JP5395042B2 - Manufacturing method of optical path conversion device - Google Patents

Description

This invention relates to an optical path conversion with 1-dimensional or one-dimensional or two-dimensional array of cores is applied to the external components and easily to the optical path changing connector for optically connecting with the two-dimensional array of cores or photoelectric conversion element The present invention relates to a device manufacturing method .

  In recent years, in order to develop a high-speed and large-capacity optical communication system and a massively parallel computer that processes parallel signals between a large number of processors, development of an optical interconnection that communicates in the apparatus at a high density has been vigorously performed. When performing such optical interconnection, processing of the transmitted optical signal is performed by the electronic device. The boundary device that connects these electronic devices requires an optical-electric mixing system that includes optical waveguides, photoelectric conversion elements, LSIs and switches for electronic control, and electric circuits for driving electronic components. Become. In particular, in order to realize a high-speed and broadband communication system, there is an increasing demand for devices including photoelectric conversion elements such as Vertical Cavity Surface Emitting Laser (VCSEL), Laser Diode (LD), and Photo diode (PD).

In response to such a requirement, an optical pin with a micromirror is provided on the photoelectric conversion element, an optical waveguide is provided in the optical printed circuit board, and a through hole having the same shape as the optical pin is provided in the optical printed circuit board so as to reach the optical waveguide. A technique for optically connecting a photoelectric conversion element and an optical waveguide by fitting an optical pin into a through hole has been proposed (see, for example, Non-Patent Document 1).
This conventional optical path conversion technology is used to reduce the light connection efficiency between the light emitting element and the optical waveguide due to the light emitted from the light emitting element into the space and the light emitted from the optical waveguide into the space having a radiation angle. A decrease in optical connection efficiency between the optical waveguide and the light receiving element can be prevented. Furthermore, when light is incident on the optical waveguide from a light emitting element (photoelectric conversion element) such as VCSEL via a micromirror, light is emitted from the optical waveguide toward a light receiving element (photoelectric conversion element) such as PD. In addition, the photoelectric conversion element and the optical waveguide can be optically connected with the same structure.

"Journal of Japan Institute of Electronics Packaging" Vol.2, No.5, p.368-372 (1999)

  In this conventional optical path conversion technique, it is necessary to manufacture an optical pin with a micromirror for each photoelectric conversion element, which complicates the manufacturing process and cannot reduce the cost. In addition, it is difficult to process the through hole formed in the optical printed wiring board, and the optical connection efficiency between the optical waveguide and the optical pin is lowered due to the unevenness formed on the core side surface of the optical waveguide. In addition, when the photoelectric conversion elements are two-dimensionally arranged, it is difficult to fix all the optical pins to the photoelectric conversion elements with high accuracy, the optical axis shift between the optical waveguide and the optical pins occurs, and the optical connection efficiency is reduced. Bring about a decline. Furthermore, in order to optically connect with the cores of the optical waveguides that are two-dimensionally arranged, pins having different lengths are required, resulting in an increase in cost.

The present invention has been made to solve the above-described problems. An optical path conversion device in which a core is arranged one-dimensionally or two-dimensionally in a cladding, a positioning member whose optical axis is adjusted with respect to the core, and A method of manufacturing an optical path conversion device in an inexpensive optical path conversion connector with high optical connection efficiency by adjusting the optical axis with an external component via a positioning member to suppress optical axis deviation during multi-core optical connection Is to provide.

Method for manufacturing an optical path-changing device according to the present invention, the first core of the multiple is formed in parallel to each plurality of second cores parallel to each other and formed in parallel with the first core, a plurality of the third core Are formed in parallel to each other and orthogonal to the first core and the second core, and the plurality of first cores, the plurality of second cores, and the plurality of third cores are orthogonal to each other. A first end face having a plurality of first core end faces exposed in a matrix, a second end face having a plurality of second core end faces exposed in a matrix, and the plurality of first cores and the plurality of third cores intersecting each other. A single first mirror surface for converting the optical path to a position to be moved, and a single second mirror surface for converting the optical path to a position where the plurality of second cores and the plurality of third cores intersect, Each of the optical waveguides is the first From the end face, the first mirror surface is reached through the first core, the direction of the first mirror surface is changed, the third core is reached through the third core, and the second mirror surface is reached. A method of manufacturing a single optical path conversion device configured to be a continuous optical path whose direction is changed to pass through the second core to the end face of the second core . Applying a refractive index material to form a first cladding layer; applying a second refractive index material having a higher refractive index than the first refractive index material; and forming a first core layer on the first cladding layer And patterning the first core layer to form a plurality of first cores parallel to each other, parallel to each other, and parallel to the first core, the same number of second cores as the first cores, And the first core parallel to each other and orthogonal to the first core and the second core The same number of third cores are arranged such that the intersection between the first core and the third core is located on the first straight line, and the intersection between the second core and the third core is the first. Forming the first clad layer on the first clad layer so as to be positioned on two straight lines; applying the first refractive index material on the first clad layer to form a second clad layer; and Manufacturing a waveguide body in which the second core and the third core are embedded in the first and second cladding layers, a plurality of the first cores, a plurality of the second cores, The step of stacking a plurality of the waveguide bodies so that the plurality of third cores, the first straight line, and the second straight line coincide with each other in the stacking direction, and the plurality of stacked waveguide bodies are bonded together And the position of the first straight line that coincides with the stacking direction. And a step of dicing the waveguide unit at the position of the second straight line to form the first mirror surface and the second mirror surface .

  According to the present invention, it is possible to obtain an inexpensive optical path conversion connector with high optical connection efficiency by suppressing optical axis deviation during multi-core optical connection.

It is a perspective view explaining the structure of the optical path conversion connector which concerns on Embodiment 1 of this invention. It is a perspective view which shows the optical path conversion device applied to the optical path conversion connector which concerns on Embodiment 1 of this invention. It is a side view which shows the optical path changing device applied to the optical path changing connector which concerns on Embodiment 1 of this invention. It is a perspective view which shows the external component optically connected to the optical path conversion connector which concerns on Embodiment 1 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 1 of this invention. It is a perspective view which shows the optical connection state of the optical path conversion connector which concerns on Embodiment 1 of this invention, and an external component. It is a perspective view explaining the 1st manufacturing method of the optical path changing device applied to this invention. It is a perspective view explaining the 2nd manufacturing method of the optical path changing device applied to this invention. It is a perspective view which shows the manufacturing method of the optical path changing device which concerns on Example 1 of this invention. It is a perspective view which shows the manufacturing method of the optical path changing device which concerns on Example 2 of this invention. It is a perspective view which shows the manufacturing method of the optical path changing device which concerns on Example 3 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 2 of this invention. It is a perspective view which shows the optical connection state of the optical path conversion connector which concerns on Embodiment 2 of this invention, and an external component. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 3 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector which concerns on Embodiment 4 of this invention, and an external component. It is a side view explaining the structure of the external component in Embodiment 4 of this invention. It is a side view explaining the structure of the external component in Embodiment 4 of this invention. It is a side view explaining the connection structure of the optical path changing device and external component in Embodiment 4 of this invention. It is a side view explaining the connection structure of the optical path changing device and external component in Embodiment 4 of this invention. It is a side view explaining the connection structure of the optical path changing device and external component in Embodiment 4 of this invention. It is a side view explaining the connection structure of the optical path changing device and external component in Embodiment 4 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 5 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 6 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 7 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 8 of this invention. It is a perspective view explaining the manufacturing method of the optical path conversion connector which concerns on Embodiment 9 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 9 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector and external component which concern on Embodiment 10 of this invention. It is sectional drawing which shows the optical path changing device concerning Embodiment 10 of this invention. It is a perspective view explaining the optical connection method of the optical path conversion connector which concerns on Embodiment 11 of this invention, and an external component. It is sectional drawing which shows the optical path changing device concerning Embodiment 11 of this invention.

Embodiments of the present invention will be described below with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is a perspective view for explaining the configuration of an optical path conversion connector according to Embodiment 1 of the present invention. FIGS. 2 and 3 are optical path conversion devices applied to the optical path conversion connector according to Embodiment 1 of the present invention. FIG. 4 is a perspective view showing external parts optically connected to the optical path conversion connector according to Embodiment 1 of the present invention, and FIG. 5 is an optical path conversion connector according to Embodiment 1 of the present invention. FIG. 6 is a perspective view showing an optical connection state between the optical path conversion connector and the external component according to Embodiment 1 of the present invention.

  In FIG. 1, an optical path conversion connector 1 includes an optical path conversion device 2, an exterior member 5 that accommodates the optical path conversion device 2, and a pair of first pin insertion holes 6a as first positioning members.

  As shown in FIG. 2 and FIG. 3, the optical path conversion device 2 is configured such that a plurality of cores 3 that propagate light are two-dimensionally arranged and embedded in a clad 4 having a refractive index smaller than that of the core 3. It is configured. The clad 4 has a first end surface 4a, a second end surface 4b, and a mirror surface 4c located between the first end surface 4a and the second end surface 4b. Each core 3 is configured to reach the mirror surface 4c from the first end surface 4a, and bend back at the mirror surface 4c to reach the second end surface 4b. The first core end surface 3a of the core 3 is exposed on the first end surface 4a in a 2 × n matrix, and the second core end surface 3b is exposed on the second end surface 4b in a 2 × n matrix. Note that n is an integer of 2 or more.

  The exterior member 5 includes an optical path conversion device housing portion 5a and a flange portion 5b formed integrally with the optical path conversion device housing portion 5a. And the optical path conversion device 2 is arrange | positioned in the optical path conversion device accommodating part 5a so that the 1st end surface 4a and the 2nd end surface 4b may be exposed. A pair of first pin insertion holes 6 a is formed in the optical path conversion device housing portion 5 a with the first core end surface 3 a of the optical path conversion device 2 interposed therebetween. Each first pin insertion hole 6a has a predetermined positional relationship with respect to the first core end surface 3a arranged two-dimensionally, and the hole direction extends from the first end surface 4a to the mirror surface 4c. It is formed parallel to the optical axis of the core 3 portion.

  Next, an optical connection method with the external component 15A by the optical path conversion connector 1 configured as described above will be described with reference to FIGS. Here, the external component 15A is an arrayed optical waveguide in which at least three or more cores (optical waveguides) are two-dimensionally arranged, as shown in FIG. In the external component 15A, the cladding embedded in the state in which the end portions of the optical fiber as the core are two-dimensionally arranged is housed in the exterior member 16, and the optical cable 14 bundled with the optical fibers is pulled out from the exterior member 16. The core end face (optical fiber end face) 17a is two-dimensionally arranged on the clad end face 18a. A pair of pin insertion holes 19 are formed on the exterior member 16 of the external component 15A with the clad end face 18a interposed therebetween. The core end surface 17a is arranged in the same arrangement state as the first core end surface 3a of the optical path conversion connector 1, and the pair of pin insertion holes 19 has the same positional relationship as the pair of first pin insertion holes 6a of the optical path conversion connector 1. It is formed with.

  First, as indicated by arrows in FIG. 5, a pair of positioning pins 8 as a member to be positioned is inserted into each first pin insertion hole 6 a of the optical path conversion connector 1. Then, the external component 15 </ b> A is attached to the optical path conversion connector 1 by inserting the pair of positioning pins 8 into the pin insertion holes 19. Thereby, the core end surface 17a of the external component 15A is brought into close contact with the first core end surface 3a of the core 3 of the optical path conversion device 2 with the optical axis aligned. Next, as shown in FIG. 6, the spring member 9 as an elastic fixing member is elastically locked to the flange portion 5b of the optical path conversion connector 1 and the flange portion 16a of the external component 15A, so that the optical path conversion connector 1 and the external component 15A is elastically fixed by the spring member 9. As a result, the core end surface 17a of the external component 15A and the first core end surface 3a of the optical path conversion device 2 are maintained in close contact with the optical axis aligned, and are optically connected.

  Therefore, for example, light incident from the second core end surface 3b propagates through the core 3 to the mirror surface 4c, and then is reflected by the mirror surface 4c (the optical path is changed) to pass through the core 3 to the first core end surface 3a. Propagated. The light enters the core of the external component 15A from the first core end surface 3a, propagates through the core of the external component 15A, and is connected to the optical device or the like optically connected to the external component 15A via the optical cable 14. Supplied.

Thus, according to the first embodiment, the optical axis of the core end surface 17a of the external component 15A is set to the optical axis of the first core end surface 3a in which the first pin insertion holes 6a are two-dimensionally arranged. Since it is provided on the exterior member 5 so as to coincide with each other, the core of the external component 15A arranged two-dimensionally can be two-dimensionally simply by inserting the positioning pin 8 of the external component 15A into the first pin insertion hole 6a. The optical axes are adjusted and simultaneously optically connected to the cores 3 of the optical path conversion devices 2 that are arranged in the same manner. Therefore, the workability of connecting the optical path conversion connector 1 to the external component 15A is facilitated, and the optical connection loss due to the optical axis shift is reduced.
Since the optical path conversion connector 1 and the external component 15A are elastically fixed using the spring member 9, the core end surface 17a of the external component 15A and the first core end surface 3a of the optical path conversion device 2 coincide with each other in the optical axis. And kept in close contact. Therefore, the adhesion between the core end surface 17a of the external component 15A and the first core end surface 3a of the optical path conversion device 2 is improved, and loss during connection can be reduced.
Moreover, since the optical path conversion device 2 is accommodated in the exterior member 5, damage to the optical path conversion device 2 can be suppressed and durability can be improved.
In addition, the adoption of this connector structure eliminates the need for optical through holes and optical pins that are difficult to manufacture, can significantly reduce manufacturing costs, increase optical connection efficiency, and increase durability. .

Note that the connection surface of the optical path conversion connector 1 with the external component 15A may be damaged due to the attachment / detachment of the external component 15A. There is also a problem of reflection on the connection surface. Therefore, a hard coat film or an antireflection film may be formed on the first end face 4a and the second end face 4b to prevent generation of scratches and reflections. As materials for the hard coat film and the antireflection film, for example, resin materials such as epoxy, acrylic, and silicone, and inorganic materials such as silica and alumina can be used.
Further, in order to suppress the influence of reflection on the connection surface of the optical path conversion connector 1 with the external component 15A, the region including at least the first core end surface 3a and the second core end surface 3b of the first end surface 4a and the second end surface 4b is a core. A predetermined amount may be inclined with respect to the three optical axes. The inclination angle is desirably 8 degrees, but is not limited to 8 degrees as long as the influence of reflection in the connected state can be suppressed.
In the first embodiment, the positioning pin 8 is described as an independent component. However, the positioning pin 8 is previously provided in one of the first pin insertion hole 6a of the optical path conversion connector 1 and the pin insertion hole 19 of the external component 15A. It may be inserted and fixed and integrated.

  Here, a manufacturing method of the optical path conversion device 2 applied to the present invention will be described with reference to FIGS.

First, the first optical path conversion device manufacturing method according to FIG. 7 will be described.
As shown in FIG. 7A, a flat substrate 50 is manufactured using quartz glass. Then, a first fluorinated polyimide solution having a low refractive index is spin-coated on the quartz substrate 50 and baked to form a first cladding layer. Next, a second fluorinated polyimide solution having a high refractive index is spin-coated and baked to form a core layer on the first cladding layer.
And a photoresist is apply | coated on a core layer, a photoresist is patterned by the photoengraving technique, and the unnecessary part of a core layer is removed by reactive ion etching after that. Then, the photoresist is removed, and four first and second cores 53a and 53b made of the core layer are obtained. Next, the first fluorinated polyimide solution is spin-coated and baked to form a second cladding layer.

As a result, as shown in FIG. 7B, a waveguide body 51 in which the four first and second cores 53a and 53b are embedded in the first and second cladding layers is obtained. The two first cores 53a are formed in parallel straight lines, the two second cores 53b are formed in parallel straight lines, and the first and second cores 53a and 53b are orthogonal to each other. Moreover, the intersection of the first and second cores 53a and 53b is located on a straight line.
Then, as shown in FIG. 7C, n waveguide bodies 51 are stacked with the first and second cores 53a and 53b aligned. Next, after n waveguide bodies 51 are bonded together to produce a waveguide unit 52, the waveguide unit 52 is diced at the intersection of the first and second cores 53a and 53b to form the mirror surface 4c. Thus, the optical path conversion device 2 is obtained. The mirror surface 4c is formed so as to pass through the intersection point between the optical axis of the first core 53a and the optical axis of the second core 53b.

  In the optical path conversion device 2, each core 3 is configured to reach the mirror surface 4c from the first end surface 4a, and bend back at the mirror surface 4c to reach the second end surface 4b. The first core end surface 3a of the core 3 is exposed on the first end surface 4a in a 2 × n matrix, and the second core end surface 3b is exposed on the second end surface 4b in a 2 × n matrix. Moreover, the core 3 produced in this way is formed in the cross-sectional rectangle.

In the first optical path conversion device manufacturing method, the refractive index of the second fluorinated polyimide solution is set to be 0.01 to 5.0% higher than the refractive index of the first fluorinated polyimide solution. In addition, although fluorinated polyimide is used as the core and the clad material, the core and the clad material may be any resin capable of obtaining a necessary refractive index. For example, polymethyl methacrylate resin, silicone resin, epoxy resin, polysilane Resin or the like can be used. Furthermore, the core layer is patterned by reactive ion etching. However, if photocurability is imparted to the second fluorinated polyimide solution, the core layer can be patterned only by photolithography, which simplifies the manufacturing process. It is done.
In the first optical path conversion device manufacturing method, quartz glass is used for the substrate 50. However, the substrate 50 is not limited to the quartz glass substrate. For example, a silicon substrate, polyimide resin, acrylic resin, A resin substrate such as an epoxy resin may be used.

  In the first optical path conversion device manufacturing method, the first and second cores 53a and 53b are formed by applying the first and second fluorinated polyimide solutions to the quartz glass substrate 50 and patterning by reactive ion etching. The waveguide body 51 is manufactured by applying the first fluorinated polyimide solution. However, a quartz glass with a low refractive index is used for the substrate, a quartz glass with a high refractive index is formed on the substrate using a vacuum film-forming technique such as sputtering, and the quartz glass film with a high refractive index is used for photolithography and reaction. The first and second cores are formed by patterning using a reactive ion etching technique, and then quartz glass having a low refractive index is formed on the substrate so as to cover the first and second cores using a vacuum film forming technique such as sputtering. A waveguide body may be fabricated by forming a film. In this case, instead of quartz glass, glass capable of obtaining a necessary refractive index, such as germanium-doped glass, borosilicate glass, or soda glass, can be used.

Next, a second optical path conversion device manufacturing method according to FIG. 8 will be described.
As shown in FIG. 8A, a flat substrate 55 is produced using halogenated glass. Then, for example, 810 nm laser light is condensed by a condenser lens, and irradiated to a predetermined depth position of the substrate 55 as energy of 100 MJ / cm ² . This laser irradiation causes a change in the refractive index of the laser irradiated portion of the halogenated glass. At this time, one first core 56a is formed by moving the substrate 55 in parallel. Then, the irradiation position is shifted, laser irradiation is performed a plurality of times, and the first cores 56a are arranged in parallel and two-dimensionally (2 × n) as shown in FIG. 8B. Formed in the substrate 55.
Next, the substrate 55 is translated in a direction perpendicular to the first core 56a, and laser irradiation is performed. The second cores 56b are parallel to each other and two-dimensionally as shown in FIG. 8C. Are arranged in the target (2 × n) and further formed in the substrate 55 so as to be orthogonal to the first core 56a.

And the board | substrate 55 is diced in the crossing position of the 1st and 2nd cores 56a and 56b, the mirror surface 4c is formed, and the optical path changing device 2 shown by (d) of FIG. 8 is obtained.
In the optical path conversion device 2 thus manufactured, the core 3 (the portion of the halogenated glass that has undergone a refractive index change) is embedded in the cladding 4 (the portion of the halogenated glass that has not undergone a refractive index change). . The refractive index of the core 3 is set higher by 0.01 to 5.0% than the refractive index of the clad 4. Moreover, the core 3 manufactured in this way is formed in a circular cross section, and can efficiently propagate light.
Also in this optical path conversion device 2, each core 3 is configured to reach from the first end face 4a to the mirror face 4c, and bend back at the mirror face 4c to reach the second end face 4b. The first core end surface 3a of the core 3 is exposed on the first end surface 4a in a 2 × n matrix, and the second core end surface 3b is exposed on the second end surface 4b in a 2 × n matrix.

In the second optical path conversion device manufacturing method, the material of the substrate 55 is not limited to the halogenated glass, but may be any material that causes a change in refractive index by laser irradiation, such as oxide glass or quartz glass. Can be used.
In the first and second optical path conversion device manufacturing methods, the cut surface of dicing may be polished to increase the flatness of the mirror surface 4c. Further, instead of dicing, the mirror surface may be formed by reactive ion etching or polishing.
In the first and second optical path conversion device manufacturing methods, the refractive index of the core material is set to be 0.01 to 5.0% higher than the refractive index of the cladding material. Is not limited to 0.01 to 5.0%, and is appropriately selected depending on the application.

Further, the optical path conversion device applied to the present invention is not limited to the optical path conversion device manufactured by the first and second manufacturing methods. For example, optical fibers are bundled and arranged two-dimensionally. An optical path conversion device configured as described above may be used.
Further, in the optical path conversion device 2, the mirror surface 4c may be coated with gold or a multilayer film so that the light propagated through the core 3 can be efficiently reflected by the mirror surface 4c.
Further, the mirror surface 4c may have a filter function. In this case, the light that has passed through the mirror surface 4c can be incident on another waveguide, increasing the application.
Furthermore, if the angle of the mirror surface 4c with respect to the optical axis of the core 3 is 45 °, the optical path can be changed by 90 °. The angle of the mirror surface 4c with respect to the optical axis of the core 3 is not limited to 45 °, and may be set as appropriate depending on the application.

Next, a method for manufacturing the optical path conversion connector will be specifically described.
Example 1.
FIG. 9 is a perspective view showing a method for manufacturing an optical path conversion device according to Embodiment 1 of the present invention.
As shown in FIG. 9, the exterior member 5 </ b> A is divided into a first divided exterior member 10 and a second divided exterior member 11. The first divided exterior member 10 has an accommodation recess 10a formed on one surface side thereof, a pair of grooves 10b formed parallel to each other on the one surface side of the accommodation recess 10a, and a light entrance / exit window 10c formed in the accommodation recess. A hole 10d is formed in the hole 10a. On the other hand, the second divided exterior member 11 has an accommodation recess 11a formed on one side thereof, a pair of grooves 11b formed on one side of the accommodation recess 11a in parallel with each other, and a flange portion 11c formed thereon. Yes. The groove interval between the pair of grooves 11b matches the groove interval between the pair of grooves 10b.

Then, the optical path changing device 2 is coated with an ultraviolet curable adhesive and disposed in the accommodating recess 11a, and after the optical axis is adjusted, the adhesive is cured by irradiating ultraviolet rays and fixed to the accommodating recess 11a. Is done. At this time, the optical path conversion device 2 uses the adhesive surface as a reference surface, adjusts the distance from the reference surface to the core 3 to be constant, and adjusts the distance between the core 3 and the groove 11b to a predetermined value. The optical axis is adjusted.
Next, the first split exterior member 10 is directed to the second split exterior member 11 so that the optical path conversion device 2 is accommodated in the housing recess 10a, and the first split exterior member 10 and the second split exterior member 11 are bolts and nuts ( The optical path conversion connector 1A is assembled by being fastened and fixed by an unillustrated).

  In the optical path conversion connector 1A assembled in this way, the second core end faces 3b arranged two-dimensionally of the optical path conversion device 2 are exposed in the window 10c. Therefore, the external component is optically connected through the first core end surface 3a and the second core end surface 3b. The grooves 10b and 11b are integrated to form the first pin insertion hole 6a.

  In the first embodiment, since the exterior member 5A is divided into the first and second divided exterior members 10 and 11, the optical axis adjustment work when attaching the optical path conversion device 2 to the exterior member 5A becomes easy.

In the first embodiment, the optical path conversion device 2 is attached to the second split exterior member 11 by adjusting the optical axis, but the optical path conversion device 2 is attached to the first split exterior member 10 by adjusting the optical axis. Also good.
In addition, the exterior member 5A is divided into two parts, the first and second divided exterior members 10 and 11, but the number of divisions is not limited to two and may be three or more.
The first and second split exterior members 10 and 11 are fixed using bolts and nuts, but the fixing method of the first and second split exterior members 10 and 11 is limited to bolts and nuts. For example, an adhesive may be used.

Example 2
FIG. 10 is a perspective view showing a method of manufacturing an optical path conversion device according to Embodiment 2 of the present invention.
As shown in FIG. 10, the exterior member 5B is divided into a first divided exterior member 10A and a second divided exterior member 11A. In the first divided exterior member 10A, an accommodation recess 10a is formed on one surface side, a pair of grooves 10b are formed parallel to each other on the one surface side of the accommodation recess 10a, and a light entrance / exit window 10c is contained in the accommodation recess. A flange portion 10d is formed in the hole 10a, and a pair of optical path conversion device positioning projections 10e (engagement portions) are extended in the housing recess 10a in parallel with the groove 10b. On the other hand, in the second divided exterior member 11A, the housing recess 11a is formed on one surface side, the pair of grooves 11b are formed in parallel on the one surface side with the housing recess 11a interposed therebetween, and the flange portion 11c is formed. An optical path conversion device positioning projection 11d (engagement portion) extends in the accommodation recess 11a in parallel with the groove 11b.

  Further, the optical path conversion device 2A has a pair of optical path conversion device positioning grooves 4d (engaged portions) extending in parallel to the core 3 on the second end face 4b of the clad 4, and the optical path conversion device positioning grooves 4e (covered parts). The engaging portion) extends in parallel with the core 3 on the end face of the clad 4 facing the second end face 4b. The distance between the pair of optical path conversion device positioning grooves 4d is equal to the distance between the pair of optical path conversion device positioning protrusions 10e. Further, the positional relationship between the pair of optical path conversion device positioning grooves 4d and the optical path conversion device positioning groove 4e matches the positional relationship between the pair of optical path conversion device positioning projections 10e and the optical path conversion device positioning projections 11d. Yes.

Then, the optical path conversion device 2A is coated with an ultraviolet curable adhesive, and the pair of optical path conversion device positioning grooves 4d is engaged with the pair of optical path conversion device positioning projections 10e to be disposed in the housing recess 10a. Is done. Then, the second divided exterior member 11A is placed in the housing recess 11a, and the second divided exterior member 11A is engaged with the optical path conversion device positioning projection 4d so as to engage the optical path conversion device positioning projection 11d. Addressed to. Then, the adhesive is cured by irradiating ultraviolet rays, the optical path conversion device 2A, the first divided exterior member 10A, and the second divided exterior member 11A are fixed, and the optical path conversion connector 1B is assembled.
Accordingly, the optical path conversion device 2A includes the engagement between the pair of optical path conversion device positioning grooves 4d and the pair of optical path conversion device positioning protrusions 10e, the optical path conversion device positioning grooves 4e, and the optical path conversion device positioning protrusions 11d. The optical axis is adjusted by the engagement.

  Therefore, in the second embodiment, the engagement between the pair of optical path conversion device positioning grooves 4d and the pair of optical path conversion device positioning protrusions 10e, and the optical path conversion device positioning grooves 4e and the optical path conversion device positioning protrusions 11d. Since the optical axis is adjusted by the engagement, the optical path changing device 2A can be easily fixed, the optical path changing device 2A after the optical axis adjustment is not displaced, and the optical axis adjustment of the optical path changing device 2A can be performed for a long time. Maintained.

  Here, when the first and second divided exterior members 10A and 11A are made of a resin material or an inorganic material, the protrusions 10e and 11d are simultaneously formed when the first and second divided exterior members 10A and 11A are molded. Can be molded. Further, when the first and second divided exterior members 10A and 11A are made of a metal material, the protrusions 10e and 11d can be formed by cutting or the like.

In the second embodiment, the optical axis of the optical path conversion device 2A is adjusted by the three engaging portions of the protrusions 10e and 11d and the grooves 4d and 4e, but the protrusions 10e and 11d and the grooves 4d and 4e The number of engaging portions is not limited to three, and may be any number that allows the optical path conversion device 2A to be accurately positioned on the exterior member.
In the second embodiment, the protrusions are formed on the first and second divided exterior members 10A and 11A and the grooves are formed on the optical path conversion device 2A. However, the protrusions are formed on the optical path conversion device and the grooves are formed. You may form in the 1st and 2nd division | segmentation exterior member 10A, 11A. Further, the protrusions and grooves may be formed in the first and second divided exterior members 10A and 11A and the optical path conversion device 2A.

Example 3
FIG. 11 is a perspective view showing a method of manufacturing an optical path conversion device according to Embodiment 3 of the present invention.
As shown in FIG. 11, the exterior member 5 </ b> C has an accommodation hole 12 as an optical path conversion device insertion hole formed in the optical path conversion device accommodation portion 5 a, and a window 13 formed at the tip of the accommodation hole 12.

  Then, the optical path conversion device 2 is applied with an ultraviolet curable adhesive and inserted into the receiving hole 12, and after the optical axis is adjusted, the adhesive is cured by irradiating the ultraviolet ray to be fixed to the receiving hole 12. The optical path conversion connector 1C is assembled. At this time, the optical path conversion device 2 uses the adhesive surface as a reference surface, adjusts the distance from the reference surface to the core 3 to be constant, and adjusts the distance between the core 3 and the first pin insertion hole 6a to a predetermined value. By doing so, the optical axis is adjusted.

  In the optical path conversion connector 1 </ b> C assembled in this way, the second core end surfaces 3 b arranged in a two-dimensional manner of the optical path conversion device 2 are exposed in the window 13. Therefore, the external component is optically connected through the first core end surface 3a and the second core end surface 3b.

  In the third embodiment, since the accommodation hole 12 for inserting the optical path conversion device 2 is formed in the optical path conversion device accommodation portion 5a of the exterior member 5C, the optical path conversion device 2 is inserted into the accommodation hole 12 in the light path. The axis adjustment can be performed, and the optical axis adjustment work of the optical path conversion device 2 becomes easy. Furthermore, since the number of parts is reduced, the number of assembly steps can be reduced and the cost can be reduced.

In each of the above embodiments, the optical path conversion device is fixed to the exterior member using an ultraviolet curable adhesive, but the optical path conversion device fixing method is not limited to the ultraviolet curable adhesive. For example, a thermosetting adhesive or a dealcohol-free adhesive may be used.
In each of the above embodiments, the material of the exterior member is not described, but the material of the exterior member may be any material that satisfies the strength and scratch resistance as a connector, such as a resin material such as epoxy, acrylic, silicone, An inorganic material such as glass or zirconia, a metal material or alloy material such as stainless steel or iron, or a material obtained by adding a filler to these materials can be used.

Embodiment 2. FIG.
FIG. 12 is a perspective view for explaining an optical connection method between an optical path conversion connector and an external part according to Embodiment 2 of the present invention, and FIG. 13 shows light between the optical path conversion connector and external parts according to Embodiment 2 of the present invention. It is a perspective view which shows a connection state.

In FIG. 12, the optical path conversion connector 20 has a second core end surface in which a pair of second pin insertion holes 6b as second positioning members are two-dimensionally arranged in the optical path conversion device accommodating portion 5a of the exterior member 5D. The hole 3b has a predetermined positional relationship with respect to 3b, and its hole direction is formed in parallel with the optical axis of the portion of the core 3 extending from the second end surface 4b to the mirror surface 4c.
The exterior member 5D is formed by forming the second pin insertion hole 6b in the exterior member 5C in the first embodiment, for example. The optical path conversion connector 20 is configured in the same manner as the optical path conversion connector 1 of the first embodiment except that an exterior member 5D is used instead of the exterior member 5C.

  The external component 15 </ b> B is an array-like photoelectric conversion element body configured by two-dimensionally arranging at least three or more photoelectric conversion elements 21, and is attached on the circuit board 22. The photoelectric conversion elements 21 are arranged in the same manner as the arrangement state of the second core end faces 3b of the optical path conversion device 2. In addition, a pair of pin insertion holes 23 as positioned members are formed on the circuit board 22 so as to have a predetermined positional relationship with respect to the photoelectric conversion elements 21 that are two-dimensionally arranged. Further, a spring member 24 as an elastic fixing member is attached to the circuit board 22 so as to be rotatable around a hinge 24a.

  Here, in the external component 15B, one of the light receiving element which is the photoelectric conversion element 21 and the light receiving element is two-dimensionally arranged. The light emitting element and the light receiving element only need to be elements capable of performing photoelectric conversion by emitting light or receiving light. For the light emitting element, for example, a surface emitting laser (VCSEL) or an edge emitting laser diode (LD) is used. For example, a photodiode (PD) is used as the light receiving element.

Next, an optical connection method with the external components 15A and 15B by the optical path conversion connector 20 configured as described above will be described.
First, as indicated by an arrow A in FIG. 12, the pair of positioning pins 8 are inserted into the first pin insertion holes 6 a of the optical path conversion connector 20. Then, the external component 15 </ b> A is attached to the optical path conversion connector 20 by inserting the pair of positioning pins 8 into the pin insertion holes 19. Thereby, the core end surface 17a of the external component 15A is brought into close contact with the first core end surface 3a of the core 3 of the optical path conversion device 2 with the optical axis aligned. Next, the spring member 9 is elastically locked to the flange portion 5b of the optical path conversion connector 20 and the flange portion 16a of the external component 15A, and the optical path conversion connector 20 and the external component 15A are spring-loaded as shown in FIG. It is elastically fixed by the member 9. As a result, the core end surface 17a of the external component 15A and the first core end surface 3a of the optical path conversion device 2 are maintained in close contact with the optical axis aligned, and are optically connected.

Next, as indicated by an arrow B in FIG. 12, the pair of positioning pins 8 are inserted into the respective pin insertion holes 23 of the circuit board 22. Then, the optical path conversion connector 20 is mounted on the circuit board 22 by inserting the pair of positioning pins 8 into the second pin insertion holes 6b. As a result, the photoelectric conversion element 21 of the external component 15B is inserted into the window 13 of the exterior member 5D, and is brought into close contact with the second core end surface 3b of the core 3 of the optical path conversion device 2 with the optical axis aligned. Next, the spring member 24 is elastically locked to the optical path conversion device housing portion 5a of the optical path conversion connector 20, and the optical path conversion connector 20 and the external component 15B are elastically fixed by the spring member 24 as shown in FIG. The As a result, the photoelectric conversion element 21 of the external component 15B and the second core end surface 3b of the optical path conversion device 2 are kept in close contact with the optical axis aligned, and are optically connected.
As a result, the core end surface of the external component 15 </ b> A and the photoelectric conversion element 21 of the external component 15 </ b> B are optically connected via the optical path conversion connector 20.

Therefore, if the photoelectric conversion element 21 is a light emitting element, the light emitted from the photoelectric conversion element 21 is incident on the second core end surface 3b, propagates through the core 3 to the mirror surface 4c, and then is reflected by the mirror surface 4c. The core 3 is propagated to the first core end surface 3a. The light enters the core of the external component 15A from the first core end surface 3a, propagates through the core of the external component 15A, and is connected to the optical device or the like optically connected to the external component 15A via the optical cable 14. Supplied.
Further, if the photoelectric conversion element 21 is a light receiving element, light incident from the core end surface 17a of the external component 15A via the first core end surface 3a propagates through the core 3 to the mirror surface 4c, and then on the mirror surface 4c. Reflected and propagated through the core 3 to the second core end surface 3b. Then, the light enters the photoelectric conversion element 21 of the external component 15B from the second core end surface 3b, is converted into an electric quantity by the photoelectric conversion element 21, and is output to a desired device via the circuit board 22.

As described above, according to the second embodiment, in addition to the effects of the first embodiment, the second pin insertion holes 6b are two-dimensionally arranged with respect to the optical axis of the second core end surface 3b. Since the exterior member 5D is provided on the exterior member 5D so that the center (optical axis) of the photoelectric conversion element 21 of the external component 15B coincides with the external component 15B, the positioning pin 8 of the external component 15B is simply inserted into the second pin insertion hole 6b. The photoelectric conversion elements 21 of the external component 15B arranged in a two-dimensional manner are optically adjusted and simultaneously optically connected to the core 3 of the optical path conversion device 2 arranged in a two-dimensional manner. Therefore, the workability of connecting the optical path conversion connector 20 to the external component 15B is facilitated, and the optical connection loss due to the optical axis shift is reduced.
In addition, since the optical path conversion connector 20 and the external component 15B are elastically fixed using the spring member 24, the photoelectric conversion element 21 of the external component 15B and the second core end surface 3b of the optical path conversion device 2 have an optical axis. They are kept in close contact with each other. Therefore, the adhesion between the photoelectric conversion element 21 of the external component 15B and the second core end surface 3b of the optical path conversion device 2 is improved, and loss during connection can be reduced.

Here, the wavelengths that can be handled by the photoelectric conversion element 21 are generally 0.85 μm, 1.3 μm, and 1.55 μm, but this optical path conversion connector 20 has an arbitrary wavelength depending on the device to which it is applied. Can be used.
The external component 15B is configured by two-dimensionally arranging one of the light emitting element and the light receiving element, but is configured by two-dimensionally arranging the light emitting element and the light receiving element together. External parts may be used.
In the second embodiment, the exterior member 5D in which the second pin insertion hole 6b is formed in the exterior member 5C is used. However, the exterior member in which the second pin insertion hole 6b is formed in the exterior members 5A and 5B is used. It may be used.

Embodiment 3 FIG.
FIG. 14 is a perspective view for explaining an optical connection method between an optical path conversion connector and an external component according to Embodiment 3 of the present invention.
In FIG. 14, the optical path conversion device 25 is configured in the same manner as the optical path conversion device 2 except that the distance from the first end surface 4a of the clad 4 to the mirror surface 4c is long. The optical path conversion device 25 is attached to the exterior member 5E so as to extend the mirror surface 4c. The exterior member 5E is formed, for example, in the first and second divided exterior members 10 and 11 shown in FIG. 9 by omitting the window 10c and penetrating the housing recesses 10a and 11a to the flange portions 10d and 11c. This is realized by drilling the second pin insertion hole 6b in the flange portions 10d and 11c.

In the optical path conversion connector 20A configured as described above, the pair of positioning pins 8 are inserted into the first pin insertion holes 6a of the optical path conversion connector 20A. Then, the external component 15A is attached to the optical path conversion connector 20A by inserting the pair of positioning pins 8 into the respective pin insertion holes.
A pair of positioning pins 8 are inserted into the respective pin insertion holes 23 of the circuit board 22. Then, the optical path conversion connector 20A is mounted on the circuit board 22 by inserting the pair of positioning pins 8 into the second pin insertion holes 6b.
Thereby, the core end surface 17a of the external component 15A is brought into close contact with the first core end surface 3a of the core 3 of the optical path conversion device 2 with the optical axis aligned. Similarly, the photoelectric conversion element 21 of the external component 15B is brought into close contact with the second core end surface 3b of the core 3 of the optical path conversion device 2 with the optical axis thereof aligned.
Next, although not shown, the spring member 9 is elastically locked to the flange portion 26b of the optical path conversion connector 20A and the flange portion 16a of the external component 15A, and the spring member 24 is fixed to the flange portion 26b of the optical path conversion connector 20A. The core end surface 17a of the external component 15A and the photoelectric conversion element 21 of the external component 15B are optically connected via the optical path conversion connector 20A by being elastically locked.

  Therefore, also in the third embodiment, the same effect as in the second embodiment can be obtained.

Embodiment 4 FIG.
FIG. 15 is a perspective view for explaining an optical connection method between an optical path conversion connector and an external component according to Embodiment 4 of the present invention.
In FIG. 15, in this optical path conversion connector 20B, the optical path conversion device 2 is optically adjusted and bonded and fixed in the accommodation hole 12 of the exterior member 5C. In addition, the external component 15B is inserted into the window 13 of the exterior member 5C, and the photoelectric conversion element 21 is adjusted to the second end surface 4b of the optical path conversion device 2 with the optical axis adjusted to the second core end surface 3b of the optical path conversion device 2. Bonded and fixed.

  The optical path conversion connector 20B configured as described above can realize optical connection between the core end surface of the external component 15A and the photoelectric conversion element 21 of the external component 15B only by connecting to the external component 15A. Moreover, since the external component 15B is integrated with the optical path conversion device 2, the size can be reduced. Furthermore, since the external component 15B is fixed to the optical path conversion device 2 with the optical axis adjusted, loss due to misalignment is reduced.

Here, a connection structure between the optical path conversion device 2 and the external component 15B in the fourth embodiment will be described with reference to FIGS. 16 to 21. FIG.
The external component 15B is manufactured by, for example, a semiconductor manufacturing technique. The photoelectric conversion element 21 is two-dimensionally formed on the silicon substrate 27. The photoelectric conversion element 21 includes a back-side incident / emission type photoelectric conversion element 21A in which an anode electrode and a cathode electrode as shown in FIG. 16 are formed on the surface opposite to the light incident / exit surface, and FIG. There is a surface entrance / exit photoelectric conversion element 21B in which one of the anode electrode and the cathode electrode is formed on the light entrance / exit surface. In FIGS. 16 and 17, reference numeral 28 denotes an electrode pad, and arrows indicate light incident / exit directions.

  As shown in FIG. 18, the connection structure between the optical path conversion device 2 and the external component 15B provided with the back surface incident / exit photoelectric conversion element 21A is such that the photoelectric conversion element non-formation surface of the silicon substrate 27 overlaps the second end surface 4b. In addition, after the optical axis adjustment of the second core end surface 3b and the back surface incident / exit photoelectric conversion element 21A is performed, they are fixed. Then, an electrical connection solder 30 is formed on the electrode pad 28 so that the back side incident / emission type photoelectric conversion element 21A can be electrically connected to other electrical components. In addition, the fixing method of the silicon substrate 27 and the optical path conversion device 2 should just be a thing which can fix the silicon substrate 27 and the optical path conversion device 2, For example, adhesives, such as an epoxy, an acryl, a silicone, can be used. In addition, a conductive resin can be used in place of solder for electrical connection between the back surface incident / exit photoelectric conversion element 21A and other electrical components.

  Further, as shown in FIG. 19, the first connection structure between the optical path conversion device 2 and the external component 15B provided with the surface incident / exit photoelectric conversion element 21B is the second photoelectric conversion element forming surface of the silicon substrate 27. After superimposing on the end face 4b and adjusting the optical axis of the second core end face 3b and the surface incident / exit photoelectric conversion element 21B, the lead electrode 29 formed on the second end face 4b and the electrode pad 28 are soldered together. ing. An adhesive is injected and cured in the gap between the second end face 4b and the silicon substrate 27. Further, an electrical connection solder 30 is formed on the extraction electrode 29 so that the surface entrance / exit photoelectric conversion element 21B can be electrically connected to other electrical components. For example, an adhesive such as epoxy, acrylic, or silicone can be used as the adhesive injected into the gap between the second end surface 4b and the silicon substrate 27. In addition, a conductive resin can be used for electrical connection between the extraction electrode 29 and the electrode pad 28 instead of solder. Furthermore, a conductive resin can be used in place of solder for electrical connection between the front surface incident / exit photoelectric conversion element 21B and other electrical components.

  Further, as shown in FIG. 20, the second connection structure between the optical path conversion device 2 and the external component 15B including the surface incident / exit photoelectric conversion element 21B is the second photoelectric conversion element forming surface of the silicon substrate 27. The second core end surface 3b and the surface incident / exit photoelectric conversion element 21B are adjusted to be overlapped with the end surface 4b, and then bonded and fixed. A through hole 27a electrically connected to the electrode pad 28 is formed in the silicon substrate 27, and a solder 30 for electrical connection is formed on the outer electrode pad of the through hole 27a so that the surface incident / emission type photoelectric conversion is performed. The element 21B and other electrical components can be electrically connected.

  Further, as shown in FIG. 21, the third connection structure between the optical path conversion device 2 and the external component 15B including the surface incident / exit photoelectric conversion element 21B is the second photoelectric conversion element forming surface of the silicon substrate 27. After superimposing on the end face 4b and adjusting the optical axis of the second core end face 3b and the surface incident / exit photoelectric conversion element 21B, the lead electrode 29 formed on the second end face 4b and the electrode pad 28 are soldered together. ing. An adhesive is injected and cured in the gap between the second end face 4b and the silicon substrate 27. Further, the inner electrode pad of the through-hole substrate 31 and the lead electrode 29 are solder-bonded, and the electrical connection solder 30 is formed on the outer electrode pad of the through-hole substrate 31 so that the surface entrance / exit photoelectric conversion element 21B and the other Electrical connection with electrical components can be made.

Embodiment 5 FIG.
FIG. 22 is a perspective view for explaining an optical connection method between an optical path conversion connector and an external component according to Embodiment 5 of the present invention.
In FIG. 22, in the optical path conversion connector 20 </ b> C, the microlens 32 is fixed to the first end surface 4 a and the second end surface 4 b of the optical path conversion device 2 with the optical axis adjusted with respect to the core 3. The microlens 32 is formed into a convex shape or a concave shape so as to have a lens function, and condenses light passing therethrough or makes it parallel light.
Other configurations are the same as those in the second embodiment.

In the fifth embodiment, when the optical path conversion connector 20C and the external components 15A and 15B are connected, the core 3 of the optical path conversion device 2 and the core of the external component 15A are optically connected via the microlens 32, and the optical path conversion device 2 core 3 and the photoelectric conversion element 21 of the external component 15 </ b> B are optically connected via a microlens 32.
Therefore, when light enters the core 3 of the optical path conversion device 2 from the core of the external component 15A, the light is collected by the microlens 32 or enters the core 3 as parallel light. Further, when light enters the core of the external component 15A from the core 3 of the optical path conversion device 2, the light is collected by the microlens 32, or becomes parallel light and enters the core of the external component 15A. The same applies to incident / exit light between the optical path conversion device 2 and the external component 15B.
Therefore, according to the fifth embodiment, the coupling loss between the optical path conversion device 2 and the external components 15A and 15B can be suppressed.

Here, the microlens 32 is not limited to a convex shape or a concave shape, and may be any one that suppresses the spread of light. For example, a part of a medium that propagates light, such as an optical fiber, is used. May be. Moreover, the material of the microlens 32 should just have a lens function, for example, resin materials, such as an epoxy, an acryl, and silicone, and inorganic materials, such as quartz, an alumina, and glass, are used.
In addition, the method of fixing the microlens 32 to the first end surfaces 4a and 4b can use an adhesive such as epoxy, acrylic, or silicone, but is not limited thereto.

In the fifth embodiment, the microlens 32 is fixed to the first end face 4a and the second end face 4b of the optical path conversion device 2, but the microlens 32 is attached to the first end face 4a and the first end face 4a of the optical path conversion device 2. You may make it adhere to one of the 2 end surfaces 4b.
Further, the surface of the microlens 32 may be covered with a hard coat film or an antireflection film to prevent the generation of scratches and reflections.

Embodiment 6 FIG.
FIG. 23 is a perspective view for explaining an optical connection method between an optical path conversion connector and external components according to Embodiment 6 of the present invention.
In FIG. 23, in the optical path conversion connector 20D, the microlens 32 is fixed to the second end surface 4b of the optical path conversion device 2 by adjusting the optical axis with the core 3, and the external component 15B is fixed to the microlens 32 by adjusting the optical axis. ing.
Other configurations are the same as those in the fourth embodiment.

  According to the sixth embodiment, since the photoelectric conversion element 21 of the external component 15B is optically connected to the second core end surface 3b of the core 3 via the microlens 32, the coupling loss due to the spread of the incident / outgoing light is reduced. Deterioration is suppressed.

Embodiment 7 FIG.
FIG. 24 is a perspective view for explaining an optical connection method between an optical path conversion connector and external parts according to Embodiment 7 of the present invention.
In FIG. 24, the optical path conversion connector 20E has an external component 15A that is optically adjusted with the core 3 of the optical path conversion device 2 and fixed to the exterior member 5D.
Other configurations are the same as those in the second embodiment.

  According to the seventh embodiment, since the external component 15A is integrated with the optical path conversion connector 20E, the spring member 9 can be omitted and can be used as a connector with an optical cable.

Embodiment 8 FIG.
FIG. 25 is a perspective view for explaining an optical connection method between an optical path conversion connector and an external component according to Embodiment 8 of the present invention.
In FIG. 25, a pair of mounting seats 33 are formed on the exterior member 5F. Further, a pair of spring members 35 as elastic fixing members are provided on the exterior member 5F. In addition, a fixing bracket 34 and a receiving bracket 36 are formed on the circuit board 22.
The exterior member 5F is provided with the mounting seat 33 and the spring member 35 on the exterior member 5C in the first embodiment. The optical path conversion connector 20F is configured in the same manner as the optical path conversion connector 20 of the second embodiment except that the exterior member 5F is used instead of the exterior member 5C.

  In the eighth embodiment, the pair of positioning pins 8 are inserted into the respective pin insertion holes 23 of the circuit board 22, and the optical path conversion connector 20 inserts the pair of positioning pins 8 into the respective second pin insertion holes 6b. Mounted on the substrate 22. As a result, the photoelectric conversion element 21 of the external component 15B is inserted into the window 13 of the exterior member 5F, and is brought into close contact with the second core end surface 3b of the core 3 of the optical path conversion device 2 with the optical axis aligned. Next, the spring member 35 is elastically locked to the metal fitting 36 of the circuit board 22, and the optical path conversion connector 20 and the external component 15 </ b> B are elastically fixed by the spring member 35. Thereafter, a mounting screw (not shown) is passed through the through hole 33a of the mounting seat 33 and fastened to the screw hole 34a of the fixing bracket 34, and the optical path conversion connector 20F and the external component 15B are fixed. Thereby, the optical connection state between the photoelectric conversion element 21 of the external component 15B and the second core end surface 3b of the optical path conversion device 2 is maintained. Next, the external component 15A is optically connected to the optical path conversion connector 20F.

  As described above, according to the eighth embodiment, the optical path conversion connector 20F can be stably fixed to the circuit board 22 and the casing, and the reliability of optical connection is increased. Further, since the external component 15A can be inserted and removed while the optical path conversion connector 20F is fixed to the circuit board 22 and the housing, the load due to the insertion and removal of the external component 15A is not easily applied to the optical path conversion connector 20F, and durability is improved.

In the eighth embodiment, the mounting seat 33 is configured integrally with the exterior member 5F, but it goes without saying that the mounting seat may be configured as a separate part.
In the eighth embodiment, the spring member 35 is attached to the exterior member 5F. However, a spring member that elastically fixes the optical path conversion connector 20F and the external component 15A may be attached to the exterior member 5F. It is not to be over. In this case, a spring metal receiving bracket is provided on the external component 15A.

Embodiment 9 FIG.
FIG. 26 is a perspective view for explaining a method for manufacturing an optical path conversion connector according to Embodiment 9 of the present invention, and FIG. 27 illustrates an optical connection method between an optical path conversion connector and external parts according to Embodiment 9 of the present invention. It is a perspective view.
In FIG. 26, the optical path conversion device 2 </ b> B is configured such that a plurality of cores 3 that propagate light are two-dimensionally arranged and embedded in a clad 4 having a refractive index smaller than that of the core 3. The clad 4 has a first end surface 4a, a second end surface 4b, and a mirror surface 4c located between the first end surface 4a and the second end surface 4b. Each core 3 is configured to reach the mirror surface 4c from the first end surface 4a, and bend back at the mirror surface 4c to reach the second end surface 4b. The first core end surface 3a of the core 3 is exposed on the first end surface 4a in a 2 × n matrix, and the second core end surface 3b is exposed on the second end surface 4b in a 2 × n matrix.

A pair of first pin insertion holes 6a as first positioning members are formed on the first end surface 4a of the cladding 4 with the first core end surface 3a arranged two-dimensionally. Each first pin insertion hole 6a has a predetermined positional relationship with respect to the first core end surface 3a arranged two-dimensionally, and the hole direction extends from the first end surface 4a to the mirror surface 4c. It is formed parallel to the optical axis of the core 3 portion. That is, each first pin insertion hole 6a is optically adjusted with respect to the first core end surface 3a.
Similarly, a pair of second pin insertion holes 6b as second positioning members are formed on the second end face 4a of the cladding 4 with the second core end face 3b arranged two-dimensionally. Each second pin insertion hole 6b has a predetermined positional relationship with respect to the second core end surface 3b arranged two-dimensionally, and the hole direction extends from the second end surface 4b to the mirror surface 4c. It is formed parallel to the optical axis of the core 3 portion. That is, each second pin insertion hole 6b is optically adjusted with respect to the second core end surface 3b.

The flange portion 37 has an inclined surface 37a equal to the angle formed by the second end surface 4b of the clad 4 and the mirror surface 4c.
The optical path conversion connector 20G is configured as a rectangular parallelepiped by fixing the inclined surface 25a of the flange portion 37 to the mirror surface 4c of the clad 4 of the optical path conversion device 2B.
The optical path conversion device 2B is configured in the same manner as the optical path conversion device 2 except that the first and second pin insertion holes 6a and 6b are provided.

Next, an optical connection method with the external components 15A and 15B by the optical path conversion connector 20G configured as described above will be described with reference to FIG. In FIG. 27, the spring members 9 and 24 are omitted.
First, a pair of positioning pins 8 (not shown) are inserted into the first pin insertion holes 6a of the optical path conversion connector 20G. Then, the external component 15A inserts the pair of positioning pins 8 into the respective pin insertion holes 19 and is attached to the optical path conversion connector 20G. As a result, the core end surface 17a of the external component 15A is brought into close contact with the first core end surface 3a of the core 3 of the optical path conversion device 2B with the optical axis thereof aligned. Next, the spring member 9 (not shown) is elastically locked to the flange portion 37 of the optical path conversion connector 20G and the flange portion 15a of the external component 15A, and the optical path conversion connector 20 and the external component 15A are Elastically fixed. As a result, the core end surface of the external component 15A and the first core end surface 3a of the optical path conversion device 2B are kept in close contact with the optical axis aligned and optically connected.

Next, as indicated by arrows in FIG. 27, the pair of positioning pins 8 are inserted into the respective pin insertion holes 23 of the circuit board 22. Then, the optical path conversion connector 20G is attached to the circuit board 22 by inserting the pair of positioning pins 8 into the second pin insertion holes 6b. As a result, the photoelectric conversion element 21 of the external component 15B is brought into close contact with the second core end surface 3b of the core 3 of the optical path conversion device 2B with the optical axis aligned. Next, the spring member 24 (not shown) is elastically locked to the optical path conversion device 2B of the optical path conversion connector 20G, and the optical path conversion connector 20G and the external component 15B are elastically fixed by the spring member 24. As a result, the photoelectric conversion element 21 of the external component 15B and the second core end surface 3b of the optical path conversion device 2B are maintained in close contact with the optical axis aligned, and are optically connected.
As a result, the core end surface 17a of the external component 15A and the photoelectric conversion element 21 of the external component 15B are optically connected via the optical path conversion connector 20G.

According to the ninth embodiment, since the first and second pin insertion holes 6a and 6b are formed in the clad 4 in which the core 3 is formed, the first relative to the first and second core end faces 3a and 3b. The positions of the second pin insertion holes 6a and 6b can be formed with high accuracy. Therefore, when the external components 15A and 15B and the optical path conversion connector 20G are optically connected, the optical axis of the core end surface 17a of the external component 15A and the optical axis of the first core end surface 3a of the optical path conversion connector 20G are highly accurate. In addition, the optical axis of the photoelectric conversion element 21 of the external component 15B and the optical axis of the second core end surface 3b of the optical path conversion connector 20G coincide with each other with high accuracy, and loss due to connection is reduced.
Moreover, the exterior member of the optical path conversion connector is not required, and the price can be reduced.

Here, in the ninth embodiment, the flange portion 37 only needs to have the strength and durability of the connector, and may be made of, for example, the clad material of the optical path conversion device 2B.
In the ninth embodiment, the spring members 9 and 35 may be attached to the optical path conversion device 2B and the flange portion 37.
In the ninth embodiment, the external component 15B may be directly fixed to the second core end surface 3b of the optical path conversion device 2B by adjusting the optical axis. In this case, the external component 15B is attached to the second core end surface 3b by the attachment structure shown in FIGS. Furthermore, the external component 15B may be attached to the second core end surface 3b via the microlens 32.
In the ninth embodiment, the external component 15A may be integrated with the optical path conversion device 2B by adjusting the optical axis.
In the ninth embodiment, the microlens 32 may be fixed to the first and second core end faces 3a and 3b of the optical path conversion device 2B by adjusting the optical axis.

Embodiment 10 FIG.
FIG. 28 is a perspective view for explaining an optical connection method between an optical path conversion connector and external parts according to Embodiment 10 of the present invention, and FIG. 29 is a cross-sectional view showing an optical path conversion device according to Embodiment 10 of the present invention. .
In FIG. 28 and FIG. 29, the optical path conversion device 2 </ b> C is configured such that a plurality of cores 3 that propagate light are two-dimensionally arranged and embedded in a clad 4 having a refractive index smaller than that of the core 3. . The clad 4 has a first end surface 4a, a second end surface 4b, and first and second mirror surfaces 4f and 4g located between the first end surface 4a and the second end surface 4b. Each core 3 extends from the first end surface 4a to the first mirror surface 4f, is bent 90 ° at the first mirror surface 4f to reach the second mirror surface 4g, and is bent 90 ° at the second mirror surface 4g to be second. It is configured in a crank shape reaching the end surface 4b. The first core end surface 3a of the core 3 is exposed on the first end surface 4a in a 2 × n matrix, and the second core end surface 3b is exposed on the second end surface 4b in a 2 × n matrix.

Further, the exterior member 5G is divided into first and second divided exterior members 10B and 11B. The optical path conversion connector 20H includes the optical path conversion device 2C in the housing recesses 10f and 11e of the first and second split exterior members 10B and 11B, and the first and second split exterior members 10B and 11B are bolts (not shown). Z)). At this time, the optical path conversion device 2C is accommodated in the exterior member 5G so as to expose the first end face 4a and the second end face 4b of the clad 4. Then, a pair of positioning pins 60 as first positioning members are optically adjusted with respect to the first core end surface 3a across the first end surface 4a of the cladding 4, and are erected on the first divided exterior member 10B of the exterior member 5G. Has been. Similarly, a pair of positioning pins 61 as a second positioning member is optically adjusted with respect to the second core end surface 3b across the second end surface 4b of the cladding 4, and stands on the second divided exterior member 11B of the exterior member 5G. It is installed. Furthermore, the spring member 35 is attached to the first and second flange portions 5c and 5d of the exterior member 5G.
The external component 15C is configured in the same manner as the external component 15A in the first embodiment except that the flange portion 16a is formed with the core end surface 17a interposed therebetween.

In the tenth embodiment, one external component 15C is addressed to the optical path conversion connector 20H while inserting the pair of positioning pins 60 into the pin insertion hole 19, and the spring member 35 is fitted and attached to the flange portion 16a. As a result, the core end surface 17a of the one external component 15C and the first core end surface 3a of the optical path conversion device 2C are kept in close contact with the optical axis aligned, and are optically connected.
Similarly, the other external component 15C is addressed to the optical path conversion connector 20H while inserting the pair of positioning pins 61 into the pin insertion hole 19, and the spring member 35 is fitted and attached to the flange portion 16a. As a result, the core end surface 17a of the other external component 15C and the second core end surface 3b of the optical path conversion device 2C are kept in close contact with the optical axis aligned, and are optically connected.

  Therefore, the light incident on the first core end surface 3a of the optical path conversion device 2C from the core end surface 17a of the one external component 15C is converted by the first and second mirror surfaces 4f and 4g to 90 ° optical paths, respectively, and the second core. The light enters the core end surface 17a of the other external component 15C from the end surface 3b.

  Thus, according to the tenth embodiment, in addition to the effects of the first embodiment, the optical path conversion connector 20H that can convert the optical path into a crank shape can be realized.

Embodiment 11 FIG.
30 is a perspective view for explaining an optical connection method between an optical path conversion connector and an external component according to Embodiment 11 of the present invention, and FIG. 31 is a cross-sectional view showing an optical path conversion device according to Embodiment 11 of the present invention. .
30 and 31, the optical path conversion device 2 </ b> D is configured such that a plurality of cores 3 that propagate light are two-dimensionally arranged and embedded in a clad 4 having a refractive index smaller than that of the core 3. . The clad 4 has a first end surface 4a, a second end surface 4b, and first and second mirror surfaces 4f and 4g located between the first end surface 4a and the second end surface 4b. Each core 3 extends from the first end surface 4a to the first mirror surface 4f, is bent 90 ° at the first mirror surface 4f to reach the second mirror surface 4g, and is bent 90 ° at the second mirror surface 4g to be second. It is comprised in the U-shape which reaches the end surface 4b. The first core end surface 3a of the core 3 is exposed on the first end surface 4a in a 2 × n matrix, and the second core end surface 3b is exposed on the second end surface 4b in a 2 × n matrix.

  The exterior member 5H is divided into first and second divided exterior members 10C and 11C. The optical path conversion connector 20I accommodates the optical path conversion device 2D in the housing recesses 10g and 11f of the first and second split exterior members 10C and 11C, and the first and second split exterior members 10C and 11C are bolts (not shown). Z)). At this time, the optical path conversion device 2D is accommodated in the exterior member 5H so that the first end surface 4a and the second end surface 4b of the clad 4 are exposed. Then, a pair of positioning pins 60 as first positioning members are optically adjusted with respect to the first core end surface 3a across the first end surface 4a of the cladding 4, and are erected on the second divided exterior member 11C of the exterior member 5H. Has been. Similarly, a pair of positioning pins 61 as a second positioning member is optically adjusted with respect to the second core end surface 3b across the second end surface 4b of the cladding 4, and stands on the second divided exterior member 11C of the exterior member 5H. It is installed. Furthermore, the spring member 35 is attached to the first and second flange portions 5c and 5d of the exterior member 5H.

In the eleventh embodiment, one external component 15C is addressed to the optical path conversion connector 20I while inserting the pair of positioning pins 60 into the pin insertion hole 19, and the spring member 35 is fitted and attached to the flange portion 16a. As a result, the core end surface 17a of the one external component 15C and the first core end surface 3a of the optical path conversion device 2D are kept in a close contact state with the optical axis aligned, and are optically connected.
Similarly, the other external component 15C is addressed to the optical path conversion connector 20I while inserting the pair of positioning pins 61 into the pin insertion hole 19, and the spring member 35 is fitted and attached to the flange portion 16a. As a result, the core end surface 17a of the other external component 15C and the second core end surface 3b of the optical path conversion device 2D are kept in close contact with the optical axis aligned, and are optically connected.

  Therefore, the light incident on the first core end surface 3a of the optical path conversion device 2D from the core end surface 17a of the one external component 15C is converted by the first and second mirror surfaces 4f and 4g by 90 ° optical paths, respectively, and the second core. The light enters the core end surface 17a of the other external component 15C from the end surface 3b.

  Thus, according to the eleventh embodiment, in addition to the effects of the first embodiment, an optical path conversion connector 20I that can convert an optical path into a U-shape can be realized.

In the first to eighth embodiments, since the workability and strength are obtained, the first and second pin insertion holes 6a and 6b are formed in the exterior member. Similarly to the above, it may be formed directly on the optical path conversion devices 2 and 2A. In this case, the optical axis of the core end surface of the external component 15A and the optical axis of the first core end surface 3a coincide with each other with high accuracy, and the optical axis of the photoelectric conversion element 21 of the external component 15B and the second core end surface 3b The optical axis of the first and second optical axes coincide with each other with high accuracy, and loss due to connection is reduced.
In each of the above embodiments, the external component 15B made of the photoelectric conversion element 21 is optically connected to the second core end surface 3b. However, the external component 15A made of an optical waveguide is optically connected to the second core end surface 3b. You may make it do. In this case, two external components 15A made of an optical waveguide are optically connected via the optical path conversion connector.

  In each of the above embodiments, the first core end surface 3a and the second core end surface 3b of the core 3 are arranged in two rows and n columns (where n is an integer of 2 or more) on the first end surface 4a and the second end surface 4b of the cladding 4. ) Is arranged in a matrix (two-dimensional), but the arrangement state of the first core end surface 3a and the second core end surface 3b may be two-dimensionally arranged, and the number of rows and columns Is appropriately set as necessary. Further, the arrangement pitch of the first core end surface 3a and the second core end surface 3b does not need to be equal, and is appropriately set as necessary. Furthermore, the first core end surface 3a and the second core end surface 3b do not have to be arranged in a complete matrix, and the number of each row may be different. That is, for example, in a 3 × 10 matrix arrangement, one core end face may be arranged in one column, two in the other column, and three in the remaining columns.

In each of the above embodiments, the first core end surface 3a and the second core end surface 3b of the core 3 are arranged in two rows and n columns (where n is an integer of 2 or more) on the first end surface 4a and the second end surface 4b of the cladding 4. In the present invention, the first core end face 3a and the second core end face 3b of the core 3 are arranged in a first end face 4a and a second end face 4b of the clad 4. Needless to say, the present invention can also be applied to a one-dimensional array.
In each of the above embodiments, the number of arrangements of the first and second core end faces 3a and 3b and the number of arrangements of the core end faces 17a and the photoelectric conversion elements 21 of the external parts are described as the same number. It goes without saying that the number of arrangements of the two core end faces 3a and 3b and the number of arrangements of the core end faces 17a and the photoelectric conversion elements 21 of the external components do not necessarily match.
In the present invention, the mode propagating through the cores 3 arranged two-dimensionally may be a single mode or a multimode.

  1, 1A, 1B, 1C, 20, 20A, 20B, 20C, 20D, 20E, 20F, 20G, 20H, 20I Optical path conversion connector 2, 2A, 2B, 2C, 2D, 25 Optical path conversion device, 3 core, 3a 1st core end surface, 3b 2nd core end surface, 4 clad, 4a 1st end surface, 4b 2nd end surface, 4c, 4f, 4g Mirror surface, 4d, 4e Optical path conversion device positioning groove (engaged portion), 5, 5A, 5B, 5C, 5D, 5E, 5F, 5G, 5H Exterior member, 6a First pin insertion hole (first positioning member), 6b Second pin insertion hole (second positioning member), 9, 24, 35 Spring Member (elastic fixing member) 10, 10A, 10B, 10C First split exterior member, 10e Optical path conversion device positioning protrusion (engagement portion), 11, 11A, 11B, 11C Second split exterior portion Material, 11d Optical path conversion device positioning protrusion (engaging part), 12 receiving hole (optical path conversion device insertion hole), 13 window (optical path conversion device insertion hole), 15A, 15B, 15C external parts, 17a core end face, 19 pins Insertion hole (positioned member), 32 microlens, 33 mounting seat.

Claims (1)

A plurality of first cores are formed in parallel,
A plurality of second cores are formed in parallel with each other and in parallel with the first core,
A plurality of third cores are formed in parallel and orthogonal to the first core and the second core,
The plurality of first cores and the plurality of second cores and the plurality of third cores have an optical waveguide orthogonal to each other,
A first end surface at which a plurality of first core end faces are exposed in a matrix, a second end face at which a plurality of second core end faces are exposed in a matrix, and a position at which the plurality of first cores and the plurality of third cores intersect. And a single first mirror surface that converts the optical path to a position where the plurality of second cores and the plurality of third cores intersect,
Each of the optical waveguides passes from the first core end surface through the first core to the first mirror surface, and the direction of the first mirror surface is changed and the second mirror passes through the third core. In a method of manufacturing a single optical path conversion device configured to be a continuous optical path that reaches a surface and is changed in direction by the second mirror surface and passes through the second core to the second core end surface . ,
Applying a first refractive index material to a flat substrate and forming a first cladding layer;
Applying a second refractive index material having a higher refractive index than the first refractive index material, and forming a first core layer on the first cladding layer;
Patterning the first core layer, a plurality of first cores parallel to each other, parallel to each other and parallel to the first core, the same number of second cores as the first core, and parallel to each other; And the same number of third cores as the first cores orthogonal to the first cores and the second cores, and the intersection of the first cores and the third cores on the first straight line And forming on the first cladding layer such that the intersection of the second core and the third core is located on a second straight line; and
The first refractive index material is applied onto the first cladding layer to form a second cladding layer, and the first core, the second core, and the third core are the first and second claddings. Producing a waveguide body embedded in the layer;
The plurality of waveguide bodies are arranged such that the plurality of first cores, the plurality of second cores, the plurality of third cores, the first straight line, and the second straight line coincide with each other in the stacking direction. The process of stacking,
Bonding the plurality of stacked waveguide bodies together to produce a waveguide unit;
And dicing the waveguide unit at the position of the first straight line and the position of the second straight line that coincide with the stacking direction to form the first mirror surface and the second mirror surface. A method for manufacturing an optical path conversion device .

Images