JP2001051142A - Optical integrating device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute compaction of an optical integrating device, by forming by fixing an optical fiber capable of propagating a light signal, on the surface of an optical waveguide. SOLUTION: This optical integrating device 10 is so composed that an optical waveguide 14 formed by being equipped with a waveguide core 12 and clad layers 13 on a substrate 11 is formed integrally, and that an optical wiring fiber 15 capable of propagating a light signal is fixed on the surface of the optical waveguide 14. As optical connection between optical parts themselves or between an optical circuit and the optical parts can be executed with a small radius of curvature by using the optical wiring fiber 15, this optical integrating device 10 can be made compact and the optical connection can be executed with a small transmission loss. By fixing the optical wiring fiber 15 on the surface of the optical waveguide 14 by using an ultraviolet-ray hardening adhesive 20, the optical wiring fiber 15 can be fixed easily after the optical parts or electronic parts are installed on the optical waveguide 14, therefore, this optical integrating device 10 can be manufactured inexpensively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical integrated device having an optical waveguide integrally provided on a substrate, an optical integrated device in which an optical circuit, an optical component, and the like are installed on a printed circuit board on which an electric circuit is formed. And their manufacturing methods.

[0002]

2. Description of the Related Art In order to spread optical fiber communication, there is a demand for integration of optical circuits and reduction in price. In order to realize these, an optical waveguide is integrally provided on a substrate, and an optical circuit is formed in the optical waveguide, or an optical integrated device in which an optical component is mounted on the waveguide optical circuit ( There has been proposed an optical integrated device (first optical integrated device) or an optical integrated device (second optical integrated device) in which an optical circuit or an optical component is fused and installed on a printed circuit board on which an electric circuit is formed.

FIGS. 8 and 9 show the latter second optical integrated device. The optical integrated device 10 of FIG.
0 indicates a DFB (Distribution) on a printed circuit board (not shown).
butted-feedback) laser array 101,
Optical modulator array 102, optical multiplexer 103, optical multiplexer / demultiplexer 1
04, hybrid gate array 105, optical filter 1
06 and a photodetector 107 are installed, the DFB laser array 101 and the optical modulator array 102 are optically connected by an optical fiber array 108, and the optical modulator array 102 and the optical multiplexer 103 are optically connected by an optical fiber array 109, respectively. And the optical multiplexer / demultiplexer 104 are optically connected by the optical fiber 110, and the optical multiplexer / demultiplexer 104 and the hybrid gate array 105 are optically connected by the optical fiber arrays 111 and 112. Further, the optical multiplexer / demultiplexer 104, the optical filter 106, and the optical filter 106 And photo detector 1
07 is optically connected by optical fibers 113 and 114, respectively.

Here, the optical multiplexer / demultiplexer 103 and the optical multiplexer / demultiplexer 104 are waveguide type optical circuits, and the optical multiplexer / demultiplexer 104 and the hybrid gate array 105 are connected to the printed circuit board 11.
5 and the printed board 115 is attached to the printed board (not shown).

In such an optical integrated device 100, the DFB
Wavelengths λ1, λ2, λ output from laser array 101
The optical signals of 3 and λ4 are input to the optical modulator array 102 to modulate their respective light intensities, and then input to the optical multiplexer 103 to be multiplexed and wavelength-multiplexed. This optical multiplexer 1
The optical signal wavelength-multiplexed at 03 is input to the optical multiplexer / demultiplexer 104 and demultiplexed, and the optical signal of each wavelength is input again to the optical multiplexer / demultiplexer 104 via the hybrid gate array 105 and multiplexed. As for the optical signal multiplexed by the optical multiplexer / demultiplexer 104, an optical signal having a desired wavelength is selected by an optical filter 106 and received by a photodetector 107.

An optical integrated device 120 shown in FIG. 9 is an optical filter device for selecting an optical signal of a desired wavelength from wavelength-multiplexed optical signals. , An optical branching circuit 122, an optical gate circuit 123, an optical multiplexer 124, a drop receiving circuit 125, and an add transmitting circuit 126, and the optical demultiplexer 121 and the optical branching circuit 122 are connected by an optical fiber array 127. The circuit 122 and the optical gate circuit 123 are connected by an optical fiber array 128, and the optical gate circuit 123 and the optical multiplexer 124, the drop receiving circuit 125, and the add transmitting circuit 126 are connected to the optical fiber arrays 129 and 13, respectively.
0 and 131.

Here, the optical demultiplexer 121 and the optical branching circuit 12
2. The optical gate circuit 123, the optical multiplexer 124, the drop receiving circuit 125, and the add transmitting circuit 126 are, for example, waveguide type optical circuits.

In such an optical integrated device 120, the wavelength λ
When wavelength-multiplexed optical signals of 1, λ2, λ3, and λ4 are input to the input end 132 of the optical demultiplexer 121, the optical signals are converted into optical signals of respective wavelengths by the optical demultiplexer 121. The signal is demultiplexed, then input to the optical branching circuit 122 and branched, and then input to the optical gate circuit 123. This optical gate circuit 123 turns any of the optical gates ON or O
By performing the FF operation, an optical signal of a desired wavelength is selected and output to the optical multiplexer 124 or dropped and received by the drop receiving circuit 125. The optical signals input to the optical multiplexer 124 are multiplexed by the optical multiplexer 124 and output from the output terminal 133 of the optical multiplexer 124. When it is desired to add a new optical signal to the optical signal output from the optical gate circuit 123 to the optical multiplexer 124, the optical transmission circuit 126 is driven to drive the optical signal of the wavelength to be added from the add transmission circuit 126. Is output to the optical multiplexer 124, which multiplexes the light having these wavelengths and outputs the multiplexed light from the output terminal 133.

[0009]

However, the waveguide type optical circuit such as the optical multiplexer 103 and the optical multiplexer / demultiplexer 104, and the above-mentioned first optical integrated device in which optical components are mounted on the waveguide type optical circuit. Has the following problems.

When the pattern of the waveguide core of the waveguide type optical circuit or the optical waveguide in the first optical integrated device is set to a small radius of curvature (for example, 5 mm or less), the optical transmission loss in the waveguide core greatly increases. Therefore, the waveguide core must be set to a large radius of curvature (for example, 5 mm or more). Therefore, a compact and highly integrated waveguide type optical circuit or a compact first optical integrated device cannot be realized.

Therefore, for example, as shown in an optical integrated device 100 of FIG. 8, single-function optical circuits such as an optical multiplexer 103 and an optical multiplexer / demultiplexer 104 are individually manufactured, and these are optical fiber arrays 108 and 109. , Optical fibers 110,..., Etc., constitute the second optical integrated device, but this leads to an increase in the size of the second optical integrated device.

Since the waveguide type optical circuit and the first optical integrated device in which the optical components are mounted on the waveguide type optical circuit cannot be manufactured compactly, the size of the substrate integrated with these optical waveguides also increases. It is difficult to reduce the cost.
When the size of the substrate is increased, the warpage of the substrate cannot be ignored, and the thickness of the clad layer provided on the substrate or the thickness of the core layer for forming the waveguide core provided on the substrate is reduced. As a result, the dimensional accuracy of patterning for forming the waveguide core is reduced. In order to avoid these problems, a polishing apparatus for polishing the surface of a large-sized substrate with high dimensional accuracy, a large-scale film forming apparatus, and a large-scale dry etching apparatus for the above patterning are required. An increase in the cost of the optical circuit and the first optical integrated device is inevitable.

As in the optical integrated device 120 shown in FIG. 9, the optical transmission lines between the optical gate circuit 123, the optical multiplexer 124, the drop receiving circuit 125, and the add transmitting circuit 126 have many intersections with each other. The optical fiber arrays 129, 130, and 131 are used. However, if these optical transmission lines are formed by the waveguide cores in the optical waveguide, not only the manufacturing becomes difficult, but also the optical transmission lines propagate through these optical transmission lines. Crosstalk is deteriorated between optical signals.

Further, the optical integrated device 10 shown in FIGS.
0, the optical integrated device 120 (second optical integrated device) has the following problems.

For example, in the optical integrated device 100, the DF
After optically connecting the B laser array 101, the optical modulator array 102, the optical multiplexer 103, the optical multiplexer / demultiplexer 104,... Using the optical fiber arrays 108, 109, the optical fibers 110,. 101, optical modulator array 102, optical multiplexer 103, optical multiplexer / demultiplexer 104 ...
Are mounted on a printed circuit board (not shown), and the optical fiber arrays 108, 109, and the optical fibers 110 are not fixed to the printed circuit board.
1. To improve the workability of installing the optical modulator array 102, the optical multiplexer 103, the optical multiplexer / demultiplexer 104 on the printed circuit board, the DFB laser array 101, the optical modulator array 102, the optical multiplexer 103, optical multiplexer / demultiplexer 104 ...
Is set to a length equal to or longer than the length required for optical connection. The same applies to the optical fiber arrays 127, 128, 129,... Of the optical integrated device 120 shown in FIG.
Therefore, the optical integrated device 100 and the optical integrated device 120 cannot be made compact.

An object of the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optical integrated device capable of downsizing the device and a method of manufacturing the same.

[0017]

According to a first aspect of the present invention, there is provided an optical integrated device in which an optical waveguide including a waveguide core and a cladding layer is integrally provided on a substrate. Further, an optical fiber capable of transmitting an optical signal is fixed.

According to a second aspect of the present invention, in the first aspect, the optical fiber is disposed and fixed in a groove formed on a surface of the optical waveguide. It is.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the optical fiber is fixed to the surface of the optical waveguide with an ultraviolet curing adhesive.

The invention described in claim 4 is the first to third aspects of the present invention.
In the invention according to any one of the above, the cross-sectional shape of the optical fiber is a circular shape, an elliptical shape, a substantially semicircular shape, or a flat shape having a straight portion at an opposing position.

[0021] The invention according to claim 5 is the invention according to claims 1 to 4.
In the invention according to any one of the above, the size ratio between the cladding layer and the waveguide core in the optical fiber is in the range of 3 to 20 for single mode transmission, and 2 to 10 for multimode transmission. It is characterized by being within the range.

The invention described in claim 6 is the invention according to claims 1 to 5
In the invention described in any one of the above, the substrate is made of glass, a magnetic material, a semiconductor, a polymer material, or a combination thereof.

The invention according to claim 7 is the invention according to claims 1 to 6
In the invention according to any one of the above, the optical fiber,
The optical circuit is characterized by being organically optically connected to at least one of an optical circuit formed on the optical waveguide and an optical component mounted on the optical waveguide.

[0024] The invention described in claim 8 is the invention according to claims 1 to 7.
In the invention described in any one of the above, the optical waveguide or the substrate is provided with at least one of an electric circuit, an electronic component, and an electric wiring.

According to a ninth aspect of the present invention, at least one of an optical circuit and an optical component is installed on a printed circuit board on which an electric circuit is formed, and the optical circuit and the optical component are optically connected by an optical fiber. In the optical integrated device described above, the optical fiber is fixed to the printed circuit board.

According to a tenth aspect of the present invention, in the ninth aspect of the present invention, the optical fiber is fixed to the surface of the printed circuit board with an ultraviolet curing adhesive.

According to an eleventh aspect of the present invention, at least one of an optical circuit and an optical component is previously provided on an optical waveguide integrated with a substrate, and an electric circuit, an electronic component, or an electric wiring of the substrate or the optical waveguide is provided on the substrate or the optical waveguide. At least one is provided in advance, and thereafter, an optical fiber capable of transmitting an optical signal is fixed to a surface of the optical waveguide.

According to a twelfth aspect of the present invention, in the eleventh aspect, the optical fiber is held at an optimum position on the surface of the optical waveguide provided on the substrate. A cured adhesive is applied, and then the adhesive is irradiated with ultraviolet rays to be solidified, thereby fixing the optical fiber to the surface of the waveguide.

According to a thirteenth aspect of the present invention, in the eleventh or twelfth aspect, a groove is formed on the surface of the waveguide, and the optical fiber is held at an optimum position in the groove. Is what you do.

According to a fourteenth aspect of the present invention, in any one of the eleventh to thirteenth aspects, the optimum position of the optical fiber is an optical circuit formed on an optical waveguide or mounted on the waveguide. Position one end of the optical fiber near the optical component, and then propagate an optical signal from the optical circuit or the optical component to the optical fiber, and monitor the optical signal at the other end of the optical fiber. Meanwhile, the present invention is characterized in that the optical fiber is matched with the optical axis of the optical circuit or the optical component.

According to a fifteenth aspect of the present invention, at least one of an optical circuit and an optical component is previously installed on a printed circuit board on which an electric circuit is formed, and at least one of an electronic component and electric wiring is previously installed on the printed circuit board. An optical fiber capable of transmitting an optical signal is fixed to the surface of the printed circuit board after the installation.

According to a sixteenth aspect of the present invention, in accordance with the fifteenth aspect, the optical fiber is held at an optimum position on the surface of a printed circuit board, and then an ultraviolet curing adhesive is applied to the optical fiber. Thereafter, the adhesive is irradiated with ultraviolet rays to be solidified, and the optical fiber is fixed to the surface of the printed circuit board.

According to a seventeenth aspect of the present invention, in the invention of the fifteenth or sixteenth aspect, the optimum position of the optical fiber is one end of the optical fiber near an optical circuit or an optical component installed on a printed circuit board. And then propagating an optical signal from the optical circuit or the optical component to the optical fiber and monitoring the optical signal at the other end of the optical fiber while monitoring the optical fiber and the optical circuit. Alternatively, the present invention is characterized in that the optical axis is aligned with the optical component.

The first, fifth, sixth, seventh and eighth aspects of the invention have the following effects.

On the surface of the optical waveguide integrated on the substrate,
Since the optical fiber capable of transmitting the optical signal is fixed, the optical circuits formed in the optical waveguide, the optical components mounted on the optical waveguide, or the optical circuit and the optical component are Since optical connection can be performed with a small radius of curvature using an optical fiber, the optical integrated device can be made compact.

Also, since the optical fibers fixed to the surface of the optical waveguide can be mounted so as to cross each other, an optical circuit formed in the optical waveguide or an optical component in which optical components mounted on the optical waveguide are densely arranged. The integrated device can be realized without increasing the size of the optical waveguide, so that the optical integrated device can be downsized.

Further, since the optical fiber has a lower optical transmission loss than the waveguide core of the optical waveguide, the optical circuits formed in the optical waveguide, the optical components mounted on the optical waveguide,
Alternatively, the optical circuit and the optical component can be optically connected with a low transmission loss using an optical fiber fixed to the surface of the optical waveguide.

The second aspect of the invention has the following operation.

Since the optical fiber on the surface of the optical waveguide is disposed and fixed in the groove formed on the surface of the optical waveguide, the optical fiber can be securely fixed on the surface of the optical waveguide.

The third aspect of the invention has the following operation.

Since the optical fiber is fixed to the surface of the optical waveguide using an ultraviolet curing adhesive, the fixing of the optical fiber can be easily carried out, so that the optical integrated device can be manufactured at low cost.

The invention according to claim 4 has the following operation.

An optical fiber having an elliptical cross section is more easily fixed to the surface of an optical waveguide than an optical fiber having a circular cross section, and an optical fiber having a substantially semicircular cross section has a higher surface than an optical fiber having an elliptical cross section. Easy to be fixed to. Furthermore,
A flat optical fiber having a straight portion at the opposed position can be satisfactorily fixed to the surface of the optical waveguide in any of the straight portions, so that the workability of fixing the optical fiber can be improved.

The ninth aspect of the invention has the following effects.

Since the optical fiber for optically connecting the optical circuit and the optical component installed on the printed circuit board is fixed to the printed circuit board, the optical circuit and the optical component are connected using the optical fiber. The optical fiber can be configured shorter than when the optical circuit or the like is installed on a printed circuit board and the optical fiber is not fixed to the printed circuit board. Therefore, the optical integrated device can be made compact.

The tenth invention has the following operation.

Since the optical fiber is fixed to the printed circuit board using the ultraviolet curing adhesive, the fixing of the optical fiber can be easily performed, and the optical integrated device can be manufactured at low cost.

The invention according to claims 11, 13 and 14 has the following effects.

On the surface of the optical waveguide integrated on the substrate,
Since the optical fiber capable of transmitting the optical signal is fixed, the optical circuits formed in the optical waveguide, the optical components mounted on the optical waveguide, or the optical circuit and the optical component Since optical connection can be made with a small radius of curvature using a fiber, the optical integrated device can be made compact.

Also, since the optical fibers fixed to the surface of the optical waveguide can be mounted crossing each other, the optical circuit formed in the optical waveguide and the optical component in which the optical components mounted on the optical waveguide are arranged at high density. The integrated device can be realized without increasing the size of the optical waveguide, so that the optical integrated device can be downsized.

Further, since the optical fiber has a lower optical transmission loss than the waveguide core of the optical waveguide, the optical circuits formed in the optical waveguide, the optical components mounted on the optical waveguide,
Alternatively, the optical circuit and the optical component can be optically connected with a low transmission loss using an optical fiber fixed to the surface of the optical waveguide.

The twelfth aspect has the following effects.

Since the optical fiber is fixed to the surface of the optical waveguide by using an ultraviolet curing adhesive, the fixing of the optical fiber can be easily performed, so that the optical integrated device can be manufactured at low cost.

The invention according to claims 15 and 17 has the following effects.

After installing an optical circuit, optical components, electronic components, and electric wiring on the printed circuit board on which the electric circuit is formed, the optical fiber is positioned at an optimum position and fixed to the printed circuit board.
Since optical circuits and optical components are optically connected with this optical fiber, optical fibers are optically connected to the optical circuits and optical components, and then these optical circuits are installed on a printed circuit board and the optical fibers are fixed to the printed circuit board. The optical fiber can be configured to be shorter than in a case where no optical fiber is provided. Therefore, the optical integrated device can be made compact.

The invention according to claim 16 has the following operation.

Since the optical fiber is fixed to the printed circuit board by using the ultraviolet curing adhesive, the fixing of the optical fiber can be easily performed, so that the optical integrated device can be manufactured at low cost.

[0058]

Embodiments of the present invention will be described below with reference to the drawings.

[A] First Embodiment (FIGS. 1 and 2) FIG. 1 shows a first embodiment of an optical integrated device according to the present invention, wherein (A) is a plan view and (B). FIG. 2 is a sectional view taken along line II of FIG.

The optical integrated device 10 shown in FIG.
An optical waveguide 14 having a waveguide core 12 and a cladding layer 13 is integrally provided on the optical waveguide 1, and an optical wiring fiber 15 capable of transmitting an optical signal is fixed on the surface of the optical waveguide 14. Things.

The substrate 11 is made of glass (eg, quartz glass, multi-component glass, etc.), magnetic material (eg, alumina,
Ceramics such as Lumiceram), semiconductors (Si, GaAs)
s), a polymer material (eg, polyimide, epoxy resin, phenol resin, etc.) or a combination thereof (eg, a glass-epoxy mixed type printed board, a laminated structure type board, etc.).

The optical waveguide 14 is constituted by embedding a high-refractive-index waveguide core 12 in a low-refractive-index cladding layer 13 so that an optical signal can propagate through the waveguide core 12. The waveguide core 12 forms at least one optical circuit (not shown) such as an optical branching / coupling circuit, an optical star coupler circuit, an optical multiplexing / demultiplexing circuit, an optical filter circuit, an optical switch circuit, and an optical modulation circuit in the optical waveguide 14. ing.

Further, at least one of an electric circuit, an electronic component, and an electric wiring (not shown) may be provided on the front surface, the back surface, or the inside of the substrate 11 or on the front surface, the back surface, or the inside of the optical waveguide 14.

The optical fiber 15 is constructed by accommodating a high refractive index core 17 in a low refractive index cladding 16. The core 17 is made of glass (for example, quartz glass,
It is made of multi-component glass or the like or plastic (amorphous transparent fluororesin, PMMA (polymethyl methacrylate), fluororesin, crosslinked acrylic resin, etc.). The clad 16 is made of the same kind of plastic as the core 17.

The core ratio (cladding / core) between the cladding 16 and the core 17 in the optical fiber 15 is such that when the optical fiber 15 is a single-mode transmission optical fiber, the diameter of the core 17 is several μm to several tens. μm (for example, 5
10 to 10 μm), and the diameter of the clad 16 is set to 3 to 20 because the diameter of the clad 16 is several tens μm. In the case of an optical fiber for multi-mode transmission, the diameter of the core 17 is set to 10 to several μm to 5 μm.
0 μm (for example, 50 μm), and the diameter of the cladding 16 is 60 μm.
Since it is 、 ２80 μm, it is set in the range of 2 to 10.

As described above, the outer diameter of the optical fiber 15 (that is, the diameter of the clad 16) is so small that the optical signal propagating in the core 17 does not leak from the outer peripheral surface of the clad 16. Therefore, the optical fiber 15
Is intended to ensure flexibility that can be easily bent and to prevent an increase in light transmission loss at the time of bending. For example,
Even when the optical fiber 15 has a radius of curvature of about 1 to 3 mm and the right-angled corner 18 is formed,
The optical transmission loss is set in a favorable range.

By the way, if the right-angled corner portion 18 is to be realized by a waveguide core in the optical waveguide, if the relative refractive index between the waveguide core and the cladding layer is 1%, the optical transmission due to the bending of the waveguide core is performed. The limit of the radius of curvature is about 5 mm in order to keep the loss within an allowable range. Further, when the relative refractive index difference between the waveguide core and the cladding layer is 0.3 to 0.5% of the ordinary, similarly, the radius of curvature is required to keep the optical transmission loss due to the bending of the waveguide core within an allowable range. The limit is about 10 mm.

On the other hand, in the present embodiment, even if the radius of curvature of the optical fiber 15 is set to about 1 to 3 mm,
Since the optical transmission loss due to this bending can be kept within an allowable range, the optical fiber 15 can be wired in a region as narrow as possible to form the right-angled corner portion 18.

This optical distribution fiber 15 is usually
The optical fiber 15A having a circular cross section shown in FIG. 2A is employed, but the optical fiber 1 having a substantially semicircular cross section shown in FIG.
5B, an optical fiber 15 having a flat cross section shown in FIG.
C, optical fiber 15D having an elliptical cross section shown in FIG. 2 (D)
It may be. The optical fiber 15D having an elliptical cross section is
Compared with the optical fiber 15A having a circular cross section, the adhesiveness to the surface of the optical waveguide 14 described later is superior. Further, the optical fiber 15B having a substantially semicircular cross section is formed by bonding a flat portion corresponding to the linear portion 19 to the surface of the optical waveguide 14 so that the optical fiber 15A and 15D having a circular or elliptical cross section are smaller than the optical fiber 14A. Excellent adhesion to the surface. Further, FIG.
The optical fiber 15C having a flat cross section shown in FIG. 1 has the linear portions 19 of the optical fiber 15B provided at opposing positions, and one of the flat portions corresponding to the linear portions 19 is adhered to the surface of the optical waveguide 14. As a result, it is bonded and fixed to the surface of the optical waveguide 14.

The optical fiber 15 is coated with an ultraviolet curing adhesive 20 between the optical fiber 14 and the surface of the optical waveguide 14.
Then, the ultraviolet curing adhesive 20 is fixed to the surface of the optical waveguide 14 by irradiating the ultraviolet curing adhesive 20 with ultraviolet light to be solidified. The optical fiber 15 is made of an ultraviolet curing adhesive 20.
It is only necessary that at least two positions in the axial direction be fixed to the optical waveguide 14 by using. This optical fiber 15 is fixed by mounting an optical circuit or an optical component (not shown) on the optical waveguide 14, or after mounting an electrical circuit, electronic component, or electrical wiring (not shown) on the substrate 11 or the optical waveguide 14. It is performed in the process.

Next, the optical fiber 15 is connected to the optical waveguide 14.
A method for manufacturing the optical integrated device 10 by fixing the optical integrated device 10 to the surface of the optical integrated device 10 will be described.

First, an electric circuit, an electronic component, or an electric wiring is formed or mounted on the substrate 11 as needed. next,
When forming the optical waveguide 14 on the substrate 11, an optical circuit is formed in the optical waveguide 14, and the optical waveguide 1 is formed as necessary.
In 4, an electric circuit, an electronic component, or an electric wiring is mounted.
Next, optical components and other optical circuits are mounted on the optical waveguide 14 as necessary.

Thereafter, one end 21 of the optical fiber 15 is gripped by using vacuum suction tweezers (both not shown) provided in the XYZ optical axis adjuster, and the optical fiber 1
5 is positioned near the optical circuit or optical component. Next, an optical signal is propagated from these optical circuits or optical components to the optical fiber 15, and while monitoring this optical signal at the other end 22 of the optical fiber 15, the optical signal is transmitted to the one end 21 of the optical fiber 15. An optimum position where the optical axis coincides with the optical circuit or the optical component is determined.

Next, the optical fiber 15 and the optical waveguide 14 are held in a state where the optical fiber 15 is held at the optimum position.
UV curable adhesive 20 is applied to the surface of the substrate. After that, the ultraviolet curable adhesive 20 is irradiated with ultraviolet rays to solidify the ultraviolet curable adhesive 20, and the optical fiber 15 is fixed to the surface of the optical waveguide 14 to manufacture the optical integrated device 10.

At the stage when the optical fiber 15 is fixed to the surface of the optical waveguide 14, the optical fiber 15 and the optical circuit in the optical waveguide 14 or another optical circuit or optical component mounted on the optical waveguide 14 are separated. Since these optical axes coincide, good and organic optical connection is achieved.

Therefore, according to the optical integrated device 10 of the first embodiment, the following effects (1) to (4) can be obtained.

(1) An optical fiber 15 capable of transmitting an optical signal is provided on the surface of the optical waveguide 14 integrated with the substrate 11.
Are fixed, the optical circuits formed in the optical waveguide 14, the optical components mounted on the optical waveguide 14, or the optical circuit and the optical component using the optical wiring fiber 15. Since the optical connection can be made with a small radius of curvature, the optical integrated device 10 can be made compact.

(2) The optical fiber 15 is the optical waveguide 1
4, the optical transmission loss is lower than that of the optical waveguide core 12. Therefore, the optical circuits formed in the optical waveguide 14, the optical components mounted on the optical waveguide 14, or the optical circuit and the optical component By using the optical wiring fiber 15 fixed to the optical waveguide 14, optical connection can be performed with low transmission loss.

(3) Since the optical fiber 15 is fixed to the surface of the optical waveguide 14 using the ultraviolet curing adhesive 20, the optical fiber 15 is placed after the optical component or the electronic component is installed on the optical waveguide 14. Since the optical integrated device 10 can be easily fixed, the optical integrated device 10 can be manufactured at low cost.

(4) Optical fiber 15D having an elliptical cross section
Is more easily fixed to the surface of the optical waveguide 14 than the optical fiber 15 using a circular optical fiber 15A, and the light using an optical fiber 15B having a substantially semicircular cross section. The wiring fiber 15 is
It is easier to fix to the surface of the optical waveguide 14 than the optical wiring fiber 15 employing the optical fiber 15D having an elliptical cross section.
Furthermore, the optical fiber 15 employing the flat optical fiber 15C having the linear portion 19 at the opposing position can be satisfactorily fixed to the surface of the optical waveguide 14 in the flat portion corresponding to any linear portion 19, For example, optical fiber 1
There is no need to twist and fix 5, and the workability of fixing the optical fiber 15 can be improved.

[B] Second Embodiment (FIG. 3) FIGS. 3A and 3B show a second embodiment of an optical integrated device according to the present invention, wherein FIG. 3A is a plan view and FIG. III- of (A)
It is sectional drawing which follows the III line. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The optical integrated device 30 according to the second embodiment
Has a groove 31 formed on the surface of the optical waveguide 14, and the optical fiber 15 is accommodated in the groove 31, and the optical fiber 15 is solidified by the ultraviolet curing adhesive 20.
Are fixed to the surface of the optical waveguide 14 in a state accommodated in the groove 31. The groove 31 is used for the optical fiber 1
Before positioning 5 on the surface of the optical waveguide 14, it is formed by dry etching, wet etching, laser beam irradiation processing, or cutting processing with a carbide blade or a diamond blade.

Then, the optical fiber 15 is connected to the optical waveguide 1.
When fixing to 4, use a vacuum pickup etc.
The optical fiber 15 is positioned at the optimum position with the optical fiber 15 housed in the groove 31. In this state, the ultraviolet curing adhesive 20 is applied between the optical fiber 15 and the surface of the optical waveguide 14 and solidified. Is fixed to the surface of the optical waveguide 14.

Therefore, according to the optical integrated device 30 of the second embodiment, the effects (1) to (1) of the optical integrated device 10 can be obtained.
The following effect (5) is exhibited in addition to the effect (4).

(5) The optical fiber 15 on the surface of the optical waveguide 14 is inserted into the groove 31 formed on the surface of the optical waveguide 14.
The optical fiber 1
5 can be securely fixed to the surface of the optical waveguide 14.

[C] Third Embodiment (FIG. 4) FIGS. 4A and 4B show an optical integrated device according to a third embodiment of the present invention, wherein FIG. 4A is a plan view and FIG. IV-I of (A)
It is sectional drawing in alignment with V. In the fourth embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The optical integrated device 40 of the third embodiment
Indicates that a plurality of optical distribution fibers 15
Are arranged vertically and horizontally crossing each other (crossing portions 41), and are fixed to the surface of the optical waveguide 14 using the ultraviolet curing adhesive 20.

Therefore, according to the optical integrated device 40 of the third embodiment, in addition to the effects (1) to (4) of the optical integrated device 10 of the first embodiment, the following effect (6). To play.

(6) Even if the optical wiring fibers 15 fixed to the surface of the optical waveguide 14 are mounted crossing each other, the degradation of the crosstalk between the optical signals propagated to the crossed optical wiring fibers 15 does not occur. Does not occur. For this reason, the optical circuit formed in the optical waveguide 14 and the optical integrated device 40 in which the optical components mounted on the optical waveguide 14 are arranged at a high density can be realized without increasing the size of the optical waveguide 14. In addition, the size of the optical integrated device 40 can be reduced.

[D] Fourth Embodiment (FIG. 5) FIG. 5 is a perspective view showing an optical integrated device according to a fourth embodiment of the present invention. In the fourth embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The optical integrated device 50 of the fourth embodiment
Is an embodiment in which optical components are specifically mounted on the optical integrated device 10 of the first embodiment. That is, in the optical integrated device 50, the optical waveguide 14 integrated with the substrate 11
A waveguide core 12 (not shown in FIG. 5) having a rectangular cross section is formed therein, and this waveguide core 12 constitutes an optical circuit such as an optical branching / coupling circuit, an optical multiplexing / demultiplexing circuit, and an optical filter circuit. . A plurality of optical fibers 56 are connected to the ports 52, 53, 54, and 55 of the waveguide core 12 on the front end face 51 of the optical waveguide 14, respectively. Further, the waveguide core 1 on the rear end face 57 of the optical waveguide 14
An optical fiber 58 is connected to two single ports (not shown).

Further, in the optical integrated device 50, the vicinity of the left end face 59 in FIG. 5 of the optical waveguide 14 is etched, and the first semiconductor laser 61 and the second A semiconductor laser 62 is mounted. Further, a first photodiode 63 as an optical component is mounted on the front end face 51 side of the surface of the optical waveguide 14, and a second photodiode 64 as an optical component is mounted on the rear end face 57 side.

Then, the first semiconductor laser 61 and the first photodiode 63 are connected to the first optical fiber 65 fixed to the surface of the optical waveguide 14 using the ultraviolet curing adhesive 20.
Optically connected by means of In addition, the second semiconductor laser 62 and the second photodiode 64 are organically optically connected by a second optical fiber 66 fixed to the surface of the optical waveguide 14 using the ultraviolet curing adhesive 20.
That is, the optical signal emitted from the first semiconductor laser 61 propagates through the first photodiode 63 and is received by the first photodiode 63. The optical signal emitted from the second semiconductor laser 62 propagates through the second optical fiber 66 and is received by the second photodiode 64. The first optical fiber 65 and the second photodiode 64 are arranged crossing each other.

Therefore, the optical integrated device 5 according to the fourth embodiment
According to 0, the following effects (7) to (10) are obtained.

(7) Since the first optical wiring fiber 65 and the second optical wiring fiber 66 capable of transmitting an optical signal are fixed to the surface of the optical waveguide 14 integrated on the substrate 11, The first semiconductor laser 61 and the first photodiode 63 mounted on the optical waveguide 14 and the second semiconductor laser 62 and the second photodiode 64 are respectively connected using the first optical fiber 65 and the second optical fiber 66. ,
Since optical connection can be made with a small radius of curvature, the optical integrated device 50 can be made compact.

(8) Even if the first optical wiring fiber 65 and the second optical wiring fiber 66 fixed on the surface of the optical waveguide 14 are mounted crossing each other, the first optical wiring fiber 65 and the second optical wiring fiber No degradation of crosstalk occurs between optical signals propagated to 66. For this reason, an optical circuit formed in the optical waveguide 14 and an optical circuit such as the first semiconductor laser 61, the second semiconductor laser 62, the first photodiode 63, and the second photodiode 64 mounted on the optical waveguide 14 are used. The optical integrated devices 50 arranged at a high density can be realized without increasing the size of the optical waveguide 14, so that the optical integrated devices 50 can be made compact.

(9) Since the first optical fiber 65 and the second optical fiber 66 have lower optical transmission loss than the waveguide core 12 of the optical waveguide 14, the first semiconductor laser mounted on the optical waveguide 14 61 and the first photodiode 63
Or the second semiconductor laser 62 and the second photodiode 64 using the first optical wiring fiber 65 and the second optical wiring fiber 66 fixed to the optical waveguide 14, respectively, under low transmission loss. Can connect.

(10) Since the first optical fiber 65 and the second optical fiber 66 are fixed to the surface of the optical waveguide 14 using the ultraviolet curing adhesive 20, the first semiconductor laser 61 and the second semiconductor The laser 62, the first photodiode 63 and the second photodiode 64 are connected to the optical waveguide 14.
Since the first optical fiber 65 and the second optical fiber 66 can be easily fixed after being mounted on the optical integrated device 50,
Can be manufactured at low cost.

[E] Fifth Embodiment (FIG. 6) FIG. 6 is a perspective view showing an optical integrated device according to a fifth embodiment of the present invention. In the fifth embodiment, the same parts as those in the first and fourth embodiments are denoted by the same reference numerals, and description thereof is omitted.

The optical integrated device 70 according to the fifth embodiment
This is also an embodiment in which optical components are specifically mounted on the optical integrated device 10 of the first embodiment. That is, in the optical integrated device 70, at least one of an electric circuit, an electronic component, and an electric wiring is provided on the front surface, the back surface, or inside the substrate 11. In the optical waveguide 14, similarly to the optical integrated device 50, the waveguide core 12 having a rectangular cross section that constitutes an optical circuit is provided.
(Not shown in FIG. 6).

Each of the plurality of optical fibers 58 is connected to a port (not shown) of the plurality of waveguide cores 12 on the rear end face 57 of the optical waveguide. Ports (not shown) of the plurality of waveguide cores 12 are also formed on the left end face 59 of the optical waveguide 14, and an optical fiber 71 is connected to each of these ports. Further, a single port (not shown) is formed on the right end face 72 of the optical waveguide 14 in FIG. 6, and an optical fiber 73 is connected to this port.

Further, the first optical wiring fiber 65 optically connected to the first semiconductor laser 61 and fixed to the surface of the optical waveguide 14 is connected to a port 74 and connected to an optical circuit inside the optical waveguide 14. This port 74 is connected to the optical waveguide 1
4 is provided in the etching concave portion 76 formed on the front right side in FIG.

Further, the first photodiode 63 is mounted on the rear side of the surface of the optical waveguide 14. The first photodiode 63 is connected to a port (not shown) provided on the left end face 59 of the optical waveguide 14 by a third optical wiring fiber 75 fixed to the surface of the optical waveguide 14 using an ultraviolet curing adhesive 20. After being connected, it is optically connected to an optical circuit inside the optical waveguide 14. Here, the first optical fiber 65
Are the second optical fiber 66 and the third optical fiber 7
It is arranged crossing 5.

The optical signal emitted from the first semiconductor laser 61 propagates through the first optical fiber 65 and passes through the port 74.
And transmitted to the optical circuit in the optical waveguide 14. Also,
The optical signal emitted from the second semiconductor laser 62 propagates in the second optical fiber 66 and travels through the second photodiode 6.
4. Further, the optical signal from the optical circuit in the optical waveguide 14 propagates through the third optical fiber 75 and is received by the first photodiode 63. Thus, the optical circuit formed in the optical waveguide 14, the first semiconductor laser 61 and the second semiconductor laser 62 mounted on the optical waveguide 14,
First photodiode 63, second photodiode 64
Are the first optical fiber 65 and the second optical fiber 6
6. Organically optically connected using the third optical fiber 75.

Therefore, the optical integrated device 70 of the above embodiment
According to the above, the following effects (11) to (14) can be obtained.

(11) A first optical wiring fiber 65, a second optical wiring fiber 66, and a third optical wiring fiber 75 capable of transmitting an optical signal are fixed on the surface of the optical waveguide 14 integrated on the substrate 11. Thus, the second semiconductor laser 62 and the second photodiode 64 mounted on the optical waveguide 14 are connected to the optical waveguide 1 using the second optical fiber 66.
The optical circuit formed in 4 and the first semiconductor laser 61 use the first optical fiber 65, or the optical circuit formed in the optical waveguide 14 and the first photodiode 63 use the third optical fiber 75. Since the optical connection can be made with a small radius of curvature, the optical integrated device 70 can be made compact.

(12) The first optical fiber 65 and the second optical fiber 66 fixed to the surface of the optical waveguide 14
Since the third optical fiber 75 can be mounted crossing each other, the optical circuit formed in the optical waveguide 14 and the optical waveguide 1
The optical integrated device 70 in which the first semiconductor laser 61, the second semiconductor laser 62, the first photodiode 63, and the second photodiode 64 mounted on the optical waveguide 14 are arranged at high density without increasing the size of the optical waveguide 14. Therefore, the size of the optical integrated device 70 can be reduced.

(13) Since the first optical fiber 65, the second optical fiber 66, and the third optical fiber 75 have a lower optical transmission loss than the waveguide core 12 of the optical waveguide 14, the second semiconductor laser 62 and the second photodiode 6
4 using the second optical fiber 66, the optical circuit formed in the optical waveguide 14 and the first semiconductor laser 61 using the first optical fiber 65, and the light formed in the optical waveguide 14. The circuit and the first photodiode 63 can be optically connected using the third optical fiber 75 with low transmission loss.

(14) Since the first optical fiber 65, the second optical fiber 66, and the third optical fiber 75 are fixed to the surface of the optical waveguide 14 using the ultraviolet curing adhesive 20, the first semiconductor fiber After the laser 61, the second semiconductor laser 62, the first photodiode 63, and the second photodiode 64 are installed in the optical waveguide 14, the first optical fiber 65, the second optical fiber 66, and the third optical fiber 75 are connected. Since the optical integrated device 70 can be easily fixed, the optical integrated device 70 can be manufactured at low cost.

[F] Sixth Embodiment (FIG. 7) FIG. 7 is a plan view showing an optical integrated device according to a sixth embodiment of the present invention.

In the sixth optical integrated device 80, various optical circuits, optical components, electronic components, and the like are fused and arranged on a printed circuit board 81 on which an electric circuit is formed. The optical fiber to be connected is fixed to the printed circuit board 81.

That is, the optical integrated device 80 places a DFB (Distributed-feedba) on the printed circuit board 81.
ck) A laser array 82, an optical modulator array 83, a waveguide type optical circuit 84, a hybrid gate array 85, an optical filter 86, a photodetector 87, a laser array driving circuit 88, and an optical gate array driving device 89 are installed. The array 83 and the waveguide type optical circuit 84 are optically connected by an optical fiber array 90, and the waveguide type optical circuit 84 and the hybrid gate array 85 are optically connected by optical fiber arrays 91 and 92. The circuit 84 and the optical filter 86, and the optical filter 86 and the photodetector 87 are optically connected by optical wiring fibers 93 and 94, respectively.

Further, the laser array driving circuit 88
The DFB laser array 82 is driven by being connected to the B laser array 82 by the electric wiring 95A. Further, the optical gate array driving device 89 is connected to the hybrid gate array 85 by the electric wiring 95B, and drives each gate of the hybrid gate array 85 to ON / OFF.

The waveguide type optical circuit 84 is formed by forming an optical multiplexing circuit 98 and an optical multiplexing / demultiplexing circuit 99 on an optical waveguide 97 provided integrally on a substrate 96.
These optical multiplexing circuits 9 are passed through a waveguide core 45A in the
8 and the optical multiplexing / demultiplexing circuit 99 are optically connected. Similarly, the optical fiber array 90 and the optical multiplexing circuit 98 are optically connected via the waveguide core 45B in the optical waveguide 97. Further, the optical fiber array 91 and the optical multiplexing / demultiplexing circuit 99 via the waveguide core 45C in the optical waveguide 97, and the waveguide core 4
The optical wiring fiber array 92 and the optical multiplexing / demultiplexing circuit 99 are optically connected via 5D. Further, the optical multiplexing / demultiplexing circuit 99 and the optical filter 86 are optically connected via the waveguide core 45E in the optical waveguide 97.

In such an optical integrated device 80, the wavelengths λ1, λ2, λ3,
The optical signal of λ4 is input to the optical modulator array 83 to modulate the light intensity, and then input to the optical multiplexing circuit 98 of the waveguide type optical circuit 84 to be demultiplexed and wavelength-multiplexed.
The optical signal multiplexed by the optical multiplexing circuit 98 is also input to the optical multiplexing / demultiplexing circuit 99 of the waveguide type optical circuit 84 to be demultiplexed. The light is input to the optical multiplexing / demultiplexing circuit 99 and multiplexed. As for the optical signal multiplexed by the optical multiplexing / demultiplexing circuit 99, an optical signal having a desired wavelength is selected by an optical filter 86 and received by a photodetector 87.

The optical fiber array 90, 91, 9
2. DFB laser array 82, optical modulator array 83, waveguide type optical circuit 84, hybrid gate array 85, optical filter 86, photodetector 87, laser array drive circuit 88, and optical gate array drive After the device 89 is installed on the printed circuit board 81 in advance, first, each is held at an optimum position, and then, the optical fiber array 90, 91, 92, and the optical fiber 93 and 94 are disposed between the printed circuit board 81 and the optical fiber array. The ultraviolet curing adhesive 46 is applied, and then the ultraviolet curing adhesive 46 is irradiated with ultraviolet rays to be solidified, thereby being fixed to the printed circuit board 81.

Optical fiber arrays 90, 91, 92,
The above-mentioned optimum positions of the optical distribution fibers 93 and 94 are determined as follows.

First, using vacuum suction tweezers (both not shown) provided in the XYZ optical axis adjuster, one end of each of the optical fiber array 90, 91, 92 and the optical fiber 93 and 94 is gripped. An optical circuit (optical modulator array 83, waveguide type optical circuit 84, optical filter 86) and optical components (DFB laser array 82, hybrid gate array 85, photodetector 87) connecting this one end to the one end. ). Next, from these optical circuits and optical components, optical wiring fiber arrays 90, 9
1, 92, and the optical signals are propagated to the optical wiring fibers 93 and 94.
0, 91, 92, and the other ends of the optical distribution fibers 93 and 94, while monitoring these optical distribution fiber arrays 9
The optical axes of the optical fibers 0, 91, and 92 and the optical fibers 93 and 94 are aligned with the optical circuits and optical components connected to the ends. Optical distribution fiber arrays 90, 91, 92,
Similarly, the optical axes of the other ends of the optical wiring fibers 93 and 94 and the optical circuits and optical components connected thereto are made to coincide. In this manner, the optical distribution fiber arrays 90, 9
1, 92, and the optimal positions of the optical distribution fibers 93 and 94 are sequentially set.

Note that the electric wires 95A and 95B are also
It may be fixed to the printed circuit board 81 using the ultraviolet curing adhesive 46.

Therefore, according to the optical integrated device 80 of the sixth embodiment, the following effects (15) and (16) can be obtained.

(15) An optical circuit (optical modulator array 83, waveguide type optical circuit 84, optical filter 86) and optical components (DFB laser array 82, hybrid gate array 85, Photodetector 87), electronic components (laser array driving circuit 88, optical gate array driving device 89), electric wires 95A and 95
After installing B, the optical distribution fiber arrays 90, 91,
The optical fiber 92, the optical fiber 93, and the optical fiber 93 are sequentially positioned at the optimum positions and fixed to the printed circuit board 81. Optical circuits and optical components are connected by the optical fiber array 90, 91, 92, and the optical fiber 93, 94. Therefore, as in the conventional example shown in FIG.
109, 111, 112 and optical fibers 110, 11
After connecting the optical circuits 3 and 114, these optical circuits and optical components are installed on a printed circuit board, and the optical integrated device 80 is an optical wiring device compared to a case where the optical fiber array 108 and the optical fibers 110 are not fixed to the printed circuit board. Fiber array 90,
Since the optical fibers 91 and 92 and the optical distribution fibers 93 and 94 can be made shorter, they can be made more compact.

(16) Optical distribution fiber arrays 90 and 9
Since the optical fibers 1 and 92 and the optical wiring fibers 93 and 94 are fixed to the printed circuit board 81 using the ultraviolet curing adhesive 46, optical circuits such as a waveguide type optical circuit 84, optical components such as a DFB laser array 82, and the like. After installing electronic components such as the laser array drive circuit 88, the optical fiber array 9
Since the optical fibers 0, 91, 92 and the optical wiring fibers 93, 94 can be easily fixed to the printed circuit board 81, the optical integrated device 80 can be manufactured at low cost.

Although the present invention has been described based on the above embodiment, the present invention is not limited to this.

For example, in the first to sixth embodiments, the adhesive is not limited to the UV-curable adhesives 20 and 46, but may be other adhesives. Further, in the optical integrated device 50 according to the fourth embodiment shown in FIG. 5 and the optical integrated device 70 according to the fifth embodiment shown in FIG. Connection may be used.

[0125]

As described above, according to the optical integrated device of the first aspect, the optical fiber capable of transmitting an optical signal is fixed to the surface of the optical waveguide integrally provided on the substrate. With this configuration, the device can be made compact.

According to the optical integrated device of the ninth aspect, an electric circuit is formed, and the optical circuit and the optical component are optically connected to a printed circuit board on which the optical circuit and the optical component are installed. Since the fiber is fixed, the apparatus can be made compact.

According to the method of manufacturing an optical integrated device according to the eleventh aspect of the present invention, at least one of an optical circuit and an optical component is previously provided on an optical waveguide integrated with a substrate, and an electric circuit is provided on the substrate or the optical waveguide. Since at least one of a circuit, an electronic component, and an electric wiring is provided in advance, and an optical fiber capable of transmitting an optical signal is fixed to the surface of the optical waveguide, the device can be made compact.

According to the method of manufacturing an optical integrated device according to the present invention, at least one of an optical circuit and an optical component is previously installed on a printed board on which an electric circuit is formed, and the electronic component is mounted on the printed board. Since at least one of the electrical wirings is installed in advance, and an optical fiber capable of transmitting an optical signal is fixed to the surface of the printed circuit board, the apparatus can be made compact.

[Brief description of the drawings]

FIGS. 1A and 1B show a first embodiment of an optical integrated device according to the present invention, wherein FIG. 1A is a plan view and FIG.

FIG. 2 is a cross-sectional view showing a cross-sectional shape of the optical wiring fiber of FIG.

3A and 3B show a second embodiment of the optical integrated device according to the present invention, wherein FIG. 3A is a plan view and FIG.
It is sectional drawing which follows the III line.

4A and 4B show a third embodiment of the optical integrated device according to the present invention, wherein FIG. 4A is a plan view and FIG. 4B is a view IV-I of FIG.
It is sectional drawing which follows the V line.

FIG. 5 is a perspective view showing an optical integrated device according to a fourth embodiment of the present invention.

FIG. 6 is a perspective view showing an optical integrated device according to a fifth embodiment of the present invention.

FIG. 7 is a plan view showing an optical integrated device according to a sixth embodiment of the present invention.

FIG. 8 is a plan view showing a conventional optical integrated device.

FIG. 9 is a plan view showing another conventional optical integrated device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Substrate 12 Waveguide core 13 Cladding layer 14 Optical waveguide 15 Optical wiring fiber (optical fiber) 19 Linear part 20 Ultraviolet curing adhesive 21 One end 22 Other end 30 Optical integrated device 31 Groove 40 Optical integrated device 41 Intersection 46 Ultraviolet Curing adhesive 50 Optical integrated device 61 First semiconductor laser 62 Second semiconductor laser 63 First photodiode 64 Second photodiode 65 First optical wiring fiber 66 Second optical wiring fiber 70 Optical integrated device 75 Third optical wiring fiber 80 Optical integrated device 81 Printed circuit board 82 DFB laser array 83 Optical modulator array 84 Waveguide optical circuit 85 Hybrid gate array 86 Optical filter 87 Photodetector 88 Laser array driving circuit 89 Optical gate array driving device 90, 91, 92 Optical wiring fiber array 93, 9 Optical wiring fiber 98 the optical multiplexing circuit 99 optical multiplexing and demultiplexing circuit

Claims (17)

[Claims] 1. An optical integrated device in which an optical waveguide comprising a waveguide core and a cladding layer is integrally provided on a substrate, wherein an optical fiber capable of transmitting an optical signal is fixed to a surface of the optical waveguide. An optical integrated device characterized by comprising: 2. The optical integrated device according to claim 1, wherein the optical fiber is disposed and fixed in a groove formed on a surface of the optical waveguide. 3. The optical integrated device according to claim 1, wherein the optical fiber is fixed to a surface of the optical waveguide with an ultraviolet curing adhesive. 4. The optical fiber according to claim 1, wherein the optical fiber has a circular, elliptical, substantially semicircular, or flattened shape having a straight portion at an opposing position. An optical integrated device as described in the above. 5. The optical fiber according to claim 1, wherein a size ratio between the cladding layer and the waveguide core is 3 to 5 for single mode transmission.
20 to 2 to 1 for multi-mode transmission.
The optical integrated device according to claim 1, wherein the optical integrated device is in a range of 0. 6. The method according to claim 1, wherein the substrate is glass, magnetic material, semiconductor,
The optical integrated device according to any one of claims 1 to 5, wherein the optical integrated device is made of a polymer material or a combination thereof. 7. The optical fiber according to claim 1, wherein the optical fiber is organically optically connected to at least one of an optical circuit formed on the optical waveguide and an optical component mounted on the optical waveguide. The optical integrated device according to any one of the above. 8. The optical integrated device according to claim 1, wherein at least one of an electric circuit, an electronic component, and an electric wiring is provided on the optical waveguide or the substrate. 9. A printed circuit board on which an electric circuit is formed,
At least one of the optical circuit and the optical component is fused and installed,
An optical integrated device in which the optical circuit and the optical component are optically connected by an optical fiber, wherein the optical fiber is fixed to the printed circuit board. 10. The optical integrated device according to claim 9, wherein the optical fiber is fixed to a surface of the printed circuit board with an ultraviolet curing adhesive. 11. An optical waveguide integrated with a substrate and at least one of an optical circuit and an optical component are provided in advance, and the substrate or the optical waveguide is provided with at least one of an electric circuit, an electronic component, and an electrical wiring in advance. Then, an optical fiber capable of transmitting an optical signal is fixed to the surface of the optical waveguide. 12. The optical fiber is held at an optimum position on the surface of an optical waveguide provided on a substrate, and then an ultraviolet curing adhesive is applied to the optical fiber, and thereafter, the adhesive is irradiated with ultraviolet light. The method of manufacturing an optical integrated device according to claim 11, wherein the optical fiber is fixed to fix the optical fiber to the surface of the waveguide. 13. The method of manufacturing an optical integrated device according to claim 11, wherein a groove is formed on the surface of the waveguide, and the optical fiber is held at an optimum position in the groove. 14. The optical fiber according to claim 1, wherein one end of the optical fiber is positioned near an optical circuit formed on the optical waveguide or an optical component mounted on the waveguide. While propagating an optical signal from the optical component to the optical fiber and monitoring the optical signal at the other end of the optical fiber, align the optical axis of the optical fiber with the optical circuit or the optical component. 14. The method of manufacturing an optical integrated device according to claim 11, wherein the method is performed. 15. At least one of an optical circuit and an optical component is previously installed on a printed board on which an electric circuit is formed, and at least one of an electronic component and electrical wiring is previously installed on the printed board. An optical integrated device manufacturing method, comprising: fixing an optical fiber capable of transmitting an optical signal to a surface of a substrate. 16. The optical fiber is held at an optimal position on the surface of a printed circuit board, and then an ultraviolet curing adhesive is applied to the optical fiber, and then the adhesive is irradiated with ultraviolet light to be solidified. 16. The method according to claim 15, wherein the optical fiber is fixed to the surface of the printed circuit board. 17. An optimum position of the optical fiber is such that one end of the optical fiber is located near an optical circuit or an optical component installed on a printed circuit board, and then the optical fiber or the optical component is moved from the optical circuit to the optical fiber. Propagating the optical signal to
17. The method according to claim 15, wherein while monitoring the optical signal at the other end of the optical fiber, the optical axes of the optical fiber and the optical circuit or the optical component are made to coincide with each other. A manufacturing method of the optical integrated device according to the above.