JP4487772B2 - Optical waveguide module - Google Patents

Description

  The present invention relates to an optical waveguide module in which a sheet-like optical waveguide having a reflecting surface inclined at an end is mounted on a mounting substrate so that a planar optical element can be used. More specifically, a waveguide support portion is provided on both sides of a mounting recess in which a planar optical element is mounted so that the end portion of the optical waveguide can be supported.

  In addition, a wavelength selective filter is disposed immediately below the reflecting surface, so that wavelength division multiplexing bidirectional optical transmission can be performed with a simple configuration.

  Furthermore, the adhesive strength of the optical waveguide to the mounting substrate is increased by performing a surface treatment for improving the wettability of the adhesive on the surface of the mounting substrate.

  Conventionally, information transmission between boards in electronic devices, between chips, etc. has been performed by electrical signals, but optical wiring technology has attracted attention in order to realize ultra high speed, large capacity information transmission, A waveguide-type optical module has been proposed that can perform wavelength-division bidirectional optical transmission using optical wiring technology (see, for example, Patent Document 1).

  The conventional optical module uses an end surface light emitting element (LD) and an end surface light receiving element (PD). However, in the configuration of Patent Document 1, the light receiving element is mounted separately from the light emitting element side. It must be mounted on a carrier and aligned with the optical waveguide. Furthermore, the wavelength filter that realizes wavelength division multiplexing optical transmission is also a separate part, and it is necessary to fix it to the end face of the waveguide, so that the assembly process is complicated and cost reduction is difficult.

  On the other hand, the surface type light emitting / receiving element is easier to manufacture than the end face type and suitable for surface mounting, so the cost is lower than that of the end face type. This is advantageous. In particular, the surface light emitting device (VCSEL) has a merit that it can be directly modulated at high speed, and is very promising as a device for a low cost optical module. There is a need for optical modules.

  However, the configuration of Patent Document 1 requires another mounting carrier in order to replace the light emitting element with the VCSEL, which further complicates the assembly process and makes it difficult to reduce the cost.

  Therefore, an optical module that can mount a VCSEL without using a mounting carrier has been proposed (see, for example, Patent Document 2).

  In the configuration of Patent Document 2, a recess is formed in the mounting substrate, and a surface light emitting element or light receiving element is mounted in the recess. In addition, a reflection part of 45 degrees is formed at the end of the optical waveguide, and the optical waveguide is mounted on the mounting substrate so that the reflection part is directly above the light emitting element or the light receiving element.

JP 2001-305365 A Japanese Patent Laid-Open No. 10-300961

  In order to form a 45 degree reflection part at the end of the optical waveguide and perform optical coupling with the surface optical element, the end part where the reflection part of the optical waveguide is formed needs to protrude into the recess. There is. For this reason, the portion where the reflection portion of the optical waveguide protruding into the recess is formed is free with respect to the mounting substrate, and positional displacement occurs between the light receiving and emitting element due to expansion and contraction of the optical waveguide due to heat or the like. There is a problem that cannot be suppressed.

  In addition, when used for a long period of time, warpage or the like occurs in the portion protruding into the concave portion of the optical waveguide, and it is impossible to suppress positional deviation and angular deviation between the light emitting and receiving element, and excessive loss occurs. is there.

  Furthermore, although the mounting substrate is generally made of silicon, the adhesive that bonds and fixes the optical waveguide has poor wettability with respect to the silicon substrate, and the adhesive is not uniformly applied, so there is a problem that the adhesive strength is insufficient. . If the adhesive strength is insufficient, there is a problem that the optical waveguide is displaced due to the influence of temperature or the like, and the displacement between the light receiving and emitting elements cannot be suppressed.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide an optical waveguide module that can reliably fix an optical waveguide and has a simple configuration.

In order to solve the above-described problem, an optical waveguide module according to the present invention includes an inclined end surface formed at at least one end portion, and a plurality of cores that intersect at the inclined end surface and have a reflecting surface formed by the inclined end surface. And an optical waveguide having a clad covering the core. Still further, a mounting recess that is formed at a position facing the reflection surface below the optical waveguide and that is optically coupled to the core via the reflection surface is mounted; and A mounting substrate having a waveguide support portion formed on both sides and supporting the optical waveguide is also provided.
Further, the optical waveguide module according to the present invention is disposed on the cladding under the core, directly below the reflecting surface, and selectively reflects and transmits light in an arbitrary wavelength region, and the optical path depends on the wavelength of the light. A wavelength selection filter for switching between.

  In the optical waveguide module according to the present invention, when the optical waveguide is mounted on the mounting substrate such that the surface optical element is mounted in the mounting recess of the mounting substrate, and the core and the surface optical element are optically coupled via the reflective surface, Since the adhesive fixing cannot be performed at the mounting recess portion, the portion located at the upper portion of the mounting recess at the end of the optical waveguide is free. On the other hand, both sides of the mounting recess are provided with the waveguide support portions, and both sides of the portion that is free at the end of the optical waveguide are bonded and fixed to the mounting substrate.

  The optical waveguide module according to the present invention is an optical waveguide module including an optical waveguide having a core and a cladding, and a mounting substrate that supports the optical waveguide. The optical waveguide has an inclined end surface at least at one end. A wavelength selection filter that forms a reflection surface by the end surface of the core exposed on the inclined end surface, selectively reflects and transmits light in an arbitrary wavelength region directly below the reflection surface, and switches an optical path according to the wavelength of the light And a planar optical element that is optically coupled to the core via the reflective surface is mounted on the lower mounting substrate of the optical waveguide facing the reflective surface.

  In the optical waveguide module according to the present invention, the light propagated through the core is reflected by the reflecting surface and is incident on the wavelength selection filter. In the wavelength selection filter, incident light is reflected or transmitted according to the wavelength, and the optical path is switched.

  According to the optical waveguide module of the present invention, the optical waveguide can be supported by providing the waveguide support portions on both sides of the mounting recess formed for mounting the planar optical element. Due to optical coupling with the mold optical element, both sides of the portion that cannot be bonded and fixed to the mounting substrate and become free in the air are fixed to the mounting substrate. As a result, the number of free portions is reduced, so that an increase in coupling loss due to deformation such as expansion and contraction of the optical waveguide due to heat and warpage of the optical waveguide due to long-term use can be reduced.

  In addition, according to the optical waveguide module of the present invention, an inclined end face is formed on the end face of the optical waveguide, and a wavelength selection filter is disposed immediately below the reflection surface by the inclined end face, so that the wavelength can be obtained using the planar optical element. An optical waveguide module capable of performing multiplex bidirectional optical communication can be realized by an easy assembly process.

  As described above, an optical waveguide module having excellent optical coupling characteristics and high reliability over a long period can be provided at low cost.

  Hereinafter, embodiments of the optical waveguide module of the present invention will be described with reference to the drawings.

<Configuration Example of Optical Waveguide Module of First Embodiment>
FIG. 1 is a configuration diagram illustrating an example of an optical waveguide module according to the first embodiment, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line AA in FIG. (C) is BB sectional drawing of Fig.1 (a).

  The optical waveguide module 1 </ b> A of the first embodiment includes a waveguide sheet 2 that constitutes a planar optical waveguide, and a mounting substrate 3 that supports the waveguide sheet 2. The waveguide sheet 2 is made of, for example, a polymer material, and includes a plurality of cores 4 arranged in parallel, a lower cladding 5a, and an upper cladding 5b, and has a core-cladding structure. The core 4 is configured such that the refractive index is slightly larger than that of the lower cladding 5a and the upper cladding 5b, and light is confined in the core 4 and propagated.

  The waveguide sheet 2 includes an inclined end surface 6 at one end. The inclined end surface 6 is configured by inclining the end portion of the waveguide sheet 2 at 45 degrees with respect to the lower surface of the waveguide sheet 2, and the end surface of each core 4 is exposed. The end surface of the core 4 is the same 45-degree inclined surface as the inclined end surface 6, and the reflecting surface 6 a is configured by the end surface of the core 4 exposed to the inclined end surface 6.

  The mounting substrate 3 is, for example, a silicon (Si) substrate, and the waveguide sheet 2 is mounted on the surface. The mounting substrate 3 is mounted with a surface light emitting element (VCSEL) 7 and a surface light receiving element (PD) 8 in accordance with the pitch of the core 4 of the waveguide sheet 2.

  Further, the mounting substrate 3 includes a mounting recess 9 for mounting the surface light emitting element 7 and the surface light receiving element 8 so as to face the reflecting surface 6 a of each core 4 of the waveguide sheet 2. The mounting recess 9 is formed with a part of the surface of the mounting substrate 3 being concave, and includes an electrode pad 9a on the bottom surface.

  The surface light emitting element 7 is mounted in the mounting recess 9 so that the light emitting portion 7a faces the reflecting surface 6a of the predetermined core 4 of the waveguide sheet 2, and is electrically connected to the electrode pad 9a. The bonding pad 7b is electrically connected to an electronic component (not shown) by wire bonding.

  The surface light receiving element 8 is mounted in the mounting recess 9 so that the light receiving portion 8a faces the reflecting surface 6a of the predetermined core 4, and is electrically connected to the electrode pad 9a. The bonding pad 8b is electrically connected to an electronic component (not shown) by wire bonding.

  The mounting recesses 9 are independently formed corresponding to the individual surface light emitting elements 7 and the surface light receiving elements 8, and waveguide support portions 10 are formed on both sides of each mounting recess 9. The waveguide support unit 10 is configured by the same plane as the surface of the mounting substrate 3 on which the waveguide sheet 2 is mounted, and supports one end side of the waveguide sheet 2.

  The waveguide sheet 2 is bonded and fixed to the mounting substrate 3 with an adhesive 11. The bonding position 11a by the adhesive 11 is the entire surface of the upper surface of the mounting substrate 3 that contacts the waveguide sheet 2, and the waveguide support portions 10 on both sides of the mounting recess 9 that do not contact the waveguide sheet 2 are also bonded positions 11a. It becomes.

  The optical waveguide module 1A is optically coupled to the core 4 of the waveguide sheet 2 by connecting an optical fiber (not shown). For example, an optical fiber may be fitted in a guide groove (not shown) formed on the mounting substrate 3 so as to align the core 4 of the waveguide sheet 2 and the optical fiber, or may be formed on the waveguide sheet 2. A configuration may be provided in which an optical fiber is fitted into a guide groove (not shown) and the core 4 of the waveguide sheet 2 and the optical fiber are aligned.

<Operation Example of Optical Waveguide Module of First Embodiment>
In the optical waveguide module 1 </ b> A, an electric signal is converted into an optical signal by the surface light emitting element 7. The surface light emitting element 7 emits light in the vertical direction with respect to the surface of the mounting substrate 3. As a result, the output optical signal emitted from the light emitting portion 7a of the surface light emitting element 7 enters from the lower surface of the inclined end surface 6 of the waveguide sheet 2 and is reflected by the reflecting surface 6a of the opposing core 4 to transmit light. The propagation direction is changed by 90 degrees and propagated through the core 4 of the waveguide sheet 2. Then, the optical signal propagated through the core 4 of the waveguide sheet 2 is propagated through an optical fiber (not shown) and received by the opposing device.

  An input optical signal output from a counter device (not shown) and propagated through the optical fiber is propagated through the core 4 of the waveguide sheet 2 and reflected by the reflecting surface 6a, whereby the light propagation direction is converted by 90 degrees. In the surface light receiving element 8, light from the vertical direction is incident on the surface of the mounting substrate 3. As a result, the optical signal reflected by the reflection surface 6a of the core 4 in the waveguide sheet 2 is emitted from the lower surface of the inclined end surface 6 and received by the light receiving portion 8a of the opposed surface light receiving element 8, and the surface light receiving element. 8 is converted into an electric signal.

<Example of mounting board manufacturing process>
FIG. 2 is a process explanatory view showing an example of a manufacturing process of the mounting substrate 3. Next, a manufacturing process of the mounting substrate 3 constituting the optical waveguide module 1A of the first embodiment will be described.

  As a material for forming the mounting substrate 3, a silicon substrate 12 (crystal orientation <100>) having a thermal oxide film 12a on the surface is used. First, as shown in FIG. 2 (a), a predetermined surface is formed on the surface of the silicon substrate 12 so that the position where the mounting recess 9 for mounting the surface light emitting element 7 and the surface light receiving element 8 described in FIG. The photoresist 13 having the opening 13a is patterned.

  Thereafter, the thermal oxide film 12a in the opening is removed by ion etching (RIE: Reactive Ion Etching) using a fluorine-based gas. The masked photoresist 13 is removed by ashing with oxygen plasma.

  Next, as shown in FIG. 2B, the silicon substrate 12 is placed in, for example, a KOH aqueous solution (concentration 20 wt%) at 70 ° C., and silicon is etched to form the mounting recess 9.

  Next, as shown in FIG. 2C, electrode pads 9 a are formed in a predetermined pattern on the bottom surface of the mounting recess 9. In this example, the electrode pad 9a has a three-layer structure of titanium (Ti), platinum (Pt), and gold (Au) from the lower layer, vapor deposition is used for forming the metal film, and photoresist is used for pattern formation. The electrode pad 9a is formed by the lift-off process.

  As a method for forming the metal film, plating or sputtering may be used in addition to vapor deposition. Also, pattern formation may be performed by etching.

  When the wafer is manufactured in a wafer state, the substrate is finally diced into the form of the mounting substrate 3 to complete the mounting substrate 3 having the mounting recess 9.

<Example of Manufacturing Process of Waveguide Sheet of First Embodiment>
FIG. 3 is an explanatory view showing an example of the manufacturing process of the waveguide sheet 2. Next, the manufacturing process of the waveguide sheet 2 constituting the optical waveguide module 1A of the first embodiment will be described.

  First, as shown in FIG. 3A, an ultraviolet curable polymer material constituting the lower clad 5a is applied on the support substrate 14 by spin coating or the like, pre-baked, and then irradiated with ultraviolet rays to form a thin film. Is cured to form the lower clad 5a.

  Next, as shown in FIG. 3B, an ultraviolet curable polymer material constituting the core 4 is applied onto the lower clad 5a by spin coating or the like, and a mask (not shown) on which the pattern of the core 4 is formed is applied. Then, the portion where the core 4 is formed is cured by irradiating with ultraviolet rays, and the portions other than the portion where the core 4 is formed are removed by solution development to form the core 4 in a predetermined pattern. As the polymer material constituting the core 4, a material having a slightly higher refractive index than the polymer material constituting the lower clad 5a and the upper clad 5b is used.

  Next, as shown in FIG. 3C, an ultraviolet curable polymer material constituting the upper clad 5b is applied onto the lower clad 5a and the core 4 by spin coating or the like, pre-baked, and then irradiated with ultraviolet rays. Then, the thin film is cured by post-baking to form the upper clad 5b. In this example, the polymer material constituting the upper clad 5b is the same as the polymer material constituting the lower clad 5a. However, if the refractive index is substantially equal to that of the lower clad 5a, a different material should be used. Is also possible.

  Next, as shown in FIG. 3 (d), the inclined end surface 6 is diced by using a dicing plate having an angle of 45 degrees as shown in FIG. 3D. And the reflective surface 6a is formed. In addition, the portion that becomes the other side is diced using a dicing plate having an angle of 90 degrees to cut out the waveguide sheet 2 having a predetermined shape.

  And as shown in FIG.3 (e), the waveguide sheet 2 is peeled from the support substrate 14, and the waveguide sheet 2 is completed.

  In the above example, the pattern of the core 4 is formed by a photolithography process using an ultraviolet curable polymer material. However, a patterning method by metal mold using a thermosetting resin, or a metal mask There is also a method in which a pattern is transferred by RIE and masked with the like.

<Example of Manufacturing Process of Optical Waveguide Module of First Embodiment>
The surface light-emitting element 7 and the surface light-receiving element 8 are mounted on the mounting substrate 3 manufactured in the process described with reference to FIG. 2, and the waveguide sheet 2 manufactured in the process described with reference to FIG. 1A is formed.

  Hereinafter, an example of a manufacturing process of the entire optical waveguide module 1A will be described. In the mounting recess 9 of the mounting substrate 3 manufactured in the process described with reference to FIG. Mount components and make electrical connections by wire bonding.

  Next, in the waveguide sheet 2 manufactured in the process described with reference to FIG. 3, the reflection surface 6 a of each core 4 has a light emitting portion 7 a of the corresponding surface light emitting element 7 and a true light receiving portion 8 a of the surface light receiving element 8. Positioning is performed so as to come up, and the adhesive 11 is fixed to the mounting substrate 3.

  Since the waveguide sheet 2 transmits light, a visible light (405, 436 nm) curable adhesive is used for the adhesive 11, and the adhesive 11 is irradiated by irradiating visible light after the alignment of the waveguide sheet 2. Curing is performed, and the waveguide sheet 2 is bonded and fixed to the mounting substrate 3.

  Here, the end of the waveguide sheet 2 on the inclined end surface 6 side is located on the mounting recess 9. For this reason, the adhesive 11 is also applied to the waveguide support 10 between the adjacent mounting recesses 9 so that the waveguide sheet 2 is bonded to the mounting substrate 3.

  Thus, by providing the waveguide sheet 2 with the waveguide support portions 10 on both sides of the mounting recess 9 formed for mounting the surface light emitting element 7 and the surface light receiving element 8, In the waveguide sheet 2, both sides of the portion that cannot be bonded and fixed to the mounting substrate 3 and become free in the air are fixed to the mounting substrate 3 because of optical coupling with the surface light emitting element 7 or the surface light receiving element 8. Thereby, since the part which becomes free decreases, the increase in the coupling loss by deformation | transformation of the expansion / contraction of the waveguide sheet 2 by heat | fever, the curvature of the waveguide sheet 2 by long-term use, etc. can be reduced.

  As described above, the mounting recess 9 is formed in the mounting substrate 3 to mount the surface light emitting element 7 and the surface light receiving element 8, and the waveguide sheet 2 having the reflection surface 6 a by the inclined end surface 6 is mounted on the mounting substrate 3. In the configuration in which the waveguide sheet 2 is optically coupled to the surface light-emitting element 7 and the surface light-receiving element 8, the mounting recess 9 has the surface light-emitting element 7 and the surface light-receiving element 8 on the surface of the mounting substrate 3. It is necessary to make the depth so that it does not protrude from.

  Further, if the gap between the surface light emitting element 7 and the surface light receiving element 8 and the waveguide sheet 2 is wide, the light coupling efficiency is lowered. Therefore, the surface light emitting element 7 and the surface light receiving element 8 and the waveguide sheet 2 are reduced. It is necessary to strictly control the gap.

  For this reason, the mounting substrate 3 is preferably formed of a silicon substrate. By using silicon for the mounting substrate 3, a highly accurate mounting recess 9 can be easily formed by anisotropic etching, so that the gap between the surface light-emitting element 7 and the surface light-receiving element 8 can be precisely set. It can be controlled and good optical coupling can be obtained. Further, since the mounting recess 9 can be formed while leaving the formation site of the waveguide support 10, the waveguide support 10 can be formed between the adjacent mounting recesses 9. Furthermore, silicon has high thermal conductivity, and good heat dissipation characteristics can be obtained.

<Configuration Example of Optical Waveguide Module of Second Embodiment>
4A and 4B are configuration diagrams showing an example of the optical waveguide module according to the second embodiment. FIG. 4A is a plan view, FIG. 4B is a cross-sectional view taken along the line C-C in FIG. (C) is DD sectional drawing of Fig.4 (a). In the following description, the same components as those of the optical waveguide module 1A according to the first embodiment will be described with the same numbers.

  In the optical waveguide module 1B of the second embodiment, a mounting recess 3 for mounting the surface light-emitting element 7 and the surface light-receiving element 8 is formed on the mounting substrate 3 that supports the waveguide sheet 2. A waveguide support portion 10 is formed at a position below the waveguide sheet 2, and a connection recess 9 b is formed at a position outside the waveguide sheet 2 between the mounting recesses 9. 9 is connected by a connecting recess 9b.

  Similarly to the mounting recess 9, the connection recess 9 b is formed with a part of the surface of the mounting substrate 3 being recessed, and is formed together with the mounting recess 9 by the process of forming the mounting recess 9 by etching as described above.

  Furthermore, in the optical waveguide module 1B of the second embodiment, each mounting recess 9 is filled with the transparent resin 15 using the connection recess 9b. The transparent resin 15 is a transparent resin having moisture resistance and a refractive index equivalent to that of the waveguide sheet 2, and uses, for example, polyimide silicon.

  In each mounting recess 9, a transparent resin 15 is filled between the surface light-emitting element 7 and the surface light-receiving element 8 and the lower end surface of the waveguide sheet 2 where light enters and exits the waveguide sheet 2. This stabilizes the output light from the waveguide sheet 2 by reducing excess loss due to reflection at the incident end face of the waveguide sheet 2 and suppressing changes in the output mode of the surface light emitting element 7 due to reflected return light. It becomes possible.

  Further, by using a moisture-resistant material as the transparent resin 15, moisture to the surface light emitting element 7 and the surface light receiving element 8 can be shielded, and thus the surface light emitting element 7 and the surface light receiving element 8. It becomes possible to improve the reliability.

  In the optical waveguide module 1B of the second embodiment, the mounting recesses 9 are connected by the connection recesses 9b. Therefore, in the step of filling the mounting recesses 9 with the transparent resin 15, the connection recesses are filled once. Since all the mounting recesses 9 can be filled with the transparent resin 15 via 9b, the process can be simplified.

  In addition, as with the optical waveguide module 1A of the first embodiment, the mounting recess 9 having an independent form can be filled with the transparent resin 15, but each mounting recess 9 has a small volume and is filled. It is difficult to control the amount of the transparent resin 15 to be processed. On the other hand, by connecting the mounting recesses 9 with the connecting recesses 9b, the volume of the recesses is increased as compared with the case where the mounting recesses 9 are divided, so that the control of the transparent resin 15 to be filled becomes easy. The mounting process of the transparent resin 15 can be easily performed.

  Here, also in the optical waveguide module 1B of the second embodiment, the waveguide support portion 10 is formed at the lower side of the waveguide sheet 2 on both sides of the mounting recess 9, and in the waveguide sheet 2, Due to optical coupling with the surface light-emitting element 7 or the surface light-receiving element 8, both sides of the portion that cannot be bonded and fixed to the mounting substrate 3 and become free in the air are fixed to the mounting substrate 3.

  As a result, as in the optical waveguide module 1A of the first embodiment, the free portion of the waveguide sheet 2 is reduced, so that the waveguide sheet 2 can be expanded and contracted due to heat, and the waveguide sheet can be used over a long period of time. The increase in coupling loss due to deformation such as warpage of 2 can be reduced.

<Configuration Example of Optical Waveguide Module of Third Embodiment>
FIGS. 5A and 5B are configuration diagrams showing an example of the optical waveguide module according to the third embodiment. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along line EE in FIG. In the following description, the same components as those of the optical waveguide module 1A according to the first embodiment will be described with the same numbers.

  The optical waveguide module 1 </ b> C of the third embodiment includes a waveguide sheet 2 that constitutes a planar optical waveguide, and a mounting substrate 3 that supports the waveguide sheet 2. The waveguide sheet 2 is made of, for example, a polymer material, and includes a first core 4a and a second core 4b, a lower clad 5a, and an upper clad 5b, and has a core / cladding structure. The first core 4a and the second core 4b are configured so that the refractive index is slightly larger than that of the lower cladding 5a and the upper cladding 5b, and light is confined in the first core 4a and the second core 4b. Propagated.

  The first core 4a and the second core 4b intersect at the intersection 4c, and the intersection angle of the first core 4a and the second core 4b at the intersection 4c is 90 degrees. The intersection 4c is located on one side of the waveguide sheet 2, and one side of the waveguide sheet 2 on which the intersection 4c is located is 45 degrees with respect to the first core 4a and the second core 4b. It extends at an angle. Further, the other side of the waveguide sheet 2 where the end of the second core 4b is located extends at an angle of 90 degrees with respect to the second core 4b.

  One side of the waveguide sheet 2 where the intersecting portion 4c is located is inclined 45 degrees with respect to the lower surface of the waveguide sheet 2 and includes a first inclined end surface 16a, and the end of the second core 4b. The other side of the waveguide sheet 2 where the is located is inclined by 45 degrees with respect to the lower surface of the waveguide sheet 2 and includes a second inclined end face 16b.

  The first inclined end surface 16a is exposed at the end surface at the intersecting portion 4c of the first core 4a and the second core 4b to form the first reflecting surface 17a. Further, the second inclined end face 16b is exposed to the end face of the second core 4b to form a second reflecting face 17b.

  The waveguide sheet 2 includes a wavelength selection filter 18 on the lower surface facing the first reflecting surface 17a formed at the intersection 4c of the first core 4a and the second core 4b. The wavelength selection filter 18 has a function of selectively reflecting and transmitting light in an arbitrary wavelength region. For example, the wavelength selective filter 18 is configured to reflect light of wavelength λ1 and transmit light of wavelength λ2. In this example, the wavelength selection filter 18 is formed in the lower clad 5a of the waveguide sheet 2 as will be described later.

  The mounting substrate 3 is, for example, a silicon (Si) substrate, and the waveguide sheet 2 is mounted on the surface. The mounting substrate 3 is mounted with a surface light emitting element (VCSEL) 7 and a surface light receiving element (PD) 8.

  Furthermore, the mounting substrate 3 mounts the surface light-receiving element 8 facing the first reflecting surface 17a of the waveguide sheet 2 and mounts the surface light-emitting element 7 facing the second reflecting surface 17b. The mounting recess 9 is provided. The mounting recess 9 is formed with a part of the surface of the mounting substrate 3 being concave, and includes an electrode pad 9a on the bottom surface.

  The surface light emitting element 7 is mounted in the mounting recess 9 so that the light emitting portion 7a faces the second reflecting surface 17b of the waveguide sheet 2, and is electrically connected to the electrode pad 9a. The bonding pad 7b is electrically connected to an electronic component (not shown) by wire bonding.

  The surface light receiving element 8 is mounted in the mounting recess 9 so that the light receiving portion 8a faces the first reflecting surface 17a, and is electrically connected to the electrode pad 9a. The bonding pad 8b is electrically connected to an electronic component (not shown) by wire bonding.

  The mounting recess 9 is independently formed corresponding to the surface light emitting element 7 and the surface light receiving element 8, and the waveguide support portions 10 are formed on both sides of each mounting recess 9. The waveguide support unit 10 is configured in the same plane as the surface of the mounting substrate 3 on which the waveguide sheet 2 is mounted, and supports the end side of the waveguide sheet 2.

  The waveguide sheet 2 is bonded and fixed to the mounting substrate 3 with an adhesive 11. The bonding position by the adhesive 11 is the entire surface of the upper surface of the mounting substrate 3 that is in contact with the waveguide sheet 2, and the waveguide support portions 10 on both sides of the mounting recess 9 that are not in contact with the waveguide sheet 2 are also bonding positions. .

  The optical waveguide module 1C is optically coupled to the first core 4a of the waveguide sheet 2 by connecting an optical fiber (not shown). For example, an optical fiber may be fitted into a guide groove (not shown) formed on the mounting substrate 3 so as to align the first core 4a of the waveguide sheet 2 and the optical fiber, or the waveguide sheet 2 may be provided. An optical fiber may be fitted in a guide groove (not shown) formed in the above, and the first core 4a of the waveguide sheet 2 and the optical fiber may be aligned.

<Example of Operation of Optical Waveguide Module of Third Embodiment>
In the optical waveguide module 1C, an input signal from a counter device (not shown) is incident on the waveguide sheet 2 through an optical fiber as an optical signal having a wavelength λ2 (for example, λ2 = 790 nm). The input optical signal incident on the waveguide sheet 2 is propagated through the first core 4 a and reflected by the first reflecting surface 17 a, so that the light propagation direction is converted by 90 degrees and incident on the wavelength selection filter 18. To do.

  Since the wavelength selective filter 18 transmits the light having the wavelength λ2 as described above, the optical signal from the opposite device (not shown) reflected by the first reflecting surface 17a is transmitted through the wavelength selective filter 18 and the waveguide sheet 2. Is emitted from the lower surface side of the first inclined end surface 16 a, received by the light receiving portion 8 a of the surface light receiving element 8, and converted into an electric signal by the surface light receiving element 8.

  On the other hand, in the optical waveguide module 1 </ b> C, the electric signal is converted into an optical signal by the surface light emitting element 7. Here, the oscillation wavelength of the surface light emitting element 7 is λ1 (for example, λ1 = 850 nm). The output optical signal emitted from the light emitting portion 7a of the surface light emitting element 7 enters from the lower surface side of the second inclined end surface 16b of the waveguide sheet 2 and is reflected by the second reflecting surface 17b to propagate light. The direction is changed by 90 degrees and propagated through the second core 4 b of the waveguide sheet 2.

  The optical signal propagated through the second core 4 b of the waveguide sheet 2 is reflected by the first reflecting surface 17 a so that the light propagation direction is changed by 90 degrees and enters the wavelength selection filter 18.

  Since the wavelength selective filter 18 reflects the light having the wavelength λ1 as described above, the optical signal from the surface light emitting element 7 reflected by the first reflective surface 17a is reflected by the wavelength selective filter 18 and again the first. The light is reflected by the reflecting surface 17a so that the light propagation direction is changed by 90 degrees and propagated through the first core 4a. The optical signal propagated through the first core 4a of the waveguide sheet 2 is propagated through an optical fiber (not shown) and received by the opposing device.

  In a counter device (not shown), as an optical waveguide module that is paired with the optical waveguide module 1C, a wavelength selection filter that has the same configuration as the optical waveguide module 1C, transmits light of wavelength λ1, and reflects light of wavelength λ2. By using an optical waveguide module including a surface light emitting device having an oscillation wavelength λ2, a plurality of optical signals of different wavelengths are separated and multiplexed to transmit optical signals of a plurality of different wavelengths to one optical fiber. It becomes possible.

  Accordingly, by providing the optical waveguide module 1C, it is possible to construct a system in which wavelength division multiplexing optical communication (WDM) is performed.

<Example of Manufacturing Process of Waveguide Sheet of Third Embodiment>
FIG. 6 is an explanatory view showing an example of the manufacturing process of the waveguide sheet 2. Next, the manufacturing process of the waveguide sheet 2 constituting the optical waveguide module 1C of the third embodiment will be described.

  First, as shown in FIG. 6A, an ultraviolet curable polymer material constituting the first layer of the lower clad 5a is applied onto the support substrate 14 by spin coating or the like, pre-baked, and then irradiated with ultraviolet rays. The thin film is cured by irradiation to form the lower clad first layer 5a (1).

  Next, as shown in FIG. 6B, a dielectric multilayer film constituting the wavelength selection filter 18 is formed at a predetermined position on the lower cladding first layer 5a (1). In this example, first, a photoresist is applied, and a portion where a dielectric multilayer film is to be formed is removed by patterning. Next, after forming a dielectric multilayer film on the entire surface of the lower cladding first layer 5a (1) by vapor deposition, the photoresist is etched with a solution to remove the photoresist and the dielectric multilayer film on the photoresist by a lift-off process. Then, the wavelength selective filter 18 made of a dielectric multilayer film is formed only at a desired location.

  Next, as shown in FIG. 6C, the lower clad second layer 5a (2) is formed on the lower clad first layer 5a (1) by the same process as the lower clad first layer 5a (1). Form. Thus, the lower clad 5a is formed in a form in which the wavelength selection filter 18 is sandwiched between the lower clad first layer 5a (1) and the lower clad second layer 5a (2).

  Next, as shown in FIG. 6D, an ultraviolet curable polymer material constituting the first core 4a and the second core 4b is applied onto the lower clad 5a by spin coating or the like, The portion where the first core 4a and the second core 4b are formed is cured by irradiating ultraviolet rays through a mask (not shown) in which the patterns of the core 4a and the second core 4b are formed, and the core is formed by solution development. The first core 4a and the second core 4b are formed in a predetermined pattern by removing portions other than the formation site. As the polymer material constituting the first core 4a and the second core 4b, a material having a slightly higher refractive index than the polymer material constituting the lower cladding 5a and the upper cladding 5b is used.

  Next, as shown in FIG. 6E, an ultraviolet curable polymer material constituting the upper clad 5b is applied onto the lower clad 5a, the first core 4a, and the second core 4b by spin coating or the like. After pre-baking, the thin film is cured by irradiating with ultraviolet rays and post-baking to form the upper clad 5b. In this example, the polymer material constituting the upper clad 5b is the same as the polymer material constituting the lower clad 5a. However, if the refractive index is substantially equal to that of the lower clad 5a, a different material should be used. Is also possible.

  Next, as shown in FIG. 6 (f), a dicing plate having an angle of 45 degrees is used as a side where the first inclined end face 16a and the second inclined end face 16b described in FIG. 5 are formed. By using and dicing, the first inclined end surface 16a and the first reflecting surface 17a, the second inclined end surface 16b and the second reflecting surface 17b are formed. In addition, the portion that becomes the other side is diced using a dicing plate having an angle of 90 degrees to cut out the waveguide sheet 2 having a predetermined shape.

  Then, as shown in FIG. 6G, the waveguide sheet 2 is peeled from the support substrate 14 to complete the waveguide sheet 2.

  In the above example, the pattern of the first core 4a and the second core 4b is formed by a photolithography process using an ultraviolet curable polymer material, but the mold is formed using a thermosetting resin. There are also a method of patterning, a method of masking with a metal mask or the like, and a method of forming a pattern by transferring by RIE.

<Example of Manufacturing Process of Optical Waveguide Module of Third Embodiment>
Below, the example of a manufacturing process of the optical waveguide module 1C whole is demonstrated. In addition, the manufacturing process of the mounting substrate 3 may be the same as the process demonstrated in FIG. First, the surface light-emitting element 7 and the surface light-receiving element 8 and an electronic component (not shown) are mounted in the mounting recess 9 of the mounting substrate 3 and are electrically connected by wire bonding or the like.

  Next, in the waveguide sheet 2 manufactured in the process described with reference to FIG. 6, the first reflection surface 17 a is located immediately above the light receiving portion 8 a of the surface light receiving element 8, and the second reflection surface 17 b is Positioning is performed so that the light emitting portion 7 a of the surface light emitting element 7 is positioned directly above, and the surface light emitting element 7 is fixed to the mounting substrate 3 with an adhesive 11.

  Since the waveguide sheet 2 transmits light, a visible light (405, 436 nm) curable adhesive is used for the adhesive 11, and the adhesive 11 is irradiated by irradiating visible light after the alignment of the waveguide sheet 2. Curing is performed, and the waveguide sheet 2 is bonded and fixed to the mounting substrate 3.

  Then, as described above, an optical waveguide module capable of performing wavelength division multiplexing optical communication by bonding an optical fiber (not shown) to the vertical cut side of the waveguide sheet 2 with the other end face of the first core 4a exposed. 1C is completed.

  As described above, the first inclined end face 16a is formed on the end face of the waveguide sheet 2, and the wavelength selective filter 18 is disposed immediately below the first reflecting face 17a by the first inclined end face 16a. By making the core 4a and the second core 4b branch under the first reflecting surface 17a, wavelength division multiplexing optical communication can be performed using the surface light emitting element 7 and the surface light receiving element 8. The optical waveguide module 1C can be realized by an easy assembly process.

  In addition, since the process of manufacturing the wavelength selective filter 18 by integrating it in the waveguide sheet 2 is possible, the mounting process of the wavelength selective filter 18 can be omitted.

  In the above configuration, the lower clad 5a is formed in two layers and the wavelength selection filter 18 is formed therebetween. However, the lower clad 5a is formed as a single lower clad 5a without being divided into two layers, and a wavelength is formed thereon. After forming the selection filter 18, it is good also as a structure which forms a core layer.

  In such a configuration, the light reflected by the first reflecting surface 17a is reflected by the wavelength selection filter 18 without being diffused out to the lower clad 5a and coupled to the second core 4b. Can be reduced. However, since the wavelength selective filter 18 exists immediately below the first core 4a and the second core 4b, the propagation loss of light in the core increases at the site where the wavelength selective filter 18 is formed. Therefore, it is necessary to form the wavelength selection filter 18 only in a portion where light is reflected as much as possible.

<Configuration Example of Optical Waveguide Module of Fourth Embodiment>
7A and 7B are configuration diagrams showing an example of an optical waveguide module according to the fourth embodiment. FIG. 7A is a plan view, and FIG. 7B is a cross-sectional view taken along line FF in FIG. In the following description, the same components as those of the optical waveguide module 1C of the third embodiment will be described with the same numbers.

  In the optical waveguide module 1D of the fourth embodiment, the wavelength selection filter 18 is not integrated in the waveguide sheet 2 and is separately provided on the lower surface of the lower cladding 5a facing the first reflection surface 17a of the waveguide sheet 2. In this configuration, the manufactured wavelength selection filter 18 is attached. Furthermore, the size of the wavelength selection filter 18 is adjusted to the size of the mounting recess 9 in which the surface light receiving element 8 is mounted.

  Other configurations and operations are the same as those of the third optical waveguide module 1C. Now, the wavelength selective filter 18 is affixed to the lower surface of the lower clad 5a, and the size thereof is adjusted to the size of the mounting recess 9 in which the surface light receiving element 8 is mounted, thereby being emitted from the surface light emitting device 7. Even if the stray light that is not coupled to the second core 4b but is coupled to the clad layer is reflected by the first inclined end surface 16a in the direction of the surface light receiving element 8, it is reflected by the wavelength selection filter 18, and the waveguide sheet 2 It does not exit from the bottom surface. Thereby, it is possible to prevent stray light from entering the surface light receiving element 8 due to multiple reflection and causing crosstalk.

  In the third and fourth embodiments, the number of cores through which signals are input / output is one, but a large number of cores are arranged in a predetermined pattern to perform transmission / reception in multi-channels. It is also possible to configure an optical waveguide module.

<Configuration Example of Optical Waveguide Module of Fifth Embodiment>
In the optical waveguide modules 1 of the first to fourth embodiments described above, the film-formed waveguide sheet 2 is attached to the mounting substrate 3 with the adhesive 11, but the wettability of the adhesive 11 with respect to the mounting substrate 3. If it is poor, the adhesive 11 is not uniformly applied to the waveguide sheet 2 and the adhesive strength is lowered.

  If the adhesive 11 is not evenly applied, particularly, a decrease in the adhesive strength due to the influence of temperature and humidity is noticeable, and the waveguide sheet 2 is displaced due to the decrease in the adhesive strength, which causes a problem in coupling with the optical element. Arise. Therefore, surface treatment is performed on the surface of the mounting substrate 3 before the waveguide sheet 2 is attached to the mounting substrate 3.

  FIG. 8 is a cross-sectional view showing a main configuration of an optical waveguide module 1E according to the fifth embodiment. In the optical waveguide module 1E, for example, the waveguide sheet 2 formed into a film is attached to the mounting substrate 3 with an adhesive 11 in the same manner as the optical waveguide module 1A shown in FIG.

  The waveguide sheet 2 is made of, for example, a polymer material, and includes a core 4, a lower cladding 5a, and an upper cladding 5b, and has a core / cladding structure. The mounting substrate 3 is a silicon substrate.

  And the wettability of the adhesive 11 with respect to the mounting substrate 3 is improved by applying the adhesive 11 on the surface treatment agent 19 applied on the mounting substrate 3. A silane coupling agent is used as the surface treatment agent 19.

<Example of Manufacturing Process of Optical Waveguide Module of Fifth Embodiment>
FIG. 9 is an explanatory diagram showing an example of a manufacturing process of the optical waveguide module according to the fifth embodiment. Hereinafter, an example of a manufacturing process of the optical waveguide module 1E according to the fifth embodiment will be described. In addition, the manufacturing process of the mounting substrate 3 may be the same as the process demonstrated in FIG. 2, for example, and the manufacturing process of the waveguide sheet 2 may be the same as the process demonstrated in FIG.

  First, as shown in FIG. 9A, a silane coupling agent is applied to the surface of the mounting substrate 3 on which the mounting recess 9 shown in FIG. Next, as shown in FIG. 1 and the like, the surface light-emitting element 7 and the surface light-receiving element 8 and an electronic component (not shown) are mounted in the mounting recess 9 of the mounting substrate 3 and are electrically connected by wire bonding or the like. I do.

  Next, as shown in FIG. 9B, for example, a visible light curable adhesive 11 is applied on the surface treatment agent (silane coupling agent) 19 applied on the mounting substrate 3, and is described with reference to FIG. 3. After aligning the waveguide sheet 2 produced in the above process, visible light is irradiated to cure the adhesive 11, and the waveguide sheet 2 is bonded and fixed to the mounting substrate 3.

<Effect of Optical Waveguide Module of Fifth Embodiment>
As a specific embodiment, in the process shown in FIG. 3, the lower clad 5a having a thickness of about 30 μm on the support substrate 14, the core 4 having a quadrangular cross section and a size of about 40 × 40 μm, and the upper portion having a thickness of about 30 μm The waveguide sheet 2 was produced by sequentially laminating the clad 5b. Then, the inclined end face 6 was formed by dicing and peeled from the support substrate 14 to produce a film-like waveguide sheet 2 having a thickness of about 100 μm.

  The mounting substrate 3 was produced by the process shown in FIG. A 5 w% aqueous silane coupling agent solution was applied as a surface treating agent 19 to the surface of the mounting substrate 3 and dried at 100 ° C. for 5 minutes. As the silane coupling agent, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane was used.

  Thereafter, the adhesive 11 was applied on the surface treatment agent (silane coupling agent) 19 and the waveguide sheet 2 was bonded and fixed to produce an optical waveguide module 1E having a sectional structure as shown in FIG.

  FIG. 10 is a cross-sectional view showing an example of an optical waveguide module of a comparative example. In the optical waveguide module of the comparative example, the adhesive 11 is applied on the mounting substrate 3 manufactured by the process shown in FIG. 2 without applying the surface treatment agent (silane coupling agent) 19, and the optical waveguide module shown in FIG. The waveguide sheet 2 produced by the process is bonded and fixed. The configuration of the waveguide sheet 2 was the same as the example shown in FIG.

  In the example in which the surface treatment agent (silane coupling agent) 19 is applied on the mounting substrate 3, the wettability of the adhesive 11 to the mounting substrate 3 is good, and the adhesive 11 spreads uniformly on the mounting substrate 3, so that the mounting is possible. When the waveguide sheet 2 was bonded to the substrate 3, no bubbles remained between the mounting substrate 3 and the waveguide sheet 2.

  On the other hand, in the comparative example in which the surface treatment agent (silane coupling agent) 19 is not applied on the mounting substrate 3, the adhesive 11 does not spread uniformly on the mounting substrate 3, and the waveguide sheet 2 is adhered to the mounting substrate 3. In addition, air bubbles remained between the mounting substrate 3 and the waveguide sheet 2, and a uniform adhesive layer was not produced.

  FIG. 11 is an explanatory diagram showing the effect of the silane coupling agent. Specific effects will be described below. The wettability of the adhesive made of an organic solvent is poor with respect to an inorganic surface such as silicon, and when the surface treatment of the mounting substrate 3 is not performed, the adhesive 11 is interposed between the mounting substrate 3 and the waveguide sheet 2. Unevenness occurs in the adhesive layer, such as bubbles that remain without being uniformly wrapped. When such adhesion unevenness occurs, the adhesive strength is low, and particularly when used in a high temperature and high humidity environment or when stored, the adhesive strength is significantly reduced. Then, the waveguide sheet 2 is displaced due to a decrease in adhesive strength, causing a problem in coupling with the optical element.

  On the other hand, when the inorganic surface of silicon constituting the mounting substrate 3 is treated with a silane coupling agent, the silane coupling agent and the organic polymer material constituting the waveguide sheet 2 as shown in FIG. Due to the interaction, the wettability of the adhesive 11 made of an organic resin to the mounting substrate 3 can be improved.

  As a result, a uniform adhesive layer is formed between the mounting substrate 3 and the waveguide sheet 2, and the adhesive strength is high, so that sufficient adhesive strength can be maintained even when used in a high temperature and high humidity environment. And reliability is improved.

As the silane coupling agent used as a surface treatment agent 19 is not limited to those described in the above embodiments, are represented by the formula _{R 2 -Si- (OR 1) 3} , OR 1 is a methoxy group, Any silane coupling agent, such as an ethoxy group, where R ₂ is, for example, a vinyl group, an epoxy group, an amino group, a methacryl group, a mercapto group, or the like can be used.

  Specifically, for example, trimethoxysilane, triethoxysilane, tripropoxysilane, triisopropoxysilane, tributoxysilane, trioctyloxysilane, methyldimethoxysilane, ethyldimethoxysilane, methyldiethoxysilane, ethyldiethoxysilane, Use methyldioctyloxysilane, dimethylmethoxysilane, dimethyloctyloxysilane, vinylmethoxysilane, vinylethoxysilane, methacryloxypropyltrimethoxysilane, aminopropyltrimethoxysilane, aminopropyltriethoxysilane, mercaptopropyltrimethoxysilane, etc. be able to.

  These silane coupling agents are diluted with various compatible solvents so that the concentration is 0.1 to 50 w%, preferably 0.1 to 20 w%. Examples of the solvent to be diluted include water, methyl alcohol, ethyl alcohol, propanol, isopropyl alcohol, butanol, acetone, toluene, xylene, methyl ethyl ketone, and the like.

  The mounting substrate 3 is not limited to a silicon substrate, and may be anything as long as it forms a chemical bond with a silane coupling agent, such as a glass substrate.

<Modification of Optical Waveguide Module of Fifth Embodiment>
The overall configuration of the optical waveguide module 1E of the fifth embodiment may be any configuration of the optical waveguide modules of the first to fourth embodiments. Furthermore, other configurations may be used.

  FIG. 12 is a perspective view showing a modification of the optical waveguide module. An optical waveguide module 1 </ b> F shown in FIG. 12 is configured by inserting a wavelength selection filter 18 into a groove 20 formed in the waveguide sheet 2 and performing an optical wavelength division duplex optical communication.

  As shown in FIG. 3, when the waveguide sheet 2 is manufactured by a photolithography process, a highly accurate groove 20 can be easily formed in the waveguide. In this example, the core 4 has a substantially Y-shaped pattern, and a groove 20 is provided at the branch point. When the waveguide 20 is formed using an ultraviolet curable polymer material, the groove 20 is irradiated with ultraviolet rays through a mask having a predetermined shape in the waveguide formation process, and other than the portion where the groove 20 is formed. Is cured, and for example, the formation site of the groove 20 is removed by solution development.

  As shown in FIG. 8, the waveguide sheet 2 provided with the groove 20 and the inclined end surface 6 is bonded and fixed by the adhesive 11 to the mounting substrate 3 that has been surface-treated with a silane coupling agent as the surface treating agent 19. The effect of using the silane coupling agent is as described above.

  The wavelength selection filter 18 is configured to reflect, for example, light having a wavelength λ1 and transmit light having a wavelength λ2, and is inserted into the groove 20 and fixed with an adhesive.

  In the above configuration, the output optical signal having the wavelength λ 2 emitted from the surface light emitting element 7 mounted in the mounting recess 9 is reflected by the reflecting surface formed on the inclined end surface 6 of the waveguide sheet 2, and the core 4 Is propagated. The signal light having the wavelength λ <b> 2 propagated through the core 4 is transmitted through the wavelength selection filter 18, enters the core 4, and is propagated to the optical fiber 21.

  The input signal light having the wavelength λ 1 incident from the optical fiber 21 is propagated through the core 4 and incident on the wavelength selection filter 18. Since the wavelength selective filter 18 reflects the light with the wavelength λ 1, the signal light with the wavelength λ 1 propagated through the core 4 is reflected by the wavelength selective filter 18, propagated through the core 4, and enters the light receiving element 22.

  As described above, in the optical waveguide module 1F, by demultiplexing a plurality of optical signals having different wavelengths, it becomes possible to transmit a plurality of optical signals having different wavelengths to one optical fiber 21. By providing the waveguide module 1F, it is possible to construct a system in which wavelength division multiplexing optical communication is performed.

  The present invention is applied to an optical communication module between boards or chips of an electronic device, a connector of a communication cable using an optical fiber, and the like.

It is a block diagram which shows an example of the optical waveguide module of 1st Embodiment. It is process explanatory drawing which shows the example of a manufacturing process of a mounting substrate. It is explanatory drawing which shows the example of a manufacturing process of a waveguide sheet. It is a block diagram which shows an example of the optical waveguide module of 2nd Embodiment. It is a block diagram which shows an example of the optical waveguide module of 3rd Embodiment. It is explanatory drawing which shows the example of a manufacturing process of a waveguide sheet. It is a block diagram which shows an example of the optical waveguide module of 4th Embodiment. It is sectional drawing which shows the principal part structure of the optical waveguide module of 5th Embodiment. It is explanatory drawing which shows the example of a manufacturing process of the optical waveguide module of 5th Embodiment. It is sectional drawing which shows an example of the optical waveguide module of a comparative example. It is explanatory drawing which shows the effect of a silane coupling agent. It is a perspective view which shows the modification of an optical waveguide module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical waveguide module, 2 ... Waveguide sheet, 3 ... Mounting board, 4 ... Core, 5a ... Lower clad, 5b ... Upper clad, 6 ... Inclined end surface, 6a ... reflective surface, 7 ... surface light emitting element, 7a ... light emitting part, 8 ... surface light receiving element, 8a ... light receiving part, 9 ... mounting recess, 9a ... Electrode pad, 9b ... Connection recess, 10 ... Waveguide support, 11 ... Adhesive, 11a ... Adhesion position, 12 ... Silicon substrate, 12a ... Thermal oxide film, 13. .... Photoresist, 13a ... opening, 14 ... support substrate, 15 ... transparent resin, 16a ... first inclined end face, 16b ... second inclined end face, 17a ... 1st reflective surface, 17b ... 2nd reflective surface, 18 ... wavelength selection filter, 19 ... surface treatment agent

Claims (7)

An optical waveguide having an inclined end surface formed at at least one end, a plurality of cores intersecting at the inclined end surface and having a reflecting surface formed by the inclined end surface, and a clad covering the core;
A mounting recess formed on a lower side of the optical waveguide and facing the reflection surface and mounted with a surface optical element optically coupled to the core via the reflection surface, and formed on both sides of the mounting recess. A mounting substrate having a waveguide support part for supporting the optical waveguide;
Directly below the reflecting surface, disposed on the lower clad of the core, selectively reflects and transmits light in an arbitrary wavelength region, and switches the optical path according to the wavelength of the light; and
An optical waveguide module comprising: The optical waveguide, the optical waveguide module of 請 Motomeko 1 wherein that is bonded to a surface and the waveguide support of the mounting substrate. On the mounting recess, the optical waveguide module of 請 Motomeko 1, wherein the resin Ru is filled with the optical waveguide and the equivalent refractive index. Optical waveguide module of the resin 請 Motomeko 3 wherein that having a moisture resistance. The mounting substrate is composed of silicon, 請 Motomeko first optical waveguide module according the mounting recess that is produced by anisotropic etching. The optical waveguide is fabricated by a polymer material, Ru sheet der 請 Motomeko first optical waveguide module according. The mounting board, the optical waveguide module of 請 Motomeko 1, wherein a surface treatment for improving the wettability that have been subjected for adhesive bonding and fixing the optical waveguide.

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