JP4374648B2 - Optical / electrical wiring board, manufacturing method, and mounting board - Google Patents

Optical / electrical wiring board, manufacturing method, and mounting board Download PDF

Info

Publication number
JP4374648B2
JP4374648B2 JP10529599A JP10529599A JP4374648B2 JP 4374648 B2 JP4374648 B2 JP 4374648B2 JP 10529599 A JP10529599 A JP 10529599A JP 10529599 A JP10529599 A JP 10529599A JP 4374648 B2 JP4374648 B2 JP 4374648B2
Authority
JP
Japan
Prior art keywords
optical
substrate
hole
core
electrical wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10529599A
Other languages
Japanese (ja)
Other versions
JP2000298216A (en
Inventor
晃一 熊井
健人 塚本
雅之 大出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Inc filed Critical Toppan Inc
Priority to JP10529599A priority Critical patent/JP4374648B2/en
Publication of JP2000298216A publication Critical patent/JP2000298216A/en
Application granted granted Critical
Publication of JP4374648B2 publication Critical patent/JP4374648B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Optical Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、光配線と電気配線とが混在する光・電気配線基板及びその製造方法並びにその基板に光部品と電気部品とを実装した実装基板に関する。
【０００２】
【従来の技術】
より速く演算処理が行えるコンピュータを作るために、ＣＰＵのクロック周波数は益々増大する傾向にあり、現在では１ＧＨｚオーダーのものが出現するに至っている。この結果、コンピュータの中のプリント基板上の銅による電気配線には高周波電流が流れる部分が存在することになるので、ノイズの発生により誤動作が生じたり、また電磁波が発生して周囲に悪影響を与えることにもなる。
【０００３】
このような問題を解決するために、プリント基板上の銅による電気配線の一部を光ファイバー又は光導波路による光配線に置き換え、電気信号の代わりに光信号を利用することが行われている。なぜなら、光信号の場合は、ノイズ及び電磁波の発生を抑えられるからである。
【０００４】
高密度実装又は小型化の観点からは、電気配線と光配線とが同一の基板上で積み重なっている光・電気配線基板を作ることが望ましい。特開平６−２２２２３０号の実施例には、光配線を多層化することによって、高密度実装又は小型化を実現すると同時に、複数の光配線を立体的に交差させて複雑な光配線を実現した光・電気配線基板が記載されている。
【０００５】
しかし、特開平６−２２２２３０号の実施例は、光配線を基板の一面に多層化したものであり、その面にのみ光部品を実装できるに過ぎない。より高密度実装又は小型化を行うためには、基板の両面に光部品を実装できることが望ましい。
【０００６】
【発明が解決しようとする課題】
本発明は係る従来技術の状況に鑑みてなされたもので、複雑な光配線が施されているだけでなく、両面に光部品が実装できる光・電気配線基板を提供することを課題とする。
【０００７】
【課題を解決するための手段】
本発明において上記の課題を達成するために、まず請求項１の発明では、電気配線を有する基板と、基板の一方の面に位置する第１の光配線層と、基板の他方の面に位置する第２の光配線層と、基板を垂直に貫通する光スルーホールとを備える光・電気配線基板であって、第１の光配線層、第２の光配線層、及び光スルーホールは、それぞれコアとクラッドとを有し、第１の光配線層、第２の光配線層、及び光スルーホールのコアは全て屈折率が等しくかつ同一材料を用いて一体となるように形成され、光スルーホールのコアの一端は第１の光配線層のコアと接続し、光スルーホールのコアの他端は第２の光配線層のコアと接続している、ことを特徴とする光・電気配線基板としたものである。
【０００８】
また請求項２の発明では、電気配線を有する基板と、基板の一方の面に位置する第１の光配線層と、基板の他方の面に位置する第２の光配線層と、基板を垂直に貫通する光スルーホールとを備える光・電気配線基板であって、第１の光配線層、第２の光配線層、及び光スルーホールは、それぞれコアとクラッドとを有し、第１の光配線層、第２の光配線層、及び光スルーホールのコアは全て屈折率が等しくかつ同一材料を用いて一体となるように形成され、光スルーホールのコアの一端は第１の光配線層のコアと接続し、光スルーホールのコアの他端は第２の光配線層のコアと接続し、それぞれの接続している部分には基板の面に対して４５度の角度のミラー面を持つミラーが設けられている、ことを特徴とする光・電気配線基板としたものである。
【０００９】
また請求項３の発明では、基板の有する電気配線が複数の層からなり、光スルーホールを貫通させるための基板の孔の内面が、電気配線の層間を電気接続する導電体層を備えていることを特徴とする請求項１又は２記載の光・電気配線基板としたものである。
【００１０】
また請求項４の発明では、基板の有する電気配線が複数の層からなり、光スルーホールを貫通させるための基板の孔の内面が、電気配線の層間を電気接続する導電体層を備えていないこと特徴とする請求項１又は２記載の光・電気配線基板としたものである。
【００１１】
また請求項５の発明では、基板に電気配線を施す工程と、
基板に第１の貫通孔を形成する工程と、
第１の貫通孔の内面及び基板の両面にクラッドをコーティングし、第１の貫通孔の内部をクラッドで満たす工程と、
第１の貫通孔の内径よりも小さい内径を持つ第２の貫通孔を、第１の貫通孔の中心に形成する工程と、
第２の貫通孔の内面及び基板両面のクラッドにコアをコーティングし、第２の貫通孔の内部をコアで満たす工程と、
基板両面のクラッド上のコアに対して光配線となる部分を残し不要部分を除去する工程と、
基板両面のクラッド上のコアに対して光配線となる部分を残し不要部分を除去した後、基板両面で露出しているクラッド及びコアの上に、さらにクラッドをコーティングする工程と、
第２の貫通孔のコアの一端と基板の一面のコアとが接続している部分及び、第２の貫通孔のコアの他端と基板の他面のコアとが接続している部分それぞれに、基板の面に対して４５度の角度でミラー面を形成する工程と、
を含む光・電気配線基板の製造方法としたものである。
【００１２】
また請求項６の発明では、請求項１〜４の何れか１項記載の光・電気配線基板に、光部品又は／及び電気部品を実装したことを特徴とする実装基板としたものである。
【００１３】
【発明の実施の形態】
１．光・電気配線基板
本発明の光・電気配線基板の断面図を、図１に示す。電気配線を有する基板１の一方の面（図１では上面）には、クラッド２及びクラッド６に囲まれたコア３からなる第１の光配線層がある。また、電気配線を有する基板の他方の面（図１では下面）には、クラッド２及びクラッド６に囲まれたコア５からなる第２の光配線層がある。さらに、電気配線を有する基板１を垂直に貫通し、クラッド２に囲まれたコア４からなる光スルーホールがある。第１配線層のコア３、光スルーホールのコア４、及び第２配線層のコア５は、全て屈折率が等しい。光スルーホールのコア４の一端（図１では上端）は、第１配線層のコア３と接続しており、その接続している部分には、基板１の面に対して４５度の角度のミラー面を持つミラー７が設けられている。同様に、光スルーホールのコア４の他端（図１では下端）は、第２配線層のコア５と接続しており、その接続している部分には、基板１の面に対して４５度の角度のミラー面を持つミラー８が設けられている。
【００１４】
基板の有する電気配線が複数の層からなる場合、光スルーホールを貫通させるための基板の孔の内面９には、電気配線の層間を電気接続する導体層があっても良いし、無くても良い。
【００１５】
図２に示すように、第１配線層のコア３を伝搬したレーザ光１０は、ミラー７で反射され、光スルーホールのコア４を伝搬した後、ミラー８で反射され、第２の配線層のコア５を伝搬する。
【００１６】
２．光・電気配線基板の製造方法
本発明の光・電気配線基板の製造方法を、光スルーホールの部分に焦点を当てて、図３の（ａ）〜（ｊ）の流れに従って説明する。
【００１７】
図３の（ａ）のように、電気配線を有する基板２１に、貫通孔２２を開ける。貫通孔２２を開ける方法としては、ドリル、レーザ、ＲＩＥ（ＲｅａｃｔｉｖｅＩｏｎ Ｅｔｃｈｉｎｇ，反応性イオンエッチング）などがある。基板２１が、複数層からなる電気配線を有するとき、電気的スルーホールを貫通孔２２として用いても良い。この場合、貫通孔２２の内面には、電気配線の層間を電気接続する導電体層がある。
【００１８】
図３の（ｂ）のように、基板２１の両面及び貫通孔２２の内面にクラッド２３をコーティングし、貫通孔２２をクラッド２３で埋める。
【００１９】
図３の（ｃ）のように、埋められた貫通孔２２の中心部分に、貫通孔２２の内径よりも小さい内径を持つ貫通孔２４を開ける。これによって、貫通孔２４はクラッド２３によって囲まれる。貫通孔２４を開ける方法には、ドリル、レーザ、ＲＩＥなどがある。
【００２０】
図３の（ｄ）のように、基板２１の両面及び貫通孔２４の内面にコア２５をコーティングし、貫通孔２４をコア２５で埋める。
【００２１】
図３の（ｅ）のように、基板２１の両面のコア２５を金属膜２６で覆う。
【００２２】
図３の（ｆ）のように、フォトリソグラフィ技術によって、金属膜２６の光配線に対応する光配線部２８を残し、金属膜２６の不要な部分を除去する。
【００２３】
基板２１の両面をＲＩＥでエッチングして、図３の（ｇ）のように、残っている金属膜２６に覆われていないコア２５の部分を除去する。
【００２４】
図３の（ｈ）のように、基板２１の両面から残っていた金属膜２６を除去する。
【００２５】
図３の（ｉ）のように、基板２１の両面にクラッド３０をコーティングする。
【００２６】
基板２１の面に平行なコアと垂直なコアとの接続部分に、９０度刃によるダイシング加工或いはＲＩＥの斜めエッチングによって、基板２１の面に対して４５度の角度のミラー面を持つミラー３２及び３３を設ける。ミラー３２、３３は、スパッタ、蒸着などによって、金属反射膜を有するミラーにしても良い。
【００２７】
【発明の効果】
本発明は、電気配線を有する基板の両面に光配線層を設け、それらを光スルーホールで光学的に接続するので、複雑な光配線を施し、しかも光部品を基板の両面に実装することができる。従って、光配線設計の簡易化、高密度配線及び実装を図ることができるという効果がある。
【図面の簡単な説明】
【図１】本発明の光・電気配線基板の断面図。
【図２】本発明の光・電気配線基板におけるレーザ光の伝搬を説明する図。
【図３】本発明の光・電気配線基板の製造方法の説明図。
【符号の説明】
１…基板
２…クラッド
３…コア
４…コア
５…コア
６…クラッド
７…ミラー
８…ミラー
９…孔の内面
１０…レーザ光
２１…基板
２２…貫通孔
２３…クラッド
２４…貫通孔
２５…コア
２６…金属膜
２８…光配線部
３０…クラッド
３２…ミラー
３３…ミラー[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical / electrical wiring board in which optical wiring and electrical wiring are mixed, a method for manufacturing the same, and a mounting board in which optical components and electrical components are mounted on the substrate.
[0002]
[Prior art]
In order to make a computer that can perform arithmetic processing faster, the clock frequency of the CPU tends to increase more and more, and now the one of the order of 1 GHz has appeared. As a result, there is a part where high-frequency current flows in the copper electrical wiring on the printed circuit board in the computer, so that malfunctions may occur due to the generation of noise, and electromagnetic waves may be generated, adversely affecting the surroundings. It will also be.
[0003]
In order to solve such a problem, a part of electric wiring made of copper on a printed board is replaced with an optical wiring made of an optical fiber or an optical waveguide, and an optical signal is used instead of an electric signal. This is because the generation of noise and electromagnetic waves can be suppressed in the case of optical signals.
[0004]
From the viewpoint of high-density mounting or miniaturization, it is desirable to make an optical / electrical wiring board in which electrical wiring and optical wiring are stacked on the same substrate. In the example of Japanese Patent Laid-Open No. 6-222230, a plurality of optical wirings are multi-layered to realize high density mounting or downsizing, and at the same time, a plurality of optical wirings are three-dimensionally crossed to realize a complicated optical wiring. An optical / electrical wiring board is described.
[0005]
However, the embodiment disclosed in Japanese Patent Laid-Open No. 6-222230 is such that optical wiring is multilayered on one surface of a substrate, and optical components can only be mounted on that surface. In order to achieve higher density mounting or downsizing, it is desirable that optical components can be mounted on both sides of the substrate.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the state of the related art, and it is an object of the present invention to provide an optical / electrical wiring board in which not only complicated optical wiring is provided but also optical components can be mounted on both sides.
[0007]
[Means for Solving the Problems]
In order to achieve the above object in the present invention, first, in the invention of claim 1, a substrate having electrical wiring, a first optical wiring layer positioned on one surface of the substrate, and positioned on the other surface of the substrate. An optical / electrical wiring board comprising a second optical wiring layer and an optical through hole penetrating the substrate vertically, wherein the first optical wiring layer, the second optical wiring layer, and the optical through hole are: Each core has a core and a clad, and the first optical wiring layer, the second optical wiring layer, and the core of the optical through-hole are all formed so as to be integrated using the same material with the same refractive index. One end of the core of the through hole is connected to the core of the first optical wiring layer, and the other end of the core of the optical through hole is connected to the core of the second optical wiring layer. This is a wiring board.
[0008]
According to a second aspect of the present invention, a substrate having electrical wiring, a first optical wiring layer located on one surface of the substrate, a second optical wiring layer located on the other surface of the substrate, and the substrate vertically An optical / electrical wiring board having an optical through hole penetrating through the first optical wiring layer, wherein the first optical wiring layer, the second optical wiring layer, and the optical through hole each have a core and a cladding, The optical wiring layer, the second optical wiring layer, and the core of the optical through hole are all formed so as to be integrated with the same refractive index and using the same material, and one end of the core of the optical through hole is the first optical wiring. The other end of the core of the optical through hole is connected to the core of the second optical wiring layer, and each connected portion has a mirror surface at an angle of 45 degrees with respect to the surface of the substrate. An optical / electrical wiring board characterized by having a mirror with A.
[0009]
According to a third aspect of the present invention, the electric wiring of the substrate is composed of a plurality of layers, and the inner surface of the hole of the substrate for penetrating the optical through hole is provided with a conductor layer for electrically connecting the layers of the electric wiring. The optical / electrical wiring board according to claim 1 or 2, wherein the optical / electrical wiring board is provided.
[0010]
In the invention of claim 4, the electric wiring of the substrate is composed of a plurality of layers, and the inner surface of the hole of the substrate for penetrating the optical through hole does not include a conductor layer for electrically connecting the layers of the electric wiring. 3. An optical / electrical wiring board according to claim 1 or 2.
[0011]
In the invention of claim 5, a step of applying electrical wiring to the substrate;
Forming a first through hole in the substrate;
Coating the clad on the inner surface of the first through hole and both sides of the substrate, and filling the inside of the first through hole with the clad;
Forming a second through hole having an inner diameter smaller than the inner diameter of the first through hole at the center of the first through hole;
Coating the core on the inner surface of the second through hole and the clad on both sides of the substrate, and filling the inside of the second through hole with the core;
A step of removing an unnecessary portion while leaving a portion to be an optical wiring with respect to the core on the clad on both sides of the substrate;
A step of coating the clad on the clad and the core exposed on both sides of the substrate, after removing the unnecessary portion leaving the portion that becomes the optical wiring with respect to the core on the clad on both sides of the substrate,
A portion where one end of the core of the second through hole is connected to the core on one surface of the substrate, and a portion where the other end of the core of the second through hole is connected to the core on the other surface of the substrate Forming a mirror surface at an angle of 45 degrees with respect to the surface of the substrate;
And a method of manufacturing an optical / electrical wiring board including
[0012]
According to a sixth aspect of the present invention, there is provided a mounting board in which an optical component and / or an electric component is mounted on the optical / electrical wiring board according to any one of the first to fourth aspects.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
1. Optical / Electrical Wiring Board FIG. 1 shows a cross-sectional view of the optical / electrical wiring board of the present invention. On one surface (upper surface in FIG. 1) of the substrate 1 having electrical wiring, there is a first optical wiring layer composed of the core 3 surrounded by the cladding 2 and the cladding 6. Further, on the other surface (the lower surface in FIG. 1) of the substrate having the electrical wiring, there is a second optical wiring layer composed of the core 5 surrounded by the cladding 2 and the cladding 6. Further, there is an optical through hole that is formed by a core 4 that vertically penetrates the substrate 1 having electrical wiring and is surrounded by the clad 2. The core 3 of the first wiring layer, the core 4 of the optical through hole, and the core 5 of the second wiring layer all have the same refractive index. One end (the upper end in FIG. 1) of the core 4 of the optical through hole is connected to the core 3 of the first wiring layer, and the connected portion has an angle of 45 degrees with respect to the surface of the substrate 1. A mirror 7 having a mirror surface is provided. Similarly, the other end (the lower end in FIG. 1) of the core 4 of the optical through hole is connected to the core 5 of the second wiring layer. A mirror 8 having a mirror surface with a degree angle is provided.
[0014]
When the electric wiring of the substrate is composed of a plurality of layers, the inner surface 9 of the hole of the substrate for penetrating the optical through hole may or may not have a conductor layer for electrically connecting the layers of the electric wiring. good.
[0015]
As shown in FIG. 2, the laser beam 10 propagated through the core 3 of the first wiring layer is reflected by the mirror 7, propagates through the core 4 of the optical through hole, and then reflected by the mirror 8. Is propagated through the core 5.
[0016]
2. Method for Manufacturing Optical / Electrical Wiring Board The method for manufacturing an optical / electrical wiring board according to the present invention will be described in accordance with the flow of FIGS.
[0017]
As shown in FIG. 3A, a through hole 22 is formed in a substrate 21 having electrical wiring. As a method of opening the through hole 22, there are a drill, a laser, RIE (Reactive Ion Etching), and the like. When the substrate 21 has an electrical wiring composed of a plurality of layers, an electrical through hole may be used as the through hole 22. In this case, the inner surface of the through-hole 22 has a conductor layer that electrically connects the layers of the electrical wiring.
[0018]
As shown in FIG. 3B, the clad 23 is coated on both surfaces of the substrate 21 and the inner surface of the through hole 22, and the through hole 22 is filled with the clad 23.
[0019]
As shown in FIG. 3C, a through hole 24 having an inner diameter smaller than the inner diameter of the through hole 22 is opened at the center of the buried through hole 22. Thus, the through hole 24 is surrounded by the clad 23. Examples of the method for opening the through hole 24 include a drill, a laser, and RIE.
[0020]
As shown in FIG. 3D, the core 25 is coated on both surfaces of the substrate 21 and the inner surface of the through hole 24, and the through hole 24 is filled with the core 25.
[0021]
As shown in FIG. 3E, the cores 25 on both sides of the substrate 21 are covered with a metal film 26.
[0022]
As shown in FIG. 3F, the optical wiring portion 28 corresponding to the optical wiring of the metal film 26 is left and unnecessary portions of the metal film 26 are removed by photolithography.
[0023]
Both surfaces of the substrate 21 are etched by RIE, and the portion of the core 25 not covered with the remaining metal film 26 is removed as shown in FIG.
[0024]
As shown in FIG. 3H, the metal film 26 remaining on both surfaces of the substrate 21 is removed.
[0025]
As shown in (i) of FIG. 3, the clad 30 is coated on both surfaces of the substrate 21.
[0026]
A mirror 32 having a mirror surface with an angle of 45 degrees with respect to the surface of the substrate 21 is formed by dicing with a 90-degree blade or oblique etching of RIE at a connecting portion between the core parallel to the surface of the substrate 21 and the perpendicular core. 33 is provided. The mirrors 32 and 33 may be mirrors having a metal reflection film by sputtering, vapor deposition, or the like.
[0027]
【The invention's effect】
In the present invention, optical wiring layers are provided on both surfaces of a substrate having electrical wiring, and they are optically connected through optical through-holes. Therefore, complicated optical wiring can be applied, and optical components can be mounted on both surfaces of the substrate. it can. Therefore, there are effects that simplification of optical wiring design, high-density wiring, and mounting can be achieved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an optical / electrical wiring board according to the present invention.
FIG. 2 is a view for explaining propagation of laser light in the optical / electrical wiring board of the present invention.
FIG. 3 is an explanatory diagram of a method for manufacturing an optical / electrical wiring board according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Cladding 3 ... Core 4 ... Core 5 ... Core 6 ... Cladding 7 ... Mirror 8 ... Mirror 9 ... Inner surface 10 of a hole ... Laser beam 21 ... Substrate 22 ... Through-hole 23 ... Cladding 24 ... Through-hole 25 ... Core 26 ... Metal film 28 ... Optical wiring part 30 ... Cladding 32 ... Mirror 33 ... Mirror

Claims (6)

電気配線を有する基板と、基板の一方の面に位置する第１の光配線層と、基板の他方の面に位置する第２の光配線層と、基板を垂直に貫通する光スルーホールとを備える光・電気配線基板であって、
第１の光配線層、第２の光配線層、及び光スルーホールは、それぞれコアとクラッドとを有し、
第１の光配線層、第２の光配線層、及び光スルーホールのコアは全て屈折率が等しくかつ同一材料を用いて一体となるように形成され、
光スルーホールのコアの一端は第１の光配線層のコアと接続し、光スルーホールのコアの他端は第２の光配線層のコアと接続している、
ことを特徴とする光・電気配線基板。A substrate having electrical wiring; a first optical wiring layer located on one surface of the substrate; a second optical wiring layer located on the other surface of the substrate; and an optical through hole penetrating the substrate vertically. An optical / electrical wiring board comprising:
The first optical wiring layer, the second optical wiring layer, and the optical through hole each have a core and a cladding,
The cores of the first optical wiring layer, the second optical wiring layer, and the optical through-hole are all formed so as to be integrated using the same material with the same refractive index,
One end of the core of the optical through hole is connected to the core of the first optical wiring layer, and the other end of the core of the optical through hole is connected to the core of the second optical wiring layer.
An optical / electrical wiring board characterized by that. 電気配線を有する基板と、基板の一方の面に位置する第１の光配線層と、基板の他方の面に位置する第２の光配線層と、基板を垂直に貫通する光スルーホールとを備える光・電気配線基板であって、
第１の光配線層、第２の光配線層、及び光スルーホールは、それぞれコアとクラッドとを有し、
第１の光配線層、第２の光配線層、及び光スルーホールのコアは全て屈折率が等しくかつ同一材料を用いて一体となるように形成され、
光スルーホールのコアの一端は第１の光配線層のコアと接続し、光スルーホールのコアの他端は第２の光配線層のコアと接続し、それぞれの接続している部分には基板の面に対して４５度の角度のミラー面を持つミラーが設けられている、
ことを特徴とする光・電気配線基板。A substrate having electrical wiring; a first optical wiring layer located on one surface of the substrate; a second optical wiring layer located on the other surface of the substrate; and an optical through hole penetrating the substrate vertically. An optical / electrical wiring board comprising:
The first optical wiring layer, the second optical wiring layer, and the optical through hole each have a core and a cladding,
The cores of the first optical wiring layer, the second optical wiring layer, and the optical through-hole are all formed so as to be integrated using the same material with the same refractive index,
One end of the core of the optical through hole is connected to the core of the first optical wiring layer, and the other end of the core of the optical through hole is connected to the core of the second optical wiring layer. A mirror having a mirror surface at an angle of 45 degrees with respect to the surface of the substrate is provided.
An optical / electrical wiring board characterized by that. 基板の有する電気配線が複数の層からなり、光スルーホールを貫通させるための基板の孔の内面が、電気配線の層間を電気接続する導電体層を備えていることを特徴とする請求項１又は２記載の光・電気配線基板。  The electrical wiring of the substrate comprises a plurality of layers, and the inner surface of the hole of the substrate for penetrating the optical through hole is provided with a conductor layer that electrically connects the layers of the electrical wiring. Or the optical / electrical wiring board according to 2. 基板の有する電気配線が複数の層からなり、光スルーホールを貫通させるための基板の孔の内面が、電気配線の層間を電気接続する導電体層を備えていないこと特徴とする請求項１又は２記載の光・電気配線基板。  The electrical wiring of the substrate is composed of a plurality of layers, and the inner surface of the hole of the substrate for penetrating the optical through hole does not include a conductor layer that electrically connects the layers of the electrical wiring. 2. The optical / electrical wiring board according to 2. 基板に電気配線を施す工程と、
基板に第１の貫通孔を形成する工程と、
第１の貫通孔の内面及び基板の両面にクラッドをコーティングし、第１の貫通孔の内部をクラッドで満たす工程と、
第１の貫通孔の内径よりも小さい内径を持つ第２の貫通孔を、第１の貫通孔の中心に形成する工程と、
第２の貫通孔の内面及び基板両面のクラッドにコアをコーティングし、第２の貫通孔の内部をコアで満たす工程と、
基板両面のクラッド上のコアに対して光配線となる部分を残し不要部分を除去する工程と、
基板両面のクラッド上のコアに対して光配線となる部分を残し不要部分を除去した後、基板両面で露出しているクラッド及びコアの上に、さらにクラッドをコーティングする工程と、
第２の貫通孔のコアの一端と基板の一面のコアとが接続している部分及び、第２の貫通孔のコアの他端と基板の他面のコアとが接続している部分それぞれに、基板の面に対して４５度の角度でミラー面を形成する工程と、
を含む光・電気配線基板の製造方法。Applying electrical wiring to the substrate;
Forming a first through hole in the substrate;
Coating the clad on the inner surface of the first through hole and both sides of the substrate, and filling the inside of the first through hole with the clad;
Forming a second through hole having an inner diameter smaller than the inner diameter of the first through hole at the center of the first through hole;
Coating the core on the inner surface of the second through hole and the clad on both sides of the substrate, and filling the inside of the second through hole with the core;
A step of removing an unnecessary portion while leaving a portion to be an optical wiring with respect to the core on the clad on both sides of the substrate;
A step of coating the clad on the clad and the core exposed on both sides of the substrate, after removing the unnecessary portion leaving the portion that becomes the optical wiring with respect to the core on the clad on both sides of the substrate,
A portion where one end of the core of the second through hole is connected to the core on one surface of the substrate, and a portion where the other end of the core of the second through hole is connected to the core on the other surface of the substrate Forming a mirror surface at an angle of 45 degrees with respect to the surface of the substrate;
Of manufacturing an optical / electrical wiring board including: 請求項１〜４の何れか１項記載の光・電気配線基板に、光部品又は／及び電気部品を実装したことを特徴とする実装基板。  5. A mounting substrate comprising an optical component and / or an electrical component mounted on the optical / electrical wiring substrate according to claim 1.
JP10529599A 1999-04-13 1999-04-13 Optical / electrical wiring board, manufacturing method, and mounting board Expired - Fee Related JP4374648B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10529599A JP4374648B2 (en) 1999-04-13 1999-04-13 Optical / electrical wiring board, manufacturing method, and mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10529599A JP4374648B2 (en) 1999-04-13 1999-04-13 Optical / electrical wiring board, manufacturing method, and mounting board

Publications (2)

Publication Number Publication Date
JP2000298216A JP2000298216A (en) 2000-10-24
JP4374648B2 true JP4374648B2 (en) 2009-12-02

Family

ID=14403709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10529599A Expired - Fee Related JP4374648B2 (en) 1999-04-13 1999-04-13 Optical / electrical wiring board, manufacturing method, and mounting board

Country Status (1)

Country Link
JP (1) JP4374648B2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW451084B (en) * 1999-06-25 2001-08-21 Toppan Printing Co Ltd Optical-electro wiring board, mounted board, and manufacturing method of optical-electro wiring board
US7352066B2 (en) * 2003-09-30 2008-04-01 International Business Machines Corporation Silicon based optical vias
JP2006120956A (en) * 2004-10-22 2006-05-11 Ibiden Co Ltd Multilayer printed-wiring board
JP2006171642A (en) * 2004-12-20 2006-06-29 Sony Corp Optical waveguide sheet, optoelectronic apparatus and their manufacturing method
JP2006330697A (en) * 2005-04-25 2006-12-07 Kyocera Corp Optical coupling structure, substrate with built-in optical transmission function, and method for manufacturing such substrate
WO2010113968A1 (en) 2009-03-30 2010-10-07 京セラ株式会社 Optical and electrical circuit board and optical module
JP2010061175A (en) * 2009-12-18 2010-03-18 Fujitsu Ltd Optical wiring board and method of manufacturing the same
JP5395042B2 (en) * 2010-12-03 2014-01-22 三菱電機株式会社 Manufacturing method of optical path conversion device
JP2013142826A (en) * 2012-01-11 2013-07-22 Hitachi Chemical Co Ltd Method for manufacturing optical waveguide
KR20140114829A (en) 2012-01-11 2014-09-29 히타치가세이가부시끼가이샤 Optical waveguide and manufacturing method thereof
US11754794B2 (en) 2021-05-25 2023-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device including optical through via and method of making

Also Published As

Publication number Publication date
JP2000298216A (en) 2000-10-24

Similar Documents

Publication Publication Date Title
KR100720854B1 (en) Photoelectric wiring board, packaging board, and photoelectric wiring board producing method
US6236786B1 (en) Substrate with optical waveguide and method of making the same
JP4374648B2 (en) Optical / electrical wiring board, manufacturing method, and mounting board
JP5247880B2 (en) Photoelectric wiring board and optical module
US7672547B2 (en) Printed circuit board including optical waveguide and method of manufacturing the same
JP4677651B2 (en) Optical wiring layer manufacturing method, optical / electrical wiring substrate, manufacturing method thereof, and mounting substrate
JP2002107560A (en) Mounting substrate
JP2001108853A (en) Optical wiring layer, opto-electric wiring board, and packaging substrate
JP4306011B2 (en) Optical wiring layer and manufacturing method thereof, optical / electrical wiring substrate, manufacturing method thereof, and mounting substrate
JP2000298217A (en) Optical-electric wiring substrate and manufacture therefor, and mounting substrate
CN110780393B (en) Optical waveguide and optical circuit board
JP4164947B2 (en) Optical / electrical wiring board, manufacturing method, and mounting board
JP2001183556A (en) Multi-chip module board and multi-chip module
US8208778B2 (en) Planar layer with optical path
JP4441980B2 (en) Optical / electrical wiring substrate, manufacturing method thereof, manufacturing method of optical wiring film, and mounting substrate
US7356215B2 (en) Methods and apparatus for selectively coupling optical paths
JP4059806B2 (en) Optical waveguide device including optical branching device, optical branching device, and optical waveguide device manufacturing method
JP2000340906A (en) Optical/electrical wiring board, manufacture thereof and mounting board
JP4590722B2 (en) Substrate manufacturing method for mounting optical components
JP4304764B2 (en) Optical / electrical wiring board, manufacturing method, and mounting board
JP2002131565A (en) Mounting substrate and structure for mounting device using it
JP4639421B2 (en) Optical wiring layer manufacturing method
US6990280B2 (en) Optical path with electrically conductive cladding
US20040071385A1 (en) PCB incorporating integral optical layers
JP4211018B2 (en) Optical circuit module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060320

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080423

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080430

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081007

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081128

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090818

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090831

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120918

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120918

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130918

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees