L-shaped optical waveguide 22b1) on the upper surface. A resin part is formed. Further, the L-shaped groove is filled with a transparent silicon resin or the like with a dispenser and cured to form an L-shaped optical waveguide 22b1 having a semicircular cross section.

  Since the optical module of the specific example 2 has such a configuration, for example, when light enters from an entrance 22f provided on the left side surface, the light propagates in the right direction in the L-shaped optical waveguide 22b1. Reflected by the tapered surface 22b11. The tapered surface 22b11 deflects light by 90 degrees toward the front. The deflected light propagates forward in the L-shaped optical waveguide 22b1 and is extracted to the outside from an entrance 22g provided on the front side surface.

For example, when light enters from the entrance 22g provided on the front side surface, the light propagates in the L-shaped optical waveguide 22b1 in the back direction and is reflected by the tapered surface 22b11. The tapered surface 22b11 deflects light 90 degrees in the left direction. The deflected light propagates leftward in the L-shaped optical waveguide 22b1 and is extracted to the outside from an entrance 22f provided on the left side.
<Specific example 3 of optical module>
FIG. 12 is an explanatory view showing a specific example 3 of the optical module, in which FIG. 12 (a) is a plan view, FIG. 12 (b) is a left side view, and FIG. ) Is a cross-sectional view taken along line JJ, and FIG.

  Similar to the optical module of Example 1, this optical module includes a substantially rectangular parallelepiped optical circuit portion, an upper electrode 32d, and a lower electrode 32e, and the optical circuit portion includes a receiving portion 32 that forms an eave-like convex portion. Is formed in the lower part of the side face in all directions.

  Further, like the optical module of the first specific example, the optical circuit unit includes a module substrate 32a, an element unit 32b, and a sealing unit 32c. An entrance / exit 32f is formed on the left side which is one side surface of the optical circuit section, and an entrance / exit 32g is formed on the upper surface which is one surface adjacent to the left side. The element portion 32b is made of a reflective resin portion formed on the upper surface of the module substrate 32a, and the in-element optical waveguide 32b1 is formed on the upper surface. The intra-element optical waveguide 32b1 is linearly extended from the entrance 32f formed on the left side surface of the element part 32b to the central part of the element part 32b, and an end on the central part side is formed on the tapered surface 32b11. Has been. The sealing portion 32c is made of a reflective resin portion formed on the upper surface of the element portion 32b, and an optical waveguide 32c1 within a sealing portion having a semicircular cross section penetrating vertically is formed in the central portion. The sealed-inside optical waveguide 32c1 has a lower side communicating with a central side end of the intra-element optical waveguide 32b1, and an upper side connected to the entrance / exit 32g.

  The element part 32b and the sealing part 32c configured as described above are formed using, for example, a mold composed of an upper mold and a lower mold. The upper surface of the lower die of the mold used when forming the element portion 32b is provided with a concave portion into which the module substrate 32a is fitted, and the lower surface of the upper die when the upper die is matched with the lower die. A recess is formed on the module substrate 32a for forming a space for filling the reflective resin. Further, the upper mold concave portion is provided with a semi-circular convex section extending linearly from one inner surface of the concave section to the central section of the concave section, and the central section side of the convex section. The end surface is a tapered surface. When forming the element portion 32b using such a mold, first, the module substrate 32a is fitted into the recess of the lower die, and the upper die is clamped according to the lower die. In this state, a reflective resin is injected into the space on the module substrate 32a and hardened to form the element portion 32b having a groove with a semicircular cross section formed on the upper surface. Next, the groove portion is filled with a transparent silicon resin or the like with a dispenser and cured to obtain the in-element optical waveguide 32b1 having a semicircular cross section having a tapered surface 32b11.

  On the other hand, the upper surface of the lower die of the mold used for forming the sealing portion 32c is provided with a concave portion into which the module substrate 32a and the element portion 32b are fitted, and the upper die is provided on the lower surface of the upper die. When matched with the lower mold, a recess for forming a space filled with the reflective resin is provided on the element portion 32b. In addition, a convex part with a semicircular cross section that hangs downward from the top surface of the concave part is provided at the central part of the concave part of the upper mold, and the tip part of this convex part is clamped by aligning the upper mold with the lower mold. When this is done, it comes into close contact with the central side end (upper portion of the tapered surface) of the in-element optical waveguide 32b1. When forming the sealing portion 32c using such a mold, first, the module substrate 32a is fitted into the recess of the lower mold, and the upper mold is matched and the mold is clamped. In this state, a reflective resin is injected into the space on the element portion 32b and cured to form a sealing portion 32c having a through hole having a semicircular cross section. Next, the through-hole is filled with a transparent silicon resin or the like with a dispenser and cured, thereby obtaining the in-sealed optical waveguide 32c1 having a semicircular cross section connected to one end of the in-element optical waveguide 32b1.

  Since the optical module of the specific example 3 has such a configuration, for example, when light is incident from the entrance / exit 32f provided on the left side, the light propagates in the right direction through the in-element optical waveguide 32b1 and is tapered. Reflected by the surface 32b11. The tapered surface 32b11 deflects the light upward by 90 degrees. The deflected light enters the in-sealing optical waveguide 32c1, propagates upward in the in-sealing optical waveguide 32c1, and is extracted to the outside from an entrance 32g provided on the upper surface.

Further, for example, when light is incident from the entrance / exit 32g provided on the upper surface, the light propagates downward in the sealed-portion optical waveguide 32c1, then enters the in-element optical waveguide 32b1, and is reflected by the tapered surface 32b11. The tapered surface 32b11 deflects light 90 degrees to the left. The deflected light propagates leftward in the element-portion optical waveguide 32b1 and is extracted to the outside from an entrance 32f provided on the left side.
<Example 4 of optical module>
FIG. 13 is an explanatory view showing a specific example 4 of the optical module, where FIG. 13 (a) is a plan view, FIG. 13 (b) is a left side view, and FIG. 13 (c) is a front view. FIG. 4D is a bottom view.

  Similar to the optical module of Example 1, this optical module includes a substantially rectangular parallelepiped optical circuit portion, an upper electrode 42d, and a lower electrode 42e, and the optical circuit portion includes a receiving portion 42 that forms an eave-like convex portion. Is formed in the lower part of the side face in all directions.

  Further, like the optical module of the first specific example, the optical circuit unit includes a module substrate 42a, an element unit 42b, and a sealing unit 42c, and an entrance / exit 42f is formed on the left side which is one side surface of the optical circuit unit. In addition, an entrance / exit 42h is formed on the back side surface, which is a surface adjacent to the left side surface, and an entrance / exit 42g is formed on the front side surface. The element portion 42b is made of a reflective resin portion formed on the upper surface of the module substrate 42a, and a T-shaped optical waveguide 42b1 is formed on the upper surface thereof. The T-shaped optical waveguide 42b1 includes a main optical waveguide 42b11 linearly extending from the inlet / outlet 42f formed on the left side surface of the element portion 42b to the central portion of the element portion 42b, and the center of the main optical waveguide 42b11. A first branch optical waveguide 42b14 that is branched at a side end portion and extends linearly from the branch portion to the entrance / exit 42h formed on the back side surface of the element portion 42b; and a front side surface of the element portion 42b from the branch portion And a second branch optical waveguide 42b15 extending linearly to the entrance / exit 42g. In addition, a tapered surface 42b12 that guides light from the main optical waveguide 42b11 to the first branch optical waveguide 42b14 side, or guides light from the first branch optical waveguide 42b14 to the main optical waveguide 42b11, the main optical waveguide, A tapered surface 42b13 that guides the light from 42b11 to the second branch optical waveguide 42b15 side or the light from the second branch optical waveguide 42b15 to the main optical waveguide 42b11 side is formed.

  The element portion 42b configured as described above is formed using, for example, a mold. The mold is composed of an upper mold and a lower mold, and a recess having a shape into which the module substrate 42a is fitted is provided on the upper surface of the lower mold. In addition, the lower surface of the upper mold is provided with a recess for forming a space filled with a reflective resin on the module substrate 42a when the upper mold is matched with the lower mold. Further, the upper mold recess is provided with a T-shaped ridge having a semicircular cross section for forming the T-shaped optical waveguide 42b1, and the T-shaped ridge is formed on the side surface of the branch section. Are provided with V-shaped recesses for forming the tapered surfaces 42b12, 42b13 of the T-shaped optical waveguide 42b1.

  When forming the element portion 42b using such a mold, first, the module substrate 42a is fitted into the recess of the lower mold, and the upper mold is aligned with the lower mold and the mold is clamped. In this state, a reflective resin is injected into the space on the module substrate 42a and cured to form a reflective resin portion 42b2 having a T-shaped groove having a semicircular cross section on the upper surface. Next, the T-shaped groove is filled with a transparent silicon resin or the like with a dispenser and cured to form a T-shaped optical waveguide 42b1 having a semicircular cross section.

Since the optical module of the specific example 4 has such a configuration, for example, light incident from the entrance / exit 42f provided on the left side first passes the main optical waveguide 42b11 of the T-shaped optical waveguide 42b1 in the right direction. And is reflected by the two tapered surfaces 42b12 and 42b13. One tapered surface 42b12 deflects light 90 degrees in the back direction, and the other tapered surface 42b13 deflects light 90 degrees in the front direction. The deflected light is branched into two, propagates in the first branch optical waveguide 42b14 in the back direction and propagates in the second branch optical waveguide 42b15 in the forward direction, and is extracted to the outside from the entrance 42h and the entrance 42g.
<Example 5 of an optical module>
FIG. 14 is an explanatory view showing a specific example 5 of the optical module, in which FIG. 14 (a) is a plan view, FIG. 14 (b) is a left side view, and FIG. ) Is a cross-sectional view taken along the line K-K, and FIG.

  Similar to the optical module of Example 1, this optical module includes a substantially rectangular parallelepiped optical circuit portion, an upper electrode 52d, and a lower electrode 52e, and the optical circuit portion includes a receiving portion 52 that forms an eaves-like convex portion. Is formed in the lower part of the side face in all directions.

  Further, the optical circuit section includes a module substrate 52a, an element section 52b, and a sealing section 52c as in the optical module of the first specific example. An entrance / exit 52h is formed on the left side which is one side surface of the optical circuit section, an entrance / exit 52f is formed on the lower surface which is another surface adjacent to the left side, and an entrance / exit 52g is formed on the upper surface. Is formed.

  A through hole serving as an entrance / exit 52f is formed in the central portion of the module substrate 52a.

  The element portion 52b is made of a reflective resin portion formed on the upper surface of the module substrate 52a, and a main optical waveguide 52b1 having a circular cross section penetrating in the vertical direction is formed on the entrance / exit 52f of the reflective resin portion. Yes. A branching portion is formed on the upper surface of the main optical waveguide 52b1, and here, a tapered surface 52b11 for deflecting light by 90 degrees is formed on the left half surface. Furthermore, on the upper surface of the reflective resin portion constituting the element portion 52b, a first branch optical waveguide 52b2 extending from the entrance / exit 52h formed on the left side to the upper portion of the main optical waveguide 52b1 and facing the tapered surface 52b11 is provided. Is formed.

  Furthermore, the sealing portion 52b is made of a reflective resin portion formed on the upper surface of the element portion 52b. The right half surface of the upper surface of the main optical waveguide 52b1 and the entrance / exit 52g are connected to the reflective resin portion. A second branch optical waveguide 52c1 having a semicircular cross section is formed.

Since the optical module of the specific example 5 has such a configuration, for example, light incident from the entrance / exit 52f provided on the lower surface propagates upward in the main optical waveguide 52b1. Of the propagated light, the right half of the light enters the second branch optical waveguide 52c1 and propagates, and is extracted to the outside from the entrance / exit 52g on the upper surface. The left half light is reflected by the tapered surface 52b11. The tapered surface 52b11 deflects light 90 degrees in the left direction. The deflected light propagates in the left direction in the main optical waveguide 52b1, then enters the first branch optical waveguide 52b2, propagates in the left direction, and is extracted to the outside from an entrance 52h provided on the left side.
<Specific example 6 of optical module>
15A and 15B are explanatory views showing a specific example 6 of the optical module, where FIG. 15A is a plan view, FIG. 15B is a cross-sectional view taken along line LL in FIG. FIG. 2C is a cross-sectional view taken along line MM in FIG. 2A, and FIG. 2D is a bottom view.

  Similar to the optical module of Example 1, this optical module includes a substantially rectangular parallelepiped optical circuit portion, an upper electrode 62d, and a lower electrode 62e, and the optical circuit portion includes a receiving portion 62 that forms an eaves-like convex portion. Is formed in the lower part of the side face in all directions.

  Further, like the optical module of the first specific example, the optical circuit section includes a module substrate 62a, an element portion 62b formed on the upper surface of the module substrate 62a, and a sealing portion 62c formed on the upper surface of the element portion 62b. An entrance / exit 62f is formed on the front side surface of the element portion 62b, an entrance / exit 62g is formed on the back side surface facing the front side surface, an entrance / exit 62h is formed on the right side surface adjacent to the front side surface, and a left side surface facing the right side surface. An entrance / exit 62i is formed.

  The element portion 62b has a substantially dome-shaped transparent resin portion 62b3 at a central portion, and the periphery thereof is covered with a reflective resin portion 62b4. And the 1st deflection | deviation part 62b1 and the 2nd deflection | deviation part 62b2 are arrange | positioned with the taper surfaces 62b11 and 62b21 facing each other in the bottom face part (namely, module module 62a upper surface part) of the transparent resin part 62b3, A right optical waveguide 67b7 and a left optical waveguide 67b8 having a semicircular cross section made of a transparent silicon resin or the like on the upper surface of the reflective resin portion 62b4 above the first deflection portion 62b1 and the second deflection portion 62b2. Are arranged opposite to each other. One end of the right optical waveguide 67b7 is connected to an entrance / exit 62h formed on the right side surface, and the other end is led out to the inside of the transparent resin portion 62b3. The left optical waveguide 67b8 has one end connected to an entrance / exit 62i formed on the left side and the other end led out to the inside of the transparent resin portion 62b3.

  In addition, a second reflective resin portion 62b5 having an inverted trapezoidal cross section is formed at the center upper portion of the transparent resin portion 62b3, and the right tapered surface 62b51 of the second reflective resin portion 62b5 is the transparent resin portion 62b3. Opposite to the other end portion of the right optical waveguide 68b7 led to the inside, the left tapered surface 62b52 of the second reflective resin portion 62b5 is located at the other end portion of the left optical waveguide 68b8 led to the inside of the transparent resin portion 62b3. Opposite. Furthermore, the right tapered surface 62b51 and the tapered surface 62b11 of the first deflecting portion 62b1 are inclined in the same direction and are opposed to each other vertically, and the left tapered surface 63b52 and the tapered surface 62b21 of the second deflecting portion 62b2 are in the same direction. It is inclined to be opposed to the top and bottom.

  Further, a third optical waveguide 62b6 having a semicircular cross section made of a transparent silicon resin or the like is formed on the upper surface of the second reflective resin portion 62b5 in a direction orthogonal to the right optical waveguide 67b7 and the right optical waveguide 67b8. Yes. The third optical waveguide 62b6 connects an entrance / exit 62f formed on the front side surface of the element portion 62b and an entrance / exit 62g formed on the back side surface.

  Since the optical module of the specific example 6 has such a configuration, for example, light incident from the entrance / exit 62h provided on the right side propagates in the second optical waveguide 62b7 in the left direction, and the transparent resin portion The light is incident on 62b3 and transmitted to the left, and is reflected by the right tapered surface 62b51. The right tapered surface 62b51 deflects light downward by 90 degrees. The deflected light is transmitted downward through the transparent resin portion 62b3 and reflected by the tapered surface 62b11 of the first deflection portion 62b1. The tapered surface 62b11 deflects light 90 degrees in the left direction. The deflected light passes through the transparent resin portion 62b3 in the left direction and is reflected by the tapered surface 62b21 of the second deflection portion 62b2. The tapered surface 62b21 deflects light upward by 90 degrees. The deflected light passes upward through the transparent resin portion 62b3 and is reflected by the left tapered surface 62b52. The left tapered surface 62b52 deflects light 90 degrees in the left direction. The deflected light passes through the transparent resin portion 62b3 in the left direction, enters the second optical waveguide 62b8, propagates in the left direction, and is extracted to the outside from an entrance / exit 62i provided on the left side.

  Further, for example, light incident from the entrance / exit 62f provided on the front side surface is propagated through the first optical waveguide 62b6 and then extracted to the outside from the entrance / exit 62g provided on the back side surface.

As can be seen from the specific examples 1 to 6, the optical module of the present invention forms optical waveguides of various shapes, but all the entrances and exits formed on the side surfaces are positioned in the width direction. The height position is formed at the same position. Moreover, the entrance / exit formed in the upper surface and the lower surface is also unified in the center part. As a result, when an optical / electronic composite circuit is formed by combining various optical modules as will be described later, the optical waveguides can be reliably connected by simply arranging the optical modules in the horizontal and vertical directions. It is designed to be optically connected.
<Specific example 7 of optical module>
In the optical modules of Specific Examples 1 to 6 described above, the receiving portions are formed in the lower portions of the side surfaces of the four sides, but may include a receiving portion guide instead of the receiving portions.

  FIG. 16 is an explanatory view showing a specific example 7 of the optical module, where FIG. 16 (a) is a plan view, FIG. 16 (b) is a left side view, and FIG. 16 (c) is a right side view. FIG. 4D is a cross-sectional view taken along line NN in FIG. 4A, and FIG. 4E is a bottom view.

  This optical module differs from the optical module shown in FIG. 3 only in that a receiving portion guide 12 ′ is provided instead of the receiving portion 12. Here, a specific example of an optical module provided with a receiving portion guide using an optical module having the same configuration as that of the optical module shown in FIG. 3 is shown. However, the optical module shown in FIGS. A receiving portion guide may be provided instead of the portion.

  Next, an embodiment of an optical / electronic composite circuit configured using the optical module of the present invention will be described.

  FIG. 17 is an explanatory diagram showing an embodiment of the optical / electronic composite circuit of the present invention.

  In the optical / electronic composite circuit, by mounting the two optical modules 2a and 2b on the electric wiring pattern 1a of the circuit board 1 in a state where the receiving portion 2a1 and the receiving portion guide 2b1 are combined by reflow soldering or the like, The electrical wiring pattern 1a and the lower surface electrode (not shown) are electrically connected. Further, the entrance / exit provided on the right side of the optical module 2a and the entrance / exit provided on the left side of the optical module 2b are formed by applying and curing an optical connection adhesive in order to reduce Fresnel loss. Optical connection is performed using the optical connection unit 4. An IC 3 is also mounted on the electric wiring pattern 1a of the circuit board 1. The IC 3 outputs a control signal to the photoelectric conversion elements in the optical modules 2a and 2b, and an electric signal output from the photoelectric conversion elements. Or have received.

  Next, an embodiment of a method for manufacturing the optical / electronic composite circuit shown in FIG. 17 will be described.

  First, after applying cream solder on the electric wiring pattern 1a formed on the circuit board 1 by performing photo-etching or the like, the IC 3 and the optical module 2a are arranged on the electric wiring pattern 1a. Next, the optical module 2b is arranged on the right side of the optical module 2a by combining the receiving part and the receiving part guide while being in close contact with the right side surface of the optical module 2a. In this state, an optical connection adhesive such as a thermosetting transparent epoxy adhesive is injected between the optical module 2a and the optical module 2b, and the entrance / exit of the optical module 2a and the entrance / exit of the optical module 2b are injected. Apply an optical connection adhesive. At this time, an excessive amount of the optical connection adhesive may hang down below the entrance / exit, but an excessive amount accumulates on the upper surface of the receiving portion 2a, so that the optical connection adhesive does not sag to the circuit board 1. .

  Finally, by heating in a reflow oven, the cream solder is cured to electrically connect the electrodes, and the optical connection adhesive 4 is cured to form an optical connection portion 4 that optically connects the entrances and exits. An optical / electronic composite circuit is obtained.

  The optical / electronic composite circuit of the present invention is not limited to the form shown in FIG. 17, and is arranged in a state where a plurality of optical modules receiving parts and receiving part guides are combined on a circuit board, and by reflow soldering. The electrodes are manufactured by electrically connecting the electrodes and optically connecting the entrances and exits by forming an optical connection portion. The configuration of the element portion of the optical module used is changed according to the design of the optical / electronic composite circuit.

Specific examples 1 to 3 of the optical / electronic composite circuit are shown below.
<Example 1 of optical / electronic composite circuit>
FIG. 18 is an explanatory view showing a specific example 1 of the optical / electronic composite circuit of the present invention, where FIG. 18 (a) is a plan view and FIG. 18 (b) is an O1-O1 line in FIG. 18 (a). It is sectional drawing and the figure (c) is the O2-O2 sectional view taken on the line of the figure (a).

  Note that the cream solder, the optical module and the circuit board, and the bottom electrode are very thin members and are not shown in FIGS. 18B and 18C.

  In this specific example, an optical / electronic composite circuit is configured using four optical modules, and an optical module having substantially the same configuration as the optical module shown in FIG. 16 is used as the first optical module 310. The first optical module 310 has no left optical waveguide for the optical waveguide and only the right optical waveguide 12f1, and the right tapered surface 12e10 does not have the left tapered surface for the tapered surface. 16 is different from the optical module shown in FIG. 16 in that only one light emitting area of the photoelectric conversion element 12b10 as a light emitting element is provided. Further, the optical module shown in FIG. 11 is used as the second optical module 320, and the optical module shown in FIG. 11 is used in a state of being rotated 90 degrees clockwise as the third optical module 330. Further, as the fourth optical module 340, an optical module having substantially the same configuration as that of the optical module shown in FIG. 16 is used, and the fourth optical module 340 does not have a left optical waveguide with respect to the right side. A point having only the optical waveguide 12f1, a point having no taper surface on the left side but only a right taper surface 12e10, and a light receiving area of the photoelectric conversion element 12b20 as a light receiving element This is different from the optical module shown in FIG.

  The optical / electronic composite circuit of this specific example constitutes a photo interrupter that detects the presence or absence of a coin using the above-described optical module.

  When manufacturing this optical / electronic composite circuit, first, cream solder is applied on the electric wiring pattern 301a formed on the circuit board 301, and the IC 302 and the first optical module 310 are arranged at each mounting position. Next, the second optical module 320 is brought into close contact with the right side surface of the first optical module 310, and the receiving portion of the second optical module 320 is combined with the receiving portion guide of the first optical module 310, whereby the right side of the first optical module 310 is combined. The right doorway provided on the surface and the left doorway provided on the left side surface of the second optical module 320 are placed close to each other at the mounting position on the circuit board 301. Further, the third optical module 330 is placed on the circuit board 301 in a state where the front entrance provided on the front side surface of the second optical module 320 and the back entrance provided on the back side surface of the third optical module 330 are close to each other. Placed at the mounting position. Note that the mounting position of the second optical module 320 and the mounting position of the third optical module 330 are adjacent to each other via a notch 301 b provided in the circuit board 301.

  Next, the fourth optical module 340 is brought into close contact with the left side surface of the third optical module 330 and the receiving part of the third optical module 330 and the receiving part guide of the fourth optical module 340 are combined to form the third optical module 330. The left entrance provided on the left side and the right entrance provided on the right side of the fourth optical module 340 are placed close to each other at the mounting position on the circuit board 301.

  Thereafter, an adhesive for optical connection between the right entrance of the first optical module 310 and the left entrance of the second optical module 320 and between the left entrance of the third optical module 330 and the right entrance of the fourth optical module 340. And an optical connection adhesive is applied between the adjacent entrances and exits.

  Finally, it is heated in a reflow oven, the cream solder is cured to electrically connect the electrodes, and the optical connection adhesive is cured to provide the optical connection portions 303 and 304 between the adjacent entrances and exits. A photo interrupter is obtained by optical connection.

  In the optical / electronic composite circuit of this specific example, the first optical module 310 includes a light emitting element 12b10 that is die-bonded on the wiring portion of the electric wiring pattern of the module substrate 12a. The light emitting element 12b10 outputs light upward in accordance with operation control by the IC 302. This light is transmitted upward through the transparent resin portion 12c covering the light emitting element 12b10. A right taper surface 12e10 is formed on the top of the transparent resin portion 12c, and the right taper surface 12e10 reflects light and deflects it 90 degrees in the right direction. As a result, light passes through the transparent resin portion 12c in the right direction, and enters the optical waveguide 12f1 connected to the upper portion of the transparent resin portion 12c. Then, the light propagating in the right direction in the optical waveguide 12f1 is extracted outside from the right entrance of the first optical module 310.

  The light extracted from the right entrance is immediately transmitted through the optical connection portion 303, enters the left entrance of the second optical module 320, and propagates rightward in the optical waveguide 22b1 formed in the second optical module 320. To do. The optical waveguide 22b1 is bent 90 degrees toward the front at the center of the second optical module 320, and an outer corner portion of the bent portion is a tapered surface 22b11. The tapered surface 22b11 reflects light propagating through the optical waveguide 22b1 and deflects it 90 degrees in the forward direction. The deflected light propagates forward in the optical waveguide 22b1 and is taken out from the front entrance.

  The light extracted to the outside propagates in the air, crosses above the cut portion 301b, enters the back entrance of the third optical module 330, and passes through the optical waveguide 22b1 formed in the third optical module 330. Propagates toward you. The optical waveguide 22b1 is bent 90 degrees leftward at the center of the third optical module 330, and an outer corner portion of the bent portion is a tapered surface 22b11. The tapered surface 22b11 reflects light propagating forward in the optical waveguide 22b1 and deflects it 90 degrees to the left. The deflected light propagates leftward in the optical waveguide 22b1 and is extracted to the outside from the left entrance.

  The light extracted to the outside immediately passes through the optical connection portion 304, enters the right entrance of the fourth optical module 340, and propagates leftward in the optical waveguide 12f1 formed in the fourth optical module 340. . Since the optical waveguide 12f1 is connected to the upper part of the transparent resin portion 12c, the light propagated through the optical waveguide 12f1 passes through the transparent resin portion 12c in the left direction. A right tapered surface 12e10 is formed on the top of the transparent resin portion 12c, and the right tapered surface 12e10 reflects light and deflects it downward by 90 degrees. As a result, light is transmitted downward through the transparent resin portion 12c, die-bonded onto the wiring portion of the electric wiring pattern of the module substrate 12a, and is incident on the light receiving area on the upper surface of the light receiving element 12b20 covered with the transparent resin portion 12c. Incident. The light receiving element 12b20 outputs an electrical signal to the IC 302 in accordance with the amount of received light.

  The optical / electronic composite circuit of this specific example has such a configuration, and when the coin 305 passes through the cut portion 301b, the light that crosses the cut portion 301b is blocked, so that it enters the light receiving element 12b20. The amount of light decreases, and the value of the electrical signal output to the IC 302 changes. As a result, a photo interrupter that detects the passage of coins can be configured.

<Example 2 of optical / electronic composite circuit>
In the above-described specific example 1 of the optical / electronic composite circuit, the optical path for detecting the passage of the coin, that is, the photo interrupter having only one blocking optical path is shown. However, by using the optical module of the present invention, a plurality of optical interrupters can be used. A photo interrupter having a blocking optical path can be easily formed.

  For example, when a photo interrupter having only one blocking light path is incorporated in a vending machine used for purchasing a commercial product, the photo interrupter detects whether or not a coin has been inserted, but it can be handled because the type of coin is not specified. There is only one type of coin. However, by incorporating photo interrupters with the number of blocking light paths corresponding to the number of types of coins to be handled, the coins are sorted by type using the conventional sorting means, and the presence or absence of coins in each blocking light path by type By detecting this, it is possible to realize a vending machine capable of handling a plurality of types of coins. As a result, options for purchasing a commercial product can be increased.

  The optical / electronic composite circuit of this example constitutes a photo interrupter having a plurality of blocking optical paths.

  FIG. 19 is an explanatory view showing a specific example 2 of the optical / electronic composite circuit of the present invention, wherein FIG. 19 (a) is a plan view and FIG. 19 (b) is a P-P line in FIG. 19 (a). It is sectional drawing.

  The cream solder, the optical wiring pattern of the optical module and the circuit board, and the lower surface electrode are very thin members and are not shown in FIG.

  In this specific example, an optical / electronic composite circuit is configured using six optical modules, and an optical module having the same configuration as the first optical module 310 shown in FIG. 18 is used as the first optical module 410. 13 is used in a state where the optical module shown in FIG. 13 is rotated 90 degrees counterclockwise, and the optical module shown in FIG. 11 is used as the third optical module 430. As the optical module 440, the optical module shown in FIG. 11 is used in a state rotated 90 degrees clockwise, and as the fifth optical module 450, the optical module shown in FIG. 13 is rotated 90 degrees clockwise. As the sixth optical module 460, an optical module having the same configuration as that of the fourth optical module 340 shown in FIG. 18 is used. In addition, the 3rd optical module 430 and the 4th optical module 440 are provided with the receiving part guide instead of the receiving part of the optical module shown in FIG.

  When manufacturing this optical / electronic composite circuit, first, cream solder is applied on the electric wiring pattern 401a formed on the upper surface of the circuit board 401, and the IC 402 and the first optical module 410 are arranged at each mounting position. The second optical module 420 is brought into close contact with the right side surface of the first optical module 410 and the receiving portion guide of the first optical module 410 is combined with the receiving portion of the second optical module 420 so that the right side surface of the first optical module 410 is attached. The right entrance provided and the left entrance provided on the left side surface of the second optical module 420 are placed close to each other at the mounting position on the circuit board 401. Further, the third optical module 430 is brought into close contact with the right side surface of the second optical module 420, and the receiving portion guide of the third optical module 430 is combined with the receiving portion of the second optical module 420, thereby the right side of the second optical module 420. The right doorway provided on the surface and the left doorway provided on the left side surface of the third optical module 430 are placed close to each other at the mounting position on the circuit board 401.

  Subsequently, in the state where the fourth optical module 440 is opposed to the front doorway provided on the front side surface of the third optical module 430 and the rear doorway provided on the back side surface of the fourth optical module 440, the circuit board 401 is provided. Place in the mounting position above. Further, the fifth optical module 450 is brought into close contact with the left side surface of the fourth optical module 440, and the receiving portion guide of the fourth optical module 440 is combined with the receiving portion guide of the fourth optical module 440. The left entrance provided on the left side and the right entrance provided on the right side of the fifth optical module 450 are brought close to each other, and the front entrance provided on the front side of the second optical module 420 and the fifth optical module 450 are provided. It is arranged at the mounting position on the circuit board 401 in a state where the back door provided on the back side face is opposed to the back door.

  Note that the mounting position of the second optical module 420 and the mounting position of the fifth optical module 450, and the mounting position of the third optical module 430 and the mounting position of the fourth optical module 440 are the cut portions 401b provided on the circuit board 401. Are adjacent to each other.

  Next, the sixth optical module 460 is brought into close contact with the left side surface of the fifth optical module 450, and the receiving portion of the fifth optical module 450 is combined with the receiving portion guide of the sixth optical module 460, whereby the left side of the fifth optical module 450 is combined. The left entrance provided on the surface and the right entrance provided on the right side of the sixth optical module 460 are placed close to each other at the mounting position of the sixth optical module 460.

  Thereafter, between the right entrance of the first optical module 410 and the left entrance of the second optical module 420, between the right entrance of the second optical module 420 and the left entrance of the third optical module 430, and of the fourth optical module 440. Between the left doorway and the right doorway of the fifth optical module 450, and between the left doorway of the fifth light module 450 and the right doorway of the sixth optical module 460, an optical connection adhesive is injected and between adjacent doorways Apply an adhesive for optical connection.

  Finally, it is heated in a reflow oven to cure the cream solder to electrically connect the electrodes, and to cure the optical connection adhesive to provide the optical connection portions 403, 404, 405, 406 A photo interrupter is obtained by optically connecting the entrance and exit.

  In the optical / electronic composite circuit of this specific example, the second optical module 420 includes a T-shaped optical waveguide 42b1 having a branch portion. Light output from the right entrance of the first optical module 410 is incident on the optical waveguide 42b1 through the optical connection portion 403 and the left entrance of the second optical module 420. The incident light propagates in the right direction in the optical waveguide 42b1, and a part of the propagated light is incident on the tapered surface 42b12 formed at the branch portion of the optical waveguide 42b1. The tapered surface 42b12 reflects light and deflects it 90 degrees in the forward direction. As a result, light propagates in the optical waveguide 42b1 from the branching portion to the front entrance provided on the front side surface, and is taken out from the front entrance. The extracted light traverses the upper portion of the cut portion 401 a and enters the back entrance provided on the back side surface of the fifth optical module 450. In addition, the other part of the light incident on the optical waveguide 42b1 propagates in the right direction in the optical waveguide 42b1 from the branch part to the right entrance without being reflected by the tapered surface 42b12 formed in the branch part, It is taken out from the right entrance. The extracted light immediately enters the left entrance of the third optical module 430 through the optical connection unit 404.

  On the other hand, the fifth optical module 450 includes a T-shaped optical waveguide 42b1 having a branch portion. The optical waveguide 42b1 propagates the light incident from the right entrance of the fifth optical module 450 to the left entrance along with the light incident from the back entrance. That is, the light incident from the rear entrance is propagated forward in the optical waveguide 42b1 and enters the tapered surface 42b13 formed at the branch portion. As a result, the light is deflected 90 degrees in the left direction at the branching portion. In addition, light incident from the right entrance of the fifth optical module 450 propagates leftward in the optical waveguide 42b1 to the branching portion, and part of the light from the branching portion to the left entrance along with the light incident from the back entrance. The light propagates leftward in the optical waveguide 42b1 and is taken out from the left entrance.

  The optical / electronic composite circuit of this example has such a configuration, and when one coin 407 passes between the third optical module 430 and the fourth optical module 440 and passes through the cut portion 401b. The light output from the front entrance of the third optical module 430 and entering the back entrance of the fourth optical module 440 is blocked. As a result, the amount of light incident on the light receiving element 12b20 decreases, and the value of the electrical signal output to the IC 402 changes. On the other hand, when the other one coin 408 passes between the second optical module 420 and the fifth optical module 450 and passes through the cut portion 401b, it is output from the front entrance of the second optical module 420 and is output to the fifth optical module 450. Blocks light incident on the back door. As a result, the amount of light incident on the light receiving element 12b20 decreases, and the value of the electrical signal output to the IC 402 changes.

The IC 402 detects which position of the cut portion 401a the coin has passed by the difference in the amount of change in the amount of incident light on each light receiving element 12b20, and as a result, detects the coin by type.
<Example 3 of optical / electronic composite circuit>
The optical / electronic composite circuit of the present invention is not limited to the photo interrupter as described above.

  FIG. 20 is an explanatory view showing an embodiment of a method for manufacturing an optical / electronic composite circuit of the present invention, and is an explanatory view showing a process of manufacturing the optical / electronic composite circuit of Example 3. FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along the line QQ in FIG.

  FIG. 21 is an explanatory view showing a specific example 3 of the optical / electronic composite circuit, where FIG. 21 (a) is a plan view, and FIG. 21 (b) is a cross-sectional view taken along the line RR of FIG. is there.

  Note that the solder cream, the optical wiring pattern of the optical module and the circuit board, and the bottom electrode are very thin members and are not shown in FIGS. 20 (b) and 21 (b).

  The optical module on the circuit board of this specific example constitutes an optical / electronic composite circuit formed by constructing multiple stages (in this specific example, two stages), and uses four optical modules and one spacer described later. This constitutes an optical / electronic composite circuit. Further, as the first optical module 510, an optical module having the same configuration as that of the fourth optical module 340 shown in FIG. 18 is used, and as the second optical module 520, the optical module shown in FIG. The optical module shown in FIG. 14 is rotated 180 degrees as the optical module 530, and the optical module having the same configuration as the first optical module 310 shown in FIG. 18 is rotated 180 degrees as the fourth optical module 540. It is used in the state of letting.

  When manufacturing this optical / electronic composite circuit, as shown in FIG. 20, first, cream solder is applied on an electric wiring pattern 501a formed on the circuit board 501 by using photo-etching, etc. The IC 502 and the first optical module 510 are disposed at the positions, and the second optical module 520 is brought into close contact with the right side surface of the first optical module 510 so that the receiving portion guide of the first optical module 510 receives the second optical module 520. And the right entrance provided on the right side of the first optical module 510 and the left entrance provided on the left side of the second optical module 520 are arranged close to each other. Subsequently, the spacer 550 shown in FIG. 22 is placed in close contact with the right side surface of the second optical module 520 and the receiving portion guide of the spacer 550 is combined with the receiving portion of the second optical module 520.

  FIG. 22 is an explanatory diagram showing an example of a spacer constituting the optical / electronic composite circuit shown in FIG. FIG. 4A is a plan view, FIG. 4B is a side view, and FIG. 4C is a bottom view.

  In the spacer 550, for example, an insulating resin portion 550b is formed on a module substrate 550a having an electrical wiring pattern on the upper surface, and the lower surface electrodes 550c are formed at the four corners on the lower surface of the module substrate 550a. The upper electrode 550d is formed at the four corners of the upper surface of the insulating resin portion 550b. Furthermore, a receiving part or a receiving part guide is formed at the lower part of the four side surfaces, and as shown in the figure, a receiving part guide 550e is formed here.

  The spacer 550 is a means for determining the position in the thickness direction (vertical direction) of the optical module arranged on the spacer 550 when the optical module is constructed in multiple stages, and the electrode portion of the electric wiring pattern on the upper surface of the circuit board. And means for electrically connecting the lower electrode of the optical module disposed above. Further, since the spacer 550 does not include an element portion having a photoelectric conversion element, an optical waveguide, or the like, it can be manufactured at a lower cost than the optical modules as shown in specific examples 1 to 7.

  After the spacer 550 is disposed on the circuit board 501, as shown in FIG. 20, the space between the right entrance of the first optical module 510 and the left entrance of the second optical module 520 and the upper surface of the second optical module 520 Optical connection adhesives 503 ′ and 504 ′ are applied on the upper doorway provided in the above.

  Subsequently, cream solder (not shown) is applied on the upper surface electrode 32d of the second optical module 520 and the upper surface electrode 550d of the spacer 550.

  Thereafter, as shown in FIG. 21, the third optical module 530 is brought close to the upper entrance of the second optical module 520 and the lower entrance of the third optical module 530, and the second optical module 520. The upper surface electrode 32d and the lower surface electrode of the third optical module 530 are in close contact with each other, and are disposed on the second optical module 520.

  Subsequently, the fourth optical module 540 is brought into close contact with the right side surface of the third optical module 530, and the receiving portion guide of the fourth optical module 540 is combined with the receiving portion of the third optical module 530. The right entrance and the left entrance provided on the left side of the fourth optical module 540 are close to each other, and the upper surface electrode 550d of the spacer 550 and the lower surface electrode of the fourth optical module 540 are in close contact with each other. To place.

  Next, an optical connection adhesive 505 ′ is applied between the right entrance of the third optical module 530 and the left entrance of the fourth optical module 540.

  In such a state, heating is performed in a reflow oven to cure the cream solder and electrically connect each optical module, and also cure the optical connection adhesives 503 ′, 504 ′, and 505 ′ for optical connection. Bonding portions 503, 504, and 505 are formed, and the respective entrances are optically connected to obtain an optical / electronic composite circuit.

  In the optical / electronic composite circuit of this specific example, the third optical module 530 is used to convert light incident from the entrance / exit (hereinafter referred to as “upper entrance / exit”) provided on the upper surface and the right entrance / exit to the second branch optical waveguide. It is taken out from the lower entrance through 52c1 and the main optical waveguide 52b1.

  In addition, the light emitting element 12b10 of the fourth optical module 540 outputs light in accordance with operation control by the IC 502. This light is extracted outside from the left entrance of the fourth optical module 540, and immediately enters the first branch optical waveguide 52b2 from the right entrance of the third optical module 530 via the optical connection portion 505 and propagates in the left direction. . The light propagating through the first branch optical waveguide 52b2 enters the main optical waveguide 52b1, and enters the tapered surface 52b11 provided on the upper surface of the main optical waveguide 52b1. This tapered surface 52b11 reflects light and deflects it downward by 90 degrees. The light after the deflection is extracted to the outside from the lower entrance with the light incident from the upper entrance of the third optical module 530.

  Then, the light extracted from the lower entrance is immediately incident on the upper entrance of the second optical module 520 through the optical connection portion 504, propagates downward in the optical waveguide 32c1 in the sealing portion, and then receives the light in the element portion. The light enters the waveguide 32b1 and is reflected by the tapered surface 32b11. The tapered surface 32b11 deflects light 90 degrees to the left. The deflected light propagates leftward in the element-portion optical waveguide 32b1 and is taken out from the left entrance.

  The light extracted outside enters the optical waveguide 12f1 from the right entrance of the first optical module 510 via the optical connection portion 503 and propagates in the left direction. The light propagating through the optical waveguide 12f1 passes through the transparent resin portion 12c in the left direction and enters the tapered surface 12e10 formed at the top. The tapered surface 12e10 reflects light and deflects it 90 degrees downward. The deflected light propagates downward in the transparent resin portion 12c and enters the light receiving element 12b20.

  The optical / electronic composite circuit of the present specific example converts, for example, light (peripheral light, etc.) incident from the upper entrance of the third optical module 530 to the light receiving element 12b20 in the first optical module 510 and converts it into an electrical signal. Used as a sensor.

  In general, adjustment of spectral sensitivity is important in an illuminance sensor, and spectral sensitivity adjustment is usually performed by a color filter or the like, and therefore, the secular change is severe. In the optical / electronic composite circuit of this specific example, the light emitted from the light emitting element 12b10 in the fourth optical module 540 is also applied to the light receiving element 12b20 of the first optical module 510 together with the light incident from the upper and lower entrances of the third optical module 530. It is comprised so that it may inject. Therefore, when the optical / electronic composite circuit of this example is used as an illuminance sensor, the illuminance sensor is calibrated (spectral sensitivity adjustment) with the light output from the light emitting element 12b10 in the fourth optical module 540. it can. As a result, since spectral sensitivity can be adjusted without using a color filter, secular change can be reduced.

  In this specific example, the optical / electronic composite circuit is used as an illuminance sensor. However, the use of the optical / electronic composite circuit of the present invention is not limited to the illuminance sensor.

  Here, the optical connection adhesive is applied to the entrance / exit of the optical module, but instead of this, a silicon rubber protrusion may be provided at the entrance / exit of the optical module to suppress the Fresnel loss.

  Furthermore, in the present specification, the upper surface electrodes are provided at the four upper surface corners of the optical circuit unit, but the upper surface electrodes can be omitted depending on the usage form of the optical module. That is, in the above-described specific example 3 of the optical / electronic composite circuit, the optical module is constructed in multiple stages on the circuit board 501, and the circuit is provided via the lower surface electrode (not shown) and the upper surface electrode 32d of the second optical module 520. The electrical wiring pattern 501a on the substrate 501 and the lower surface electrode (not shown) of the third optical module 530 are electrically connected. Therefore, the optical module used as the second optical module 520 needs to have a top electrode, and the optical modules used as the first, third, and fourth optical modules 510, 530, and 540 have a top electrode. There is no need. For example, if the upper electrode is omitted when forming the optical module, the manufacturing cost of the optical module can be reduced, and if the upper electrode is provided, the versatility of the optical module can be expanded.

  INDUSTRIAL APPLICABILITY The optical module, the optical module manufacturing method, the optical / electronic composite circuit configured using the optical module, and the manufacturing method of the optical module according to the present invention are utilized in the case of producing a small variety of optical wiring and circuits having electrical wiring it can.

It is explanatory drawing which shows Embodiment 1 of the optical module of this invention. It is explanatory drawing which shows Embodiment 2 of the optical module of this invention. It is explanatory drawing which shows the specific example 1 of the optical module of this invention. It is process explanatory drawing which shows the procedure which mounts a photoelectric conversion element in one Embodiment of the manufacturing method of the optical module shown in FIG. It is process explanatory drawing which shows the procedure which forms a transparent resin part and a reflective resin part in one Embodiment of the manufacturing method of the optical module shown in FIG. It is process explanatory drawing which shows the procedure which forms an optical waveguide in one Embodiment of the manufacturing method of the optical module shown in FIG. It is process explanatory drawing which shows the procedure which implements dicing and forms a receiving part in one Embodiment of the manufacturing method of the optical module shown in FIG. It is process explanatory drawing which shows the procedure which implements dicing and forms a receiving part guide in one Embodiment of the manufacturing method of the optical module shown in FIG. It is explanatory drawing which shows an example of the lower surface electrode and upper surface electrode of the optical module of this invention. It is explanatory drawing which shows the other example of the lower surface electrode and upper surface electrode of the optical module of this invention. It is explanatory drawing which shows the specific example 2 of the optical module of this invention. It is explanatory drawing which shows the specific example 3 of the optical module of this invention. It is explanatory drawing which shows the specific example 4 of the optical module of this invention. It is explanatory drawing which shows the specific example 5 of the optical module of this invention. It is explanatory drawing which shows the specific example 6 of the optical module of this invention. It is explanatory drawing which shows the specific example 7 of the optical module of this invention. It is explanatory drawing which shows one Embodiment of the optical / electronic composite circuit of this invention. It is explanatory drawing which shows the specific example 1 of the optical / electronic composite circuit of this invention. It is explanatory drawing which shows the specific example 2 of the optical / electronic composite circuit of this invention. It is explanatory drawing which shows one Embodiment of the manufacturing method of the optical / electronic composite circuit of this invention. It is explanatory drawing which shows the specific example 3 of the optical / electronic composite circuit of this invention. It is explanatory drawing which shows an example of the spacer which comprises the optical / electronic composite circuit shown in FIG. It is explanatory drawing which shows an example of the conventional board | substrate for IC chip mounting. It is explanatory drawing which shows an example of the conventional semiconductor infrared laser chip. It is explanatory drawing which shows an example of the conventional plane lens chip. It is explanatory drawing which shows an example of the conventional fixed stand chip | tip. It is explanatory drawing which shows an example of the conventional hybrid type | mold optical integrated circuit. It is explanatory drawing which shows an example of the conventional optical integrated circuit module. It is explanatory drawing which shows the other example of the conventional optical integrated circuit module. It is explanatory drawing which shows the further another example of the conventional optical integrated circuit module. It is explanatory drawing which shows the further another example of the conventional optical integrated circuit module. It is explanatory drawing which shows the further another example of the conventional optical integrated circuit module. It is explanatory drawing which shows an example of the conventional optical semiconductor device. It is explanatory drawing which shows the other example of the conventional optical semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 1a Electric wiring pattern 2a, 2b Optical module 2a1 Receiving part 2b1 Receiving part guide 3 IC
4 Optical connections

Claims (15)

  It is composed of an optical circuit portion having a substantially rectangular parallelepiped shape and a plurality of lower surface electrodes formed on the lower surface of the optical circuit portion, and the optical circuit portion includes an element portion having an optical waveguide, a side surface of the optical circuit portion, An entrance / exit to which the optical waveguide is connected is formed on at least one of the upper surface and the lower surface, and a convex receiving portion or a concave receiving portion combined with the receiving portion is provided below the entrance / exit on the side surface of the optical circuit portion. An optical module in which a part guide is formed.   The optical module according to claim 1, further comprising a photoelectric conversion element in the element portion, wherein the photoelectric conversion element is connected to the optical waveguide.   3. The optical module according to claim 1, wherein an entrance / exit is formed on at least two of a side surface, an upper surface, and a lower surface of the optical circuit unit, and each entrance / exit is connected by the optical waveguide. Optical module.   4. The optical module according to claim 3, wherein an entrance / exit is formed on at least two adjacent surfaces of the optical circuit section.   4. The optical module according to claim 3, wherein an entrance / exit is formed on at least two faces of the optical circuit portion facing each other.   4. The optical module according to claim 3, wherein an entrance / exit is formed on one surface of the optical circuit section and two surfaces adjacent to the one surface.   2. The optical module according to claim 1, wherein an upper surface electrode is provided on the upper surface of the optical circuit section.   8. The optical module according to claim 7, wherein the optical circuit unit includes a module substrate provided with an electric wiring pattern on an upper surface, an element unit formed on the module substrate, and a sealing unit covering the upper surface of the element unit. The lower surface electrode is formed on the lower surface of the module substrate, the upper surface electrode is formed on the upper surface of the sealing portion, and the lower surface electrode and the upper surface electrode are electrically connected.   9. The optical module according to claim 8, further comprising a conductive block disposed on and electrically connected to the electrical wiring pattern, wherein the conductive block penetrates the element portion and the sealing portion and the upper end portion is sealed. An optical module that is arranged in a state of protruding from the top surface of the part, and in which the protruding part functions as an upper surface electrode.   9. The optical module according to claim 8, further comprising a conductive block disposed on the electrical wiring pattern and electrically connected, wherein the conductive block is disposed in the element portion and the sealing portion, and an upper surface thereof. Is provided with a protruding portion formed using a conductive silicon resin, and the protruding portion is formed in a state of protruding from the upper surface of the sealing portion, and this protruding portion functions as an upper surface electrode. An optical module manufacturing method according to claim 1,
When forming an optical module having a receiving portion after forming element portions and sealing portions for a plurality of optical modules on the upper surface of one substrate to be a module substrate after division, a wide first blade is used. Then, half dicing is performed from the upper surface side of the substrate to form a dicing groove, and full dicing is performed on the bottom surface of the dicing groove using a second blade narrower than the first blade to divide the optical module into a single product, When forming an optical module having a receiving portion guide, a dicing groove is formed by performing half dicing from the lower surface side of the substrate using a wide first blade, and the bottom surface of the dicing groove is narrower than the first blade. A method of manufacturing an optical module, characterized in that full dicing is performed using a second blade to divide the optical module into a single product. An optical / electronic composite circuit configured using the optical module according to claim 1,
The circuit board on which the electrical wiring pattern is formed and a plurality of optical modules arranged and mounted in a state where the receiving portion and the receiving portion guide are combined on the electrical wiring pattern. It is optically connected through an optical connection formed by applying and curing a connecting adhesive, and electrical wiring is formed by the electrical wiring pattern of the circuit board and the lower surface electrode of the optical module. An optical / electronic composite circuit, wherein an optical wiring is formed by an optical waveguide. An optical / electronic composite circuit configured using the optical module according to claim 7,
The circuit board on which the electrical wiring pattern is formed and a plurality of optical modules mounted on the electrical wiring pattern are formed by applying and curing an optical connection adhesive between two adjacent entrances and exits. It is optically connected through the optical connection part, the electrical wiring is formed by the electrical wiring pattern of the circuit board, the lower surface electrode and the upper surface electrode of the optical module, and the optical wiring is formed by the optical waveguide of the optical module Optical and electronic composite circuit characterized by A method of manufacturing an optical / electronic composite circuit according to claim 12,
Applying cream solder on the electrical wiring pattern formed on the upper surface of the circuit board;
Arranging a plurality of optical modules on the electrical wiring pattern;
Passing the reflow oven to cure the cream solder and soldering between the electrical wiring pattern and the bottom electrode of the optical module;
Applying an optical connection adhesive between two adjacent doorways;
A method for producing an optical / electronic composite circuit comprising: curing an optical connection adhesive to form an optical connection portion. A method of manufacturing an optical / electronic composite circuit according to claim 13,
Applying cream solder on the electrical wiring pattern formed on the upper surface of the circuit board;
Arranging a plurality of optical modules on the electrical wiring pattern;
Applying an optical connection adhesive between the optically connected entrance and exit;
A solder application step of applying cream solder to the upper surface electrode of the optical module, a first adhesive application step of applying an optical connection adhesive between the two entrances when there are two close entrances, and Second adhesive application step and upper surface electrode for applying optical connection adhesive to the entrance / exit provided on the upper surface when optically connecting the entrance / exit provided on the upper surface and the entrance / exit provided on the lower surface of the optical module of the next stage A multi-layer process comprising an arrangement step of arranging an optical module on the top;
It consists of the steps of passing through a reflow oven to cure the cream solder and soldering between the electrical wiring pattern and the lower electrode of the optical module, and curing the optical connection adhesive to form the optical connection part,
A method of manufacturing an optical / electronic composite circuit, wherein the multilayering step is performed at least once.

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