JP2000298216A - Optical-electric wiring substrate and manufacture therefor, and mounting substrate - Google Patents
Optical-electric wiring substrate and manufacture therefor, and mounting substrateInfo
- Publication number
- JP2000298216A JP2000298216A JP10529599A JP10529599A JP2000298216A JP 2000298216 A JP2000298216 A JP 2000298216A JP 10529599 A JP10529599 A JP 10529599A JP 10529599 A JP10529599 A JP 10529599A JP 2000298216 A JP2000298216 A JP 2000298216A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- substrate
- hole
- core
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Optical Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光配線と電気配線
とが混在する光・電気配線基板及びその製造方法並びに
その基板に光部品と電気部品とを実装した実装基板に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical / electrical wiring board in which optical wiring and electric wiring are mixed, a method of manufacturing the same, and a mounting board on which an optical component and an electric component are mounted.
【０００２】[0002]
【従来の技術】より速く演算処理が行えるコンピュータ
を作るために、ＣＰＵのクロック周波数は益々増大する
傾向にあり、現在では１ＧＨｚオーダーのものが出現す
るに至っている。この結果、コンピュータの中のプリン
ト基板上の銅による電気配線には高周波電流が流れる部
分が存在することになるので、ノイズの発生により誤動
作が生じたり、また電磁波が発生して周囲に悪影響を与
えることにもなる。2. Description of the Related Art In order to make a computer capable of performing arithmetic processing faster, the clock frequency of a CPU tends to increase more and more, and a clock frequency of the order of 1 GHz has come to the present. As a result, there is a portion where a high-frequency current flows in the electric wiring made of copper on the printed circuit board in the computer, so that malfunction occurs due to generation of noise, and electromagnetic waves are generated, which adversely affects the surroundings. It will also be.
【０００３】このような問題を解決するために、プリン
ト基板上の銅による電気配線の一部を光ファイバー又は
光導波路による光配線に置き換え、電気信号の代わりに
光信号を利用することが行われている。なぜなら、光信
号の場合は、ノイズ及び電磁波の発生を抑えられるから
である。In order to solve such a problem, a part of copper electric wiring on a printed circuit board is replaced with an optical fiber or an optical waveguide and an optical signal is used instead of an electric signal. I have. This is because, in the case of an optical signal, generation of noise and electromagnetic waves can be suppressed.
【０００４】高密度実装又は小型化の観点からは、電気
配線と光配線とが同一の基板上で積み重なっている光・
電気配線基板を作ることが望ましい。特開平６−２２２
２３０号の実施例には、光配線を多層化することによっ
て、高密度実装又は小型化を実現すると同時に、複数の
光配線を立体的に交差させて複雑な光配線を実現した光
・電気配線基板が記載されている。[0004] From the viewpoint of high-density mounting or miniaturization, optical and optical wiring are stacked on the same substrate.
It is desirable to make an electrical wiring board. JP-A-6-222
In the embodiment of No. 230, the optical wiring is multilayered to realize high-density mounting or miniaturization, and at the same time, a plurality of optical wirings are three-dimensionally crossed to realize a complicated optical wiring. A substrate is described.
【０００５】しかし、特開平６−２２２２３０号の実施
例は、光配線を基板の一面に多層化したものであり、そ
の面にのみ光部品を実装できるに過ぎない。より高密度
実装又は小型化を行うためには、基板の両面に光部品を
実装できることが望ましい。However, in the embodiment of Japanese Patent Application Laid-Open No. 6-222230, the optical wiring is multi-layered on one surface of the substrate, and the optical component can be mounted only on that surface. In order to achieve higher density mounting or downsizing, it is desirable that optical components can be mounted on both sides of the substrate.
【０００６】[0006]
【発明が解決しようとする課題】本発明は係る従来技術
の状況に鑑みてなされたもので、複雑な光配線が施され
ているだけでなく、両面に光部品が実装できる光・電気
配線基板を提供することを課題とする。SUMMARY OF THE INVENTION The present invention has been made in view of the state of the prior art, and has an optical / electrical wiring board on which not only complicated optical wiring is provided but also optical components can be mounted on both sides. The task is to provide
【０００７】[0007]
【課題を解決するための手段】本発明において上記の課
題を達成するために、まず請求項１の発明では、電気配
線を有する基板と、基板の一方の面に位置する第１の光
配線層と、基板の他方の面に位置する第２の光配線層
と、基板を垂直に貫通する光スルーホールとを備える光
・電気配線基板であって、第１の光配線層、第２の光配
線層、及び光スルーホールは、それぞれコアとクラッド
とを有し、第１の光配線層、第２の光配線層、及び光ス
ルーホールのコアは全て屈折率が等しく、光スルーホー
ルのコアの一端は第１の光配線層のコアと接続し、光ス
ルーホールのコアの他端は第２の光配線層のコアと接続
している、ことを特徴とする光・電気配線基板としたも
のである。In order to achieve the above object, the present invention first provides a substrate having electric wiring and a first optical wiring layer located on one surface of the substrate. An optical / electrical wiring board comprising: a second optical wiring layer located on the other surface of the substrate; and an optical through hole vertically penetrating the substrate, wherein the first optical wiring layer and the second optical wiring The wiring layer and the optical through hole each have a core and a clad. The first optical wiring layer, the second optical wiring layer, and the core of the optical through hole all have the same refractive index. Is connected to the core of the first optical wiring layer, and the other end of the core of the optical through hole is connected to the core of the second optical wiring layer. Things.
【０００８】また請求項２の発明では、電気配線を有す
る基板と、基板の一方の面に位置する第１の光配線層
と、基板の他方の面に位置する第２の光配線層と、基板
を垂直に貫通する光スルーホールとを備える光・電気配
線基板であって、第１の光配線層、第２の光配線層、及
び光スルーホールは、それぞれコアとクラッドとを有
し、第１の光配線層、第２の光配線層、及び光スルーホ
ールのコアは全て屈折率が等しく、光スルーホールのコ
アの一端は第１の光配線層のコアと接続し、光スルーホ
ールのコアの他端は第２の光配線層のコアと接続し、そ
れぞれの接続している部分には基板の面に対して４５度
の角度のミラー面を持つミラーが設けられている、こと
を特徴とする光・電気配線基板としたものである。Further, according to the present invention, a substrate having electric wiring, a first optical wiring layer located on one surface of the substrate, a second optical wiring layer located on the other surface of the substrate, An optical / electrical wiring board comprising an optical through hole vertically penetrating the substrate, wherein the first optical wiring layer, the second optical wiring layer, and the optical through hole each have a core and a clad, The first optical wiring layer, the second optical wiring layer, and the core of the optical through hole all have the same refractive index, and one end of the core of the optical through hole is connected to the core of the first optical wiring layer. The other end of the core is connected to the core of the second optical wiring layer, and each connected portion is provided with a mirror having a mirror surface at an angle of 45 degrees with respect to the surface of the substrate. An optical / electrical wiring board characterized by the following.
【０００９】また請求項３の発明では、基板の有する電
気配線が複数の層からなり、光スルーホールを貫通させ
るための基板の孔の内面が、電気配線の層間を電気接続
する導電体層を備えていることを特徴とする請求項１又
は２記載の光・電気配線基板としたものである。According to the third aspect of the present invention, the electric wiring of the substrate is composed of a plurality of layers, and the inner surface of the hole for penetrating the optical through hole has a conductive layer for electrically connecting between the electric wiring layers. The optical / electrical wiring board according to claim 1 or 2, wherein the optical / electrical wiring board is provided.
【００１０】また請求項４の発明では、基板の有する電
気配線が複数の層からなり、光スルーホールを貫通させ
るための基板の孔の内面が、電気配線の層間を電気接続
する導電体層を備えていないこと特徴とする請求項１又
は２記載の光・電気配線基板としたものである。According to the invention of claim 4, the electric wiring of the substrate is composed of a plurality of layers, and the inner surface of the hole of the substrate for penetrating the optical through hole has a conductive layer for electrically connecting between the electric wiring layers. 3. The optical / electrical wiring board according to claim 1, wherein the optical / electrical wiring board is not provided.
【００１１】また請求項５の発明では、基板に電気配線
を施す工程と、基板に第１の貫通孔を形成する工程と、
第１の貫通孔の内面及び基板の両面にクラッドをコーテ
ィングし、第１の貫通孔の内部をクラッドで満たす工程
と、第１の貫通孔の内径よりも小さい内径を持つ第２の
貫通孔を、第１の貫通孔の中心に形成する工程と、第２
の貫通孔の内面及び基板両面のクラッドにコアをコーテ
ィングし、第２の貫通孔の内部をコアで満たす工程と、
基板両面のクラッド上のコアに対して光配線となる部分
を残し不要部分を除去する工程と、基板両面のクラッド
上のコアに対して光配線となる部分を残し不要部分を除
去した後、基板両面で露出しているクラッド及びコアの
上に、さらにクラッドをコーティングする工程と、第２
の貫通孔のコアの一端と基板の一面のコアとが接続して
いる部分及び、第２の貫通孔のコアの他端と基板の他面
のコアとが接続している部分それぞれに、基板の面に対
して４５度の角度でミラー面を形成する工程と、を含む
光・電気配線基板の製造方法としたものである。Further, in the invention according to claim 5, a step of providing electric wiring to the substrate, a step of forming a first through hole in the substrate,
A step of coating the inner surface of the first through hole and both surfaces of the substrate with cladding and filling the inside of the first through hole with the cladding; and forming a second through hole having an inner diameter smaller than the inner diameter of the first through hole. Forming at the center of the first through hole;
Coating the core on the inner surface of the through hole and the cladding on both surfaces of the substrate, and filling the inside of the second through hole with the core;
After removing the unnecessary portion by leaving the portion that becomes the optical wiring with respect to the core on the clad on both sides of the substrate, and removing the unnecessary portion while leaving the portion that becomes the optical wiring with respect to the core on the clad on both surfaces of the substrate, Further coating the clad on the exposed clad and core on both sides;
A portion where the one end of the core of the through hole is connected to the core on one surface of the substrate, and a portion where the other end of the core of the second through hole is connected to the core on the other surface of the substrate. Forming a mirror surface at an angle of 45 degrees with respect to the surface of the optical and electric wiring board.
【００１２】また請求項６の発明では、請求項１〜４の
何れか１項記載の光・電気配線基板に、光部品又は／及
び電気部品を実装したことを特徴とする実装基板とした
ものである。According to a sixth aspect of the present invention, there is provided a mounting board characterized by mounting an optical component and / or an electrical component on the optical / electrical wiring board according to any one of the first to fourth aspects. It is.
【００１３】[0013]
【発明の実施の形態】１．光・電気配線基板 本発明の光・電気配線基板の断面図を、図１に示す。電
気配線を有する基板１の一方の面（図１では上面）に
は、クラッド２及びクラッド６に囲まれたコア３からな
る第１の光配線層がある。また、電気配線を有する基板
の他方の面（図１では下面）には、クラッド２及びクラ
ッド６に囲まれたコア５からなる第２の光配線層があ
る。さらに、電気配線を有する基板１を垂直に貫通し、
クラッド２に囲まれたコア４からなる光スルーホールが
ある。第１配線層のコア３、光スルーホールのコア４、
及び第２配線層のコア５は、全て屈折率が等しい。光ス
ルーホールのコア４の一端（図１では上端）は、第１配
線層のコア３と接続しており、その接続している部分に
は、基板１の面に対して４５度の角度のミラー面を持つ
ミラー７が設けられている。同様に、光スルーホールの
コア４の他端（図１では下端）は、第２配線層のコア５
と接続しており、その接続している部分には、基板１の
面に対して４５度の角度のミラー面を持つミラー８が設
けられている。BEST MODE FOR CARRYING OUT THE INVENTION Optical / Electrical Wiring Board FIG. 1 is a sectional view of the optical / electrical wiring board of the present invention. On one surface (the upper surface in FIG. 1) of the substrate 1 having the electric wiring, there is a first optical wiring layer composed of a core 3 surrounded by a clad 2 and a clad 6. On the other surface (the lower surface in FIG. 1) of the substrate having the electric wiring, there is a second optical wiring layer composed of the core 5 surrounded by the clad 2 and the clad 6. Furthermore, it penetrates vertically through the substrate 1 having the electric wiring,
There is a light through hole consisting of a core 4 surrounded by a cladding 2. A first wiring layer core 3, a light through hole core 4,
The cores 5 of the second wiring layer have the same refractive index. One end (the upper end in FIG. 1) of the core 4 of the optical through hole is connected to the core 3 of the first wiring layer, and the connected portion has an angle of 45 degrees with respect to the surface of the substrate 1. A mirror 7 having a mirror surface is provided. Similarly, the other end (the lower end in FIG. 1) of the core 4 of the optical through hole is connected to the core 5 of the second wiring layer.
A mirror 8 having a mirror surface at an angle of 45 degrees with respect to the surface of the substrate 1 is provided at the connected portion.
【００１４】基板の有する電気配線が複数の層からなる
場合、光スルーホールを貫通させるための基板の孔の内
面９には、電気配線の層間を電気接続する導体層があっ
ても良いし、無くても良い。When the electric wiring of the substrate is composed of a plurality of layers, the inner surface 9 of the hole for penetrating the optical through hole may have a conductor layer for electrically connecting the electric wiring between layers. You don't have to.
【００１５】図２に示すように、第１配線層のコア３を
伝搬したレーザ光１０は、ミラー７で反射され、光スル
ーホールのコア４を伝搬した後、ミラー８で反射され、
第２の配線層のコア５を伝搬する。As shown in FIG. 2, the laser beam 10 propagating through the core 3 of the first wiring layer is reflected by the mirror 7, propagates through the core 4 of the optical through hole, is reflected by the mirror 8, and
The light propagates through the core 5 of the second wiring layer.
【００１６】２．光・電気配線基板の製造方法 本発明の光・電気配線基板の製造方法を、光スルーホー
ルの部分に焦点を当てて、図３の（ａ）〜（ｊ）の流れ
に従って説明する。2. Method for Manufacturing Optical / Electrical Wiring Board The method for manufacturing an optical / electrical wiring board according to the present invention will be described in accordance with the flow of FIGS.
【００１７】図３の（ａ）のように、電気配線を有する
基板２１に、貫通孔２２を開ける。貫通孔２２を開ける
方法としては、ドリル、レーザ、ＲＩＥ（Ｒｅａｃｔｉ
ｖｅＩｏｎ Ｅｔｃｈｉｎｇ，反応性イオンエッチン
グ）などがある。基板２１が、複数層からなる電気配線
を有するとき、電気的スルーホールを貫通孔２２として
用いても良い。この場合、貫通孔２２の内面には、電気
配線の層間を電気接続する導電体層がある。As shown in FIG. 3A, a through hole 22 is formed in a substrate 21 having electric wiring. Drilling, laser, RIE (Reacti
VeIon Etching, reactive ion etching). When the substrate 21 has electric wiring composed of a plurality of layers, an electric through hole may be used as the through hole 22. In this case, on the inner surface of the through hole 22, there is a conductor layer for electrically connecting the layers of the electric wiring.
【００１８】図３の（ｂ）のように、基板２１の両面及
び貫通孔２２の内面にクラッド２３をコーティングし、
貫通孔２２をクラッド２３で埋める。As shown in FIG. 3B, cladding 23 is coated on both surfaces of the substrate 21 and the inner surface of the through hole 22.
The through hole 22 is filled with a clad 23.
【００１９】図３の（ｃ）のように、埋められた貫通孔
２２の中心部分に、貫通孔２２の内径よりも小さい内径
を持つ貫通孔２４を開ける。これによって、貫通孔２４
はクラッド２３によって囲まれる。貫通孔２４を開ける
方法には、ドリル、レーザ、ＲＩＥなどがある。As shown in FIG. 3C, a through hole 24 having an inner diameter smaller than the inner diameter of the through hole 22 is formed at the center of the buried through hole 22. Thereby, the through hole 24
Is surrounded by the cladding 23. A method of forming the through hole 24 includes a drill, a laser, RIE, and the like.
【００２０】図３の（ｄ）のように、基板２１の両面及
び貫通孔２４の内面にコア２５をコーティングし、貫通
孔２４をコア２５で埋める。As shown in FIG. 3D, a core 25 is coated on both surfaces of the substrate 21 and the inner surface of the through hole 24, and the through hole 24 is filled with the core 25.
【００２１】図３の（ｅ）のように、基板２１の両面の
コア２５を金属膜２６で覆う。As shown in FIG. 3E, the cores 25 on both sides of the substrate 21 are covered with a metal film 26.
【００２２】図３の（ｆ）のように、フォトリソグラフ
ィ技術によって、金属膜２６の光配線に対応する光配線
部２８を残し、金属膜２６の不要な部分を除去する。As shown in FIG. 3F, unnecessary portions of the metal film 26 are removed by photolithography while leaving an optical wiring portion 28 corresponding to the optical wiring of the metal film 26.
【００２３】基板２１の両面をＲＩＥでエッチングし
て、図３の（ｇ）のように、残っている金属膜２６に覆
われていないコア２５の部分を除去する。The both surfaces of the substrate 21 are etched by RIE to remove the portion of the core 25 that is not covered with the remaining metal film 26 as shown in FIG.
【００２４】図３の（ｈ）のように、基板２１の両面か
ら残っていた金属膜２６を除去する。As shown in FIG. 3H, the remaining metal film 26 is removed from both surfaces of the substrate 21.
【００２５】図３の（ｉ）のように、基板２１の両面に
クラッド３０をコーティングする。As shown in FIG. 3I, cladding 30 is coated on both surfaces of the substrate 21.
【００２６】基板２１の面に平行なコアと垂直なコアと
の接続部分に、９０度刃によるダイシング加工或いはＲ
ＩＥの斜めエッチングによって、基板２１の面に対して
４５度の角度のミラー面を持つミラー３２及び３３を設
ける。ミラー３２、３３は、スパッタ、蒸着などによっ
て、金属反射膜を有するミラーにしても良い。The connecting portion between the core parallel to the surface of the substrate 21 and the core perpendicular thereto is diced by a 90-degree blade or
Mirrors 32 and 33 having mirror surfaces at an angle of 45 degrees with respect to the surface of the substrate 21 are provided by oblique etching of the IE. The mirrors 32 and 33 may be mirrors having a metal reflection film by sputtering, vapor deposition, or the like.
【００２７】[0027]
【発明の効果】本発明は、電気配線を有する基板の両面
に光配線層を設け、それらを光スルーホールで光学的に
接続するので、複雑な光配線を施し、しかも光部品を基
板の両面に実装することができる。従って、光配線設計
の簡易化、高密度配線及び実装を図ることができるとい
う効果がある。According to the present invention, since optical wiring layers are provided on both sides of a substrate having electric wiring and they are optically connected by optical through holes, complicated optical wiring is provided, and the optical component is connected to both sides of the substrate. Can be implemented. Therefore, there is an effect that simplification of optical wiring design, high-density wiring and mounting can be achieved.
【図１】本発明の光・電気配線基板の断面図。FIG. 1 is a sectional view of an optical / electrical wiring board according to the present invention.
【図２】本発明の光・電気配線基板におけるレーザ光の
伝搬を説明する図。FIG. 2 is a view for explaining propagation of laser light in the optical / electrical wiring board of the present invention.
【図３】本発明の光・電気配線基板の製造方法の説明
図。FIG. 3 is an explanatory view of a method for manufacturing an optical / electrical wiring board according to the present invention.
１…基板 ２…クラッド ３…コア ４…コア ５…コア ６…クラッド ７…ミラー ８…ミラー ９…孔の内面 １０…レーザ光 ２１…基板 ２２…貫通孔 ２３…クラッド ２４…貫通孔 ２５…コア ２６…金属膜 ２８…光配線部 ３０…クラッド ３２…ミラー ３３…ミラー DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Cladding 3 ... Core 4 ... Core 5 ... Core 6 ... Cladding 7 ... Mirror 8 ... Mirror 9 ... Inner surface of hole 10 ... Laser beam 21 ... Substrate 22 ... Through hole 23 ... Cladding 24 ... Through hole 25 ... Core 26 ... metal film 28 ... optical wiring part 30 ... cladding 32 ... mirror 33 ... mirror
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2H047 KA04 KB01 KB08 MA05 MA07 PA02 PA03 PA22 PA24 RA08 TA05 TA43 TA44 5E346 AA11 AA12 AA15 AA41 BB01 BB20 GG01 GG15 HH01 HH21 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H047 KA04 KB01 KB08 MA05 MA07 PA02 PA03 PA22 PA24 RA08 TA05 TA43 TA44 5E346 AA11 AA12 AA15 AA41 BB01 BB20 GG01 GG15 HH01 HH21
Claims (6)
に位置する第１の光配線層と、基板の他方の面に位置す
る第２の光配線層と、基板を垂直に貫通する光スルーホ
ールとを備える光・電気配線基板であって、 第１の光配線層、第２の光配線層、及び光スルーホール
は、それぞれコアとクラッドとを有し、 第１の光配線層、第２の光配線層、及び光スルーホール
のコアは全て屈折率が等しく、 光スルーホールのコアの一端は第１の光配線層のコアと
接続し、光スルーホールのコアの他端は第２の光配線層
のコアと接続している、 ことを特徴とする光・電気配線基板。1. A substrate having electrical wiring, a first optical wiring layer located on one surface of the substrate, a second optical wiring layer located on the other surface of the substrate, and vertically penetrating the substrate. An optical / electrical wiring board comprising: an optical through hole; a first optical wiring layer, a second optical wiring layer, and an optical through hole each having a core and a clad; , The second optical wiring layer and the core of the optical through hole all have the same refractive index, one end of the core of the optical through hole is connected to the core of the first optical wiring layer, and the other end of the core of the optical through hole is An optical / electrical wiring board connected to a core of a second optical wiring layer.
に位置する第１の光配線層と、基板の他方の面に位置す
る第２の光配線層と、基板を垂直に貫通する光スルーホ
ールとを備える光・電気配線基板であって、 第１の光配線層、第２の光配線層、及び光スルーホール
は、それぞれコアとクラッドとを有し、 第１の光配線層、第２の光配線層、及び光スルーホール
のコアは全て屈折率が等しく、 光スルーホールのコアの一端は第１の光配線層のコアと
接続し、光スルーホールのコアの他端は第２の光配線層
のコアと接続し、それぞれの接続している部分には基板
の面に対して４５度の角度のミラー面を持つミラーが設
けられている、 ことを特徴とする光・電気配線基板。2. A substrate having electrical wiring, a first optical wiring layer located on one surface of the substrate, a second optical wiring layer located on the other surface of the substrate, and vertically penetrating the substrate. An optical / electrical wiring board comprising: an optical through hole; a first optical wiring layer, a second optical wiring layer, and an optical through hole each having a core and a clad; , The second optical wiring layer and the core of the optical through hole all have the same refractive index, one end of the core of the optical through hole is connected to the core of the first optical wiring layer, and the other end of the core of the optical through hole is A mirror connected to the core of the second optical wiring layer and having a mirror surface at an angle of 45 degrees with respect to the surface of the substrate at each connected portion; Electric wiring board.
り、光スルーホールを貫通させるための基板の孔の内面
が、電気配線の層間を電気接続する導電体層を備えてい
ることを特徴とする請求項１又は２記載の光・電気配線
基板。3. The electric wiring of the substrate is composed of a plurality of layers, and the inner surface of the hole of the substrate for penetrating the optical through hole is provided with a conductor layer for electrically connecting between the electric wiring layers. The optical / electrical wiring board according to claim 1 or 2, wherein
り、光スルーホールを貫通させるための基板の孔の内面
が、電気配線の層間を電気接続する導電体層を備えてい
ないこと特徴とする請求項１又は２記載の光・電気配線
基板。4. The electric wiring of the substrate comprises a plurality of layers, and the inner surface of the hole for penetrating the optical through hole does not have a conductor layer for electrically connecting between the electric wiring layers. The optical / electrical wiring board according to claim 1.
ィングし、第１の貫通孔の内部をクラッドで満たす工程
と、 第１の貫通孔の内径よりも小さい内径を持つ第２の貫通
孔を、第１の貫通孔の中心に形成する工程と、 第２の貫通孔の内面及び基板両面のクラッドにコアをコ
ーティングし、第２の貫通孔の内部をコアで満たす工程
と、 基板両面のクラッド上のコアに対して光配線となる部分
を残し不要部分を除去する工程と、 基板両面のクラッド上のコアに対して光配線となる部分
を残し不要部分を除去した後、基板両面で露出している
クラッド及びコアの上に、さらにクラッドをコーティン
グする工程と、 第２の貫通孔のコアの一端と基板の一面のコアとが接続
している部分及び、第２の貫通孔のコアの他端と基板の
他面のコアとが接続している部分それぞれに、基板の面
に対して４５度の角度でミラー面を形成する工程と、 を含む光・電気配線基板の製造方法。5. A step of applying electric wiring to the substrate, a step of forming a first through hole in the substrate, coating an inner surface of the first through hole and both surfaces of the substrate with a clad, A step of filling the inside with a clad; a step of forming a second through-hole having an inner diameter smaller than the inner diameter of the first through-hole at the center of the first through-hole; an inner surface of the second through-hole and a substrate A step of coating the clad on both sides with a core and filling the inside of the second through hole with the core; a step of removing an unnecessary part while leaving a part to be an optical wiring with respect to the core on the clad on both sides of the substrate; Removing an unnecessary portion from the core on the clad, leaving unnecessary portions, and further coating the clad on the clad and the core exposed on both surfaces of the substrate; One end of the core and the core And the other end of the core of the second through hole and the other end of the substrate are connected to the mirror surface at an angle of 45 degrees with respect to the surface of the substrate. Forming an optical / electrical wiring board.
配線基板に、光部品又は／及び電気部品を実装したこと
を特徴とする実装基板。6. A mounting board, wherein an optical component and / or an electrical component is mounted on the optical / electrical wiring board according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10529599A JP4374648B2 (en) | 1999-04-13 | 1999-04-13 | Optical / electrical wiring board, manufacturing method, and mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10529599A JP4374648B2 (en) | 1999-04-13 | 1999-04-13 | Optical / electrical wiring board, manufacturing method, and mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000298216A true JP2000298216A (en) | 2000-10-24 |
| JP4374648B2 JP4374648B2 (en) | 2009-12-02 |
Family
ID=14403709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10529599A Expired - Fee Related JP4374648B2 (en) | 1999-04-13 | 1999-04-13 | Optical / electrical wiring board, manufacturing method, and mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4374648B2 (en) |
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