JP2001077408A - Infrared transmission/reception module and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent peeling of a conductor layer by coating a solder paste in the opening of a through-hole, before being heated to fill the through-hole with the solder, and cutting a substrate along the axial core direction of the through-hole filled with the solder. SOLUTION: A mask comprising a window hole, for example, corresponding to the hole position of a through-hole 24 is used. The window hole and its vicinity are coated with a solder paste where granular solder, for example, and flux are kneaded, and the paste is extruded toward the through-hole 24 side. The aggregate substrate is heated to melt the solder paste, which is allowed to flow in the through-hole 24, so that it is filled with a solder S. Then the through-hole 24 is cut in the axial core direction, to form the channel on the side of a substrate 2. With this configuration, the through-hole 24 is filled with the solder S in advance, while the conductor layer 10 is covered with the solder S, so that the conductor layer 10 will not peel when it is cut thereafter.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to IrDA (Infr.
The present invention relates to a method of manufacturing an infrared transmitting / receiving module used for performing infrared data communication by an ared data association, and an infrared transmitting / receiving module.

[0002]

2. Description of the Related Art Heretofore, it has been used in portable information devices and notebook personal computers, etc., and an I / O is required between these devices or peripheral devices such as a printer.
Infrared data communication by rDA is performed.

In such infrared data communication,
An infrared transmitting / receiving module (hereinafter, simply referred to as a “module”) including a light emitting element and a light receiving element for infrared rays is used. This module includes, for example,
There is a substrate mounting type in which the above-described elements are mounted on a substrate and are integrally molded.

FIG. 13 shows an example of this board-mounted module, and particularly shows a state in which the module is mounted on an external circuit board when viewed from the back side. As shown in the drawing, the appearance of the module 1 is formed by a substrate 2 and a sealing body 6 formed integrally with the substrate 2.
A light-emitting element, a light-receiving element, and an LSI chip (not shown) for controlling the light-emitting element and the light-receiving element are mounted on the substrate 2, and a sealing body 6 is formed so as to cover these electronic components. On the front side of the module 1, although not shown, a light emitting lens portion is formed on a surface facing the light emitting element, and a light receiving lens portion 14 is formed on a surface facing the light receiving element.

[0005] On the back surface of the substrate 2 (the back surface of the module 1), there are formed connection terminal portions 8 which are soldered and joined to an external circuit board B. On the side surface of the substrate 2, a groove 9 having an inner peripheral surface plated with copper is formed. Through the groove 9, the connection terminal portion 8 is formed on the surface of the substrate 2 on which the light emitting element or the like is mounted. It is connected to the formed conductor pattern (not shown). In the drawing, P indicates a wiring pattern of the external circuit board B.

When such a module 1 is manufactured, for example, an aggregate substrate made of a substantially rectangular glass epoxy is used, and a large number of modules 1 are obtained from the aggregate substrate. The module 1 is manufactured for each partitioned area on the collective substrate. Specifically, an appropriate number of through-holes penetrating in the thickness direction of the collective substrate are formed in each region, and after forming a predetermined conductor pattern on the front surface and the back surface, the electronic components described above are mounted. Are respectively formed so as to cover. Then, the aggregate substrate is cut vertically and horizontally to obtain a large number of modules 1.

Here, the groove 9 is formed by cutting along the axial direction of the through hole when cutting the collective substrate. That is, it is formed so that approximately half of the cylindrical through hole remains, and as a result, the groove 9 is formed.
Is exposed to the outside.

[0008]

However, when the through hole is cut along the axial direction, a part of the conductor layer formed by copper plating is peeled off on the inner peripheral surface of the through hole. Burrs may occur. for that reason,
When the module 1 is mounted on an external circuit board B, the side surface of the board 2 in which the groove 9 is formed is in contact with the surface of the circuit board B. In some cases, the module 1 cannot be mounted on the circuit board B properly.

[0009]

DISCLOSURE OF THE INVENTION The present invention has been conceived in view of the above circumstances, and has been developed in view of the above circumstances, and is a conductor layer formed on an inner peripheral surface of a through hole, which is generated by cutting a substrate along the through hole. To provide a method of manufacturing an infrared transmitting and receiving module that can prevent peeling of the like beforehand,
The subject.

In order to solve the above problems, the present invention takes the following technical measures.

According to the first aspect of the present invention, a substrate on which a light emitting element and a light receiving element are mounted and a through hole having a conductor layer is provided on an inner peripheral surface is divided along the through hole. A manufacturing method for manufacturing an infrared transmitting / receiving module in which a groove is formed on a side surface of a substrate, wherein a solder paste is applied to an opening of a through-hole and then heated to fill the through-hole with solder. And a cutting step of cutting the substrate along the axial direction of the through hole filled with solder.

According to this method, for example, when a plurality of substrates are formed by cutting an aggregate substrate, a groove is formed on a side surface of the substrate by cutting along a through hole formed in the aggregate substrate. Since the formation of the groove is performed after the solder is filled in the through-hole, the solder covers the conductor layer formed on the inner peripheral surface of the through-hole, and therefore, the peeling of the conductor layer does not occur. . Therefore, the occurrence of the peeling can be prevented beforehand. Also, for example, when this infrared transmitting / receiving module is mounted on an external circuit board, when the side surface of the board is mounted on the surface of the circuit board in contact with the infrared transmitting / receiving module, the infrared transmitting / receiving module is filled with solder filled in the groove. It can be easily joined to an external circuit board.

According to a preferred embodiment of the present invention,
It has a sealing step of sealing each element mounted on the surface of the substrate with the resin together with the substrate, and in the solder filling step, after sealing by the sealing step, the substrate is turned upside down, and the solder is applied from the back side of the substrate. Fill. According to this, since the front side of the board is sealed with the resin, the lower opening of the through hole is closed when the solder is filled. Therefore, the solder can be reliably filled without the solder leaking from the through hole.

According to another preferred embodiment of the present invention, in the solder filling step, a mask having a window hole corresponding to the opening of the through hole is used, and the solder paste is extruded from the window hole of the mask toward the through hole. . According to this method, the solder can be appropriately filled in the through hole by the mask without spreading the solder paste around the opening of the through hole, for example.

According to another preferred embodiment of the present invention, in the solder filling step, the solder is filled so that the solder is substantially flush with the front and back surfaces of the substrate. According to this method, the solder is filled so as to be substantially flush with the side surface of the board. For example, when this infrared transmitting / receiving module is mounted on an external circuit board, the bonding with the external circuit board is smoother. The bonding strength between the infrared transmitting / receiving module and an external circuit board can be increased.

The infrared transmitting / receiving module provided by the second aspect of the present invention is characterized by being manufactured by the method of manufacturing an infrared transmitting / receiving module provided by the first aspect of the present invention.

In the infrared transmitting / receiving module according to the present invention, the same operation and effect as those obtained by the first aspect of the present invention can be expected.

[0018] Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

FIG. 1 is a perspective view of an infrared transceiver module according to the present invention. 2 and 3 are diagrams showing the internal configuration of the infrared transceiver module shown in FIG.

As shown in FIGS. 1 to 3, the infrared transmitting / receiving module (hereinafter simply referred to as "module") 1 has a substantially rectangular substrate 2, a light emitting element 3 and a light receiving element 4 mounted on the substrate 2. , And an LSI chip 5, and a sealing body 6 for integrally sealing them.

The substrate 2 is made of glass epoxy resin,
A predetermined conductor pattern 7 is formed on the surface 2a,
On the back surface 2b, a connection terminal portion 8 to be joined to an external circuit board (described later) for mounting the module 1 is formed. A substantially semi-cylindrical groove 9 is formed on the side surface 2 c of the substrate 2, and a conductor layer 10 made of plated copper is formed on the inner peripheral surface of the groove 9. Via the conductor layer 10, the conductor pattern 7 on the front surface 2a of the substrate 2 and the connection terminal portion 8 on the back surface 2b are electrically connected.

The groove 9 is formed by cutting a through hole formed so as to penetrate the substrate 2 in the thickness direction in a manufacturing process of the substrate 2 (described later). In detail, the groove 9 is cut along the axial direction of the through hole so that approximately half of the substantially cylindrical through hole remains. The peripheral surface is exposed to the outside.

The groove 9 is filled with solder S. More specifically, as shown in FIG.
In the above, the solder S is filled so as to be substantially flush with the side surface 2c of the substrate 2.

An insulating layer (not shown) for protecting the front surface 2a and the back surface 2b of the substrate 2 is formed. This insulating layer covers portions other than those that need to be exposed to the outside. For example, since the connection terminal portion 8 is joined to an external circuit board via a solder fillet, it is covered with the insulating layer. Absent.

The light emitting element 3 is composed of a light emitting diode or the like, and is mounted on the substrate 2 as shown in FIG.
Conductor pattern 7
Is connected to The light receiving element 4 is formed of a PIN photodiode or the like, is mounted on the substrate 2 like the light emitting element 3, and is connected to the conductor pattern 7 by wire bonding with a gold wire 12 or the like. The LSI chip 5 controls the transmission / reception operation of the light emitting element 3 and the light receiving element 4 and is mounted on the substrate 2 and includes a gold wire 13.
Conductor pattern 7
Are connected to the light emitting element 3 and the light receiving element 4 through the conductor pattern 7.

The sealing body 6 is made of, for example, an epoxy resin containing a pigment, and the light emitting element 3, the light receiving element 4, and the LSI
The chip 5 is integrally sealed so as to cover the chip 5. The sealing body 6 does not transmit visible light, but transmits infrared light sufficiently well. On the surface of the sealing body 6 facing the light emitting element 3 and the light receiving element 4, a light emitting lens part 14 and a light receiving lens part 15 are formed, respectively.

Although not shown in FIG. 1, the module 1 may be provided with a shield case or the like for suppressing the influence of electromagnetic waves around the module 1 so as to cover the outer shape of the module 1.

When the module 1 having such a configuration is mounted on an external circuit board, for example, as shown in FIG.
The mounting is performed so that the back surface 2b of the substrate 2 extends in a direction orthogonal to the surface of the external circuit board B, that is, the light receiving and emitting directions of the light emitting element 3 and the light receiving element 4 are parallel to the surface of the external circuit board B. Is done. In this case, the solder fillet F is formed so as to join the connection terminal portion 8 on the back surface 2b and the wiring pattern P formed on the surface of the external circuit board B to each other.

The data communication by infrared rays is performed by being arranged opposite to another module (not shown). That is, the light emitting element 3 converts an electric signal sent from the LSI chip 5 transmitted through the conductor pattern 7 into an optical signal and emits infrared light as the optical signal to the outside. On the other hand, the light receiving element 4 converts infrared light as an optical signal received from the outside into an electric signal,
An electric signal is given to the LSI chip 5.

As described above, when this module 1 is mounted on an external circuit board B, if the module 1 is mounted such that the side surface 2c of the board 2 contacts the surface of the external circuit board B, the groove 9 is formed. Since it faces the surface of the external circuit board B, the module 1 can be easily and smoothly mounted on the external circuit board B by the solder S filled in the groove 9. Further, when mounting the module 1 on the external circuit board B, a solder fillet F is formed between the connection terminal portion 8 formed on the back surface of the board 2 and the wiring pattern P of the external circuit board B. In this case, the solder S filled in the groove 9 is well coupled to the solder fillet F, and the mounting strength of the module 1 on the circuit board B outside the module 1 can be increased.

Next, a method of manufacturing the module 1 will be described. First, as shown in FIG. 6, a collective substrate 20 made of a sheet-like glass epoxy resin extending in a substantially rectangular shape.
Is used. The assembly board 20 includes a large number of modules 1
Are arranged, and a region 21 having a certain size is defined corresponding to each of the modules 1.
Engagement holes 22 for fixing the collective substrate 20 when manufacturing the module 1 are provided on both sides of the collective substrate 20.
Are formed. In addition, a slit 23 extending in the vertical direction for preventing warping of the collective substrate 20 is formed in the collective substrate 20 for each of the predetermined number of regions 21.

Next, for each region 21 of the collective substrate 20, an appropriate number of through-holes 24, which finally become the grooves 9, for conducting the front and back surfaces of the collective substrate 20 are formed. The through hole 24 is formed so as to penetrate the collective substrate 20, and the inner peripheral surface thereof is plated with copper to form the conductor layer 10.

Next, a predetermined conductor pattern 7 is formed on the front and back surfaces of the collective substrate 20 for each region 21 by a known photolithography method. That is,
A resist material is applied to the collective substrate 20 having a copper foil on the surface, exposed and developed using a mask on which a desired pattern is drawn, and unnecessary portions of the copper foil are removed by etching. 7 is formed. in this case,
On the back surface of the collective substrate 20, connection terminals 8 of an appropriate size are formed around the openings of the through holes 24.

Next, an insulating layer is formed on the front and back surfaces of the collective substrate 20 to cover portions other than those which need to be exposed to the outside. Also in this case, the insulating layer formed in advance on the entire surface of the collective substrate 20 is exposed using a photolithography method, for example, using a mask having a window hole corresponding to a portion to be exposed in the conductor pattern 7, An opening is formed in the insulating layer by performing the development.

In this case, since the front side of the collective substrate 20 is molded with a translucent resin as described later, the resin is prevented from entering the through hole 24.
The opening of the through hole 24 on the front side is closed by an insulating layer. On the other hand, in the connection terminal portion 8 including the through hole 24 on the back surface side of the collective substrate 20, an opening is formed in the insulating layer to be exposed to the outside.

Next, electronic components such as the light emitting element 3 are mounted on each area 21 on the collective substrate 20, and thereafter, as shown in FIG.
As shown in (1), the mounted electronic component is integrally molded by transfer molding using a predetermined mold using a translucent resin such as an epoxy resin. Here, the modules 1 in the two regions 21 are collectively molded to form the intermediate sealing body 25. On the upper surface of the intermediate sealing body 25 facing the light emitting element 3 and the light receiving element 4, a substantially hemispherical light emitting lens part 14 and a light receiving lens part 15 are formed.

Next, the through holes 24 are filled with solder. For this purpose, as shown in FIG. 8, the collective substrate 20 is turned upside down, and for example, a mask 26 having a window hole corresponding to the hole position of the through hole 24 is used. For example, a solder paste in which powdery solder and flux are kneaded is applied. Then, as shown in FIG. 9, the solder paste is extruded from the window hole of the mask 26 toward the through hole 24 by a squeegee 27 or the like. After that, the solder paste is melted by heating the collective substrate 20 and poured into the through holes 24 as shown in FIG.

In this case, the solder paste may be extruded with the squeegee 27 or the like a plurality of times. In order to reduce the possibility of peeling of the conductor layer 10 when the through hole 24 is cut, the solder S is removed. It is desirable to fill the through hole 24 without gaps.

Further, as described above, by using the mask 26 having the window hole corresponding to the hole position of the through hole 24, the solder paste spreads directly on the connection terminal 8 around the opening of the through hole 24. Therefore, the solder S can be appropriately filled in the through hole 24. Furthermore, a sealing body 6 and an insulating layer are formed on the front side of the collective substrate 20, and when the solder S is filled, the through hole 2 is formed by the sealing body 6 and the insulating layer.
4 will be closed. Therefore, the solder S can be reliably filled without the solder S leaking from the through hole 24.

Thereafter, as shown in FIGS. 11 and 12, the collective substrate 20 is cut vertically and horizontally. FIG. 11 is a view as seen from the back side of the collective substrate 20. First, collective board 2
The collective substrate 20 is cut along the vertical direction of 0, specifically, along the dashed line L1 shown in FIG. For cutting the aggregate substrate 20, for example, a blade 28 having a diameter of 56 mm and a thickness of 0.35 mm is used, and as shown in FIG.
The collective substrate 20 and the through holes 24 are cut. In this case, the intermediate sealing body 21 is cut so as to be divided into two in the vertical direction, and the through-hole 24 is cut along the axial direction, and the groove 9 on the side surface 2 c of the substrate 2 is cut.
Is formed.

In this case, the through holes 24 are filled with solder S in advance. Therefore, when the through hole is cut in a state where the solder is not filled as in the conventional case, the conductor layer 10 formed on the inner peripheral surface of the cut portion of the through hole may be peeled off. If the through holes 24 are filled with the solder S in advance, the conductor layer 10 is covered with the solder S, so that even if the conductor layer 10 is cut afterwards, the conductor layer 10 does not peel off. Therefore, the conductor layer 1 in the through-hole 24 generated by cutting the substrate along the through-hole 24
0 can be prevented beforehand.

When the through hole 24 is cut,
It is conceivable that the solder S pre-filled in the through-hole 24 may be peeled off. However, when the module 1 is mounted on an external circuit board B, the solder S is thermally contracted by the solder reflow process, so that a problem occurs. Absent.

Next, along the end of the region 21 on the side opposite to the side where the groove 9 is formed, specifically, along the dashed line L2 shown in FIG. 11, a vertically long intermediate product is obtained. Thereafter, the intermediate product is cut along an alternate long and short dash line L3 shown in FIG. 11 to remove unnecessary portions located above and below each region 21. Thus, by cutting the collective substrate 20, a large number of modules 1 are obtained.

The module 1 manufactured by the above-described manufacturing method is mounted on an external circuit board B, for example.
The board 2 is mounted by, for example, a solder reflow process so that the side surface 2c of the board 2 contacts the surface of the external circuit board B (see FIG. 4). In this case, the solder S filled in the groove 9
Thereby, the board 2 is satisfactorily bonded to the external circuit board B, and a solder fillet F is formed between the connection terminal portion 8 and the wiring pattern P of the external circuit board B, thereby improving the bonding property between the two. be able to.

Of course, the scope of the present invention is not limited to the above embodiment. For example, the number of terminals of the groove 9 formed on the side surface 2c of the substrate 2 is not limited to eight as shown in FIG.

The above-described cutting method is not limited to being applied only when manufacturing an infrared transmitting / receiving module, but may be applied to other module devices that cut through holes and form grooves on the side surfaces of the substrate. .

[Brief description of the drawings]

FIG. 1 is a perspective view of an infrared transceiver module according to the present invention.

FIG. 2 is an internal configuration diagram of the infrared transceiver module shown in FIG. 1;

FIG. 3 is an internal configuration diagram of the infrared transceiver module shown in FIG. 1;

FIG. 4 is a partially cutaway side view of the infrared transceiver module.

FIG. 5 is a diagram showing a state in which the infrared transceiver module shown in FIG. 1 is mounted on an external circuit board.

FIG. 6 is a diagram for explaining a method of manufacturing the infrared transmitting / receiving module.

FIG. 7 is a diagram for explaining a method of manufacturing the infrared transmitting / receiving module.

FIG. 8 is a diagram for explaining a method of manufacturing the infrared transmitting / receiving module.

FIG. 9 is a diagram for explaining a method of manufacturing the infrared transmitting / receiving module.

FIG. 10 is a diagram illustrating a method for manufacturing the infrared transmitting / receiving module.

FIG. 11 is a diagram illustrating a method for manufacturing the infrared transmitting / receiving module.

FIG. 12 is a diagram for explaining a method of manufacturing the infrared transmitting / receiving module.

FIG. 13 is a diagram showing an example of a conventional infrared transmitting / receiving module.

[Description of Signs] 1 Infrared transmitting / receiving module 2 Substrate 2c Side surface 3 Light emitting element 4 Light receiving element 6 Sealing body 9 Groove 10 Conductive layer 20 Assembly board 24 Through hole B Circuit board

Claims (5)

[Claims] A substrate, on which a light emitting element and a light receiving element are mounted and provided with a through hole having a conductor layer on an inner peripheral surface, is divided along the through hole to form a groove on a side surface of the substrate. A method for manufacturing an infrared transmitting / receiving module, comprising: applying a solder paste to an opening of the through-hole, and then heating and filling the inside of the through-hole by heating; and A cutting step of cutting the substrate along the axial direction of the filled through-holes. 2. The method according to claim 2, further comprising a sealing step of sealing each of the elements mounted on the surface of the substrate with a resin together with the substrate. In the solder filling step, after sealing in the sealing step, the substrate is sealed. 2. The method for manufacturing an infrared transmitting / receiving module according to claim 1, wherein the substrate is turned upside down and filled with solder from the back side of the substrate. 3. The solder filling step according to claim 1, wherein a mask having a window hole corresponding to the opening of the through hole is used, and the solder paste is extruded from the window hole of the mask toward the through hole. Manufacturing method of the infrared transmitting / receiving module. 4. The method of manufacturing an infrared transmitting / receiving module according to claim 1, wherein in the solder filling step, the solder is filled so that the solder is substantially flush with the front and back surfaces of the substrate. 5. An infrared transmission / reception module manufactured by the manufacturing method according to claim 1. Description: