JP2006171642A - Optical waveguide sheet, optoelectronic apparatus and their manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optoelectronic apparatus that facilitates keeping flexibility of design, adaptable to design change and that can easily deal with the production of many kinds in small quantities, and to provide its manufacturing method. <P>SOLUTION: The optical waveguide sheet guides and emits an incident clock signal by splitting it into plural parts and is laminated with a first optical waveguide layer, in which a striped first core extending in a first direction, is covered with a first clad, and a second optical waveguide layer in which a striped second core extending in a second direction is covered with a second clad. The sheet is structured, such that a first recess in a prescribed shape is formed in the specific place of the first optical waveguide layer, while a second recess in a prescribed shape is formed at a prescribed place of the second optical waveguide layer, and that the inner wall face of the first and the second recess reflects, as a mirror face, the light guided in the first and the second core to the second and the first core side, and/or splits in half the light from the second and the first core side to reflect to the one and the other extending directions of the first and the second core. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical waveguide sheet, an optoelectronic device, and a manufacturing method thereof, and more particularly, an optical waveguide sheet that distributes and guides light serving as a clock signal, an electron including a light emitting element that emits light serving as a clock signal, and a light receiving unit. The present invention relates to an optoelectronic device having a structure in which a semiconductor chip having a circuit is optically connected by an optical waveguide sheet, and a manufacturing method thereof.

The demand for downsizing, thinning, and weight reduction of portable electronic devices such as digital video cameras, digital mobile phones, and notebook personal computers is increasing. A reduction of 70% has been achieved in the year.
On the other hand, as a package form of a semiconductor device, it progresses from a lead insertion type such as DIP (Dual Inline Package) to a surface mounting type or flip chip mounting, and further, a semiconductor chip provided with an active element and a passive element. It has evolved into a complex form called packaged system-in-package (SiP).

As described above, the progress of semiconductor technology in recent years is remarkable, and the clock frequency has already exceeded the GHz order, particularly in the LSI world of CPUs and high-speed logics.
The wiring of signals exceeding GHz has many problems that have not been a problem in the past, whether inside or outside the LSI. Solving these problems is very important for the further integration and speeding up of semiconductors in the near future. It has become an element.
These issues include signal distortion (Signal Integrity), frequency limits of electrical wiring, wiring loss, wiring delay, radiation from wiring, signal skew (skew), increased power consumption related to wiring driving, etc. It is.

  In particular, the skew (timing difference) of clocks supplied to LSI chips or different LSIs in recent years has been a problem. For example, the IDigit time of a 1 GHz clock is 500 ps, and the rise and fall times are about several tens ps to about 200 ps or less. On the other hand, in a general wiring on a dielectric of about ε = 4, the propagation speed of an approximate electric signal is 67 ps / cm, and reaches a region that cannot be ignored with respect to the rise time.

Therefore, many attempts have been made to suppress wiring skew by using completely equal length wiring on the mounting substrate or LSI, and distributing the clock to the wiring having the shape of the letter H called H-bar. .
When clock distribution is performed using these conventional electrical wirings, the wiring load is always driven at the clock frequency, and waveform shaping is also performed at each distribution point, resulting in increased power consumption. was there.

Therefore, in order to overcome the above problems, it has been proposed to distribute the clock using light for the wiring instead of the electric wiring using a metal such as aluminum or copper.
For example, Non-Patent Document 1 describes a technique for obtaining a wiring board having an optical clock tree by forming optical waveguides on a silicon substrate and processing them by a semiconductor process for each LSI using a mask. Yes.

However, in the method of sequentially forming a clock wiring layer by a semiconductor process on a substrate such as silicon or ceramic or organic substrate as described above, a design or mask corresponding to a specific LSI is manufactured and processed each time. There is a hassle of doing.
In addition, since all manufacturing processes are performed sequentially, the entire TAT is prolonged and there is a drawback that it is difficult to cope with small changes.
Shiou Lin Sam, Anantha Chandrakasan, and Duane Boning, Variation Issues in On-Chip Optical Clock Distribution, Sixth International Workshop on Statistical Methodologies for IC Processes, Devices, and Circuits, Kyoto, Japan, June, 2001.

  The problem to be solved is that it is difficult to maintain the degree of freedom of design so that it can cope with design changes, and it is difficult to cope with the production of a small variety of products. is there.

  In order to solve the above problems, an optical waveguide sheet of the present invention is an optical waveguide sheet that divides and guides light that is an incident clock signal and emits the light, and extends in a first direction. A first optical waveguide layer formed by covering a first core formed in a stripe shape with a first cladding, and a second direction different from the first direction, which is formed by laminating the first optical waveguide layer. And a second optical waveguide layer formed by coating a second core formed in a stripe shape with a second cladding, and at a predetermined position of the first optical waveguide layer in the first direction. A first concave portion having a forward tapered shape in which a parallel cross section narrows toward the bottom of the opening and having an inner wall surface intersecting with a plane perpendicular to the first direction at an angle of 45 ° is formed, and the second optical waveguide is formed. A forward taper where the cross section parallel to the second direction becomes narrower toward the bottom of the opening at a predetermined position of the layer A second recess having an inner wall surface intersecting at an angle of 45 ° with respect to a plane perpendicular to the second direction is formed, and the inner wall surface of the first recess serves as the mirror surface as the first surface. The light guided in the core is reflected to the second core side and / or the light from the second core side is divided into two and reflected in one extending direction and the other extending direction of the first core. The inner wall surface of the second recess serves as a mirror surface to reflect light guided through the second core toward the first core and / or divide the light from the first core into two parts Then, the light that is reflected in one extending direction and the other extending direction of the second core and that is incident on the first core or the second core from a predetermined light incident position is reflected on the first recess and the second core. Waveguides are divided into a plurality of parts through the recesses, and the optical waveguide is provided in the first recesses or the second recesses. Emitted to out-of-plane direction of the over bets.

The optical waveguide sheet of the present invention described above is an optical waveguide sheet that divides a light, which is an incident clock signal, into a plurality of waveguides, and emits the light. The optical waveguide sheet extends in a first direction and is formed in a stripe shape. The first optical waveguide layer formed by covering the first core with the first cladding and the second core formed in a stripe shape extending in the second direction different from the first direction are covered with the second cladding. And a second optical waveguide layer.
Here, a predetermined portion of the first optical waveguide layer has a forward tapered shape in which a cross section parallel to the first direction becomes narrower toward the bottom of the opening, and intersects with a plane perpendicular to the first direction at an angle of 45 °. A first recess having an inner wall surface is formed.
The second optical waveguide layer has a forward tapered shape in which a cross section parallel to the second direction becomes narrower toward the bottom of the opening, and intersects a plane perpendicular to the second direction at an angle of 45 °. A second recess having an inner wall surface is formed.
The inner wall surface of the first recess serves as a mirror surface to reflect light guided in the first core to the second core side and / or to divide the light from the second core side into two parts. Reflecting in one extending direction and the other extending direction of the core, and the inner wall surface of the second recess reflects, as a mirror surface, light guided in the second core toward the first core, and / or The light from the first core is divided into two parts and reflected in one extending direction and the other extending direction of the second core, and enters the first core or the second core from a predetermined light incident position. The emitted light is divided into a plurality of waves through the first recess and the second recess and guided, and emitted in the out-of-plane direction of the optical waveguide sheet at the first recess or the second recess.

  In order to solve the above problems, an optoelectronic device according to the present invention includes a light emitting element that emits light serving as a clock signal, a semiconductor chip that includes a light receiving portion that receives the light, and a plurality of light incident on the light emitting element. And an optical waveguide sheet that is guided to the light-receiving unit, the optical waveguide sheet extending in a first direction and having a first core formed in a stripe shape by the first cladding A first optical waveguide layer formed by coating, and a second core formed in a stripe shape by being stacked in the first optical waveguide layer and extending in a second direction different from the first direction. A second optical waveguide layer coated with two clads, and having a forward tapered shape in which a cross section parallel to the first direction narrows toward the bottom of the opening at a predetermined portion of the first optical waveguide layer. And an inner wall surface that intersects at a 45 ° angle with respect to a plane perpendicular to the first direction. A first concave portion is formed, and a predetermined tapered portion of the second optical waveguide layer has a forward tapered shape in which a cross section parallel to the second direction becomes narrower toward the bottom of the opening, and is in a plane perpendicular to the second direction. A second recess having an inner wall surface that intersects at an angle of 45 ° is formed, and the inner wall surface of the first recess serves as a mirror surface to transmit light guided in the first core to the second core side. Reflecting and / or splitting the light from the second core side in two and reflecting it in one extending direction and the other extending direction of the first core, and the inner wall surface of the second recess as a mirror surface The light guided in the second core is reflected to the first core side, and / or the light from the first core side is divided into two so that one extension direction of the second core and the other Reflected in the extending direction, the first core or the first core from the light emitting element at a predetermined light incident position The light incident on the core, through said first recess and said second recess and guided in a plurality to emit them to the light receiving portion in the first recess or the second recess.

  In the optoelectronic device of the present invention, light that becomes a clock signal is incident on the first core or the second core from the light emitting element at a predetermined light incident position on the optical waveguide sheet of the present invention. And it is the structure which divides | segments into several through a 2nd recessed part, and guides to a light-receiving part with which the semiconductor chip was equipped in the 1st recessed part or the 2nd recessed part.

  In addition, in order to solve the above-described problem, the optical waveguide sheet manufacturing method of the present invention includes a first clad and a first core embedded in the first clad and extending in the first direction to form a stripe shape. A processing head provided at the tip of the capillary portion at a position to be an end of the first optical waveguide with respect to the first optical waveguide layer in which the first optical waveguide having a shape is formed into a sheet shape, A step of driving the processing head having a first surface and a second surface, wherein the processing head has a first surface and a second surface intersecting at an angle of 45 ° with respect to an axis of symmetry of the processing head; The processing head is released from the layer, the shapes of the first surface and the second surface are transferred to the end of the first optical waveguide, and the forward taper in which the cross section parallel to the first direction becomes narrower toward the bottom of the opening. Shape, in the first direction Forming a first recess having an inner wall surface intersecting at an angle of 45 ° with respect to a straight plane; embedded in the second cladding and the second cladding; and extending in the second direction to form a stripe shape The second optical waveguide having the second core formed in a sheet shape is a position that is an end of the second optical waveguide and corresponds to the first recess. A step of driving the processing head into position, releasing the processing head from the second optical waveguide layer, and transferring the shapes of the first surface and the second surface to an end of the second optical waveguide; Forming a second recess having a forward tapered shape in which a cross section parallel to the second direction becomes narrower toward the bottom of the opening, and having an inner wall surface intersecting at a 45 ° angle with a plane perpendicular to the second direction. And making the first direction different from the second direction, The combined serial first recess and the position of the second recess, and a step of bonding the second optical waveguide layer and said first optical waveguide layer.

In the method of manufacturing an optical waveguide sheet according to the present invention, the first optical waveguide having the first core embedded in the first cladding and the first cladding and extending in the first direction and formed in a stripe shape is formed into a sheet shape. The processing head is provided at the tip of the capillary portion at a position corresponding to the end of the first optical waveguide with respect to the first optical waveguide layer formed into a shape, and the tip of the processing head is symmetrical to the processing head. A machining head having a first surface and a second surface intersecting at an angle of 45 ° with respect to the axis and orthogonal to each other is driven.
Next, the processing head is released from the first optical waveguide layer, the shapes of the first surface and the second surface are transferred to the end of the first optical waveguide, and the cross section parallel to the first direction becomes narrower toward the opening bottom. A first concave portion having a forward taper shape and having an inner wall surface intersecting at an angle of 45 ° with respect to a plane perpendicular to the first direction is formed.
On the other hand, a second optical waveguide having a second core embedded in the second clad and the second clad and having a second core extending in the second direction and formed in a stripe shape is formed into a sheet shape. A machining head is driven into the optical waveguide layer at a position corresponding to the first recess, which is the end of the second optical waveguide.
Next, the processing head is released from the second optical waveguide layer, the shapes of the first surface and the second surface are transferred to the end of the second optical waveguide, and the cross section parallel to the second direction is narrowed toward the bottom of the opening. A second concave portion having a forward taper shape and having an inner wall surface intersecting at an angle of 45 ° with a plane perpendicular to the second direction is formed.
Next, the first optical waveguide layer and the second optical waveguide layer are bonded together by changing the first direction and the second direction so that the positions of the first concave portion and the second concave portion are aligned.

  In order to solve the above-described problems, a method for manufacturing an optoelectronic device according to the present invention includes a first core embedded in a first clad and the first clad, and extending in a first direction and formed in a stripe shape. A processing head provided at a tip of a capillary portion at a position to be an end of the first optical waveguide with respect to a first optical waveguide layer in which the first optical waveguide having a sheet shape is formed, A step of driving the processing head having a first surface and a second surface in which a front end portion of the processing head intersects at an angle of 45 ° with respect to an axis of symmetry of the processing head, and the first optical waveguide layer; The processing head is released from the front, the shape of the first surface and the second surface is transferred to the end of the first optical waveguide, and the cross section parallel to the first direction becomes narrower toward the bottom of the opening. And hangs in the first direction Forming a first recess having an inner wall surface intersecting at an angle of 45 ° with respect to a flat surface, embedded in the second cladding and the second cladding, and extending in the second direction to form a stripe shape. The second optical waveguide layer having the second core is formed into a sheet-like shape, and is a position corresponding to the first recess, the position being the end of the second optical waveguide. The step of driving the processing head, releasing the processing head from the second optical waveguide layer, transferring the shape of the first surface and the second surface to the end of the second optical waveguide, Forming a second recess having a forward tapered shape in which a cross section parallel to the second direction becomes narrower toward the bottom of the opening, and having an inner wall surface intersecting with a plane perpendicular to the second direction at an angle of 45 °; , Different the first direction and the second direction, Aligning the first concave portion and the second concave portion, bonding the first optical waveguide layer and the second optical waveguide layer to form an optical waveguide sheet, and aligning with the light incident position of the optical waveguide sheet; Mounting a light emitting element that emits light serving as a clock signal, and mounting a semiconductor chip including a light receiving portion that receives the light in alignment with the light emitting position of the optical waveguide sheet; Have

  The above-described method for manufacturing an optoelectronic device according to the present invention includes manufacturing an optical waveguide sheet by the method for manufacturing an optical waveguide sheet according to the present invention, and further, at the light incident position of the optical waveguide sheet on the optical waveguide sheet or a predetermined substrate. A light emitting element that emits light that becomes a clock signal is mounted, and a semiconductor chip that includes a light receiving portion that receives the light is mounted by aligning with a light emitting position of the optical waveguide sheet. .

  The optical waveguide sheet of the present invention can maintain a degree of design flexibility that can cope with a design change, and can cope with the production of a small variety of products.

  The optoelectronic device of the present invention can maintain a degree of freedom of design that can cope with a design change, and can cope with the production of a small variety of products.

  The manufacturing method of the optical waveguide sheet of the present invention can maintain the degree of freedom of design so as to cope with the design change, and can be manufactured corresponding to the production of a small variety of products.

  The method for manufacturing an optoelectronic device according to the present invention can maintain a degree of design flexibility that can cope with a design change, and can be manufactured in response to the production of a small variety of products.

  Hereinafter, an optical waveguide sheet according to the present invention, a manufacturing method thereof, and a structure in which a light emitting element that emits light serving as a clock signal and a semiconductor chip having an electronic circuit including a light receiving portion are optically connected by the optical waveguide sheet Embodiments of an optoelectronic device and a method for manufacturing the same will be described with reference to the drawings.

First Embodiment The present embodiment is an optical waveguide sheet that divides a light, which is an incident clock signal, into a plurality of waveguides and emits the light.
FIG. 1A is a plan view of the optical waveguide sheet according to the present embodiment, FIG. 1B is a cross-sectional view taken along the line aa ′ in FIG. 1A, and FIG. It is sectional drawing in bb 'in 1 (a).
Unlike the first direction D ₁ , the first optical waveguide layer 30 formed by covering the first core 30 b formed in a stripe shape extending in the first direction D ₁ with the first cladding 30 a, for example, laminating the second core 31b formed in the second stripes extend in a direction D ₂ of the orthogonal to the second optical waveguide layer 31 formed by coating with a second cladding 31a is, through the adhesive layer 54 Has been.

  Here, at a branch point BR indicated by a circle, a first recess is formed in the first optical waveguide layer 30 and a second recess is formed in the second optical waveguide layer 31. The inner wall surfaces of the first recess and the second recess are mirror surfaces, and the light branching point where the light guided through the first optical waveguide layer is divided into two and guided through the second optical waveguide layer, or The light guided through the second optical waveguide layer is divided into two to form a branching point of the light guided through the first optical waveguide layer.

  The second recess is formed in the second optical waveguide layer 31 also at the light emission position LO indicated by the black circle. The inner wall surface of the second recess is a mirror surface, and the light guided through the second optical waveguide layer 31 is emitted in the out-of-plane direction of the optical waveguide sheet.

Due to the above configuration, the light incident from the light incident position LI is guided through the first optical waveguide WG1 provided in the first optical waveguide layer 30, and the light at the end of the first optical waveguide WG1. At the branch point BR, the light is divided into two from the first optical waveguide WG1 and guided to the second optical waveguide WG2 provided in the second optical waveguide layer 31.
Further, at the branch point BR at one end of the second optical waveguide WG2, the second optical waveguide WG2 is divided into two and guided to the third optical waveguide WG3 provided in the first waveguide layer 30.
On the other hand, at the branch point BR at the other end of the second optical waveguide WG2, the second optical waveguide WG2 is divided into two parts and guided to the fourth optical waveguide WG4 provided in the first waveguide layer 30.
A fifth optical waveguide layer WG5, a sixth optical waveguide layer WG6, which are divided into two at each branch point BR from the third optical waveguide WG3 and the fourth optical waveguide WG4 and provided in the second optical waveguide layer 31, The optical waveguides are guided to the seventh optical waveguide layer WG7 and the eighth optical waveguide layer WG8, respectively, at both ends of the fifth optical waveguide layer WG5, the sixth optical waveguide layer WG6, the seventh optical waveguide layer WG7, and the eighth optical waveguide layer WG8. The light is emitted from a total of eight light emitting positions LO in the out-of-plane direction of the optical waveguide sheet.

Of the branch points, a branch point BR that is divided into two parts from the first optical waveguide layer 30 and guided to the second optical waveguide layer 31 will be described in detail.
2A is a schematic plan view of the branch point BR, FIG. 2B is a schematic cross-sectional view taken along aa ′ in FIG. 2A, and FIG. It is a schematic cross section in bb 'in 2 (a).
At the location that becomes the branch point BR, the first optical waveguide layer 30 has a forward taper shape in which a cross section parallel to the first direction D ₁ narrows toward the bottom of the opening, and is on a plane F ₁ that is perpendicular to the first direction D _1. On the other hand, a V-shaped first recess 30v having an inner wall surface that intersects at an angle of 45 ° (α) is formed.
As the mirror surface MR, the inner wall surface of the first recess 30v configured as described above reflects light guided in the first core 30b toward the second core 31b and / or light from the second core 31b. And is reflected in one extending direction and the other extending direction of the first core 30b.

On the other hand, at a point where the branch point BR, the second optical waveguide layer 31, a cross section parallel to the second direction D ₂ is a forward tapered shape which narrows as open bottom side, a plane perpendicular F in the second direction D ₂ second recess 31v V-shaped having an inner wall surface which intersect at an angle of ₂ 45 ° relative to (alpha) is formed.
The inner wall surface of the second recess 31v configured as described above reflects, as the mirror surface MR, the light guided through the second core 31b to the first core 30b side and / or the light from the first core 30b side. And is reflected in one extending direction and the other extending direction of the second core 31b.

The depth of the first recess 30v reaches at least the lower surface of the first core 30b, for example, reaches the lower surface of the entire first optical waveguide layer 30. The width of the first recess 30v with respect to the direction perpendicular to the first direction D ₁ is wider than the width of the first core 30b, the whole light guided through the first core 30b is reflected on the inner wall surface of the first recess 30v It is the composition to do.
The same applies to the second recess 31v, and at least reaches the lower surface of the second core 31b, for example, reaches the lower surface of the entire second optical waveguide layer 31. The width of the second recess 31v with respect to a direction perpendicular to the second direction D ₂ is wider than the width of the second core 31b, the whole light guided through the second core 31b is reflected on the inner wall surface of the second recess 31v It is the composition to do.

2A to 2C, one of a pair of inner wall surfaces that intersect at an angle of 45 ° (α) with respect to a plane F ₁ perpendicular to the first direction D ₁ of the first recess 30v. The center of the surface and the center of the second recess 31v are aligned.
In this case, as shown in FIG. 2 (a) ~ (c) , the light L guided to the branch point BR direction in the first core 30b is a plane perpendicular F in a first direction D ₁ of the first recess 30v ₁ is reflected toward the second core 31b on one surface of the pair of inner wall surfaces intersecting at an angle of 45 ° with respect to 1, and further on a plane F ₂ perpendicular to the second direction D ₂ of the second recess 31 On the other hand, a pair of inner wall surfaces intersecting at an angle of 45 ° are divided into two and reflected in one extending direction and the other extending direction of the second core 31b, and are guided in the second core 31b.

As described above, the branch point BR is configured by the combination of the first recess 30v and the second recess 31v, but when only one of the first recess 30v and the second recess 31v is formed, A light emission position LO for emitting light guided in the first core 30b or the second core 31b in the out-of-plane direction of the optical waveguide sheet is configured.
Since the light emission position LO in FIG. 1A is provided in the second optical waveguide layer 31, it is constituted by the second recess 31v.

  Since the first recess 30v and the second recess 31v serving as the branch point BR and the light emission position LO having the above-described configuration are formed at predetermined positions, the first core 30b or the second core from the predetermined light incident position LI. The light incident on 31b is divided into a plurality of parts through the first concave portion 30v and the second concave portion 31v and guided, and is emitted in the out-of-plane direction of the optical waveguide sheet at the first concave portion 30v or the second concave portion 31v. It has become.

In the optical waveguide sheet according to the above-described embodiment, the distance for guiding light from the light incident position to the position where the light is emitted to the outside of the optical waveguide sheet is further divided in multiple paths. Are also equal distances.
As described above, by making the optical wiring for supplying the clock a completely equal length wiring, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving portions.

Next, a method for forming the first recess and the second recess having the above-described configuration will be described.
FIG. 3A is a schematic perspective view of a processing head portion of a processing apparatus provided with a processing head for forming a first concave portion and a second concave portion whose inner wall surface is a mirror surface of the optical waveguide sheet.
A processing head 1 is formed at the tip of a substantially cylindrical capillary 2, and the end of the capillary 2 opposite to the processing head 1 is held by a capillary holding unit 3.

FIG. 3B is a side view of the machining head according to the present embodiment, and FIG. 3C is a side view from the side orthogonal to FIG. 3B.
The tip of the processing head 1 has a first surface 1a and a second surface 1b that intersect the symmetry axis AX of the processing head 1 at a predetermined angle α (45 °) and are orthogonal to each other.
When the above-described processing head is driven into the end portion of the optical waveguide with respect to the optical waveguide sheet in which the optical waveguide having the clad and the core embedded in the clad is formed into a sheet shape, The shape of the first surface 1a and the second surface 1b is transferred to the end portion to form a mirror surface.

The processing head of the above-described embodiment preferably includes a heating unit that heats the processing head.
In the processing of the optical waveguide sheet, for example, when the optical waveguide sheet is made of a thermoplastic material, it is possible to soften the optical waveguide sheet by applying heat and to facilitate the processing. Alternatively, for example, when the optical waveguide sheet is made of a thermosetting material, it can be cured by applying heat so as to maintain the processed shape. In any case, the heating temperature is not higher than the thermal decomposition temperature of the optical waveguide sheet material.

  The processing head 1 is preferably made of ceramics such as alumina, aluminum nitride, silicon carbide, boron nitride, artificial minerals such as sapphire, ruby and diamond, metals and metal alloys such as stainless steel, tungsten and titanium, So-called super steel alloys such as tungsten, titanium, aluminum, silicon, tantalum and other carbides, nitrides, carbonitrides, etc., and those super steel alloys added with additives such as cobalt, nickel, chromium, molybdenum, etc. It is composed of

The length L projected onto the symmetry axis AX of the first surface 1a and the second surface 1b is set to be greater than the thickness to be processed of the optical waveguide sheet processed by the processing head 1, and at least the thickness to the lower surface of the core. For example, it is the thickness of the entire optical waveguide sheet.
Further, the width W of the first surface 1 a and the second surface 1 b is set to be equal to or larger than the width of the core in the optical waveguide sheet processed by the processing head 1.

A method of forming the first recess in the first optical waveguide layer using the above processing head will be described.
First, as a processed optical waveguide sheet, as shown in FIG. 4A, a release layer 51 is formed on a dummy substrate 50 such as silicon or glass, and then a first optical waveguide layer 30 is formed thereon. . That is, after applying a clad material on the release layer 51 and performing a curing process, the core material is applied, processed into a predetermined pattern by pattern exposure and development processes, and then the clad material is applied again and planarized. Process into a sheet.
As described above, the first clad 30a having the first refractive index and the first clad 30a are covered with the first clad 30a and have a pattern extending in the optical waveguide direction, for example, in a stripe shape, which is higher than the first refractive index. A first optical waveguide layer 30 having a first core 30b having a second refractive index and formed into a sheet shape is formed.
As the release layer 51, a thermoplastic resin, a titanium / copper laminate having poor adhesion to the resin material constituting the optical waveguide sheet, a silicon oxide film dissolved in a specific acid, or the like can be used.

The first optical waveguide layer is transparent to the wavelength of light used, and is made of, for example, an organic material such as polyimide resin, polyolefin resin, polynorbornene resin, acrylic resin, epoxy resin, or fluorides thereof. ing.
Further, as the first core 30b, for example, assuming multimode propagation, the thickness and width of the first core 30b are approximately 5 to 50 μm, and the thickness of the second cladding 30a is 1/4 to 1 of the core 30b. / 2 is appropriate.

Next, as shown in FIG. 4 (b), the position of the end of the optical waveguide and the processing head are aligned with the first optical waveguide layer configured as described above, and a predetermined force is applied. Then, the machining head 1 having the above configuration is driven. At this time, the processing head is driven so as to reach, for example, the release layer 51 below the first optical waveguide layer 30 so that at least the tip of the processing head 1 reaches the lower surface of the first core 30b.
At this time, a processing residue (burr) 30c is pushed out from a portion processed by the processing head 1 depending on circumstances.

  Next, as shown in FIG. 4C, the processing head 1 is released from the first optical waveguide layer 30, and the shapes of the first surface 1a and the second surface 1b of the processing head 1 are transferred to the ends of the optical waveguide. Thus, the first recess 30v is formed. The inner wall surface of the first recess 30v becomes the mirror surface MR.

Next, for example, the surface of the first optical waveguide layer is lapped on the polishing sheet face down to remove the processing residue 30c as shown in FIG. Further, since a residue may be generated on the used processing head, the residue is removed by scrubbing using a dummy processing substrate as necessary.
As described above, the first recess can be formed in the first optical waveguide layer using the processing head.
The step of forming the second recess in the second optical waveguide layer can be performed in the same manner as described above.

In the step of driving the processing head into the position to be the end of the optical waveguide, for example, the first optical waveguide layer is held at a predetermined temperature by a lower heater (not shown), and the processing head is heated by a heating means (not shown). While heating to a predetermined temperature.
In the processing of the first optical waveguide layer, for example, when the first optical waveguide layer is made of a thermoplastic material, the optical waveguide sheet can be softened by applying heat to facilitate processing. Alternatively, for example, when the first optical waveguide layer is made of a thermosetting material, it can be cured by applying heat so as to keep the processed shape. In any case, the heating temperature of the processing head is set to be equal to or lower than the thermal decomposition temperature of the material of the first optical waveguide layer.

The processing apparatus using the above processing head can be obtained by diverting the bonding wire device, that is, it can be obtained by changing the head of the bonding wire device to the processing head of this embodiment.
When forming a mirror surface on the first optical waveguide layer using this processing apparatus, it is possible to set and input the coordinates of the processing point by the processing head in advance, regardless of the location and orientation on the optical waveguide. The mirror surface can be formed at a high speed at the location. The processing speed at this time is substantially equal to the bonding speed of wire bonding, and processing of about 5 to 10 points per second is possible.

Next, a method for manufacturing the optical waveguide sheet according to this embodiment will be described.
First, a first optical waveguide layer is formed.
First, as shown in FIG. 5A, a laminate of a titanium layer and a copper layer is formed on the surface of a dummy substrate 50 made of silicon or glass by, for example, electron beam evaporation or sputtering, and then peeled off. Layer 51 is assumed. Alternatively, the peeling layer 51 can be formed by forming a silicon oxide layer by a CVD (Chemical Vapor Deposition) method or a sputtering method. In this case, the dummy substrate 50 uses silicon or the like.

  Next, as shown in FIG. 5B, a resin layer having a first refractive index such as polyimide resin is formed by spin coating or printing, for example, and cured by curing to form the first cladding 30a. .

Next, as shown in FIG. 5C, a photosensitive resin layer having a second refractive index higher than the first refractive index, such as photosensitive polyimide, is formed, and exposure is performed using a patterning mask. Then, development and curing are further performed to form the stripe-shaped first core 30b.
For example, assuming multi-mode propagation, the thickness and width of the first core 30b are about 5 to 50 μm, and the thickness of the first cladding 30a is about 1/4 to 1/2 of the first core 30b.

Next, as shown in FIG. 6A, in the same manner as described above, for example, a resin layer having a first refractive index such as polyimide resin is formed by spin coating or printing, and heat reflow is performed as necessary. Curing is performed and cured to form the first cladding 30a.
In this way, the first optical waveguide layer 30 formed in a sheet shape is formed by covering the outer periphery of the first core 30b with the first cladding 30a.
FIG. 6B shows a cross section parallel to the extending direction of the core in the state of FIG. 6A, which is a cross section in a direction orthogonal to FIG. 6A, and the subsequent steps are cross sections in this direction. Follow along.

Next, as shown in FIG. 7A, the first light guide is used in the same manner as the steps shown in FIGS. 4A to 4D using the machining head 1 shown in FIGS. 3A to 3C. The position of the end of the optical waveguide and the processing head are aligned with the wave layer 30 and a predetermined force is applied to drive the processing head 1. At this time, the processing head is driven so as to reach, for example, the release layer 51 below the first optical waveguide layer so that at least the tip of the processing head 1 reaches the lower surface of the first core 30b.
By releasing the processing head 1 from the first optical waveguide layer 30, the shapes of the first surface 1a and the second surface 1b of the processing head 1 are transferred to the end portion of the optical waveguide to form the first recess 30v. The wall surface of the first recess 30v becomes the mirror surface MR.

  In the step of forming the first recess 30v, a processing residue (burr) is generated by being pushed out from a portion processed by the processing head 1, so that the optical waveguide sheet can be face-down, for example, on the polishing sheet as necessary. Surface lapping is performed to remove processing residues.

Next, as shown in FIG. 7B, a heat release sheet 52 that has adhesiveness and can be peeled off at a specific temperature is bonded to the surface of the first optical waveguide layer 30.
The thermal release sheet 52 is configured, for example, by dispersing foamed capsules in an adhesive on a PET film. For example, River Alpha manufactured by Nitto Denko Corporation can be used. For example, the PET film can be easily removed by heating to 70 ° C. to 150 ° C.

Next, as shown in FIG. 7C, for example, when a laminate of a titanium layer and a copper layer is used as the release layer 51, the first supported by the thermal release sheet 52 in an acid such as hydrochloric acid. The optical waveguide layer 30 is immersed and peeled off at the interface between the release layer 51 and the first cladding 30 a of the first optical waveguide layer 30.
Alternatively, when a silicon oxide layer is used as the release layer 51, the first optical waveguide layer 30 supported by the thermal release sheet 52 is immersed in an acid such as hydrofluoric acid or buffered hydrofluoric acid, and the release is performed. The layer 51 is dissolved and the first optical waveguide layer 30 is peeled off.
Thus, the first optical waveguide layer 30 held on the heat release sheet 52 is obtained.
Separately, by the same process as described above, the second optical waveguide layer 31 that is held on the heat release sheet and has the second recesses is formed.

  Next, as shown in FIG. 8 (a), the first optical waveguide layer 30 and the second optical waveguide layer obtained as described above are bonded to an adhesive sheet transparent to the wavelength of light used ( The first concave portion 30v and the second concave portion 31v are bonded to each other through the adhesive layer) 54 while being aligned.

Next, as shown in FIG. 8B, the thermal release sheet (52, 53) is released to obtain an optical waveguide sheet in which the first optical waveguide layer 30 and the second optical waveguide layer 31 are laminated.
However, since the optical waveguide sheet having the above structure is thin and has poor handleability as a single unit, at least one of the heat release sheets is left until the stage of actual use, such as transfer to a mounting substrate. You can leave.

According to the method for manufacturing an optical waveguide sheet according to the present embodiment, if the first optical waveguide layer and the second optical waveguide layer are manufactured in advance, the first concave portion and the second concave portion are respectively formed, Even if the manufacturing is completed simply by bonding together and the design of the LSI itself is changed, it is possible to deal with LSIs with different types of specifications each time. It can be easily maintained, and can be manufactured easily corresponding to the production of a small variety of products.
In particular, by using a completely equal length wiring for the optical wiring for supplying the clock, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving portions.
As described above, it is possible to develop an LSI that suppresses the skew by suppressing the manufacturing cost and shortening the development period and TAT.

  In the method of manufacturing the optical waveguide sheet according to the above-described embodiment, the example in which the optical waveguide layer serving as the base is sequentially manufactured on a dummy substrate such as silicon has been shown. Of course, the base polyimide film is rolled. The core material is prepared by coating and patterning using, for example, the Roll to Roll process, and batch manufacturing is also possible. By doing so, a significant cost reduction can be realized.

Second Embodiment FIG. 9A is a plan view of an optoelectronic device which is a multichip module according to this embodiment.
For example, an optical waveguide sheet WS similar to that of the first embodiment is formed on one surface of a mounting substrate BD having a configuration in which four layers of patterned wiring layers and resin insulating layers are alternately laminated by an adhesive layer (not shown). It is pasted together. A pad opening PO for mounting a semiconductor chip is provided through the optical waveguide sheet and an adhesive layer (not shown). The pad opening PO can be provided at any place where the optical signal of the optical waveguide sheet does not guide. The mounting substrate BD is also referred to as a package interposer. It is a so-called FR-4 substrate, FR-5 substrate, BT-resin substrate, polyimide substrate, or any other organic wiring substrate, or ceramic such as alumina or glass ceramic A substrate can be used.
In addition, a laser diode LD that is a light emitting element that emits light as a clock signal and a driver DR thereof are mounted on the mounting substrate BD in alignment with the light incident position on the side of the optical waveguide sheet WS.
Furthermore, four semiconductor chips (CP1 to CP4) incorporating PIN-PD (PD), which is a light receiving element, match the light emitting position of the optical waveguide sheet WS and the position of the light receiving element via the optical waveguide sheet WS. In addition, the bump BP is mounted on the mounting substrate BD so as to be fitted into the pad opening PO. Each semiconductor chip (CP1 to CP4) incorporates a simple amplifier in addition to the light receiving element, and is configured to demodulate the optical clock signal into an electrical clock signal.

The optical waveguide sheet WS has the same configuration as that of the first embodiment.
A first optical waveguide layer formed by covering a first core formed in a stripe shape extending in a first direction with a first cladding; and extending in a second direction different from the first direction in a stripe shape A second optical waveguide layer formed by covering the formed second core with the second cladding is laminated via an adhesive layer. A first recess is formed in the first optical waveguide layer, and a second recess is formed in the second optical waveguide layer at a position where the light branch point BR or the light emission position LO is. The inner wall surfaces of these first and second recesses are mirror surfaces.
The light L incident from the light incident position LI repeats five branches at a plurality of branch points BR, and is emitted in the out-of-plane direction of the optical waveguide sheet WS from 2 5 = 32 light emitting positions LO. The light enters the PIN-PD (PD) incorporated in the semiconductor chips (CP1 to CP4).

  In the above optical waveguide sheet, the distance for guiding light from the light incident position to the position where the light is emitted to the outside of the optical waveguide sheet is the same distance in any of the paths that are divided and guided multiple times. By making the optical wiring for supplying the clock a completely equal length wiring, it is possible to substantially suppress the skew when the clock signal is distributed to the plurality of light receiving portions.

As a method for manufacturing the optoelectronic device according to the present embodiment, for example, the optical waveguide sheet WS is bonded to one surface of the mounting substrate BD with an adhesive layer, and the pad openings PO are formed as necessary. This pad opening can be formed by providing a receiving land at a desired position on the mounting substrate, irradiating a laser such as CO ₂ or excimer after bonding the optical waveguide sheet. The land of the mounting board at this time acts as a stopper for the laser beam.
Next, the laser diode LD and the driver DR are mounted on the side portion of the optical waveguide sheet WS, and further, as shown in the sectional view of FIG. The semiconductor chips (CP1 to CP4) are mounted by aligning the light emitting position of the optical waveguide sheet WS and the position of the light receiving element through the optical waveguide sheet WS and fitting the bumps BP to the pad openings PO. To do.

According to the optoelectronic device and the manufacturing method thereof according to the present embodiment, if the first optical waveguide layer and the second optical waveguide layer are manufactured in advance, the first concave portion and the second concave portion are respectively formed and pasted. Even if the manufacturing is completed simply by combining them and the design of the LSI itself is changed, it is possible to deal with LSIs with different types of specifications each time, keeping the design flexibility to cope with design changes. It is possible to manufacture easily in correspondence with the production of a small variety of products.
Furthermore, by making the optical wiring for supplying the clock a completely equal length wiring, the skew when distributing the clock signal to the plurality of light receiving portions can be substantially suppressed.
As described above, it is possible to develop an LSI that suppresses the skew by suppressing the manufacturing cost and shortening the development period and TAT.

Third Embodiment FIG. 10 is a plan view of an optoelectronic device which is a multichip module according to this embodiment.
Although substantially the same as that of the second embodiment, the light emitting element that emits light that is a clock signal is not a Fabry-Perot type, but a surface emitting laser VCSEL, and the first branch point BR in the optical waveguide sheet WS. Is mounted so that the light emitted from the light emitting element is uniformly incident on the branch point BR, and the driver DR is also disposed in the vicinity of the surface emitting laser VCSEL.
The optoelectronic device according to this embodiment can also be manufactured in the same manner as in the second embodiment.

According to the optoelectronic device and the manufacturing method thereof according to the present embodiment, if the first optical waveguide layer and the second optical waveguide layer are manufactured in advance, the first concave portion and the second concave portion are respectively formed and pasted. Even if the manufacturing is completed simply by combining them and the design of the LSI itself is changed, it is possible to deal with LSIs with different types of specifications each time, keeping the design flexibility to cope with design changes. It is possible to manufacture easily in correspondence with the production of a small variety of products.
Furthermore, by making the optical wiring for supplying the clock a completely equal length wiring, the skew when distributing the clock signal to the plurality of light receiving portions can be substantially suppressed.
As described above, it is possible to develop an LSI that suppresses the skew by suppressing the manufacturing cost and shortening the development period and TAT.

Fourth Embodiment FIG. 11 is a sectional view of an optoelectronic device which is a single chip module according to this embodiment.
Substantially the same as in the second embodiment, but only one semiconductor chip CP is mounted, mounted face-up instead of face-down (flip chip), and connected to the mounting substrate BD by wire bonding WB. Is different.
As the laser light to be guided, those having various wavelengths can be used. For example, light having a wavelength smaller than the band gap of silicon, specifically, light having a wavelength of 1 μm or more, It is possible to pass through the silicon substrate. In this case, light that becomes a clock signal can be incident from the back surface of the silicon substrate.
In the present embodiment shown in FIG. 11, the semiconductor chip CP is mounted face-up on the optical waveguide sheet WS, and the light that becomes the clock signal emitted from the desired position is transmitted through the silicon substrate constituting the semiconductor chip CP. The semiconductor chip CP is photoelectrically converted in a PIN-PD (PD), further amplified by an amplifier in the semiconductor chip, and converted into an electric clock.
The optoelectronic device according to this embodiment can also be manufactured in the same manner as in the second embodiment by performing a wire bonding process or the like.

According to the optoelectronic device and the manufacturing method thereof according to the present embodiment, if the first optical waveguide layer and the second optical waveguide layer are manufactured in advance, the first concave portion and the second concave portion are respectively formed and pasted. Even if the manufacturing is completed simply by combining them and the design of the LSI itself is changed, it is possible to deal with LSIs with different types of specifications each time, keeping the design flexibility to cope with design changes. It is possible to manufacture easily in correspondence with the production of a small variety of products.
Furthermore, by making the optical wiring for supplying the clock a completely equal length wiring, the skew when distributing the clock signal to the plurality of light receiving portions can be substantially suppressed.
As described above, it is possible to develop an LSI that suppresses the skew by suppressing the manufacturing cost and shortening the development period and TAT.

The present invention is not limited to the above description.
For example, the number of branches provided in the optical waveguide sheet is not particularly limited.
As a light emitting element mounted on the optoelectronic device, a light emitting diode can be used in addition to a laser diode such as a surface emitting laser.
In addition, various modifications can be made without departing from the scope of the present invention.

  The optical waveguide sheet of the present invention can be applied to an optical waveguide sheet that distributes light serving as a clock signal and optically connects a light emitting element and a light receiving unit.

  The optoelectronic device of the present invention can be applied to an optoelectronic device having a configuration in which a light emitting element that emits light serving as a clock signal and a semiconductor chip having an electronic circuit including a light receiving portion are optically connected by an optical waveguide sheet.

  The method for manufacturing an optical waveguide sheet of the present invention can be applied to a method for manufacturing an optical waveguide sheet that distributes light serving as a clock signal and optically connects a light emitting element and a light receiving unit.

  The method of manufacturing an optoelectronic device according to the present invention manufactures an optoelectronic device having a configuration in which a light emitting element that emits light serving as a clock signal and a semiconductor chip having an electronic circuit including a light receiving portion are optically connected by an optical waveguide sheet. Applicable to.

FIG. 1A is a plan view of the optical waveguide sheet according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the line aa ′ in FIG. c) is a cross-sectional view taken along line bb ′ in FIG. 2A is a schematic plan view of a branch point in FIG. 1A, FIG. 2B is a schematic cross-sectional view along aa ′ in FIG. 2A, and FIG. ) Is a schematic cross-sectional view taken along line bb ′ in FIG. FIG. 3A is a schematic perspective view of a machining head portion of a machining apparatus provided with the machining head used in the first embodiment of the present invention, and FIG. 3B is a side view of this machining head. FIG. 3 (c) is a side view from the side orthogonal to FIG. 3 (b). 4A to 4D are cross-sectional views showing a process of forming the first recess in the optical waveguide sheet according to the first embodiment of the present invention. 5A to 5C are cross-sectional views showing the steps of the manufacturing method of the optoelectronic device manufacturing method according to the first embodiment of the present invention. 6 (a) and 6 (b) are cross-sectional views showing the steps of the method of manufacturing the optoelectronic device according to the first embodiment of the present invention. FIGS. 7A to 7C are cross-sectional views showing the steps of the optoelectronic device manufacturing method according to the first embodiment of the present invention. FIG. 8A and FIG. 8B are cross-sectional views showing the steps of the optoelectronic device manufacturing method according to the first embodiment of the present invention. FIG. 9A is a plan view of the optoelectronic device according to the second embodiment of the present invention, and FIG. 9B is a cross-sectional view showing the steps of the manufacturing method. FIG. 10 is a plan view of an optoelectronic device according to a third embodiment of the present invention. FIG. 11 is a sectional view of an optoelectronic device according to a fourth embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Processing head, 1a ... 1st surface, 1b ... 2nd surface, 2 ... Capillary part, 3 ... Capillary holding part, 30 ... 1st optical waveguide layer, 30a ... 1st clad, 30b ... 1st core, 30c ... Processing residue, 30v ... first recess, 31 ... second optical waveguide layer, 31a ... second cladding, 31b ... second core, 31v ... second recess, 50 ... dummy substrate, 51 ... release layer, 52, 53 ... heat Release sheet, 54 ... adhesive layer, AX ... axis of symmetry, LI ... light incident position, BR ... branch point, LO ... light exit position, WG1 to WG8 ... optical waveguide, MR ... mirror surface, L ... light, LD ... laser diode , DR ... driver, CP1 to CP4 ... semiconductor chip, WS ... optical waveguide sheet, PO ... pad opening, BD ... mounting substrate, VCSEL ... surface emitting laser, WB ... wire bonding

Claims (14)

An optical waveguide sheet that divides and guides light that is an incident clock signal and emits the light,
A first optical waveguide layer formed by covering a first core formed in a stripe shape extending in a first direction with a first cladding;
A second optical waveguide formed by laminating the first optical waveguide layer and extending in a second direction different from the first direction and covering the second core formed in a stripe shape with a second cladding. Layers,
Have
A predetermined tapered portion of the first optical waveguide layer has a forward tapered shape in which a cross section parallel to the first direction becomes narrower toward the bottom of the opening, and intersects a plane perpendicular to the first direction at an angle of 45 °. A first recess having an inner wall surface is formed;
A predetermined tapered portion of the second optical waveguide layer has a forward tapered shape in which a cross section parallel to the second direction becomes narrower toward the bottom of the opening, and intersects a plane perpendicular to the second direction at an angle of 45 °. A second recess having an inner wall surface is formed,
The inner wall surface of the first recess serves as a mirror surface to reflect light guided in the first core toward the second core side and / or divide the light from the second core side into two. Reflected in one stretching direction and the other stretching direction of the first core,
The inner wall surface of the second recess serves as a mirror surface to reflect light guided in the second core toward the first core and / or divide the light from the first core into two parts Reflected in one stretching direction and the other stretching direction of the second core,
Light incident on the first core or the second core from a predetermined light incident position is divided into a plurality of waves through the first recess and the second recess, and guided to the first recess or the second core. An optical waveguide sheet that emits in the out-of-plane direction of the optical waveguide sheet in the recess. In the optical waveguide sheet, a distance for guiding the light from the light incident position to a position where the light is emitted to the outside of the optical waveguide sheet is an equal distance in any of the paths that are divided and guided multiple times. Item 4. The optical waveguide sheet according to Item 1. A light emitting element that emits light as a clock signal;
A semiconductor chip including a light receiving portion for receiving the light;
The light is incident and divided into a plurality of waveguides, and has an optical waveguide sheet that is emitted to the light receiving unit, and
The optical waveguide sheet is
A first optical waveguide layer formed by covering a first core formed in a stripe shape extending in a first direction with a first cladding;
A second optical waveguide formed by laminating the first optical waveguide layer and extending in a second direction different from the first direction and covering the second core formed in a stripe shape with a second cladding. Layers,
Have
A predetermined tapered portion of the first optical waveguide layer has a forward tapered shape in which a cross section parallel to the first direction becomes narrower toward the bottom of the opening, and intersects a plane perpendicular to the first direction at an angle of 45 °. A first recess having an inner wall surface is formed;
A predetermined tapered portion of the second optical waveguide layer has a forward tapered shape in which a cross section parallel to the second direction becomes narrower toward the bottom of the opening, and intersects a plane perpendicular to the second direction at an angle of 45 °. A second recess having an inner wall surface is formed,
The inner wall surface of the first recess serves as a mirror surface to reflect light guided in the first core toward the second core side and / or divide the light from the second core side into two. Reflected in one stretching direction and the other stretching direction of the first core,
The inner wall surface of the second recess serves as a mirror surface to reflect light guided in the second core toward the first core and / or divide the light from the first core into two parts Reflected in one stretching direction and the other stretching direction of the second core,
The light incident on the first core or the second core from the light emitting element at a predetermined light incident position is divided into a plurality of waves through the first concave portion and the second concave portion, and is guided. Or the optoelectronic device which radiate | emits to the said light-receiving part in the said 2nd recessed part. 4. In the optical waveguide sheet, a distance for guiding the light from the light incident position to a position where the light is emitted to the light receiving unit is the same distance in any of the paths that are divided and guided multiple times. The optoelectronic device as described. For a first optical waveguide layer in which a first optical waveguide having a first core embedded in the first cladding and the first cladding and extending in the first direction and formed in a stripe shape is formed into a sheet shape A processing head provided at the tip of the capillary portion at a position to be an end of the first optical waveguide, wherein the tip of the processing head is at an angle of 45 ° with respect to the symmetry axis of the processing head. Driving the processing head having a first surface and a second surface intersecting and orthogonal to each other;
The processing head is released from the first optical waveguide layer, the shapes of the first surface and the second surface are transferred to the end of the first optical waveguide, and the cross section parallel to the first direction is the bottom of the opening. Forming a first recess having a forward tapered shape that narrows toward the side and having an inner wall surface intersecting at a 45 ° angle with respect to a plane perpendicular to the first direction;
A second optical waveguide layer formed by forming a second optical waveguide having a second core embedded in the second cladding and the second cladding and extending in the second direction into a stripe shape into a sheet shape. A step of driving the processing head into a position corresponding to the first recess, which is a position to be an end of the second optical waveguide;
The processing head is released from the second optical waveguide layer, the shape of the first surface and the second surface is transferred to the end of the second optical waveguide, and the cross section parallel to the second direction is the bottom of the opening Forming a second recess having a forward taper shape that narrows toward the side and having an inner wall surface intersecting at a 45 ° angle with respect to a plane perpendicular to the second direction;
Differentiating the first direction and the second direction, aligning the positions of the first concave portion and the second concave portion, and bonding the first optical waveguide layer and the second optical waveguide layer. Manufacturing method of optical waveguide sheet. The inner wall surface of the first recess serves as a mirror surface to reflect light guided in the first core toward the second core side and / or divide the light from the second core side into two. Reflected in one stretching direction and the other stretching direction of the first core,
The inner wall surface of the second recess serves as a mirror surface to reflect light guided in the second core toward the first core and / or divide the light from the first core into two parts Reflected in one stretching direction and the other stretching direction of the second core,
Light incident on the first core or the second core from a predetermined light incident position is divided into a plurality of waves through the first recess and the second recess, and guided to the first recess or the second core. The method for manufacturing an optical waveguide sheet according to claim 5, wherein the optical waveguide sheet is configured to emit light in an out-of-plane direction of the optical waveguide sheet in the recess. In the step of forming the optical waveguide sheet, a distance for guiding the light from the light incident position to a position where the light is emitted to the light receiving unit is equal in any of the paths that are divided and guided multiple times. The method for manufacturing an optical waveguide sheet according to claim 5, wherein the first recess and the second recess are formed at such positions. The method for manufacturing an optical waveguide sheet according to claim 5, wherein the processing head is heated while the processing head is driven into the first optical waveguide layer and the processing head is driven into the second optical waveguide layer. The method for manufacturing an optical waveguide sheet according to claim 5, wherein the first optical waveguide layer and the second optical waveguide layer are made of a thermoplastic material. The method for manufacturing an optical waveguide sheet according to claim 5, wherein the first optical waveguide layer and the second optical waveguide layer are made of a thermosetting material. The method for producing an optical waveguide sheet according to claim 5, wherein a machining head made of ceramic, artificial mineral, metal, metal alloy, super steel metal, or alloy thereof is used as the machining head. For a first optical waveguide layer in which a first optical waveguide having a first core embedded in the first cladding and the first cladding and extending in the first direction and formed in a stripe shape is formed into a sheet shape A processing head provided at the tip of the capillary portion at a position to be an end of the first optical waveguide, wherein the tip of the processing head is at an angle of 45 ° with respect to the symmetry axis of the processing head. Driving the processing head having a first surface and a second surface intersecting and orthogonal to each other;
The processing head is released from the first optical waveguide layer, the shapes of the first surface and the second surface are transferred to the end of the first optical waveguide, and the cross section parallel to the first direction is the bottom of the opening. Forming a first recess having a forward taper shape that narrows toward the side and having an inner wall surface intersecting at a 45 ° angle with respect to a plane perpendicular to the first direction;
A second optical waveguide layer formed by forming a second optical waveguide having a second core embedded in the second cladding and the second cladding and extending in the second direction into a stripe shape into a sheet shape. A step of driving the processing head into a position corresponding to the first recess, which is a position to be an end of the second optical waveguide;
The processing head is released from the second optical waveguide layer, the shape of the first surface and the second surface is transferred to the end of the second optical waveguide, and the cross section parallel to the second direction is the bottom of the opening Forming a second recess having a forward taper shape that narrows toward the side and having an inner wall surface intersecting at a 45 ° angle with respect to a plane perpendicular to the second direction;
An optical waveguide sheet in which the first optical waveguide layer and the second optical waveguide layer are bonded together by making the first direction different from the second direction, aligning the positions of the first concave portion and the second concave portion And a process of
Mounting the light emitting element that emits the light that becomes the clock signal in alignment with the light incident position of the optical waveguide sheet;
Mounting a semiconductor chip provided with a light receiving portion for receiving the light in alignment with the light emitting position of the optical waveguide sheet. In the step of forming the optical waveguide sheet,
The inner wall surface of the first recess serves as a mirror surface to reflect light guided in the first core toward the second core side and / or divide the light from the second core side into two. Reflected in one stretching direction and the other stretching direction of the first core,
The inner wall surface of the second recess serves as a mirror surface to reflect light guided in the second core toward the first core and / or divide the light from the first core into two parts Reflected in one stretching direction and the other stretching direction of the second core,
Light incident on the first core or the second core from a predetermined light incident position is divided into a plurality of waves through the first recess and the second recess, and guided to the first recess or the second core. The method of manufacturing an optoelectronic device according to claim 12, wherein an optical waveguide sheet configured to emit light to the light receiving portion is formed in the concave portion. In the step of forming the optical waveguide sheet, a distance for guiding the light from the light incident position to a position where the light is emitted to the light receiving unit is equal in any of the paths that are divided and guided multiple times. The method for manufacturing an optoelectronic device according to claim 12, wherein the first recess and the second recess are formed at such positions.

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