JP5047591B2 - Flexible optical waveguide and optical waveguide module - Google Patents

Description

The present invention relates to a flexible optical waveguide and an optical waveguide module.

  In recent years, with an increase in the amount of information transmitted inside an electronic device, a method (optical interconnection) in which information is transmitted between circuits by optical communication is being developed. And in order to raise the freedom degree of the circuit arrangement | positioning inside an electronic device, flexible optical waveguides, such as a flexible optical waveguide film, were developed as such an optical waveguide for optical communications, and this flexible optical waveguide is developed. An optical coupling method between a waveguide and a semiconductor optical device has also been proposed.

  For example, as shown in FIG. 21, an optical interconnection board described in Patent Document 1 is provided on a flexible and thin-film optical waveguide 101, a substrate 102 having a fitting hole 102a, and a back surface of the substrate 102. The fixed plate 103 and the integrated element 104 including the light emitting / receiving unit 104a are provided. The end portion of the optical waveguide 101 is fitted in the fitting hole 102a of the substrate 102, and the integrated element 104 is mounted on the end portion so that the light emitting / receiving portion 104a is disposed. Further, portions other than the end portion of the optical waveguide 101 are bonded to a fixed plate 103 having a curved surface.

JP-A-5-281428

  However, when an optical element is mounted on a substrate, bumps, spacers, and the like often support the optical element, and the light detection surface (or light emitting surface) is separated from the substrate surface. In the optical interconnection board described in Patent Document 1, since the end surface of the optical waveguide 101 is arranged so as to form the same surface as the surface of the substrate 102, the light emitting / receiving unit 104 a is separated from the surface of the substrate 102. The light emitted from the end face of the optical waveguide 101 (or the light emitted from the light receiving / emitting section 104a) spreads, and the light loss between the end face of the optical waveguide 101 and the light receiving / emitting section 104a increases. Since the end portion of the optical waveguide 101 is inserted into the fitting hole 102a provided in the substrate 102, even if the end surface of the optical waveguide 101 protrudes from the surface of the substrate 102, the protruding height cannot be controlled with high accuracy.

The present invention has been made in view of the above problems , and an optical waveguide module capable of increasing the optical coupling efficiency between an optical element and an end face of the optical waveguide , and a flexible optical waveguide usable in the optical waveguide module. The purpose is to provide.

In order to solve the above-described problems, a flexible optical waveguide according to the present invention has a main portion extending in the optical waveguide direction, a core portion including an end extending in a direction crossing the optical waveguide direction, and a cladding portion covering the core portion. And having the end surface of the core portion on the side surface along the optical waveguide direction, the connecting portion between the main portion and the end portion of the core portion being bent, and having a light reflecting surface embedded adjacent to the connecting portion a reflecting member further Yes, the reflecting member is formed along a plane intersecting the predetermined plane, and the shape of the cross section along a predetermined plane comprises a metal film formed on an annular, the metal film formed on the annular The inside is filled with the constituent material of the core part or the clad part .
The flexible optical waveguide has a plurality of core portions, the main portions of the plurality of core portions are arranged side by side in a direction intersecting the optical waveguide direction, and the end surfaces of the plurality of core portions are side surfaces. In FIG. 2, the plurality of core portions may be arranged side by side along the optical waveguide direction, and the plurality of core portions may not cross each other.
The optical waveguide module according to the present invention has any of the flexible optical waveguides described above and a groove extending inward from the side wall along the optical waveguide direction, and a part of the flexible optical waveguide is accommodated and fixed in the groove. A core part, comprising: a base part; an optical element mounted on the base part so as to straddle the flexible optical waveguide; and a pedestal part provided in a gap between the optical element and the base part to support the optical element. The flexible optical waveguide is fixed to the base portion so that the end face of the base plate faces the optical element, and the side surface of the flexible optical waveguide protrudes from the surface of the base portion.

  In the optical waveguide module described above, the end surface of the core portion is disposed on the side surface of the flexible optical waveguide along the optical waveguide direction, and the flexible optical waveguide is mounted on the base with the side surface protruding from the surface of the base portion. It is housed and fixed in the groove of the part. Therefore, according to this optical waveguide module, the distance between the light emitting / receiving area of the optical element mounted on the base part and the end face of the core part is shortened in the form in which the base parts such as bumps and spacers support the optical element. Thus, the mutual optical coupling efficiency can be increased. In addition, since it is easy to accurately form the width of the flexible optical waveguide and the depth of the groove of the base portion, according to the optical waveguide module described above, the protruding height of the side surface of the flexible optical waveguide can be accurately controlled.

  The optical waveguide module may be characterized in that the side surface of the flexible optical waveguide is in contact with the optical element directly or via a refractive index matching material. Thereby, the optical coupling efficiency between the optical element and the end face of the core part can be further increased.

  The optical waveguide module may be characterized in that the base is made of silicon, quartz, ceramic, or resin. If the base is made of silicon, quartz, or ceramic, the groove for accommodating and fixing the flexible optical waveguide can be formed with extremely high accuracy. If the base part is made of resin, the base part can be manufactured at a lower cost and a lead frame can be applied to the wiring of the optical element.

The flexible optical waveguide has an electrical wiring extending in the optical waveguide direction in the interior of the cladding portion, the end portion of the electric wiring may be characterized by exposed from the cladding portion in the side surface. Thereby, both optical communication and electric communication between circuits are attained using one optical waveguide module.

The flexible optical waveguide may be characterized by further comprising a mark member colored embedded in the cladding portion to indicate a position of the end face of the core portion in the side surface. Thereby, the position of the end face of the core part can be easily and accurately visually recognized, and the relative positional accuracy between the optical element and the end face of the core part can be increased, so that the optical coupling efficiency between the optical element and the end face of the core part can be increased. It can be further increased.

  Further, the optical waveguide module may be characterized in that a connection portion between the main portion and the end portion of the core portion is bent, and the flexible optical waveguide further includes a reflecting member embedded adjacent to the connection portion. . Thereby, the light guided through the core portion can be guided from the main portion to the end portion (or from the end portion to the main portion) while suppressing loss.

  The optical waveguide module further includes a case for accommodating the base portion and the optical element, and the case preferably has an opening for leading out the flexible optical waveguide. Further, in this case, the case is made of metal, a metal film is formed in a region surrounded by the opening of the case on the surface of the flexible optical waveguide, and the gap between the opening of the case and the metal film is a conductive adhesive. It is still more preferable that it is sealed with.

  In the optical waveguide module, the optical element has a plurality of light receiving and emitting regions arranged in the optical waveguide direction, the flexible optical waveguide has a plurality of core portions, and each of the plurality of light receiving and emitting regions of the optical element and the plurality of core portions. These end faces may be arranged to face each other. Thereby, more information can be transmitted using one optical waveguide module.

  The optical waveguide module includes a light emitting element and a light detecting element mounted on the base as optical elements, and the flexible optical waveguide has at least two core parts, and the light emitting region and the light detecting element of the light emitting element. The light detection region of the element and the end faces of at least two core portions may be arranged to face each other. Thereby, bidirectional information transmission can be performed using one optical waveguide module.

  In addition, the optical waveguide module includes a plurality of flexible optical waveguides, the base portion has a plurality of grooves, and a part of each flexible optical waveguide is respectively accommodated and fixed in the plurality of grooves of the base portion. It may be characterized by being. Thereby, more information can be transmitted using one optical waveguide module.

  The optical waveguide module may be characterized in that the base portion has an electrode pattern, and the pedestal portion is a conductive member that electrically connects the electrode pattern and the electrode of the optical element. Alternatively, the optical waveguide module may be characterized in that the pedestal is an insulating member. As described above, various members can be applied as the pedestal portion in the above-described optical waveguide module regardless of the presence or absence of electrical conductivity.

According to the optical waveguide module of the present invention, the optical coupling efficiency between the optical element and the end face of the optical waveguide can be increased. Moreover, according to this invention, the flexible optical waveguide which can be used in the said optical waveguide module can be provided.

  Embodiments of an optical waveguide module according to the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a side sectional view showing a configuration of an optical waveguide module 1 according to an embodiment of the present invention. FIG. 2 is a perspective view showing the vicinity of the end portion (near the base portion 3) of the optical waveguide module 1 shown in FIG. Referring to FIGS. 1 and 2, the optical waveguide module 1 of this embodiment includes a flexible optical waveguide 2, a base portion 3, and semiconductor optical elements 4 and 5.

  The flexible optical waveguide 2 is a thin-film optical waveguide whose longitudinal direction is a predetermined optical waveguide direction (arrow A in the figure). FIG. 1 shows a cross section orthogonal to the thickness direction of the flexible optical waveguide 2. The flexible optical waveguide 2 of the present embodiment has a core part 21, a clad part 22, an electrical wiring 23, a reflective film 24, and a metal film 26.

  The core part 21 and the clad part 22 include a polymer mainly composed of at least one kind of organic materials such as polyimide, silicone, epoxy, acrylate, polymethyl methacrylate (PMMA), and polybenzoxazole. The Alternatively, the core portion 21 and the clad portion 22 are deuterated in which H in the C—H group of these organic materials is substituted with deuterium in order to obtain optimum transmission characteristics according to the wavelength of the guided light. (Example: deuterated silicone) or a polymer mainly composed of a fluorinated product in which H in the C—H group is substituted with fluorine (eg, fluorinated polyimide) may be included. (In the following description, a polymer mainly composed of these organic materials or their deuterated and fluorinated materials is simply referred to as “polymer such as polyimide”). Among these organic materials, it is preferable to include a polyimide having a high glass transition temperature and excellent heat resistance. When the core part 21 and the clad part 22 contain polyimide, the reliability of the flexible optical waveguide 2 can be maintained over a long period of time, and the temperature rise when the semiconductor optical elements 4 and 5 are mounted can be withstood. More preferably, the core portion 21 and the clad portion 22 may be configured to include fluorinated polyimide in consideration of light transmittance, refractive index characteristics, and the like.

  The core portion 21 is covered with the cladding portion 22 and has a higher refractive index than that of the cladding portion 22, thereby constituting an optical waveguide. The waveguide mode of the core portion 21 may be either single mode or multimode. In the single mode, the width (thickness) of the core portion 21 is a value of 10 μm, for example. In the case of the multimode, the width (thickness) of the core portion 21 can be freely set over a wide range of, for example, 10 μm to several hundred μm, and is determined according to the application.

  The core portion 21 includes a main portion 21a extending in the optical waveguide direction (arrow A in the drawing) and two end portions 21b extending from both ends of the main portion 21a in a direction intersecting the optical waveguide direction A. Yes. The end portion 21b extends toward the side surface 2a along the optical waveguide direction A in the surface of the flexible optical waveguide 2, and both end surfaces 21d of the core portion 21 are formed on the side surface 2a. The connecting portion between the main portion 21a and the end portion 21b of the core portion 21 is bent at a substantially right angle. It is embedded adjacent to the connection at an angle that reflects to 21a). The reflective film 24 is a reflective member in the present embodiment, and is formed of a metal film such as aluminum.

  The electrical wiring 23 is made of, for example, a conductive material such as aluminum, and is embedded in the cladding portion 22. The electrical wiring 23 is provided along the core portion 21. That is, the electrical wiring 23 includes a main portion 23a extending in the optical waveguide direction A and an end portion 23b extending in a direction intersecting the optical waveguide direction A from the end of the main portion 23a. The end portion 23b extends toward the side surface 2a of the flexible optical waveguide 2 and is exposed from the cladding portion 22 on the side surface 2a.

  The metal film 26 is a gap between the case and the flexible optical waveguide 2 when a case (described later) for housing the base 3 and the semiconductor optical device 4 (or the semiconductor optical device 5) is made of metal (hermetic seal). Is used for sealing with solder or the like. The metal film 26 is formed by depositing, for example, gold (Au) on a part of the surface of the flexible optical waveguide 2 (the surface of the portion inserted through the opening of the metal case).

  Here, FIG. 3 is a diagram showing in detail the configuration of the flexible optical waveguide 2 of the present embodiment. FIG. 3A is a plan view of the vicinity of the end portion of the flexible optical waveguide 2 and shows an appearance when the flexible optical waveguide 2 is viewed from the side surface 2a. FIG. 3B is a sectional view taken along the line III-III of the flexible optical waveguide 2 shown in FIG.

  As shown in FIGS. 3A and 3B, the end surface 21 d of the core portion 21 and the end portion 23 b of the electrical wiring 23 are exposed on the side surface 2 a of the flexible optical waveguide 2. The flexible optical waveguide 2 of the present embodiment further includes colored mark members 25a and 25b embedded in the cladding portion 22 in order to indicate the position of the end surface 21d on the side surface 2a of the flexible optical waveguide 2 in addition to the above configuration. .

  The mark members 25a and 25b are made of the same material as the reflective film 24 (see FIG. 3B) (for example, a metal material such as aluminum), and are embedded so that the end faces 21d of the core portion 21 are positioned at the centers of each other. Yes. Each of the mark members 25a and 25b has a box shape opened in the thickness direction of the flexible optical waveguide 2, and is specifically a hollow cube filled with a constituent material of the cladding portion 22 and has a flexible optical waveguide. It has a shape such that one surface intersecting the thickness direction of 2 is removed. The shape of the mark members 25a and 25b is due to the formation of the mark members 25a and 25b by the same process as the formation process of the reflective film 24 described later, and is visually recognized on the side surface 2a of the flexible optical waveguide 2. Other shapes are possible if possible.

  Moreover, the cross-sectional shape of the reflective film 24 of this embodiment is exhibiting the box shape opened to the thickness direction of the flexible optical waveguide 2, like the mark members 25a and 25b. A part of the surface constitutes a light reflecting surface 24a, and the light reflecting surface 24a is disposed adjacent to the connecting portion 21c between the main portion 21a and the end portion 21b of the core portion 21. In addition, although the reflective film 24 of this embodiment is embedded with the material which comprises the core part 21, it may be embedded with the constituent material of the clad part 22. FIG.

  Reference is again made to FIGS. The base part 3 is a member for partially fixing the flexible optical waveguide 2 to an electronic device or the like and mounting the semiconductor optical elements 4 and 5. In the present embodiment, the base part 3 is provided at both ends of the flexible optical waveguide 2. It is arranged one by one. The base portion 3 is made of a hard material such as silicon, quartz, or ceramic, and is formed in a substantially rectangular parallelepiped shape. The base part 3 has a main surface 3a and side walls 3b. The base part 3 has a groove 31 extending in the optical waveguide direction A from the side wall 3b to the inside of the base part 3 in the main surface 3a, and a part of the flexible optical waveguide 2 (in this embodiment, an end part). ) In the groove 31 and fixed. When the dimension of the base part 3 is illustrated, height h is 300 micrometers-1 mm, for example, and a planar dimension is 1 mm or less of one side, for example. The depth of the groove 31 is, for example, about 200 μm, and is set slightly smaller than the width of the flexible optical waveguide 2 (dimension w in the drawing). The width of the groove 31 is, for example, 50 μm, and is set substantially equal to the thickness of the flexible optical waveguide 2 (dimension t in the figure).

  In the present embodiment, the length of the groove 31 in the optical waveguide direction A is finitely formed according to the length of the flexible optical waveguide 2, but the inner surface of the groove 31 is positioned on the flexible optical waveguide 2, etc. If not used, the groove 31 may be formed to penetrate from the side wall 3b of the base part 3 to the opposite side wall 3c. Moreover, it is preferable that the flexible optical waveguide 2 and the base part 3 are mutually adhere | attached by resin, such as a polyimide, for example. Further, as a method for forming the groove 31, etching is preferable in order to form the depth with high precision, but high-precision dicing may be used.

  For example, one of the semiconductor optical elements 4 and 5 is a light emitting element such as a backside emitting VCSEL (VerticalCavity Surface Emitting Laser), and the other is a light detecting element such as a photodiode. Hereinafter, for ease of explanation, the semiconductor optical device 4 is a light emitting device, and the semiconductor optical device 5 is a photodetecting device. The semiconductor optical device 4 has a light emitting region 41 as a light receiving / emitting region, and the semiconductor optical device 5 has a light detection region 51 as a light receiving / emitting region. The diameter of the light emitting region 41 is 20 μm, for example, and the diameter of the light detection region 51 is 80 μm, for example. The semiconductor optical element 4 is mounted on one base part 3, and the semiconductor optical element 5 is mounted on the other base part 3. The semiconductor optical elements 4 and 5 are arranged on each base part 3 so as to straddle one end and the other end of the flexible optical waveguide 2.

  Further, as shown in FIG. 2, a plurality of bumps 61 are provided between the semiconductor optical device 4 (5) and the base portion 3. These bumps 61 are pedestal portions in the present embodiment, and electrically connect the plurality of electrode patterns 32 provided on the main surface 3a of the base portion 3 and the respective electrodes of the semiconductor optical device 4 (5). At the same time, the semiconductor optical device 4 (5) is supported at the four corners of the semiconductor optical device 4 (5). For this reason, a gap corresponding to the height of the bump 61 is generated between the semiconductor optical device 4 (5) and the base 3. The plurality of electrode patterns 32 are electrically connected to corresponding terminals of other electronic components by wiring patterns or bonding wires (not shown).

  The flexible optical waveguide 2 of the present embodiment is fixed to the base portion 3 so that the end surface 21d of the core portion 21 faces the light emitting region 41 (light detection region 51) of the semiconductor optical device 4 (or the semiconductor optical device 5). ing. In other words, the flexible optical waveguide 2 is accommodated and fixed in the groove 31 such that the side surface 2 b opposite to the side surface 2 a including the end surface 21 d of the core portion 21 is in contact with the bottom surface of the groove 31. The width w of the flexible optical waveguide 2 is larger than the depth of the groove 31, the side surface 2 a of the flexible optical waveguide 2 protrudes from the main surface 3 a of the base portion 3, and the end surface 21 d of the core portion 21 and the semiconductor optical element 4. The light emitting area 41 (photodetection area 51) of (5) is arranged close to each other. The protruding height of the side surface 2a is equal to or less than the gap between the semiconductor optical device 4 (5) and the base portion 3 (that is, the height of the bump 61). More preferably, the side surface 2a protrudes from the main surface 3a at a height equivalent to the gap between the semiconductor optical device 4 (5) and the base portion 3, and the side surface 2a passes through the refractive index matching material 62 or directly. The semiconductor optical element 4 (5) may be in contact with the semiconductor optical element.

  In addition, by disposing the refractive index matching material 62 between the side surface 2a of the flexible optical waveguide 2 and the semiconductor optical device 4 (5), both are optically coupled with a constant refractive index without creating a gap having a low refractive index. Thus, the optical coupling efficiency can be increased, and the relative positions of the flexible optical waveguide 2 and the semiconductor optical device 4 (5) can be more reliably fixed. As such a refractive index matching material 62, for example, various types of resins such as epoxy and acrylic can be used. The resin used as the refractive index matching material 62 is preferably cured, but may be in a gel form as long as it does not flow out. Further, the curing characteristics of the resin used for the refractive index matching material 62 may be any of a thermosetting type, an ultraviolet curing type, or a combination type thereof. Since the electrode pattern 32 and the like are present on the base 3, the refractive index matching material 62 is preferably insulating.

  The end 23 b of the electrical wiring 23 is exposed without being covered with the semiconductor optical device 4 (5), and is electrically connected to the electrode 33 through the conductive paste 34. The electrode 33 is electrically connected to other electronic components by a wiring pattern or a bonding wire (not shown).

  The optical waveguide module 1 having the above configuration operates, for example, as follows. When an electrical communication signal (for example, an image signal) is input from the external circuit to the semiconductor optical device 4 through the electrode pattern 32 and the bump 61, signal light is emitted from the light emitting region 41 of the semiconductor optical device 4. The signal light passes through the refractive index matching material 62 and enters one end surface 21d of the core portion 21, and then propagates through one end portion 21b, the main portion 21a, and the other end portion 21b of the core portion 21. Then, the signal light is emitted from the other end surface 21 d of the core portion 21, passes through the refractive index matching material 62, and enters the light detection region 51 of the semiconductor optical element 5.

  In addition, a communication signal (for example, an audio signal) different from the above is input from an external circuit to the electrode 33 provided on one base part 3. This communication signal is sent to the other base unit 3 through the electrical wiring 23. The transmission direction of this communication signal may be the same direction as the signal light or may be the reverse direction.

  Here, the manufacturing method of the flexible optical waveguide 2 of the present embodiment will be described focusing on the formation process of the reflective film 24. 4-13 is a figure which shows the manufacturing process of the flexible optical waveguide 2 in order. 4 to 13, (a) is a partial plan view, and (b) is a side sectional view of (a). 4 to 13 show the manufacturing process in the vicinity of the reflective film 24 in the flexible optical waveguide 2 in an enlarged manner, but the manufacturing processes of other parts are the same.

  As shown in FIG. 4A and FIG. 4B, which is a sectional view taken along the line IV-IV, a substrate 70 is first prepared. The constituent material of the substrate 70 is appropriately selected from hard materials such as silicon, polyimide, glass, quartz, glass epoxy, and ceramic. Then, a first clad layer 71 made of resin is formed on the surface of the substrate 70. At this time, the first cladding layer 71 is preferably formed of a polymer such as polyimide. In this case, the first cladding layer 71 may be formed on the substrate 70 by coating (preferably spin coating).

  Subsequently, a metal film (for example, an aluminum film) is formed on the first cladding layer 71, and a portion excluding the predetermined pattern of the metal film is removed using a mixed acid or the like, thereby forming the electrical wiring 23. Thereafter, a resin core layer 72 is formed on the first cladding layer 71. At this time, the core layer 72 is formed of a material having a higher refractive index than that of the first cladding layer 71. In this step, the core layer 72 is preferably formed of a polymer such as polyimide. In this case, similarly to the first cladding layer 71, the core layer 72 may be formed on the first cladding layer 71 by coating (preferably spin coating).

  Subsequently, as shown in FIG. 5A and FIG. 5B which is a VV cross-sectional view thereof, a recess 72a is formed in the core layer 72, and the first cladding layer 71 is exposed. At this time, the recess 72a is formed at a position where the reflective film 24 (see FIG. 3) is disposed. Further, the planar shape of the recess 72a formed here is the cross-sectional shape of the reflective film 24 shown in FIG. For convenience of explanation, in this figure, the recess 72a is formed in the vicinity of the electrical wiring 23, but the positional relationship between the recess 72a and the electrical wiring 23 is arbitrary. As a specific method for forming the recess 72a, for example, a mask (WSi or the like) having an opening corresponding to the planar shape of the recess 72a is formed on the core layer 72, and etching is performed on the core layer 72 through this mask (preferably Dry etching) may be performed.

  Subsequently, as shown in FIG. 6A and FIG. 6B, which is a sectional view taken along the line VI-VI, the surface of the core layer 72, the side surface of the recess 72 a, and the first cladding layer 71 exposed by the recess 72 a. A metal film (for example, an aluminum film) 73 is formed on the surface. Then, as shown in FIG. 7A and FIG. 7B which is a sectional view taken along the line VII-VII, a resin layer 74 is formed on the metal film 73. The resin layer 74 is a layer for filling the inside of the reflective film 24 (see FIG. 3), and may be formed using, for example, the constituent material of the first cladding layer 71 or the constituent material of the core layer 72.

  Subsequently, the resin layer 74 is etched. At this time, etching (preferably dry etching) is performed until the metal film 73 is exposed, as shown in FIG. 8A and FIG. Then, as shown in FIG. 9A and FIG. 9B which is a cross-sectional view taken along the line IX-IX, a portion of the metal film 73 formed on the surface of the core layer 72 is removed using a mixed acid or the like. At this time, the portion of the metal film 73 formed in the recess 72a is left without being removed. Thereby, the reflecting film 24 having the light reflecting surface 24a is formed.

  Note that the mark members 25 a and 25 b shown in FIG. 3 are formed at the same time as the reflective film 24. That is, in the process shown in FIG. 5, the concave portions corresponding to the positions and shapes of the mark members 25a and 25b are formed simultaneously with the concave portions 72a. Thereby, in the subsequent steps (FIGS. 6 to 8), the mark members 25 a and 25 b are formed in parallel with the reflective film 24.

  Subsequently, a mask 75 is formed on the core layer 72 as shown in FIG. 10A and FIG. The mask 75 of the present embodiment includes a first portion 75a having a planar shape corresponding to the shape of the core portion 21 (see FIG. 3), and a second portion formed so as to cover the reflective film 24 and the resin layer 74. 75b. In addition, the 2nd part 75b may be the form which covers only the light reflection surface 24a other than the shape which covers the reflective film 24 completely as shown in FIG. As a mask material of the mask 75, for example, a resist or a metal thin film (Al, Ti, Cr, WSi, etc.) can be used.

  Subsequently, as shown in FIG. 11A and FIG. 11B, which is a sectional view taken along the line XI-XI, the core layer 21 is etched by performing etching (dry etching) on the core layer 72 through the mask 75. Form. At this time, etching is performed until the first cladding layer 71 is exposed. Thereafter, the mask 75 is removed (see FIG. 12A and FIG. 12B which is a cross-sectional view taken along the line XII-XII). Then, as shown in FIG. 13A and FIG. 13B, which is a sectional view taken along XIII-XIII, a second cladding layer 76 is applied (spin coated) so as to cover the core portion 21. Thereby, the clad part 22 which consists of the first clad layer 71 and the second clad layer 76 and covers the core part 21 is formed. Finally, the substrate 70 is removed by peeling or the like, and the flexible optical waveguide 2 of this embodiment is completed.

  Moreover, the optical waveguide module 1 of this embodiment is manufactured as follows, for example. First, as shown in FIG. 2, the groove 31 is formed in the base portion 3, and the end portion of the flexible optical waveguide 2 is accommodated in the groove 31. At this time, an adhesive resin is interposed between the flexible optical waveguide 2 and the groove 31, and the resin is cured to fix the flexible optical waveguide 2 and the base portion 3 to each other. If the width of the groove 31 is formed slightly narrower than the thickness t of the flexible optical waveguide 2, the flexible optical waveguide 2 can be easily fixed to the base portion 3. Moreover, since it heats to about 350 degreeC when mounting the semiconductor optical element 4 (5) in a subsequent process, a polymer such as polyimide having excellent heat resistance is suitable as the adhesive resin. By using a material of the same system as that of the flexible optical waveguide 2 as the adhesive resin, the generation of internal stress can be suppressed.

  Next, the electrical wiring 23 and the electrode 33 are connected to each other using the conductive paste 34. Further, bumps 61 are formed on the electrode pattern 32, and the semiconductor optical device 4 (5) is mounted on the base portion 3 (FCB: Flip Chip Bonding). Alternatively, the semiconductor optical device 4 (5) with the bump 61 is mounted on the electrode pattern 32. At this time, the position of the end face 21d of the core portion 21 is confirmed based on imaging or the like by the mark members 25a and 25b (see FIG. 3) of the flexible optical waveguide 2, and the light emitting region of the semiconductor optical device 4 (5) is formed on the end face 21d. The semiconductor optical device 4 (5) is mounted so that 41 (light detection region 51) is located. Thereafter, a refractive index matching material 62 is poured between the semiconductor optical device 4 (5) and the flexible optical waveguide 2 and cured. Through the above steps, the optical waveguide module 1 of the present embodiment is completed.

  In the optical waveguide module 1 of the present embodiment, as described above, the end surface 21d of the core portion 21 is disposed on the side surface 2a of the flexible optical waveguide 2 along the optical waveguide direction A. The flexible optical waveguide 2 is housed and fixed in the groove 31 of the base part 3 with the side surface 2 a protruding from the main surface 3 a of the base part 3. Accordingly, the distance between the light emitting region 41 (light detection region 51) of the semiconductor optical device 4 (or the semiconductor optical device 5) mounted on the base portion 3 and the end surface 21d of the core portion 21 is shortened, and the light spreads. Since it can suppress, mutual optical coupling efficiency can be improved. Moreover, it is easy to form the width w of the flexible optical waveguide 2 and the depth of the groove 31 of the base portion 3 with high accuracy, and the protruding height of the side surface 2a of the flexible optical waveguide 2 can be controlled with high accuracy.

  Further, as in the present embodiment, the side surface 2a of the flexible optical waveguide 2 is preferably in contact with the semiconductor optical device 4 (5) via the refractive index matching material 62 or directly. Thereby, the optical coupling efficiency between the semiconductor optical device 4 (5) and the end face 21d of the core portion 21 can be further increased. In the optical waveguide module 1 of the present embodiment, since the protruding height of the side surface 2a of the flexible optical waveguide 2 can be controlled with high accuracy, such a configuration can be easily realized. When the flexible optical waveguide 2 is made of a polymer such as polyimide, the flexible optical waveguide 2 has appropriate flexibility with respect to the semiconductor optical device 4 (5). Even if the semiconductor optical element 4 (5) comes into contact with the semiconductor optical element 4 (5), there is a low risk of damaging the semiconductor optical element 4 (5).

  Further, as in this embodiment, the base 3 is preferably made of silicon, quartz, or ceramic. Thereby, the groove | channel 31 for accommodating and fixing the flexible optical waveguide 2 can be formed very accurately.

  Moreover, it is preferable that the flexible optical waveguide 2 has the electrical wiring 23 like this embodiment. Thereby, both optical communication and electric communication between circuits using one optical waveguide module 1 become possible. In this case, since the end portion 23b of the electrical wiring 23 is exposed from the clad portion 22 on the side surface 2a of the flexible optical waveguide 2, the electrical wiring 23 and the external wiring can be suitably connected.

  Further, as in the present embodiment, the flexible optical waveguide 2 preferably has mark members 25a and 25b (see FIG. 3) for indicating the position of the end surface 21d of the core portion 21 on the side surface 2a. The core portion 21 and the cladding portion 22 are often transparent in order to guide light, and are made of the same material (differing only in refractive index). Therefore, it is difficult to visually recognize the position of the end surface 21d of the core portion 21. According to the flexible optical waveguide 2 of the present embodiment, the position of the end surface 21d of the core portion 21 can be easily and accurately visually recognized by the mark members 25a and 25b, so that the semiconductor optical device 4 (5) and the end surface 21d of the core portion 21 are visible. Relative position accuracy can be increased. That is, the optical coupling efficiency between the semiconductor optical device 4 (5) and the end face 21d of the core portion 21 can be further increased.

  Further, as in the present embodiment, the connecting portion 21c (see FIG. 3) between the main portion 21a and the end portion 21b of the core portion 21 is bent, and the reflective film 24 is embedded adjacent to the connecting portion 21c. It is preferable. Thereby, the light guided through the core portion 21 can be guided from the main portion 21a to the end portion 21b (or from the end portion 21b to the main portion 21a) while suppressing loss. In addition to the plane shown in FIG. 3, the shape of the light reflecting surface 24a may be a curved surface in which the core portion 21 side is concave. Further, as the reflecting member of the present invention, for example, a wavelength filter that reflects only light of a specific wavelength may be used instead of the reflecting film 24. In this case, if the main part 21a of the core part 21 is extended to the back side of the wavelength filter and the end face of the core part 21 is added, wavelength division multiplexing (WDM) optical communication is also possible.

(Modification)
14A to 14C are side sectional views for explaining various forms of the pedestal portion in the present invention. Each of FIGS. 14A to 14C is a cross-sectional view in a cross section orthogonal to the optical waveguide direction. Further, in FIGS. 14A to 14C, illustration of the internal configuration (the core portion 21 and the cladding portion 22) of the flexible optical waveguide 2 is omitted.

  FIG. 14A shows a form in which conductive bumps 61 are provided as pedestals as in the above embodiment. In this case, the protruding height of the side surface 2 a of the flexible optical waveguide 2 is set to be equal to or less than the sum of the height of the bump 61 and the thickness of the electrode pattern 32. The bump 61 has a height of about 50 μm to 100 μm before heating, but is heated and melted when the semiconductor optical device 4 (5) is mounted. At this time, if the protruding height of the side surface 2a of the flexible optical waveguide 2 is a certain level, the height of the bump 61 is lowered until the semiconductor optical device 4 (5) and the side surface 2a contact each other (for example, 10 μm to 40 μm). .

  FIG. 14B shows a form in which an insulating spacer 63 is provided as a pedestal portion. In this case, the protruding height of the side surface 2 a of the flexible optical waveguide 2 is set to be equal to or lower than the height of the spacer 63. The spacer 63 is intended to control the gap (gap) between the semiconductor optical device 4 (5) and the base 3 (for example, to fix the semiconductor optical devices 4 and 5 at a higher position than the form shown in FIG. 14A). Case). As the spacer 63, a plate-like spacer made of Si, glass or ceramic, or a spherical spacer such as glass beads or Si balls is preferably used. The height of the spacer 63 is, for example, 50 μm to 500 μm.

  FIG. 14C shows a form in which a conductive resin layer 64 is provided as a pedestal portion. In this case, the protruding height of the side surface 2 a of the flexible optical waveguide 2 is set to be equal to or less than the thickness of the resin layer 64. The resin layer 64 is formed by allowing a conductive resin to flow between the semiconductor optical element 4 (5) and the base portion 3 when the semiconductor optical element 4 (5) is mounted, and UV curing or thermosetting. .

  As in the modification shown in FIGS. 14A to 14C, the pedestal portion is a conductive material such as a bump 61 or a resin layer 64 that electrically connects the electrode pattern 32 and the electrode of the semiconductor optical device 4 (5). The insulating member such as the spacer 63 may be used. Thus, various members can be applied as the pedestal portion regardless of the presence or absence of electrical conductivity. Note that the bumps 61, the spacers 63, and the resin layer 64 shown in FIGS. 14A to 14C may be used in combination with each other depending on the application.

  FIGS. 15A, 15B, 16A, and 16B are cross-sectional views showing other modifications of the optical waveguide module, respectively (FIGS. 15A, 15B, and 16A). ) And a plan view (FIG. 16B). 15A, 15B, and 16A show the same cross section as that in FIG.

  An optical waveguide module 1a shown in FIG. 15A includes a flexible optical waveguide 6 and semiconductor optical elements 11 and 12 in place of the flexible optical waveguide 2 and the semiconductor optical elements 4 and 5 of the above embodiment. The flexible optical waveguide 6 has a plurality of core portions 21. The main portions 21 a of the plurality of core portions 21 are arranged side by side in the width direction of the flexible optical waveguide 6 that intersects the optical waveguide direction A, and extend along the optical waveguide direction A. Further, the end surface 21 d of each core portion 21 is arranged side by side along the optical waveguide direction A on the side surface 6 a of the flexible optical waveguide 6.

  The semiconductor optical device 11 is an arrayed light emitting device having a plurality of light emitting regions 111 arranged along the optical waveguide direction A, and the semiconductor optical device 12 has a plurality of light detection regions 121 arranged along the optical waveguide direction A. This is an array-shaped photodetecting element. The semiconductor optical device 11 is placed on one base portion 3 across one end portion of the flexible optical waveguide 6 so that each of the plurality of light emitting regions 111 and one end face 21d of the plurality of core portions 21 face each other. Has been implemented. The semiconductor optical device 12 has the other base portion 3 straddling the other end portion of the flexible optical waveguide 6 so that each of the plurality of light detection regions 121 and each of the other end faces 21d of the plurality of core portions 21 face each other. Implemented above.

  According to the configuration of this modification, more information can be transmitted using one optical waveguide module 1a. In this modification, although the arrayed light emitting element and the light detecting element are adopted as the semiconductor optical elements 11 and 12, a light emitting element (light detecting element) having a single light emitting region (light detecting region) is used as a light guide. They may be juxtaposed along the wave direction A. Further, the maximum number of the light emitting regions 111 and the light detection regions 121 (that is, the maximum number of the core portions 21) is determined according to the width w of the flexible optical waveguide 6. The maximum width of the flexible optical waveguide 6 is not particularly limited in manufacturing, and is determined according to the depth at which the groove 31 can be formed.

  An optical waveguide module 1b shown in FIG. 15B includes a flexible optical waveguide 7 instead of the flexible optical waveguide 2 of the above embodiment. The optical waveguide module 1b includes a pair of semiconductor optical elements 4 (light emitting elements) and semiconductor optical elements 5 (light detecting elements) on both of the base portions 3 disposed at both ends of the flexible optical waveguide 7. ing.

  The flexible optical waveguide 7 has at least two (two in this example) core portions 21. The main portion 21 a of each core portion 21 is arranged side by side in the width direction of the flexible optical waveguide 7 and extends along the optical waveguide direction A. Further, the end surface 21 d of each core portion 21 is arranged along the optical waveguide direction A on the side surface 7 a of the flexible optical waveguide 7.

  The semiconductor optical devices 4 and 5 have a single base straddling the end portion of the flexible optical waveguide 7 so that each of the light emitting region 41 and the light detection region 51 and one end surface 21d of each core portion 21 face each other. It is mounted side by side on the part 3. The semiconductor optical elements 4 and 5 include a light emitting element (semiconductor optical element 4) mounted on one base part 3 and a light detection element (semiconductor optical element 5) mounted on the other base part 3. ) Are optically coupled to each other via the core portion 21.

  According to the configuration of this modification, bidirectional information transmission can be performed using one optical waveguide module 1b.

  An optical waveguide module 1c shown in FIG. 16 (a) is a further modification of the optical waveguide module 1b shown in FIG. 15 (b), and instead of the flexible optical waveguide 7 shown in FIG. It has. The flexible optical waveguide 8 has a plurality of electrical wirings 23 in addition to at least two core portions 21. Each of the main portions 23 a of the plurality of electrical wirings 23 is arranged side by side in the width direction of the flexible optical waveguide 8 and extends along the optical waveguide direction A. Further, the end 23 b of each electrical wiring 23 is exposed side by side along the optical waveguide direction A on the side surface 8 a of the flexible optical waveguide 8.

  As in this modification, a plurality of electrical wirings 23 may be provided by utilizing the empty space of the flexible optical waveguide 8.

  An optical waveguide module 1d shown in FIG. 16B is a further modification of the optical waveguide module 1a shown in FIG. 15A, and includes a plurality of flexible optical waveguides 6 shown in FIG. Further, the optical waveguide module 1d includes a base portion 9 instead of the base portion 3 of the above embodiment. The base portion 9 has a plurality of grooves 91 extending from the side wall 9b to the inside of the base portion 9 along the optical waveguide direction A on the main surface 9a, and a part of each flexible optical waveguide 6 (in this example, The end portion is accommodated in each groove 91 and fixed.

  The optical waveguide module 1 d includes a plurality of semiconductor optical elements 11 (arrayed light emitting elements) corresponding to the number of flexible optical waveguides 6 on one base part 9. Each semiconductor optical device 11 includes a plurality of light emitting regions 111 included in each semiconductor optical device 11 and each end surface 21d of each of the plurality of core portions 21 (see FIG. 15A) included in each flexible optical waveguide 6. The flexible optical waveguides 6 are mounted across one end portion so as to face each other.

  In addition, the optical waveguide module 1 d includes a plurality of semiconductor optical elements 12 (array-shaped light detection elements) corresponding to the number of flexible optical waveguides 6 on the other base part 9. Each semiconductor optical device 12 includes a plurality of light detection regions 121 included in each semiconductor optical device 12, and each of the other end surfaces 21d of the plurality of core portions 21 (see FIG. 15A) included in each flexible optical waveguide 6. Are mounted across the other end of each flexible optical waveguide 6 so as to face each other.

  According to the configuration of this modification, it is possible to transmit more information than the optical waveguide module 1a of FIG. 15A using one optical waveguide module 1d. Note that the plurality of flexible optical waveguides 6 may be bundled together between one base part 9 and the other base part 9.

  FIG. 17 is an exploded perspective view showing another modification of the optical waveguide module. FIG. 18 is a side cross-sectional view showing the XVIII-XVIII cross section of the optical waveguide module 1e shown in FIG. An optical waveguide module 1e shown in FIG. 17 further includes a case 13 in addition to the configuration of the optical waveguide module 1 shown in FIGS. The case 13 is a hermetic seal for accommodating the base 3 and the semiconductor optical element 4 (5) and electromagnetically and hermetically sealing, and accommodates the base 3 and the semiconductor optical element 4 (5). A container portion 131 for sealing, and a lid portion 132 for sealing the container portion 131. The lid part 132 is fixed to the container part 131 with a conductive adhesive 14 such as solder (see FIG. 18).

  In addition, an opening 131a for leading the flexible optical waveguide 2 is formed in the side wall 131b of the container portion 131, and the flexible optical waveguide 2 is extended to the outside of the case 13 through the opening 131a. Further, a metal film 26 (for example, an Au film) used when sealing the gap between the case 13 and the flexible optical waveguide 2 is formed on the surface of the flexible optical waveguide 2. The metal film 26 is formed in a region surrounded by the opening 131 a of the case 13 on the surface of the flexible optical waveguide 2. As shown in FIG. 18, the gap between the opening 131 a of the case 13 and the metal film 26 is sealed with the conductive adhesive 14.

  As in this modification, the optical waveguide module may include a case 13 for sealing the base portion 3 and the semiconductor optical device 4 (5). If the strength of the flexible optical waveguide 2 is insufficient, the flexible optical waveguide 2 may be reinforced by covering the surface of the flexible optical waveguide 2 with a resin film.

  FIGS. 19A and 19B are a plan view and a cross-sectional view showing a XIX-XIX cross section for explaining a method of forming a metal film 26 for hermetic sealing on the surface of the flexible optical waveguide 2. As shown in FIGS. 19A and 19B, when forming the metal film 26, first, a jig 80 having an opening 80a at the position where the metal film 26 is formed is prepared. Then, the flexible optical waveguide 2 formed by the steps shown in FIGS. 4 to 13 is placed on the jig 80, and metal (Au) is deposited on the flexible optical waveguide 2 through the jig 80. At this time, after depositing a metal on one surface side of the flexible optical waveguide 2, the flexible optical waveguide 2 may be turned over and the metal may be deposited again on the other surface side. By this method, the metal film 26 can be suitably formed.

  FIG. 20 is a perspective view showing another modification of the optical waveguide module. The difference between the optical waveguide module 1f shown in FIG. 20 and the optical waveguide module 1 shown in FIG. 1 is the material of the base portion. The optical waveguide module 1f includes a resin base 15 (molded substrate).

  The resin base 15 has a lead frame 151. The lead frame 151 includes an electrode pattern 151a. The electrode pattern 151 a is electrically connected to the electrode of the semiconductor optical device 4 (5) via the bump 61. Further, the lead frame 151 of this modification is extended to the side of the base portion 15. The extending direction of the lead frame 151 can be set in various directions, for example, the height direction of the base portion 15. The extending direction of the lead frame 151 may be determined in consideration of the bending direction of the flexible optical waveguide 2 and the layout of the PC board on which the base portion 15 is mounted.

  By making the base part 15 made of resin as in this modification, the base part 15 can be manufactured at a lower cost, and the lead frame 151 can be applied to the wiring of the semiconductor optical device 4 (5).

  The optical waveguide module according to the present invention is not limited to the above-described embodiments and modifications, and various other modifications are possible. For example, when forming the flexible optical waveguide, the end surface of the core portion may be slightly inclined (about 8 °) with respect to the side surface of the flexible optical waveguide. Moreover, the core part of the flexible optical waveguide constitutes a branch path that branches the light from one end face to a plurality of end faces in addition to the form in which the one end face and the other end face are coupled one-to-one as in the above embodiment. Alternatively, a directional coupler may be configured by a plurality of core portions.

  Moreover, although the base part is arrange | positioned at the both ends of the flexible optical waveguide in the said embodiment and each modification, a base part may be arrange | positioned near the center part of a flexible optical waveguide. In this case, it is preferable that the groove of the base portion is formed from one side wall to the other side wall, and at least one end surface of the core portion is provided near the central portion of the flexible optical waveguide.

It is side surface sectional drawing which shows the structure of the optical waveguide module which concerns on one Embodiment of this invention. It is a perspective view which shows the edge part vicinity (base part vicinity) of the optical waveguide module shown in FIG. It is a figure which shows the structure of the flexible optical waveguide which concerns on embodiment in detail. (A) It is a top view near the edge part of a flexible optical waveguide, and has shown the external appearance when the flexible optical waveguide is seen from the side surface side. (B) It is sectional drawing along the III-III line of the flexible optical waveguide shown to (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the IV-IV cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the VV cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the VI-VI cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the VII-VII cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the VIII-VIII cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the IX-IX cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the XX cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the XI-XI cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the XII-XII cross section of (a). It is a figure which shows the manufacturing process of a flexible optical waveguide. (A) is a partial top view, (b) has shown the XIII-XIII cross section of (a). (A)-(c) It is side surface sectional drawing for demonstrating the various forms of the base part in this invention. (A), (b) It is a figure which shows the modification of an optical waveguide module, respectively. (A), (b) It is a figure which shows the modification of an optical waveguide module, respectively. It is a disassembled perspective view which shows the modification of an optical waveguide module. It is side surface sectional drawing which shows the XVIII-XVIII cross section of the optical waveguide module shown in FIG. It is sectional drawing which shows the (a) top view for demonstrating the method to form the metal film for a hermetic seal on the surface of a flexible optical waveguide, (b) XIX-XIX cross section. It is a perspective view which shows the modification of an optical waveguide module. It is a figure which shows the conventional optical interconnection board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a-1f ... Optical waveguide module, 2, 6-8 ... Flexible optical waveguide, 3, 9, 15 ... Base part, 4, 5, 11, 12 ... Semiconductor optical element, 13 ... Case, 14 ... Conductivity Adhesive, 21 ... core part, 22 ... clad part, 23 ... electrical wiring, 21a, 23a ... main part, 21b, 23b ... end part, 21d ... end face, 24 ... reflective film, 25a, 25b ... mark member, 26 ... Metal film, 31, 91 ... Groove, 32 ... Electrode pattern, 33 ... Electrode, 34 ... Conductive paste, 41, 111 ... Light emitting region, 51, 121 ... Photodetection region, 61 ... Bump, 62 ... Refractive index matching material , 63 ... spacers, 64 ... conductive resin layer, 151 ... lead frame.

Claims (14)

A core portion including a main portion extending in the optical waveguide direction and an end portion extending in a direction crossing the optical waveguide direction; and a clad portion covering the core portion; and an end surface of the core portion along the optical waveguide direction. On the side,
The connecting portion between the main portion and the end portion of the core portion is bent,
Further have a reflecting member having a light reflecting surface which is embedded adjacent to the connecting portion,
The reflective member includes a metal film formed along a plane intersecting a predetermined plane, and a cross-sectional shape along the predetermined plane is formed in an annular shape.
A flexible optical waveguide characterized in that the inside of the annular metal film is embedded with a constituent material of the core part or the clad part . An electrical wiring extending in the optical waveguide direction is provided inside the cladding part,
End of the electrical wiring, and wherein the exposed from the cladding portion in the side, the flexible optical waveguide according to claim 1. Characterized by further comprising a mark member colored embedded in the cladding portion to indicate a position of the end surface of the core portion in the side surface, a flexible optical waveguide according to claim 1 or 2. A plurality of the core portions;
The main portions of the plurality of core portions are arranged side by side in a direction intersecting the optical waveguide direction,
The end surfaces of the plurality of core portions are arranged side by side along the optical waveguide direction on the side surface,
Wherein the plurality of core portions do not intersect each other, the flexible optical waveguide according to any one of claims 1-3. The flexible optical waveguide according to any one of claims 1 to 4 ,
A base portion that has a groove extending inward from the side wall along the optical waveguide direction, and that accommodates and fixes a part of the flexible optical waveguide in the groove;
An optical element mounted on the base so as to straddle the flexible optical waveguide;
Provided in a gap between the optical element and the base part, and a pedestal part that supports the optical element,
The flexible optical waveguide is fixed to the base portion so that the end face of the core portion faces the optical element;
The optical waveguide module, wherein the side surface of the flexible optical waveguide protrudes from a surface of the base portion. The optical waveguide module according to claim 5 , wherein the side surface of the flexible optical waveguide is in contact with the optical element directly or via a refractive index matching material. The optical waveguide module according to claim 5 or 6 , wherein the base portion is made of silicon, quartz, ceramic, or resin. A case for accommodating the base and the optical element;
The optical waveguide module according to any one of claims 5 to 7 , wherein the case has an opening for leading out the flexible optical waveguide. The case is made of metal;
A metal film is formed in a region of the surface of the flexible optical waveguide surrounded by the opening of the case,
The optical waveguide module according to claim 8 , wherein a gap between the opening of the case and the metal film is sealed with a conductive adhesive. The optical element has a plurality of light receiving and emitting regions arranged in the optical waveguide direction;
The flexible optical waveguide has a plurality of the core portions,
10. The optical waveguide module according to claim 5 , wherein each of the plurality of light receiving and emitting regions of the optical element and each end face of the plurality of core portions are arranged to face each other. . A light emitting element and a light detecting element mounted on the base as the optical element;
The flexible optical waveguide has at least two core parts;
Characterized in that the light emitting regions and respective end faces of the optical detection region of at least two core portions of the light detection element is arranged opposite to each other of the light emitting device, any one of claims 5-9 2. An optical waveguide module according to 1. A plurality of the flexible optical waveguides,
The base portion has a plurality of the grooves,
The optical waveguide module according to any one of claims 5 to 11 , wherein a part of each flexible optical waveguide is accommodated and fixed in the plurality of grooves of the base portion. The base has an electrode pattern;
The optical waveguide module according to claim 5 , wherein the pedestal is a conductive member that electrically connects the electrode pattern and the electrode of the optical element. The optical waveguide module according to claim 5 , wherein the pedestal is an insulating member.

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