JP4088932B2 - Light emitting device and lighting apparatus using the same - Google Patents

Light emitting device and lighting apparatus using the same Download PDF

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Publication number
JP4088932B2
JP4088932B2 JP2005515992A JP2005515992A JP4088932B2 JP 4088932 B2 JP4088932 B2 JP 4088932B2 JP 2005515992 A JP2005515992 A JP 2005515992A JP 2005515992 A JP2005515992 A JP 2005515992A JP 4088932 B2 JP4088932 B2 JP 4088932B2
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Prior art keywords
light
emitting device
light emitting
surface
led
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JPWO2005055328A1 (en
Inventor
康雄 今井
武之 前川
令幸 後藤
成 明道
卓生 村井
章人 田中
健一 石井
秀樹 福田
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三菱電機株式会社
三菱電機照明株式会社
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Priority to JP2003407804 priority
Application filed by 三菱電機株式会社, 三菱電機照明株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2004/018046 priority patent/WO2005055328A1/en
Publication of JPWO2005055328A1 publication Critical patent/JPWO2005055328A1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/04Optical design
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/0008Reflectors for light sources providing for indirect lighting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Description

  The present invention relates to a high-efficiency light-emitting device using a light source by a light-emitting diode and a lighting fixture using the same.

  There are many inventions related to a light-emitting device and a lighting device using a conventional light-emitting diode (LED). Among them, for example, several methods for realizing a high-efficiency lighting device that converts light emitted from an LED into second light and takes out the light in a reflective manner have been proposed. Among them, the following is an example of realizing a light emitting device by combining a short wavelength LED and a phosphor.

  In the conventional light emitting diode, the radiant flux emitted from the light emitting diode element is partially reflected on the reflective surface facing the light emitting diode element on the light emitting surface side of the light emitting diode element, and partly directly light transmissive. It passes through the member and goes to the exit surface. On the reflecting surface, the fluorescent material that emits visible light by receiving the radiant flux from the light-emitting diode element mainly emits visible light of 500 nm or more. In addition, in the radiant flux directed to the surface of the direct light transmissive member, the component in the ultraviolet region of 400 nm or less is reflected by the interference film 20, returns to the transparent resin material again, hits the phosphor of the adhesive layer 16, and is visible. The light is converted into light, and is reflected directly or reflected on the reflecting surface and is emitted from the interference film from the emitting surface (see, for example, Patent Document 1).

JP 2001-345483 (paragraphs 0020 to 0026, FIG. 1).

  Since the conventional light emitting diode can effectively utilize the ultraviolet region of the radiant flux from the light emitting diode element, the element device using the light emitting diode can achieve high performance and energy saving. Moreover, since the deterioration and yellowing of the light-transmitting member due to the ultraviolet rays from sunlight can be prevented, the lifetime when the light-emitting diode is used outdoors can be increased, and it is particularly suitable as an outdoor video display device. It is said to be a thing.

  However, this structure has a drawback that the electrode member structure becomes an obstacle and the efficiency of the extracted light is lowered. Further, when a plurality of LEDs are used to increase the light emission amount of the apparatus main body, it is difficult to increase the light emission amount while maintaining a high extraction efficiency due to an increase in the electrode area.

  Further, this is a method of directly providing an interference film on the upper surface of the translucent member, and therefore, the translucent member must be solid. For this reason, for example, a liquid or gel material having good thermal conductivity cannot be used as the transparent material. In particular, in the case where the light emitting surface is used downward, the LED element has a structure embedded in a transparent light member, so the heat dissipation efficiency of the heat generated at the element junction is poor, resulting in the LED light emission efficiency. There has been a problem of lowering the device life and shortening the device life.

  The present invention improves efficiency reduction and heat dissipation when a plurality of light emitting devices using short wavelength light sources such as LED elements are used, and has high efficiency, long life, and low cost light emitting device and illumination using the same The purpose is to obtain the instrument.

A light-emitting device according to the present invention includes a plurality of LED mounting boards on which LED elements that emit wavelength light are mounted, a housing in which a recess in which the LED mounting board is disposed is formed, and the LED element in the recess. A reflective surface provided with a wavelength conversion unit that emits converted light by the short wavelength light, and a thermally conductive LED substrate support plate erected at the center of the bottom surface of the recess of the housing, The reflective surface is formed of a bowl-shaped paraboloid having trough portions parallel to both sides along the LED substrate support plate, and the LED mounting substrate is a light emitting surface of the LED element on both surfaces of the LED substrate support plate. Is mounted so as to face the reflective surface, and the surface of the LED mounting substrate is formed of a high reflectance material for the short wavelength light emitted from the LED element and the converted wavelength light converted by the wavelength conversion unit. It is what.

The present invention includes a housing formed with a recess in which an LED mounting substrate is disposed, a reflecting surface provided with a wavelength conversion unit that emits converted light by the short wavelength light of the LED element in the recess, A thermally conductive LED board support plate erected at the center of the bottom surface of the recess of the housing, and the reflective surface has a trough shape having valleys parallel to both sides along the LED board support board. The LED mounting substrate is attached to both surfaces of the LED substrate support plate so that the light emitting surface of the LED element faces the reflecting surface, and the surface of the LED mounting substrate is the LED element. Is formed of a highly reflective material with respect to the short wavelength light emitted from and the converted wavelength light converted by the wavelength conversion unit, so that the luminous efficiency does not decrease even when a plurality of LED elements are used, Excellent heat dissipation, from light emitting surface Can be extraction efficiency is high, to obtain a light emitting device and a lighting fixture long life.

FIG. 1 is a cross-sectional view of a light-emitting device showing Embodiment 1 of the present invention.
FIG. 2 is a top view of FIG.
FIG. 3 is a top view of the LED mounting substrate of the light emitting device according to the first embodiment of the present invention.
FIG. 4 is a cross-sectional view of the LED mounting substrate of the light emitting device showing Embodiment 1 of the present invention.
FIG. 5 is a configuration explanatory view of a wavelength conversion material for a light emitting device according to Embodiment 1 of the present invention.
FIG. 6 is a cross-sectional view of a light emitting device showing Embodiment 1 of the present invention.
FIG. 7 is a cross-sectional view of the light-emitting device showing Embodiment 1 of the present invention.
FIG. 8 is a cross-sectional view of a light emitting device showing a second embodiment of the present invention.
FIG. 9 is a top view of FIG.
FIG. 10 is a top view of a light emitting device showing a second embodiment of the present invention.
FIG. 11 is a sectional view of a light emitting device showing a second embodiment of the present invention.
FIG. 12 is a top view of FIG.
FIG. 13 is a cross-sectional view of a light emitting device showing Embodiment 3 of the present invention.
FIG. 14 is a top view of FIG.
FIG. 15 is a sectional view of a light emitting device showing a third embodiment of the present invention.
FIG. 16 is a top view of FIG.
FIG. 17 is a cross-sectional view of a light-emitting device showing Embodiment 3 of the present invention.
FIG. 18 is a top view of FIG.
FIG. 19 is a cross-sectional view of a light emitting device according to Embodiment 4 of the present invention.
FIG. 20 is a top view of FIG.
FIG. 21 is a cross-sectional view of a light emitting device showing Embodiment 4 of the present invention.
[FIG. 22] A sectional view of a light emitting device according to Embodiment 5 of the present invention.
FIG. 23 is a cross-sectional view of a light emitting device showing Embodiment 5 of the present invention.
FIG. 24 is a cross-sectional view of a light emitting device showing Embodiment 5 of the present invention.
[FIG. 25] A sectional view of a light emitting device according to Embodiment 5 of the present invention.
[FIG. 26] A sectional view of a lighting fixture showing Embodiment 6 of the present invention.
FIG. 27 is a top view of FIG. 26.
[FIG. 28] A sectional view of a lighting apparatus showing Embodiment 6 of the present invention.
[FIG. 29] A sectional view of a lighting apparatus showing Embodiment 6 of the present invention.
[FIG. 30] A sectional view of a lighting fixture showing Embodiment 6 of the present invention.
FIG. 31 is a cross-sectional view showing a structural example of a substrate support plate of the light emitting device according to the first embodiment of the present invention.
FIG. 32 is a cross-sectional view showing a structural example of a substrate support plate of the light emitting device according to the first embodiment of the present invention.
FIG. 33 is a diagram showing a configuration example of a wavelength conversion unit according to the first embodiment of the present invention.
FIG. 34 is a sectional view of the light emitting device showing the first embodiment of the present invention.
FIG. 35 is a sectional view of the light emitting device showing the first embodiment of the present invention.
FIG. 36 is a sectional view of a light emitting device showing a second embodiment of the present invention.
FIG. 37 is a cross sectional view of a light emitting device showing a third embodiment of the present invention.
[FIG. 38] A sectional view of a light emitting apparatus according to Embodiment 7 of the present invention.
FIG. 39 is a top view of a light emitting device according to a seventh embodiment of the present invention.
[FIG. 40] A sectional view of a light emitting device according to Embodiment 7 of the present invention.
FIG. 41 is a cross sectional view of a light emitting device showing Embodiment 7 of the present invention.
[FIG. 42] A sectional view of a light emitting apparatus according to Embodiment 7 of the present invention.
FIG. 43 is a cross-sectional view of a light emitting device showing Embodiment 7 of the present invention.
FIG. 44 is a top view of a light-emitting device showing Embodiment 7 of the present invention.
[FIG. 45] A sectional view of a light emitting apparatus according to Embodiment 7 of the present invention.
[FIG. 46] A sectional view of a light emitting apparatus according to Embodiment 7 of the present invention.
FIG. 47 is a sectional view of a lighting fixture using the light emitting device according to the seventh embodiment of the present invention.
FIG. 48 is a cross-sectional view of a lighting fixture using a light emitting device according to a seventh embodiment of the present invention.
[FIG. 49] A sectional view of a light emitting apparatus according to Embodiment 7 of the present invention.
FIG. 50 is a cross-sectional view of a light emitting device showing Embodiment 7 of the present invention.
FIG. 51 is a plan view of FIGS. 49 and 50. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Translucent board, 2 Housing | casing, 2a, 2a2 Reflecting surface, 2a1 Ridge part, 2a3, 2a4 Side surface, 3 Wavelength conversion part, 4 LED mounting board, 5 Substrate support plate, 12 LED element, 24 Radiation fin, 40 High heat Conductive member, 50 luminaire housing, 51 light emitting device.
60 phosphor, 61 binder, 62 light reflection mask, 63 diffuse transmission plate.

Embodiment 1 FIG.
1 is a cross-sectional view of a light-emitting device according to Embodiment 1 of the present invention (B-sectional view of FIG. 2), FIG. 2 is a top view of the light-emitting device, FIG. 3 is a top view of an LED mounting substrate of the light-emitting device, and FIG. Is a cross-sectional view (cross-section B of FIG. 3) of the LED mounting substrate of the light-emitting device, and FIG. 5 is an explanatory diagram of the wavelength conversion material of the light-emitting device.

  1 and 2, the light emitting device includes an LED mounting substrate 4 on which a short wavelength LED element 12 having a peak in the near ultraviolet region is mounted, a housing 2 having a concave portion whose surface is a reflecting surface 2a, a housing 2 The wavelength conversion unit 3 is provided on the reflection surface 2a on the inner side of the body 2, converts the wavelength by using light emitted from the LED element 12 as excitation light, and emits second light that is converted light, and the bottom of the reflection surface 2a of the recess. Standing at the center, supporting the LED mounting substrate 4 on both sides, a substrate support plate 5 having thermal conductivity, a translucent plate 1 attached to the opening of the housing 2, and a central portion on the back of the housing 2. Further, the high thermal conductivity member 40 is used. The two LED mounting substrates 4 are attached to both side surfaces of the substrate support plate 5 so that the light emission central axes of the respective LED elements 12 face the side surfaces of the reflecting surface 2a of the housing recess, Reference numeral 1 denotes a light emitting surface that emits light emitted from the inside of the housing to the outside, and is formed of a light-transmitting plate such as glass or resin.

The reflective surface 2a of the concave portion includes a ridgeline portion 2a1 formed at the center of the bottom portion, a reflective surface 2a2 composed of two paraboloids having a rectangular shape in top view and having valleys along both sides of the ridgeline portion 2a1. It consists of side surfaces 2a4 at both ends of the object surface. The substrate support plate 5 is erected by fitting into a groove provided in the ridge line portion 2 a 1, and a part of one end surface of the substrate support plate 5 is in contact with the high thermal conductivity member 40.
In addition, although the housing | casing 2 is comprised with resin with good heat resistance from the surface of good workability, you may comprise from highly heat conductive members, such as a metal, from the surface of heat dissipation.

  Next, FIG. 3 and FIG. 4 show the configuration of the LED mounting substrate 4. In the present embodiment, the LED substrate 10 is used for the purpose of improving the heat dissipation of the LED element 12 related to the life of the LED element 12 and the light emission efficiency. A metal substrate is used. In order to maintain the electrical insulation of the metal substrate, the insulating layer 15 is provided on the substrate, the conductive pattern 11 is provided thereon, and the LED element 12 is mounted thereon. Note that an insulating layer 15 is provided on a portion of the conductive pattern 11 excluding the mounting portion of the LED element 12.

  Furthermore, the LED mounting substrate upper plate 13 for taking out the short wavelength light emitted from the LED element 12 in the lateral direction with the light distribution characteristic in the front direction of the LED mounting substrate 4 is connected to the LED substrate through the adhesive layer 16. 10 is joined. The LED mounting substrate upper plate 13 is provided with reflecting holes 14 in accordance with the positions where the LEDs 12 are arranged, and the side surfaces of the reflecting holes 14 are diffused or mirror-like so that light emitted from the LED elements 12 is efficiently emitted to the front surface. The high reflectivity surface. The LED mounting substrate upper plate 13 is made of, for example, metal or resin, and the surface other than the reflection hole 14 is coated with a high reflectance paint so as to increase the illumination efficiency, or a process such as vapor deposition of a highly reflective material on the surface is performed. Apply.

  Further, in order to increase the light extraction efficiency from the LED element 12, a transparent molding material 17 is molded in the reflection hole 14 of the LED mounting substrate upper plate 13 so as to cover the LED element 12. Here, since the LED element 12 has a short wavelength, the transparent mold material 17 is made of a material such as a light-resistant silicone resin or glass. Although the LED element 12 may be in a bare state, the light extraction efficiency can be increased by such a configuration.

  Although the LED substrate 10 is a glass epoxy substrate and does not hinder the function as a light emitting device, it is a metal substrate in order to enhance the heat dissipation of the heat generated by the LED element 12 as described above. As another heat dissipating substrate, a high heat conductive film substrate bonded to a metal plate or a ceramic material may be used.

  Here, the LED element 12 does not specify a light emitting type such as a face-up type or a flip chip type. For the purpose of improving the overall reflectance in the reflection hole 14, the surface insulating layer on the LED substrate 10 which is a metal substrate is applied with a highly reflective paint or the like.

In addition, as a structure similar to the LED mounting substrate 4 of a present Example, there exist the commercially available LED package which uses as a main material the ceramics with which the LED board and the LED board upper plate were integrated, and highly heat conductive resin. This light-emitting device can obtain the same effect as that of this embodiment without losing its essential function even when such a commercially available package is used for the light-emitting portion.
Here, the reflection hole 14 and the commercial package reflection hole of the present embodiment are highly reflective to the short wavelength light emitted by the LED, and the surface of the LED board upper plate 13 and the commercial package surface are converted by the wavelength conversion unit. By using a member having a high reflectivity with respect to the converted wavelength light, a light emitting device with high light emission efficiency with little light loss at those portions can be obtained.

  For example, as shown in FIG. 5, the wavelength converter 3 has three types of mixed fluorescence each having a blue emission spectrum S2, a green emission spectrum S3, and a red emission spectrum S4 that emit light using the short wavelength LED emission spectrum S1 as an excitation spectrum. Configure as a body. With this configuration, white light emission is realized. However, when the phosphors are mixed, the mixing ratio of the three kinds of phosphors is realized at such a ratio that the luminous efficiency is enhanced and the color rendering property is enhanced.

  By configuring the wavelength conversion unit 3 in such a configuration, white light is emitted using a conventional blue light emitting LED element and a YAG phosphor (yttrium, aluminum, garnet phosphor) that is excited by the wavelength and emits yellow light. Compared with the method to realize, since the spectral component of the emission spectrum is continuous in the converted light region, it is possible to obtain a light emitting device with high color rendering.

However, the short wavelength LED that constitutes the light emitting device emits ultraviolet light, near ultraviolet light, purple, or blue light, and the above contents do not limit the realization by the blue light emitting LED and the YAG phosphor. In addition, when short-wavelength LED light uses ultraviolet light or near ultraviolet light having a purple or blue-violet light color, the phosphor types excited by them have multiple emission colors including blue, green, and red Exists. Therefore, depending on the selection and combination, it is possible to obtain an arbitrary light color other than white, for example, by selecting one having a narrow spectrum in S2, S3, and S4 in FIG. A light-emitting device with a wide possible color reproduction range can also be obtained.

In addition, when the short wavelength LED emission wavelength is configured to be near ultraviolet light emission having a purple or blue-violet light emission wavelength (about 360 to 430 nm), in general, in the wavelength region as compared with that emitting ultraviolet light. Although the phosphor excitation efficiency is low, the LED element 12 has a feature that the self-light absorption is small and the light emission efficiency is high. Therefore, it is possible to obtain a light-emitting device that maintains high luminous efficiency by using a near-ultraviolet LED, has little deterioration of members as in the case of using ultraviolet light, and has little adverse effect on the surface of a living body. Furthermore, since there are many phosphors having an excitation band in this wavelength region as described above, there is an advantage that the emission color can be arbitrarily designed.

  In general, the LED element 12 causes a decrease in light emission efficiency when the element internal temperature or the ambient temperature becomes high. However, when the light emitting device is used as a lighting device, the light emitting surface of the light emitting device is used downward. In many cases, the configuration of the present invention in consideration of heat dissipation functions effectively with respect to LED light emission efficiency and device lifetime.

  In particular, the substrate support plate 5 is made of a heat conductive material such as a metal, and one side provided on the back surface of the housing 2 is brought into contact with a high heat conductive member 40 configured to be placed in the air, whereby an LED element is obtained. The heat radiation property can be enhanced by securing a heat radiation path for the heat generated from 12. As the heat conductive material, for example, aluminum, copper, metal ceramics or the like having high heat conductivity is used.

  As shown in FIG. 2, at least one end on the short side of the substrate support plate 5 is configured to be in contact with the side surface 2a4 of the concave portion on the inner side of the housing 2 (point A on the dotted line in FIG. 2). Even when used as a side light-emitting device, since a heat radiation path along the substrate support plate 5 can be secured, a high heat radiation effect can be obtained.

In this configuration, short wavelength light is radiated as excitation light from the LED elements 12 of the LED mounting substrate 4 attached to both surfaces of the LED substrate support plate 5 erected at the center of the recess of the housing 2, and the recess of the housing 2. The converted light emitted by the wavelength conversion unit 3 provided on the reflective surface 2 a of which the wavelength is converted is emitted via the translucent plate 1.
At this time, heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the substrate support plate 5, and the high thermal conductivity member 40.

As described above, the casing 2 having the reflection surface 2a provided with the wavelength conversion section 3 that emits the converted light by the short wavelength light of the LED element 12 in the recess, and the central portion of the bottom surface of the recess of the casing 2 Since the LED mounting substrate 4 provided with the provided thermally conductive LED substrate supporting plate 5 and the LED elements 12 mounted on both sides of the LED substrate supporting plate 5 is attached, the heat dissipation of the LED mounting substrate 4 can be improved. In addition, even when a high-power LED mounting substrate composed of a plurality of LED elements is used, an increase in LED element temperature can be suppressed, and as a result, a large luminous flux light emitting device with high efficiency and long life can be obtained. The effect of the present invention is also effective when there is a single LED element.
Furthermore, although there is a large current drive type and a large light output type that have been recently developed as LED elements, it is possible to incorporate LED elements (high power elements) that generate a large amount of heat in a correlated manner.

  In the present embodiment, the high thermal conductivity member 40 is attached to the back surface of the housing 2 so as to be in contact with the substrate support plate 5, but at least the substrate support plate 5 is attached without attaching the high thermal conductivity member 40. You may make it comprise the center part of the recessed part bottom face of the housing | casing 2 with a highly heat conductive member.

  Further, as shown in FIG. 6, by providing a heat radiating member such as the heat radiating fins 24 instead of the high heat conductive member 40 in contact with the end portion of the substrate support plate 5, a heat radiating effect can be further provided. Further, although the case 2 is an example in which the case 2 is formed of a metal plate, since the heat from the substrate support plate 5 is transmitted to the heat radiating fins 24, the constituent material of the case 2 as shown in FIG. A metallic material may be used.

  Moreover, it is good also as a structure which contacts the edge part of the LED board support plate 5 similarly to the radiation fin 24 using a heat pipe or a Peltier element as a member which gives a high thermal radiation effect other than the radiation fin 24.

  Further, as shown in FIG. 31, the board mounting portion 5a of the board support plate 5 may be configured such that the LED mounting board 4 is positioned obliquely upward with respect to the reflecting surface 2a. With this configuration, it is possible to prevent the light source image of the LED element 12 from being directly visible from the front side of the translucent plate 1. Further, as shown in FIG. 32, the LED board mounting portion 5a of the LED board support plate 5 may be formed in an inverted triangle shape, and the back surface of the LED mounting board 4 is thick, so that the heat dissipation effect can be improved. In this configuration, the inverted triangular surface (upper side in the figure) of the LED board mounting portion 5a is preferably a high-reflectivity reflecting surface, and may be in contact with the translucent plate 1.

  Moreover, you may make it the form comprised with a thin metal plate like FIG. 7 instead of the thick housing | casing 2 as shown in FIG. 1, FIG. In FIG. 7, in addition to the housing 2, the reflection unit 29 on which the wavelength conversion unit 3 is installed is formed of the same metal plate. Moreover, the heat dissipation effect can be enhanced by supporting the substrate support plate 5 made of a high thermal conductivity material with the LED support plate restraint 41 and attaching it to the metal housing 2. Further, by mounting a high heat radiating member such as the heat radiating fin 24 on the back surface of the housing 2, the heat radiating characteristics can be further improved.

Furthermore, as a result of improving the heat dissipation of the LED element 12, the wavelength shift peculiar to the LED can be suppressed to a considerably low range. As a result, even when a plurality of phosphors are used, the emission spectrum fluctuation is extremely reduced and stable light emission is achieved. It is possible to obtain a color.

  In addition to providing the wavelength conversion unit 3 directly on the reflection surface 2a of the concave portion of the housing 2, the wavelength conversion unit 3 is applied in advance on a flexible wavelength conversion material addition sheet 25 as shown in FIG. Alternatively, it may be a method of adhering it to the reflecting portion 29. With such a configuration, when the wavelength conversion unit 3 is applied directly, the shape of the reflection surface 2a and the reflection unit 29 is complicated, so that the uniformity of the coating film thickness deteriorates. Can be eliminated. Further, the manufacturing method is simple and the luminous efficiency can be increased.

At this time, as shown in FIG. 33, the wavelength conversion unit 3 includes the single or plural kinds of phosphors 60 as the main constituent materials in a binder 61 that fixes them. The binder main material is, for example, resin or water, but is selected on the assumption that it does not cause a chemical change between the phosphor and the optical function. In the present embodiment, it can be formed of, for example, a silicone material that is excellent in workability, weather resistance, and translucency, and has shape flexibility that can correspond to the reflecting surface 2a of the curved recess.
Further, the surface of the wavelength conversion material adding sheet 25 is made of at least a mirror surface or a diffusive material having a high reflectivity with respect to the short wavelength light emitted from the LED element 12. With such a configuration, the light (UV11) that has once passed through the wavelength conversion unit 3 is efficiently reincident (UV12) on the surface of the wavelength conversion material addition sheet 25, and the wavelength conversion opportunity is once again. As a result, it is possible to improve the wavelength conversion efficiency. At this time, if the surface reflectance of the wavelength conversion material addition sheet 25 is a material having a high reflectance with respect to the light after wavelength conversion, the light whose wavelength is converted in the binder can be efficiently reflected toward the inside of the apparatus. Therefore, it is possible to obtain a light emitting device with high luminous efficiency. In addition, as the wavelength conversion material addition sheet | seat 25, the sheet | seat by multilayer structure, such as PET, aluminum, silver, can be used, for example.

The same effect can be obtained by forming at least the portion where the wavelength conversion unit 3 is laid with a high reflectivity material when providing the wavelength conversion unit 3 directly on the reflection surface 2a of the concave portion of the housing 2. . This high reflectivity material may be the same material as the housing, or may be formed on the housing 2 by metal deposition such as aluminum or silver or metal plating.
Further, the wavelength conversion unit 3 of the light emitting device may be one in which the binding material mixed with the phosphor is directly applied or sprayed on the arrangement part of the wavelength conversion unit 3, or the phosphor is vapor-deposited. In this case, in the same manner as described above, a light emitting device having high luminous efficiency can be obtained by forming at least the arrangement portion of the wavelength converting portion 3 with a high reflectance material.

Further, as shown in FIG. 7, an LED emission light reflecting portion such as a filter or a vapor deposition film that reflects the emission wavelength portion of the LED element 12 and transmits light in other wavelength regions on the inner back surface of the translucent plate 1. 26 can be used as a member that contributes to the light emission from the wavelength conversion unit 3 again without directly emitting the emitted light of the LED element 12 to the outside, so that the light emission efficiency can be increased. Become.
Regardless of the presence or absence of the LED emission light reflecting portion 26, the surface of the casing 2 is completely closed by the translucent plate 1, and nitrogen gas is sealed inside the casing 2 or a vacuum state is provided. It is good also as a structure which raises. In addition, the translucent plate 1 has a function of improving contact protection and weather resistance to components inside the apparatus, but depending on use conditions, the translucent board 1 may not be necessarily mounted by realizing the basic function of the light emitting apparatus.

  In addition, the light distribution can be arbitrarily changed by using the lens system 27 in the opening of the housing 2. The lens is made of light-resistant optical glass or silicone material, and the shape of the lens is changed depending on the purpose, such as convex or concave (the figure shows the light collected in the center of the device to some extent) ).

  Further, for example, by installing a highly reflective diffuse reflective mask 28 on the substrate support plate 5, it is possible to eliminate the image of the light source of the LED element 12 when viewed from the light emitting surface side, and diffuse reflection. The image of the sex mask 28 itself can also be weakened.

1, 6, and 7, the shape of the concave portion of the housing 2 is curved, but the shape of the concave portion may be flat, for example, and the function of the light emitting device is lost due to the shape of the concave portion. There is no. As an example, FIG. 34 shows a configuration diagram when the bottom surface and the side surface of the recess are made flat, and FIG. 35 shows a configuration when the bottom surface of a part of the recess is made flat and the side surface is curved.
The reflecting surface 2a is preferably a paraboloid, but at least a part of the paraboloid may be replaced with a plane that is approximately approximate to the paraboloid, thereby improving workability.
In the above description, the substrate support plate is described as a single component, but it may be integrated with the heat conductive casing 2 or a metal plate provided under the reflecting surface of FIG. The heat dissipation function is maintained in the same way as in the configuration.

Embodiment 2. FIG.
FIG. 8 is a cross-sectional view of the light emitting device (cross section B of FIG. 9) showing Embodiment 2 of the present invention, and FIG. 9 is a top view of the light emitting device.
8 and 9, the same or corresponding parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
High heat conductive members 40 are attached to two opposite sides of the opening edge of the housing 2 so as to protrude inward so that the side faces the reflecting surface 2a2 at the bottom of the recess. The reflective surface 2a2 at the bottom is a flat surface, and the opposite side surface 2a3 to which the high thermal conductivity member 40 is attached is formed to extend outward from the reflective surface 2a2 at the bottom toward the opening, and the other opposed side surface 2a4 is the bottom. Is formed perpendicular to the reflective surface 2a2.
Then, the LED mounting substrate 4 is attached to the inner surface side of the high thermal conductivity member 40 with the light emitting surface of the LED element facing the reflecting surface 2a2 on the bottom surface of the recess.

  In this configuration, the light emitted from the LED element 12 of the LED mounting substrate 4 is converted into excitation light, and the second light emitted by the wavelength conversion unit 3 provided on the reflection surface 2a of the concave portion of the housing 2 is converted. Radiated via the light plate 1. At this time, the heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the substrate support plate 5, the high thermal conductivity member 40, and the radiation fins 24.

As described above, the high thermal conductivity member 40 attached to the inner side of the opening edge of the housing 2 with the inner surface facing the reflecting surface 2a2 of the bottom of the recess, and the light emitting surface of the LED element 12 facing the reflecting surface 2a2 of the bottom. Since the LED mounting substrate 4 is attached, the image of the light source of the LED element 12 can be prevented from being directly seen from the front side of the translucent plate 1, and the wavelength conversion unit 3 is the same as that of the first embodiment. White light emission can be obtained with the same configuration.
Moreover, the heat dissipation of the LED mounting board | substrate 4 can be improved, and the luminous efficiency fall of LED element 12 itself and a lifetime shortening can be prevented.

In the present embodiment, the LED mounting substrate 4 has two sides facing each other at the edge of the opening of the housing 2, but may be provided on four sides as shown in FIG. Further, although the bottom surface of the concave portion of the housing 2 is flat, it may be curved, for example, and this does not affect the light emitting function. FIG. 36 shows a side view in that case.
Moreover, although the recessed part of the housing | casing 2 was made into the quadrilateral top view, it is good also as a circle.
Further, as shown in FIG. 11 (cross-sectional view B in FIG. 12) and FIG. 12, heat radiation fins 24 may be provided on the back surface of the high thermal conductivity member 40 to further obtain a heat radiation effect.
Further, in the present embodiment, the high thermal conductivity member 40 that supports the LED mounting substrate 4 is attached to the opening edge of the housing 2, but instead of attaching the portion of the high thermal conductivity member 40, at least this portion is heated to high temperature. You may make it comprise with a conductive member.
Further, the substrate support plate may be integrated with a thermally conductive casing, and in that case, the heat dissipation function is maintained as in the case of a single component configuration.

Embodiment 3 FIG.
FIG. 13 is a cross-sectional view of the light emitting device (cross section B of FIG. 14) showing Embodiment 3 of the present invention, and FIG. 14 is a top view of the light emitting device. 13 and 14, the same reference numerals are given to the same or corresponding parts as in FIG. 1 of the first embodiment, and the description thereof is omitted.
The reflective surface 2a of the concave portion of the housing 2 is composed of a ridge line portion 2a1 at the center and two parabolic reflective surfaces 2a2 having troughs on both sides along the ridge line portion 2a1, and the ridge line portion 2a1. The LED mounting substrate 4 is attached to the opposite side surfaces 2a3 parallel to each other with the light emitting surface of the LED element 12 facing the reflecting surface 2a2.
A high heat radiating member such as a heat radiating fin 24 is attached to the back surface of both side surfaces 2 a 3 of the housing 2. Further, a diffuse reflective mask 28 is provided so as to project inwardly at the edge of the opening surface of the housing on the light extraction side so that the image of the light source of the LED element 12 cannot be seen directly.

  In this configuration, the light emitted from the LED element 12 of the LED mounting substrate 4 is excited by using the wavelength converted portion 3 provided on the reflecting surface 2a2 of the concave portion of the housing 2 as the second light (white color). Light) is emitted via the translucent plate 1. At this time, the heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the side surface 2 a 3 of the housing 2, and the radiation fins 24.

As described above, the reflecting surface 2a of the concave portion of the housing 2 is formed from the reflecting surface 2a2 composed of the central ridgeline portion 2a1 and two bowl-shaped paraboloids having valleys on both sides along the ridgeline portion 2a1. The LED mounting substrate 4 is attached to the opposite side surfaces 2a3 parallel to the ridge line portion 2a1 with the light emitting surface of the LED element 12 facing the reflecting surface 2a2, respectively, and the radiation fins 24 are attached to the side surfaces 2a3. Therefore, since the heat generated from the LED element 12 is radiated into the air through the radiation fins 24 on the side surface of the housing 2, the luminous efficiency of the LED element 12 can be kept high and the life of the LED element 12 can be increased. Can be long.
Further, since the diffuse reflection mask 28 is provided at the edge of the opening surface, the image of the light source of the LED element 12 when viewed from the light emitting surface side can be eliminated.

  Note that at least both side surfaces 2a3 of the concave portion of the housing 2 to which the LED mounting substrate 4 is attached may be formed of a high thermal conductivity member without mounting the heat dissipation fins 24, and the heat dissipation fins 24 may be mounted to further dissipate heat. The effect may be enhanced.

  Moreover, as shown in FIG. 15 (FIG. 16B cross section) and FIG. 16, the opening part of the same magnitude | size as the LED mounting board | substrate 4 is provided in the part to which the LED mounting board | substrate 4 of the both-sides 2a3 of the recessed part of the housing | casing 2 is attached, The LED mounting substrate 4 may be in direct contact with the air through the opening so as not to leak light from the housing recess, and the heat dissipation characteristics may be improved. At this time, it is possible to further improve the heat dissipation characteristics by providing the heat dissipation fins 24 on the back surface of the LED mounting substrate 4.

  Further, the ridge line portion 2a1 of the housing recess provided with the wavelength conversion unit 3 of FIG. 13 is configured to be positioned above the center of the optical axis of the LED element 12 (C line in FIG. 13). The light emitted from the light can be efficiently irradiated onto the wavelength conversion unit, and high wavelength conversion efficiency can be obtained. In addition, even if the reflective surface comprised as a ridgeline part in FIG. 13 is a structure which has a plane part in the reflective surface like FIG. 37, a wavelength conversion function can be maintained.

  As shown in FIGS. 17 and 18, the concave portion of the housing 2 has a circular shape, and a reflective surface comprising a convex portion 2 a 5 at the center and a circular paraboloid formed along the outer periphery of the convex portion 1 a 5. 2a2 may be provided. With this configuration, the wavelength conversion efficiency and the light extraction efficiency can be improved. Moreover, the circular shape of the recessed part of the housing | casing 2 may be a polygonal shape near circular.

  The LED mounting substrate 4 may be a metal substrate or a ceramic substrate with high heat dissipation, but considering the ease of mounting on the housing 2, for example, a flexible substrate such as polyimide with high heat resistance. You may comprise. Furthermore, the heat radiation effect can be enhanced by attaching the heat radiation fins 24 to the back surface of the housing 2 as shown in FIG.

Embodiment 4 FIG.
19 is a cross-sectional view of the light-emitting device (cross-section B of FIG. 20) showing Embodiment 4 of the present invention, FIG. 20 is a top view of the light-emitting device, and FIG. 21 is a cross-sectional view of the light-emitting device (cross-section A of FIG. 20). is there.
19 to 21, the same or corresponding parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

The reflection surface 2a of the concave portion of the housing 2 is composed of a plurality of ridge line portions 2a1 having a plurality of ridge line portions 2a1 and a reflection surface 2a2 formed of a bowl-shaped paraboloid having a trough portion between the ridge line portions 2a1 and the ridge line portions 2a1. Both ends of each reflecting surface 2a2 in the direction of the ridge line 2a1 are supported by the side surface 2a3 of the housing. Then, the LED mounting substrate 4 is attached to the side surface 2a3 of the housing facing each other so that the optical axis of the LED element 12 mounted on the LED mounting substrate 4 passes between the reflecting surfaces 2a2 formed of paraboloids.
In this way, a plurality of curved stripes are formed so that the ridge line portion 2a1 is positioned between the LED elements 12 adjacent to each other along the light emission axis of the LED elements 12.

  In this configuration, the light emitted from the LED element 12 of the LED mounting substrate 4 is excited light, and the second light emitted by the wavelength conversion unit 3 provided on each reflection surface 2a2 of the recess of the housing 2 is converted in wavelength. Is emitted via the translucent plate 1. At this time, the heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the side surface 2 a 3 of the housing 2, and the radiation fins 24.

  As described above, the reflection surface 2a is composed of the plurality of ridge line portions 2a1 and the reflection surface 2a2 composed of a plurality of parabolic surfaces having valleys on both sides along the ridge line portion 2a1, and each of the reflection surfaces 2a2 Since the LED mounting substrate 4 is attached to the side surface 2a3 of the housing at each end with the light emitting surface of the LED mounting substrate 4 facing the reflecting surface 2a2, the light emitted from the LED element 12 in various directions is along the optical axis. The wavelength conversion can be performed within a limited range, and the wavelength conversion is performed in the wavelength conversion unit 3 in a state where there is no large light loss, so that the wavelength conversion efficiency and the light extraction efficiency from the light emitting device can be improved. it can.

Embodiment 5. FIG.
22 to 25 are cross-sectional views of a light-emitting device showing Embodiment 5 of the present invention.
22, FIG. 23, and FIG. 24 are replots of FIG. 6 of the first embodiment, FIG. 8 of the second embodiment, and FIG. 13 of the third embodiment, and FIG. 25 is the wavelength conversion unit 3 of FIG. It shows the size of.

  22 to 24, the reflection hole 14 reflection portion angle of the LED mounting substrate upper plate 13 shown in FIG. 4 of the first embodiment and the mold shape of the transparent molding material 17 are adjusted, as shown in FIGS. 22 to 24. The light distribution of the light emitted from the LED elements 12 of the LED mounting substrate 4 enters the recesses of the housing 2 as viewed from the LED elements 12 (entering an angle δ or less from the optical axis of the LED elements 12 in the figure). And so on.

  By setting it as such a structure, it becomes possible to irradiate the light-emission light from the LED element 12 to the wavelength conversion part 3 efficiently, and an efficient light-emitting device is realizable.

Furthermore, as shown in FIG. 25, the portion occupied by the wavelength conversion unit 3 provided on the reflection surface 2a of the concave portion of the housing 2 is configured to match the range (irradiation angle β) irradiated with the emitted light of the LED element 12. To do.
With this configuration, the area of the wavelength conversion unit 3 can be reduced, the cost of the wavelength conversion unit can be reduced, and the apparatus can be made inexpensive.

  At this time, it is possible to maintain high light emission efficiency by making the reflecting surface 2a to which the wavelength conversion portion material is not applied in a highly reflective state. The reflection surface 2a may be made of a specular reflection material such as aluminum. However, if the reflection surface 2a is made of a white material having a high diffuse reflection property, it is difficult to recognize the boundary between the wavelength converter 3 and the reflection surface 2a when viewed from the light emitting surface side. A light-emitting device with good appearance can be obtained.

Embodiment 6 FIG.
26 and 28 to 30 are sectional views (sectional view of FIG. 27A) of a lighting fixture using the light emitting device according to Embodiment 6 of the present invention, and FIG. 27 is a top view of FIGS. 26 and 28 to 30.
In the present embodiment, the light emitting device shown in Embodiments 1 to 3 is used, and each of the four light emitting devices is used to form a bottom-open luminaire having the simplest configuration.

  26-30, it has the lighting device 52 for lighting the light-emitting device 51 in the upper part of a lighting fixture, and can supply commercial power to the lighting device 52 via the power supply input part 53 of a lighting fixture, The power for lighting the LED element 12 is supplied to the power input unit provided in the light emitting device 51 via the lighting device 52. Four light emitting devices 51 are arranged in four directions from the center.

  FIG. 26 uses the light emitting device 51 of the first embodiment, and the high heat conductive member 40 made of metal or the like of the light emitting device 51 is directly attached to the lighting fixture housing 50 of the lighting fixture or a high thermal conductive seal. It is installed through etc.

  In such a configuration, heat generated from the LEDs of the light emitting device 51 is radiated to the lighting fixture housing 50 via the LED mounting substrate 4, the substrate support plate 5, and the high thermal conductivity member 40.

FIG. 28 shows a case where the light emitting device 51 of Embodiment 1 with the radiation fins 24 mounted thereon is applied to a lighting fixture. The radiating fin 24 of the light emitting device 51 is configured to directly touch the air in the mounting portion of the light emitting device 51 of the lighting fixture.
By adopting such a configuration, it is possible to cool the upper part of the lighting fixture by convection and further improve the heat effect.

FIG. 29 shows the use of the light emitting device 51 to which the high thermal conductivity member 40 is attached in the second embodiment, and the high thermal conductivity member 40 of the light emitting device 51 is directly or highly heated to the lighting fixture housing 50 of the lighting fixture. It is installed through a conductive seal.
In such a configuration, heat generated from the LED of the light emitting device 51 is radiated to the lighting fixture housing 50 via the LED mounting substrate 4 and the high thermal conductivity member 40.

FIG. 30 shows a third embodiment in which a light emitting device 51 to which a high thermal conductivity member 40 is attached is used instead of the radiation fin 24, and the LED mounting substrate 4 of the housing 2 of the light emitting device 51 is attached. The part is installed directly on the lighting fixture housing 50 of the lighting fixture or through a high thermal conductive seal.
In such a configuration, heat generated from the LEDs of the light emitting device 51 is radiated to the lighting fixture housing 50 via the LED mounting substrate 4 and the high thermal conductivity member 40 of the housing 2.

As described above, the temperature rise of the LED element 12 can be suppressed, and a lighting device with high luminous efficiency and long life can be obtained.
Further, the illumination light can be obtained by mixing the light as part of the light emitted from the light emitting device 51 and the other part as the light reflected by the reflecting plate 56.
At this time, the reflecting plate 56 is preferably made of a highly reflective material from the viewpoint of improving the illumination efficiency, and may be a diffusing surface or a mirror finish depending on the intended lighting application.

Embodiment 7 FIG.
FIG. 38 is a cross-sectional view of the light emitting device (cross section B of FIG. 39) showing Embodiment 7 of the present invention, and FIG. 39 is a top view of the light emitting device. 38 and 37, the same or corresponding parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Similar to the first embodiment, the LED mounting substrate 4 on which the LED element 12 that emits short-wavelength light is mounted, and the reflection surface 2a in which the wavelength conversion section 3 that emits converted light by the short-wavelength light of the LED element is provided in the recess. And a housing having
Here, the reflective surface 2a is formed of a parabolic surface formed to face the LED mounting substrate 4, and the LED substrate 4 faces the light emitting surface of the LED mounting substrate 4 toward the reflective surface 2a on one side surface inside the housing recess. To be installed. In such a light emitting device in which the LED mounting substrate 4 is provided on one side in the housing 2, the LED mounting substrate 4 side (radiation fin 24 side) is on the upper side in addition to using the transparent plate 1 facing downward. Even in the usage method in which the transmissive plate 1 is directed sideways, the heat generated by the LED element 12 can be radiated upward along the housing, and a light emitting device with good heat dissipation and high light emission efficiency can be obtained. It is possible to obtain.

At this time, by limiting the maximum light distribution angle of the LED light emission within the reflection surface 2a as shown by the maximum light distribution angle δ in FIG. 38, the wavelength conversion of the LED light that becomes the wavelength converter primary excitation light is efficiently performed. It is possible to irradiate the unit 3 and to realize a light emitting device with high luminous efficiency. 40, even if a light reflection mask 62 having a mirror-like surface or a diffusive surface having a high reflectance is used, the ratio of the LED emission light directly incident on the translucent plate 1 is lowered. Thus, a light emitting device with high luminous efficiency can be obtained. The light reflection mask 62 may be integrated with the housing. Further, the reflecting surface 2a of the concave portion may be constituted by a plane approximately approximate to a paraboloid as shown in FIG. 41, for example, or may be constituted by a paraboloid and a plane portion as shown in FIG. It is possible to realize a conversion function.

43 (cross section B in FIG. 44), the wavelength conversion unit 3 is a single inclined member formed of a paraboloid formed facing the LED substrate 4 and provided at the opening edge of the housing recess. You may comprise so that the light emission surface of the LED mounting board | substrate 4 may be attached to the highly heat conductive member 40 toward the reflective surface 2a. 38 and 39, the transmissive plate 1 is used with the transmissive plate 1 facing downward, and the transmissive plate 1 is oriented sideways so that the LED mounting substrate 4 faces upward. A highly efficient light-emitting device can be obtained.
FIG. 45 shows an example in which the back surface of the LED mounting substrate 4 is composed of a thick high thermal conductive member 54, and a high heat dissipation effect can be obtained. Here, as shown in FIG. 45, the wavelength conversion unit 3 may be disposed also on the side surface on the light source installation side.

  43 and 45 show the case where the reflecting surface 2a is a paraboloid, but at least a part of the paraboloid of the paraboloid may be replaced with a plane that approximates the paraboloid, Depending on the mounting position of the LED mounting substrate 4, the bottom may be a flat surface, or it may be composed of a paraboloid and a flat surface to improve workability.

  Further, as shown in FIG. 46, a recess is provided in a part of the bottom surface inside the housing 2, and the wavelength conversion unit 3 is disposed in the recess, and at least the LED element 12 on the translucent plate 1 side from the LED optical axis. A light emitting device with high luminous efficiency can also be obtained by adopting a configuration in which the angle δ of the maximum light distribution falls within the region. Further, by reducing the light distribution angle and reducing the wavelength conversion region, a light emitting device that is inexpensive in cost can be obtained.

In addition, the light emitting device 51 having the configuration shown in the present embodiment is incorporated in a lighting fixture housing 50 that enhances the heat dissipation of the light emitting device as shown in FIG. It can be used as a high luminous flux luminaire. Even in the case of a rectangular luminaire in which a plurality of the light emitting devices are arranged in the direction of the paper, the side surface of the device or the back surface of the housing is in contact with (contacted with) the luminaire housing 50 formed of a high thermal conductivity material as shown in the figure. Thus, the heat dissipation is ensured. At this time, since the light emitting device 51 can diffusively extract white light from the wide wavelength conversion section, it is possible to obtain a lighting fixture with reduced discomfort glare.
Further, as shown in FIG. 48 (showing a sectional view of the appliance), a plurality of light emitting devices 51 can be used as a lighting fixture arranged in a configuration that enhances heat dissipation, and a plurality of light emitting devices 51 can be arranged in the depth direction of the paper. A lighting device having a large luminous flux surface can be obtained. FIG. 48 shows an example in which an opening 50c is provided in a lighting fixture housing 50 made of a heat conductive material, and a light emitting surface (translucent plate 1) of the light emitting device is installed accordingly.

The lighting fixture housing 50 has a front opening 50a (light emitting surface surface of the lighting fixture) on the front surface, and an opening 50c into which the light emitting surface side of the housing 2 of the light emitting device 51 is inserted in the bottom 50b. The inner surface of the bottom 50b is covered with a highly reflective material, and the front opening 50a is covered with a diffuse transmission plate 63.
In addition, the standing part 50d is provided in the back side from the front opening part 50a, and makes it easy to fix while improving heat conduction with the lighting fixture housing | casing 50 and the light-emitting device 51. FIG. Further, it is desirable that there are no steps between the bottom 50b of the luminaire housing 50 and the surfaces of the light-transmitting plate 1 of the light emitting device.

In this configuration, the light emitted from the light emitting device 51 is radiated through the diffusing and transmitting plate 63, and the light reflected by the diffusing and transmitting plate 63 is a high reflectance material at the bottom 50 b of the luminaire housing 50. The light is reflected and radiated through the diffuse transmission plate 63.
Further, the heat generated from the light emitting device 51 is radiated from the housing 2 to the lighting fixture housing 50 via the standing portion 50 d of the lighting fixture housing 50.

Thus, the temperature rise of the LED element 12 can be suppressed, and a lighting device with high luminous efficiency and long life can be obtained.
Further, part of the illumination light is emitted from the light emitting device 51, and the other part of the light reflected by the high reflectivity material on the bottom 50b of the luminaire housing 50 is transmitted through the diffuse transmission plate 63 and emitted. Therefore, it can be made uniform, and a lighting apparatus with uniform illumination light can be obtained with high luminous efficiency.
Furthermore, by controlling the driving power of each light emitting device, it is possible to control the divided lighting of the light emitting surface. Moreover, it can also utilize for the lighting fixture of this structure as illumination light sources, such as a liquid crystal display device, for example.

Hereinafter, another configuration of the wavelength conversion unit 3 of the light emitting device will be described with reference to FIGS. 49, 50, and 51. 49 and 48 are cross-sectional views of the light-emitting device, and FIG. 51 is a plan view of FIGS.
The wavelength conversion unit 3 in FIG. 49 is configured with a high reflectance surface in the arrangement portion, and the surface of the wavelength conversion unit 3 is formed in an uneven shape. In a case having a fixed dimension due to such a structure, it is possible to secure a wide LED irradiation area on the surface of the case where the wavelength conversion unit 3 is configured to be flat, resulting in a highly efficient light-emitting device. Obtainable. Further, as shown in FIG. 50, the surface of the wavelength conversion unit 3 is configured to have an uneven shape, and the thickness of the fluorescence conversion unit can be made constant while increasing the LED irradiation area by the configuration in which the reflection surface 2a is formed in accordance with the shape. As in FIG. 49, it is possible to obtain a light emitting device with high luminous efficiency and at low cost.

The uneven shape of the wavelength conversion unit 3 may be a pyramid shape, for example, as shown in FIG. 51A, and a straight triangular wave shape (a dotted line is a ridge line and a solid line is a valley as shown in FIG. 51B). It may also be shown). Moreover, it is good also as a triangular wave shape of a curve like FIG.51 (c). In either case, the pitch of the inclined portion of the reflecting surface 2a is made smaller than that of the plane portion. In the case shown in FIG. 51 (c), when the number of the LED elements 12 is small, the distance between the concavo-convex shape portion and the LED elements 12 can be made equal, which is effective.
Further, the configuration of the wavelength conversion unit is not limited to the present embodiment, and the configuration can also be implemented in the wavelength conversion unit of the example described above.
For example, it is effective when used for the wavelength converter 3 shown in FIG. 46 of the seventh embodiment.

  As mentioned above, although this Embodiment showed the light-emitting device 51 and the lighting fixture using the same, even if it uses the light-emitting device 51 shown in this Embodiment for the lighting fixture shown in Embodiment 6, the same effect is shown. Can be obtained.

Claims (16)

  1. A plurality of LED mounting substrates on which LED elements emitting short wavelength light are mounted;
    A housing formed with a recess in which the LED mounting substrate is disposed;
    A reflective surface provided with a wavelength conversion unit that emits converted light by the short wavelength light of the LED element in the recess;
    A thermally conductive LED substrate support plate erected at the center of the bottom surface of the recess of the housing;
    With
    The reflective surface comprises a bowl-shaped paraboloid having trough portions parallel to both sides along the LED substrate support plate,
    The LED mounting substrate is attached to both surfaces of the LED substrate support plate so that the light emitting surface of the LED element faces the reflecting surface ,
    The light emitting device, wherein the surface of the LED mounting substrate is made of a high reflectance material for the short wavelength light emitted from the LED element and the converted wavelength light converted by the wavelength conversion unit .
  2.   The light emitting device according to claim 1, wherein at least a part of the radiation surface of the paraboloid constituting the reflecting surface is replaced with a plane substantially approximate to the paraboloid.
  3.   The light emitting device according to claim 1, wherein at least a portion of the housing to which the LED mounting substrate is attached is a heat conductive material.
  4.   The light emitting device according to any one of claims 1 to 3, wherein a radiation fin is attached to a back surface of the casing to which the LED mounting substrate is attached.
  5.   5. The light emitting device according to claim 1, wherein a light distribution angle of the light emitted from the LED element is an angle at which the light emitted is irradiated so as to enter a facing reflecting surface. .
  6.   6. A wavelength conversion material is provided only on a portion of a reflective surface irradiated with light emitted from an LED element, and a reflective material is provided on a portion of the reflective surface not irradiated with the emitted light. The light emitting device according to any one of the above.
  7.   A part or all of the short wavelength light is reflected on at least one surface of the translucent plate, and light including part or all of the converted light converted by the wavelength converter is transmitted. A light emitting device according to any one of claims 1 to 6, further comprising an LED light emitting light reflecting portion to be taken out.
  8.   The surface on which at least the wavelength conversion part of the reflection surface is disposed is formed of a high reflectivity material with respect to short wavelength light and wavelength converted light emitted from the LED element. Item 8. The light emitting device according to any one of Items 1 to 7.
  9.   A reflection sheet having a high reflectance with respect to at least short-wavelength light emitted from the LED element and wavelength-converted light is disposed on at least a surface of the reflection surface on which the wavelength conversion unit is disposed. The light-emitting device according to claim 1.
  10.   The light emitting device according to any one of claims 1 to 9, wherein the wavelength conversion part constituent material is a sheet-like material in which a phosphor is mixed in a translucent and shape-flexible resin.
  11.   The light emitting device according to claim 1, wherein a surface of the wavelength conversion unit is formed in an uneven shape.
  12. The light emitting device according to any one of claims 1 to 1 1, wherein the LED mounting substrate is one that is constituted by a high thermal conductivity material.
  13. The short-wavelength light purple or light emitting device according to any one of claims 1 to 1 2, characterized in that the light of the blue-violet.
  14. Luminaire, characterized in that the light-emitting device according to the luminaire to claim 1 to 1 3.
  15. The casing of the lighting fixture is made of a heat conductive material, and at least a part of the heat conductive member of the casing of the light emitting device is in contact with the casing of the lighting fixture. 4. The lighting apparatus according to 4 .
  16. The housing of the lighting fixture is formed in a box shape having a front opening at the front and an opening into which the light emitting surface side of the housing of the light emitting device is inserted at the bottom, and the surface of the bottom is a highly reflective material It consists luminaire of claim 1 5, wherein the front opening is characterized by being covered with a diffuse transmission plate.
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US8894240B2 (en) 2012-01-18 2014-11-25 Samsung Electronics Co., Ltd. Illumination device

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