JP2002090586A - Optical/electronic circuit module and method for manufacturing the same - Google Patents

Optical/electronic circuit module and method for manufacturing the same

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Publication number
JP2002090586A
JP2002090586A JP2000278828A JP2000278828A JP2002090586A JP 2002090586 A JP2002090586 A JP 2002090586A JP 2000278828 A JP2000278828 A JP 2000278828A JP 2000278828 A JP2000278828 A JP 2000278828A JP 2002090586 A JP2002090586 A JP 2002090586A
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JP
Japan
Prior art keywords
optical
electronic circuit
circuit board
signal
circuit module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000278828A
Other languages
Japanese (ja)
Inventor
Hitomaro Togo
仁麿 東郷
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP2000278828A priority Critical patent/JP2002090586A/en
Publication of JP2002090586A publication Critical patent/JP2002090586A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Abstract

PROBLEM TO BE SOLVED: To provide an optical/electronic circuit module in which an optimal design is attained without causing the transmission or reception of an optical signal by a photoelectric element, the transmission or reception of an electric signal by an electronic circuit element to be restricted with the optical guiding of an optical signal and which has improved various signal transfer characteristic such as high-frequency signal transmission characteristic, and to provide a method for manufacturing the same. SOLUTION: The principal part of the optical/electronic circuit module is constituted by superposing an optical waveguide board 1 on a high-frequency circuit board 2 in nearly parallel, and adhering their peripheries with a sealing agent-cum-adhesive 12 made of an ultraviolet curing resin to seal them. In more detail, the optical waveguide board 1 is equipped with an optical waveguide 9 and a multiplayer film mirror 10, and emits or receives an optical signal in the vertical direction relative to the high-frequency circuit board 2. A light receiving element 3, a light emitting element 4 or the like are mounted on the high-frequency circuit board 2, and those optical axes are positioned so as to be aligned with the optical axis of the optical waveguide 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical / electronic circuit module using both an optoelectronic device and an electronic circuit device, such as a high-frequency optical communication module used for high-speed optical fiber communication, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, in addition to communication systems using metal cables, optical fiber communication systems capable of transmitting a large amount of information at high speed with low loss have been attracting attention. In the field of optical fiber communication technology, higher performance and lower cost of communication functions such as optical / electronic circuit modules are demanded.

Conventionally, an optical / electronic circuit module using such an optical signal and an electric signal together in a system is, for example, a chip carrier type package having a light receiving element 503 as shown in FIG. Photoelectric device (optical device)
525, an electronic circuit element (electronic device) 523 such as an electronic component such as a capacitor, a signal processing circuit element, and the like, and a high-frequency coaxial connector 524, which are housed in the optical module package 527 and connected to the outside by bonding wires 517. In general, a configuration mounted on the high-frequency signal transmission board 522 is used.

The photoelectric element 525 is, for example, a light receiving element 503.
In the case of (1), it is necessary to input an optical signal from the direction perpendicular to the light receiving surface. On the other hand, an optical signal transmitted from the outside is emitted from the end face of the optical fiber 526 in a direction parallel to the substrate. For this reason, the light receiving element 503 must be disposed so as to be substantially perpendicular to the substrate surface so that the optical signal emitted from the end face of the optical fiber 526 can be received substantially perpendicular to the light receiving surface. Then, the light receiving element 503 and the optical fiber 526 are coupled so that the optical axes thereof coincide with each other, and substantially the entire photoelectric element 525 including the coupling portion is hermetically sealed with a metal hermetic package 527. The optical module containing the photoelectric element 525 as described above is electrically connected to a high-frequency circuit module 528 disposed at a subsequent stage via the high-frequency coaxial connector 524.

[0005] Alternatively, as shown in an example in FIG. 7, an optical waveguide substrate 529 having an optical branching function and the like is provided.
A light receiving element 503, a light emitting element 504, an optical fiber 526, and the like are arranged thereon, and the light receiving element 503 and the light emitting element 50 are arranged.
An optical / electronic module having a configuration in which the optical fiber 4 and the optical fiber 526 are optically connected via an optical waveguide substrate 529 is also known. Note that the light receiving element 503 and the light emitting element 504 are further connected to the high frequency signal output terminal 530 by a bonding wire 517 or the like. The high frequency signal output terminal 530
Is the electronic circuit element 5 of the next-stage high-frequency circuit board 531
32 and the like. In such an optical / electronic module, a plurality of photoelectric elements can be mounted on one substrate by using a passive alignment technique.

Further, an optical fiber integrated with a reflecting lens (not shown) proposed in Japanese Patent Application Laid-Open No. 7-270642 is
After the tip of the optical fiber is melted, a surface inclined with respect to the optical axis of the optical fiber is formed at the tip, and the light propagating through the optical fiber is reflected and collected at the tip, thereby forming a surface on the circuit board. An optical signal can be made to enter or exit from the upper part of the light receiving element mounted on the device.
An optical signal can be incident or emitted almost vertically on a light-receiving element or light-emitting element mounted on a substrate in a plane (parallel to the surface of the substrate). In addition to miniaturization of dimensions, it is possible to connect the light-receiving element or light-emitting element to the substrate by means of lead frame pins or surface-mounting connection methods, and obtain good high-frequency characteristics. Become.

[0007]

However, in the conventional optical / electronic circuit module, in order to control complicated signal processing and a large number of communication circuits, a large number of light receiving elements 503 and light emitting elements 504 for transmitting and receiving optical signals are used. And the like must be provided on one substrate, and complicated optical waveguides (optical circuits) and high-frequency signal circuits (electric circuits) must be formed on the same substrate. There is a problem that the planar pattern arrangement and the arrangement of the optical waveguide and the arrangement of the photoelectric element and the electronic circuit element are often mutually restricted, and it is extremely difficult to optimize their arrangement design. .

In the conventional optical / electronic circuit module, as shown in FIGS. 6 and 7, the optical axes of the light receiving element 503 and the light emitting element 504 and the optical axis of the optical fiber 526 are almost aligned with the substrate surface. Since the light receiving elements 503 and the light emitting elements 504 are set so as to coincide with the parallel direction, the light signals must be incident or emitted from the side surfaces when the light receiving elements 503 and the light emitting elements 504 are mounted on the substrate. Therefore, the light receiving element 503 and the light emitting element 50
As for 4, an optical signal input or output port is provided on the side surface, and a special structure that is housed in a mounting package in which pins of a lead frame or the like extend in a direction substantially perpendicular to the substrate is required. Becomes However, ZIP (ZigzagInline Packa), which is a standard for the package form of electronic components,
ge) generally requires that the height dimension on the board be high, and also achieves verticality to the board surface and accurate positioning in the height direction when actually mounted on the board. That tends to be difficult.

Therefore, in practice, a package accommodating the light-receiving element 503 and the light-emitting element 504 is mounted sideways, and a bonding wire is connected to a pad of the light-receiving element 503 and the light-emitting element 504 to connect with the outside. I try to take a connection. However, in such a configuration, the bonding wires must be long, and signal transmission characteristics such as high-frequency signal transmission characteristics are reduced due to the deterioration of the parasitic inductance and impedance characteristics. In addition, the connection of the pads of the light receiving element 503 and the light emitting element 504 arranged so as to stand in the vertical direction and the pads arranged planarly on the substrate surface or the like by bonding wires, or the optical waveguide substrate 529 and the high frequency The connection with the circuit board 531 by a jumper wire, a flexible board, or the like has a problem that productivity is low.

In the technique proposed in Japanese Patent Application Laid-Open No. Hei 7-270642, accurate alignment is performed separately for each of the optical axes of the inclined distal end surface of the optical fiber and the light receiving element 503 or the light emitting element 504. Since the connection must be performed, the process becomes extremely complicated, and there is a problem that productivity is poor. Further, in this technique, it is difficult to input an optical signal transmitted through one optical waveguide to a plurality of photoelectric elements at a time or to branch the optical signal into a plurality of optical waveguides.

Another problem common to all of the above-mentioned conventional technologies is that in order to prevent floating dust from entering or adhering in the transmission path of the optical signal, the entire module or at least the joint between the photoelectric element and the optical waveguide is prevented. It is necessary to form an airtight structure between joints and optical waveguides, and the overall configuration has been complicated.

The present invention has been made to solve such a problem, and an optical / electronic circuit module and an optical / electronic circuit module capable of improving various signal transmission characteristics such as high-frequency signal transmission characteristics. An object of the present invention is to provide a manufacturing method thereof. Alternatively, an optical / electronic circuit module and a method of manufacturing the optical / electronic circuit module capable of achieving an optimum design without restricting the planar pattern arrangement of the optical waveguide and the high-frequency signal circuit and the arrangement of the photoelectric element and the electronic circuit element to each other. Is provided. Another object of the present invention is to provide an optical / electronic circuit module which can be easily and inexpensively manufactured by using a light receiving element or a light emitting element mounted in a package form conforming to a general standard, and a method of manufacturing the same. . Alternatively, it is not necessary to individually provide an airtight structure for the entire module or at least the seam between the photoelectric element and the optical waveguide or the seam between the optical waveguides, and it is possible to simplify the entire configuration. An electronic circuit module and a method for manufacturing the same are provided.

[0013]

An optical / electronic circuit module according to the present invention comprises: a photoelectric element capable of transmitting or receiving an optical signal;
An optical / electronic circuit board on which an electronic circuit element capable of transmitting or receiving an electric signal is mounted, and the optical / electronic circuit board is stacked and arranged substantially in parallel on the optical / electronic circuit board, and the optical signal is incident on the photoelectric element. Or an optical waveguide circuit substrate having a predetermined optical path for emitting and further guiding the optical signal.

Further, the optical / electronic circuit module of the present invention is provided on an optical / electronic circuit board on which a photoelectric element capable of transmitting or receiving an optical signal and an electronic circuit element capable of transmitting or receiving an electric signal are mounted. A configuration including a step of stacking and arranging optical waveguide circuit boards having a predetermined optical path for guiding the optical signal so that the optical signal can be incident or emitted to the photoelectric element, and bonding the both. Have.

With this configuration, while the transmission or reception of the optical signal by the photoelectric element and the transmission or reception of the electric signal by the electronic circuit element are performed by the optical / electronic circuit board, it is possible to guide the optical signal on a predetermined optical path. This is performed on an optical waveguide circuit board. As a result, both can perform optimal circuit design without restricting each other, except for alignment for transmitting and receiving optical signals.

Further, in the optical / electronic circuit module of the present invention, the photoelectric element is surface-mounted on the optical / electronic circuit board, and the optical signal is incident on the optical / electronic circuit board in an upward or downward direction. Alternatively, a configuration capable of emitting light may be used.

Alternatively, in the optical / electronic circuit module according to the present invention, the photoelectric element is flip-chip mounted on the optical / electronic circuit board, and the optical signal is transmitted to the optical / electronic circuit board. It is also possible to adopt a configuration in which light can enter or exit in the direction or downward direction.

With such a configuration using surface mounting or flip-chip mounting, it is possible to minimize the wiring length required for connection between the photoelectric element and the substrate, connection between the photoelectric element and the electronic circuit element, and the like. As a result, various signal transmission characteristics such as high-frequency signal transmission characteristics can be improved. In addition, a light receiving element or a light emitting element mounted in a package conforming to a general standard can be used. As a result, a manufacturing process can be simplified and a manufacturing cost can be reduced.

In the optical / electronic circuit module according to the present invention, the photoelectric device may be a surface emitting device. With this configuration, the electrical connection of the photoelectric element can be further simplified, and light can be incident on and emitted from the photoelectric element not on a point but on a surface, and more reliable transmission and reception of an optical signal can be performed. You can do it.

Further, the optical / electronic circuit module of the present invention may be configured such that the optical / electronic circuit board is further mounted with an optical component for guiding an optical signal. With this configuration, it is possible to perform further various optical controls on the optical signal using the optical component.

Further, in the optical / electronic circuit module and the method of manufacturing the same according to the present invention, the optical / electronic circuit board and the optical waveguide circuit board are bonded at least around the periphery with a sealing material and an adhesive. May be formed in an airtight structure. With this configuration, by simply bonding the optical / electronic circuit board and the optical waveguide circuit board, the two boards can be extremely easily and reliably formed in an airtight structure, and the optical signal transmitted and received between the two boards can be conducted. It is possible to prevent floating dust and the like from entering or adhering to the wave path.

Further, in the method for manufacturing an optical / electronic circuit module according to the present invention, a plurality of the optical / electronic circuit boards and the optical waveguide circuit boards are respectively formed in one sheet substrate, and both of them are formed. A configuration in which the original substrate is superimposed and adhered substantially in parallel, and then the original substrate is cut and divided into individual optical / electronic circuit modules by a combination of the optical / electronic circuit substrate and the optical waveguide circuit substrate. It may be. With this configuration, the original substrate of the opto-electronic circuit board before cutting and the original substrate of the optical waveguide circuit substrate need only be aligned once, thereby improving the productivity when manufacturing a plurality of opto-electronic circuit modules. Can be greatly improved.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. <First Embodiment> FIG. 1 shows a schematic configuration of an optical / electronic circuit module according to a first embodiment of the present invention. FIG. 2 is a sectional view thereof. Since the optical / electronic circuit module according to the present embodiment is manufactured by the manufacturing method thereof, the description will be made below together.

The first embodiment of the optical / electronic circuit module according to the present invention is set for transmission and processing of a high-frequency signal. The optical waveguide substrate 1 and the high-frequency circuit substrate 2 are superposed substantially in parallel. The main part is constituted by bonding and sealing the periphery with a sealing material and adhesive 12 using an ultraviolet curable resin. Further, in the first embodiment, a multi-core optical fiber connector 7 is connected for transmitting an optical signal to the outside, and an electric connector 8 is connected for transmitting an electric signal. Here, the optical waveguide substrate 1 and the high-frequency circuit substrate 2 respectively correspond to the optical waveguide circuit substrate and the optical / electronic circuit substrate in the respective claims.

The optical waveguide substrate 1 includes an optical waveguide 9 and a multilayer mirror 10, and emits an optical signal (optical drop function) or enters (optical add function) in a direction perpendicular to the high-frequency circuit board 2. is there. The optical waveguide 9 is set so that an optical axis guides an optical signal in a direction substantially parallel to the surface of the high-frequency circuit board 2. The multilayer mirror 10 is arranged at predetermined positions, for example, at an angle of 45 degrees with respect to the surface of the high-frequency circuit board 2. The multilayer mirror 10 reflects an optical signal guided in a direction parallel to the high-frequency circuit board 2, changes its direction in the vertical direction, and makes it incident on a predetermined position on the high-frequency circuit board 2. Or conversely,
The optical signal incident from a predetermined position on the high-frequency circuit board 2 is reflected by the multilayer mirror 10 to change its direction, and is guided into the optical waveguide 9.

The high-frequency circuit board 2 includes a light-receiving element 3, a light-emitting element 4, an electronic circuit element 5 such as a high-frequency device, and an electric signal transmission line 6 as main parts, and a positioning marker 112 at a predetermined position on the surface. Is formed.
As partially shown in FIG. 3, the light receiving element 3, the light emitting element 4,
The electronic circuit element 5 and the like are mounted by a surface mount type package or a flip chip.

Since the light receiving element 3 and the light emitting element 4 are mounted on the high frequency circuit board 2 together with the electronic circuit element 5,
These are electrically connected by an electric signal transmission line (such as a conductor pattern of a printed wiring circuit) 6 to constitute an electronic circuit. The light receiving element 3 and the light emitting element 4
Has an opening for receiving or emitting an optical signal on its upper surface, and is mounted on the high-frequency circuit board 2 and mounted on the optical waveguide board 1.
An optical signal is made incident or outgoing in a direction substantially perpendicular to the surface.

Positioning marker 1 on optical waveguide substrate 1
11 and alignment marker 112 on high-frequency circuit board 2
By simply aligning the two substrates so that they match, the light-receiving element 3 on the high-frequency circuit board 2 can be easily and reliably connected.
The alignment of the optical axis of the light emitting element 4 with the optical axis of the optical waveguide 9 in the optical waveguide substrate 1 can be performed, and one optical / electronic circuit system can be configured by both substrates.

Further, since the optical waveguide substrate 1 can be used only for guiding an optical signal, it is possible to optimally design the optical waveguide without being restricted by other conditions, and to receive light. Since the high-frequency circuit board 2 can be used only for mounting the element 3, the light emitting element 4, and the electronic circuit element 5, it is necessary to optimize the mounting of the electronic circuit element 5 without being restricted by other various conditions. Becomes possible. As a result, the wiring length of the electric signal transmission line 6 and the like can be minimized, and various signal transmission characteristics such as high-frequency signal transmission characteristics can be improved.

Further, since an optical signal can be made to enter or exit from the surface of the high-frequency circuit board 2 in a substantially vertical direction,
As the light receiving element 3 and the light emitting element 4, the photoelectric element mounted (accommodated) in a general surface mount type package can be surface mounted on the high-frequency circuit board 2. As a result, it is possible to eliminate a decrease in high-frequency signal characteristics due to the parasitic inductance, impedance, and the like of the conventional bonding wire.

The optical waveguide substrate 1 and the high-frequency circuit substrate 2
Are superimposed substantially in parallel, and the periphery thereof is bonded with a sealing material / adhesive 12 to easily and reliably seal between the two substrates, which are the most important connection portions of the optical signal waveguide. Can be stopped.

As the electronic circuit element 5, other than a high-frequency device, for example, an optoelectronic device such as a liquid crystal display element having a shutter function for switching an optical signal can be used. Also, the light receiving element 3
It is needless to say that, for example, a photodiode or the like can be used, and as the light emitting element 4, for example, a surface emitting type light emitting diode element can be used.

<Second Embodiment> FIG. 4 shows a second embodiment of the present invention.
It is the fragmentary sectional view which showed the principal part of embodiment. In the second embodiment, in addition to the first embodiment,
Optical components such as the optical component 18 having the lens 180 and the optical component 19 having the mirror 190 are mounted on the high-frequency circuit board 2 with an accuracy of several μm in the same manner as the electronic circuit element 5 by, for example, reflow soldering. Is surface mounted.

Therefore, the optical coupling efficiency can be improved by the lens 180 of the optical component 18. Further, since the optical signal emitted in the direction parallel to the substrate surface can be reflected in the vertical direction by the mirror 190 of the optical component 19 to change its direction, the side edge light emitting element 20 can be used. Moreover, since the optical component can be accurately mounted at a predetermined position in the same process as the mounting of the electronic circuit element 5 by the reflow soldering method, the manufacturing process is complicated because the optical component is further mounted on the substrate. Such a disadvantage does not occur, and the simplicity of the manufacturing method can be maintained.

In addition to the optical components having a lens or a mirror, for example, a color light filter, an interference filter, a polarization filter, or the like that passes only light of a specific wavelength, a phase difference compensating plate, or an optical path is changed. It is also possible to use a prism or the like for performing the operation.

<Third Embodiment> FIG. 5 shows an outline of a method of manufacturing an opto-electronic circuit module according to a third embodiment of the present invention.

While an optical waveguide 9 and a multilayer mirror 10 are formed on the optical waveguide substrate 1, an electric signal transmission line 6 is formed on the surface of the high-frequency circuit substrate 2, and the light receiving element 3, the light emitting element 4, and the electronic circuit The element 5 is mounted. At this time, a plurality of optical waveguide substrates 1 are formed in parallel in one sheet substrate 100. Similarly, a plurality of high-frequency circuit boards 2 are formed in parallel in one sheet substrate 200.

Subsequently, the optical waveguide substrate 1 is superimposed on the surface of the high-frequency circuit board 2 on which the light-receiving element 3 and the light-emitting element 4 are mounted. The material / adhesive 12 is applied to almost the entire surface of the high-frequency circuit board 2 to bond the two boards together. At this time, bubbles and the like are prevented from being mixed between the two substrates. At this time, the positioning marker 101 on the source substrate 100 and the positioning marker 20 on the source substrate 200 are used.
By aligning the two substrates with each other, the optical axis of each optical waveguide substrate 1 and the optical axis of each high-frequency circuit board 2 can be aligned.

Then, the boundaries between the optical / electronic circuit modules formed by combining the optical waveguide substrate 1 and the high-frequency circuit substrate 2 are cut. In this manner, a plurality of optical / electronic circuit modules can be manufactured at one time in one manufacturing process, and thus, an improvement in productivity and a reduction in manufacturing cost can be achieved.

In the above-described embodiment, the case where the optical waveguide substrate 1 is bonded to the surface of the high-frequency circuit board on the side on which the light receiving element, the light emitting element, and the like are mounted (omotenmen) is described. As described above, in addition to this, for example, an opening through which light enters or exits is provided on the bottom surface side of the light receiving element or the light emitting element, and a through hole that penetrates the high-frequency circuit board in the thickness direction from the opening to the back surface. It is also possible to provide a hole (through hole) and attach the optical waveguide substrate to the back surface of the substrate. In this case, by mounting the light receiving element and the light emitting element on the surface of the substrate, the back surface of the substrate can be made almost completely flat, so that the optical waveguide substrate is closely adhered to the high frequency circuit substrate in parallel with no gap. Can be stuck together,
It is possible to further reduce the size of the entire optical / electronic circuit module in the thickness direction and further secure parallel bonding.

[0041]

As described above, according to the present invention, the transmission or reception of the optical signal by the photoelectric element and the transmission or reception of the electric signal by the electronic circuit element are performed by the optical / electronic circuit board, while the optical signal is transmitted or received. By conducting the light guide (propagation) on the optical waveguide circuit board, it is possible to perform the optimal circuit design without restricting the two. As a result, it is possible to optimize both the arrangement of the photoelectric element and the electronic element and the arrangement of the optical waveguide, and it is possible to improve various signal transmission characteristics such as high-frequency signal transmission characteristics. A module and a method for manufacturing the module can be provided.

Further, by using the surface mounting or the flip chip mounting, it is possible to minimize the wiring length required for connection between the photoelectric device and the substrate, connection between the photoelectric device and the electronic device, and as a result, An object of the present invention is to provide an optical / electronic circuit module having excellent signal transmission characteristics such as high-frequency signal transmission characteristics and a method for manufacturing the same.

Further, according to the present invention, an optical component for guiding an optical signal is further mounted on an optical / electronic circuit board, so that various optical controls on the optical signal can be performed using the optical component. It is possible to provide an optical / electronic circuit module capable of performing the above and a method for manufacturing the same.

Further, according to the present invention, the optical / electronic circuit board and the optical waveguide circuit board are bonded at least around the periphery thereof with a sealing material and an adhesive, so that an airtight structure is formed between the two boards.
By simply bonding the optical / electronic circuit board and the optical waveguide circuit board, it is possible to extremely easily and reliably form an airtight structure between the two boards, and to guide optical signals transmitted and received between the two boards. It is possible to provide an optical / electronic circuit module capable of preventing floating dust and the like from entering or adhering to a path and a method for manufacturing the same.

Further, according to the present invention, a plurality of optical / electronic circuit boards and optical waveguide circuit boards are formed in a single original substrate, and the original substrates are superimposed substantially in parallel. After making contact, the original substrate is cut and divided into individual optical and electronic circuit modules by combining optical and electronic circuit boards and optical waveguide circuit boards. An object of the present invention is to provide a method of manufacturing an optical / electronic circuit module capable of greatly improving productivity in manufacturing.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a first embodiment of an optical / electronic circuit module of the present invention.

FIG. 2 is a sectional view showing a schematic configuration of a first embodiment of the optical / electronic circuit module of the present invention.

FIG. 3 is a partial cross-sectional view showing a light-receiving element mounted on a surface-mounted package or a flip chip according to the first embodiment of the optical / electronic circuit module of the present invention;

FIG. 4 is a partial sectional view showing a main part of a second embodiment of the optical / electronic circuit module of the present invention.

FIG. 5 is a diagram showing an outline of a method for manufacturing an optical / electronic circuit module according to a third embodiment of the present invention;

FIG. 6 is a diagram showing a main part of a conventional optical / electronic circuit module.

FIG. 7 is a diagram showing a main part of another conventional optical / electronic circuit module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical waveguide board 2 High frequency circuit board 3 Light receiving element 4 Light emitting element 5 Electronic circuit element 6 Electric signal transmission line 7 Multi-core optical fiber connector 8 Electric connector 9 Optical waveguide 10 Multilayer mirror 12 Sealant and adhesive

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 33/00 H01L 31/02 B

Claims (9)

[Claims]
1. An optical / electronic circuit board on which an optoelectronic device capable of transmitting / receiving an optical signal, an electronic circuit element capable of transmitting / receiving an electric signal are mounted, and substantially parallel to the optical / electronic circuit board. And an optical waveguide circuit board provided with an optical path for inputting or outputting the optical signal to the photoelectric element and guiding the optical signal.
2. The photoelectric device is surface-mounted on the optical / electronic circuit board, and is capable of entering or emitting the optical signal in an upward or downward direction of the optical / electronic circuit board. An optical / electronic circuit module as described in the above.
3. The optical / electronic circuit board is mounted on the optical / electronic circuit board by a flip chip, and the optical signal is transmitted to the optical / electronic circuit board.
2. The optical / electronic circuit module according to claim 1, wherein the optical / electronic circuit module is capable of entering or exiting the electronic circuit board in an upward or downward direction.
4. The opto-electronic circuit module according to claim 2, wherein the photoelectric device is a surface-emitting device.
5. The optical / electronic circuit module according to claim 1, wherein the optical / electronic circuit board further comprises an optical component for guiding the optical signal.
6. The light according to claim 1, wherein the optical / electronic circuit board and the optical waveguide circuit board are bonded together at least around the periphery thereof with a sealing material and an adhesive, so that an airtight structure is formed between the two boards.・ Electronic circuit module.
7. An optical / electronic circuit board on which a photoelectric element capable of transmitting or receiving an optical signal and an electronic circuit element capable of transmitting or receiving an electric signal are mounted, wherein the optical signal is transmitted to the photoelectric element. A method of manufacturing an optical / electronic circuit module, comprising: stacking and arranging optical waveguide circuit substrates provided with a predetermined optical path for guiding the optical signal in a substantially parallel manner so that light can be incident or emitted, and bonding them.
8. At least the periphery of the optical / electronic circuit board and the optical waveguide circuit board is superposed and adhered substantially in parallel using a sealing material / adhesive, and the sealing material / adhesive is provided. The method for manufacturing an optical / electronic circuit module according to claim 7, wherein an airtight structure is provided between the two substrates.
9. A plurality of said optical / electronic circuit boards and said optical waveguide circuit boards are respectively formed in one original substrate, and after bonding both of these substrates, 8. The method for manufacturing an optical / electronic circuit module according to claim 7, wherein the optical / electronic circuit module is cut into individual optical / electronic circuit modules by a combination of the optical / electronic circuit board and the optical waveguide circuit board.
JP2000278828A 2000-09-13 2000-09-13 Optical/electronic circuit module and method for manufacturing the same Withdrawn JP2002090586A (en)

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Application Number Priority Date Filing Date Title
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