JP2004233894A - Optical wiring substrate, its manufacturing method, and manufacturing method of optical element of optical wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance deflection efficiency by an optical deflection element by enhancing the accuracy of an optical deflection element for deflecting an optical signal transmitted in an optical wiring. <P>SOLUTION: The optical wiring 3 where an optical waveguide 6 for transmitting the optical signal is formed and the optical element 5 having the optical deflection element 12 for joining the optical signal transmitted through the optical waveguide 6 and an optical signal transmitted in a direction orthogonal to the direction of the optical signal transmitted through the optical waveguide 6 are constituted as individual components. Then, the miniaturization of the optical element 5 is attained, and also, in the case of forming the optical deflection element 12 on the small-sized optical element 5, the optical deflection element 12 can be manufactured with high accuracy in surface angle, surface size and surface roughness, then, the deflection efficiency by the optical deflection element 12 is enhanced, and also, the optical signal transmission efficiency is enhanced. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical wiring board, a method for manufacturing the same, and a method for manufacturing an optical element of the optical wiring board.
[0002]
[Prior art]
2. Description of the Related Art In recent years, the amount of information to be transmitted has been increasing in the field of information transmission, and various inventions have been proposed in which a part of a transmission signal is converted into an optical signal and transmitted in order to perform communication on the order of GBps (gigabytes / second). (For example, see Patent Document 1). By converting a part of the transmission signal to an optical signal and transmitting the signal, the amount of information to be transmitted can be increased, and malfunction due to generation of noise and adverse effects on the surrounding environment due to generation of electromagnetic waves can be prevented.
[0003]
FIG. 13 shows an optical wiring 101 disclosed in Patent Document 1. This optical wiring 101 includes a core 102, a clad 103 surrounding the core 102, a lens 104, and a mirror 105 as an optical deflection element. Have been. The mirror 105 is provided directly on the optical wiring 101.
[0004]
[Patent Document 1]
JP 2001-166167 A
[0005]
[Problems to be solved by the invention]
However, in the optical wiring 101 disclosed in Patent Literature 1, when the length of the optical wiring 101 becomes 10 cm or more, when a fine mirror 105, a lens 104, and the like are formed on the optical wiring 101 having such a large size. Therefore, it becomes difficult to improve the positional accuracy of the mirror 105 and the lens 104.
[0006]
Further, when mounting a large-sized optical wiring 101 and a photoelectric composite device having a photoelectric conversion device that receives and emits an optical signal on a substrate, the alignment accuracy between the photoelectric conversion device and the lens 104 is improved. It is difficult.
[0007]
SUMMARY OF THE INVENTION It is an object of the present invention to improve the accuracy of an optical deflecting element that deflects an optical signal transmitted through an optical wiring, and to increase the deflection efficiency of the optical deflecting element.
[0008]
[Means for Solving the Problems]
According to the first aspect of the present invention, there is provided an optical wiring board on which an optical waveguide for transmitting an optical signal is formed, and an optical signal transmitted through the optical waveguide is transmitted in a direction crossing the optical signal. And an optical element formed as a separate component from the optical wiring.
[0009]
Therefore, since the optical deflecting element is provided on the optical element which is a separate component from the optical wiring, the optical element can be reduced in size, and the surface angle and the surface size of the optical deflecting element can be reduced with the miniaturization. , Surface roughness and the like can be manufactured with high precision, thereby increasing the deflection efficiency of the optical deflection element and the transmission efficiency of the optical signal.
[0010]
The optical wiring board of the invention according to claim 2, wherein a substrate having electrical wiring, a photoelectric composite element having a photoelectric conversion element provided on the substrate, and a surface of the substrate provided on the substrate, An optical wiring on which an optical waveguide for transmitting an optical signal is formed in parallel, and an optical signal provided on the substrate, which is conveyed in a direction crossing the optical signal conveyed through the optical waveguide and the optical signal; An optical element having an optical deflecting element for coupling an optical signal input to and output from the electric conversion element.
[0011]
Therefore, the optical element provided with the optical deflecting element can be formed as a separate component from the optical wiring, whereby the optical element can be downsized. The angle, the size of the surface, the surface roughness, and the like can be manufactured with high accuracy, and the deflection efficiency of the optical deflecting element increases and the transmission efficiency of the optical signal also increases.
[0012]
According to a third aspect of the present invention, in the optical wiring substrate according to the second aspect, the optical element, the optical wiring, and the photoelectric composite element are provided on the same surface side of the substrate, and the optical element is the photoelectric element. It is located between the composite element and the substrate.
[0013]
Therefore, the distance between the optical element and the photoelectric composite element is reduced, and the transmission of the optical signal between the optical element and the photoelectric composite element is performed with high efficiency.
[0014]
According to a fourth aspect of the present invention, in the optical wiring board according to the second aspect, the optical wiring and the photoelectric composite element are separately arranged on both front and back surfaces of the substrate, and the optical element is on the same surface as the optical wiring. And a through-hole penetrating through the substrate in a front-to-back direction at a position where the photoelectric conversion element of the photoelectric composite element and the optical deflection element of the optical element face each other.
[0015]
Therefore, an optical signal entering and exiting the photoelectric conversion element of the photoelectric composite element is optically coupled to the optical deflection element through the through hole. Here, by arranging the optical element and the photoelectric composite element separately on the front and back surfaces of the substrate, the optical element can be mounted after the photoelectric composite element is mounted on the substrate. Prevents the thermal load on the optical element during the heating process of mounting the composite element, maintains the precision because the optical element is not affected by thermal expansion, etc. due to the thermal load, and forms the optical element from a material with low heat resistance can do.
[0016]
According to a fifth aspect of the present invention, in the optical wiring board according to the second aspect, the optical wiring and the photoelectric composite element are separately arranged on both front and back surfaces of the substrate, and an opening is formed in the substrate. The optical element is inserted into the opening.
[0017]
Therefore, the optical element can be inserted into the opening and mounted after the optoelectronic composite element is mounted on the substrate, and the thermal load on the optical element in the heating process of mounting the optoelectric composite element can be prevented. Since the optical element is not affected by thermal expansion or the like due to its thermal load, accuracy can be maintained, and the optical element can be formed of a material having low heat resistance. Furthermore, since the alignment between the photoelectric conversion element of the photoelectric composite element and the optical deflection element of the optical element can be performed directly without passing through a hole or the like formed in the substrate, the accuracy of the alignment is increased, and the alignment work is also easy. become.
[0018]
According to a sixth aspect of the present invention, in the optical wiring board according to any one of the second to fifth aspects, a positioning means for positioning the photoelectric composite element and the optical element is provided.
[0019]
Therefore, by using this alignment means, the alignment accuracy between the optical element and the photoelectric composite element is increased and the alignment work is facilitated, and the optical coupling caused by the decrease in the alignment precision between the optical element and the photoelectric composite element is reduced. A decrease in efficiency is suppressed.
[0020]
According to a seventh aspect of the present invention, in the optical wiring board according to any one of the first to sixth aspects, an electric drive element that enables active conversion of an optical signal transmitted through the optical element inside the optical element. Is provided, and a through hole for an electrode for supplying electric power to the electric drive element is formed in the optical element.
[0021]
Therefore, power can be supplied to the electric drive element provided inside the optical element by inserting the electrode into the electrode through hole, and the function of the optical element is improved by providing such an electric drive element in the optical element. I do.
[0022]
According to an eighth aspect of the present invention, in the optical wiring board according to any one of the first to seventh aspects, the optical element crosses a transmission direction of an optical signal transmitted through the optical waveguide in the optical wiring. Are arranged in layers.
[0023]
Therefore, the transmission capacity per unit area of the optical signal transmitted in the optical wiring is increased.
[0024]
According to a ninth aspect of the present invention, in the optical wiring board according to any one of the first to eighth aspects, an optical waveguide is formed in the optical element, and the optical deflecting element is arranged in the middle of the optical waveguide. An end of the optical waveguide faces the optical wiring and the photoelectric conversion element.
[0025]
Therefore, since the optical signal transmitted in the optical element is transmitted in the optical waveguide, the transmission efficiency of the optical signal in the optical element is increased.
[0026]
According to a tenth aspect of the present invention, in the optical wiring substrate according to the ninth aspect, the diameter of the optical waveguide is such that the emission side portion from the optical deflection element has a larger diameter than the incidence side portion to the optical deflection element. Is formed.
[0027]
Therefore, the leakage of the optical signal transmitted through the optical waveguide toward the optical deflecting element to the outside of the optical waveguide without hitting the optical deflecting element is reduced, the deflection efficiency by the optical deflecting element is increased, and the transmission of the optical signal is performed. Efficiency also increases.
[0028]
According to an eleventh aspect of the present invention, in the optical wiring board according to the ninth or tenth aspect, the optical waveguide of the optical wiring and the optical waveguide of the optical element are a self-supporting waveguide type optical coupling made of a low elastic material. Optically coupled by the element.
[0029]
Therefore, even when the optical axis of the optical wiring and the optical axis of the optical element are misaligned, the self-supporting waveguide type optical coupling element is formed of a low elastic material, and the self-supporting waveguide type optical coupling element is formed in accordance with the misalignment. Since the optical coupling element is deformed, high-precision alignment is not required when optically coupling the optical wiring and the optical element, and the cost for optical coupling is reduced. In addition, the effect of thermal expansion is reduced, the deflection efficiency of the entire optical element is improved, and high optical coupling efficiency is realized.
[0030]
Here, “self-supporting” in the self-supporting waveguide type optical coupling device means a state where the waveguide structure is supported even if it is not provided on the substrate, and has a strength capable of maintaining the waveguide structure by supporting both ends. Means you are. Further, the “waveguide” is different from a mere adhesive or the like, and has a function of confining light therein.
[0031]
According to a twelfth aspect of the present invention, in the optical wiring board according to any one of the first to eleventh aspects, a total reflection mirror and an air clad located outside a mirror surface of the total reflection mirror are used as the light deflecting element. Is provided.
[0032]
Therefore, the light deflection efficiency is increased, the optical element can be formed at a low temperature, and the number of parts can be reduced.
[0033]
Here, in the low-refractive-index dielectric layer, in order to make the total reflection angle about 45 degrees, the refractive index of the core is required to be 2.0 or more even if the refractive index of the clad is set to 1.4. It is necessary to use a suitable inorganic material. However, by providing an optical deflecting element comprising a total reflection mirror and an air cladding, an organic material such as polyimide, polymethyl methacrylate (PMMA), or polycarbonate having a refractive index of about 1.5, or an inorganic material such as siloxane having a refractive index of about 1.5 is provided in the core layer. Can be used, and low-temperature formation is possible. In addition, components such as a metal plate for reflection and a metal thin film are not required, and the number of components is reduced.
[0034]
According to a thirteenth aspect of the present invention, in the optical wiring substrate according to any one of the first to eleventh aspects, a metal mirror on which a metal film is formed is provided as the light deflecting element.
[0035]
Therefore, the light deflection efficiency increases, and the optical element can be formed at a low temperature.
[0036]
Here, in the low-refractive-index dielectric layer, in order to make the total reflection angle about 45 degrees, the refractive index of the core is required to be 2.0 or more even if the refractive index of the clad is set to 1.4. It is necessary to use a suitable inorganic material. However, by providing a metal mirror as an optical deflecting element, an organic material such as polyimide, polymethyl methacrylate (PMMA), and polycarbonate having an index of refraction of about 1.5 and an inorganic material such as siloxane can be used for the core layer. Low temperature formation becomes possible. Furthermore, even when the incident angle, that is, the NA of the optical waveguide of the optical element is large, high deflection efficiency can be realized.
[0037]
According to a fourteenth aspect of the present invention, in the optical wiring substrate according to any one of the first to eleventh aspects, a hologram mirror is provided as the light deflection element.
[0038]
Therefore, the light deflection efficiency increases, and the optical element can be formed at a low temperature.
[0039]
Here, in the low-refractive-index dielectric layer, in order to make the total reflection angle about 45 degrees, the refractive index of the core is required to be 2.0 or more even if the refractive index of the clad is set to 1.4. It is necessary to use a suitable inorganic material. However, by providing the hologram mirror as a light deflecting element, an organic material such as polyimide, polymethyl methacrylate (PMMA), or polycarbonate having an index of refraction of about 1.5, or an inorganic material such as siloxane can be used for the core layer. Low temperature formation becomes possible. Further, this hologram mirror can be manufactured by emboss molding or exposure molding, which facilitates the production. In addition, it is possible to provide wavelength selectivity.
[0040]
According to a fifteenth aspect of the present invention, in the optical wiring substrate according to any one of the first to eleventh aspects, a diffraction grating mirror is provided as the light deflection element.
[0041]
Therefore, the light deflection efficiency increases, and the optical element can be formed at a low temperature.
[0042]
Here, in the low-refractive-index dielectric layer, in order to make the total reflection angle about 45 degrees, the refractive index of the core is required to be 2.0 or more even if the refractive index of the clad is set to 1.4. It is necessary to use a suitable inorganic material. However, by providing the diffraction grating mirror as an optical deflecting element, an organic material having a refractive index of about 1.5, such as polyimide, polymethyl methacrylate (PMMA), or polycarbonate, or an inorganic material such as siloxane can be used for the core layer. , Low-temperature formation becomes possible. Further, this hologram mirror can be manufactured by emboss molding or exposure molding, which facilitates the production. In addition, it is possible to provide wavelength selectivity.
[0043]
According to a sixteenth aspect of the present invention, there is provided an optical / electrical composite element having a photoelectric conversion element on a substrate having an electrical wiring, and an optical wiring having an optical waveguide through which an optical signal is transmitted parallel to a surface of the substrate. Mounting an optical signal having an optical deflecting element that couples an optical signal conveyed through the optical waveguide and an optical signal that is conveyed in a direction crossing the optical signal and that is input to and output from the photoelectric conversion element. A method for manufacturing an optical wiring board, comprising: mounting the optoelectronic composite device on the substrate, and then mounting the optical device on the substrate.
[0044]
Therefore, it is possible to prevent the heat generated in the heating process when mounting the photoelectric composite device on the substrate from being transmitted to the optical device, and to prevent the thermal expansion of the optical device due to the influence of the heat during the mounting of the photoelectric composite device. The performance of the optical element can be maintained, and a material having low heat resistance can be used for the optical element.
[0045]
The method of manufacturing an optical element of an optical wiring board according to the invention of claim 17, further comprising: forming a first core extending on the first dummy substrate in parallel with the substrate surface of the first dummy substrate; Forming a clad on the substrate, forming a second core extending in a direction intersecting the substrate surface of the second dummy substrate in the clad, and an end face of the first core and the second core. Bonding the first dummy substrate and the second dummy substrate so that the end faces thereof are joined, removing the first dummy substrate and exposing the first core, the first core and the Forming a light deflecting element at a junction with the second core; covering the exposed first core with a clad; and removing the second dummy substrate.
[0046]
Therefore, the first dummy substrate on which the first core is formed and the second dummy substrate on which the clad and the second core are formed are bonded so that the end face of the first core and the end face of the second core are joined. Thereafter, the first dummy substrate is removed to expose the first core, an optical deflecting element is formed at a joint between the first core and the second core, and the exposed first core is covered with a clad to form a light deflecting element. The device is manufactured. According to this method for manufacturing an optical element, the optical element can be miniaturized, and with the miniaturization, the surface angle, surface size, surface roughness, and the like of the optical deflection element can be manufactured with high accuracy. become.
[0047]
BEST MODE FOR CARRYING OUT THE INVENTION
An optical wiring board according to a first embodiment of the present invention will be described with reference to FIGS. The optical wiring board 1 of the present embodiment includes a substrate 2 having electric wiring (not shown), an optical wiring 3 mounted on the substrate 2, an optical-electrical composite device 4, an optical device 5, and the like. .
[0048]
The optical wiring 3 is a member for transmitting an optical signal in parallel with the substrate surface of the substrate 2, and includes a core 6 and a clad 7 having a lower refractive index than the core 6, and a portion of the core 6 serves as an optical waveguide. ing.
[0049]
The photoelectric composite element 4 is an element on which a photoelectric conversion element 8 composed of a semiconductor laser or a photodiode and an electronic integrated circuit (not shown) for driving the photoelectric conversion element 8 are mounted. As a light emitting element which is one of the photoelectric conversion elements 8, a surface emitting laser is promising as an integrated light source, but a normal semiconductor laser or a light emitting diode may be used. The photoelectric composite element 4 is electrically connected to electric wiring on the substrate 2 by bumps 9. An optical signal emitted from the photoelectric conversion element 8 or incident on the photoelectric conversion element 8 is transmitted in a direction perpendicular to the substrate 2. An optical signal transmitted through the core (optical waveguide) 6 of the optical wiring 3 mounted on the substrate 2 travels in a direction parallel to the substrate 2.
[0050]
The optical element 5 is formed by a core (optical waveguide) 10 and a clad 11 surrounding the core 10. The optical waveguide 10 is formed by bending 90 degrees in the middle, and an optical deflection element 12 is provided at the bent portion. I have. An end of the optical waveguide 10 faces the optical wiring 3 and the photoelectric conversion element 8, and an end of the optical waveguide 10 is connected to the photoelectric composite element 4 and the optical wiring 3 by a self-alignment coupling element 13. ing.
[0051]
As shown in an enlarged manner in FIG. 2, the light deflecting element 12 has a total reflection mirror 14 in which a 90-degree bent portion of the optical waveguide 10 is cut at an angle of 45 degrees, and is provided outside the mirror surface of the total reflection mirror 14. The air clad 15 is formed. The air clad 15 is a portion between the core (optical waveguide) 10 and the clad 11 where air is sealed.
[0052]
The optical wiring 3, the photoelectric composite device 4, and the optical device 5 are arranged on the same surface side of the substrate 2. The optical element 5 is positioned between the photoelectric composite element 4 and the substrate 2 so as to be flush with the optical wiring 3. The optical element 5 and the photoelectric composite element 4 are positioned so that the photoelectric conversion element 8 and the optical deflection element 12 are opposed to the substrate surface of the substrate 2 in the vertical direction. Are positioned such that the optical waveguide 10 and the optical waveguide 6 face in a direction parallel to the substrate surface of the substrate 2.
[0053]
In this embodiment, the case where the optical wiring 3 is provided so as to face one side surface of the optical element 5 is shown. Wiring may be provided.
[0054]
Further, in the present embodiment, the case where the photoelectric composite element 4 and the optical wiring 3 are connected to the optical element 5 by the self-alignment coupling element 13 is shown. It is effective to use a self-supporting waveguide type optical coupling element made of a low elastic material. The self-supporting waveguide-type optical coupling element is an element in which silicone, fluoro rubber, or the like is provided in a cross-linked structure and has low elasticity or expansion and contraction by irradiating ultraviolet rays or the like. It has the function of confining and provides high optical coupling efficiency.
[0055]
According to the optical wiring board 1 having such a configuration, an optical signal emitted from the photoelectric conversion element 8 or incident on the photoelectric conversion element 8 and an optical signal transmitted through the optical waveguide 6 of the optical wiring 3. Are coupled by the light deflecting element 12 by changing the traveling direction by 90 degrees.
[0056]
Further, since the optical element 5 provided with the optical deflecting element 12 is formed as a separate component from the optical wiring 3, the optical element 5 can be reduced in size, and the optical deflecting element can be reduced with the size reduction. The surface angle, surface size, surface roughness, and the like of the total reflection mirror 14, which is a part of the mirror 12, can be manufactured with high accuracy. Thereby, the deflection efficiency of the optical deflecting element 12 can be increased, and the transmission efficiency of the optical signal via the optical element 5 can be increased.
[0057]
Furthermore, since the light deflecting element 12 of the present embodiment is not exposed to the outside like the mirror (light deflecting element) 105 in the conventional example shown in FIG. And the stability and reliability of optical signal transmission are improved.
[0058]
An optical wiring board according to a second embodiment of the present invention will be described with reference to FIG. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted (the same applies to the following embodiments).
[0059]
The optical wiring board of the present embodiment is characterized by the structure of the optical element 21, and the other parts (substrate, optical wiring, photoelectric composite element) are the same as in the first embodiment.
[0060]
The optical element 21 has a core (optical waveguide) 22, a clad 23 surrounding a narrow area around the core 22, and a holding member 24 for holding the core 22 and the clad 23. An optical deflecting element 25 having a shape obtained by bending the core 22 by 90 degrees is formed.
[0061]
The optical signal transmitted in the optical element 21 is optically coupled by the optical deflecting element 25 by changing the traveling direction by 90 degrees.
[0062]
An optical wiring board according to a third embodiment of the present invention will be described with reference to FIG. The optical wiring board of the present embodiment is characterized by the structure of the optical element 31, and the other parts (substrate, optical wiring, photoelectric composite element) are the same as those of the first embodiment.
[0063]
This optical element 31 is formed of a core (optical waveguide) 32 and a clad 33 surrounding the core 32, and the optical waveguide 32 is formed by bending 90 degrees in the middle, and a metal mirror as an optical deflection element is formed at the bent portion. 34 are provided.
[0064]
The metal mirror 34 is formed by cutting a 90-degree bent portion of the optical waveguide 32 at an angle of 45 degrees, and forming a metal film such as aluminum on the outside of the cut surface by vapor deposition or the like.
[0065]
The optical signal transmitted through the optical element 31 is optically coupled by changing the traveling direction by 90 degrees by the metal mirror 34. Since the metal mirror 34 can reflect light without reaching the critical angle, the deflection efficiency is increased.
[0066]
An optical wiring board according to a fourth embodiment of the present invention will be described with reference to FIG. The optical wiring board of this embodiment is characterized by the structure of the optical element 41, and the other parts (substrate, optical wiring, photoelectric composite element) are the same as those of the first embodiment.
[0067]
The optical element 41 is formed of a core (optical waveguide) 42 and a clad 43 surrounding the core 42, and the optical waveguide 42 is formed by bending 90 degrees in the middle, and a hologram mirror as an optical deflection element is formed at the bent portion. 44 are provided.
[0068]
The hologram mirror 44 is formed by cutting a 90-degree bent portion of the optical waveguide 42 at an angle of 45 degrees, and embossing and exposing the cut surface.
[0069]
The optical signal transmitted through the optical element 41 is changed in direction by 90 degrees by the hologram mirror 44 and optically coupled.
[0070]
Note that a diffraction grating mirror may be provided instead of the hologram mirror 44. This diffraction grating mirror can be formed in the same manner as the hologram mirror. By using this diffraction grating mirror, the optical signal transmitted through the optical element 41 is converted in direction by 90 degrees by the diffraction grating mirror and optically coupled.
[0071]
An optical wiring board according to a fifth embodiment of the present invention will be described with reference to FIG. The optical wiring board of the present embodiment is characterized by the structure of the optical element 51, and the basic structure of other parts (substrate, optical wiring, photoelectric composite element) is the same as that of the first embodiment. However, the difference is that the photoelectric conversion element of the photoelectric composite element is exclusively used for emitting an optical signal.
[0072]
This optical element 51 is formed of a core (optical waveguide) 52 and a clad 53 surrounding the core 52, and the optical waveguide 52 is formed by bending 90 degrees in the middle, and a hologram mirror as an optical deflection element is formed at the bent portion. 44 are provided. Note that it is optional to use a light deflecting element having another configuration instead of the hologram mirror 44.
[0073]
Further, in the optical element 51, as shown in FIG. 6A, the optical signal reflected by the hologram mirror 44 is emitted as compared with the diameter of the portion 52a of the optical waveguide 52 on the incident side to the hologram mirror 44. The emission side portion 52b is formed to have a large diameter.
[0074]
FIG. 6B shows a comparative example, in which the diameter of the optical waveguide 52 is the same on both sides of the hologram mirror 44. If the diameters of the optical waveguides 52 are the same as shown in FIG. 6B, the transmitted optical signal does not hit the hologram mirror 44 and leaks out of the optical waveguide 52 as shown by the broken arrow. In some cases, the transmission efficiency of the optical signal is reduced.
[0075]
On the other hand, as shown in FIG. 6 (a), the diameter of the optical waveguide 52 is made larger on the emission side 52b than on the incidence side 52a, so that the inside of the optical waveguide 52 is directed toward the hologram mirror 44. The optical signal transmitted through the hologram mirror 44 is prevented from leaking out of the optical waveguide 52 without hitting the hologram mirror 44, so that the deflection efficiency by the hologram mirror 44 is increased and the transmission efficiency of the optical signal is also increased.
[0076]
An optical wiring board according to a sixth embodiment of the present invention will be described with reference to FIG. The basic configuration of an optical wiring board 61 of the present embodiment is the same as that of the optical wiring board 1 of the first embodiment, and a board 2 having electric wiring (not shown), and mounted on the board 2 It is composed of an optical wiring 3, a photoelectric composite device 4, an optical device 5, and the like.
[0077]
However, the optical wiring 3 and the optical element 5 are arranged on one substrate surface of the substrate 2, and the photoelectric composite device 4 is arranged on the other substrate surface of the substrate 2.
[0078]
The photoelectric conversion element 8 of the photoelectric composite element 4 and the light deflecting element 12 of the optical element 5 are opposed to each other in a direction orthogonal to the substrate surface of the substrate 2 with the substrate 2 interposed therebetween. A through hole 62 is formed so that the element 8 and the light deflecting element 12 face each other. The through-hole 62 is formed by using a drill or the like, and an optical signal emitted from the photoelectric conversion element 8 or incident on the photoelectric conversion element 8 passes through the through-hole 62 and is formed in the optical element 5. In and out of the optical waveguide 10.
[0079]
The basic operation of this embodiment is the same as that of the first embodiment, and the optical signal that enters and exits the photoelectric conversion element 8 and the optical signal that travels through the optical waveguide 6 of the optical wiring 3 are optically deflected. The traveling direction is changed by 90 degrees by the element 12 to be coupled.
[0080]
Further, since the optical element 5 provided with the optical deflecting element 12 is formed as a separate component from the optical wiring 3, the optical element 5 can be reduced in size, and the optical deflecting element can be reduced with the size reduction. The surface angle, the surface size, the surface roughness, and the like of the total reflection mirror 14 (see FIG. 2) that is a part of the mirror 12 can be manufactured with high accuracy, thereby increasing the deflection efficiency of the optical deflecting element 12. The transmission efficiency of the optical signal can be increased.
[0081]
Further, in the present embodiment, the optical element 5 and the photoelectric composite element 4 are arranged separately on the front and back surfaces of the substrate 2, so that the optical element 5 is mounted on the substrate 2 and then mounted. It can be mounted on the substrate 2. For this reason, it is possible to prevent a thermal load on the optical element 5 in the heating process of mounting the photoelectric composite element 4, and to maintain the accuracy of the optical element 5 because the optical element 5 is not affected by thermal expansion and the like, and 5 can be formed of a material having low heat resistance. For this reason, the selection range of the material for manufacturing the optical element 5 is widened, and it becomes possible to manufacture the optical element 5 with better performance.
[0082]
An optical wiring board according to a seventh embodiment of the present invention will be described with reference to FIG. The basic configuration of the optical wiring board 71 of the present embodiment is the same as that of the optical wiring board 61 of the second embodiment, and the board 2 having electric wiring (not shown), and mounted on this board 2 It is composed of the optical wiring 3, the photoelectric composite device 4, the optical device 72 and the like. The optical wiring 3 is arranged on one substrate surface of the substrate 2, and the photoelectric composite device 4 is arranged on the other substrate surface of the substrate 2.
[0083]
However, the optical element 72 is inserted into the opening 73 formed in the substrate 2, and the optical element 72 connects the photoelectric composite element 4 and the optical wiring 3. In addition, the optical signal emitted from or incident on the photoelectric conversion element 8 and the optical signal transmitted through the optical waveguide 6 of the optical wiring 3 are separated by the optical deflection provided in the optical element 72. Due to the action of the element 12, the transmission direction is changed by 90 degrees and coupled.
[0084]
Here, the spread angle Δθ of the far-field image of the surface emitting laser as one mode of the photoelectric conversion element 8 is:
Δθ = 0.31 × (λ / 2s)
(References: Iga, Koyama, "Basic and Application of Surface Emitting Laser", Kyoritsu Shuppan, p33, 1999).
[0085]
λ is the oscillation wavelength, and s is the spot size of the beam. For example, if the oscillation wavelength of the surface emitting laser used for optical wiring is λ = 850 nm and the spot size is s = 5 μm, then Δθ = 0.027 rad.
[0086]
Assuming that the core size of the optical waveguide 10 is 50 μm, when the center of the surface emitting laser coincides with the center of the optical waveguide 10, the distance between the optical element 72 and the photoelectric conversion element 8 is 50 μm / 2tan (Δθ). ) = 926 μm, so that the distance between the optical element 72 and the photoelectric conversion element 8 is preferably 1 μm to 1 mm, more preferably 50 μm to 500 μm.
[0087]
By inserting the optical element 72 into the opening 73 as in the present embodiment, even when the optical wiring 3 and the photoelectric composite element 4 are arranged on the opposite surface of the substrate 2, the optical element 72 and the optical The distance from the electric conversion element 8 can be set to 50 to 500 μm.
[0088]
An optical wiring board according to an eighth embodiment of the present invention will be described with reference to FIG. The optical wiring board of the present embodiment is characterized by a connection structure between the optical element 5 and the photoelectric composite element 4. The basic structure of the optical element 5 and the photoelectric composite element 4 is the same as that of the first embodiment. Is the same.
[0089]
In the optical wiring board of the present embodiment, a positioning means 75 for positioning the optical element 5 and the photoelectric composite element 4 is provided. The positioning means 75 is composed of holes 76 formed on the opposing surfaces of the optical element 5 and the photoelectric composite element 4, and guide pins 77 having both ends inserted into the opposing holes 76. I have.
[0090]
By providing such a positioning means 75, the position shift between the optical element 5 and the photoelectric composite element 4 is prevented, and the photoelectric conversion element 8 of the photoelectric composite element 4 and the optical deflection element 12 of the optical element 5 are connected. The accuracy of the alignment is increased, and the work of the alignment is facilitated.
[0091]
An optical wiring board according to a ninth embodiment of the present invention will be described with reference to FIG. The optical wiring board of the present embodiment is characterized by the structure of the optical element 81, and the other parts (substrate, optical wiring, photoelectric composite element) are the same as in the first embodiment.
[0092]
The optical element 81 is provided with an electric drive element 82 that enables active conversion of an optical signal in the middle of the optical waveguide (core) 10, and an electrode through hole 83 that supplies power to the electric drive element 82 has a clad 11. Is formed in the part. The operation of the electric drive element 82 includes, for example, amplification of an optical signal transmitted in the optical waveguide 10 and blocking of the transmitted optical signal.
[0093]
According to this embodiment, by supplying power to the electric drive element 82 from the electrode inserted into the electrode through-hole 83, active conversion of the optical signal by the electric drive element 82 becomes possible.
[0094]
An optical wiring board according to a tenth embodiment of the present invention will be described with reference to FIG. The optical wiring board of the present embodiment is characterized in that a plurality of optical elements 85a, 85b, 85c are stacked. The lamination direction of the optical elements 85a, 85b, 85c is a direction orthogonal to the substrate surface of the substrate 2 (see FIG. 1).
[0095]
In addition to the optical waveguide 10, the first-layer optical element 85a is connected to the optical waveguide 86a connected to the optical waveguide 10 of the second-layer optical element 85b and the optical waveguide 10 of the third-layer optical element 85c. An optical waveguide 86b is formed. In addition to the optical waveguide 10, an optical waveguide 86c connected to the optical waveguide 10 of the third-layer optical element 85c is formed in the second-layer optical element 85b.
[0096]
By having the plurality of optical elements 85a, 85b, 85c stacked in this way, the transmission capacity of an optical signal per unit area can be increased.
[0097]
An eleventh embodiment of the present invention will be described with reference to FIG. The present embodiment is a method for manufacturing the optical element 5, and this embodiment shows a case where two optical elements 5 are formed at the same time.
[0098]
FIG. 12A shows a state in which a groove 92 is formed on a first dummy substrate 91 in parallel with the substrate surface, and an epoxy material or the like is embedded in the groove 92 to form a first core 93. The first core 93 has a 45-degree inclined portion 94 for forming a light deflecting element.
[0099]
FIG. 12B shows a state in which a clad 96 is formed on a second dummy substrate 95 and a second core 97 extending in a direction perpendicular to the substrate surface of the second dummy substrate 95 is formed in the clad 96. is there.
[0100]
FIG. 12C shows a state where the first dummy substrate 91 and the second dummy substrate 95 are bonded together, and the end surface of the second core 97 and the end surface of the first core 93 are joined. The second core 97 and the first core 93 have a continuous structure.
[0101]
FIG. 12D shows that after the bonding shown in FIG. 12C, the first dummy substrate 91 is removed to expose the first core 93, and a portion of the exposed 45 degree inclined portion 94 in the first core 93. In this state, the light deflection element 98 is formed. The formation of the light deflecting element 98 includes forming a hologram mirror by embossing, forming a metal mirror by depositing a metal film, and the like.
[0102]
FIG. 12E shows a state in which the exposed first core 93 is covered with the cladding 99 after the formation of the light deflecting element 98.
[0103]
FIG. 12F shows a state in which the second dummy substrate 95 is detached, and the two optical elements 5 formed simultaneously by cutting at the central portion are individually separated, and the optical element 5 is completed.
[0104]
According to the method for manufacturing the optical element 5, the optical element 5 can be reduced in size, and the surface angle, surface size, surface roughness, and the like of the optical deflecting element 98 can be manufactured with high precision along with the reduction in size. become able to.
[0105]
In the present embodiment, the case where two optical elements 5 are simultaneously formed and separated into two at the final stage has been described as an example. However, three or more optical elements 5 are simultaneously formed and the final You may make it separate at a stage. By increasing the number of optical elements 5 formed simultaneously, the manufacturing cost is reduced.
[0106]
【The invention's effect】
According to the optical wiring board of the first aspect of the present invention, since the optical deflecting element is provided on the optical element which is a separate component from the optical wiring, the optical element can be reduced in size and the size of the optical element can be reduced. The surface angle, surface size, surface roughness, and the like of the light deflecting element can be manufactured with high accuracy, whereby the deflection efficiency of the light deflecting element can be increased and the transmission efficiency of the optical signal can be increased.
[0107]
According to the optical wiring board according to the second aspect of the present invention, the optical element provided with the optical deflecting element can be formed as a separate component from the optical wiring, whereby the optical element can be downsized. With the miniaturization, the surface angle, surface size, surface roughness, and the like of the optical deflecting element can be manufactured with high accuracy, so that the deflection efficiency of the optical deflecting element and the transmission efficiency of the optical signal can be increased.
[0108]
According to the invention described in claim 3, in the optical wiring board according to claim 2, the optical element, the optical wiring, and the photoelectric composite element are provided on the same surface side of the substrate, and the optical element is Since it is positioned between the photoelectric composite device and the substrate, the distance between the optical device and the photoelectric composite device is reduced, and transmission of an optical signal between the optical device and the photoelectric composite device is reduced. It can be performed with high efficiency.
[0109]
According to the fourth aspect of the present invention, in the optical wiring board according to the second aspect, the optical wiring and the photoelectric composite element are separately arranged on both the front and back surfaces of the substrate, and the optical element is connected to the optical wiring. Since the through-hole is formed on the same surface side, the through-hole penetrating the substrate in a front-to-back direction is formed at a position where the photoelectric conversion element of the photoelectric composite element and the optical deflection element of the optical element face each other. The optical element can be mounted after the optoelectronic composite element is mounted on the substrate, and the heat load on the optical element during the heating process when mounting the optoelectric composite element can be prevented, and the optical element can be heated by the heat. Since the optical element is not affected by thermal expansion or the like due to a load, accuracy can be maintained, and the optical element can be formed of a material having low heat resistance.
[0110]
According to the fifth aspect of the present invention, in the optical wiring board according to the second aspect, the optical wiring and the photoelectric composite element are separately arranged on both front and back surfaces of the substrate, and an opening is formed in the substrate. Since the optical element is inserted into the opening, the optical element can be inserted into the opening and mounted after mounting the photoelectric composite element on the substrate. The heat load on the optical element during the heating process can be prevented, the precision can be maintained because the optical element is not affected by thermal expansion, etc., due to the heat load, and the optical element can be formed of a material having low heat resistance. Further, since the alignment between the photoelectric conversion element of the photoelectric composite element and the optical deflection element of the optical element can be performed directly without passing through a hole or the like formed in the substrate, the accuracy of the alignment can be increased and the alignment accuracy can be improved. The Raimento work can be facilitated.
[0111]
According to the sixth aspect of the present invention, in the optical wiring board according to any one of the second to fifth aspects, the positioning means for positioning the photoelectric composite element and the optical element is provided. By using this positioning means, the alignment accuracy between the optical element and the photoelectric composite element can be increased, and the alignment work can be facilitated.
[0112]
According to a seventh aspect of the present invention, in the optical wiring board according to any one of the first to sixth aspects, an electric element that enables active conversion of an optical signal transmitted through the optical element inside the optical element. A drive element is provided, and an electrode through-hole for supplying power to the electric drive element is formed in the optical element, so that power supply to the electric drive element provided inside the optical element is performed through the electrode through-hole. This can be achieved by inserting an electrode into the optical element. By providing such an electric drive element in the optical element, the function of the optical element can be improved. Formation can also be performed with high precision.
[0113]
According to an eighth aspect of the present invention, in the optical wiring board according to any one of the first to seventh aspects, the optical element intersects a transmission direction of an optical signal transmitted through the optical waveguide in the optical wiring. , The transmission capacity per unit area of the optical signal transmitted in the optical wiring can be increased. Can be done.
[0114]
According to the ninth aspect of the present invention, in the optical wiring board according to any one of the first to eighth aspects, an optical waveguide is formed in the optical element, and the optical deflecting element is arranged in the middle of the optical waveguide. Since the end of the optical waveguide faces the optical wiring and the photoelectric conversion element, an optical signal transmitted through the optical element is transmitted through the optical waveguide. Signal transmission efficiency can be improved.
[0115]
According to the tenth aspect of the present invention, in the optical wiring board according to the ninth aspect, the diameter of the optical waveguide is larger at an emission side portion from the optical deflection element than at an incidence side portion to the optical deflection element. Since it is formed with a diameter, it is possible to reduce leakage of an optical signal transmitted through the optical waveguide toward the optical deflecting element to the outside of the optical waveguide without hitting the optical deflecting element, thereby increasing deflection efficiency by the optical deflecting element. And the transmission efficiency of the optical signal can be increased.
[0116]
According to an eleventh aspect of the present invention, in the optical wiring board according to the ninth or tenth aspect, the optical waveguide of the optical wiring and the optical waveguide of the optical element are a self-supporting waveguide type made of a low elastic material. Since the optical coupling is performed by the optical coupling element, even when the optical axis of the optical wiring and the optical axis of the optical element are misaligned, the self-supporting waveguide type optical coupling element is formed of a low elastic material. Since the self-supporting waveguide type optical coupling element is deformed in accordance with the displacement, high-precision alignment is not required when optically coupling the optical wiring and the optical element, and the cost for optical coupling can be reduced.
[0117]
According to a twelfth aspect of the present invention, in the optical wiring board according to any one of the first to eleventh aspects, as the optical deflecting element, a total reflection mirror and an air clad located outside a mirror surface of the total reflection mirror are provided. Are provided, the light deflection efficiency can be increased, the optical element can be formed at a low temperature, and the number of parts can be reduced.
[0118]
According to a thirteenth aspect of the present invention, in the optical wiring substrate according to any one of the first to eleventh aspects, a metal mirror on which a metal film is formed is provided as the optical deflecting element. And the optical element can be formed at a low temperature.
[0119]
According to the fourteenth aspect of the present invention, in the optical wiring board according to any one of the first to eleventh aspects, a hologram mirror is provided as the light deflecting element, so that the light deflecting efficiency can be improved. The optical element can be formed at a low temperature.
[0120]
According to the fifteenth aspect of the present invention, in the optical wiring substrate according to any one of the first to eleventh aspects, a diffraction grating mirror is provided as the light deflecting element, so that the light deflection efficiency can be increased. At the same time, the optical element can be formed at a low temperature.
[0121]
According to the method of manufacturing an optical wiring board according to the present invention, the optical element is mounted on the substrate after the optoelectronic composite element is mounted on the substrate. The heat generated in the heating process can be prevented from being transmitted to the optical element, and the thermal expansion of the optical element due to the influence of the heat at the time of mounting the photoelectric composite element can be prevented, and the performance of the optical element can be maintained.
[0122]
According to the method for manufacturing an optical element of an optical wiring board according to the invention of claim 17, the first dummy substrate on which the first core is formed, and the second dummy substrate on which the clad and the second core are formed, The end face of the core and the end face of the second core are bonded together so that the first dummy substrate is removed to expose the first core, and a light deflecting element is provided at the junction between the first core and the second core. Since the optical element can be manufactured by forming and covering the exposed first core with the clad, the optical element can be miniaturized, and with the miniaturization, the surface angle and the surface The size, surface roughness and the like can be manufactured with high accuracy.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a schematic structure of an optical wiring board according to a first embodiment of the present invention.
FIG. 2 is an enlarged sectional view showing the structure of the optical element.
FIG. 3 is a cross-sectional view illustrating a structure of an optical element which is a component of an optical wiring board according to a second embodiment of the present invention.
FIG. 4 is a cross-sectional view showing a structure of an optical element which is a component of an optical wiring board according to a third embodiment of the present invention.
FIG. 5 is a cross-sectional view illustrating a structure of an optical element that is a component of an optical wiring board according to a fourth embodiment of the present invention.
FIG. 6 is a cross-sectional view illustrating a structure of an optical element that is a component of an optical wiring board according to a fifth embodiment of the present invention.
FIG. 7 is a sectional view showing a schematic structure of an optical wiring board according to a sixth embodiment of the present invention.
FIG. 8 is a sectional view showing a schematic structure of an optical wiring board according to a seventh embodiment of the present invention.
FIG. 9 is a sectional view showing an alignment structure between an optical element and a photoelectric conversion element, which are components of an optical wiring board according to an eighth embodiment of the present invention.
FIG. 10 is a cross-sectional view illustrating a structure of an optical element that is a component of an optical wiring board according to a ninth embodiment of the present invention.
FIG. 11 is a cross-sectional view showing a laminated structure of a plurality of optical elements which are components of an optical wiring board according to a tenth embodiment of the present invention.
FIG. 12 is a process diagram illustrating a method for manufacturing an optical element that is a component of the optical wiring board according to the eleventh embodiment of the present invention.
FIG. 13 is a cross-sectional view showing a conventional optical wiring.
[Explanation of symbols]
2 substrate
3 Optical wiring
4 Photoelectric composite device
5 Optical element
6 Optical waveguide
8 photoelectric conversion element
10 Optical waveguide
12 Optical deflection element
14 Total reflection mirror
15 Air Clad
21 Optical element
22 Optical waveguide
31 Optical element
32 optical waveguide
34 Light deflection element, metal mirror
41 Optical element
42 Optical waveguide
44 Light deflection element, hologram mirror
51 Optical element
52 optical waveguide
52a Incident side part
52b Outgoing side part
62 Through hole
73 opening
75 Positioning means
82 Electric drive element
83 Electrode through hole
85a, 85b, 85c Optical element
91 First dummy substrate
93 First Core
95 Second dummy substrate
96 clad
97 Second Core
98 Optical deflector
99 clad

Claims (17)

An optical wiring on which an optical waveguide for transmitting an optical signal is formed,
An optical element having an optical deflecting element for coupling an optical signal transmitted through the optical waveguide and an optical signal transmitted in a direction crossing the optical signal, and an optical element formed as a separate component from the optical wiring, ,
An optical wiring board comprising: A substrate having electrical wiring;
Provided on the substrate, a photoelectric composite element having a photoelectric conversion element,
An optical wiring provided on the substrate and formed with an optical waveguide through which an optical signal is transmitted in parallel with the surface of the substrate,
An optical deflecting element provided on the substrate, for coupling an optical signal conveyed through the optical waveguide and an optical signal conveyed in a direction crossing the optical signal and input / output to the photoelectric conversion element; An optical element;
An optical wiring board having: The optical element, the optical wiring and the photoelectric composite element are provided on the same surface side of the substrate,
3. The optical wiring board according to claim 2, wherein the optical element is positioned between the photoelectric composite element and the substrate. The optical wiring and the photoelectric composite device are separately arranged on both front and back surfaces of the substrate,
The optical element is disposed on the same surface side as the optical wiring,
3. The optical wiring board according to claim 2, wherein a through hole penetrating the substrate in a front-to-back direction is formed at a position where the photoelectric conversion element of the photoelectric composite element and the optical deflection element of the optical element face each other. The optical wiring and the photoelectric composite device are separately arranged on both front and back surfaces of the substrate,
An opening is formed in the substrate,
3. The optical wiring board according to claim 2, wherein the optical element is inserted into the opening. 6. The optical wiring board according to claim 2, further comprising a positioning unit for positioning the photoelectric composite element and the optical element. An electric drive element that enables active conversion of an optical signal transmitted through the optical element is provided inside the optical element, and a through hole for an electrode that supplies power to the electric drive element is formed in the optical element. The optical wiring board according to any one of claims 1 to 6, wherein: The optical wiring board according to claim 1, wherein the optical elements are stacked in a direction intersecting a transmission direction of an optical signal transmitted through the optical waveguide in the optical wiring. 2. An optical waveguide is formed in the optical element, and the optical deflection element is arranged in the middle of the optical waveguide, and an end of the optical waveguide faces the optical wiring and the photoelectric conversion element. 9. The optical wiring board according to any one of items 8 to 8. 10. The optical wiring board according to claim 9, wherein the diameter of the optical waveguide is formed such that a portion on the light exit side from the light deflecting element has a larger diameter than a portion on the light incident side to the light deflecting element. 11. The optical wiring board according to claim 9, wherein the optical waveguide of the optical wiring and the optical waveguide of the optical element are optically coupled by a self-supporting waveguide type optical coupling element made of a low elastic material. The optical wiring board according to claim 1, wherein the optical deflecting element includes a total reflection mirror and an air clad located outside a mirror surface of the total reflection mirror. The optical wiring substrate according to claim 1, wherein a metal mirror on which a metal film is formed is provided as the optical deflecting element. The optical wiring substrate according to claim 1, wherein a hologram mirror is provided as the light deflection element. The optical wiring substrate according to claim 1, wherein a diffraction grating mirror is provided as the light deflecting element. On a substrate having electric wiring, an opto-electric composite element having an opto-electric conversion element, an optical wiring in which an optical waveguide for transmitting an optical signal is formed parallel to the surface of the substrate, and the optical waveguide is conveyed. A method for manufacturing an optical wiring board, comprising: an optical element having an optical deflecting element for coupling an optical signal and an optical signal conveyed in a direction crossing the optical signal and inputting and outputting to the photoelectric conversion element. And
A method of manufacturing an optical wiring board, wherein the optical element is mounted on the substrate after the optoelectronic composite element is mounted on the substrate. Forming a first core extending on the first dummy substrate in parallel with the substrate surface of the first dummy substrate,
Forming a clad on the second dummy substrate,
Forming a second core extending in a direction intersecting with the substrate surface of the second dummy substrate in the clad,
Bonding the first dummy substrate and the second dummy substrate such that the end surface of the first core and the end surface of the second core are joined,
Removing the first dummy substrate to expose the first core,
Forming a light deflecting element at the junction between the first core and the second core,
Coating the exposed first core with a clad,
Removing the second dummy substrate,
A method for manufacturing an optical element of an optical wiring board, comprising:

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