JP2009147312A - White led device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a white LED light emitting device using a blue system LED chip capable of facilitating cooling the LED chip with a simple structure and of stably holding fluorescent body. <P>SOLUTION: A white LED light emitting device includes: a container with a recessed part; a blue system LED chip mounted on the bottom of the recessed part; an insulating liquid or sol layer filled into the recessed part to surround the blue system LED chip; and a transparent resin layer provided on top of the container for sealing the insulating liquid or sol layer in such a manner that the transparent resin layer is continuously in contact with the surface of the insulating liquid or sol layer. A fluorescent body is dispersed in the transparent resin layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention generally relates to a light emitting device, and more particularly, to a white LED light emitting device using an LED (light-emitting diode).

  White LED (light-emitting diode) light-emitting device is a high-efficiency light-emitting device using LED, and various applications such as high-efficiency lighting equipment and high-efficiency backlight light source for transmissive or projection liquid crystal display devices. Is expected. Since high-intensity blue LEDs have been put to practical use, white LED devices that use such high-intensity blue LEDs and convert generated blue light into white light using a phosphor have been proposed.

  Patent Document 1 describes a white LED light emitting device that generates blue light using such a blue LED chip and converts it into white light by a phosphor.

  In the white LED light emitting device of Patent Document 1, a blue LED chip is sealed in a resin layer in which a phosphor is dispersed, and blue light generated by the blue LED chip passes through the resin layer. In doing so, the phosphor is excited and conversion from blue light to white light occurs.

  On the other hand, in the white LED light emitting device of Patent Document 1, since the blue LED chip is sealed in the resin layer, it is caused by shrinkage that occurs when the resin layer is cured or heat generated by the LED chip during operation. As a result, stress is generated in the bonding wires constituting the chip and the electric wiring, resulting in a problem that the life of the apparatus is shortened.

  In particular, in the configuration of Patent Document 1, since the blue LED chip is sealed in the cured resin layer, the heat conduction characteristics are poor, and the temperature of the chip is likely to rise due to heat generation.

  On the other hand, Patent Document 2 discloses a configuration in which an LED chip is immersed in an insulating liquid in order to suppress deterioration of the LED chip due to thermal stress. In the configuration of Patent Document 2, phosphor powder is dispersed in the insulating liquid, and the wavelength of light emitted from the LED chip is converted by the phosphor.

  In this patent document 2, since the LED chip is immersed in the liquid, the heat generated in the LED chip during operation is quickly dissipated, and the LED chip does not deteriorate due to thermal stress. .

However, in the configuration of Patent Document 2, since the phosphor powder tends to precipitate in the liquid when the apparatus is left unattended, it is necessary to stir the liquid during the light emitting operation and disperse the phosphor powder in the liquid. There is. For this reason, in the configuration of Patent Document 2, a liquid stirring mechanism is provided. However, such a configuration is not only complicated and poor in reliability, but also has various problems such as an increase in configuration and consumption of extra power.
JP 2007-123946 A Japanese Patent No. 3656715 JP 2007-116109 A JP 2007-116124 A JP 2007-165937 A JP 2006-319371 A Japanese Utility Model Publication No. 63-84352 JP 2006-286999 A Special table 2007-533140 gazette

  According to one aspect, the present invention provides a container having a recess, a blue LED chip mounted on the bottom of the recess, an insulating liquid filled in the recess and surrounding the blue LED chip, or A sol layer and a specific gravity higher than that of the insulating liquid or sol, which is formed outside the insulating liquid or sol layer as viewed from the blue LED chip and seals the insulating liquid or sol layer. There is provided a white LED light emitting device comprising a small transparent resin layer, wherein phosphors are dispersed in the transparent resin layer. Here, the term “transparent resin layer” does not refer to organic substances widely, but refers to a general term for transparent plastics. Of these, it is transparent. In the present invention, as the “transparent resin layer”, a silicone resin, an epoxy resin, or a hybrid resin of silicone and epoxy can be used. However, the “transparent resin layer” in the present invention is not limited to these specific materials.

Here, “sol” refers to a colloidal solution, which means a dispersion system in which particles are dispersed in a liquid at a density of about 10 ⁻⁹ m to 10 ⁻⁶ m. As such a sol, for example, a material in which fine silica particles are dispersed in a chain structure of siloxane can be used. However, the present invention is not limited to such specific materials.

  According to another aspect, the present invention provides a blue LED chip, an insulating liquid or sol layer surrounding the blue LED chip, and a transparent resin layer sealing the insulating liquid or sol layer. A white LED, wherein a fiber holding a phosphor is provided in the insulating liquid or sol layer, or between the insulating liquid or sol layer and the transparent resin layer. A light emitting device is provided.

  According to another aspect, the present invention provides a step of mounting a blue LED chip on the bottom of a container having a recess, a step of performing electrical wiring on the blue LED chip with a bonding wire, and a blue LED in the recess. Filling an insulating liquid or sol so as to immerse the LED chip and the bonding wire, and forming a layer of the insulating liquid or sol; and an uncured resin material on the insulating liquid or sol layer The manufacturing method of the white LED device characterized by including the process of apply | coating and forming a non-hardened resin layer, and the process of hardening | curing the said non-hardened resin layer is provided.

  At that time, it is preferable that the step of filling the insulating liquid or sol and the step of applying the uncured resin material are performed by a screen printing method. Further, when the step of filling the insulating liquid or sol is performed, it is preferable to perform a vacuum deaeration step after that, and also when the step of applying the uncured resin material is performed, It is preferable to perform a vacuum degassing step.

  According to the present invention, a container having a recess, a blue LED chip mounted on the bottom of the recess, an insulating liquid layer or a sol layer filled in the recess and surrounding the blue LED chip, A transparent resin layer provided on the container and sealing the insulating liquid or sol layer in continuous contact with the surface of the insulating liquid or sol layer. By dispersing the phosphor in the resin layer, blue light emitted from the blue LED chip is converted into white light by excitation of the phosphor while passing through the transparent resin layer.

  In that case, according to the present invention, the phosphor is stably held in the resin layer and is not dispersed in the insulating liquid or sol layer, and therefore, in the insulating liquid or sol layer. In this case, the problem that the phosphor powder precipitates or aggregates does not occur. Therefore, in the present invention, it is not necessary to stir the insulating liquid or sol in which the phosphor powder is dispersed, the stirring mechanism can be omitted, the structure is simplified, the reliability is improved, and the power consumption is further reduced. Is done.

  Furthermore, according to the present invention, the blue LED chip is a blue LED chip in order to maintain closer thermal contact with the side wall surface defining the container recess and the insulating liquid or sol layer. The generated heat is not only dissipated by heat conduction to the substrate directly under the LED chip, but is also transported to the side wall surface by heat conduction and convection in the insulating liquid or sol layer. The cooling efficiency of the chip is improved and the lifetime is improved.

  In the present invention, the blue LED chip is in contact with the insulating liquid or sol layer, but the insulating liquid or sol has fluidity and does not harden like a resin. Even if the concavo-convex structure is formed on the light emitting surface, the concavo-convex pattern constituting the concavo-convex structure is completely immersed in the insulating liquid or sol, and an air layer is not formed therebetween. When such an air layer is present, a rapid refractive index of light emitted from the blue LED chip at the interface between the emitting surface of the LED chip and a bubble existing between the insulating liquid or sol layer. A part of the light is reflected by the change and returns to the LED chip, so that light loss is likely to occur. By forming such a concavo-convex structure, the light emission efficiency of the blue LED chip increases, and the light emission surface It is possible to reduce light loss due to reflection at the surface.

  In particular, the cooling efficiency of the blue LED chip can be greatly improved by using a fluorine-based liquid as the insulating liquid or the liquid constituting the sol layer.

  Further, by using a liquid having a heat resistant temperature of 250 ° C. or higher as the insulating liquid or the liquid constituting the sol layer, it becomes possible to mount such a white LED light emitting device on a substrate by a solder reflow process. The solder reflow process is generally performed at a temperature around 250 ° C. Such heat resistance is not necessary for a long time, and it is sufficient if it can be secured for several tens of seconds in the solder reflow process. As such a liquid, liquid silicone can be used.

The container can use a metal having high thermal conductivity such as Cu or Al, a ceramic having high thermal conductivity such as Al ₂ O ₃ , or a resin having high thermal conductivity such as PET resin.

  The resin layer is composed of a first layer that does not contain a phosphor and is in contact with the surface of the insulating liquid or sol, and a second layer that contains the phosphor on the first layer. Also good.

  In the present invention, since the insulating liquid or sol layer is provided so as to immerse not only the blue LED chip but also a bonding wire provided as an electric wiring on the LED chip, stress is applied to the bonding wire. It is possible to further extend the lifetime of the white LED light emitting device without being applied.

  According to the present invention, a white LED light emitting device is mounted on the bottom of a container having a recess, a step of mounting a blue LED chip, a step of performing electrical wiring on the blue LED chip with a bonding wire, Filling the insulating liquid or sol to form the insulating liquid or sol layer so as to immerse the blue LED chip and the bonding wire; and uncured on the insulating liquid or sol layer. On the insulating liquid or sol layer by a manufacturing method comprising a step of applying a sealing resin material, a step of vacuum degassing, and a step of curing the sealing resin material. When a cured encapsulating resin material is dropped, the uncured encapsulating resin material has a specific gravity difference from the insulating liquid or sol, that is, the uncured encapsulating resin material is more Since the specific gravity is smaller than that of the insulating liquid or sol, a desired white LED light-emitting device can be obtained by spreading in a layer form on the surface of the insulating liquid or sol and simply curing the uncured sealing resin material. Is possible.

  At that time, it is preferable that the step of filling the insulating liquid or sol and the step of applying the uncured resin material are performed by a screen printing method. Further, when the step of filling the insulating liquid or sol is performed, it is preferable to perform a vacuum deaeration step after that, and also when the step of applying the uncured resin material is performed, It is preferable to perform a vacuum degassing step.

  According to the present invention, the phosphor is provided in a state of being held by the fiber immersed in the insulating liquid or sol, so that the blue light emitted from the blue LED chip is refracted or scattered by the fiber. The white light converted by the phosphor can be extracted efficiently.

[First Embodiment]
FIG. 1 shows a configuration of a white LED light emitting device 10 according to a first embodiment of the present invention.

  Referring to FIG. 1, the white LED light emitting device 10 is mounted on a wiring board 1 carrying wiring patterns 2 and 3 via solder bumps 2A and 3A, and includes a mounting board 11 and the mounting board. 11, a container 13 made of a metal such as Cu or Al that defines a recess 13A together with the mounting substrate 11, and a blue LED chip 12 mounted on the mounting substrate 11 at the bottom of the recess 13A. Including.

  When viewed from a direction perpendicular to the mounting substrate 11, the recess 13 </ b> A has a square shape with a side of, for example, 7 to 8 mm, and a depth of, for example, 2 to 5 mm.

The mounting substrate 11 is made of a thermally conductive ceramic such as AlN or Al ₂ O ₃ and carries wiring patterns 11A and 11B on the upper surface thereof. The blue LED chip 12 is disposed on the mounting substrate 11 and on the lower portion thereof. An electrode (not shown) is surface-mounted so as to be electrically and thermally connected to the wiring pattern 11A, and an upper electrode (not shown) is connected to the wiring pattern 11B by a bonding wire 12A. In the present invention, as the blue LED chip 12, any LED chip including an element called a blue LED that emits ultraviolet to blue light having a wavelength of 350 to 480 nm can be used, and its structure, light emitting direction, chip The shape is not limited. In the following description, a case where an LED chip that emits blue light mainly in the vertical direction to the mounting substrate 13 is used as the blue LED chip 12 will be described. In such an LED chip that emits light vertically. However, emission of ultraviolet light or blue light to the side or downward has occurred. In the present invention, instead of the LED chip 12 that emits light vertically, an LED chip that emits light from the end face can be used as necessary.

  As an example, as the blue LED chip 12, it is possible to use a product such as a product name SL-V-B40AC commercially available from SEMILEDS, for example.

  A conductive pattern 11C connected to the wiring pattern 11A is formed on the lower surface of the mounting substrate 11, and the lower electrode of the blue LED chip is connected to the wiring pattern on the wiring substrate 1 via the solder bump 2A. 2 is electrically and thermally connected. Similarly, a conductor pattern 11D electrically and thermally connected to the wiring pattern 11B is formed on the lower surface of the mounting substrate 11, and the upper electrode of the blue LED chip is formed of the bonding wire 12A and the solder bump. It is connected to the wiring pattern 3 through 3A.

  A heat-resistant insulating liquid, such as silicone oil, is introduced into the bottom of the recess 13A so as to immerse the blue LED chip 12 and the bonding wire 12A, and the thickness is, for example, about 0.1 to 3 mm. An insulating liquid layer 14 made of a silicone oil is formed. The silicone oil preferably has a heat resistant temperature of 250 ° C. or higher. When the silicone oil using the heat resistant temperature of 250 ° C. or higher is used, the white LED light emitting device 10 is placed on the wiring board 1 at 250 ° C. The solder bumps 2A and 3A that require a certain temperature can be suitably mounted by reflow. However, since this reflow process is only performed for about 20 to 30 seconds, an insulating liquid having a lower heat-resistant temperature can be used as long as it can withstand this heat treatment.

  As said silicone oil, it is possible to use dimethyl silicone oil, methylphenyl silicone oil, etc. which are commercially available from Shin-Etsu Chemical Co., Ltd., for example.

Further, instead of the silicone oil, a sol (colloidal solution), for example, silica particles having a particle size of several nanometers to several tens of nanometers in a siloxane chain structure with a density of about 10 ⁻⁹ m to 10 ⁻⁶ m. It is also possible to use a commercially available sol as a trade name Optseal from Shin-Etsu Chemical Co., Ltd. dispersed in

  Further, in the white LED light emitting device 10 having the configuration shown in FIG. 1, the transparent resin layer 15 made of, for example, a silicone resin or an epoxy resin and having a phosphor dispersed therein is, for example, 0 on the insulating liquid layer 14 in the recess 13A. It is formed to a thickness of about 5 to 2 mm. The transparent resin layer 15 has a protruding portion 15A on its side surface, and is engaged with a corresponding cutout portion 13B (see FIG. 2A) formed on the side wall surface of the container 13. However, the formation of the notches 13B and 15A is not essential and can be omitted.

  Here, the “transparent resin layer” is not a general term for organic substances, but is a general term for plastics. In particular, the light transmittance in the visible light band is 95% or more. In the present invention, as the “transparent resin layer”, a silicone resin or an epoxy resin is used as described above, but a hybrid resin of silicone and epoxy can be used. As such a hybrid resin of silicone and epoxy, for example, a commercially available product from Shin-Etsu Chemical Co., Ltd. can be used. However, the “transparent resin layer” in the present invention is not limited to these specific materials.

  The resin layer 15 has a diameter of about 15 μm of YAG (yttrium aluminum garnet) or silicate phosphor material that is excited by purple to blue light emitted from the blue LED chip 12 and emits white light. The powder is dispersed at a density of, for example, about 2 wt%, and the violet to blue light having a wavelength of 350 to 480 nm emitted from the blue LED chip 12 passes through the resin layer 15 as white light. Is converted to

  In the white LED light emitting device of FIG. 1, since the blue LED chip 12 and the bonding wire 12A are immersed in an insulating liquid layer 14 such as silicone oil, the blue LED chip 12 is driven to generate heat. Even in this case, no stress is applied from the insulating liquid layer 14 to the blue LED chip 12 or the bonding wire 12A, and the deterioration of the LED chip 12 and the bonding wire 12A are avoided.

Further, in the white LED light emitting device 10 having the configuration shown in FIG. 1, since the insulating liquid layer 14 is a liquid, when the blue LED chip 12 is driven to generate heat, convection is generated in the insulating liquid layer 14. The generated heat is effectively transported to the side wall of the container 13. The heat thus transported to the side wall of the container 13 is partly radiated into the atmosphere, and part of the heat is transported to the mounting substrate 11 through the side wall and further acts as a heat spreader. It is escaped to the wiring board 1 through 2A. The side wall portion may be made of ceramic such as Al ₂ O ₃ or AlN having high thermal conductivity.

In this embodiment, the side wall of the container 13 is made of a metal having high thermal conductivity such as Cu or Al, and the mounting substrate 11 is also made of ceramic having high thermal conductivity such as Al ₂ O ₃ or AlN, and the blue color The heat generated in the LED chip 12 is quickly released to the wiring board 1. The bottom of the container 13 may be made of metal, ceramic, or a semiconductor package substrate material.

  At this time, in this embodiment, since the phosphor that converts purple to blue light generated in the blue LED chip 12 into white light is held in the solidified resin layer 15, as in Patent Document 2 A mechanism for stirring the liquid and a power source therefor are not necessary, and no extra power consumption occurs.

  In the above embodiment, since it is assumed that the white LED light emitting device 10 is mounted by reflow of the solder bumps 2A and 3A, silicone oil excellent in heat resistance is used for the insulating liquid layer 14, When the white LED light-emitting device 10 is used in an application where such heat treatment is not applied, the heat resistance is inferior, but a fluorine-based inert liquid superior in thermal conductivity, such as a commercial product from Sumitomo 3M It is also possible to use the name Florinato.

  When the configuration of FIG. 1 is compared with a configuration having the same size, but using a silicone resin instead of the insulating liquid layer 14, when continuously driven with an introduction power of 1.2 W, in the present invention, the above comparison is performed. It was confirmed that the temperature (bonding temperature) of the blue LED chip 12 decreased by 2.5 ° C. or more as compared with the control example.

  Next, a manufacturing process of the white LED light emitting device 10 of FIG. 1 will be described with reference to FIGS. However, in FIGS. 2A to 2E, the same reference numerals are given to the portions described above, and the description thereof is omitted.

  Referring to FIG. 2A, the blue LED chip 12 is surface-mounted in a recess 13A formed by a container 13 on the mounting substrate 11, and an upper electrode (LED) of the LED chip 12 (by a bonding wire 12A). (Not shown) is connected to the wiring pattern 11B on the mounting substrate 11.

  Next, in the step of FIG. 2B, silicone oil is dropped from the nozzle 210 into the recess 13A, and then a vacuum degassing step is performed in the step of FIG. 2C, thereby insulating the blue LED chip 12 and the bonding wire 12A. A conductive liquid layer 14 is formed. However, the vacuum degassing step in FIG. 2C may be omitted depending on the type of the insulating liquid.

  Next, in the step of FIG. 2D, uncured silicone resin or epoxy resin blended with the phosphor powder described above is dropped from the nozzle 310 on the insulating liquid layer 14 in the recess 13A. A cured resin layer 15m is formed. Since the uncured resin layer 15m has a specific gravity lighter than that of the insulating liquid layer 14 below, the uncured resin layer 15m spreads on the insulating liquid layer 14 in a dripped state, thereby forming the uncured resin layer 15m. The same applies when an uncured epoxy resin is used instead of the uncured silicone resin. The uncured resin layer 15m dropped in this way enters the cutout portion 13B formed on the side wall surface of the metal container 13 to form the engagement portion 15A. For example, when the specific gravity of 1.0 is used as the transparent resin layer, when the Optseal is used as the insulating liquid layer 14, or when using the commercial name Fluorinert available from Sumitomo 3M The specific gravity of the transparent resin layer 15 is smaller than the specific gravity of the insulating liquid layer 14. Optoseal has a specific gravity of 1.1, and Fluorinert has a specific gravity of 1.9. The specific gravity of the transparent resin layer 15 is not substantially different from the specific gravity of the uncured resin layer 15m.

  Further, when the recess 13A is filled with the uncured resin layer 15m, a vacuum deaeration process is performed in the process of FIG. 2E, and the insulating liquid layer 14 and the blue LED chip 12 in the insulating liquid layer 14 are processed. , The interface between the insulating liquid layer 14 and the uncured resin layer 15m, and the bubbles in the uncured resin layer 15m are removed.

  Further, in the step of FIG. 2F, the structure obtained in the step of FIG. 2E is heat-treated at, for example, 150 ° C., whereby the uncured resin layer 15m is cured and changed to the resin layer 15.

  Further, by mounting the structure of FIG. 2F on the wiring substrate 1, the device including the white LED light emitting device 10 described in FIG. 1 can be obtained. As described above, the specific gravity of the transparent resin layer 15 is not substantially different from the specific gravity of the uncured resin layer 15m.

  Although the case where the resin layer 15 is a silicone resin has been described above, another resin such as an epoxy resin can be used as the resin layer 15.

  In the present invention, the white LED light emitting device 10 can be formed by dropping and curing the resin layer containing the phosphor on the insulating liquid layer 14 in an uncured state. The manufacturing process is simplified. In particular, the resin layer 15m dropped in an uncured state in this manner fills the cutout portion 13B formed on the wall surface of the container 13, and the resin layer 15 formed by curing the resin layer 15m Even if a special bonding process or locking process is not performed, the insulating liquid layer 14 is covered and fixed, and problems such as liquid leakage of the insulating liquid layer 14 do not occur.

  In the present invention, the transparent resin layer 15 containing a phosphor can be disposed above the LED chip 12 and spaced apart from the LED chip 12. In this way, the phosphor is disposed on the LED chip 12. The light emitted from the phosphor does not return to the LED chip 12 and is not absorbed, and the amount of light beam emitted from the white LED light emitting device can be increased. It is. For example, in the white LED light emitting device of the present embodiment, when the LED chip 12 is driven with an input power of 1.2 W, the transparent resin layer 15 and thus the phosphor is separated from the LED chip 12 Compared with the case where the transparent resin layer 15 is in direct contact with the LED chip 12, the amount of light beam emitted from the white LED light emitting device is such that the phosphor is separated from the LED chip 12. Has been confirmed to increase by 10%.

[Second Embodiment]
FIG. 3 is a diagram illustrating in detail a state of an interface between the light emitting surface of the blue LED chip 12 and the silicone oil layer 14 in the white LED light emitting device 20 according to the second embodiment of the present invention. However, in the figure, the same reference numerals are assigned to portions corresponding to the portions described above, and description thereof is omitted.

  Referring to FIG. 3, the light emitting surface of the blue LED chip 12 has grooves and recesses having a depth of about 5 to 10 μm. The portions 12G are formed with a pitch of 2 to 3 μm, reduce the light loss on the light emitting surface of the LED chip, and further increase the light emission area.

  If such a groove portion 12G is filled with a resin layer, bubbles are likely to be trapped at the interface between the resin layer and the groove portion. For this reason, the emitted light is scattered by the trapped bubbles, resulting in an increase in light loss. .

  On the other hand, in this embodiment, the concavo-convex pattern constituting the groove 12G is in contact with the insulating liquid layer 14, and the insulating liquid layer 14 closely covers (immerses) the concavo-convex pattern. Air bubbles are not trapped at the interface between the pattern and the insulating liquid layer 14.

  That is, according to this embodiment, it is possible to reduce the light loss of the blue light emitted from the blue LED chip.

  Other features of this embodiment are the same as those of the previous embodiment, and a description thereof will be omitted.

[Third Embodiment]
FIG. 4A shows a configuration of a white LED light emitting device 30 according to a third embodiment of the present invention. However, in FIG. 4A, the same reference numerals are assigned to the portions corresponding to the portions described above, and the description thereof is omitted.

  Referring to FIG. 4A, in the present embodiment, another resin layer 16 in which another phosphor is dispersed is formed on the resin layer 15 in which the phosphor is dispersed. The locking portion 16A engages with a corresponding notch formed in the container 13. However, the formation of the locking portions 16A and the corresponding cutout portions is not essential and can be omitted.

  The resin layer 16 is formed on the resin layer 15 in the same manner as the resin layer 15 previously formed in FIGS. 2C to 2F, and the purple-blue light emitted from the blue LED chip 12 is the resin When passing through the layer 15, it is converted into light of another wavelength, and when passing through the resin layer 16, it is converted into white light.

  For this reason, in the present embodiment, a phosphor such as yellow, green, or red is dispersed in the resin layer 15, and a phosphor such as red, green, or yellow is dispersed in the resin layer 16.

  According to this configuration, an LED chip that emits ultraviolet light can be used as the blue LED chip 12.

  Even in such a configuration, similarly to the white LED light emitting device 10, cooling of the blue LED chip 12 is promoted, and the life of the LED chip 12 including the bonding wire 12A is improved. Further, since the phosphor is held in the cured resin layer 15, a mechanism for dispersing the phosphor in the liquid during the operation of the white LED light emitting device is unnecessary, the configuration is simplified, and the power consumption is also reduced. Is done.

  In the present embodiment, when a chip that generates ultraviolet light is used as the blue LED chip 12, the resin layers 15 and 16 are replaced with a resin layer having a three-layer structure, and green, Disperse red and blue phosphors.

  In the configuration of FIG. 4A, phosphors of different colors are dispersed in the resin layer 15 and the resin layer 16, but in this embodiment, the resin layers in which phosphors of different colors are dispersed are limited to two types. However, three or more resin layers may be laminated. For example, the resin layer 15 is composed of a plurality of resin layers 15a to 15d in which phosphors of different colors are dispersed, as shown in FIG. 4B, or the resin layer 16 has different colors as shown in FIG. 4C. The plurality of resin layers 16a to 16d in which the phosphors are dispersed can be used. As described above, the resin layer 15 or 16 is formed by stacking a plurality of resin layers in which phosphors of different colors are dispersed, so that the blue LED chip 1 has a variation in emission wavelength or emission luminance. However, it is possible to suppress the color variation of the white light caused by the variation, and the yield of the white LED light emitting device 10 can be improved. 4B to 4C, the same reference numerals are given to the parts described above.

[Fourth Embodiment]
FIG. 5 shows a configuration of a white LED light emitting device 40 according to the fourth embodiment of the present invention. However, in FIG. 5, the same reference numerals are assigned to portions corresponding to the portions described above, and description thereof is omitted.

  Referring to FIG. 5, the white LED light emitting device 40 of the present embodiment is a modification of the white LED light emitting device 10 described above with reference to FIG. 1, and is between the resin layer 15 and the insulating liquid layer 14. In addition, a transparent resin layer 17 containing no phosphor is interposed.

  That is, the transparent resin layer 17 is engaged and held in a corresponding notch (not shown) formed on the side wall of the container 13 by a locking portion 17A similar to the locking portion 15A. The However, the locking portion 17A and the corresponding notch are not essential and can be omitted.

  Even in such a configuration, similarly to the white LED light emitting device 10, cooling of the blue LED chip 12 is promoted, and the life of the LED chip 12 including the bonding wire 12A is improved. Further, since the phosphor is held in the cured resin layer 15, a mechanism for dispersing the phosphor in the liquid during the operation of the white LED light emitting device is unnecessary, the configuration is simplified, and the power consumption is also reduced. Is done.

  In the configuration of the present embodiment, a cured sheet is used as the resin layer 15, an uncured resin is used as the transparent resin layer, and the cured sheet is disposed on the uncured transparent resin layer 17. By curing the uncured resin layer 17, it is possible to realize excellent adhesion between the resin layer 17 and the resin layer 15. Also, by preparing a plurality of resin sheets containing phosphors of different colors at different concentrations, selecting a sheet optimal for the emission wavelength and emission luminance of the blue LED chip and combining it with the blue LED chip Even if there is a variation in the emission wavelength or emission luminance of the blue LED chip 12, it is possible to suppress the variation in the color of white light caused by the variation, and improve the yield of the white LED light emitting device 10. be able to.

[First Modification]
As shown in FIG. 6, in the white LED light emitting device 10 having the configuration of FIG. 1, the wiring patterns 11 </ b> A and 11 </ b> C on the mounting substrate 11 are formed as conductor films that continuously cover the back and front of the mounting substrate 11. By forming, the heat generated in the blue LED chip 12 can be more efficiently released from the mounting substrate 11 to the wiring substrate 1 via the solder bumps 2A.

[Second Modification]
FIG. 7 shows another modification of the white LED light emitting device 10 of FIG.

  Referring to FIG. 7, in the present embodiment, the bottom of the container 13 is also continuously formed of a metal constituting the side wall of the container 13, and the blue LED chip 12 is directly on the bottom. Has been implemented.

  In the configuration of FIG. 7, a substrate 11S corresponding to the mounting substrate 11 is provided on a part of the bottom, and the upper electrode of the blue LED chip 12 is connected to a wiring pattern on the substrate 11S via a bonding wire 12A. The wiring pattern 11D provided on the bottom surface of the substrate 11S is connected to the pattern 3 on the wiring substrate 1 via the solder bumps 3A.

[Third Modification]
FIG. 8 shows another modification of the white LED light emitting device 10 of FIG.

  Referring to FIG. 8, in the present embodiment, the blue LED chip 12 is surrounded by an insulator 12I such as polyimide formed by screen printing at the bottom of the container 13, and the insulator 12I is formed on the insulator 12I. A conductor pattern 12B formed by screen printing instead of the bonding wire 12A is formed as a wiring pattern.

  With this configuration, a wire bonding process is not necessary, and the manufacturing cost of the white LED light-emitting device can be further reduced. According to such a configuration, the heat radiation efficiency of the heat generated from the blue LED chip 12 is improved by using an insulating liquid or sol. Further, by forming the conductor pattern 12B by screen printing, the wiring width of the conductor pattern 12B can be increased, and the blue LED is compared with the case where the blue LED chip 12 is driven through an Au wire. The chip 12 can be driven with a large current.

[Fifth Embodiment]
FIG. 9 shows a configuration of a white LED light-emitting device 10B according to the fifth embodiment of the present invention.

  Referring to FIG. 9, the white LED light emitting device 10B is mounted on a wiring board 1 carrying wiring patterns 2 and 3 via solder bumps 22A and 23A, and includes a mounting board 31 and the mounting board. A container 33 made of a metal such as Cu or Al, which defines a recess 33A together with the mounting substrate 31, and a blue LED chip 32 mounted on the mounting substrate 31 at the bottom of the recess 33A. Including.

  When viewed from a direction perpendicular to the mounting substrate 31, the recess 33A has a square shape of, for example, 7 to 8 mm and a depth of 2 to 5 mm.

The mounting substrate 31 is made of a heat conductive ceramic such as AlN or Al ₂ O ₃ , and carries wiring patterns 31A and 31B on the upper surface thereof. The blue LED chip 32 is disposed on the mounting substrate 31 and on the lower portion thereof. An electrode (not shown) is surface-mounted so as to be electrically and thermally connected to the wiring pattern 31A, and an upper electrode (not shown) is connected to the wiring pattern 31B by a bonding wire 32A. The blue LED chip emits purple to blue light having a wavelength of 350 to 480 nm in a direction substantially perpendicular to the surface of the mounting substrate 21.

  A conductor pattern 31C connected to the wiring pattern 31A is formed on the lower surface of the mounting substrate 31, and the lower electrode of the blue LED chip is connected to the wiring pattern on the wiring substrate 1 via the solder bump 22A. 2 is electrically and thermally connected. Similarly, a conductor pattern 31D electrically and thermally connected to the wiring pattern 31B is formed on the lower surface of the mounting substrate 31, and the upper electrode of the blue LED chip is formed of the bonding wire 32A and the solder bump. It is connected to the wiring pattern 3 through 23A.

  As the blue LED chip 32, a product such as a trade name SL-V-B40AC commercially available from SEMILEDS can be used.

  A heat-resistant insulating liquid, such as silicone oil, is introduced into the bottom of the recess 33A so as to immerse the blue LED chip 32 and the bonding wire 32A, and the thickness is, for example, about 0.1 to 3 mm. An insulating liquid layer 34 made of a silicone oil is formed. The silicone oil preferably has a heat resistant temperature of 250 ° C. or higher. When silicone oil using such a heat resistant temperature of 250 ° C. or higher is used, the white LED light emitting device 10B is placed on the wiring board 1 at 250 ° C. The solder bumps 22A and 23A that require a certain temperature can be suitably mounted by reflow. However, since this reflow process is only performed for about 20 to 30 seconds, an insulating liquid having a lower heat-resistant temperature can be used as long as it can withstand this heat treatment.

  As said silicone oil, it is possible to use dimethyl silicone oil, methylphenyl silicone oil, etc. which are commercially available from Shin-Etsu Chemical Co., Ltd., for example.

  Moreover, it is also possible to use a sol instead of the silicone oil, for example, a commercially available sol from Shin-Etsu Chemical Co., Ltd. under the trade name Optseal.

  Further, in the white LED light emitting device 10B having the configuration of FIG. 9, a fiber member 36 made of fiber such as glass fiber and holding a phosphor is formed on the insulating liquid layer 34 in the recess 33A by the insulating liquid. A transparent resin layer 35 made of silicone resin or epoxy resin is formed on the fiber member 36 to a thickness of about 0.5 to 2 mm, for example. The transparent resin layer 35 has a protrusion 35 </ b> A on its side surface and engages with a corresponding notch 33 </ b> B (see FIG. 2A) formed on the side wall surface of the container 33. However, the formation of the protruding portion 35A and the cutout portion 33B is not essential and can be omitted.

  FIG. 10 shows the fiber member 36 in detail.

  Referring to FIG. 10, the fiber member 36 is a nonwoven fabric made of fiber 36F such as glass fiber, and is excited by purple to blue light emitted from the blue LED chip 32 between the fibers 36F and 36F. Then, a powder 36P having a diameter of about 15 μm of YAG (yttrium aluminum garnet) or silicate phosphor material that emits white light is held at a density of about 2 wt%, for example.

  Such a nonwoven fabric including the phosphor powder 36P is easily formed by filtering fibers such as glass fibers together with the phosphor powder 36P dispersed in a solvent. The said fiber member 36 is formed by laminating | stacking such a nonwoven fabric individually or as needed. By providing such a fiber member containing the phosphor powder 36P, purple-blue light having a wavelength of 350 to 480 nm emitted from the blue LED chip 32 passes through the fiber member 36. , Converted to white light.

  In the white LED light emitting device 10B of FIG. 9, the refractive index of the fiber 36F is about 1.5 when quartz glass or silicate glass fiber such as borate glass is used. Therefore, by using a liquid having an equivalent refractive index, for example, silicone oil, as the insulating liquid 34, it is possible to substantially completely remove the effects of light refraction and scattering by the fiber 36F. Thereby, in the white LED light-emitting device 10B of FIG. 9, high light transmittance is realizable. Further, when glass fiber or the like is used as the fiber 36F, the heat resistance temperature of the fiber 36F is about 500 ° C., so that the white LED light-emitting device 10B is also affected when mounted on the wiring board 1 by solder reflow. I do not receive it.

  In the white LED light emitting device of FIG. 9, since the blue LED chip 32 and the bonding wire 32A are immersed in an insulating liquid layer 34 such as silicone oil, the blue LED chip 32 is driven to generate heat. Even in this case, no stress is applied from the insulating liquid layer 34 to the blue LED chip 32 or the bonding wire 32A, and the deterioration of the LED chip 32 and the bonding wire 32A are avoided.

Further, in the white LED light emitting device 10B having the configuration of FIG. 9, since the insulating liquid layer 34 is a liquid, when the blue LED chip 32 is driven to generate heat, convection is generated in the insulating liquid layer 34. The generated heat is effectively transported to the side wall of the container 33. The heat thus transported to the side wall of the container 33 is partly radiated into the atmosphere, and part of the heat is transported to the mounting substrate 31 through the side wall and further acts as a heat spreader. It escapes to the wiring board 1 through 22A. The side wall portion may be made of ceramic such as Al ₂ O ₃ or AlN having high thermal conductivity.

In the present embodiment, the side wall of the container 33 is made of a metal having high thermal conductivity such as Cu or Al, and the mounting substrate 31 is also made of ceramic having high thermal conductivity such as Al ₂ O ₃ or AlN, and the blue color The heat generated in the system LED chip 32 is quickly released to the wiring board 1. The bottom of the container 33 may be made of metal, ceramic, or a semiconductor package substrate material.

  At this time, in the present embodiment, since the phosphor that converts the violet to blue light generated in the blue LED chip 32 into white light is held in the fiber member 36, a liquid as in Patent Document 2 is used. There is no need for a stirring mechanism or a power source for that purpose, and no extra power consumption occurs.

  In the above embodiment, since it is assumed that the white LED light emitting device 10B is mounted by reflow of the solder bumps 2A and 3A, silicone oil having excellent heat resistance is used for the insulating liquid layer 34. When the white LED light emitting device 10B is used in an application where such heat treatment is not applied, the heat resistance is inferior, but a fluorine-based inert liquid superior in thermal conductivity, for example, a commercial product from Sumitomo 3M It is also possible to use the name Florinato.

  In such a configuration, since the blue LED chip 32 is directly mounted on the metal member constituting the bottom surface of the container 33, the escape of heat generated in the chip 32 is promoted.

  Next, a manufacturing process of the white LED light emitting device 10B of FIG. 9 will be described with reference to FIGS. However, in FIGS. 11A to 11F, the same reference numerals are given to the parts described above, and the description thereof is omitted.

  Referring to FIG. 11A, the blue LED chip 32 is surface-mounted in a recess 33A formed by a container 33 on the mounting substrate 31, and an upper electrode (LED) of the LED chip 32 (by a bonding wire 32A). (Not shown) is connected to the wiring pattern 31B on the mounting substrate 31.

  Next, in the step of FIG. 11B, silicone oil is dropped from the nozzle 211 into the recess 33A, and the insulating liquid layer 24 covering the blue LED chip 32 and the bonding wire 32A is formed.

  Next, in the step of FIG. 11C, the fiber member 36 that holds the phosphor powder described above is disposed on the insulating liquid layer 34 in the recess 33 </ b> A, and the insulating liquid layer is disposed in the fiber member 36. 34 is impregnated, and vacuum deaeration is performed in the process of FIG. 11D. However, depending on the type of the insulating liquid constituting the insulating liquid layer 34, the vacuum degassing step of FIG. 11D may be omitted.

  Next, in the step of FIG. 11E, uncured silicone resin or epoxy resin is dropped from the nozzle 311 to form an uncured resin layer 35m. Since the uncured resin layer 35m has a specific gravity lighter than the insulating liquid layer 34 below, the uncured resin layer 35m spreads on the fiber member 36 on the insulating liquid layer 34 in a dripped state. Form. The same applies when an uncured epoxy resin is used instead of the uncured silicone resin. The uncured resin layer 35m dropped in this way enters the notch 33B formed on the side wall surface of the metal container 33, and forms the engaging portion 35A. In the step of FIG. 11D, since the viscosity of the uncured resin layer 35m is high, the fiber member 26 does not impregnate the uncured resin layer 35m.

  Further, when the concave portion 33A is filled with the uncured resin layer 35m, a vacuum deaeration step is performed in the step of FIG. 11F, and the insulating liquid layer 34 and the blue LED chip 32 in the insulating liquid layer 34 are performed. , The interface between the insulating liquid layer 34 and the uncured resin layer 35m, and the bubbles in the uncured resin layer 35m are removed.

  Further, in the step of FIG. 11G, the structure obtained in the step of FIG. 11F is heat-treated at, for example, 150 ° C., whereby the uncured resin layer 35m is cured and changed to the resin layer 35.

  Further, by mounting the structure of FIG. 11G on the wiring substrate 1, the device including the white LED light emitting device 10B described in FIG. 9 is obtained.

  Although the case where the resin layer 35 is a silicone resin has been described above, another resin such as an epoxy resin can be used as the resin layer 35.

  In the present invention, the white LED light emitting device 10B can be formed by dropping and curing the resin layer not containing the phosphor on the insulating liquid layer 34 in an uncured state as described above. The manufacturing process of the device is simplified. In particular, the resin layer 35m dropped in an uncured state in this way fills the notch 33B formed on the wall surface of the container 33, and the resin layer 35 formed by curing the resin layer 35m Even if a special bonding process or a locking process is not performed, the insulating liquid layer 34 is covered and fixed, and problems such as liquid leakage of the insulating liquid layer 34 do not occur.

  The external extraction conversion efficiency of light in the white LED light emitting device 10B of FIG. 9 is the external extraction conversion efficiency of light in the reference sample in which the fiber member 36 is not impregnated with the insulating liquid layer 34 but impregnated with air. As a result of the comparison, it was confirmed that the white LED light emitting device of the present embodiment has 2.5 times higher external light extraction conversion efficiency. Here, the “external light extraction conversion efficiency” is the efficiency with which the output of the blue LED 32 is extracted from the white LED light emitting device to the outside as white light.

  In the embodiment of FIG. 9, the position where the fiber member 36 is provided is not limited to the interface between the insulating liquid layer 34 and the resin layer 35, but is formed inside the insulating liquid layer 34. It is also possible.

  It is also possible to use a sol layer as the insulating liquid layer 34.

[Sixth Embodiment]
12A to 12D are diagrams illustrating manufacturing steps of the white LED light-emitting device 60 according to the sixth embodiment of the present invention.

  Referring to FIG. 12A, in this embodiment, a dome-shaped member 41 is first formed by a fiber member 26 holding a phosphor, similar to the fiber member 26 of FIG. 9, and then, as shown in FIG. 12B. Then, an uncured resin layer 42m is adhered on the dome-shaped member 41. As in the previous embodiment, the uncured resin layer 42m has a large viscosity, and the dome-shaped member 41 is impregnated with the uncured resin layer 42m even if it holds the uncured resin layer 42m. Never do.

  Next, in the process of FIG. 12C, the structure of FIG. 12B is mounted on the mounting substrate 43 on which the blue LED chip 44 is surface-mounted, and the uncured resin layer 42 is cured by heating. In FIG. 12C, the blue LED chip 44 is mounted on the electrode 43A on the mounting substrate 43, and the upper electrode is connected to another electrode 43B on the mounting substrate 43 by a bonding wire 45. I understand. Also, electrodes 43C and 43D electrically connected to the electrodes 43A and 43B are formed on the lower surface of the mounting substrate 43, respectively. In the structure of FIG. 12C, openings 42A and 42B are formed in communication with the space inside the dome-shaped member 41.

  Next, the structure of FIG. 12C is immersed in an insulating liquid 46 similar to the insulating liquid 24, and the space inside the dome-shaped member 41 is evacuated from the opening 42B, whereby the insulating liquid 46 is obtained. Is introduced into the space from the opening 42 </ b> A, and the space is filled with the liquid 46.

  By sealing the openings 42A and 42B in this state, the white LED light emitting device 40 shown in FIG. 12E is obtained.

[Seventh Embodiment]
Next, the manufacturing process of the white LED light-emitting device by the 7th Embodiment of this invention is demonstrated, referring FIG. However, in FIGS. 13A to 13E, the same reference numerals are given to the portions described above, and the description thereof is omitted.

  Referring to FIG. 13A, the blue LED chip 12 is surface-mounted in a recess 13A formed by a container 13 on the mounting substrate 11, and an upper electrode (LED) of the LED chip 12 (by a bonding wire 12A). (Not shown) is connected to the wiring pattern 11B on the mounting substrate 11.

  Next, in the step of FIG. 13B, silicone oil is dropped from the nozzle 210 into the recess 13A to form the insulating liquid layer 14 that covers the blue LED chip 12 and the bonding wire 12A. In the step of FIG. 13B, the insulating liquid layer 14 or a sol layer instead of the insulating liquid layer 14 is formed by screen printing using a screen mask 410M and a squeegee 411M as shown in the modification of FIG. It is also possible to form the squeegee 411M by moving it in the direction of the arrow.

  Next, after performing the deaeration process in the process of FIG. 13C, in the process of FIG. 13D, the uncured silicone in which the phosphor powder described above is blended on the insulating liquid layer 14 in the recess 13A. Resin or epoxy resin 15M is filled by moving the squeegee 411 in the direction of the arrow by screen printing using the screen printing mask 410 and the squeegee 411, thereby forming an uncured resin layer 15m. The squeegee 411 and the screen printing mask 410 may be the same as the squeegee 411 and the screen printing mask 410 used in the process of FIG. Since the uncured resin layer 15m has a specific gravity lighter than that of the insulating liquid layer 14 below, the uncured resin layer 15m spreads on the insulating liquid layer 14 in a dripped state, thereby forming the uncured resin layer 15m. The same applies when an uncured epoxy resin is used instead of the uncured silicone resin. The uncured resin layer 15m dropped in this way enters the cutout portion 13B formed on the side wall surface of the metal container 13 to form the engagement portion 15A. The vacuum degassing step of FIG. 13C may be omitted depending on the type of insulating liquid or sol used.

  Further, when the recess 13A is filled with the uncured resin layer 15m, a vacuum deaeration process is performed in the process of FIG. 13E, and the insulating liquid layer 14 and the blue LED chip 12 in the insulating liquid layer 14 are processed. , The interface between the insulating liquid layer 14 and the uncured resin layer 15m, and the bubbles in the uncured resin layer 15m are removed.

  Further, in the step of FIG. 13F, the uncured resin layer 15m is cured and changed to the resin layer 15 by heat-treating the structure obtained in the step of FIG.

  Further, by mounting the structure of FIG. 13F on the wiring board 1, the device including the white LED light emitting device 10 described above with reference to FIG. 1 can be obtained.

  As mentioned above, although this invention was described about preferable embodiment, this invention is not limited to this specific embodiment, In the summary described in the claim, various deformation | transformation and change are possible. .

It is a figure which shows the structure of the white LED light-emitting device by the 1st Embodiment of this invention. FIG. 3 is a diagram (part 1) illustrating a manufacturing process of the white LED light-emitting device of FIG. 1; FIG. 3 is a diagram (part 2) illustrating a manufacturing process of the white LED light-emitting device of FIG. 1. FIG. 3 is a diagram (part 3) illustrating a manufacturing process of the white LED light-emitting device of FIG. 1; FIG. 4 is a diagram (part 4) illustrating a manufacturing process of the white LED light-emitting device of FIG. 1; FIG. 5 is a view (No. 5) showing a manufacturing step of the white LED light-emitting device of FIG. 1; FIG. 6 is a view (No. 6) showing a manufacturing step of the white LED light-emitting device of FIG. 1; It is a figure which shows a part of structure of the white LED light-emitting device by the 2nd Embodiment of this invention. It is a figure which shows the structure of the white LED light-emitting device by the 3rd Embodiment of this invention. It is a figure which shows the structure of the white LED light-emitting device by the modification of 3rd Embodiment. It is a figure which shows the structure of the white LED light-emitting device by the other modification of 3rd Embodiment. It is a figure which shows the structure of the white LED light-emitting device by the 4th Embodiment of this invention. It is a figure which shows the modification of the white LED light-emitting device of FIG. It is a figure which shows the other modification of the white LED light-emitting device of FIG. It is a figure which shows the other modification of the white LED light-emitting device of FIG. It is a figure which shows the structure of the white LED light-emitting device by the 5th Embodiment of this invention. It is a figure which expands and shows a part of white LED light-emitting device by the 5th Embodiment of this invention. It is a figure (the 1) which shows the manufacturing process of the white LED light-emitting device of FIG. FIG. 10 is a diagram (part 2) illustrating a manufacturing process of the white LED light-emitting device of FIG. 9; It is FIG. (3) which shows the manufacturing process of the white LED light-emitting device of FIG. FIG. 10 is a view (No. 4) showing a step of manufacturing the white LED light-emitting device of FIG. 9; It is FIG. (5) which shows the manufacturing process of the white LED light-emitting device of FIG. FIG. 10 is a view (No. 6) showing a step of manufacturing the white LED light-emitting device of FIG. 9; FIG. 10 is a view (No. 7) showing a manufacturing step of the white LED light-emitting device of FIG. 9; It is FIG. (1) which shows the structure of the white LED light-emitting device by the 6th Embodiment of this invention. It is FIG. (2) which shows the structure of the white LED light-emitting device by the 6th Embodiment of this invention. It is FIG. (3) which shows the structure of the white LED light-emitting device by the 6th Embodiment of this invention. It is FIG. (4) which shows the structure of the white LED light-emitting device by the 6th Embodiment of this invention. It is FIG. (5) which shows the structure of the white LED light-emitting device by the 6th Embodiment of this invention. It is FIG. (1) which shows the structure of the white LED light-emitting device by the 7th Embodiment of this invention. It is FIG. (2) which shows the structure of the white LED light-emitting device by the 7th Embodiment of this invention. It is FIG. (3) which shows the structure of the white LED light-emitting device by the 7th Embodiment of this invention. It is FIG. (4) which shows the structure of the white LED light-emitting device by the 7th Embodiment of this invention. It is FIG. (5) which shows the structure of the white LED light-emitting device by the 7th Embodiment of this invention. It is FIG. (6) which shows the structure of the white LED light-emitting device by the 7th Embodiment of this invention. It is a figure which shows one modification of 7th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 2,3 Wiring pattern 2A, 3A, 22A, 23A Solder bump 11, 11S, 31, 43 Mounting board 10, 10B, 20, 30, 40, 60 White LED light-emitting device 11A, 11B, 11C, 11D, 31A , 31B, 31C, 31D Wiring pattern 12, 32, 44 Blue LED chip 12A, 32A, 45 Bonding wire 12G, 32G Groove 13, 33 Container 13A, 33A Recess 13B, 33B Notch 14, 34 Insulating liquid layer 15, 35, 42 Resin layer 15m, 35m, 42m Uncured resin layer 15A, 16A, 17A, 35A Engagement portion 15M Uncured resin 16 Another resin layer 17 Resin layer not including phosphor 36, 41 Fiber member 36F Fiber 36P Fluorescence Body powder 42A, 42B Openings 210, 310, 211, 311 Le 410,410M screen printing mask 411,411M squeegee

Claims (11)

A container having a recess;
A blue LED chip mounted on the bottom of the recess;
A layer of insulating liquid or sol filled in the recess and surrounding the blue LED chip;
A transparent resin layer formed outside the insulating liquid or sol layer as viewed from the blue LED chip and sealing the insulating liquid or sol layer and having a specific gravity smaller than that of the insulating liquid or sol; ,
Including
A white LED light-emitting device, wherein phosphors are dispersed in the transparent resin layer.   2. The blue LED chip has an uneven pattern on a surface in contact with the insulating liquid or sol layer, and the insulating liquid or sol layer is in close contact with the uneven pattern. White LED light emitting device.   The white LED light-emitting device according to claim 1, wherein the insulating liquid or sol layer is made of a fluorine-based liquid.   3. The white LED light emitting device according to claim 1, wherein the insulating liquid or sol layer is made of silicone oil.   The transparent resin layer includes a first layer in contact with the surface of the insulating liquid or sol layer, and a plurality of stacked layers on the first layer, and each of the plurality of layers has a different light emission. The white LED light-emitting device according to claim 1, wherein the phosphors having colors are dispersed.   The blue LED chip is immersed in the insulating liquid or sol layer and electrically connected by a bonding wire immersed in the insulating liquid or sol layer. The white LED light-emitting device as described in any one of 1-5.   The blue LED chip is immersed in the insulating liquid or sol layer, and is electrically connected by a conductive pattern formed by screen printing in the insulating liquid or sol layer. The white LED light-emitting device according to claim 1, wherein a polyimide pattern is formed around the LED chip by screen printing. A blue LED chip,
A layer of insulating liquid or sol surrounding the blue LED chip;
A transparent resin layer for sealing the insulating liquid or sol layer;
Including
A white LED light-emitting device, wherein a fiber holding a phosphor is provided in the insulating liquid or sol layer or between the insulating liquid or sol layer and the transparent resin layer.   The white LED light-emitting device according to claim 8, wherein the transparent resin layer has a specific gravity smaller than that of the insulating liquid or sol. Mounting a blue LED chip on the bottom of a container having a recess;
Electric wiring to the blue LED chip by a bonding wire;
Filling the recess with the insulating liquid or sol so as to immerse the blue LED chip and the bonding wire, and forming a layer of the insulating liquid or sol;
Applying an uncured resin material on the insulating liquid or sol layer to form an uncured resin layer;
Curing the uncured resin layer;
A method for producing a white LED device, comprising:   The method of manufacturing a white LED device according to claim 10, wherein the step of filling the insulating liquid or sol and the step of applying the uncured resin material are performed by a screen printing method.

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