JP2002198572A - Infrared rays data communication module and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an infrared rays data communication module wherein a trench-shaped connection terminal formed on a side surface of a substrate can be prevented from being filled and choked with resin for forming a resin package or resist material for forming a protective film on the surface of the substrate. SOLUTION: This infrared rays data communication module is provided with the substrate wherein component groups including a light emitting element and a light receiving element are mounted on a single surface, and a resin package which is so formed that the component groups are sealed and the single surface of the substrate is covered wholly. On the side surface of the substrate, the trench-shaped connection terminal which is stretched in the whole part in the thickness direction of the substrate and has a conductor layer on an inner peripheral surface is formed. Aperture parts of the resin package side in the connection terminal are previously choked with conductive choking pads which are electrically connected with the conductor layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a so-called IrD
The present invention relates to an infrared data communication module used for performing infrared data communication conforming to the A (Infrared Data Association) standard.

[0002]

2. Description of the Related Art IrDA-compliant infrared data communication modules (hereinafter simply referred to as "modules") have become very popular in the field of notebook personal computers, and have recently become widespread in mobile phones and electronic notebooks. This type of module integrates a light-emitting element and a light-receiving element for infrared rays, and a control circuit element for controlling these elements into one package, and enables bidirectional wireless communication. The distance and the like are defined as a unified standard by the version. As the performance of infrared data communication functions has been enhanced, the size of the entire module has become smaller and smaller due to downsizing.In the manufacturing process, strict dimensional accuracy is required and cost reduction is called for. I have.

FIG. 18 shows an example of such a conventional infrared data communication module. FIG. 19 is a schematic perspective view showing a state where the infrared data communication module 100 shown in FIG. 18 is mounted on an external circuit board. As shown in FIG. 18, the module 100 includes a substrate 101 and a substrate 1
The outer appearance is formed by the resin package 5 formed so as to entirely cover the one surface 101a of the optical disc 101. On the substrate 101, a component group E including a light emitting element 2, a light receiving element 3, and an LSI chip 4 for controlling the light emitting element 2, the light receiving element 3, and the
And the resin package 5 is formed so as to seal these component groups E. This module 100
, A light emitting lens portion 51 is formed on a surface facing the light emitting element 2, and a light receiving lens portion 52 is formed on a surface facing the light receiving element 3.

[0004] On the side surface of the substrate 101, the conductor layer 17 extends over the entire thickness direction of the substrate 101 and has an inner peripheral surface.
A plurality of groove-shaped connection terminal portions 107 having 0 are formed. As shown in FIG. 19, a terminal pad 6 formed so as to surround the opening of the connection terminal portion 107 is provided on the back surface 101b of the substrate 101. As shown in FIG. 18, the terminal pad 6 is connected to a wiring pattern (not shown) formed on one surface 101a of the substrate 101 via a conductor layer 170 on the inner peripheral surface of the connection terminal portion 107.

When such a module 100 is manufactured, for example, as shown in FIG. 20, an original substrate 110 made of a sheet-like glass epoxy resin is used, and a large number of modules 100 are obtained from the original substrate 110. . Specifically, first, one side 110a of the original substrate 110 including the substrate area S serving as the substrate 101, which includes a plurality of rows and columns.
And plating a conductor film such as copper on the entire back surface,
By etching this conductor coating, the original substrate 11
A wiring pattern is formed on one side 110a of the “0” and a predetermined pattern including the terminal pads 6 is formed on the back surface of each of the substrate areas S.

Next, as shown in FIG. 20, a predetermined number of through-holes 171 are formed through the boundary of each substrate area S, and as shown in FIG.
A conductor layer 170 is formed on the inner peripheral surface of the through hole 171 so as to conduct the wiring pattern a and the terminal pad 6 on the back surface. The through-hole 171 is partially cut to become the connection terminal portion 107 by being cut later.

[0007] Next, as shown in FIG.
0, a protective film 1 generally called a green resist.
09 is formed. For example, the protective film 109 is formed by applying a liquid resist material to the surface of the original substrate 110 relatively thinly and exposing it using a mask on which a desired pattern is drawn.
By developing the exposed resist material, a predetermined portion is formed so as to be opened. At this time, when the resin package 5 is formed as described later, in order to prevent molten resin from entering the through hole 171, the original substrate 1 is removed from the opening of the through hole 171.
The opening on the one surface 110a side of the substrate 10 is closed with a protective film 109.

Next, the component group E is mounted.
As shown in FIG. 22, a resin for forming the resin package 5 on the original substrate 110 is molded so as to be larger than each of the substrate areas S in plan view. Here, an intermediate encapsulant 5a is formed by molding on two adjacent substrate areas at once. As a resin for forming the resin package 5, an epoxy resin or the like that does not transmit visible light but transmits infrared light is used. In molding such a resin, a transfer molding method or the like is used. More specifically, a mold having a cavity corresponding to the shape of the intermediate sealing body 5a is set on one side 110a of the original substrate 110, and after the molten resin is injected into the cavity, the resin is cured. Then, the mold is removed.

Then, the original substrate 110 is cut along each substrate area S, and a plurality of modules 100 are obtained. At this time, as shown in FIG. 23, each through hole 171 having a cylindrical inner surface is cut so that approximately half remains along the axial direction. Thus, the groove-shaped connection terminal portion 107 is formed on the side surface of each substrate 110 such that the inner peripheral surface thereof is exposed to the outside.

The module 100 manufactured as described above
Are mounted on an external circuit board through an inspection process. In the inspection process, various characteristics are measured by bringing a measurement probe of the inspection device into contact with the inner peripheral surface of the connection terminal 107.

When mounting the module 100 on the external circuit board B, for example, as shown in FIG. 24, the module 100 is soldered such that the inner peripheral surface of the connection terminal 107 faces the external circuit board B. Attach. At this time, the solder fillet F is formed so as to join the inner peripheral surface of the connection terminal portion 107, the terminal pad 6, and the conductor pattern P formed on the surface of the external circuit board B to each other. By performing such soldering, the module 100 can be mounted such that the side surface thereof is in contact with the external circuit board B.

However, as described above, before the resin package 5 is formed, the through hole 171 is formed.
Of the openings, the opening on the one surface 110a side of the original substrate 110 is covered with the protective film 109. The resist material for forming the protective film 109 is applied relatively thinly. Since it is liquid, it may penetrate into the through hole 171 to a depth d more than necessary as shown in FIG. As a result, when the through-hole 171 is cut to form the connection terminal portion 107, a part of the resist material that has entered the through-hole 171 becomes a cutting residue. Also, the manufactured module 1
At 00, the groove-shaped connection terminal 107 is filled with a resist material. As a result, module 10
When inspecting 0, the measurement probe of the inspection apparatus may come into contact with the resist material filling the connection terminal 107, and accurate measurement may not be performed. Further, when the module 100 is soldered to the external circuit board B, as shown in FIG. 24, the solder fillet F cannot be formed on the entire inner peripheral surface of the connection terminal portion 107, and the mounting strength is reduced. Resulting in.

[0013]

SUMMARY OF THE INVENTION The present invention has been conceived in view of the above-mentioned circumstances, and has a structure in which a connection terminal formed in a groove shape on a side surface of a substrate forms a resin package. It is an object of the present invention to provide an infrared data communication module that can be prevented from being blocked by a resin or a resist material for forming a protective film on a substrate surface.

[0014]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

That is, the infrared data communication module provided by the first aspect of the present invention includes a substrate on which a component group including a light emitting element and a light receiving element is mounted on one surface; A resin package formed so as to entirely cover the one surface of the substrate, and a groove-shaped connection terminal extending on the side surface of the substrate over the entire thickness direction of the substrate and having a conductor layer on an inner peripheral surface. An infrared data communication module in which a portion is formed, wherein an opening portion of the connection terminal portion on the resin package side is previously closed by a conductive closing pad that is electrically connected to the conductor layer. .

In a preferred embodiment, the infrared data communication module is provided with respect to an external circuit board.
It is mounted so that the inner peripheral surface of the connection terminal portion faces.

According to a first aspect of the present invention, an opening portion on the resin package side in the connection terminal portion includes:
The connection terminal portion is prevented from being filled with a resin for forming a resin package or a resist material for forming a protective film for protecting a substrate surface since the connection terminal portion is previously closed by the conductive closing pad. Can be. As a result, when testing the infrared data communication module, when the measurement probe of the inspection device is brought into contact with the inner peripheral surface of the connection terminal portion, the measurement probe comes into contact with the resin or the resist material, thereby providing accurate measurement. Measurement can be prevented from becoming impossible. Further, when the infrared data communication module is soldered to an external circuit board, a solder fillet can be formed over the entire inner peripheral surface of the connection terminal portion, and the mounting strength can be improved.

According to a second aspect of the present invention, there is provided a method of manufacturing an infrared data communication module, comprising: a substrate on which a component group including a light emitting element and a light receiving element is mounted on one side; A resin package formed so as to entirely cover the one surface of the substrate, and a groove-shaped connection extending on the side surface of the substrate over the entire thickness direction of the substrate and having a conductor layer on an inner peripheral surface. A method for manufacturing an infrared data communication module having a terminal portion formed thereon, the method comprising:
Forming a through-hole on a boundary line of the first substrate area through a first material substrate having a substrate area; and providing an adhesive on a back side having a second substrate area corresponding to the first substrate area. Forming an original substrate by laminating a second material substrate on which the second material substrate is coated on the first material substrate, forming a conductive film over the entire surface of the second material substrate, Forming a conductive closing pad larger than the opening area of the through hole at a position corresponding to the through hole on the surface side of the second material substrate by etching
Performing a desmear process on the second material substrate to form a hole communicating with the through hole so that the opening is closed by the conductive closing pad; Forming the conductive layer on the inner peripheral surface of the conductive substrate so as to be electrically connected to the conductive blocking pad; mounting the component group on the second material substrate side of the original substrate; Forming the resin package on a two-material substrate, cutting the original substrate along the first substrate area and the second substrate area,
It is characterized by including.

This manufacturing method is the first method of the present invention described above.
A method for manufacturing an infrared data communication module according to the aspect of (1). Therefore, the same advantages as described above for the infrared data communication module according to the first aspect of the present invention can be enjoyed.

In a preferred embodiment, the second
The material substrate is formed of a glass epoxy resin, and the adhesive applied to the back surface of the second material substrate is an epoxy resin-based adhesive, and the step of performing the desmearing process dissolves the epoxy resin. This is carried out by immersing the original substrate on which the above-mentioned conductive closing pad is formed in a solution.

According to such a configuration, the adhesive and the second material substrate can be simultaneously dissolved.

Other features and advantages of the present invention will become more apparent from the following description of embodiments of the present invention.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an example of an infrared data communication module according to the present invention, FIG. 2 is a schematic perspective view showing a state where the infrared data communication module shown in FIG. 1 is mounted on an external circuit board, FIG. 3 is a sectional view taken along the line III-III in FIG. FIGS. 4 and 7 to 16 are schematic diagrams for explaining a method of manufacturing the infrared data communication module according to the present invention. Further, FIG.
4 is a schematic view from the back of the first material substrate in FIG. 4, FIG. 6 is a sectional view taken along the line VI-VI in FIG. 4, and FIG.
FIG. 7 is a sectional view taken along line XVII-XVII of FIG. In these figures, the same reference numerals are given to members and parts equivalent to those shown in FIGS. 18 to 24 showing a conventional example.

As shown in FIG. 1, this infrared data communication module (hereinafter simply referred to as “module”)
A includes a substrate 1, a component group E mounted on one side 1a of the substrate 1, and a resin package 5 formed so as to seal the component group E.

As shown in FIG. 1, the substrate 1 is generally formed in a substantially rectangular shape in plan view. On one side 1a of the substrate 1, a predetermined wiring pattern (not shown) is formed. On the side surface of the substrate 1, a plurality of groove-like connection terminal portions 7 extending over the entire thickness direction of the substrate 1 and having the conductor layer 70 on the inner peripheral surface are formed. Back surface 1b of substrate 1
As shown in FIG. 2, a terminal pad 6 for mounting the module A on an external circuit board B is formed so as to surround an opening of the connection terminal portion 7. As shown in FIG. 1, the terminal pad 6 is electrically connected to a wiring pattern on one surface 1 a of the substrate 1 via a conductor layer 70 on the inner peripheral surface of the connection terminal portion 7.

Each of the connection terminal portions 7 is formed by cutting out a part of a through-hole formed as described later and a hole communicating with the through-hole in the manufacturing process of the module A. is there. In more detail, the original substrate is cut along the axial direction of the through hole and the hole communicating with the through hole, and the through hole and a part of the hole are formed so as to remain. Then, the conductor layer 70 on the inner peripheral surface of the connection terminal portion 7 is exposed to the outside.

As shown in FIG. 1, the component group E includes a light emitting element 2, a light receiving element 3, and an LSI chip 4. The light emitting element 2 is composed of, for example, an infrared light emitting diode that can emit infrared light, is mounted on one surface 1a of the substrate 1, and is connected to a wiring pattern by wire bonding with a gold wire or the like. The light receiving element 3
For example, the light emitting element 2 is formed of a PIN photodiode capable of sensing infrared rays.
And is connected to a wiring pattern by wire bonding with a gold wire or the like. Also, L
The SI chip 4 is for controlling the transmission / reception operation by the light emitting element 2 and the light receiving element 3,
a, is connected to a wiring pattern by wire bonding with a gold wire or the like, and is connected to the light emitting element 2 and the light receiving element 3 through the wiring pattern.

The resin package 5 is made of, for example, an epoxy resin containing a pigment, and is formed so as to entirely cover one surface 1 a of the substrate 1. The resin package 5 has no translucency with respect to visible light, but is formed of a material having translucency with respect to infrared rays by a method such as a transfer molding method. As shown in FIG. 1, the resin package 5 has a light emitting lens portion 51 integrally formed on a surface facing the light emitting element 2, and collects light emitted from the upper surface of the light emitting element 2. It is configured to emit light. In addition, resin package 5
A light receiving lens portion 52 is integrally formed on the surface facing the light receiving element 3, and is configured to condense the light transmitted to the module A and make the light incident on the light receiving element 3. I have.

As shown in FIG. 1, the opening of each connection terminal 7 on the side of the resin package 5 is closed by a conductive closing pad 8 which is electrically connected to the conductor layer 70 on the inner peripheral surface of the connection terminal 7. It is separated from the resin package 5. The conductive closing pad 8 is formed so as to be electrically connected to the wiring pattern. In the present embodiment, the conductive closing pad 8 is formed by etching a conductive film formed on one surface 1a of the substrate 1 as described later.

The module A having such a configuration is:
It is manufactured by the procedure described below.

First, as shown in FIGS. 4 and 6, a first substrate area Sa having a first substrate area Sa on the back side of the substrate 1 is provided.
A predetermined number of through holes 71 are formed through the material substrate 12a on the boundary line of the substrate area Sa. More specifically, the first material substrate 12a has a first substrate area Sa in a plurality of rows and a plurality of columns, and the back surface of the first substrate area Sa is the back surface 1b of the substrate 1 (see FIG. 5). . The first material substrate 12a is formed of a glass epoxy resin, and has a thickness of, for example, about 0.7 mm. Note that, as shown in FIG. 5, the terminal pads 6 are previously formed on the back surface of the first material substrate 12a for each first substrate area Sa by a known photolithography method. That is, in this step, first, a resist material is applied to the first material substrate 12a having a copper foil on the back surface, exposed using a mask on which a desired pattern is drawn, and the exposed resist material is developed. By doing so, the outside of the area corresponding to the terminal pad 6 of the copper foil is exposed. Next, the exposed portion of the copper foil is melted by dipping the first material substrate 12a in a solution capable of melting copper, and the resist material is peeled off. A through hole 71 is formed in a predetermined portion of the first material substrate 12a on which the terminal pad 6 has been formed in advance in this manner by, for example, drilling a hole in a cylindrical inner surface.

Next, as shown in FIG. 7, a second material substrate 12b, the back surface of which is coated with an adhesive 13, is laminated on the first material substrate 12a to form an original substrate 1
0 is formed. As shown in FIG. 8, the second material substrate 12b has a second substrate area Sb corresponding to the first substrate area Sa, and a second substrate area Sb is provided on each first substrate area Sa of the first material substrate 12a. Second substrate area Sb of material substrate 12b
Are arranged to overlap. That is, the surface of the second substrate area Sb becomes the one surface 1a of the substrate 1. In the present embodiment, the second material substrate 12b is formed of glass epoxy resin. The thickness of the second material substrate 12a is, for example, about 0.1 mm.
It is preferable that the thickness is defined so as to be thinner than 2a.
In the present embodiment, an epoxy resin-based adhesive is used as the adhesive 13 and is dissolved at the same time as the second material substrate 12a when desmearing is performed as described later.

Next, as shown in FIG. 9, a conductor film 81 is formed on the entire surface of the second material substrate 12b. The conductor coating 81 is formed by plating a copper foil over the entire surface of the second material substrate 12b.

Next, as shown in FIG. 10, the conductive coating 81 is etched to form the conductive closing pad 8. The conductive closing pad 8 is formed at a position corresponding to each of the through holes 71 on the front surface side of the second material substrate 12b and so as to be larger than the opening area of each of the through holes 71. At this time, each substrate area S
In (b), a wiring pattern (not shown) forming a circuit is formed, and the conductive closing pad 8 is formed so as to be continuous with the wiring pattern. The wiring pattern and the conductive closing pad 8 are formed collectively by etching the conductive film 81 using a known photolithography method. That is, first, a resist material is applied to the entire area of the conductor film on the second material substrate 12b, exposed using a mask on which a desired pattern is drawn, and developed by exposing the exposed resist material to form the conductor film 81. Out of the region corresponding to the wiring pattern and the conductive closing pad 8. Next, the exposed portion of the conductor coating 81 is melted by dipping the original substrate 10 in a solution capable of melting copper, and the resist material is peeled off. In this embodiment, this step is performed before forming a hole 72 described later, but this step may be performed immediately after forming the hole 72.

Next, as shown in FIG. 11, a desmear process is performed on the second material substrate 12b, and a hole 72 communicating with the through hole 71 is closed by the conductive closing pad 8. It is formed so that it comes off. In this embodiment, this step is performed by immersing the original substrate 10 on which the conductive closing pad 8 is formed in a solution capable of dissolving the epoxy resin. At this time, of the second material substrate 12b and the adhesive 13 applied to the back side thereof, the portion corresponding to the through hole 71 gradually dissolves, and the second material substrate 12b eventually dissolves over the entire thickness direction. Then, the hole 72 is formed by exposing the back side of the conductive closing pad 8.

Next, as shown in FIG. 12, a conductor layer 70 is formed on the inner peripheral surfaces of the through hole 71 and the hole 72 so as to be electrically connected to the conductive closing pad 8. Thereby, the wiring pattern on the surface of the second material substrate 12b and the terminal pad 6 of the first material substrate 12a are electrically connected via the conductive closing pad 8 and the conductor layer 70.

Next, as shown in FIG.
Of the first material substrate 12a and the surface of the second material substrate 12b are respectively formed with a protective film 9a and a protective film 9b generally called a green resist. The protective film 9a is formed so that predetermined portions of the wiring pattern (chip bonding pads and wire bonding pads for mounting the component group E) are opened. On the other hand, the protective film 9b is
Is formed so that the opening on the back surface side of the first material substrate 12a and the terminal pad 6 are opened. These protective films 9a and 9b are formed by applying a resist material to the original substrate 10, exposing it using a mask on which a desired pattern is drawn, and developing the exposed resist material.

At this time, since the opening of the hole 72 communicating with the through hole 71 is closed by the conductive closing pad 8 as described above, the inside of the hole 72 and the inside of the through hole 71 are formed. In addition, it is possible to prevent the resist material from entering.

In this embodiment, as shown in FIG. 14, the conductor layer 70 on the inner periphery of the through hole 71 and the hole 72, the back surface of the conductive closing pad 8, the terminal pad 6, the wire bonding Gold plating 80 is applied to the pads. At this time, if the wiring patterns formed in each second substrate area Sb are formed in advance so as to be continuous with each other,
Each pad of the original substrate 10 can be collectively plated with gold.

Next, as shown in FIG. 15, the original substrate 10 is on the second material substrate 12b side, more specifically, the second material substrate 12b.
The component group E is mounted on each second substrate area Sb of the material substrate 12b. At this time, each component group E is
Chip bonding is performed on a predetermined chip bonding pad, and wire bonding is performed using a gold wire W on a predetermined wire bonding pad. In the present embodiment, since the gold plating is applied on the wire bonding pads, the respective component groups E can be connected well.

Next, the resin package 5 is formed on the second material substrate 12b of the original substrate 10. In this process, a translucent resin such as epoxy resin is used as a material,
The mounted component group E is molded by transfer molding using a predetermined mold so as to be larger than each of the second substrate areas Sb in plan view. here,
As shown in FIG. 16, two adjacent second substrate areas S
b, the intermediate sealing body 5a which is molded at once is integrally formed. More specifically, a cavity corresponding to the shape of the intermediate sealing body 5a is formed in the predetermined mold, and the mold is set on the second material substrate 12b and melted in the cavity. After the resin is injected, the mold is removed after the resin has hardened.

At this time, since the opening of the hole 72 communicating with the through hole 71 is closed by the conductive closing pad 8 as described above, as shown in FIG. The molten resin can be prevented from entering the portion 72 and the through hole 71.

Then, the original substrate 10 is cut along the first substrate area Sa and the second substrate area Sb.
First, along the longitudinal direction of the first substrate area Sa and the second substrate area Sb, specifically, for example, a thickness of 0.35
As shown in FIG. 17, the intermediate sealing body 5a and the original substrate 1 are taken along a dashed line L using a circular blade of about mm.
Cut 0. At this time, the through-hole 71 and the hole 72 are cut along the axial direction thereof, whereby the connection terminal 7 is formed. Thereafter, by cutting along the short sides of the first substrate area Sa and the second substrate area Sb, a plurality of modules A can be obtained.

At this time, as described above, the penetration of the resin for forming the resin package 5 and the resist material for forming the protective films 9a and 9b are prevented from entering the through hole 71 and the hole 72. Therefore, it is possible to prevent a part of the resin or the resist material from becoming a cutting residue.

In the module A manufactured as described above, the connection terminal portion 7 is filled with the resin for forming the resin package 5 and the resist material for forming the protective films 9a and 9b. Can be prevented.

The module A is mounted on an external circuit board through an inspection process. In the inspection process, the measurement probe of the inspection device is brought into contact with the inner peripheral surface of the connection terminal portion 7.

At this time, in the module A, since the measurement probe is prevented from coming into contact with the resin or the resist material, an accurate inspection can be performed.

When the module A is mounted on the external circuit board B, for example, as shown in FIG. 2, the connection terminal portion 7 has its inner peripheral surface facing the external circuit board B, The module A is soldered so that the side surface of the substrate 1 on which the terminal portions 7 are formed faces the external circuit board B.
Thus, the module A is mounted such that the light emitting and receiving directions of the light emitting element 2 and the light receiving element 3 are parallel to the surface of the external circuit board B. At this time, as shown in FIG. 17, the solder fillet F is formed so as to join the inner peripheral surface of the connection terminal portion 7, the terminal pad 6, and the conductor pattern P formed on the surface of the external circuit board B to each other. Is done.

At this time, in this embodiment, the connection terminal 7
Conductor layer 70 on the inner peripheral surface of the conductive backing pad 8,
And the terminal pads 6 are made of gold plating 80 as described above.
Is applied, the module A can be mounted on the conductor pattern P of the external circuit board B with good conduction.

Further, in the module A, as described above, the connection terminal portion 7 is prevented from being blocked by the resin for forming the resin package 5 and the resist material for forming the protective films 9a and 9b. Therefore, when the module A is soldered to an external circuit board B, a solder fillet F can be formed on the entire inner peripheral surface of the connection terminal portion 7 as shown in FIG. Therefore,
The mounting strength of the module A on the circuit board B can be improved.

The data communication by infrared rays is performed by being arranged opposite to another module (not shown). That is, in the light emitting element 2, L
The electric signal transmitted from the SI chip 4 is converted into an optical signal, and infrared light as the optical signal is emitted to the outside. On the other hand, the light receiving element 3 converts infrared light as an optical signal received from the outside into an electric signal, and gives the LSI chip 4 an electric signal.

Of course, the scope of the present invention is not limited to the above embodiment. For example, in the above-described embodiment, the second material substrate 12b having the back surface coated with the adhesive is bonded to the first material substrate 12a, and then the conductive film 81 is formed on the second material substrate 12b. ,
Instead of the second material substrate 12b, a prepreg material formed by sandwiching an insulating layer made of glass epoxy resin between an epoxy resin adhesive layer and a copper foil layer may be used.

Further, the method of forming the connection terminal portion described above is as follows.
The present invention is not limited to application only when manufacturing an infrared data communication module, and can be applied to other semiconductor devices in which through-holes are cut to form groove-shaped connection terminal portions on the side surfaces of the substrate.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an example of an infrared data communication module according to the present invention.

FIG. 2 is a schematic perspective view showing a state where the infrared data communication module shown in FIG. 1 is mounted on an external circuit board.

FIG. 3 is a sectional view taken along the line III-III of FIG. 2;

FIG. 4 is a schematic plan view for explaining a method of manufacturing the infrared data communication module according to the present invention.

FIG. 5 is a schematic view of the first material substrate 12a in FIG. 4 as viewed from the back surface.

6 is a sectional view taken along the line VI-VI of FIG.

FIG. 7 is a cross-sectional view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 8 is a schematic plan view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 9 is a cross-sectional view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 10 is a cross-sectional view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 11 is a cross-sectional view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 12 is a cross-sectional view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 13 is a cross-sectional view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 14 is a cross-sectional view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 15 is a schematic perspective view for explaining the method for manufacturing the infrared data communication module according to the present invention.

FIG. 16 is a schematic perspective view for explaining the method for manufacturing the infrared data communication module according to the present invention.

17 is a sectional view taken along the line XVII-XVII in FIG.

FIG. 18 is a schematic perspective view showing an example of a conventional infrared data communication module.

19 is a schematic perspective view showing a state where the infrared data communication module shown in FIG. 18 is mounted on an external circuit board.

FIG. 20 is a schematic plan view for explaining a method for manufacturing a conventional infrared data communication module.

21 is a sectional view taken along the line XXI-XXI in FIG.

FIG. 22 is a schematic perspective view for explaining a method for manufacturing a conventional infrared data communication module.

FIG. 23 is a sectional view taken along the line XXIII-XXIII of FIG. 22;

FIG. 24 is a sectional view taken along the line XXIV-XXIV of FIG. 19;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting element 3 Light receiving element 5 Resin package 7 Connection terminal part 10 Original substrate 12a First material substrate 12b Second material substrate 13 Adhesive 70 Conductive layer 71 Through hole 72 Hole 81 Conductive film A Infrared data communication module E Parts Group Sa First substrate area Sb Second material substrate

Claims (4)

[Claims] 1. A substrate on which a component group including a light emitting element and a light receiving element is mounted on one side, and a resin package formed so as to seal the component group and entirely cover the one side of the substrate. Equipped on the side of the substrate,
An infrared data communication module in which a groove-shaped connection terminal portion extending over the entire thickness direction of the substrate and having a conductor layer on an inner peripheral surface is formed, wherein the connection terminal portion has an opening on the resin package side, An infrared data communication module, wherein the infrared data communication module is closed in advance by a conductive closing pad that conducts with the conductor layer. 2. The infrared data communication module according to claim 1, wherein the infrared data communication module is mounted so that an inner peripheral surface of the connection terminal portion faces an external circuit board. 3. A board on which a component group including a light emitting element and a light receiving element is mounted on one surface, and a resin package formed to seal the component group and to entirely cover the one surface of the substrate. Equipped on the side of the substrate,
A method for manufacturing an infrared data communication module in which a groove-shaped connection terminal portion having a conductor layer on an inner peripheral surface is formed and extends over the entire thickness direction of the substrate, wherein the first substrate is a rear surface side of the substrate. Forming a through hole on a boundary line of the first substrate area with respect to a first material substrate having an area; and having an adhesive on the back side having a second substrate area corresponding to the first substrate area. A step of forming an original substrate by laminating the applied second material substrate on the first material substrate; a step of forming a conductive film over the entire surface of the second material substrate; By etching, at a position corresponding to the through hole on the surface side of the second material substrate,
Forming a conductive blocking pad larger than the opening area of the through-hole; performing desmear processing on the second material substrate to form a hole communicating with the through-hole; Forming the conductive layer so as to be closed by a closing pad; forming the conductive layer on the inner peripheral surface of the through hole and the hole so as to be electrically connected to the conductive closing pad; A step of mounting the component group on the two-material board side; a step of forming the resin package on the second material board of the original board; and a step of moving the original board along the first board area and the second board area. And cutting the infrared data communication module. 4. The second material substrate is formed of glass epoxy resin, and the adhesive applied to the back surface of the second material substrate is an epoxy resin-based adhesive, and performs the desmear process. The method for manufacturing an infrared data communication module according to claim 3, wherein the step is performed by immersing the original substrate on which the conductive blocking pad is formed in a solution capable of dissolving an epoxy resin.