JP2011035198A - Method of manufacturing led light-emitting device - Google Patents

Method of manufacturing led light-emitting device Download PDF

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Publication number
JP2011035198A
JP2011035198A JP2009180706A JP2009180706A JP2011035198A JP 2011035198 A JP2011035198 A JP 2011035198A JP 2009180706 A JP2009180706 A JP 2009180706A JP 2009180706 A JP2009180706 A JP 2009180706A JP 2011035198 A JP2011035198 A JP 2011035198A
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Japan
Prior art keywords
phosphor
light
emitting device
led
led element
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Pending
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JP2009180706A
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Japanese (ja)
Inventor
Kenji Yoneda
賢治 米田
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Ccs Inc
シーシーエス株式会社
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Priority to JP2009180706A priority Critical patent/JP2011035198A/en
Publication of JP2011035198A publication Critical patent/JP2011035198A/en
Application status is Pending legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape

Abstract

Provided is a method for manufacturing an LED light-emitting device that can easily analyze, classify, and manage wavelength conversion members, easily control the emission color and illuminance of the LED light-emitting device, and has a high yield.
A sealing member that includes a base having a recess opening in an upper end surface and an LED element mounted on a bottom surface of the recess, has a light-transmitting property, and seals the LED element; The wavelength conversion member containing a body is a method for producing an LED light-emitting device provided in this order from the bottom surface side of the recess, and the wavelength conversion member is laminated on a translucent substrate A step of mounting the LED element on the bottom surface of the concave portion of the base, and a step of filling the concave portion of the base on which the LED element is mounted with a translucent resin for a sealing member. A sealing step for sealing the element, and before the light-transmitting resin is cured, the light-transmitting substrate is formed on the bottom surface side of the recess. And a mounting process covering with the laminate so that it faces It was.
[Selection] Figure 1

Description

  The present invention relates to an LED light-emitting device that can easily analyze, classify, and manage wavelength conversion members, easily control the light emission color and illuminance of the LED light-emitting device, has a high yield, and is excellent in moisture resistance and heat dissipation. Is.

  Conventionally, LED light emission that emits light of a color different from the light emission color of LED elements including white by combining LED elements that emit blue light or ultraviolet rays with various phosphors using a gallium nitride compound semiconductor A device is being developed. Such LED light-emitting devices using LED elements have advantages such as small size, power saving, and long life, and are widely used as display light sources and illumination light sources.

  As such an LED light emitting device, an LED element is mounted in the concave portion of the base in which the concave portion is formed, and a translucent sealing member that covers the LED element and a wavelength conversion member that contains a phosphor are LEDs. What is provided in this order from the element side is known (Patent Document 1), and the LED light emitting device is provided with a sealing layer, so that it has excellent light extraction efficiency from the LED element, Thermal degradation of the phosphor can be prevented.

  In order to manufacture the LED light-emitting device, a light-transmitting resin for a sealing member is filled and cured in a concave portion of a substrate on which an LED element is mounted, and then a phosphor for a wavelength conversion member is contained thereon. A resin composition is injected.

  A resin composition for a wavelength conversion member in which a phosphor is dispersed is prepared by adjusting a plurality of LED light emitting devices at one time and then using a predetermined amount. The dispersion of the phosphor in the resin composition Since the state changes with time, even in the LED light emitting device having the same specification, the color of light emission and the illuminance slightly vary from lot to lot. Moreover, there are variations in the emission color and illuminance of the LED elements, which also causes variations in the emission color and illuminance of the LED light-emitting device that is the final product. And when using the obtained LED light-emitting device as a light source for an inspection apparatus, if there is even such slight variation, the reliability of the inspection result is impaired, which is a problem.

  For this reason, conventionally, the LED light emitting device which is the final product is inspected for the color of emitted light and the illuminance, and those that deviate from the allowable range are excluded.

  In addition, recently, the output of LED elements has been increased, and the amount of heat generated by the LED elements has increased remarkably, and the LED element itself has deteriorated due to the heat. Further, since the phosphor is also vulnerable to heat, it is considered that the phosphor is thermally deteriorated by heat transfer from the LED element.

  Therefore, conventionally, a heat sink is laid under the LED element to dissipate heat. However, in practice, when the phosphor is excited by, for example, ultraviolet rays, the phosphor generates significant heat. The present inventor discovered for the first time through intensive studies the fact that the deterioration of the material was promoted. When an LED element is mounted on a heat dissipation substrate, covered with a sealing member, and further covered with a wavelength conversion member, an experiment was conducted under conditions of an applied voltage of 3.5 V and a current of 300 mA. The temperature of the upper surface of the wavelength conversion member is 65 ° C. despite the fact that the temperature is lowered such that the portion is 85 ° C. and the upper surface of the sealing member is 55 ° C. It was confirmed that the exotherm of was remarkable.

JP 2005-191197 A

  The present invention has been made in view of the above problems, and provides an LED light emitting device that can easily analyze, classify, and manage wavelength conversion members, easily control the emission color and illuminance of the LED light emitting device, and has a high yield. This is the main intended issue.

  That is, the manufacturing method of the LED light-emitting device according to the present invention includes a base body having a recess opening in an upper end surface, and an LED element mounted on the bottom surface of the recess, and has translucency and the LED element. A method of manufacturing an LED light emitting device in which a sealing member to be sealed and a wavelength conversion member containing a phosphor are provided in this order from the bottom surface side of the recess, the wavelength conversion member being translucent A laminating process for producing a laminate laminated on a substrate, a mounting process for mounting an LED element on the bottom surface of the recess of the substrate, and a sealing member transparent member in the recess of the substrate on which the LED element is mounted. A sealing step of sealing the LED element by filling with a light-transmitting resin, and an opening of the concave portion of the base body filled with the light-transmitting resin before the light-transmitting resin is cured; The optical substrate faces the bottom side of the recess. Characterized in that it includes a mounting step of covering with serial laminate.

  As described above, the phosphor-containing resin composition for the wavelength conversion member adjusts a plurality of LED light emitting devices at a time, but the dispersion state of the phosphor in the phosphor-containing resin composition is temporal. Therefore, even if the LED light emitting device has the same specification, the color of light emission and the illuminance slightly vary from lot to lot. Moreover, there are variations in the emission color and illuminance of the LED elements, and this causes variations in the emission color and illuminance of the LED light emitting device as the final product.

  On the other hand, in the present invention, the laminate of the wavelength conversion member and the translucent substrate is manufactured separately from the base on which the LED element is mounted, and then the LED element is mounted. Since the laminate is mounted on the substrate, the wavelength and light intensity are determined in advance, for example, a reference light source that emits near ultraviolet rays is used to measure the emission color, illuminance, and the like of the laminate, and the laminate having variations Classification and management of body groups according to luminescent color, illuminance, etc., selecting those having the desired luminescent color, illuminance, etc., and combining them with suitable LED elements can produce LED light emitting devices with the expected performance . For this reason, it is possible to suppress variations in the emission color, illuminance, and the like of the LED light emitting device that is the final product as much as possible.

  Further, since the light-transmitting substrate also exhibits a heat dissipation action of the wavelength conversion member and the sealing member, a change in emission color of the LED light-emitting device due to thermal deterioration of the phosphor in the wavelength conversion member. Can be suppressed satisfactorily.

  Furthermore, a silicone resin having a high gas permeability may be used as the translucent resin for the sealing member, but by covering the sealing member with the translucent substrate, Since the intrusion of gas can be suppressed, even if a reflector made of a metal thin film such as silver is formed on the side surface and bottom surface of the recess, the metal thin film is prevented from being corroded by oxidation, sulfidation, chloride, etc. Can do. Further, the translucent substrate can also exhibit a waterproof function.

  Further, since the LED element is a point light source, in order to increase the light extraction efficiency, it is preferable that the LED element and the phosphor are close to each other, but the phosphor is deteriorated by heat from the LED element. Therefore, it is necessary to manage the distance between the phosphor and the LED element so that the balance is optimal. However, as in the prior art, in the method in which the light-transmitting resin is filled and cured in the concave portion of the substrate on which the LED element is mounted, and then the phosphor-containing resin composition is injected thereon, Depending on the state of the side surface and the viscosity of the translucent resin, the translucent resin may rise up the side surface of the substrate recess and harden in a state where the interface between the sealing member and the wavelength conversion member is depressed. Even if the filling amount of the functional resin is strictly managed, it is difficult to manage the distance between the LED element and the phosphor (wavelength conversion member) with good reproducibility. On the other hand, in the present invention, the laminate of the wavelength conversion member and the translucent substrate is produced as a separate body from the base on which the LED element is mounted, and the concave portion of the base is filled. Before the translucent resin is cured, by placing the laminate on the translucent resin so as to cover the opening of the concave portion, the thickness of the wavelength conversion member from the prefabricated laminate is increased. Therefore, the distance between the LED element and the phosphor (wavelength conversion member) can be managed with good reproducibility. For this reason, for example, it becomes easy to cope with thermal deterioration of the phosphor.

  Specific examples of the laminating step include a step of applying a phosphor-containing resin composition onto the light-transmitting substrate and curing the phosphor-containing resin composition. When the phosphor-containing resin composition is applied, management of the coating amount of the phosphor-containing resin composition becomes easy. In addition, hardening the said fluorescent substance containing resin composition means making it a harder state than the said translucent resin before hardening.

  A plurality of the laminates may be produced in a lump, and in this case, the lamination step is performed on a large substrate on which a plurality of the light-transmitting substrates are integrated. The phosphor-containing resin composition is printed using, for example, an ink jet printer so that a plurality of the wavelength conversion members are formed, and the phosphor-containing resin composition is cured to form a plurality of the laminates. It is preferable that the manufacturing method includes a step of manufacturing as a single body, and a step of cutting a large substrate on which a plurality of the wavelength conversion members are formed to cut out the plurality of laminated bodies.

  In this case, a phosphor-containing resin composition containing a phosphor that emits red light (hereinafter referred to as a red phosphor) and a phosphor containing a phosphor that emits green light (hereinafter referred to as a green phosphor). A resin composition and a phosphor-containing resin composition containing a phosphor that emits blue light (hereinafter referred to as a blue phosphor) may be printed separately, and in particular, a red phosphor-containing resin composition. When the green phosphor-containing resin composition and the blue phosphor-containing resin composition are printed in this order, the blue light emitted from the blue phosphor and the green light emitted from the green phosphor are transferred to other phosphors. This is preferable because the light extraction efficiency and energy conversion efficiency can be increased without being absorbed.

  In the sealing step, the translucent resin may be filled in the recesses of the base so that the surface of the translucent resin swells. In the present invention, “the surface of the translucent resin swells” means that the filled translucent resin is raised so that one point on the surface of the translucent resin is a vertex. That means.

  If it is such, when covering the opening of the concave portion with the laminate, the vertex on the surface of the translucent resin is first in contact with the laminate, and continuously from the vertex as the starting point. Since the contact area between the translucent resin and the laminate increases, bubbles are not easily formed between the translucent resin and the laminate.

  Moreover, you may further provide the resin adhesion process which adheres the said translucent resin to the surface at the side of the said translucent board | substrate among the surfaces of the said laminated body before the said mounting process. A translucent resin is adhered to the surface of the laminated body on the translucent substrate side by potting or the like to form a bulge portion, and the bulge portion and the translucent resin filled in the recess are first By covering the opening of the recess with the laminated body so as to come into contact, the contact area between the translucent resin and the laminated body is continuously expanded from the bulged portion. Air bubbles are hardly formed between the functional resin and the laminate.

  An LED light-emitting device obtained by such a manufacturing method is also one aspect of the present invention. That is, the LED light-emitting device according to the present invention includes a base having a recess opening in the upper end surface, an LED element mounted on the bottom surface of the recess, and a sealing member that has translucency and seals the LED element. And a light-transmitting substrate provided on the sealing member so as to hermetically seal the sealing member in the recess, and a phosphor. And a wavelength conversion member provided on the top.

  Specifically, as the LED light emitting device according to the present invention, the LED element emits ultraviolet light or visible light having a short wavelength, and the phosphor is a red phosphor, a green phosphor, and a blue phosphor. The thing which is a body is mentioned.

  The translucent substrate is not particularly limited. For example, when a short-wavelength transmission filter that transmits ultraviolet rays and short-wavelength visible rays and reflects longer-wavelength visible rays is used, the LED element emits light. Of the visible light emitted from the phosphor excited by ultraviolet light or short wavelength visible light, the light traveling toward the substrate on which the LED element is mounted is reflected by the short wavelength transmission filter and travels in the direction of travel. It is injected out of the device by changing. For this reason, the visible light converted by the phosphor can be efficiently taken out of the apparatus.

  As the LED element, specifically, one having a radiation peak at 430 nm or less is preferably used, and more preferably has a radiation peak in the near ultraviolet region of 360 to 430 nm.

  Specifically, the short wavelength transmission filter has a boundary where the light reflectance and transmittance are reversed in a wavelength region of 10 nm or more larger than the emission peak wavelength of the LED element and 440 nm or less. A dielectric multilayer film is preferably used. A dielectric multilayer film is formed by selecting and laminating two or more films having different refractive indexes from a thin film made of a highly transparent substance such as a metal oxide. It is also excellent.

  In the wavelength conversion member, a layer containing a phosphor emitting red light, a layer containing a phosphor emitting green, and a layer containing a phosphor emitting blue light are formed in this order from the LED element side. May be.

  According to the present invention having such a configuration, the wavelength conversion member can be easily analyzed, classified, and managed, the light emission color and illuminance of the LED light emitting device can be easily controlled, and the LED light emitting device can be manufactured with a high yield. Furthermore, the moisture resistance and heat dissipation of the LED light-emitting device can be improved.

It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on one Embodiment of this invention. It is a graph which shows the outline | summary of the transmittance | permeability and reflectance of the short wavelength transmission filter in the embodiment. It is the top view (a) and longitudinal cross-sectional view (b) which show the laminated body before the cutting | disconnection in the same embodiment. It is a figure which shows the manufacturing process of the LED light-emitting device which concerns on the embodiment. It is optical path explanatory drawing which shows the one part optical path of the LED light-emitting device which concerns on the embodiment. It is a figure which shows the manufacturing process of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a top view which shows the laminated body before cutting | disconnection in other embodiment. It is a perspective view of the LED light-emitting device which concerns on other embodiment. It is a perspective view of the LED light-emitting device which concerns on other embodiment.

  An embodiment of the present invention will be described below with reference to the drawings.

  First, the LED light emitting device 1 according to the present embodiment will be described. As shown in FIG. 1, the LED light emitting device 1 includes a base body 2 having a recess 22 that opens to an upper end surface 21, an LED element 3 mounted on a bottom surface 221 of the recess 22, and a seal that seals the LED element 3. It is provided with a stop member 4, a translucent substrate 5 provided on the sealing member 4 and covering the opening of the recess 22, and a wavelength conversion member 6 provided on the translucent substrate 5. is there.

Each part is described in detail below.
The base 2 has a recess 22 having a truncated conical shape that opens to the upper end surface 21 and expands from the bottom surface 221 toward the opening. For example, an insulating material having high thermal conductivity such as alumina or aluminum nitride. It is made by molding a material.

  The base body 2 mounts an LED element 3 to be described later on the bottom surface 221 of the recess 22, and a wiring conductor (not shown) for electrically connecting the LED element 3 to the bottom surface 221. Is formed. This wiring conductor is led to the outer surface of the LED light emitting device 1 through a wiring layer (not shown) formed inside the base 2 and connected to the external electric circuit board, whereby the LED element 3 and the external electric circuit are connected. The substrate is electrically connected.

  A metal thin film 23 having high reflectivity is formed on the inner surface including the side surface 222 and the bottom surface 221 of the concave portion 22 of the base 2 by performing metal plating of silver or the like, and functions as a reflector.

  The LED element 3 emits ultraviolet rays or short-wavelength visible light, and has a radiation peak at 360 to 430 nm, for example. For example, the LED element 3 is formed by laminating a gallium nitride-based compound semiconductor in the order of an n-type layer, a light-emitting layer, and a p-type layer on a sapphire substrate or a gallium nitride substrate.

  The LED element 3 is flip-chip mounted on the bottom surface 221 of the recess 22 with solder bumps or gold bumps (not shown) with the gallium nitride compound semiconductor facing down (the bottom surface 221 side of the recess 22).

  The sealing member 4 is filled in the concave portion 22 and seals the LED element 3. For example, the sealing member 4 is excellent in translucency and heat resistance, and has a translucency such as a silicone resin having a small refractive index difference from the LED element 3. It is made of resin 4. When such a sealing member 4 is provided, the light extraction efficiency from the LED element 3 can be improved, and thermal deterioration of the phosphor 61 in the wavelength conversion member 6 can be prevented.

  The translucent substrate 5 functions as a coated substrate for the wavelength conversion member 6 in the manufacturing process, and is provided on the sealing member 4 to cover the opening of the recess 22. The recess 22 is hermetically sealed. Since the silicone resin constituting the sealing member 4 has a high gas permeability, it is possible to suppress the intrusion of gas into the recess 22 by covering the opening of the recess 22 with the translucent substrate 5. Corrosion due to oxidation, sulfidation, chlorination, etc. of the metal thin film 23 formed on the inner surface of 22 can be prevented. Moreover, the translucent board | substrate 5 can also express a waterproof function.

  In the present embodiment, a short wavelength transmission filter that reflects visible light and selectively transmits only light from the ultraviolet region to the near ultraviolet region is used as the translucent substrate 5. Specifically, for example, as shown in FIG. 2, the short wavelength transmission filter is a dielectric multilayer film in which the light transmittance and the reflectance are reversed around 430 nm as a boundary. Such a dielectric multilayer film is formed, for example, by attaching a film material to a glass substrate or the like.

  The wavelength conversion member 6 has a phosphor 61 dispersed therein, and is provided on the translucent substrate 5. As such a wavelength conversion member 6, for example, the phosphor 61 is dispersed in a translucent resin such as a silicone resin that is excellent in translucency and heat resistance and has a small refractive index difference from the sealing member 4. Things.

  In this embodiment, the wavelength conversion member 6 includes a red phosphor 61R, a green phosphor 61G, and a blue phosphor 61B, and the layers containing the respective phosphors 61 are red fluorescent from the LED element 3 side. The body-containing layer 6R, the green phosphor-containing layer 6G, and the blue phosphor-containing layer 6B are formed in this order.

  When the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B are excited by ultraviolet rays or short-wavelength visible light emitted from the LED elements 3, red light, green light, and blue light emitted from the phosphors 61 are emitted. It mixes and emits white light. And the ultraviolet-ray and short wavelength visible light which LED element 3 emits cannot affect the white which is the luminescent color of LED light-emitting device 1 substantially. For this reason, for example, when the LED element 3 emits blue light and the blue light is configured to mix with the light emitted from the phosphor 61, the optical path on the light emitting surface of the LED light emitting device 1. Although the color tone unevenness due to the difference in length is likely to occur, the LED element 3 emits ultraviolet rays or visible light having a short wavelength, and the phosphor 61 is composed of a red phosphor 61R, a green phosphor 61G, and a blue phosphor 61B. In such an LED light-emitting device 1, such uneven color tone is unlikely to occur.

  Then, LED emission using ultraviolet light or short wavelength visible light as the LED element 3 as in the present embodiment, and red phosphor 61R, green phosphor 61G and blue phosphor 61B as the phosphor 61 is used. The mixed light emitted from the device 1 moves on the Planck locus and is a natural white color very close to sunlight.

  Next, the manufacturing method of the LED light-emitting device 1 which concerns on this embodiment is demonstrated with reference to FIG.3 and FIG.4.

  First, as shown in FIG. 3, the wavelength conversion member is formed so that a plurality of wavelength conversion members 6 are collectively produced on a large substrate B having a size corresponding to a plurality of translucent substrates 5. The phosphor-containing resin composition 6 for 6 is printed using an inkjet printer or the like. At this time, the red phosphor-containing resin composition 6R containing the red phosphor 61R, the green phosphor-containing resin composition 6G containing the green phosphor 61G, and the blue phosphor-containing resin composition containing the blue phosphor 61B. The product 6B is printed separately in this order.

  Thereafter, the phosphor-containing resin composition 6 printed on the large substrate B is cured by heating or irradiation with light (including ultraviolet rays), and the wavelength conversion member 6 is laminated on the translucent substrate 5. A plurality of laminated bodies 7 are manufactured as a unit. Next, the large substrate B on which the plurality of wavelength conversion members 6 are integrally formed is cut with a laser or the like, and a plurality of laminated bodies 7 are cut out.

  Subsequently, the LED element 3 is mounted on the bottom surface 221 of the concave portion 22 of the base 2, and the translucent resin 4 for the sealing member 4 is filled in a larger amount than necessary so that the surface swells there. To do.

By the way, when the electrical pattern is formed on the side surface 222 of the recess 22, if the viscosity of the translucent resin 4 is low, the filled translucent resin 4 tends to scoop up the side surface 222 of the recess 22. Increases the amount of crawls compared to those without. Then, even if the filling amount of the translucent resin 4 is strictly controlled, the substantial filling amount of the translucent resin 4 depends on the rising amount, and it is extremely difficult to make the rising amount constant. For this reason, there is a possibility that the height of the surface of the central portion of the translucent resin 4 will vary. In order to suppress this phenomenon and manage the height to be constant, in this embodiment, the amount of the translucent resin 4 is increased, and when the lid is covered with the laminate 7, it is overflowing. If a resin having a high viscosity of, for example, 100 mm 2 / s or more is used as the translucent resin 4, the amount of scooping is reduced in the first place. Therefore, the amount of overflow, that is, the initial filling amount of the translucent resin 4 is reduced. This is particularly preferable when the electric pattern is formed on the side surface 222 of the recess 22.

  And before hardening the translucent resin 4, the opening part of the recessed part 22 with which the translucent resin 4 was filled is covered with the laminated body 7 so that the translucent board | substrate 5 may face the bottom face 221 side of the recessed part 22. FIG. (FIG. 4A).

  As described above, depending on the state of the side surface 222 of the recess 22 and the viscosity of the translucent resin 4, the translucent resin 4 filled in the recess 22 may crawl up the side surface 222 of the recess 22. Even if the filling amount of the functional resin 4 into the recess 22 is strictly controlled, it is difficult to control the height of the interface. On the other hand, in the present embodiment, the concave portion 22 is filled with a large amount of the translucent resin 4, and then the opening of the concave portion 22 filled with the translucent resin 4 is covered with the laminate 7, The distance between the wavelength conversion member 6 (phosphor 61) and the LED element 3 can be easily managed.

  Further, when the translucent resin 4 is filled more than necessary so that the surface of the translucent resin 4 swells, the apex of the bulging portion 41 first comes into contact with the laminate 7, and the translucent resin The contact area between 4 and the laminate 7 gradually increases.

  When the opening of the recess 22 is completely covered with the laminate 7, the translucent resin 4 slightly protrudes between the laminate 7 and the base 2, but the translucent resin 4 such as silicone resin is transparent. There is almost no influence on the appearance and function (FIG. 4B). The translucent resin 4 that overflows from the recess 22 and protrudes between the laminate 7 and the base 2 also serves to adhere the laminate 7 and the base 2.

  Finally, the LED light-emitting device 1 can be obtained by curing the translucent resin 4 by heating or the like.

  If it is such embodiment, after producing the laminated body 7 in which the wavelength conversion member 6 is laminated | stacked on the translucent board | substrate 5, as a different body from the base | substrate 2 with which the LED element 3 was mounted, LED By mounting the laminated body 7 on the substrate 2 on which the element 3 is mounted, the emission color, illuminance, and the like of the laminated body 7 are analyzed using a reference light source, and the group of the laminated bodies 7 having variations is emitted. The LED light-emitting device 1 having the desired performance can be manufactured by combining and classifying and managing the light-emitting elements having the desired emission color, illuminance, and the like and combining them with the suitable LED elements 3.

  Moreover, in this embodiment, before the translucent resin 4 with which the recessed part 22 was filled hardens | cures, by mounting the laminated body 7 on the translucent resin 4 so that the opening part of the recessed part 22 may be covered. The distance between the LED element 3 and the phosphor 61 (wavelength conversion member 6) can be managed with good reproducibility. For this reason, the distance between the LED element 3 and the phosphor 61 (wavelength conversion member 6) is controlled so that the light extraction efficiency from the LED element 3 and the influence of the heat received by the phosphor 61 are in an optimal balance. be able to.

  In the present embodiment, the translucent resin 4 is filled in the concave portion 22 more than necessary so that the surface of the translucent resin 4 bulges. Since the contact area between the translucent resin 4 and the laminate 7 gradually increases in contact with the laminate 7, bubbles are not easily formed between the translucent resin 4 and the laminate 7.

  Moreover, since the LED light-emitting device 1 obtained in this embodiment includes the translucent substrate 5 that covers the opening of the recess 22, the reflector 23, the LED element 3, and the sealing member 4 in the recess 2 are provided. It can be protected from the influence of external environmental factors such as moisture and gas, and has excellent corrosion resistance. Moreover, since the translucent board | substrate 5 functions also as a heat radiating member of the wavelength conversion member 6 and the sealing member 4, it suppresses the color tone change of the irradiated light, the output fall, etc. resulting from the thermal deterioration of the fluorescent substance 61 favorably. Can do.

  In the present embodiment, since a short wavelength transmission filter is used as the translucent substrate 5, as shown in FIG. 5, the phosphor excited by ultraviolet rays or short wavelength visible light U emitted from the LED element 3. Of the visible light V emitted by 61, the light traveling toward the substrate 2 is reflected by the short wavelength transmission filter and emitted outside the LED light emitting device 1. Therefore, by using a short wavelength transmission filter as the translucent substrate 5, the converted visible light V can be efficiently taken out of the LED light emitting device 1.

In the present embodiment, the layers containing the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B in the wavelength conversion member 6 are respectively arranged from the LED element 3 side to the red phosphor containing layer 6R, green. Since the phosphor-containing layer 6G and the blue phosphor-containing layer 6B are formed in this order, the blue light emitted from the blue phosphor 61B and the green light emitted from the green phosphor 61G are not absorbed by the other phosphors 61, For this reason, energy conversion efficiency and light extraction efficiency can be improved.

  The present invention is not limited to the above embodiment.

  For example, the method of applying the phosphor-containing resin composition 6 to the translucent substrate 5 is not limited to printing, and may be potting or dipping. Moreover, you may produce one by one, without producing the several laminated body 7 collectively.

  In addition, as shown in FIG. 6, the bulging portion 42 may be formed by attaching the translucent resin 4 to the surface of the laminated body 7 on the translucent substrate 5 side by potting or the like. By forming the bulging portion 42 in this way and covering the opening of the concave portion 22 with the laminate 7 so that the bulging portion 42 first contacts the translucent resin 4 filled in the concave portion 22, Since the contact area between the translucent resin 4 and the laminate 7 continuously increases from the bulging portion 42, it is difficult for bubbles to be formed between the translucent resin 4 and the laminate 7.

  The LED element 3 is not limited to one that emits ultraviolet rays or visible light having a short wavelength, and may emit blue light. Further, the LED element 3 may not be flip-chip mounted, and may be connected to a wiring conductor provided on the base 2 using wire bonding.

  The translucent substrate 5 is not limited to a short-wavelength transmission filter, and any other translucent substrate can be used as long as it has translucency. For example, the translucent substrate 5 is made of diamond, sapphire, crystal, glass, plastic, or the like. There may be. In particular, when the translucent substrate 5 is made of a material having a higher thermal conductivity than that of quartz, such as diamond, sapphire, or quartz, the heat of the wavelength conversion member 6 can be efficiently released through the translucent substrate 5. Therefore, thermal denaturation and thermal degradation of the phosphor 61 included in the wavelength conversion member 6 can be effectively prevented.

  The wavelength conversion member 6 does not have to have a layered structure divided for each type of the phosphor 61, and the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B are included in the wavelength conversion member 6 including one layer. May be mixed. The phosphor 61 contained in the wavelength conversion member 6 is not limited to the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B, and may be a yellow phosphor. White light can also be emitted to the LED light-emitting device 1 by using a combination of the wavelength conversion member 6 containing a yellow phosphor and the LED element 3 that emits blue light.

  The base body 2 is not limited to one having a truncated cone shape in which the concave portion 22 expands from the bottom surface 221 toward the opening portion. For example, the concave portion 22 may have a cylindrical shape. Further, as shown in FIG. 7, the base body 2 has a stepped portion 24 formed on the side surface 222 of the concave portion 22, and a peripheral portion on the translucent substrate 5 side is placed on the upper end surface of the stepped portion 24. By disposing the laminated body 7 as described above, the laminated body 7 may be configured to be positioned with respect to the base 2 both in the optical axis direction and in the axis orthogonal direction.

  Further, the visible light V traveling in the wavelength conversion member 6 may be totally reflected at the interface between the wavelength conversion member 6 and the air and may reversely travel into the wavelength conversion member 6. FIG. As shown in FIG. 4, a transparent plate 8 made of a high refractive index material such as sapphire is further provided on the wavelength conversion member 6, and an antireflection coating or fine irregularities are provided on the surface exposed from the LED light emitting device 1. If antireflection treatment such as roughening to be formed is performed, total reflection as described above can be prevented and light extraction efficiency can be improved.

  In the case where the LED element 3 emits ultraviolet rays, an ultraviolet cut layer may be provided on the upper or lower surface of the transparent plate-like body 8 made of the high refractive index material as necessary.

  When forming the wavelength conversion member 6 on the large substrate B, the plurality of wavelength conversion members 6 do not have to be formed integrally, and as shown in FIG. It may be formed on the large substrate B in a space. By forming a plurality of wavelength conversion members 6 on the large substrate B at a predetermined interval in this way, it becomes easy to cut the large substrate B and cut a plurality of laminated bodies 7.

  The number of recesses 22 formed in one base 2 is not limited to one. As shown in FIG. 10, a plurality of recesses 22 are formed in one base 2, and each LED element 3 (not shown) is formed in each recess 22. ) May be mounted, and the opening of each recess 22 may be covered with the laminate 7.

  Further, when a plurality of recesses 22 are formed in one base body 2, as shown in FIG. 11, a plurality of recesses 22 each mounted with a near-ultraviolet-excited LED element 3 are set as one set, and R · You may make it cover with the single laminated body 7 in which the several wavelength conversion member 6 which changed the mixture ratio of G * B was formed. The color temperature can be freely changed by changing the current value supplied to the LED elements 3 and mixing the visible light V derived from the LED elements 3. For example, in the embodiment shown in FIG. 11, it is assumed that one unit 11 of the light emitting device 1 emits white having a color temperature of 3000K, and the other unit 12 of the light emitting device 1 emits white having a color temperature of 6000K. Thus, it is possible to configure the white light emitting device 1 having excellent color rendering properties in which the color temperature changes along the black body locus.

  In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 ... LED light emitting device 2 ... Base | substrate 3 ... LED element 4 ... Sealing member (Translucent resin for sealing members)
5 ... Translucent substrate 6 ... Wavelength conversion member (phosphor-containing resin composition for wavelength conversion member)

Claims (14)

  1. A base member having a recess opening in the upper end surface and an LED element mounted on the bottom surface of the recess, having a light-transmitting sealing member for sealing the LED element, and a phosphor The wavelength conversion member is a method of manufacturing an LED light emitting device provided in this order from the bottom surface side of the recess,
    A laminating step for producing a laminate in which the wavelength conversion member is laminated on a light-transmitting substrate;
    A mounting step of mounting the LED element on the bottom surface of the concave portion of the substrate;
    A sealing step of sealing the LED element by filling a light-transmitting resin for a sealing member into a concave portion of the base on which the LED element is mounted;
    Prior to curing the translucent resin, the mounting body covers the opening of the concave portion of the base filled with the translucent resin with the laminate so that the translucent substrate faces the bottom surface of the concave portion. And a process for producing an LED light-emitting device.
  2.   The LED light-emitting device manufacturing method according to claim 1, wherein the laminating step is a step of applying a phosphor-containing resin composition for a wavelength conversion member on the translucent substrate and curing the phosphor-containing resin composition. Method.
  3.   The manufacturing method of the LED light-emitting device of Claim 2 which apply | coats the said fluorescent substance containing resin composition by potting.
  4. In the laminating step, a phosphor-containing resin composition for a wavelength conversion member is formed on a large substrate in which a plurality of the translucent substrates are integrated, so that the plurality of wavelength conversion members are formed. Printing, curing the phosphor-containing resin composition, and producing a plurality of the laminates as a unit;
    The manufacturing method of the LED light-emitting device of Claim 1 or 2 which consists of the process of cut | disconnecting the several laminated body by cut | disconnecting the large board | substrate with which the said several wavelength conversion member was formed on it.
  5.   A phosphor-containing resin composition containing a phosphor that emits red light, a phosphor-containing resin composition that contains a phosphor that emits green light, and a phosphor containing a phosphor that emits blue light The method for manufacturing an LED light-emitting device according to claim 4, wherein the resin composition and the resin composition are printed separately.
  6.   A phosphor-containing resin composition containing a phosphor that emits red light, a phosphor-containing resin composition that contains a phosphor that emits green light, and a phosphor containing a phosphor that emits blue light The method for manufacturing an LED light-emitting device according to claim 4 or 5, wherein the resin composition is printed by overlapping the resin composition in this order.
  7.   The LED light emission according to claim 1, wherein the translucent resin is filled in the concave portion of the base so that the surface of the translucent resin swells in the sealing step. Device manufacturing method.
  8.   Before the said mounting process, The resin adhesion process which adheres the said translucent resin to the surface by the side of the said translucent board | substrate among the surfaces of the said laminated body is further provided. The manufacturing method of the LED light-emitting device of 5, 6 or 7.
  9. A substrate having a recess opening in the upper end surface;
    LED elements mounted on the bottom surface of the recess,
    A sealing member having translucency and sealing the LED element;
    A translucent substrate provided on the sealing member so as to hermetically seal the sealing member in the recess;
    An LED light emitting device comprising a phosphor and comprising a wavelength conversion member provided on the translucent substrate.
  10. The LED element emits ultraviolet rays or visible light having a short wavelength,
    The LED light-emitting device according to claim 9, wherein the phosphor is a phosphor that emits red light, a phosphor that emits green light, and a phosphor that emits blue light.
  11.   The LED light emitting device according to claim 9 or 10, wherein the translucent substrate is a short wavelength transmission filter that transmits ultraviolet light and visible light having a short wavelength and reflects visible light having a longer wavelength.
  12.   The LED light-emitting device according to claim 9, 10 or 11, wherein the LED element has a radiation peak at 430 nm or less.
  13.   The short-wavelength transmission filter is a dielectric multilayer film having a boundary where the level of reflectance and transmittance of light is reversed in a wavelength region that is 10 nm or more larger than the emission peak wavelength of the LED element and 440 nm or less. The LED light-emitting device according to claim 11 or 12.
  14.   The wavelength conversion member includes a layer containing a phosphor emitting red light, a layer containing a phosphor emitting green light, and a layer containing a phosphor emitting blue light in this order from the LED element side. The LED light-emitting device according to claim 9, 10, 11, 12, or 13.
JP2009180706A 2009-08-03 2009-08-03 Method of manufacturing led light-emitting device Pending JP2011035198A (en)

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PCT/JP2010/063052 WO2011016433A1 (en) 2009-08-03 2010-08-03 Method for manufacturing led light emitting device
TW99125748A TW201119092A (en) 2009-08-03 2010-08-03 LED device manufacturing method

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