JP2017011030A - Method for manufacturing light-emitting device - Google Patents

Method for manufacturing light-emitting device Download PDF

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JP2017011030A
JP2017011030A JP2015123047A JP2015123047A JP2017011030A JP 2017011030 A JP2017011030 A JP 2017011030A JP 2015123047 A JP2015123047 A JP 2015123047A JP 2015123047 A JP2015123047 A JP 2015123047A JP 2017011030 A JP2017011030 A JP 2017011030A
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light
substrate
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light emitting
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JP6398887B2 (en
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誠治 山口
Seiji Yamaguchi
誠治 山口
伊藤　浩史
Hiroshi Ito
浩史 伊藤
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Toyoda Gosei Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device including a step of sealing a light-emitting element with a sealing material which is simple and can suppress warpage of a substrate.SOLUTION: A method for manufacturing a light-emitting device 1 having a light-emitting element 11 sealed by a sealing material 12 on a substrate 10 includes: a step of mounting the light-emitting element 11 on the substrate 10; a step of forming a plurality of first portions 12a which are a part of the sealing material 12 so as to be separated from each other, and curing the first portions 12a; and a step of filling a space between the plurality of first portions 12a with a resin in a state where warpage is corrected by adding an external force to the substrate 10, and forming a single or plurality of second portions 12b which are a part of the sealing material 12.SELECTED DRAWING: Figure 2

Description

本発明は、発光装置の製造方法に関する。   The present invention relates to a method for manufacturing a light emitting device.

従来の発光装置として、線状又はマトリクス状に配置された複数の発光素子が蛍光体を含む部材で覆われた発光装置が知られている（例えば、特許文献１〜４参照）。   As a conventional light-emitting device, a light-emitting device in which a plurality of light-emitting elements arranged in a linear or matrix shape is covered with a member containing a phosphor is known (for example, see Patent Documents 1 to 4).

特許文献１に開示される発光装置は、基板上に線状に配置された複数の発光素子と、それら複数の発光素子を共通して封止する、かまぼこ型の透明封止部材と、その透光性部材の表面を直接被覆する、蛍光体を含む光変換部材と、を有する。   A light-emitting device disclosed in Patent Document 1 includes a plurality of light-emitting elements arranged linearly on a substrate, a kamaboko-type transparent sealing member that seals the plurality of light-emitting elements in common, and a transparent And a light conversion member including a phosphor that directly covers the surface of the light member.

特許文献２に開示される発光装置は、基板上にマトリクス状に配置された複数の発光素子と、それら複数の発光素子の各々を封止する、複数のドーム状の蛍光体層と、を有する。   A light-emitting device disclosed in Patent Document 2 includes a plurality of light-emitting elements arranged in a matrix on a substrate, and a plurality of dome-shaped phosphor layers that seal each of the plurality of light-emitting elements. .

特許文献３に開示される発光装置は、基板上に線状に配置された複数の発光素子と、それら複数の発光素子を共通して被覆する、両端の閉じた中空の樋状の透光性部材と、その透光性部材の表面を直接被覆する、蛍光体を含む光変換部材と、を有する。   A light-emitting device disclosed in Patent Document 3 includes a plurality of light-emitting elements arranged linearly on a substrate, and a hollow bowl-shaped light-transmitting property that is closed at both ends and covers the plurality of light-emitting elements in common. And a light conversion member including a phosphor that directly covers the surface of the light transmissive member.

特許文献４に開示される発光装置は、基板上にマトリクス状に配置された複数の発光素子と、それら複数の発光素子の上方に設置された板状の保持部材と、その保持部材の表面に塗布された蛍光体部と、を有する。   A light emitting device disclosed in Patent Document 4 includes a plurality of light emitting elements arranged in a matrix on a substrate, a plate-like holding member installed above the plurality of light emitting elements, and a surface of the holding member. And a coated phosphor portion.

特開２０１２−１９９４９７号公報JP 2012-199497 A 特開２０１２−２３５１５７号公報JP 2012-235157 A 特開２０１２−２０４３４９号公報JP 2012-204349 A 特開２０１３−９３４５９号公報JP 2013-93459 A

特許文献１、２に示されるような、発光素子を封止部材や蛍光体層で封止する構造の発光装置においては、封止部材や蛍光体層の基板への接触面積が比較的大きいため、これらを構成する樹脂が硬化時に収縮することにより、基板に反りが生じるおそれがある。   In a light emitting device having a structure in which a light emitting element is sealed with a sealing member or a phosphor layer as shown in Patent Documents 1 and 2, the contact area of the sealing member or the phosphor layer with the substrate is relatively large. The resin constituting them may shrink during curing, which may cause the substrate to warp.

一方、特許文献３、４に示されるような、発光素子が直接封止されない構造の発光装置においては、上記のような基板に反りが生じるおそれは少ないものの、その構造故に、製造工程が複雑である。   On the other hand, in the light emitting device having a structure in which the light emitting element is not directly sealed as shown in Patent Documents 3 and 4, there is little risk of warping of the substrate as described above, but the manufacturing process is complicated because of the structure. is there.

そこで、本発明の目的の一つは、発光素子を封止材により封止する工程を含む発光装置の製造方法であって、簡便かつ基板の反りを抑えることのできる発光装置の製造方法を提供することにある。   Thus, one of the objects of the present invention is a method for manufacturing a light emitting device including a step of sealing a light emitting element with a sealing material, and provides a method for manufacturing a light emitting device that can easily suppress warping of a substrate. There is to do.

本発明の一態様は、上記目的を達成するために、下記［１］〜［５］の発光装置の製造方法を提供する。   In order to achieve the above object, one embodiment of the present invention provides a method for manufacturing a light-emitting device according to any one of [1] to [5] below.

［１］基板上に封止材により封止された発光素子を有する発光装置の製造方法であって、基板上に発光素子を搭載する工程と、前記封止材の一部である複数の第１の部分を互いに離間させて形成し、硬化させる工程と、前記基板に外力を加えて反りを矯正した状態で、前記複数の第１の部分の間の空間に樹脂を充填して、前記封止材の一部である単数又は複数の第２の部分を形成する工程と、を含む、発光装置の製造方法。 [1] A method for manufacturing a light-emitting device having a light-emitting element sealed on a substrate with a sealing material, the step of mounting the light-emitting element on a substrate, and a plurality of first parts that are a part of the sealing material A step of forming and curing one portion apart from each other, and filling a space between the plurality of first portions with a resin in a state in which warping is corrected by applying an external force to the substrate; Forming a single part or a plurality of second parts which are a part of the stop material.

［２］前記複数の第１の部分の各々、及び前記第２の部分の各々が、前記発光素子を封止する、上記［１］に記載の発光装置の製造方法。 [2] The method for manufacturing a light-emitting device according to [1], wherein each of the plurality of first parts and each of the second parts seals the light-emitting element.

［３］前記第１の部分の屈折率と前記第２の部分の屈折率が異なる、上記［１］又は［２］に記載の発光装置の製造方法。 [3] The method for manufacturing a light-emitting device according to [1] or [2], wherein a refractive index of the first portion is different from a refractive index of the second portion.

［４］前記第１の部分の硬化による収縮率が、前記第２の部分の硬化による収縮率よりも大きい、上記［１］〜［３］のいずれか１項に記載の発光装置の製造方法。 [4] The method for manufacturing a light-emitting device according to any one of [1] to [3], wherein a shrinkage rate due to curing of the first portion is larger than a shrinkage rate due to curing of the second portion. .

［５］前記複数の第１の部分を金型成形する、上記［１］〜［４］のいずれか１項に記載の発光装置の製造方法。 [5] The method for manufacturing a light-emitting device according to any one of [1] to [4], wherein the plurality of first portions are molded.

本発明によれば、発光素子を封止材により封止する工程を含む発光装置の製造方法であって、簡便かつ基板の反りを抑えることのできる発光装置の製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, it is a manufacturing method of the light-emitting device including the process of sealing a light emitting element with a sealing material, Comprising: The manufacturing method of the light-emitting device which can suppress the curvature of a board | substrate simply can be provided.

図１（ａ）は、実施の形態に係る発光装置の斜視図である。図１（ｂ）は、実施の形態に係る発光装置の変形例を示す斜視図である。FIG. 1A is a perspective view of a light emitting device according to an embodiment. FIG. 1B is a perspective view showing a modification of the light emitting device according to the embodiment. 図２（ａ）〜（ｆ）は、実施の形態に係る発光装置の製造工程の一例を示す垂直断面図である。2A to 2F are vertical sectional views showing an example of a manufacturing process of the light emitting device according to the embodiment. 図３（ａ）、（ｂ）は、発光素子がマトリクス状に配置された発光装置を形成した後、ダイシングにより、発光素子が線状に配置された複数の発光装置に分割する場合の工程の一例を概略的に表す平面図である。3A and 3B show a process in the case where a light emitting device in which light emitting elements are arranged in a matrix is formed and then divided into a plurality of light emitting devices in which the light emitting elements are arranged in a line by dicing. It is a top view showing an example roughly.

〔実施の形態〕
（発光装置の構成）
図１（ａ）は、実施の形態に係る発光装置１の斜視図である。 Embodiment
(Configuration of light emitting device)
Fig.1 (a) is a perspective view of the light-emitting device 1 which concerns on embodiment.

発光装置１は、基板１０と、基板１０上に線状に配置された複数の発光素子１１と、複数の発光素子１１を封止する封止材１２と、を有する。   The light emitting device 1 includes a substrate 10, a plurality of light emitting elements 11 arranged linearly on the substrate 10, and a sealing material 12 that seals the plurality of light emitting elements 11.

基板１０は、例えば、Ａｌ２Ｏ３基板、ＡｌＮ基板等のセラミック基板、表面が絶縁膜で覆われたＡｌ基板やＣｕ基板等の金属基板、又はガラスエポキシ基板である。また、基板１０は、発光素子１１への電源供給経路となる配線（図示しない）を有する。 The substrate 10 is, for example, a ceramic substrate such as an Al 2 O 3 substrate or an AlN substrate, a metal substrate such as an Al substrate or a Cu substrate whose surface is covered with an insulating film, or a glass epoxy substrate. In addition, the substrate 10 has wiring (not shown) serving as a power supply path to the light emitting element 11.

発光素子１１は、例えば、チップ基板と、発光層及びそれを挟むクラッド層を含む結晶層とを有する、ＬＥＤやレーザーダイオード等の発光素子である。発光素子１１は、結晶層が上方を向いたフェイスアップ型の素子であってもよいし、結晶層が下方を向いたフェイスダウン型の素子であってもよい。   The light emitting element 11 is, for example, a light emitting element such as an LED or a laser diode having a chip substrate and a crystal layer including a light emitting layer and a cladding layer sandwiching the light emitting layer. The light-emitting element 11 may be a face-up element with the crystal layer facing upward, or a face-down element with the crystal layer facing downward.

発光素子１１は、基板１０に含まれる配線に接続され、その配線を介して発光素子１１に電源が供給される。複数の発光素子１１は、すべて同じ発光波長を有していてもよいし、異なる発光波長を有していてもよい。   The light emitting element 11 is connected to a wiring included in the substrate 10, and power is supplied to the light emitting element 11 through the wiring. The plurality of light emitting elements 11 may all have the same emission wavelength or may have different emission wavelengths.

封止材１２は、複数の第１の部分１２ａと、複数の第２の部分１２ｂから構成される。第１の部分１２ａと第２の部分１２ｂは、交互に配置される。第１の部分１２ａと第２の部分１２ｂは、例えば、シリコーン系樹脂やエポキシ系樹脂等の透明樹脂からなる。   The sealing material 12 includes a plurality of first portions 12a and a plurality of second portions 12b. The first portions 12a and the second portions 12b are alternately arranged. The 1st part 12a and the 2nd part 12b consist of transparent resins, such as silicone resin and an epoxy resin, for example.

発光装置１においてローカルディミングを行う等の場合には、第１の部分１２ａと第２の部分１２ｂの屈折率が異なっていることが好ましい。この場合、第１の部分１２ａと第２の部分１２ｂとの界面で光が全反射しやすくなるため、第１の部分１２ａに封止された発光素子１１から発せられる光と第２の部分１２ｂに封止された発光素子１１から発せられる光が混ざりにくくなる。   When performing local dimming in the light emitting device 1, it is preferable that the refractive indexes of the first portion 12a and the second portion 12b are different. In this case, since light is easily totally reflected at the interface between the first portion 12a and the second portion 12b, the light emitted from the light emitting element 11 sealed in the first portion 12a and the second portion 12b. The light emitted from the light-emitting element 11 sealed in is difficult to mix.

例えば、第１の部分１２ａと第２の部分１２ｂの材料として、一方にメチルシリコーン樹脂、他方にフェニルシリコーンを用いる場合には、第１の部分１２ａと第２の部分１２ｂの間に０．２程度の屈折率差を生じさせることができる。また、一方にシリコーン樹脂等の樹脂材料を用いて、他方にガラスを用いる場合には、より大きな屈折率差を生じさせることができる。ただし、本実施の形態においては、後述するように、第１の部分１２ａを第２の部分１２ｂよりも先に形成するため、一方の材料にガラスを用いる場合には、第１の部分１２ａの材料にガラスを用いる必要がある。ガラスの融点が高いため、第２の部分１２ｂの材料にガラスを用いると、先に形成される第１の部分１２ａを溶かしてしまうためである。また、この場合、基板１０の材料として耐熱性に優れるセラミック等を用いる必要がある。   For example, when methylsilicone resin is used as one of the materials for the first part 12a and the second part 12b and phenylsilicone is used for the other, 0.2 is provided between the first part 12a and the second part 12b. A degree of refractive index difference can be generated. Further, when a resin material such as a silicone resin is used on one side and glass is used on the other side, a larger refractive index difference can be generated. However, in this embodiment, as described later, since the first portion 12a is formed before the second portion 12b, when glass is used for one material, the first portion 12a It is necessary to use glass as the material. This is because the melting point of glass is high, and thus, when glass is used as the material of the second portion 12b, the first portion 12a formed first is melted. Further, in this case, it is necessary to use ceramics having excellent heat resistance as the material of the substrate 10.

封止材１２は、蛍光体粒子を含んでもよい。蛍光体粒子の蛍光色は特に限定されず、例えば、黄色系の蛍光体粒子としては、ＢＯＳ（バリウム・オルソシリケート）系蛍光体や、ＹＡＧ（イットリウム・アルミニウム・ガーネット）系蛍光体の粒子が用いられる。例えば、発光素子１１の発光色が青色であり、蛍光体粒子の蛍光色が黄色である場合は、発光装置１の発光色は白色になる。   The sealing material 12 may include phosphor particles. The fluorescent color of the phosphor particles is not particularly limited. For example, as the yellow phosphor particles, BOS (barium orthosilicate) phosphor particles or YAG (yttrium aluminum garnet) phosphor particles are used. It is done. For example, when the emission color of the light emitting element 11 is blue and the fluorescent color of the phosphor particles is yellow, the emission color of the light emitting device 1 is white.

なお、第１の部分１２ａと第２の部分１２ｂがそれぞれどのような蛍光体粒子を含むかは自由である。例えば、第１の部分１２ａと第２の部分１２ｂは、同種の蛍光体粒子を含んでいてもよいし、異なる蛍光体粒子を含んでいてもよい。また、第１の部分１２ａと第２の部分１２ｂは、異なる濃度の蛍光体粒子を含んでいてもよいし、一方のみが蛍光体粒子を含んでいてもよい。   In addition, it is free what kind of fluorescent substance particle each the 1st part 12a and the 2nd part 12b contains. For example, the first portion 12a and the second portion 12b may include the same type of phosphor particles, or may include different phosphor particles. Moreover, the 1st part 12a and the 2nd part 12b may contain the fluorescent substance particle of a different density | concentration, and only one may contain the fluorescent substance particle.

図１（ａ）に示される例では、第１の部分１２ａと第２の部分１２ｂの形状はそれぞれ直方体であるが、これに限定されず、第１の部分１２ａと第２の部分１２ｂの側面同士が面接触していればよい。   In the example shown in FIG. 1A, the shapes of the first portion 12a and the second portion 12b are rectangular parallelepipeds, but are not limited thereto, and the side surfaces of the first portion 12a and the second portion 12b are not limited thereto. It suffices if they are in surface contact with each other.

図１（ｂ）は、発光装置１の変形例を示す斜視図である。この変形例においては、第１の部分１２ａと第２の部分１２ｂの上面が湾曲しており、それぞれの内部における、発光素子１１から発せられた光の光路差を小さくすることができる。   FIG. 1B is a perspective view showing a modification of the light emitting device 1. In this modification, the upper surfaces of the first portion 12a and the second portion 12b are curved, and the optical path difference of the light emitted from the light emitting element 11 in each of them can be reduced.

（発光装置の製造方法）
以下に、発光装置１の製造方法の一例について具体的に説明する。 (Method for manufacturing light emitting device)
Below, an example of the manufacturing method of the light-emitting device 1 is demonstrated concretely.

図２（ａ）〜（ｆ）は、実施の形態に係る発光装置１の製造工程の一例を示す垂直断面図である。   2A to 2F are vertical sectional views showing an example of a manufacturing process of the light emitting device 1 according to the embodiment.

まず、図２（ａ）に示されるように、基板１０上に複数の発光素子１１を搭載する。   First, as shown in FIG. 2A, a plurality of light emitting elements 11 are mounted on a substrate 10.

次に、図２（ｂ）に示されるように、基板１０上に、第１の部分１２ａを成形するための金型２０を固定する。その後、樹脂注入路２１を通して基板１０と金型２０の間の空間に樹脂を注入し、第１の部分１２ａを成形する。これによって、複数の第１の部分１２ａが互いに離間した状態で成形される。   Next, as shown in FIG. 2B, a mold 20 for forming the first portion 12 a is fixed on the substrate 10. Thereafter, resin is injected into the space between the substrate 10 and the mold 20 through the resin injection path 21 to mold the first portion 12a. Thereby, the plurality of first portions 12a are molded in a state of being separated from each other.

次に、加熱により第１の部分１２ａを硬化させる。図２（ｃ）、（ｄ）に示されるように、第１の部分１２ａは、硬化が進行するにつれて収縮する。そして、第１の部分１２ａの収縮により基板１０に反りが生じる。図２（ｄ）中の矢印は、基板１０の反りの方向を模式的に示すものである。   Next, the first portion 12a is cured by heating. As shown in FIGS. 2C and 2D, the first portion 12a contracts as the curing proceeds. Then, the substrate 10 is warped due to the contraction of the first portion 12a. The arrow in FIG. 2D schematically shows the direction of warping of the substrate 10.

次に、図２（ｅ）に示されるように、基板１０に外力を加えて、基板１０の反りを矯正する。図２（ｅ）中の矢印は、基板１０に加える外力の方向を模式的に示すものである。基板１０に外力を加える方法としては、例えば、基板の上面を上方から押さえる方法、基板吸引固定装置を用いて基板の下面を下方から吸引する方法等がある。なお、第１の部分１２ａの硬化前から、基板１０に外力を加えていてもよい。   Next, as shown in FIG. 2E, an external force is applied to the substrate 10 to correct the warpage of the substrate 10. The arrow in FIG. 2E schematically shows the direction of the external force applied to the substrate 10. Examples of a method of applying an external force to the substrate 10 include a method of pressing the upper surface of the substrate from above and a method of sucking the lower surface of the substrate from below using a substrate suction fixing device. Note that an external force may be applied to the substrate 10 before the first portion 12a is cured.

次に、図２（ｆ）に示されるように、基板１０の反りを矯正した状態で、複数の第１の部分１２ａの間の空間に樹脂を充填して、第２の部分１２ｂを形成する。   Next, as shown in FIG. 2F, in a state where the warpage of the substrate 10 is corrected, the space between the plurality of first portions 12a is filled with resin to form the second portion 12b. .

このとき、第２の部分１２ｂは、第１の部分１２ａの収縮により生じた第１の部分１２ａの側方の空間にも充填されるため、上記の基板１０の反りを矯正するための外力の印加を止めた後の基板１０の反りの復元を妨げる。   At this time, since the second portion 12b is also filled in the space on the side of the first portion 12a generated by the contraction of the first portion 12a, the external force for correcting the warp of the substrate 10 is not affected. This prevents the warpage of the substrate 10 from being restored after the application is stopped.

このため、第２の部分１２ｂを形成する時点で第１の部分１２ａが完全に硬化していなくてもよいが、収縮がほぼ終わる状態まで硬化していることが好ましい。また、基板１０の反りの復元をより効果的に妨げるためには、第２の部分１２がほぼ完全に硬化した後で外力の印加を止めることが好ましい。   For this reason, the first portion 12a may not be completely cured at the time of forming the second portion 12b, but it is preferable that the first portion 12a is cured until the contraction is almost finished. Further, in order to more effectively prevent the warpage of the substrate 10 from being restored, it is preferable to stop applying the external force after the second portion 12 is almost completely cured.

また、本実施の形態では、第１の部分１２ａの収縮による基板１０の反りを矯正するため、第１の部分１２ａと第２の部分１２ｂの材料が異なる場合には、第１の部分１２ａに硬化時の収縮率が大きい材料を用いて、第２の部分１２ｂに硬化時の収縮率が小さい材料を用いることにより、基板１０の反りをより効果的に抑えることができる。   Further, in the present embodiment, in order to correct the warpage of the substrate 10 due to the contraction of the first portion 12a, when the materials of the first portion 12a and the second portion 12b are different, the first portion 12a By using a material having a large shrinkage rate during curing and using a material having a small shrinkage rate during curing for the second portion 12b, the warpage of the substrate 10 can be more effectively suppressed.

第２の部分１２ｂは、第１の部分１２ａのように金型を用いて成形してもよいし、スクリーン印刷等による塗布や、滴下により形成してもよい。塗布や滴下により第２の部分１２ｂを形成する場合には、第１の部分１２ａと接触しない側面を形成するための外枠を用いることが好ましい。   The second portion 12b may be formed using a mold like the first portion 12a, or may be formed by application by screen printing or dripping. When the second portion 12b is formed by coating or dropping, it is preferable to use an outer frame for forming a side surface that does not contact the first portion 12a.

図３（ａ）、（ｂ）は、発光素子１１がマトリクス状に配置された発光装置２を形成した後、ダイシングにより、発光素子１１が線状に配置された複数の発光装置１に分割する場合の工程の一例を概略的に表す平面図である。   3A and 3B, after forming the light-emitting device 2 in which the light-emitting elements 11 are arranged in a matrix, the light-emitting elements 11 are divided into a plurality of light-emitting devices 1 in which the light-emitting elements 11 are arranged in a line by dicing. It is a top view showing an example of a process in a case roughly.

図３（ａ）に示される発光装置２は、上記の図２（ａ）〜（ｆ）に示される工程を経て形成される。発光装置２は、発光素子１１がマトリクス状に配置され、第１の部分１２ａ及び第２の部分１２ｂは、ダイシング方向と直交する方向に延びて、各々が複数の発光素子１１を共通して封止している。   The light emitting device 2 shown in FIG. 3A is formed through the steps shown in FIGS. 2A to 2F. In the light emitting device 2, the light emitting elements 11 are arranged in a matrix, and the first portion 12 a and the second portion 12 b extend in a direction orthogonal to the dicing direction, and each of the plurality of light emitting elements 11 is sealed in common. It has stopped.

（実施の形態の効果）
上記実施の形態によれば、第１の部分１２ａの硬化後に第２の部分１２ｂを形成することにより、第１の部分１２ａの収縮による基板１０の反りを低減することができる。このため、上記実施の形態に係る封止材１２の形成により生じる基板１０の反りは、封止材１２と同じ大きさの１つの封止材の形成により生じる基板の反りよりも格段に小さい。すなわち、封止材の形成により生じる基板の反りを従来よりも小さくすることができる。 (Effect of embodiment)
According to the above embodiment, the warpage of the substrate 10 due to the contraction of the first portion 12a can be reduced by forming the second portion 12b after the first portion 12a is cured. For this reason, the warpage of the substrate 10 caused by the formation of the sealing material 12 according to the embodiment is much smaller than the warpage of the substrate caused by the formation of one sealing material having the same size as the sealing material 12. That is, the warpage of the substrate caused by the formation of the sealing material can be made smaller than before.

また、封止材１２には蛍光体粒子を含有させて蛍光体層として用いることができるが、発光素子から離間して設けられる蛍光体層と比較して容易に形成することができる。   Further, the sealing material 12 can contain phosphor particles and can be used as a phosphor layer, but can be easily formed as compared with a phosphor layer provided apart from the light emitting element.

以上、本発明の実施の形態を説明したが、本発明は、上記の実施の形態に限定されず、発明の主旨を逸脱しない範囲内において種々変形実施が可能である。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

例えば、図１に示される発光装置１は、複数の第１の部分１２ａの各々及び複数の第２の部分１２ｂの各々が１つの発光素子を封止する構造を有しているが、発光装置１の構造はこのような構造に限定されず、例えば、１つの部分が複数の発光素子を共通して封止する構造であってもよいし、発光素子を封止しない部分を含む構造であってもよい。このため、封止材の部分の数、発光素子の数及び配置は特に限定されない。なお、封止材の形成により生じる基板の反りを小さくするために求められる封止材１２の構成のうち、最も単純なものは、２つの第１の部分１２ａと、それらに挟まれた１つの第２の部分１２ｂからなる構成である。   For example, the light emitting device 1 shown in FIG. 1 has a structure in which each of the plurality of first portions 12a and each of the plurality of second portions 12b seals one light emitting element. The structure of 1 is not limited to such a structure. For example, one part may be a structure that seals a plurality of light emitting elements in common, or a structure that includes a part that does not seal the light emitting elements. May be. For this reason, the number of portions of the sealing material, the number and arrangement of the light emitting elements are not particularly limited. Of the configurations of the sealing material 12 required to reduce the warpage of the substrate caused by the formation of the sealing material, the simplest one is the two first portions 12a and one sandwiched between them. It is the structure which consists of the 2nd part 12b.

また、上記実施の形態においては、封止材１２が２種類の部分（第１の部分１２ａ及び第２の部分１２ｂ）から構成されているが、３種以上の部分から構成されてもよい。   Moreover, in the said embodiment, although the sealing material 12 is comprised from 2 types of parts (1st part 12a and 2nd part 12b), you may be comprised from 3 or more types of parts.

また、上記の実施の形態は特許請求の範囲に係る発明を限定するものではない。また、実施の形態の中で説明した特徴の組合せの全てが発明の課題を解決するための手段に必須であるとは限らない点に留意すべきである。   Moreover, said embodiment does not limit the invention which concerns on a claim. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

１、２ 発光装置
１０ 基板
１１ 発光素子
１２ 封止材
１２ａ 第１の部分
１２ｂ 第２の部分
２０ 金型 DESCRIPTION OF SYMBOLS 1, 2 Light-emitting device 10 Board | substrate 11 Light-emitting element 12 Sealing material 12a 1st part 12b 2nd part 20 Mold

Claims (5)

基板上に封止材により封止された発光素子を有する発光装置の製造方法であって、
基板上に発光素子を搭載する工程と、
前記封止材の一部である複数の第１の部分を互いに離間させて形成し、硬化させる工程と、
前記基板に外力を加えて反りを矯正した状態で、前記複数の第１の部分の間の空間に樹脂を充填して、前記封止材の一部である単数又は複数の第２の部分を形成する工程と、
を含む、発光装置の製造方法。 A method of manufacturing a light emitting device having a light emitting element sealed on a substrate with a sealing material,
Mounting a light emitting element on a substrate;
Forming and curing a plurality of first portions that are part of the sealing material; and
In a state where the warp is corrected by applying an external force to the substrate, a resin is filled in a space between the plurality of first portions, and one or more second portions which are a part of the sealing material are filled. Forming, and
A method for manufacturing a light emitting device, comprising: 前記複数の第１の部分の各々、及び前記第２の部分の各々が、前記発光素子を封止する、
請求項１に記載の発光装置の製造方法。 Each of the plurality of first portions and each of the second portions seals the light emitting element.
The manufacturing method of the light-emitting device of Claim 1. 前記第１の部分の屈折率と前記第２の部分の屈折率が異なる、
請求項１又は２に記載の発光装置の製造方法。 The refractive index of the first part is different from the refractive index of the second part,
The manufacturing method of the light-emitting device of Claim 1 or 2. 前記第１の部分の硬化による収縮率が、前記第２の部分の硬化による収縮率よりも大きい、
請求項１〜３のいずれか１項に記載の発光装置の製造方法。 The shrinkage due to the curing of the first part is greater than the shrinkage due to the curing of the second part,
The manufacturing method of the light-emitting device of any one of Claims 1-3. 前記複数の第１の部分を金型成形する、
請求項１〜４のいずれか１項に記載の発光装置の製造方法。 Molding the plurality of first portions;
The manufacturing method of the light-emitting device of any one of Claims 1-4.
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