JP6399783B2 - LED light emitting device and manufacturing method thereof - Google Patents

LED light emitting device and manufacturing method thereof Download PDF

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JP6399783B2
JP6399783B2 JP2014074475A JP2014074475A JP6399783B2 JP 6399783 B2 JP6399783 B2 JP 6399783B2 JP 2014074475 A JP2014074475 A JP 2014074475A JP 2014074475 A JP2014074475 A JP 2014074475A JP 6399783 B2 JP6399783 B2 JP 6399783B2
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phosphor resin
emitting device
resin layer
substrate
led light
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JP2015198130A (en
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康生 中西
康生 中西
福田　匡広
福田　　匡広
浩之 塚田
浩之 塚田
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Watch Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Description

本発明は、ＬＥＤ発光装置及びその製造方法に関し、特に、枠体に蛍光体樹脂層が接合されたＬＥＤ発光装置及びその製造方法に関する。   The present invention relates to an LED light emitting device and a manufacturing method thereof, and more particularly to an LED light emitting device in which a phosphor resin layer is bonded to a frame and a manufacturing method thereof.

近年、半導体素子であるＬＥＤ素子は、長寿命で優れた駆動特性を有し、さらに小型で発光効率が良く鮮やかな発光色を有することから、照明等に広く利用されるようになってきた。   In recent years, LED elements, which are semiconductor elements, have long life and excellent driving characteristics, and are widely used for illumination and the like because they are small in size, have high luminous efficiency, and have bright emission colors.

基板上にＬＥＤ素子を搭載し、ＬＥＤ素子を取り囲むように反射部材を配置し、反射部材に基板に対して垂直方向に凹部を設け、凹部に接着材を注入し、凹部に注入された接着材によって波長変換部材を固定した照明装置が知られている（特許文献１参照）。   An LED element is mounted on a substrate, a reflective member is disposed so as to surround the LED element, a concave portion is provided in the reflective member in a direction perpendicular to the substrate, an adhesive is injected into the concave portion, and an adhesive injected into the concave portion There is known an illumination device in which the wavelength conversion member is fixed by the above (see Patent Document 1).

また、基板上にＬＥＤ素子を搭載し、ＬＥＤ素子を取り囲むように反射部材を配置し、反射部材に内周に沿って溝状凹部を設け、波長変換部材が溝状凹部内に遊嵌されている照明装置が知られている（特許文献２参照）。   Also, an LED element is mounted on the substrate, a reflective member is disposed so as to surround the LED element, a groove-shaped recess is provided on the reflective member along the inner periphery, and the wavelength conversion member is loosely fitted in the groove-shaped recess. There is known a lighting device (see Patent Document 2).

特開２００７−２３４６３７号公報JP 2007-234637 A 特開２００７−１８００６６号公報JP 2007-180066 A

しかしながら、特許文献１に記載された照明装置では、接着剤が光を吸収して照明装置の発光効率及び光出力が低下する、また、接着剤が光を吸収して機械的強度が劣化して波長変換部材が枠体に強固に固定されない、といった問題があった。さらには、特許文献１に記載された照明装置では、接着剤が、波長変換部材の放熱を阻害するという問題もあった。   However, in the lighting device described in Patent Document 1, the adhesive absorbs light and the luminous efficiency and light output of the lighting device decrease, and the adhesive absorbs light and the mechanical strength deteriorates. There was a problem that the wavelength conversion member was not firmly fixed to the frame. Furthermore, in the illuminating device described in Patent Document 1, there is also a problem that the adhesive hinders heat radiation of the wavelength conversion member.

また、特許文献２に記載された照明装置では、波長変換部材は溝状凹部内に遊嵌されており、波長変換部材が反射部材から外れやすい、といった問題があった。また、特許文献２に記載された照明装置では、波長変換部材は溝状凹部と密着しておらず、空隙を有するため、波長変換部材の放熱性は低い。   Moreover, in the illuminating device described in patent document 2, there existed a problem that the wavelength conversion member was loosely fitted in the groove-shaped recessed part, and the wavelength conversion member was easy to remove | deviate from a reflection member. Moreover, in the illuminating device described in patent document 2, since the wavelength conversion member is not closely_contact | adhered with a groove-shaped recessed part and has a space | gap, the heat dissipation of a wavelength conversion member is low.

そこで、本発明は、上述した問題点を解消することを可能としたＬＥＤ発光装置及びその製造方法を提供することを目的とする。   Then, an object of this invention is to provide the LED light-emitting device which made it possible to eliminate the trouble mentioned above, and its manufacturing method.

また、本発明は、蛍光体樹脂層を枠体に強固に接合することを可能としたＬＥＤ発光装置及びその製造方法を提供することを目的とする。   Another object of the present invention is to provide an LED light-emitting device that can firmly bond a phosphor resin layer to a frame and a method for manufacturing the LED light-emitting device.

本発明に係るＬＥＤ発光装置は、基板と、基板の上面に配置されたＬＥＤ素子と、基板の上面にＬＥＤ素子を取り囲むように配置された枠体と、枠体の内周面に設けられた保持部と、保持部と接合された蛍光体樹脂層と、を有し、保持部は、凹部又は凸部を含み、枠体と蛍光体樹脂層とが、保持部を介して、一体的に形成されている、ことを特徴とする。   An LED light-emitting device according to the present invention is provided on a substrate, an LED element disposed on the upper surface of the substrate, a frame disposed on the upper surface of the substrate so as to surround the LED element, and an inner peripheral surface of the frame A holding unit and a phosphor resin layer bonded to the holding unit, the holding unit includes a concave portion or a convex portion, and the frame body and the phosphor resin layer are integrally formed via the holding unit. It is formed, It is characterized by the above-mentioned.

本発明に係るＬＥＤ発光装置では、凹部又は凸部は、基板と略平行となる様に形成されていることが好ましい。   In the LED light emitting device according to the present invention, it is preferable that the concave portion or the convex portion is formed so as to be substantially parallel to the substrate.

本発明に係るＬＥＤ発光装置では、更に、前記基板と略平行となる様に形成された凹部又は凸部と交差するように形成された凹部又は凸部を含んでいることが好ましい。   It is preferable that the LED light emitting device according to the present invention further includes a concave portion or a convex portion formed so as to intersect with the concave portion or the convex portion formed so as to be substantially parallel to the substrate.

本発明に係るＬＥＤ発光装置の製造方法は、基板、基板の上面に配置されたＬＥＤ素子、及び、枠体を有するＬＥＤ発光装置の製造方法であって、枠体の内周面に保持部を形成し、保持部の内側に未硬化の第１の蛍光体樹脂を滴下し、未硬化の第１の蛍光体樹脂を硬化させて、保持部と接合された蛍光体樹脂層を形成し、蛍光体樹脂層が形成された枠体を基板上にＬＥＤ素子を取り囲むように配置する、工程を有し、保持部は、凹部又は凸部を含み、枠体と蛍光体樹脂層とが、保持部を介して、一体的に形成されている、ことを特徴とする。   A manufacturing method of an LED light emitting device according to the present invention is a manufacturing method of an LED light emitting device having a substrate, an LED element disposed on an upper surface of the substrate, and a frame, and a holding portion is provided on an inner peripheral surface of the frame. Forming and dropping an uncured first phosphor resin inside the holding portion to cure the uncured first phosphor resin to form a phosphor resin layer bonded to the holding portion, The frame having the body resin layer formed thereon is disposed on the substrate so as to surround the LED element, the holding part includes a concave part or a convex part, and the frame and the phosphor resin layer are provided in the holding part. It is characterized by being formed integrally through.

本発明に係るＬＥＤ発光装置の製造方法では、凹部又は凸部は、前記基板と略平行となる様に形成されていることが好ましい。   In the manufacturing method of the LED light emitting device according to the present invention, it is preferable that the concave portion or the convex portion is formed so as to be substantially parallel to the substrate.

本発明に係るＬＥＤ発光装置の製造方法では、更に、前記基板と略平行となる様に形成された凹部又は凸部と交差するように形成された凹部又は凸部を含んでいることが好ましい。   In the manufacturing method of the LED light-emitting device according to the present invention, it is preferable that the method further includes a concave portion or a convex portion formed so as to intersect with the concave portion or the convex portion formed so as to be substantially parallel to the substrate.

本発明に係るＬＥＤ発光装置の製造方法では、未硬化の第１の蛍光体樹脂を滴下後に、更に、未硬化の第１の蛍光体樹脂よりも粘度が高い未硬化の第２の蛍光体樹脂を滴下し、未硬化の第１の蛍光体樹脂及び未硬化の第２の蛍光体樹脂を硬化させて、保持部と接合された蛍光体樹脂層を形成することが好ましい。   In the manufacturing method of the LED light emitting device according to the present invention, after dropping the uncured first phosphor resin, the uncured second phosphor resin having a higher viscosity than the uncured first phosphor resin. Is preferably dripped to cure the uncured first phosphor resin and the uncured second phosphor resin to form a phosphor resin layer bonded to the holding portion.

本発明に係るＬＥＤ発光装置及びその製造方法では、枠体と蛍光体樹脂層との接合面を多くとることができるため、蛍光体樹脂層を枠体に強固に接合すること、及び、蛍光体樹脂層で発生する熱を、枠体を通して十分に放熱すること、が可能となった。   In the LED light-emitting device and the manufacturing method thereof according to the present invention, a large number of bonding surfaces between the frame and the phosphor resin layer can be obtained, and therefore, the phosphor resin layer can be firmly bonded to the frame, and the phosphor It has become possible to sufficiently dissipate heat generated in the resin layer through the frame.

（ａ）は本発明に係るＬＥＤ発光装置１の平面図であり、（ｂ）は（ａ）のＡＡ´断面図である。(A) is a top view of the LED light-emitting device 1 which concerns on this invention, (b) is AA 'sectional drawing of (a). ＬＥＤ発光装置１の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the LED light-emitting device. 図２（ｃ）のＢの箇所の拡大図である。FIG. 3 is an enlarged view of a portion B in FIG. 保持部１９の他の例を説明するための図である。It is a figure for demonstrating the other example of the holding | maintenance part. 保持部１９の更に他の例を説明するための図である。It is a figure for demonstrating the further another example of the holding | maintenance part. 本発明に係る他のＬＥＤ発光装置２の断面図である。It is sectional drawing of the other LED light-emitting device 2 which concerns on this invention. ＬＥＤ発光装置２の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the LED light-emitting device. 本発明に係る更に他のＬＥＤ発光装置３の断面図である。It is sectional drawing of the other LED light-emitting device 3 which concerns on this invention.

以下図面を参照して、本発明に係るＬＥＤ発光装置及びその製造方法について説明する。但し、本発明の技術的範囲はそれらの実施の形態に限定されず、特許請求の範囲に記載された発明とその均等物に及ぶ点に留意されたい。   Hereinafter, an LED light emitting device and a manufacturing method thereof according to the present invention will be described with reference to the drawings. However, it should be noted that the technical scope of the present invention is not limited to these embodiments, but extends to the invention described in the claims and equivalents thereof.

図１（ａ）は本発明に係るＬＥＤ発光装置１の平面図であり、図１（ｂ）は図１（ａ）のＡＡ´断面図である。   Fig.1 (a) is a top view of the LED light-emitting device 1 which concerns on this invention, FIG.1 (b) is AA 'sectional drawing of Fig.1 (a).

ＬＥＤ発光装置１は、基板１０、枠体１１、ＬＥＤ素子１２、蛍光体樹脂層１３等から構成されている。基板１０には、２つの電極１４が設けられている。   The LED light emitting device 1 includes a substrate 10, a frame 11, an LED element 12, a phosphor resin layer 13, and the like. Two electrodes 14 are provided on the substrate 10.

ＬＥＤ素子１２は、ダイボンド材１５によって基板１０の表面に接着され、透光性の樹脂２７で封止されている。また、ＬＥＤ素子１２は、基板１０の上面側に形成された電極１４にワイヤーボンディングされている。   The LED element 12 is bonded to the surface of the substrate 10 with a die bond material 15 and sealed with a translucent resin 27. The LED element 12 is wire-bonded to an electrode 14 formed on the upper surface side of the substrate 10.

枠体１１は、樹脂やセラミックス等から形成される。枠体１１は、略円筒形であり、基板１０の上面に、ＬＥＤ素子１２を取り囲むように接着剤等により取り付けられている。   The frame 11 is formed from resin, ceramics, or the like. The frame body 11 has a substantially cylindrical shape, and is attached to the upper surface of the substrate 10 with an adhesive or the like so as to surround the LED element 12.

枠体１１の上端内周面には、保持部１９が形成されている。保持部１９には、凹部として、断面が略矩形の溝部２０を含んでいる。なお、図１（ｂ）では、保持部１９は、凹部として、２本の断面が略矩形の溝部２０を設けているが、断面が略矩形の溝部の本数は２本に限定されず、１本であっても、３本以上であっても良い。   A holding portion 19 is formed on the inner peripheral surface of the upper end of the frame body 11. The holding portion 19 includes a groove portion 20 having a substantially rectangular cross section as a concave portion. In FIG. 1B, the holding portion 19 is provided with a groove portion 20 having a substantially rectangular cross section as a recess, but the number of groove portions having a substantially rectangular cross section is not limited to two. It may be a book or three or more.

凹部は、基板と略平行でなくとも、例えば、基板と４５度傾いた構造を有していてもよい。なお、凹部が基板と略平行になるように形成されている場合、蛍光体樹脂層内に気泡が入りにくくなる。また、凹部が基板と略平行になるように形成されている場合、蛍光体樹脂層と枠体との接合は、枠体の上下両方向からの衝撃に強いものとなる。   For example, the recess may have a structure inclined by 45 degrees with respect to the substrate. In addition, when the recess is formed so as to be substantially parallel to the substrate, it is difficult for bubbles to enter the phosphor resin layer. In addition, when the recess is formed so as to be substantially parallel to the substrate, the phosphor resin layer and the frame are strongly bonded to impacts from both the upper and lower directions of the frame.

保持部１９には、ＬＥＤ素子１２の上部を覆うように、蛍光体を含有した樹脂が硬化して形成された蛍光体樹脂層１３が接合されている。枠体１１と蛍光体樹脂層１３は、保持部１９を介して、一体的に形成されている。   A phosphor resin layer 13 formed by curing a resin containing a phosphor is bonded to the holding portion 19 so as to cover the upper portion of the LED element 12. The frame body 11 and the phosphor resin layer 13 are integrally formed via a holding part 19.

蛍光体は、ＬＥＤ素子１２から発光された青色光の一部を吸収し、波長変換した黄色光を発光するので、青色光と黄色光が混じり合い、ＬＥＤ発光装置１からは白色光が出射される。なお、蛍光体樹脂層１３には、ＬＥＤ素子１２から発光された光を均一に分散させるための散乱材が含まれていてもよい。   The phosphor absorbs part of the blue light emitted from the LED element 12 and emits yellow light after wavelength conversion. Therefore, the blue light and the yellow light are mixed, and white light is emitted from the LED light emitting device 1. The The phosphor resin layer 13 may include a scattering material for uniformly dispersing the light emitted from the LED elements 12.

本発明に係るＬＥＤ発光装置１では、枠体１１と蛍光体樹脂層１３が、保持部１９を介して一体的に形成されているため、蛍光体樹脂層１３と枠体１１とが強固に接合されている。したがって、蛍光体樹脂層１３は枠体１１から容易に離脱することがなく、また、蛍光体樹脂層１３で発生する熱は、枠体１１を通して十分に放熱することが可能となる。   In the LED light emitting device 1 according to the present invention, since the frame body 11 and the phosphor resin layer 13 are integrally formed via the holding part 19, the phosphor resin layer 13 and the frame body 11 are firmly bonded. Has been. Therefore, the phosphor resin layer 13 is not easily detached from the frame body 11, and the heat generated in the phosphor resin layer 13 can be sufficiently dissipated through the frame body 11.

なお、枠体１１の内周面には、光反射層を形成してもよい。光反射層は、例えば、白色インク、アルミニウム等の金属、又は、酸化チタン（ＴｉＯ2）や二酸化ケイ素（ＳｉＯ2）等からなる誘電体多層膜から形成される。光反射層は、ＬＥＤ素子１２から枠体１１に向かう光を、ＬＥＤ発光装置１の出射方向に向けて反射するので、発光効率が改善する。 A light reflection layer may be formed on the inner peripheral surface of the frame body 11. The light reflecting layer is formed of a dielectric multilayer film made of, for example, a white ink, a metal such as aluminum, or titanium oxide (TiO 2 ) or silicon dioxide (SiO 2 ). Since the light reflection layer reflects the light from the LED element 12 toward the frame 11 toward the emission direction of the LED light emitting device 1, the light emission efficiency is improved.

図２は、ＬＥＤ発光装置１の製造方法を説明するための図である。   FIG. 2 is a diagram for explaining a method of manufacturing the LED light emitting device 1.

まず、樹脂により、略円筒形であって、上端内周面に保持部１９を有する、枠体１１を用意する。保持部１９には、凹部として、断面が略矩形の溝部２０を形成する。   First, a frame body 11 having a substantially cylindrical shape and having a holding portion 19 on the inner peripheral surface of the upper end is prepared from resin. In the holding part 19, a groove part 20 having a substantially rectangular cross section is formed as a concave part.

次に、図２（ａ）に示すように、枠体１１の上端が下向きとなるように、専用の治具２１内に、枠体１１を設置する。   Next, as shown in FIG. 2A, the frame body 11 is installed in the dedicated jig 21 so that the upper end of the frame body 11 faces downward.

次に、図２（ｂ）に示すように、ディスペンサ２２によって、未硬化の蛍光体樹脂２４を、蛍光体樹脂２４の高さが、完全に保持部１９を満たすまで、枠体１１及び治具２１に囲まれた領域に滴下する。枠体１１の上端を下向きに設置した状態で、蛍光体樹脂２４を滴下することにより、保持部１９に、未硬化の蛍光体樹脂２４が密着し易くなる。   Next, as shown in FIG. 2B, the uncured phosphor resin 24 is removed by the dispenser 22 until the height of the phosphor resin 24 completely fills the holding portion 19. Dripping into the area surrounded by 21. By dropping the phosphor resin 24 in a state where the upper end of the frame body 11 is set downward, the uncured phosphor resin 24 is easily adhered to the holding portion 19.

次に、図２（ｃ）に示す様に、蛍光体樹脂２４を硬化させて蛍光体樹脂層１３を形成し、治具２１から枠体１１を取り外す。図３は、図２（ｃ）のＢの箇所の拡大図である。図３に示す様に、蛍光体樹脂層１３は硬化すると、枠体１１に沿って蛍光体樹脂層１３から盛り上がるヒケ部分２３が生じる。   Next, as shown in FIG. 2C, the phosphor resin 24 is cured to form the phosphor resin layer 13, and the frame body 11 is removed from the jig 21. FIG. 3 is an enlarged view of a portion B in FIG. As shown in FIG. 3, when the phosphor resin layer 13 is cured, a sink portion 23 that rises from the phosphor resin layer 13 along the frame 11 is generated.

最後に、図２（ｄ）に示すように、蛍光体樹脂層１３を備える枠体１１を、ＬＥＤ素子１２を備える基板１０に、接着剤等で取り付けて、ＬＥＤ発光装置１を完成させる。   Finally, as shown in FIG. 2 (d), the frame body 11 including the phosphor resin layer 13 is attached to the substrate 10 including the LED elements 12 with an adhesive or the like to complete the LED light emitting device 1.

上述した製造方法によって、枠体１１と蛍光体樹脂層１３が、保持部１９を介して一体的に形成されているため、蛍光体樹脂層１３と枠体１１とが強固に接合されている。したがって、蛍光体樹脂層１３は枠体１１から容易に離脱することがなく、また、蛍光体樹脂層１３で発生する熱は、枠体１１を通して十分に放熱することが可能となる。   Since the frame body 11 and the phosphor resin layer 13 are integrally formed through the holding portion 19 by the manufacturing method described above, the phosphor resin layer 13 and the frame body 11 are firmly bonded. Therefore, the phosphor resin layer 13 is not easily detached from the frame body 11, and the heat generated in the phosphor resin layer 13 can be sufficiently dissipated through the frame body 11.

図４は、保持部１９の他の例を説明するための図である。   FIG. 4 is a diagram for explaining another example of the holding unit 19.

図４（ａ）に示すように、保持部１９´は、凹部として、複数の断面が略Ｖ字状の溝部３１を含んでいる。なお、図４（ａ）では、保持部１９´は、２本の断面が略Ｖ字状の溝部３１を設けているが、溝部３１の本数は２本に限定されず、１本であっても、３本以上であっても良い。   As shown in FIG. 4A, the holding portion 19 ′ includes a groove portion 31 having a plurality of substantially V-shaped cross sections as a concave portion. In FIG. 4A, the holding portion 19 ′ has two groove portions 31 each having a substantially V-shaped cross section. However, the number of the groove portions 31 is not limited to two, and is one. Or three or more.

図４（ｂ）では、保持部１９´´は、凹部として、断面が略ロ字状の１本の溝部３２を含んでいる。溝部３２は、保持部１９´´の外周側に設けられた開口部分と連結され、開口部分より幅広の溝を有している。なお、溝部３２は、特殊な工具によって保持部１９´´部分を掘削するようにして形成しても良いし、２部品等によって形成しても良い。また、図４（ｂ）では、保持部１９´´は、１本の断面が略ロ字状の溝部３２を設けているが、溝部３２の本数は１本に限定されず、２本以上であっても良い。   In FIG. 4B, the holding portion 19 ″ includes one groove portion 32 having a substantially square cross section as a recess. The groove portion 32 is connected to an opening portion provided on the outer peripheral side of the holding portion 19 ″ and has a groove wider than the opening portion. The groove 32 may be formed by excavating the holding portion 19 ″ with a special tool, or may be formed by two parts. In FIG. 4B, the holding portion 19 ″ is provided with a groove portion 32 having a substantially square cross section. However, the number of the groove portions 32 is not limited to one, but two or more. There may be.

図４（ｃ）では、保持部１９´´´は、凸部として、断面が略Ｌ字状の１本の突起３３を含んでいる。なお、図４（ｃ）では、保持部１９´´´は、１本の断面が略Ｌ字状の突起３３を設けているが、突起３３の本数は１本に限定されず、２本以上であっても良い。また、突起３３の形状も断面が略Ｌ字状に限定されることなく、他の形状であっても良い。   In FIG.4 (c), holding | maintenance part 19 '' '' contains the one protrusion 33 whose cross section is substantially L-shaped as a convex part. In FIG. 4C, the holding portion 19 ″ ″ is provided with a protrusion 33 having a substantially L-shaped cross section, but the number of the protrusions 33 is not limited to one, but two or more. It may be. Further, the shape of the protrusion 33 is not limited to a substantially L-shaped cross section, and may be another shape.

図５は、保持部１９の更に他の例を説明するための図である。   FIG. 5 is a diagram for explaining still another example of the holding unit 19.

図５（ａ）は枠体１１の平面図であり、図５（ｂ）は図５（ａ）のＣＣ´断面図である。図５に示す例では、保持部１９´´´´は、凹部として、図１（ｂ）と同様に、断面が略矩形状の２本の溝部２０を含んでいる。しかしながら、保持部１９´´´´は、図５（ａ）に示す様に、更に凹部として、溝部２０と交差するように形成された溝部３４を含んでいる。図５（ａ）に示す様に、枠体１１を上部から観察すれば、溝部３４と突起部３５が交互に複数形成されることとなる。なお、突起部３５には、図５（ｂ）に示す様に、断面が略矩形状の２本の溝部２０が形成されていることとなる。このような構造とすることで、保持部と蛍光体樹脂層との密着強度、及び、蛍光体樹脂層で発生する熱の放熱性は、さらに高いものとなる。   FIG. 5A is a plan view of the frame 11, and FIG. 5B is a CC ′ cross-sectional view of FIG. 5A. In the example shown in FIG. 5, the holding portion 19 ″ ″ ″ includes two groove portions 20 having a substantially rectangular cross section, as in FIG. However, as shown in FIG. 5A, the holding portion 19 ″ ″ ″ further includes a groove portion 34 formed so as to intersect with the groove portion 20 as a concave portion. As shown in FIG. 5A, when the frame 11 is observed from above, a plurality of grooves 34 and protrusions 35 are alternately formed. As shown in FIG. 5B, the protrusion 35 is formed with two grooves 20 having a substantially rectangular cross section. By setting it as such a structure, the adhesive strength of a holding | maintenance part and a fluorescent substance resin layer, and the heat dissipation of the heat | fever which generate | occur | produces in a fluorescent substance resin layer become still higher.

図６は、本発明に係る他のＬＥＤ発光装置２の断面図である。   FIG. 6 is a cross-sectional view of another LED light emitting device 2 according to the present invention.

図６に示すＬＥＤ発光装置２と、図１に示すＬＥＤ発光装置１との差異は、ＬＥＤ発光装置２の蛍光体樹脂層１３´が、ＬＥＤ発光装置１の蛍光体樹脂層１３と異なっている点のみであり、他の構成は全て同様であるので、その他の説明を省略する。   The LED light emitting device 2 shown in FIG. 6 is different from the LED light emitting device 1 shown in FIG. 1 in that the phosphor resin layer 13 ′ of the LED light emitting device 2 is different from the phosphor resin layer 13 of the LED light emitting device 1. Since only the points are the same and all other configurations are the same, the other description is omitted.

ＬＥＤ発光装置２では、保持部１９の凹部である溝部２０へ、未硬化の樹脂がより浸透、密着できるように、保持部１９との接合部と、他の部分で、異なった２種類の樹脂を用いている。したがって、ＬＥＤ発光装置２の蛍光体樹脂層１３´は、２種類の蛍光体樹脂により形成されている。蛍光体樹脂層１３´が、２種類の蛍光体樹脂から形成される点については、後述する。   In the LED light emitting device 2, two different types of resins are used in the joint portion with the holding portion 19 and other portions so that the uncured resin can penetrate and adhere more closely to the groove portion 20 that is the concave portion of the holding portion 19. Is used. Therefore, the phosphor resin layer 13 ′ of the LED light emitting device 2 is formed of two types of phosphor resins. The point that the phosphor resin layer 13 ′ is formed from two types of phosphor resins will be described later.

なお、本発明に係るＬＥＤ発光装置２でも、枠体１１と蛍光体樹脂層１３´が、保持部１９を介して一体的に形成されているため、蛍光体樹脂層１３´と枠体１１とが強固に接合されている。したがって、蛍光体樹脂層１３´は枠体１１から容易に離脱することがなく、また、蛍光体樹脂層１３´で発生する熱は、枠体１１を通して十分に放熱することが可能となる。また、ＬＥＤ発光装置２においても、図４及び図５に示した、他の保持部を用いることが可能である。   In the LED light emitting device 2 according to the present invention, since the frame body 11 and the phosphor resin layer 13 ′ are integrally formed via the holding portion 19, the phosphor resin layer 13 ′, the frame body 11, and the like. Are firmly joined. Therefore, the phosphor resin layer 13 ′ is not easily detached from the frame body 11, and the heat generated in the phosphor resin layer 13 ′ can be sufficiently dissipated through the frame body 11. Moreover, also in the LED light-emitting device 2, it is possible to use the other holding | maintenance part shown in FIG.4 and FIG.5.

図７は、ＬＥＤ発光装置２の製造方法を説明するための図である。   FIG. 7 is a diagram for explaining a method of manufacturing the LED light emitting device 2.

まず、樹脂により、略円筒形であって、上端内周面に保持部１９を有する、枠体１１を用意する。保持部１９には、凹部として、断面が略矩形の溝部２０を形成する。   First, a frame body 11 having a substantially cylindrical shape and having a holding portion 19 on the inner peripheral surface of the upper end is prepared from resin. In the holding part 19, a groove part 20 having a substantially rectangular cross section is formed as a concave part.

次に、図７（ａ）に示すように、枠体１１の上端が下向きとなるように、専用の治具２１に、枠体１１を設置する。   Next, as shown in FIG. 7A, the frame body 11 is installed on a dedicated jig 21 so that the upper end of the frame body 11 faces downward.

次に、図７（ｂ）に示すように、第１のディスペンサ２８によって、粘度が３５０ｍＰａ・ｓの未硬化の第１の蛍光体樹脂２５を、第１の蛍光体樹脂２５の高さが、完全に保持部１９を満たすまで、枠体１１及び治具２１に囲まれた領域に滴下する。   Next, as shown in FIG. 7B, the first dispenser 28 causes the uncured first phosphor resin 25 having a viscosity of 350 mPa · s to be changed to a height of the first phosphor resin 25. It is dripped in the area | region enclosed by the frame 11 and the jig | tool 21 until the holding | maintenance part 19 is satisfy | filled completely.

次に、図７（ｃ）に示すように、第１の蛍光体樹脂２５を硬化させずに、保持部１９の溝部２０に十分に第１の蛍光体樹脂２５が付着した枠体１１を、治具２１から取り出す。   Next, as shown in FIG. 7 (c), the frame 11 in which the first phosphor resin 25 is sufficiently adhered to the groove portion 20 of the holding portion 19 without curing the first phosphor resin 25 is obtained. Remove from the jig 21.

次に、図７（ｄ）に示すように、他の治具２９に、第１の蛍光体樹脂２５が付着した枠体１１を再び設置し、第２のディスペンサ３０によって、粘度が１００００ｍＰａ・ｓの第２の蛍光体樹脂２６を、第２の蛍光体樹脂２６の高さが、完全に保持部１９を満たすまで、枠体１１及び治具２９に囲まれた領域に滴下する。   Next, as shown in FIG. 7 (d), the frame body 11 with the first phosphor resin 25 attached thereto is placed again on another jig 29, and the viscosity is 10000 mPa · s by the second dispenser 30. The second phosphor resin 26 is dropped onto a region surrounded by the frame 11 and the jig 29 until the height of the second phosphor resin 26 completely fills the holding portion 19.

次に、図７（ｅ）に示すように、第１の蛍光体樹脂２５及び第２の蛍光体樹脂２６を併せて硬化させ、蛍光体樹脂層１３´を形成し、治具２９から枠体１１を取り出す。   Next, as shown in FIG. 7 (e), the first phosphor resin 25 and the second phosphor resin 26 are cured together to form the phosphor resin layer 13 ', and the frame body from the jig 29 is formed. 11 is taken out.

最後に、図７（ｆ）に示すように、蛍光体樹脂層１３´を備える枠体１１を、ＬＥＤ素子１２を備える基板１０に、接着剤等で取り付けて、ＬＥＤ発光装置２を完成させる。   Finally, as shown in FIG. 7 (f), the frame body 11 including the phosphor resin layer 13 ′ is attached to the substrate 10 including the LED elements 12 with an adhesive or the like to complete the LED light emitting device 2.

ＬＥＤ発光装置２では、最初に、粘度がより低い第１の蛍光体樹脂２５を滴下することにより、保持部１９の溝部２０には、第１の蛍光体樹脂２５がよく浸透し、密着する。その後に、粘度が第１の蛍光体樹脂２５より高い第２の蛍光体樹脂２６を滴下するので、第２の蛍光体樹脂２６は容易に第１の蛍光体樹脂２５と混じり合う。したがって、保持部１９に詳細な凹部又は凸部が形成されていても、保持部１９と、第１の蛍光体樹脂２５及び第２の蛍光体樹脂２６から構成される蛍光体樹脂層１３´とが強固に接合されることが可能となった。   In the LED light emitting device 2, first, the first phosphor resin 25 having a lower viscosity is dropped, so that the first phosphor resin 25 penetrates well into the groove portion 20 of the holding portion 19 and comes into close contact therewith. Thereafter, since the second phosphor resin 26 having a higher viscosity than the first phosphor resin 25 is dropped, the second phosphor resin 26 is easily mixed with the first phosphor resin 25. Therefore, even if the concave portion or the convex portion is formed in the holding portion 19, the holding portion 19 and the phosphor resin layer 13 ′ composed of the first phosphor resin 25 and the second phosphor resin 26 Can be firmly bonded.

ＬＥＤ発光装置においてムラのない均一な白色光を得るためには、蛍光体樹脂層内には、所定量の蛍光体を、できる限り均一に分散させて含有させることが望ましい。しかしながら、そのような蛍光体樹脂層を形成する未硬化の蛍光体樹脂の粘度を低く抑えることが困難な場合がある。一方で、保持部１９と接合される部分の樹脂には、必ずしも蛍光体の所条件を満足する必要はない。そこで、上記の製造方法では、強固に接合すべき部分には粘度の低い第１の蛍光体樹脂を用いて、保持部の凹部又は凸部に、よく浸透し、密着するようにした。一方、蛍光体樹脂層の大部分に相当する箇所には、所定の粘度の高い第２の蛍光体樹脂を用いて、ムラのない均一な白色光を得られるようにした。   In order to obtain uniform white light with no unevenness in the LED light emitting device, it is desirable that a predetermined amount of phosphor is dispersed and contained as uniformly as possible in the phosphor resin layer. However, it may be difficult to keep the viscosity of the uncured phosphor resin that forms such a phosphor resin layer low. On the other hand, the portion of the resin joined to the holding portion 19 does not necessarily satisfy the desired condition of the phosphor. Therefore, in the manufacturing method described above, the first phosphor resin having a low viscosity is used for the portions to be firmly bonded, so that the portions penetrate the concave portions or the convex portions of the holding portion and are in close contact with each other. On the other hand, in a portion corresponding to most of the phosphor resin layer, a second phosphor resin having a predetermined viscosity is used to obtain uniform white light without unevenness.

なお、第１の蛍光体樹脂２５としては、粘度が１００ｍＰａ・ｓ以上、３５０ｍＰａ・ｓ以下の蛍光体樹脂を用いることが好ましい。また、滴下の際、第１の蛍光体樹脂２５が保持部１９によく浸透、密着するように、必要に応じて第１の蛍光体樹脂２５を加温してもよい。   The first phosphor resin 25 is preferably a phosphor resin having a viscosity of 100 mPa · s to 350 mPa · s. Further, when dripping, the first phosphor resin 25 may be heated as necessary so that the first phosphor resin 25 permeates and adheres well to the holding portion 19.

また、第２の蛍光体樹脂２６としては、粘度が４０００ｍＰａ・ｓ以上、７００００ｍＰａ・ｓ以下の蛍光体樹脂を用いることが好ましい。   Further, as the second phosphor resin 26, it is preferable to use a phosphor resin having a viscosity of 4000 mPa · s or more and 70000 mPa · s or less.

なお、第１の蛍光体樹脂２５及び第２の蛍光体樹脂２６は、硬化後に１枚の蛍光体樹脂層１３´として成形されることから、第１の蛍光体樹脂２５と第２の蛍光体樹脂２６には、成分が同一であるバインダ樹脂を用いることが好ましい。   Since the first phosphor resin 25 and the second phosphor resin 26 are molded as one phosphor resin layer 13 ′ after curing, the first phosphor resin 25 and the second phosphor resin are formed. As the resin 26, it is preferable to use a binder resin having the same components.

蛍光体を均一に分散させるためには、粘度の高い樹脂を用いるべきであるが、一方で、高粘度樹脂は、細かな凹凸部への浸透、密着がよくないという問題がある。そこで、本発明に係るＬＥＤ発光装置２の製造方法では、第１の蛍光体樹脂２５に粘度の低い蛍光体樹脂を用いて、蛍光体樹脂層１３´が枠体１１から外れ難くなる効果、及び、蛍光体樹脂層１３´で発生する熱の枠体１１を通じた放熱効果、を改善しつつ、さらに、第２の蛍光体樹脂２６に粘度の高い蛍光体樹脂を用いることで、蛍光体樹脂層１３´内に分散させる蛍光体の均一性がより高いものとなり、よりムラのない光の形成が可能となる。   In order to uniformly disperse the phosphor, a resin having a high viscosity should be used. On the other hand, the high viscosity resin has a problem that the fine concavo-convex portions do not penetrate and adhere well. Therefore, in the method for manufacturing the LED light emitting device 2 according to the present invention, the phosphor resin layer 13 ′ is less likely to be detached from the frame body 11 using a phosphor resin having a low viscosity for the first phosphor resin 25, and In addition, while improving the heat dissipation effect of the heat generated in the phosphor resin layer 13 ′ through the frame 11, the phosphor resin layer can be obtained by using a phosphor resin having a high viscosity for the second phosphor resin 26. The uniformity of the phosphor dispersed in 13 'becomes higher, and the formation of light without unevenness becomes possible.

図８は、本発明に係る更に他のＬＥＤ発光装置３の断面図である。   FIG. 8 is a sectional view of still another LED light emitting device 3 according to the present invention.

図８に示すＬＥＤ発光装置３と、図１に示すＬＥＤ発光装置１との差異は、ＬＥＤ発光装置３では、ＬＥＤ素子１２が、基板１０に所謂フリップチップ実装されている点のみであり、他の構成は全て同様であるので、その他の説明を省略する。   The LED light-emitting device 3 shown in FIG. 8 and the LED light-emitting device 1 shown in FIG. 1 differ only in that the LED element 12 is so-called flip-chip mounted on the substrate 10 in the LED light-emitting device 3. Since all the configurations of are the same, other description is omitted.

なお、本発明に係るＬＥＤ発光装置３でも、枠体１１と蛍光体樹脂層１３が、保持部１９を介して一体的に形成されているため、蛍光体樹脂層１３と枠体１１とが強固に接合されている。したがって、蛍光体樹脂層１３は枠体１１から容易に離脱することがなく、また、蛍光体樹脂層１３で発生する熱は、枠体１１を通して十分に放熱することが可能となる。   In the LED light-emitting device 3 according to the present invention, since the frame body 11 and the phosphor resin layer 13 are integrally formed via the holding portion 19, the phosphor resin layer 13 and the frame body 11 are strong. Are joined. Therefore, the phosphor resin layer 13 is not easily detached from the frame body 11, and the heat generated in the phosphor resin layer 13 can be sufficiently dissipated through the frame body 11.

ＬＥＤ発光装置３は、図２に示した製造方法及び図７に示した製造方法の何れでも製造することが可能である。なお、図７に示した製造方法によって製造される場合には、ＬＥＤ発光装置３の蛍光体樹脂層１３は、２種類の蛍光体樹脂から成形されることとなる。また、ＬＥＤ発光装置３の保持部１９においても、図４及び図５に示した、他の保持部を用いることが可能である。   The LED light emitting device 3 can be manufactured by either the manufacturing method shown in FIG. 2 or the manufacturing method shown in FIG. In addition, when manufacturing with the manufacturing method shown in FIG. 7, the phosphor resin layer 13 of the LED light-emitting device 3 will be shape | molded from two types of phosphor resin. Further, in the holding unit 19 of the LED light emitting device 3, other holding units shown in FIGS. 4 and 5 can be used.

１、２、３ ＬＥＤ発光装置
１０ 基板
１１ 枠体
１２ ＬＥＤ素子
１３ 蛍光体樹脂層
１３´ 蛍光体樹脂層
１４ 電極
１５ ダイボンド材
１６ バンプ
１７ 電極
１８ 光反射層
１９ 保持部
１９´ 保持部
１９´´ 保持部
１９´´´ 保持部
１９´´´´ 保持部
２０ 溝部
２１ 治具
２２ ディスペンサ
２３ 盛り上がり部分
２４ 蛍光体樹脂
２５ 第１の蛍光体樹脂
２６ 第２の蛍光体樹脂
２７ 透光性の樹脂
２８ 第１のディスペンサ
２９ 治具
３０ 第２のディスペンサ
３１ 溝部
３２ 溝部
３３ 突起
３４ 溝部 1, 2, 3 LED light emitting device 10 substrate 11 frame 12 LED element 13 phosphor resin layer 13 ′ phosphor resin layer 14 electrode 15 die bond material 16 bump 17 electrode 18 light reflecting layer 19 holding unit 19 ′ holding unit 19 ″ Holding part 19 ″ ″ Holding part 19 ″ ″ Holding part 20 Groove part 21 Jig 22 Dispenser 23 Swelling part 24 Phosphor resin 25 First phosphor resin 26 Second phosphor resin 27 Translucent resin 28 First dispenser 29 Jig 30 Second dispenser 31 Groove part 32 Groove part 33 Projection 34 Groove part

Claims (8)

基板と、
前記基板の上面に配置されたＬＥＤ素子と、
前記基板の上面に前記ＬＥＤ素子を取り囲むように配置された枠体と、
前記枠体の内周面に設けられた保持部と、
前記保持部と接合された蛍光体樹脂層と、を有し、
前記保持部は、対向する２つの面を有する凹部又は凸部を含み、
前記凹部は複数の壁部分および前記壁部分に挟まれたへこみ部分により構成され、前記凸部は複数の基盤部分および前記基盤部分に挟まれた突出部分により構成され、一の前記壁部分の頂面又は前記基盤部分の上面から前記蛍光体樹脂層を挟んで対向する前記壁部分の頂面又は前記基盤部分の上面までの距離が、他の前記壁部分の頂面又は前記基盤部分の上面から前記蛍光体樹脂層を挟んで対向する前記壁部分の頂面又は前記基盤部分の上面までの距離と等しく、
前記枠体と前記蛍光体樹脂層とが、前記保持部を介して、一体的に形成されている、
ことを特徴とするＬＥＤ発光装置。 A substrate,
LED elements arranged on the upper surface of the substrate;
A frame disposed on the upper surface of the substrate so as to surround the LED element;
A holding portion provided on an inner peripheral surface of the frame,
A phosphor resin layer bonded to the holding part,
The holding portion includes a concave portion or a convex portion having two opposing surfaces,
The concave portion includes a plurality of wall portions and a recessed portion sandwiched between the wall portions, and the convex portion includes a plurality of base portions and a protruding portion sandwiched between the base portions. The distance from the top surface of the wall portion or the top surface of the base portion to the top surface of the wall portion or the top surface of the base portion facing each other across the phosphor resin layer is from the top surface of the other wall portion or the top surface of the base portion. Equal to the distance to the top surface of the wall portion or the top surface of the base portion facing each other across the phosphor resin layer,
The frame and the phosphor resin layer are integrally formed via the holding portion,
An LED light emitting device characterized by that. 基板と、
前記基板の上面に配置されたＬＥＤ素子と、
前記基板の上面に前記ＬＥＤ素子を取り囲むように配置された枠体と、
前記枠体の内周面に設けられた保持部と、
前記ＬＥＤ素子との間に空隙を備えるように前記保持部と接合された蛍光体樹脂層と、を有し、
前記保持部は、凹部又は凸部を含み、
前記枠体と前記蛍光体樹脂層とが、前記保持部を介して、一体的に形成されている、
ことを特徴とするＬＥＤ発光装置。 A substrate,
LED elements arranged on the upper surface of the substrate;
A frame disposed on the upper surface of the substrate so as to surround the LED element;
A holding portion provided on an inner peripheral surface of the frame,
A phosphor resin layer bonded to the holding portion so as to have a gap between the LED element, and
The holding part includes a concave part or a convex part,
The frame body and the phosphor resin layer are integrally formed via the holding portion.
An LED light emitting device characterized by that. 前記凹部又は凸部は、前記基板と略平行となる様に形成されていることを特徴とする請求項１または２に記載のＬＥＤ発光装置。   The LED light-emitting device according to claim 1, wherein the concave portion or the convex portion is formed so as to be substantially parallel to the substrate. 前記保持部は、更に、前記基板と略平行となる様に形成された凹部又は凸部と交差するように形成された凹部又は凸部を含む、請求項３に記載のＬＥＤ発光装置。   The LED light-emitting device according to claim 3, wherein the holding portion further includes a concave portion or a convex portion formed so as to intersect with a concave portion or a convex portion formed so as to be substantially parallel to the substrate. 基板、前記基板の上面に配置されたＬＥＤ素子、及び、枠体を有するＬＥＤ発光装置の製造方法であって、
前記枠体の内周面に保持部を形成し、
前記保持部の内側に未硬化の第１の蛍光体樹脂を滴下し、
前記未硬化の第１の蛍光体樹脂を硬化させて、前記保持部と接合された蛍光体樹脂層を形成し、
前記蛍光体樹脂層が形成された前記枠体を前記基板上に前記ＬＥＤ素子を取り囲むように配置する、工程を有し、
前記保持部は、凹部又は凸部を含み、
前記枠体と前記蛍光体樹脂層とが、前記保持部を介して、一体的に形成されている、
ことを特徴とするＬＥＤ発光装置の製造方法。 A substrate, an LED element disposed on the upper surface of the substrate, and a method for manufacturing an LED light emitting device having a frame,
Forming a holding portion on the inner peripheral surface of the frame,
An uncured first phosphor resin is dropped inside the holding part,
Curing the uncured first phosphor resin to form a phosphor resin layer bonded to the holding portion;
Arranging the frame on which the phosphor resin layer is formed so as to surround the LED element on the substrate;
The holding part includes a concave part or a convex part,
The frame and the phosphor resin layer are integrally formed via the holding portion,
A method for manufacturing an LED light-emitting device. 前記凹部又は凸部は、前記基板と略平行となる様に形成されていることを特徴とする請求項５に記載のＬＥＤ発光装置の製造方法。   6. The method for manufacturing an LED light-emitting device according to claim 5, wherein the concave portion or the convex portion is formed so as to be substantially parallel to the substrate. 前記保持部は、更に、前記基板と略平行となる様に形成された凹部又は凸部と交差するように形成された凹部又は凸部を含む、請求項６に記載のＬＥＤ発光装置の製造方法。   The manufacturing method of the LED light-emitting device according to claim 6, wherein the holding part further includes a concave part or a convex part formed so as to intersect with a concave part or a convex part formed so as to be substantially parallel to the substrate. . 前記未硬化の第１の蛍光体樹脂を滴下後に、更に、前記未硬化の第１の蛍光体樹脂よりも粘度が高い未硬化の第２の蛍光体樹脂を滴下し、
前記未硬化の第１の蛍光体樹脂及び前記未硬化の第２の蛍光体樹脂を硬化させて、前記保持部と接合された前記蛍光体樹脂層を形成する、請求項５〜７のいずれか一項に記載のＬＥＤ発光装置の製造方法。 After dropping the uncured first phosphor resin, further dropping an uncured second phosphor resin having a higher viscosity than the uncured first phosphor resin,
The uncured first phosphor resin and the uncured second phosphor resin are cured to form the phosphor resin layer bonded to the holding portion. The manufacturing method of the LED light-emitting device of one term | claim.
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