JP2003347601A - Light emitting diode illuminator - Google Patents

Light emitting diode illuminator

Info

Publication number
JP2003347601A
JP2003347601A JP2002154829A JP2002154829A JP2003347601A JP 2003347601 A JP2003347601 A JP 2003347601A JP 2002154829 A JP2002154829 A JP 2002154829A JP 2002154829 A JP2002154829 A JP 2002154829A JP 2003347601 A JP2003347601 A JP 2003347601A
Authority
JP
Japan
Prior art keywords
emitting diode
light
cover
light emitting
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002154829A
Other languages
Japanese (ja)
Inventor
Masao Yamaguchi
昌男 山口
Ryoji Yokoya
良二 横谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2002154829A priority Critical patent/JP2003347601A/en
Publication of JP2003347601A publication Critical patent/JP2003347601A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a long-life light emitting diode illuminator working with a little secular change of the light pickup efficiency and a little deterioration of its light emitting diode. <P>SOLUTION: A light emitting diode 1 is face-down-mounted on a circuit board 2 and has an emitting surface on one side, not parallel to the other side. A plate-like base 3 having a thicknesswise bored through-hole 31 is mounted on the circuit board 2 in the form of housing the diode 1 in the through-hole 31 closed at one side opening with the board 2. The other opening of the through-hole 31 is closed with a synthetic resin cover 5 containing phosphor mixed thereinto; the cover 5 being apart from the diode 1. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、発光ダイオードの
光を受けて発光ダイオードの光とは波長の異なる光を放
つ蛍光体を用いた発光ダイオード照明装置に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode illuminating device using a phosphor which receives light from a light emitting diode and emits light having a wavelength different from that of the light from the light emitting diode.

【0002】[0002]

【従来の技術】従来から、発光ダイオードの光を受けて
発光ダイオードの光とは波長の異なる光を放つ蛍光体を
用いた発光ダイオード照明装置として、例えば図16に
示すようなものが提供されている。この発光ダイオード
照明装置は、発光ダイオード1と、発光ダイオード1を
実装した回路基板2とを備える。さらに、板状であって
表裏に貫通する貫通孔31が設けられた基台3が、発光
ダイオード1が貫通孔31に収納され貫通孔31の一方
の開口が回路基板2によって閉塞される形で回路基板2
に取りつけられている。貫通孔31の内周面には発光ダ
イオード1の光を反射する反射鏡が設けられている。そ
して、貫通孔31の内側には、発光ダイオード1の光に
よって励起され発光ダイオード1の光とは波長の異なる
光を放つ蛍光体が含まれた合成樹脂からなる封止樹脂4
が充填されている。例えば発光ダイオード1として青色
の光を放つものを選び、蛍光体として黄色の光を放つも
のを選択すると、発光ダイオードから放射され封止樹脂
4を透過した青色の光と、蛍光体から放射された黄色の
光との混色によって白色光が得られる。
2. Description of the Related Art Conventionally, as shown in FIG. 16, for example, a light emitting diode illuminating device using a phosphor which receives light from a light emitting diode and emits light having a wavelength different from that of the light emitting diode has been provided. I have. The light emitting diode lighting device includes a light emitting diode 1 and a circuit board 2 on which the light emitting diode 1 is mounted. Further, the base 3 having a plate-like shape and provided with a through hole 31 penetrating from front to back is provided in a form in which the light emitting diode 1 is housed in the through hole 31 and one opening of the through hole 31 is closed by the circuit board 2. Circuit board 2
It is attached to. On the inner peripheral surface of the through hole 31, a reflecting mirror for reflecting the light of the light emitting diode 1 is provided. Inside the through hole 31, a sealing resin 4 made of a synthetic resin containing a phosphor excited by the light of the light emitting diode 1 and emitting light having a different wavelength from the light of the light emitting diode 1 is included.
Is filled. For example, when the light emitting diode 1 is selected to emit blue light and the phosphor is selected to emit yellow light, the blue light emitted from the light emitting diode and transmitted through the sealing resin 4 and the phosphor emitted. White light is obtained by mixing with yellow light.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記従来例に
おいては、発光ダイオード1が封止樹脂4に封止されて
いるため、発光ダイオード1から出る熱と光とによって
発光ダイオード1の近傍において封止樹脂4が劣化し、
劣化に伴う封止樹脂4の着色などによって光取り出し効
率が低下することにより寿命が短くなっていた。ここ
で、光取り出し効率とは、発光ダイオード1において発
生する光量と発光ダイオード照明装置の外部へ取り出さ
れる光量との比である。
However, in the above-mentioned conventional example, since the light emitting diode 1 is sealed by the sealing resin 4, the light and the light emitted from the light emitting diode 1 are sealed in the vicinity of the light emitting diode 1. The resin 4 deteriorates,
The life has been shortened due to a decrease in light extraction efficiency due to coloring of the sealing resin 4 due to deterioration or the like. Here, the light extraction efficiency is a ratio between the amount of light generated in the light emitting diode 1 and the amount of light extracted outside the light emitting diode lighting device.

【0004】本発明は上記事由に鑑みてなされたもので
あり、その目的は、光取り出し効率の経年的な低下が少
なく、かつ発光ダイオードの劣化も少ない、寿命の長い
発光ダイオード照明装置を提供することにある。
The present invention has been made in view of the above circumstances, and has as its object to provide a long-life light-emitting diode illuminating device in which the light extraction efficiency is less reduced over time and the light-emitting diode is less deteriorated. It is in.

【0005】[0005]

【課題を解決するための手段】請求項1の発明は、板状
であって厚み方向の一面に他面とは非平行である出射面
を有した発光ダイオードと、前記発光ダイオードがフェ
ースダウン実装された回路基板と、前記回路基板の厚み
方向の一面に載設され前記発光ダイオードを収納する収
納室が形成されるとともに前記発光ダイオードから放射
された光を取り出す開口窓が前記収納室の一部に形成さ
れた基台と、前記発光ダイオードから放射された光を異
なる波長に変換する蛍光体を有しかつ前記発光ダイオー
ドとは離間して前記開口窓を覆う形で前記基台に取り付
けた透光性のカバーとから成ることを特徴とする。
According to a first aspect of the present invention, there is provided a light emitting diode having a plate-like shape and having an emission surface which is not parallel to another surface on one surface in a thickness direction, and wherein the light emitting diode is mounted face down. A circuit board, and a storage chamber mounted on one surface of the circuit board in a thickness direction for storing the light emitting diode, and an opening window for extracting light emitted from the light emitting diode is part of the storage chamber. A light-emitting diode, and a phosphor that converts light emitted from the light emitting diode to a different wavelength, and is attached to the base so as to be separated from the light emitting diode and cover the opening window. And a light-emitting cover.

【0006】請求項2の発明は、請求項1記載の発明に
おいて、前記収納室は前記回路基板および前記カバーに
より密閉され前記発光ダイオードが放つ光を透過させる
液体が前記収納室に封入されていることを特徴とする。
According to a second aspect of the present invention, in the first aspect of the invention, the storage chamber is sealed by the circuit board and the cover, and a liquid that transmits light emitted by the light emitting diode is sealed in the storage chamber. It is characterized by the following.

【0007】請求項3の発明は、請求項1記載の発明に
おいて、前記収納室は前記回路基板および前記カバーに
より囲まれ前記収納室を気流が通過するように前記回路
基板と前記カバーとにはそれぞれ前記収納室と外部とを
連通させる放熱孔が設けられていることを特徴とする。
According to a third aspect of the present invention, in the first aspect, the storage chamber is surrounded by the circuit board and the cover, and the circuit board and the cover are connected to each other so that an airflow passes through the storage chamber. A heat radiating hole for communicating the storage chamber with the outside is provided.

【0008】請求項4の発明は、請求項1記載の発明に
おいて、前記カバーを前記開口窓に対して分離可能とす
る着脱手段を前記カバーと前記基台との少なくとも一方
に設けたことを特徴とする。
According to a fourth aspect of the present invention, in the first aspect of the present invention, at least one of the cover and the base is provided with attaching / detaching means for separating the cover from the opening window. And

【0009】請求項5の発明は、請求項4記載の発明に
おいて、前記基台は、前記回路基板に固定され前記収納
室が形成された遮光性の固定基台と、前記固定基台の表
面に平行な面内で回転可能となるように回路基板に支承
され収納室に設けた前記開口窓に一致する形状の複数個
のカバーを保持して前記着脱手段として機能する可動基
台とからなり、前記カバーのうちのいずれか1個を開口
窓の位置に一致させるように可動基台を回転させる回転
手段が付加されていることを特徴とする。
According to a fifth aspect of the present invention, in the invention of the fourth aspect, the base is fixed to the circuit board and has a light-shielding fixed base in which the storage chamber is formed, and a surface of the fixed base. A movable base functioning as the attaching / detaching means, holding a plurality of covers having a shape corresponding to the opening windows provided on the circuit board so as to be rotatable in a plane parallel to the opening. A rotation means for rotating the movable base so that any one of the covers coincides with the position of the opening window is added.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0011】(実施形態1)本実施形態における発光ダ
イオード照明装置は、図1に示すように、回路基板2に
フェースダウン実装された発光ダイオード1を備える。
回路基板2は、アルミ板21と、アルミ板21の表裏の
一面を覆う絶縁膜22と、絶縁膜22を挟んでアルミ板
21の反対側に設けた銅の回路パターン23とを備えて
なる。
(Embodiment 1) As shown in FIG. 1, a light-emitting diode illuminating device according to the present embodiment includes a light-emitting diode 1 mounted face-down on a circuit board 2.
The circuit board 2 includes an aluminum plate 21, an insulating film 22 covering one surface of the aluminum plate 21, and a copper circuit pattern 23 provided on the opposite side of the aluminum plate 21 with the insulating film 22 interposed therebetween.

【0012】また、板状であって厚み方向に貫通する貫
通孔31が設けられた基台3を備える。基台3の厚み方
向に直交する貫通孔31の断面は円形状であって、貫通
孔31の内周面は、一方の開口を他方の開口よりも広く
する傾斜面である。また、貫通孔31の内周面には反射
鏡が設けられている。基台3は、貫通孔31の開口が狭
い側の面を回路基板2に向けて発光ダイオード1が貫通
孔31に収納される形で回路基板2に固定されている。
また、透光性の合成樹脂からなる板状のカバー5が貫通
孔31の広い側の開口を覆う形で基台3に取りつけられ
ている。すなわち、基台3の広い側の開口が開口窓とし
て機能する。貫通孔31の広い側の開口の周縁部には、
カバー5の厚さ寸法の程度だけ基台3の他の部分よりも
厚さ寸法を薄くする段を形成するカバー載置部33が設
けられていて、カバー5の周縁はカバー載置部33に載
置されている。ここで、基台3のカバー載置部33にお
ける厚さ寸法は発光ダイオード1の出射面の回路基板2
からの距離よりも大きく、カバー5は基台3によって発
光ダイオード1から離れた位置において定位置に保持さ
れている。
The base 3 has a plate-like shape and is provided with a through hole 31 penetrating in the thickness direction. The cross section of the through hole 31 orthogonal to the thickness direction of the base 3 is circular, and the inner peripheral surface of the through hole 31 is an inclined surface that makes one opening wider than the other opening. In addition, a reflecting mirror is provided on the inner peripheral surface of the through hole 31. The base 3 is fixed to the circuit board 2 such that the light emitting diode 1 is housed in the through hole 31 with the surface of the through hole 31 on the side with the narrow opening facing the circuit board 2.
A plate-shaped cover 5 made of a light-transmitting synthetic resin is attached to the base 3 so as to cover the opening on the wide side of the through hole 31. That is, the opening on the wide side of the base 3 functions as an opening window. In the peripheral portion of the opening on the wide side of the through hole 31,
A cover mounting portion 33 is provided, which forms a step of reducing the thickness of the cover 5 by the thickness of the cover 5 from the other portions of the base 3, and the periphery of the cover 5 is attached to the cover mounting portion 33. It is placed. Here, the thickness dimension of the cover mounting portion 33 of the base 3 is determined by the circuit board 2 on the emission surface of the light emitting diode 1.
The cover 5 is held at a fixed position at a position apart from the light emitting diode 1 by the base 3.

【0013】カバー5と基台3と回路基板2とによって
囲まれた部分は収納室32である。カバー5を構成する
合成樹脂には、発光ダイオード1の光によって励起され
発光ダイオード1の光とは波長が異なる光を放つ蛍光体
が練りこまれている。発光ダイオード1と蛍光体との組
み合わせとして、例えば、青色の光を放つ発光ダイオー
ド1と黄色の光を放つ蛍光体とを用いると、青色と黄色
との混色によって白色光が得られる。
A portion surrounded by the cover 5, the base 3, and the circuit board 2 is a storage room 32. The synthetic resin forming the cover 5 is kneaded with a phosphor that is excited by the light of the light emitting diode 1 and emits light having a wavelength different from that of the light of the light emitting diode 1. When the light emitting diode 1 emitting blue light and the phosphor emitting yellow light are used as a combination of the light emitting diode 1 and the phosphor, for example, white light can be obtained by mixing blue and yellow.

【0014】発光ダイオード1と回路基板2との形状を
具体的に説明すると、発光ダイオード1は、図1に示す
ように、板状のサファイア基板11と、サファイア基板
11の表裏の一面に形成されたInGaNのn形半導体
層12aおよびp形半導体層12bを接合した半導体層
12とを備える。半導体層12にはバンプ13が設けら
れており、発光ダイオード1は回路基板2にフェースダ
ウン実装されている。サファイア基板11において半導
体層12から離れた側の面が出射面である。サファイア
基板11において半導体層12から離れた側の面には微
小な凹凸が全面に亙って形成されており、すなわち出射
面と反対側面とは非平行になっている。
The shapes of the light emitting diode 1 and the circuit board 2 will be specifically described. As shown in FIG. 1, the light emitting diode 1 is formed on a plate-shaped sapphire substrate 11 and on one surface of the sapphire substrate 11. And a semiconductor layer 12 in which an InGaN n-type semiconductor layer 12a and a p-type semiconductor layer 12b are joined. The semiconductor layer 12 is provided with a bump 13, and the light emitting diode 1 is mounted face down on the circuit board 2. The surface of the sapphire substrate 11 on the side away from the semiconductor layer 12 is the emission surface. On the surface of the sapphire substrate 11 on the side remote from the semiconductor layer 12, fine irregularities are formed over the entire surface, that is, the emission surface is not parallel to the opposite side.

【0015】ここで、半導体層12において発生した光
であって臨界角以上の入射角でサファイア基板11の出
射面に到達した光は全反射し半導体層12に到達する
が、サファイア基板11の出射面と半導体層12とが平
行であった場合、半導体層12においても臨界角以上の
入射角で空気との境界面に入射して全反射し、再び同じ
入射角でサファイア基板11の出射面へ入射する。つま
り、臨界角以上の入射角でサファイア基板11の出射面
に到達した光は発光ダイオード1の内部で全反射を繰り
返し、発光ダイオード1の外部へ出射することができな
い。一方、半導体層12と空気との境界面とサファイア
基板11の出射面とが非平行であることにより、サファ
イア基板11の出射面において全反射した光が半導体層
12と空気との境界面において反射してから出射面に入
射する際には入射角が変化する。このとき入射角が臨界
角より小さくなって出射する光もあるから、サファイア
基板11と半導体層12とが平行である場合に比べて光
取り出し効率が向上する。
Here, the light generated in the semiconductor layer 12 and having reached the emission surface of the sapphire substrate 11 at an incident angle equal to or greater than the critical angle is totally reflected and reaches the semiconductor layer 12. When the surface and the semiconductor layer 12 are parallel to each other, the semiconductor layer 12 also enters the interface with air at an angle of incidence equal to or greater than the critical angle, is totally reflected, and returns to the exit surface of the sapphire substrate 11 at the same angle of incidence Incident. That is, the light that has reached the emission surface of the sapphire substrate 11 at an incident angle equal to or greater than the critical angle repeats total reflection inside the light emitting diode 1 and cannot be emitted outside the light emitting diode 1. On the other hand, since the interface between the semiconductor layer 12 and the air and the emission surface of the sapphire substrate 11 are not parallel, light totally reflected at the emission surface of the sapphire substrate 11 is reflected at the interface between the semiconductor layer 12 and the air. Then, when the light is incident on the emission surface, the incident angle changes. At this time, since some light is emitted with the incident angle smaller than the critical angle, the light extraction efficiency is improved as compared with the case where the sapphire substrate 11 and the semiconductor layer 12 are parallel.

【0016】出射面と反対側面とを非平行とする形状と
しては、出射面が反対側面に対して傾斜する形状でもよ
い。または、出射面を錐体形状に形成したり、球面の一
部をなす形状に出射面を形成したり、出射面に複数の錐
体形や球面状を形成したりすることによって出射面と反
対側面とを非平行としてもよい。
The shape in which the exit surface and the opposite side surface are made non-parallel may be a shape in which the exit surface is inclined with respect to the opposite side surface. Alternatively, the emission surface is formed in a conical shape, the emission surface is formed in a shape that forms part of a spherical surface, or a plurality of cones or a spherical shape is formed on the emission surface, thereby forming a surface opposite to the emission surface. May be non-parallel.

【0017】上記構成によれば、発光ダイオード1から
カバー5に伝わる熱は発光ダイオード1を合成樹脂で封
止した場合における合成樹脂に発光ダイオード1から伝
わる熱よりも少なく、またカバー5が受ける光の入射密
度は発光ダイオード1を合成樹脂で封止した場合におけ
る発光ダイオード1の近傍の合成樹脂が受ける光の入射
密度よりも少ないから合成樹脂の劣化が抑えられ、した
がって合成樹脂の劣化による着色等が発生しにくいから
発光ダイオード1を合成樹脂で封止した発光ダイオード
照明装置に比べて寿命が長くなる。
According to the above configuration, the heat transmitted from the light emitting diode 1 to the cover 5 is smaller than the heat transmitted from the light emitting diode 1 to the synthetic resin when the light emitting diode 1 is sealed with the synthetic resin. Is smaller than the incident density of light received by the synthetic resin in the vicinity of the light emitting diode 1 when the light emitting diode 1 is sealed with the synthetic resin, so that the deterioration of the synthetic resin can be suppressed. Is less likely to occur, and the life is longer than in a light emitting diode lighting device in which the light emitting diode 1 is sealed with a synthetic resin.

【0018】また、発光ダイオード1を合成樹脂で封止
する場合は樹脂を回り込ませるために粘度の小さい合成
樹脂を用いる必要があるが、カバー5は板状であるか
ら、カバー5は粘度の比較的高い合成樹脂を用いて形成
することができる。しかも、発光ダイオード1を封止す
る合成樹脂に比べてカバー5は薄く、合成樹脂が固まる
までの時間が短い。したがって蛍光体を均一に分布させ
ることが容易であり、蛍光体の濃度を調整しやすい。
When the light emitting diode 1 is sealed with a synthetic resin, it is necessary to use a synthetic resin having a low viscosity in order to wrap around the resin. However, since the cover 5 is plate-shaped, the cover 5 has a comparative viscosity. It can be formed using a highly synthetic resin. In addition, the cover 5 is thinner than the synthetic resin for sealing the light emitting diode 1, and the time until the synthetic resin hardens is short. Therefore, it is easy to distribute the phosphor uniformly, and it is easy to adjust the concentration of the phosphor.

【0019】また、基台3において貫通孔31の内周面
は回路基板2から離れる方向へ向かって貫通孔31の開
口を広くする傾斜面であるから、基台3のカバー載置部
33の貫通孔31の内面における位置とカバー5の直径
とを適宜設定することで、光が発せられる部分の大きさ
を自由に設定することができる。
The inner peripheral surface of the through hole 31 of the base 3 is an inclined surface that widens the opening of the through hole 31 in a direction away from the circuit board 2. By appropriately setting the position on the inner surface of the through hole 31 and the diameter of the cover 5, the size of the portion from which light is emitted can be freely set.

【0020】ここで、発光ダイオード1を合成樹脂で封
止した場合は、合成樹脂の熱伝導率が一般に低いために
発光ダイオード1の熱は主に回路基板2を通じて外部に
放出される。一方、本実施形態においては発光ダイオー
ド1によって加熱された空気が収納室32の内部で対流
することにより、発光ダイオード1を合成樹脂で封止す
る場合に比べてカバー5に熱が伝わりやすくなり、より
多くの熱がカバー5から放出されるようになるため放熱
性も向上する。発光ダイオード1を合成樹脂で封止する
場合に比べて放熱性が向上することにより、熱による発
光ダイオード1の劣化が抑えられるから、発光ダイオー
ド照明装置の寿命を長くしたり、発光ダイオード1に大
電流を流すことによって輝度を高めることができる。因
みに発光ダイオード1を合成樹脂で封止した場合と上記
構成とを互いに同程度の条件において比較したところ、
上記構成では発光ダイオード1を合成樹脂で封止した場
合に比べ、発光ダイオードの温度を20℃程度低減する
ことが可能であった。
When the light emitting diode 1 is sealed with a synthetic resin, the heat of the light emitting diode 1 is mainly radiated to the outside through the circuit board 2 because the thermal conductivity of the synthetic resin is generally low. On the other hand, in the present embodiment, the air heated by the light emitting diode 1 convects inside the storage chamber 32, so that heat is easily transmitted to the cover 5 as compared with the case where the light emitting diode 1 is sealed with a synthetic resin. Since more heat is released from the cover 5, the heat dissipation is also improved. Since the heat dissipation is improved as compared with the case where the light emitting diode 1 is sealed with a synthetic resin, deterioration of the light emitting diode 1 due to heat is suppressed. Luminance can be increased by passing a current. By the way, when comparing the case where the light emitting diode 1 is sealed with a synthetic resin and the above configuration under the same conditions,
With the above configuration, it was possible to reduce the temperature of the light emitting diode 1 by about 20 ° C. as compared with the case where the light emitting diode 1 was sealed with a synthetic resin.

【0021】なお、図2に示すようにカバー5における
発光ダイオード1との対向面に蛍光体を塗布した蛍光体
層53を形成してもよい。この場合、蛍光体をカバー5
に練り込む必要はないから、カバー5を合成樹脂ではな
くガラスによって形成してもよい。
As shown in FIG. 2, a phosphor layer 53 coated with a phosphor may be formed on the surface of the cover 5 facing the light emitting diode 1. In this case, the phosphor is covered 5
The cover 5 may be made of glass instead of synthetic resin.

【0022】(実施形態2)本実施形態における発光ダ
イオード照明装置は、図3に示すように実施形態1と同
様の構成における収納室32に液体としてのシリコンオ
イル9を封入したものである。その他の構成は実施形態
1と同様である。
(Embodiment 2) The light-emitting diode illuminating apparatus according to the present embodiment is one in which silicon oil 9 as a liquid is sealed in a storage chamber 32 having the same configuration as that of Embodiment 1 as shown in FIG. Other configurations are the same as those of the first embodiment.

【0023】上記構成によれば収納室32にシリコンオ
イル9が封入されているから、シリコンが空気よりもよ
く熱を伝えることにより、シリコンオイル9を介して発
光ダイオード1の熱をより効率良くカバー5に伝えて装
置の外部へ逃がすことができる。
According to the above configuration, since the silicon oil 9 is sealed in the storage chamber 32, the silicon conducts heat better than air, so that the heat of the light emitting diode 1 can be more efficiently covered through the silicon oil 9. 5 to escape to the outside of the device.

【0024】(実施形態3)本実施形態における発光ダ
イオード照明装置は、実施形態1と同様の構成に加え、
図4に示すようにカバー5と回路基板2とにそれぞれ収
納室32の内外を連通させる放熱孔51、24が貫設さ
れている。
(Embodiment 3) The light emitting diode illuminating device according to the present embodiment has the same structure as that of Embodiment 1,
As shown in FIG. 4, the cover 5 and the circuit board 2 are provided with heat radiating holes 51 and 24 for communicating the inside and outside of the storage chamber 32 with each other.

【0025】具体的に説明すると、図5に示すようにカ
バー5の放熱孔51はカバー5の周縁部において周方向
に沿って等間隔に4個設けられている。また、図6に示
すように、回路基板2の放熱孔24は、回路基板2にお
いて発光ダイオード1が実装された位置を挟む位置にそ
れぞれ設けられている。寸法の一例を挙げると、カバー
5の直径は3.2mm、放熱孔51,24の直径は0.
2mm、回路基板2とカバー5との距離H1(図7参
照)は1mm、回路基板2の厚さ寸法H2は0.5m
m、貫通孔31の回路基板2に近い側の開口の直径は
1.5mm、発光ダイオード1の外周の一辺の長さは
0.35mmである。
More specifically, as shown in FIG. 5, four heat radiation holes 51 of the cover 5 are provided at equal intervals along the circumferential direction at the peripheral edge of the cover 5. As shown in FIG. 6, the heat radiation holes 24 of the circuit board 2 are provided at positions on the circuit board 2 that sandwich the position where the light emitting diode 1 is mounted. To give an example of the dimensions, the diameter of the cover 5 is 3.2 mm, and the diameter of the heat radiation holes 51 and 24 is 0.2 mm.
2 mm, the distance H1 between the circuit board 2 and the cover 5 (see FIG. 7) is 1 mm, and the thickness dimension H2 of the circuit board 2 is 0.5 m
m, the diameter of the opening of the through hole 31 near the circuit board 2 is 1.5 mm, and the length of one side of the outer periphery of the light emitting diode 1 is 0.35 mm.

【0026】上記構成によれば、空気が放熱孔51,2
4を通じて収納室32に出入りするから、発光ダイオー
ド1の熱をより効率良く収納室32の外部へ逃がすこと
ができる。例えば、カバー5を上に向けて設置した場
合、図4の矢印Aで示すように回路基板2の放熱孔24
から流入した空気が発光ダイオードによって加熱されカ
バーの放熱孔51から収納室32の外部へ流出する。
According to the above configuration, the air is radiated from the heat radiation holes 51 and 52.
4, the heat of the light emitting diode 1 can be more efficiently released to the outside of the storage room 32. For example, when the cover 5 is installed with the cover 5 facing upward, as shown by an arrow A in FIG.
Is heated by the light emitting diodes and flows out of the storage chamber 32 through the heat radiation holes 51 of the cover.

【0027】(実施形態4)本実施形態における発光ダ
イオード照明装置は、カバー5が基台3に対して着脱可
能である点が実施形態1と異なる。具体的に説明する
と、図9に示すように、カバー5は円形平板状であっ
て、カバー5の外周においてカバー5の中心を挟んだ2
箇所にはそれぞれ係合爪52が突設されている。係合爪
52の表裏の一面はカバー5の他の部分の表裏の一面と
面一であって、かつ係合爪52の厚さ寸法はカバー5の
他の部分の厚さ寸法よりも小さく形成されている。また
図9に示すように、基台3において貫通孔31を挟んだ
2箇所には係合爪52とバヨネット式に係合する係合部
34がそれぞれ設けられる。詳しく説明すると、係合部
34は、基台3において開口窓の近傍部位で貫通穴31
の内側面に凹設され貫通孔31の周方向に沿って形成さ
れた収納溝34bと、収納溝34bの一端部に連通し基
台3において回路基板2から離れた側の面に開放された
導入部34aとからなる。各係合部34において、導入
部34aは収納溝34bに対して貫通孔31の周方向に
沿って同じ側に設けられている。
(Embodiment 4) The light-emitting diode illuminating device of this embodiment is different from that of Embodiment 1 in that the cover 5 is detachable from the base 3. More specifically, as shown in FIG. 9, the cover 5 has a circular flat plate shape,
Engaging claws 52 are protrudingly provided at the respective locations. One surface of the front and back surfaces of the engaging claw 52 is flush with one surface of the other surface of the cover 5, and the thickness of the engaging claw 52 is formed smaller than the thickness of the other portion of the cover 5. Have been. Further, as shown in FIG. 9, two engaging portions 34 that engage with the engaging claws 52 in a bayonet manner are provided at two places on the base 3 with the through hole 31 interposed therebetween. More specifically, the engaging portion 34 is provided at the base 3 near the opening window at the through hole 31.
A storage groove 34b is formed in the inner surface of the base 3 and is formed along the circumferential direction of the through-hole 31. The storage groove 34b communicates with one end of the storage groove 34b and is open to the surface of the base 3 away from the circuit board 2. And an introduction portion 34a. In each engagement portion 34, the introduction portion 34a is provided on the same side of the storage groove 34b along the circumferential direction of the through hole 31.

【0028】カバー5を基台3に取り付ける際は、係合
爪52においてカバー5のほかの部位の表裏の一面と面
一に形成された側を回路基板2に向け、図10の矢印B
で示すように各係合爪52を各一方の導入部34aにそ
れぞれ導入してからカバー5を基台3に対して矢印Cで
示すように相対的に回転させると、図11に示すように
各係合爪52は各一方の係合部34の収納溝34bにそ
れぞれ収納される。カバー5を基台から取り外す際は、
取り付けたときと逆方向にカバー5を回転させることで
各係合爪52が係合部34の導入部34aに臨み、ここ
においてカバー5を基台3から分離させることができ
る。つまりカバー5の係合爪52と基台3の係合部34
とが着脱手段として機能する。
When the cover 5 is attached to the base 3, the side of the engaging claw 52 formed flush with the front and back surfaces of the other portions of the cover 5 is directed toward the circuit board 2, and the arrow B in FIG.
When the cover 5 is rotated relative to the base 3 as shown by the arrow C after each of the engagement claws 52 is introduced into each one of the introduction portions 34a as shown by, as shown in FIG. Each of the engaging claws 52 is housed in the housing groove 34b of each one of the engaging portions 34. When removing the cover 5 from the base,
By rotating the cover 5 in a direction opposite to the direction of attachment, each engagement claw 52 faces the introduction portion 34a of the engagement portion 34, and the cover 5 can be separated from the base 3 here. That is, the engaging claw 52 of the cover 5 and the engaging portion 34 of the base 3
Function as attachment / detachment means.

【0029】各部の寸法は例えば、カバー5の直径は
3.2mmであり、カバー5と回路基板2との距離H3
は1mmであり、回路基板2の厚さH4は0.5mmで
ある。また、発光ダイオード1は外周が0.35mm四
方の正方形状であり、基台3の狭い側の開口の直径は
1.5mmである。
The dimensions of each part are, for example, the diameter of the cover 5 is 3.2 mm, and the distance H3 between the cover 5 and the circuit board 2 is H3.
Is 1 mm, and the thickness H4 of the circuit board 2 is 0.5 mm. The light emitting diode 1 has a square shape with an outer circumference of 0.35 mm square, and the diameter of the opening on the narrow side of the base 3 is 1.5 mm.

【0030】上記構成によれば、カバー5を構成する合
成樹脂の劣化によって光の透過率が減少した場合や、カ
バー5に用いられている蛍光体が劣化してカバー5から
得られる光の色が変化した場合にカバー5を容易に交換
することができる。また、カバー5を他の蛍光体を有す
るカバー5と交換して光の色を変えることも容易であ
る。
According to the above configuration, the light transmittance is reduced due to the deterioration of the synthetic resin constituting the cover 5, or the color of light obtained from the cover 5 due to the deterioration of the phosphor used in the cover 5 is deteriorated. The cover 5 can be easily replaced when the value changes. Also, it is easy to change the color of light by replacing the cover 5 with a cover 5 having another phosphor.

【0031】(実施形態5)本実施形態における発光ダ
イオード1は紫外光を放出するものであり、半導体層1
2にGaNを用いている。また、本実施形態における固
定基台8は、図12に示すように板状であって厚さ方向
に貫通した収納室を形成する貫通孔81が設けられ、貫
通孔81の内側に発光ダイオード1が収納される形で回
路基板2に取りつけられている。ここで、固定基台8の
厚さ寸法は発光ダイオード1の出射面の回路基板2から
の距離よりも大きい。また、貫通孔81の内周面は、一
方の開口を他方の開口よりも広くする傾斜面であって、
貫通孔81の内周面には反射鏡が形成されている。貫通
孔81の広い側の開口が開口窓として機能する。また、
図13に示すように回路基板2において固定基台8の側
方には出力軸71と出力軸71を駆動するモータ本体7
2とを有するモータ7が、出力軸71を回路基板2に直
交する方向へ向けて固定されている。さらに、円形板状
の可動基台6の中央部がモータ7の出力軸71に固定さ
れている。可動基台6の回路基板2に近い側の面は固定
基台8の回路基板2から離れた側の面に近接して対向し
ている。図14に示すように、可動基台6において出力
軸71を中心とした1つの円上には、周方向に沿って等
間隔に円形の4個のカバー孔61が貫設されている。各
カバー孔61にはそれぞれ合成樹脂からなる4個のカバ
ー5が装着されている。各カバー5の形状と、固定基台
8の貫通孔81の広い側の開口の形状とは一致してい
る。各カバー5はそれぞれ異なる蛍光体を有し、発光ダ
イオード1が放つ紫外光を受けてそれぞれ赤色、緑色、
青色、黄色の光を放つ。いずれかのカバー孔61が基台
3の貫通孔31と重なってカバー5の表裏の一面が発光
ダイオード1に向けられるように、モータ7は出力軸7
1を回路基板2に対して相対的に図14の矢印Dの方向
に回転させることができる。したがって、可動基台6の
回転に伴ってカバー5は開口窓に対して着脱されること
になる。つまりモータ7が回転手段として機能する。可
動基台6の直径は例えば10mmであって、カバー孔6
1の直径は例えば3mmである。また、固定基台8の厚
さ寸法H5は1mmであって、回路基板2の厚さ寸法H
6は0.5mmである。
(Embodiment 5) The light emitting diode 1 according to the present embodiment emits ultraviolet light.
2 uses GaN. As shown in FIG. 12, the fixing base 8 in the present embodiment is provided with a through hole 81 which is plate-shaped and forms a storage chamber penetrating in the thickness direction, and the light emitting diode 1 is provided inside the through hole 81. Is mounted on the circuit board 2 in a form to be stored. Here, the thickness dimension of the fixed base 8 is larger than the distance of the light emitting surface of the light emitting diode 1 from the circuit board 2. The inner peripheral surface of the through hole 81 is an inclined surface that makes one opening wider than the other opening.
A reflecting mirror is formed on the inner peripheral surface of the through hole 81. The opening on the wide side of the through hole 81 functions as an opening window. Also,
As shown in FIG. 13, an output shaft 71 and a motor main body 7 for driving the output shaft 71 are provided on the side of the fixed base 8 on the circuit board 2.
2 is fixed with the output shaft 71 directed in a direction orthogonal to the circuit board 2. Further, the center of the circular plate-shaped movable base 6 is fixed to the output shaft 71 of the motor 7. The surface of the movable base 6 on the side close to the circuit board 2 is close to and opposes the surface of the fixed base 8 on the side remote from the circuit board 2. As shown in FIG. 14, four circular cover holes 61 are provided at equal intervals along the circumferential direction on one circle centered on the output shaft 71 in the movable base 6. Each cover hole 61 is provided with four covers 5 made of synthetic resin. The shape of each cover 5 matches the shape of the opening on the wide side of the through hole 81 of the fixed base 8. Each cover 5 has a different phosphor, and receives red light emitted by the light emitting diode 1 to receive red light, green light,
Emits blue and yellow light. The motor 7 is connected to the output shaft 7 so that one of the cover holes 61 overlaps the through hole 31 of the base 3 and one surface of the front and back of the cover 5 is directed to the light emitting diode 1.
1 can be rotated relative to the circuit board 2 in the direction of arrow D in FIG. Accordingly, the cover 5 is attached to and detached from the opening window as the movable base 6 rotates. That is, the motor 7 functions as a rotating unit. The movable base 6 has a diameter of, for example, 10 mm, and has a cover hole 6.
The diameter of 1 is, for example, 3 mm. The thickness H5 of the fixing base 8 is 1 mm, and the thickness H of the circuit board 2 is 1 mm.
6 is 0.5 mm.

【0032】なお、カバー孔61およびカバー5の数は
本実施形態に限定されず、例えば図15に示すように、
可動基台6にカバー孔61およびカバー5を8つずつ設
けてもよい。
Note that the numbers of the cover holes 61 and the covers 5 are not limited to the present embodiment, and for example, as shown in FIG.
The movable base 6 may be provided with eight cover holes 61 and eight covers 5.

【0033】上記構成によれば、モータ7によって可動
基台6を回転させるだけで、発光ダイオード1の光を受
けるカバー5を変更して容易に光の色を変えることがで
きる。
According to the above configuration, the color of the light can be easily changed by changing the cover 5 for receiving the light of the light emitting diode 1 only by rotating the movable base 6 by the motor 7.

【0034】[0034]

【発明の効果】請求項1の発明は、発光ダイオードの熱
や光によって劣化する材料に覆われてはいないので、発
光ダイオードが合成樹脂で封止されている場合に比べて
寿命が長くなる。また、少なくとも発光ダイオードを封
止する分の合成樹脂が必要ないので、コストを低減する
ことができる。さらに、カバーを合成樹脂製として蛍光
体を練りこむ場合にも、発光ダイオードを合成樹脂で封
止する場合に比べて用いる合成樹脂が少なく、合成樹脂
の硬化が速いので蛍光体の濃度調節が容易である。
According to the first aspect of the present invention, since the light emitting diode is not covered with a material that is deteriorated by heat or light, the life of the light emitting diode is longer than when the light emitting diode is sealed with a synthetic resin. In addition, since at least the synthetic resin for sealing the light emitting diode is not required, the cost can be reduced. Furthermore, even when the cover is made of synthetic resin and the phosphor is kneaded, less synthetic resin is used than in the case where the light emitting diode is sealed with synthetic resin, and the concentration of the phosphor is easily adjusted because the synthetic resin cures quickly. It is.

【0035】請求項2の発明は、発光ダイオード1が収
納された収納室に液体が封入されているから、液体が一
般に空気よりも熱を伝えやすいことにより、収納室の内
部に空気を封入する場合に比べて発光ダイオードの放熱
が促進される。
According to the second aspect of the present invention, since the liquid is sealed in the storage chamber in which the light emitting diode 1 is stored, the liquid is generally easier to conduct heat than air, so that the air is sealed in the storage chamber. Heat radiation of the light emitting diode is promoted as compared with the case.

【0036】請求項3の発明は、カバーと回路基板とに
は収納室の内外を連通させる放熱孔が設けられているか
ら、発光ダイオードによって加熱された空気の少なくと
も一部が放熱孔を通過して入れ替わることにより発光ダ
イオードの放熱が促進される。
According to the third aspect of the present invention, since the cover and the circuit board are provided with a heat radiating hole communicating between the inside and the outside of the storage chamber, at least a part of the air heated by the light emitting diode passes through the heat radiating hole. The heat exchange of the light emitting diode is promoted by the replacement.

【0037】請求項4の発明は、カバーを開口窓に対し
て分離可能とする着脱手段をカバーと基台との少なくと
も一方に設けているから、カバーの材料やカバーに含ま
れる蛍光体が劣化した場合にもカバーを交換するだけで
性能を回復させることができる。
According to the fourth aspect of the present invention, since at least one of the cover and the base is provided with attaching / detaching means capable of separating the cover from the opening window, the material of the cover and the phosphor contained in the cover deteriorate. In this case, the performance can be restored simply by replacing the cover.

【0038】請求項5の発明は、基台は、回路基板に固
定され収納室が形成された遮光性の固定基台と、固定基
台の表面に平行な面内で回転可能となるように回路基板
に支承され収納室に設けた開口窓に一致する形状の複数
個のカバーを保持して着脱手段として機能する可動基台
とからなり、カバーのうちのいずれか1個を開口窓の位
置に一致させるように可動基台を回転させる回転手段が
付加されているから、回転手段によって可動基台を回転
させるだけでカバーを交換することができる。
According to a fifth aspect of the present invention, the base is fixed to the circuit board and has a light-shielding fixed base in which a storage chamber is formed, and the base is rotatable in a plane parallel to the surface of the fixed base. A movable base functioning as a detachable means by holding a plurality of covers supported by the circuit board and having a shape corresponding to the opening window provided in the storage chamber, and any one of the covers is positioned at the position of the opening window; Since the rotating means for rotating the movable base is added so as to match the above, the cover can be replaced only by rotating the movable base by the rotating means.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施形態1を示す断面図である。FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

【図2】同上の別の形態の要部を示す断面図である。FIG. 2 is a sectional view showing a main part of another embodiment of the above.

【図3】本発明の実施形態2を示す断面図である。FIG. 3 is a sectional view showing Embodiment 2 of the present invention.

【図4】本発明の実施形態3を示す断面図である。FIG. 4 is a sectional view showing Embodiment 3 of the present invention.

【図5】本発明の実施形態3に用いられるカバーを示す
平面図である。
FIG. 5 is a plan view showing a cover used in a third embodiment of the present invention.

【図6】本発明の実施形態3を示すカバーを含まない平
面図である。
FIG. 6 is a plan view illustrating a third embodiment of the present invention without including a cover.

【図7】同上を示す断面図である。FIG. 7 is a sectional view showing the above.

【図8】本発明の実施形態4に用いられるカバーを示す
平面図である。
FIG. 8 is a plan view showing a cover used in a fourth embodiment of the present invention.

【図9】本発明の実施形態4を示すカバーを含まない平
面図である。
FIG. 9 is a plan view illustrating a fourth embodiment of the present invention without including a cover.

【図10】同上を示す説明図である。FIG. 10 is an explanatory diagram showing the above.

【図11】同上を示す断面図である。FIG. 11 is a sectional view showing the above.

【図12】本発明の実施形態5の要部を示す断面図であ
る。
FIG. 12 is a sectional view showing a main part of a fifth embodiment of the present invention.

【図13】本発明の実施形態5を示す断面図である。FIG. 13 is a sectional view showing Embodiment 5 of the present invention.

【図14】同上を示す平面図である。FIG. 14 is a plan view showing the above.

【図15】同上の別の形態を示す基台を含まない斜視図
である。
FIG. 15 is a perspective view that does not include a base showing another embodiment of the above.

【図16】従来例を示す断面図である。FIG. 16 is a sectional view showing a conventional example.

【符号の説明】 1 発光ダイオード 2 回路基板 24 放熱孔 3 基台 32 収納室 5 カバー 51 放熱孔 53 蛍光体層 6 可動基台 7 モータ 8 固定基台 9 シリコンオイル[Explanation of symbols] 1 Light emitting diode 2 Circuit board 24 Heat radiation holes 3 bases 32 storage rooms 5 Cover 51 Heat dissipation hole 53 phosphor layer 6 movable base 7 Motor 8 Fixed base 9 Silicone oil

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3K014 AA01 LA01 LB03 5F041 AA33 AA44 CA02 CA34 CA40 CA46 CB36 DA04 DA20 DA35 DA36 DA61 DA75 EE25 FF11   ────────────────────────────────────────────────── ─── Continuation of front page    F term (reference) 3K014 AA01 LA01 LB03                 5F041 AA33 AA44 CA02 CA34 CA40                       CA46 CB36 DA04 DA20 DA35                       DA36 DA61 DA75 EE25 FF11

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 板状であって厚み方向の一面に他面とは
非平行である出射面を有した発光ダイオードと、前記発
光ダイオードがフェースダウン実装された回路基板と、
前記回路基板の厚み方向の一面に載設され前記発光ダイ
オードを収納する収納室が形成されるとともに前記発光
ダイオードから放射された光を取り出す開口窓が前記収
納室の一部に形成された基台と、前記発光ダイオードか
ら放射された光を異なる波長に変換する蛍光体を有しか
つ前記発光ダイオードとは離間して前記開口窓を覆う形
で前記基台に取り付けた透光性のカバーとから成ること
を特徴とする発光ダイオード照明装置。
1. A light-emitting diode having a plate-like shape and having an emission surface that is non-parallel to another surface on one surface in a thickness direction, a circuit board on which the light-emitting diode is mounted face-down,
A base formed with a storage chamber mounted on one surface in the thickness direction of the circuit board for storing the light emitting diode and having an opening window for taking out light emitted from the light emitting diode formed in a part of the storage chamber And a light-transmitting cover having a phosphor that converts light emitted from the light-emitting diode to a different wavelength, and a light-transmitting cover attached to the base in a form that is separated from the light-emitting diode and covers the opening window. A light emitting diode lighting device, comprising:
【請求項2】 前記収納室は前記回路基板および前記カ
バーにより密閉され前記発光ダイオードが放つ光を透過
させる液体が前記収納室に封入されていることを特徴と
する請求項1記載の発光ダイオード照明装置。
2. The light-emitting diode illumination according to claim 1, wherein the storage chamber is sealed by the circuit board and the cover, and a liquid that transmits light emitted by the light-emitting diode is sealed in the storage chamber. apparatus.
【請求項3】 前記収納室は前記回路基板および前記カ
バーにより囲まれ前記収納室を気流が通過するように前
記回路基板と前記カバーとにはそれぞれ前記収納室と外
部とを連通させる放熱孔が設けられていることを特徴と
する請求項1記載の発光ダイオード照明装置。
3. The storage chamber is surrounded by the circuit board and the cover, and the circuit board and the cover have a radiating hole for communicating the storage chamber with the outside so that an airflow passes through the storage chamber. The light emitting diode lighting device according to claim 1, wherein the light emitting diode lighting device is provided.
【請求項4】 前記カバーを前記開口窓に対して分離可
能とする着脱手段を前記カバーと前記基台との少なくと
も一方に設けたことを特徴とする請求項1記載の発光ダ
イオード照明装置。
4. The light-emitting diode illuminating device according to claim 1, wherein a detachable means for detaching the cover from the opening window is provided on at least one of the cover and the base.
【請求項5】 前記基台は、前記回路基板に固定され前
記収納室が形成された遮光性の固定基台と、前記固定基
台の表面に平行な面内で回転可能となるように回路基板
に支承され収納室に設けた前記開口窓に一致する形状の
複数個のカバーを保持して前記着脱手段として機能する
可動基台とからなり、前記カバーのうちのいずれか1個
を開口窓の位置に一致させるように可動基台を回転させ
る回転手段が付加されていることを特徴とする請求項4
記載の発光ダイオード照明装置。
5. A light-shielding fixed base fixed to the circuit board and having the storage chamber formed therein, and a circuit configured to be rotatable in a plane parallel to a surface of the fixed base. A movable base functioning as the attaching / detaching means, holding a plurality of covers supported by the substrate and having a shape corresponding to the opening windows provided in the storage chamber, and any one of the covers is provided with an opening window 5. A rotating means for rotating the movable base so as to match the position of the movable base is added.
The light-emitting diode lighting device according to claim 1.
JP2002154829A 2002-05-28 2002-05-28 Light emitting diode illuminator Pending JP2003347601A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002154829A JP2003347601A (en) 2002-05-28 2002-05-28 Light emitting diode illuminator

Publications (1)

Publication Number Publication Date
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Family

ID=29771487

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2003347601A (en)

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JP2020126912A (en) * 2019-02-04 2020-08-20 日機装株式会社 Semiconductor light-emitting device and manufacturing method therefor
JP7178761B2 (en) 2019-02-04 2022-11-28 日機装株式会社 Semiconductor light emitting device and manufacturing method thereof

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