JP6398887B2 - Method for manufacturing light emitting device - Google Patents

Method for manufacturing light emitting device Download PDF

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JP6398887B2
JP6398887B2 JP2015123047A JP2015123047A JP6398887B2 JP 6398887 B2 JP6398887 B2 JP 6398887B2 JP 2015123047 A JP2015123047 A JP 2015123047A JP 2015123047 A JP2015123047 A JP 2015123047A JP 6398887 B2 JP6398887 B2 JP 6398887B2
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light emitting
light
substrate
emitting device
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JP2017011030A (en
Inventor
誠治 山口
誠治 山口
伊藤 浩史
浩史 伊藤
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豊田合成株式会社
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Description

  The present invention relates to a method for manufacturing a light emitting device.

  As a conventional light-emitting device, a light-emitting device in which a plurality of light-emitting elements arranged in a linear or matrix shape is covered with a member containing a phosphor is known (for example, see Patent Documents 1 to 4).

  A light-emitting device disclosed in Patent Document 1 includes a plurality of light-emitting elements arranged linearly on a substrate, a kamaboko-type transparent sealing member that seals the plurality of light-emitting elements in common, and a transparent And a light conversion member including a phosphor that directly covers the surface of the light member.

  A light-emitting device disclosed in Patent Document 2 includes a plurality of light-emitting elements arranged in a matrix on a substrate, and a plurality of dome-shaped phosphor layers that seal each of the plurality of light-emitting elements. .

  A light-emitting device disclosed in Patent Document 3 includes a plurality of light-emitting elements arranged linearly on a substrate, and a hollow bowl-shaped light-transmitting property that is closed at both ends and covers the plurality of light-emitting elements in common. And a light conversion member including a phosphor that directly covers the surface of the light transmissive member.

  A light emitting device disclosed in Patent Document 4 includes a plurality of light emitting elements arranged in a matrix on a substrate, a plate-like holding member installed above the plurality of light emitting elements, and a surface of the holding member. And a coated phosphor portion.

JP 2012-199497 A JP 2012-235157 A JP 2012-204349 A JP 2013-93459 A

  In a light emitting device having a structure in which a light emitting element is sealed with a sealing member or a phosphor layer as shown in Patent Documents 1 and 2, the contact area of the sealing member or the phosphor layer with the substrate is relatively large. The resin constituting them may shrink during curing, which may cause the substrate to warp.

  On the other hand, in the light emitting device having a structure in which the light emitting element is not directly sealed as shown in Patent Documents 3 and 4, there is little risk of warping of the substrate as described above, but the manufacturing process is complicated because of the structure. is there.

  Thus, one of the objects of the present invention is a method for manufacturing a light emitting device including a step of sealing a light emitting element with a sealing material, and provides a method for manufacturing a light emitting device that can easily suppress warping of a substrate. There is to do.

In order to achieve the above object, one embodiment of the present invention provides a method for manufacturing a light-emitting device according to any one of [1] to [ 4 ] below.

[1] A method for manufacturing a light-emitting device having a light-emitting element sealed on a substrate with a sealing material, the step of mounting the light-emitting element on a substrate, and a plurality of first parts that are a part of the sealing material A step of forming and curing one portion apart from each other, and filling a space between the plurality of first portions with a resin in a state in which warping is corrected by applying an external force to the substrate; seen containing a step of forming a a part one or more second portions of the sealing material, and shrinkage due to the curing of the first portion is greater than the shrinkage due to curing of the second portion , Manufacturing method of light emitting device.

[2] The method for manufacturing a light-emitting device according to [1], wherein each of the plurality of first parts and each of the second parts seals the light-emitting element.

[3] The method for manufacturing a light-emitting device according to [1] or [2], wherein a refractive index of the first portion is different from a refractive index of the second portion.

[ 4 ] The method for manufacturing a light emitting device according to any one of [1] to [ 3 ], wherein the plurality of first portions are molded.

  ADVANTAGE OF THE INVENTION According to this invention, it is a manufacturing method of the light-emitting device including the process of sealing a light emitting element with a sealing material, Comprising: The manufacturing method of the light-emitting device which can suppress the curvature of a board | substrate simply can be provided.

FIG. 1A is a perspective view of a light emitting device according to an embodiment. FIG. 1B is a perspective view showing a modification of the light emitting device according to the embodiment. 2A to 2F are vertical sectional views showing an example of a manufacturing process of the light emitting device according to the embodiment. 3A and 3B show a process in the case where a light emitting device in which light emitting elements are arranged in a matrix is formed and then divided into a plurality of light emitting devices in which the light emitting elements are arranged in a line by dicing. It is a top view showing an example roughly.

Embodiment
(Configuration of light emitting device)
Fig.1 (a) is a perspective view of the light-emitting device 1 which concerns on embodiment.

  The light emitting device 1 includes a substrate 10, a plurality of light emitting elements 11 arranged linearly on the substrate 10, and a sealing material 12 that seals the plurality of light emitting elements 11.

The substrate 10 is, for example, a ceramic substrate such as an Al 2 O 3 substrate or an AlN substrate, a metal substrate such as an Al substrate or a Cu substrate whose surface is covered with an insulating film, or a glass epoxy substrate. In addition, the substrate 10 has wiring (not shown) serving as a power supply path to the light emitting element 11.

  The light emitting element 11 is, for example, a light emitting element such as an LED or a laser diode having a chip substrate and a crystal layer including a light emitting layer and a cladding layer sandwiching the light emitting layer. The light-emitting element 11 may be a face-up element with the crystal layer facing upward, or a face-down element with the crystal layer facing downward.

  The light emitting element 11 is connected to a wiring included in the substrate 10, and power is supplied to the light emitting element 11 through the wiring. The plurality of light emitting elements 11 may all have the same emission wavelength or may have different emission wavelengths.

  The sealing material 12 includes a plurality of first portions 12a and a plurality of second portions 12b. The first portions 12a and the second portions 12b are alternately arranged. The 1st part 12a and the 2nd part 12b consist of transparent resins, such as silicone resin and an epoxy resin, for example.

  When performing local dimming in the light emitting device 1, it is preferable that the refractive indexes of the first portion 12a and the second portion 12b are different. In this case, since light is easily totally reflected at the interface between the first portion 12a and the second portion 12b, the light emitted from the light emitting element 11 sealed in the first portion 12a and the second portion 12b. The light emitted from the light-emitting element 11 sealed in is difficult to mix.

  For example, when methylsilicone resin is used as one of the materials for the first part 12a and the second part 12b and phenylsilicone is used for the other, 0.2 is provided between the first part 12a and the second part 12b. A degree of refractive index difference can be generated. Further, when a resin material such as a silicone resin is used on one side and glass is used on the other side, a larger refractive index difference can be generated. However, in this embodiment, as described later, since the first portion 12a is formed before the second portion 12b, when glass is used for one material, the first portion 12a It is necessary to use glass as the material. This is because the melting point of glass is high, and thus, when glass is used as the material of the second portion 12b, the first portion 12a formed first is melted. Further, in this case, it is necessary to use ceramics having excellent heat resistance as the material of the substrate 10.

  The sealing material 12 may include phosphor particles. The fluorescent color of the phosphor particles is not particularly limited. For example, as the yellow phosphor particles, BOS (barium orthosilicate) phosphor particles or YAG (yttrium aluminum garnet) phosphor particles are used. It is done. For example, when the emission color of the light emitting element 11 is blue and the fluorescent color of the phosphor particles is yellow, the emission color of the light emitting device 1 is white.

  In addition, it is free what kind of fluorescent substance particle each the 1st part 12a and the 2nd part 12b contains. For example, the first portion 12a and the second portion 12b may include the same type of phosphor particles, or may include different phosphor particles. Moreover, the 1st part 12a and the 2nd part 12b may contain the fluorescent substance particle of a different density | concentration, and only one may contain the fluorescent substance particle.

  In the example shown in FIG. 1A, the shapes of the first portion 12a and the second portion 12b are rectangular parallelepipeds, but are not limited thereto, and the side surfaces of the first portion 12a and the second portion 12b are not limited thereto. It suffices if they are in surface contact with each other.

  FIG. 1B is a perspective view showing a modification of the light emitting device 1. In this modification, the upper surfaces of the first portion 12a and the second portion 12b are curved, and the optical path difference of the light emitted from the light emitting element 11 in each of them can be reduced.

(Method for manufacturing light emitting device)
Below, an example of the manufacturing method of the light-emitting device 1 is demonstrated concretely.

  2A to 2F are vertical sectional views showing an example of a manufacturing process of the light emitting device 1 according to the embodiment.

  First, as shown in FIG. 2A, a plurality of light emitting elements 11 are mounted on a substrate 10.

  Next, as shown in FIG. 2B, a mold 20 for forming the first portion 12 a is fixed on the substrate 10. Thereafter, resin is injected into the space between the substrate 10 and the mold 20 through the resin injection path 21 to mold the first portion 12a. Thereby, the plurality of first portions 12a are molded in a state of being separated from each other.

  Next, the first portion 12a is cured by heating. As shown in FIGS. 2C and 2D, the first portion 12a contracts as the curing proceeds. Then, the substrate 10 is warped due to the contraction of the first portion 12a. The arrow in FIG. 2D schematically shows the direction of warping of the substrate 10.

  Next, as shown in FIG. 2E, an external force is applied to the substrate 10 to correct the warpage of the substrate 10. The arrow in FIG. 2E schematically shows the direction of the external force applied to the substrate 10. Examples of a method of applying an external force to the substrate 10 include a method of pressing the upper surface of the substrate from above and a method of sucking the lower surface of the substrate from below using a substrate suction fixing device. Note that an external force may be applied to the substrate 10 before the first portion 12a is cured.

  Next, as shown in FIG. 2F, in a state where the warpage of the substrate 10 is corrected, the space between the plurality of first portions 12a is filled with resin to form the second portion 12b. .

  At this time, since the second portion 12b is also filled in the space on the side of the first portion 12a generated by the contraction of the first portion 12a, the external force for correcting the warp of the substrate 10 is not affected. This prevents the warpage of the substrate 10 from being restored after the application is stopped.

  For this reason, the first portion 12a may not be completely cured at the time of forming the second portion 12b, but it is preferable that the first portion 12a is cured until the contraction is almost finished. Further, in order to more effectively prevent the warpage of the substrate 10 from being restored, it is preferable to stop applying the external force after the second portion 12 is almost completely cured.

  Further, in the present embodiment, in order to correct the warpage of the substrate 10 due to the contraction of the first portion 12a, when the materials of the first portion 12a and the second portion 12b are different, the first portion 12a By using a material having a large shrinkage rate during curing and using a material having a small shrinkage rate during curing for the second portion 12b, the warpage of the substrate 10 can be more effectively suppressed.

  The second portion 12b may be formed using a mold like the first portion 12a, or may be formed by application by screen printing or dripping. When the second portion 12b is formed by coating or dropping, it is preferable to use an outer frame for forming a side surface that does not contact the first portion 12a.

  3A and 3B, after forming the light-emitting device 2 in which the light-emitting elements 11 are arranged in a matrix, the light-emitting elements 11 are divided into a plurality of light-emitting devices 1 in which the light-emitting elements 11 are arranged in a line by dicing. It is a top view showing an example of a process in a case roughly.

  The light emitting device 2 shown in FIG. 3A is formed through the steps shown in FIGS. 2A to 2F. In the light emitting device 2, the light emitting elements 11 are arranged in a matrix, and the first portion 12 a and the second portion 12 b extend in a direction orthogonal to the dicing direction, and each of the plurality of light emitting elements 11 is sealed in common. It has stopped.

(Effect of embodiment)
According to the above embodiment, the warpage of the substrate 10 due to the contraction of the first portion 12a can be reduced by forming the second portion 12b after the first portion 12a is cured. For this reason, the warpage of the substrate 10 caused by the formation of the sealing material 12 according to the embodiment is much smaller than the warpage of the substrate caused by the formation of one sealing material having the same size as the sealing material 12. That is, the warpage of the substrate caused by the formation of the sealing material can be made smaller than before.

  Further, the sealing material 12 can contain phosphor particles and can be used as a phosphor layer, but can be easily formed as compared with a phosphor layer provided apart from the light emitting element.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

  For example, the light emitting device 1 shown in FIG. 1 has a structure in which each of the plurality of first portions 12a and each of the plurality of second portions 12b seals one light emitting element. The structure of 1 is not limited to such a structure. For example, one part may be a structure that seals a plurality of light emitting elements in common, or a structure that includes a part that does not seal the light emitting elements. May be. For this reason, the number of portions of the sealing material, the number and arrangement of the light emitting elements are not particularly limited. Of the configurations of the sealing material 12 required to reduce the warpage of the substrate caused by the formation of the sealing material, the simplest one is the two first portions 12a and one sandwiched between them. It is the structure which consists of the 2nd part 12b.

  Moreover, in the said embodiment, although the sealing material 12 is comprised from 2 types of parts (1st part 12a and 2nd part 12b), you may be comprised from 3 or more types of parts.

  Moreover, said embodiment does not limit the invention which concerns on a claim. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

DESCRIPTION OF SYMBOLS 1, 2 Light-emitting device 10 Board | substrate 11 Light-emitting element 12 Sealing material 12a 1st part 12b 2nd part 20 Mold

Claims (4)

  1. A method of manufacturing a light emitting device having a light emitting element sealed on a substrate with a sealing material,
    Mounting a light emitting element on a substrate;
    Forming and curing a plurality of first portions that are part of the sealing material; and
    In a state where the warp is corrected by applying an external force to the substrate, a resin is filled in a space between the plurality of first portions, and one or more second portions which are a part of the sealing material are filled. Forming, and
    Only including,
    The shrinkage due to the curing of the first part is greater than the shrinkage due to the curing of the second part,
    Manufacturing method of light-emitting device.
  2. Each of the plurality of first portions and each of the second portions seals the light emitting element.
    The manufacturing method of the light-emitting device of Claim 1.
  3. The refractive index of the first part is different from the refractive index of the second part,
    The manufacturing method of the light-emitting device of Claim 1 or 2.
  4. Molding the plurality of first portions;
    The manufacturing method of the light-emitting device of any one of Claims 1-3 .
JP2015123047A 2015-06-18 2015-06-18 Method for manufacturing light emitting device Active JP6398887B2 (en)

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Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915509Y2 (en) * 1977-12-30 1984-05-08
JPS5724542A (en) * 1980-07-22 1982-02-09 Toshiba Corp Preparation of resin sealed type semiconductor device
JPH0340457A (en) * 1989-03-10 1991-02-21 Fujitsu Ltd Mounting structure of semiconductor device
JPH1187740A (en) * 1997-09-04 1999-03-30 Stanley Electric Co Ltd Formation method for surface mounted component
JP2007149991A (en) * 2005-11-28 2007-06-14 Kyocera Corp Manufacturing method for circuit module
JP2009088054A (en) * 2007-09-28 2009-04-23 Toyoda Gosei Co Ltd Linear light-emitting device and method of manufacturing the same
JP5052397B2 (en) * 2008-04-23 2012-10-17 三菱電機株式会社 Light emitting device and light emitting apparatus
US7892950B2 (en) * 2009-04-29 2011-02-22 Freescale Semiconductor, Inc. Methodology for processing a panel during semiconductor device fabrication
JP5375544B2 (en) * 2009-11-19 2013-12-25 日亜化学工業株式会社 Semiconductor light emitting device and manufacturing method thereof
JP5553722B2 (en) * 2010-10-15 2014-07-16 スタンレー電気株式会社 Light emitting device
JP2013041999A (en) * 2011-08-17 2013-02-28 Nec Corp Manufacturing method and device for module component, and module component assembly
JP2014086694A (en) * 2012-10-26 2014-05-12 Sharp Corp Light-emitting device and manufacturing method of light-emitting device
JP6156213B2 (en) * 2013-09-17 2017-07-05 豊田合成株式会社 Light emitting device and manufacturing method thereof
JP2015082550A (en) * 2013-10-22 2015-04-27 パナソニックIpマネジメント株式会社 Light-emitting module, lighting device, and lighting fixture

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