JP4804429B2 - Light emitting device and lighting apparatus using the same - Google Patents

Light emitting device and lighting apparatus using the same Download PDF

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JP4804429B2
JP4804429B2 JP2007196736A JP2007196736A JP4804429B2 JP 4804429 B2 JP4804429 B2 JP 4804429B2 JP 2007196736 A JP2007196736 A JP 2007196736A JP 2007196736 A JP2007196736 A JP 2007196736A JP 4804429 B2 JP4804429 B2 JP 4804429B2
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light
led
emitting
housing
wavelength
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JP2007300138A (en
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康雄 今井
武之 前川
令幸 後藤
成 明道
卓生 村井
章人 田中
健一 石井
秀樹 福田
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三菱電機株式会社
三菱電機照明株式会社
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/0008Reflectors for light sources providing for indirect lighting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Description

この発明は、発光ダイオードによる光源を用いて高効率の発光装置及びこれを用いた照明器具に関するものである。   The present invention relates to a high-efficiency light-emitting device using a light source by a light-emitting diode and a lighting fixture using the same.
従来の発光ダイオード(LED;Light Emitting Diode)を用いた発光装置及び照明装置に係わる発明は数多くある。そのうち、例えばLEDからの発光光を第二の光に変換し、反射的に取出そうとする高効率照明装置を実現する方法も幾つか提案されている。その中でも短波長LEDと蛍光体を組み合わせて発光装置を実現するものの例として次のようなものがある。   There are many inventions related to a light-emitting device and a lighting device using a conventional light-emitting diode (LED). Among them, for example, several methods for realizing a high-efficiency lighting device that converts light emitted from an LED into second light and takes out the light in a reflective manner have been proposed. Among them, the following is an example of realizing a light emitting device by combining a short wavelength LED and a phosphor.
従来の発光ダイオードは、発光ダイオード素子からの放射される放射束は、その一部が前記発光ダイオード素子の発光面側の前記発光ダイオード素子と対向する反射面に、また一部は直接光透過性部材を透過し出射面に向かう。反射面では、前記発光ダイオード素子からの放射束を受けることで可視光を放射する蛍光体により、主に500nm以上の可視域光の発光を行う。また、直接光透過性部材の表面に向かった放射束の中で、400nm以下の紫外域の成分は干渉膜20で反射され、再び透明樹脂材内に戻り、接着層16の蛍光体に当たり、可視光に変換され、直接または反射面に反射して出射面から干渉膜から出射する(例えば、特許文献1参照)。   In the conventional light emitting diode, the radiant flux emitted from the light emitting diode element is partially reflected on the reflective surface facing the light emitting diode element on the light emitting surface side of the light emitting diode element, and partly directly light transmissive. It passes through the member and goes to the exit surface. On the reflecting surface, the fluorescent material that emits visible light by receiving the radiant flux from the light-emitting diode element mainly emits visible light of 500 nm or more. In addition, in the radiant flux directed to the surface of the direct light transmissive member, the component in the ultraviolet region of 400 nm or less is reflected by the interference film 20, returns to the transparent resin material again, hits the phosphor of the adhesive layer 16, and is visible. The light is converted into light, and is reflected directly or reflected on the reflecting surface and is emitted from the interference film from the emitting surface (see, for example, Patent Document 1).
特開2001−345483号公報(段落0020〜0026、図1)。JP 2001-345483 (paragraphs 0020 to 0026, FIG. 1).
従来の発光ダイオードは、発光ダイオード素子からの放射束の紫外域を有効に活用できるので、発光ダイオードを用いた素子装置の高性能及び省エネルギー化が可能になるとしている。また、太陽光からの紫外線による光透過性部材の劣化及び黄変を防止できるので、発光ダイオードを屋外で使用する場合の寿命を高めることができ、特に屋外用映像表示装置装置として非常に好適なものであるとしている。   Since the conventional light emitting diode can effectively utilize the ultraviolet region of the radiant flux from the light emitting diode element, the element device using the light emitting diode can achieve high performance and energy saving. Moreover, since the deterioration and yellowing of the light-transmitting member due to the ultraviolet rays from sunlight can be prevented, the lifetime when the light-emitting diode is used outdoors can be increased, and it is particularly suitable as an outdoor video display device. It is said to be a thing.
しかしながら、本構造においては電極部材構造が障害となり、取り出す光の効率が低下する欠点があった。さらに装置本体の発光量をあげるため複数のLEDを利用するような場合、その電極面積が増加して、高い取りだし効率を保持したまま発光量を上げることは困難であった。   However, this structure has a drawback that the electrode member structure becomes an obstacle and the efficiency of the extracted light is lowered. Further, when a plurality of LEDs are used to increase the light emission amount of the apparatus main body, it is difficult to increase the light emission amount while maintaining a high extraction efficiency due to an increase in the electrode area.
また、透光性部材の上面に直接干渉膜を設ける方法であり、そのため透光性部材は必然的に固体のものでなくてはならなかった。そのため例えば熱伝導率のよい液体やジェル状の材料を透明材料として用いることはできなかった。また、特に発光面を下にして用いるような場合においては、LED素子が透明光部材に埋められた構造であるため、素子ジャンクション部で発生する熱の放熱効率が悪く、結果的にLED発光効率の低下や素子寿命を短くするといった問題があった。   Further, this is a method of directly providing an interference film on the upper surface of the translucent member, and therefore, the translucent member must be solid. For this reason, for example, a liquid or gel material having good thermal conductivity cannot be used as the transparent material. In particular, in the case where the light emitting surface is used downward, the LED element has a structure embedded in a transparent light member, so the heat dissipation efficiency of the heat generated at the element junction is poor, resulting in the LED light emission efficiency. There has been a problem of lowering the device life and shortening the device life.
この発明は、LED素子のような短波長光源を用いた発光装置を複数用いた場合の効率低下や放熱性を改善し、高効率で長寿命、さらに低コストの発光装置およびこれを用いた照明器具を得ることを目的とする。   The present invention improves efficiency reduction and heat dissipation when a plurality of light emitting devices using short wavelength light sources such as LED elements are used, and has high efficiency, long life, and low cost light emitting device and illumination using the same The purpose is to obtain the instrument.
この発明に係わる発光装置は、短波長光を放射するLED素子が実装されたLED実装基板と、凹部に前記LED素子の前記短波長光により変換光を発光する波長変換部が設けられた反射面を有する筐体と、前記筐体の開口縁部内側に内側面を前記凹部底面を向けて設けられたLED基板支持板と、を備え、前記LED基板支持板に前記LED素子の発光面を前記反射面の前記凹部底面に向けて前記LED実装基板が取り付けられ、前記波長変換部は、前記LED素子からの発光光が照射される前記反射面の部分のみに設けられ、前記発光光が照射されない前記反射面の部分には、反射性材料を設けたものである。 The light emitting device according to the present invention includes an LED mounting substrate on which an LED element that emits short wavelength light is mounted, and a reflective surface in which a wavelength conversion unit that emits converted light by the short wavelength light of the LED element is provided in the recess. And an LED substrate support plate provided with an inner surface facing the bottom surface of the recess on the inner side of the opening edge of the housing, and the light emitting surface of the LED element is disposed on the LED substrate support plate. The LED mounting substrate is attached toward the bottom surface of the concave portion of the reflective surface, and the wavelength conversion unit is provided only in the portion of the reflective surface where the emitted light from the LED element is irradiated, and the emitted light is not irradiated. The reflective surface is provided with a reflective material .
この発明は、凹部に前記LED素子の前記短波長光により変換光を発光する波長変換部が設けられた反射面を有する筐体と、前記筐体の開口縁部内側に内側面を前記凹部底面を向けて設けられたLED基板支持板と、を備え、前記LED基板支持板に前記LED素子の発光面を前記反射面の前記凹部底面に向けて前記LED実装基板が取り付けられたので、複数のLED素子を用いても発光効率が低下することがなく、また、放熱性に優れ、さらに、発光面からの光取り出し効率が高く、LED素子の光源のイメージが直接見えないようにすることができ、長寿命の発光装置及び照明器具を得ることができる。   The present invention includes a housing having a reflection surface provided with a wavelength conversion portion that emits converted light by the short wavelength light of the LED element in the recess, and an inner surface on the inner side of the opening edge of the housing. And the LED mounting board is attached to the LED board supporting plate with the light emitting surface of the LED element facing the bottom surface of the concave portion of the reflecting surface. Even if the LED element is used, the light emission efficiency is not lowered, the heat dissipation is excellent, the light extraction efficiency from the light emitting surface is high, and the image of the light source of the LED element can not be directly seen. A long-life light-emitting device and lighting fixture can be obtained.
実施の形態1.
図1はこの発明の実施の形態1を示す発光装置の断面図(図2のB断面図)、図2は発光装置の上面図、図3は発光装置のLED実装基板の上面図、図4は発光装置のLED実装基板の断面図(図3のB断面)、図5は発光装置の波長変換材料の説明図である。
Embodiment 1 FIG.
1 is a cross-sectional view of a light-emitting device according to Embodiment 1 of the present invention (B-sectional view of FIG. 2), FIG. 2 is a top view of the light-emitting device, FIG. 3 is a top view of an LED mounting substrate of the light-emitting device, and FIG. Is a cross-sectional view (cross-section B of FIG. 3) of the LED mounting substrate of the light-emitting device, and FIG. 5 is an explanatory diagram of the wavelength conversion material of the light-emitting device.
図1、図2において本発光装置は、近紫外線域にピークを持つような短波長LED素子12を実装したLED実装基板4、内側に表面が反射面2aとなる凹部を有する筐体2、筐体2内側の反射面2aに設けられ、LED素子12から発する光を励起光として波長を変換して変換光である第二の光を発光する波長変換部3、凹部の反射面2aの底部の中央に立設され、LED実装基板4を両面に支え、熱伝導性を有する基板支持板5、筐体2の開口部に取りつけられる透光性板1及び筐体2の背面中央部に設けられた高熱伝導性部材40から構成される。そして、2つのLED実装基板4は、それぞれのLED素子12の発光中心軸が筐体凹部の反射面2aの側面方向を向くように、基板支持板5の両側面に取り付けられ、透光性板1は筐体内部から発せられる光を外部に発光する発光面となり、例えばガラスや樹脂などの透光性板で構成される。   1 and 2, the light emitting device includes an LED mounting substrate 4 on which a short wavelength LED element 12 having a peak in the near ultraviolet region is mounted, a housing 2 having a concave portion whose surface is a reflecting surface 2a, a housing 2 The wavelength conversion unit 3 is provided on the reflection surface 2a on the inner side of the body 2, converts the wavelength by using light emitted from the LED element 12 as excitation light, and emits second light that is converted light, and the bottom of the reflection surface 2a of the recess. Standing at the center, supporting the LED mounting substrate 4 on both sides, a substrate support plate 5 having thermal conductivity, a translucent plate 1 attached to the opening of the housing 2, and a central portion on the back of the housing 2. Further, the high thermal conductivity member 40 is used. The two LED mounting substrates 4 are attached to both side surfaces of the substrate support plate 5 so that the light emission central axes of the respective LED elements 12 face the side surfaces of the reflecting surface 2a of the housing recess, Reference numeral 1 denotes a light emitting surface that emits light emitted from the inside of the housing to the outside, and is formed of a light-transmitting plate such as glass or resin.
凹部の反射面2aは、底部の中央に形成された稜線部2a1と、この稜線部2a1の両側に沿って谷部を有する2つの上面視長方形の放物面からなる反射面2a2と、この放物面の両端の側面2a4からなる。基板支持板5は、稜線部2a1に設けられた溝に勘合して立設され、基板支持板5の片側端面は、高熱伝導性部材40に一部が接している。
なお、筐体2は加工性のよさの面から耐熱性のよい樹脂で構成しているが、放熱性の面から金属などの高熱伝導性部材で構成してもよい。
The reflective surface 2a of the concave portion includes a ridgeline portion 2a1 formed at the center of the bottom portion, a reflective surface 2a2 composed of two paraboloids having a rectangular shape in top view and having valleys along both sides of the ridgeline portion 2a1. It consists of side surfaces 2a4 at both ends of the object surface. The substrate support plate 5 is erected by fitting into a groove provided in the ridge line portion 2 a 1, and a part of one end surface of the substrate support plate 5 is in contact with the high thermal conductivity member 40.
In addition, although the housing | casing 2 is comprised with resin with good heat resistance from the surface of good workability, you may comprise from highly heat conductive members, such as a metal, from the surface of heat dissipation.
次に、図3、図4はLED実装基板4の構成を示すが、本実施の形態においてはLED素子12の寿命や発光効率に関係するLED素子12の放熱性を高める目的で、LED基板10に金属基板を用いている。金属基板の電気的絶縁性を保つために基板上に絶縁層15、その上に導電パターン11を設け、その上にLED素子12を実装している。なお、導電パターン11上のLED素子12の実装部分を除いた部分には絶縁層15を設けた構造となっている。   Next, FIG. 3 and FIG. 4 show the configuration of the LED mounting substrate 4. In the present embodiment, the LED substrate 10 is used for the purpose of improving the heat dissipation of the LED element 12 related to the life of the LED element 12 and the light emission efficiency. A metal substrate is used. In order to maintain the electrical insulation of the metal substrate, the insulating layer 15 is provided on the substrate, the conductive pattern 11 is provided thereon, and the LED element 12 is mounted thereon. Note that an insulating layer 15 is provided on a portion of the conductive pattern 11 excluding the mounting portion of the LED element 12.
さらに、LED素子12から側面方向に放射される前記短波長光を、LED実装基板4の前面方向にある配光特性をもって取出すためのLED実装基板上板13を、接着層16を介してLED基板10と接合する構成としている。LED実装基板上板13にはLED12の配設位置に合わせて反射孔14を設けており、反射孔14の側面はLED素子12から発光した光を効率よく前面に放射するように拡散あるいは鏡面状の高反射率面とする。LED実装基板上板13は例えば金属、あるいは樹脂などで構成し、反射孔14以外の表面も照明効率を高めるように高反射率塗料で塗布、あるいは表面に高反射材料を蒸着するなどの処理を施す。   Furthermore, the LED mounting substrate upper plate 13 for taking out the short wavelength light emitted from the LED element 12 in the lateral direction with the light distribution characteristic in the front direction of the LED mounting substrate 4 is connected to the LED substrate through the adhesive layer 16. 10 is joined. The LED mounting substrate upper plate 13 is provided with reflecting holes 14 in accordance with the positions where the LEDs 12 are arranged, and the side surfaces of the reflecting holes 14 are diffused or mirror-like so that light emitted from the LED elements 12 is efficiently emitted to the front surface. The high reflectivity surface. The LED mounting substrate upper plate 13 is made of, for example, metal or resin, and the surface other than the reflection hole 14 is coated with a high reflectance paint so as to increase the illumination efficiency, or a process such as vapor deposition of a highly reflective material on the surface is performed. Apply.
さらに、LED素子12からの光取出し効率を上げるためにLED実装基板上板13の反射孔14には、LED素子12を覆うようにして透明性モールド材料17をモールドする。ここで透明性モールド材料17は、LED素子12が短波長であるため、例えば耐光性のあるシリコーン樹脂やガラスなどの材料で構成する。LED素子12はベアの状態でもよいが、このような構成にすることで光取出し効率を上げることができる。   Further, in order to increase the light extraction efficiency from the LED element 12, a transparent molding material 17 is molded in the reflection hole 14 of the LED mounting substrate upper plate 13 so as to cover the LED element 12. Here, since the LED element 12 has a short wavelength, the transparent mold material 17 is made of a material such as a light-resistant silicone resin or glass. Although the LED element 12 may be in a bare state, the light extraction efficiency can be increased by such a configuration.
LED基板10はガラスエポキシ基板でも発光装置としての機能に支障を与えないが、前述の通りLED素子12が発する熱の放熱性を高めるため金属基板としている。その他の放熱性基板として、高熱伝導性のフィルム基板を金属板に張り合わせたもの、あるいはセラミック材料を用いたものでもよい。   Although the LED substrate 10 is a glass epoxy substrate and does not hinder the function as a light emitting device, it is a metal substrate in order to enhance the heat dissipation of the heat generated by the LED element 12 as described above. As another heat dissipating substrate, a high heat conductive film substrate bonded to a metal plate or a ceramic material may be used.
ここで、LED素子12はフェースアップタイプやフリップチップタイプといった発光型の種類を特定するものではない。なお、反射孔14内の全体の反射率向上を目的とし、金属基板であるLED基板10上の表面絶縁層を高反射率性の塗料などで塗布する。   Here, the LED element 12 does not specify a light emitting type such as a face-up type or a flip chip type. For the purpose of improving the overall reflectance in the reflection hole 14, the surface insulating layer on the LED substrate 10 which is a metal substrate is applied with a highly reflective paint or the like.
なお、本実施例のとしてLED実装基板4に類似の構成として、LED基板とLED基板上板が一体化されたセラミクスや高熱伝導性樹脂を主材料とする市販LEDパッケージが存在する。本発光装置は発光部をこのような市販パッケージを用いた場合にも、その本質機能を失うことなく本実施例と同様の効果を得ることができる。
ここで本実施例の反射孔14及び市販パッケージ反射孔が、LEDが放射する短波長光に対して高反射率、さらにLED基板上板13表面及び市販パッケージ表面が、波長変換部により変換された変換波長光に対し高反射率である部材で構成することで、それら部位における光損失が少ない高い発光効率の発光装置を得ることができる。
In addition, as a structure similar to the LED mounting substrate 4 in the present embodiment, there is a commercially available LED package mainly composed of ceramics in which the LED substrate and the LED substrate upper plate are integrated or a high thermal conductive resin. This light-emitting device can obtain the same effect as that of this embodiment without losing its essential function even when such a commercially available package is used for the light-emitting portion.
Here, the reflection hole 14 and the commercial package reflection hole of the present embodiment are highly reflective to the short wavelength light emitted by the LED, and the surface of the LED board upper plate 13 and the commercial package surface are converted by the wavelength conversion unit. By using a member having a high reflectivity with respect to the converted wavelength light, a light emitting device with high light emission efficiency with little light loss at those portions can be obtained.
波長変換部3は、例えば、図5に示すように、短波長LED発光スペクトルS1を励起スペクトルとして発光を行う青色発光スペクトルS2、緑色発光スペクトルS3、赤色発光スペクトルS4をそれぞれ有する3種類の混合蛍光体として構成する。この構成により白色発光を実現するが、蛍光体混合の際、3種類の蛍光体の混合比は発光効率を高めるとともに演色性を高めるような比率で実現する。   For example, as shown in FIG. 5, the wavelength converter 3 has three types of mixed fluorescence each having a blue emission spectrum S2, a green emission spectrum S3, and a red emission spectrum S4 that emit light using the short wavelength LED emission spectrum S1 as an excitation spectrum. Configure as a body. With this configuration, white light emission is realized. However, when the phosphors are mixed, the mixing ratio of the three kinds of phosphors is realized at such a ratio that the luminous efficiency is enhanced and the color rendering property is enhanced.
波長変換部3をこのような構成とすることで、従来の青色発光LED素子とその波長によって励起され黄色発光を行うYAG系蛍光体(イットリウム・アルミニウム・ガーネット系蛍光体)を用いて白色発光を実現する方法に比較し、発光スペクトルの分光成分が変換光域で連続的となるため演色性の高い発光装置を得ることが可能である。   By configuring the wavelength conversion unit 3 in such a configuration, white light is emitted using a conventional blue light emitting LED element and a YAG phosphor (yttrium, aluminum, garnet phosphor) that is excited by the wavelength and emits yellow light. Compared with the method to realize, since the spectral component of the emission spectrum is continuous in the converted light region, it is possible to obtain a light emitting device with high color rendering.
しかしながら、本発光装置を構成する短波長LEDは紫外線、近紫外線、あるいは紫色、青色光を発光するものであり、上記内容をもって青色発光LEDとYAG系蛍光体による実現を制限するものではない。さらに短波長LED光が紫外光や紫色や青紫色の光色を有する近紫外光用いる場合、それらに励起される蛍光体種類は青、緑、赤をはじめとして複数の発光色を有するものが存在する。したがってその選定、組み合せによっては白色以外の任意光色を得ることや、例えば図5のS2、S3、S4に狭域スペクトルを有するものを選定することにより色再現域の広い発光装置を得ることもできる。   However, the short wavelength LED that constitutes the light emitting device emits ultraviolet light, near ultraviolet light, purple, or blue light, and the above contents do not limit the realization by the blue light emitting LED and the YAG phosphor. Furthermore, when short-wavelength LED light uses near-ultraviolet light having ultraviolet light or purple or blue-violet light, the phosphors excited by them may have multiple emission colors including blue, green, and red. To do. Therefore, depending on the selection and combination, it is possible to obtain an arbitrary light color other than white, or to obtain a light emitting device having a wide color reproduction range by selecting, for example, those having a narrow spectrum in S2, S3 and S4 in FIG. it can.
また、短波長LED発光波長を紫あるいは青紫色の発光波長(360〜420nm程度)を有する近紫外線発光であるもので構成すると、紫外発光するものに比較して、一般的にその領域での蛍光体励起効率は低いものの、LED素子12自身の放射強度は自己光吸収が少なく高くなる特徴がある。そのため、近紫外LEDを用いることで紫外線を用いる場合のような部材劣化が少なく、生体面への悪影響も少ない発光装置を得ることが可能である。さらに上記の通りこの波長域で励起帯を有する複数蛍光体が存在するため、装置発光色を任意に設計できる利点がある。   In addition, when the short wavelength LED emission wavelength is composed of near-ultraviolet emission having a violet or blue-violet emission wavelength (about 360 to 420 nm), the fluorescence in that region is generally compared with that of the ultraviolet emission. Although the body excitation efficiency is low, the emission intensity of the LED element 12 itself is characterized by high self-light absorption and high. Therefore, by using a near-ultraviolet LED, it is possible to obtain a light-emitting device with less deterioration of members as in the case of using ultraviolet rays and less adverse effects on the living body surface. Furthermore, as described above, since there are a plurality of phosphors having an excitation band in this wavelength region, there is an advantage that the device emission color can be arbitrarily designed.
また、LED素子12は一般的に素子内部温度や周囲温度が高くなると発光効率の低下を招くが、本発光装置を照明装置として使用する場合には、本発光装置の発光面を下向きにして用いる場合が多く、この場合、放熱性を考慮したこの発明の構成がLED発光効率や素子寿命に対して有効に機能する。   In general, the LED element 12 causes a decrease in light emission efficiency when the element internal temperature or the ambient temperature becomes high. However, when the light emitting device is used as a lighting device, the light emitting surface of the light emitting device is used downward. In many cases, the configuration of the present invention in consideration of heat dissipation functions effectively with respect to LED light emission efficiency and device lifetime.
特に、基板支持板5を金属などの熱伝導性材料で構成するとともに、筐体2の背面に設けた片面が空気中に置かれるような構成をとる高熱伝導性部材40と接触させ、LED素子12から発生する熱の放熱路を確保することで放熱性を高めることができる。熱伝導性材料には、例えば、熱伝導率の高いアルミニウム、銅、金属セラミクスなどを用いる。   In particular, the substrate support plate 5 is made of a heat conductive material such as a metal, and one side provided on the back surface of the housing 2 is brought into contact with a high heat conductive member 40 configured to be placed in the air, whereby an LED element is obtained. The heat radiation property can be enhanced by securing a heat radiation path for the heat generated from 12. As the heat conductive material, for example, aluminum, copper, metal ceramics or the like having high heat conductivity is used.
なお、図2のように基板支持板5の短辺側の少なくとも一端を筐体2の内側の凹部の側面2a4に接するように構成(図2点線上A点)することにより、接触端を上側にして側面発光装置として用いる場合にも、基板支持板5に沿った放熱路を確保できるため高い放熱効果を得ることができる。   As shown in FIG. 2, at least one end on the short side of the substrate support plate 5 is configured to be in contact with the side surface 2a4 of the concave portion on the inner side of the housing 2 (point A on the dotted line in FIG. 2). Even when used as a side light-emitting device, since a heat radiation path along the substrate support plate 5 can be secured, a high heat radiation effect can be obtained.
この構成において、筐体2の凹部中央の立設されたLED基板支持板5の両面に取り付けられたLED実装基板4のLED素子12から短波長光を励起光として放射し、筐体2の凹部の反射面2aに設けられた波長変換部3で波長が変換されて発光した変換光が透光性板1を経由して放射される。
このときLED素子12から発生する熱がLED実装基板4、基板支持板5、高熱伝導性部材40を介して放熱される。
In this configuration, short wavelength light is radiated as excitation light from the LED elements 12 of the LED mounting substrate 4 attached to both surfaces of the LED substrate support plate 5 erected at the center of the recess of the housing 2, and the recess of the housing 2. The converted light emitted by the wavelength conversion unit 3 provided on the reflective surface 2 a of which the wavelength is converted is emitted via the translucent plate 1.
At this time, heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the substrate support plate 5, and the high thermal conductivity member 40.
以上のように、凹部にLED素子12の短波長光により変換光を発光する波長変換部3が設けられた反射面2aを有する筐体2と、この筐体2の凹部底面の中央部に立設された熱伝導性のLED基板支持板5を備え、LED基板支持板5の両面にLED素子12が実装されたLED実装基板4を取り付けたので、LED実装基板4の放熱性を高めることができ、複数LED素子からなる大出力LED実装基板を用いた場合にも、LED素子温度の上昇を抑制することができ、結果的に効率がよく寿命の長い大光束発光装置を得ることができる。なお本発明による効果はLED素子が単数の場合にも有効である。
さらに、LED素子として近年開発が加速している大電流駆動、大光出力型があるが、それに相関する形で発熱量も大きいLED素子(ハイパワー素子)の組込みも可能にすることができる。
As described above, the casing 2 having the reflection surface 2a provided with the wavelength conversion section 3 that emits the converted light by the short wavelength light of the LED element 12 in the recess, and the central portion of the bottom surface of the recess of the casing 2 Since the LED mounting substrate 4 provided with the provided thermally conductive LED substrate supporting plate 5 and the LED elements 12 mounted on both sides of the LED substrate supporting plate 5 is attached, the heat dissipation of the LED mounting substrate 4 can be improved. In addition, even when a high-power LED mounting substrate composed of a plurality of LED elements is used, an increase in LED element temperature can be suppressed, and as a result, a large luminous flux light emitting device with high efficiency and long life can be obtained. The effect of the present invention is also effective when there is a single LED element.
Furthermore, although there is a large current drive type and a large light output type that have been recently developed as LED elements, it is possible to incorporate LED elements (high power elements) that generate a large amount of heat in a correlated manner.
なお、本実施の形態では、基板支持板5に接するように高熱伝導性部材40を筐体2の背面に取り付けたが、高熱伝導性部材40を取り付けずに、少なくとも基板支持板5が取り付けられる筐体2の凹部底面中央部を高熱伝導性部材で構成するようにしてもよい。   In the present embodiment, the high thermal conductivity member 40 is attached to the back surface of the housing 2 so as to be in contact with the substrate support plate 5, but at least the substrate support plate 5 is attached without attaching the high thermal conductivity member 40. You may make it comprise the center part of the recessed part bottom face of the housing | casing 2 with a highly heat conductive member.
また、図6に示すように基板支持板5の端部に接する高熱伝導性部材40の代わりに放熱フィン24などの放熱性部材を設けることで、さらに、放熱効果を与えることができる。また、筐体2を金属板で形成した例であるが、基板支持板5からの熱が放熱フィン24に伝わるため、図1のような筐体2の構成材料が樹脂やプラスチックのような非金属性の材料でもよい。   Further, as shown in FIG. 6, by providing a heat radiating member such as the heat radiating fins 24 instead of the high heat conductive member 40 in contact with the end portion of the substrate support plate 5, a heat radiating effect can be further provided. Further, although the case 2 is an example in which the case 2 is formed of a metal plate, since the heat from the substrate support plate 5 is transmitted to the heat radiating fins 24, the constituent material of the case 2 as shown in FIG. A metallic material may be used.
また、放熱フィン24以外に高い放熱効果を与える部材としてヒートパイプやペルチェ素子を用い、放熱フィン24と同様にLED基板支持板5の端部に接触するような構成としてもよい。   Moreover, it is good also as a structure which contacts the edge part of the LED board support plate 5 similarly to the radiation fin 24 using a heat pipe or a Peltier element as a member which gives a high thermal radiation effect other than the radiation fin 24.
また、図31に示すように、基板支持板5の基板取付部分5aを、反射面に2a対してLED実装基板4が斜め上方に位置するようにしてもよい。この構成により、透光性板1の表側からはLED素子12の光源のイメージが直接見えないようにすることができる。また、図32に示すように、LED基板支持板5のLED基板取付部分5aを、逆三角形状にしてもよく、LED実装基板4の背面が厚みがあり放熱効果をよくすることができる。この構成でLED基板取付部分5aの逆三角形状の表面(図の上側)は高反射率反射面であることが望ましく、また透光性板1に接してもよい。   Further, as shown in FIG. 31, the board mounting portion 5a of the board support plate 5 may be configured such that the LED mounting board 4 is positioned obliquely upward with respect to the reflecting surface 2a. With this configuration, it is possible to prevent the light source image of the LED element 12 from being directly visible from the front side of the translucent plate 1. Further, as shown in FIG. 32, the LED board mounting portion 5a of the LED board support plate 5 may be formed in an inverted triangle shape, and the back surface of the LED mounting board 4 is thick, so that the heat dissipation effect can be improved. In this configuration, the inverted triangular surface (upper side in the figure) of the LED board mounting portion 5a is preferably a high-reflectivity reflecting surface, and may be in contact with the translucent plate 1.
また、図1、図6に示すような肉厚の筐体2でなく図7のように薄い金属板で構成する形にしてもよい。図7では筐体2の他、波長変換部3の設置される反射部29も同様の金属板で構成している。また、高熱伝導性材料からなる基板支持板5をLED支持板抑え41で支え、金属の筐体2へ取り付けるようにすることで放熱効果を高めることができる。また、筐体2の背面に放熱フィン24などの高放熱性部材を装着することにより、さらに、放熱特性を良好にすることができる。   Moreover, you may make it the form comprised with a thin metal plate like FIG. 7 instead of the thick housing | casing 2 as shown in FIG. 1, FIG. In FIG. 7, in addition to the housing 2, the reflection unit 29 on which the wavelength conversion unit 3 is installed is formed of the same metal plate. Moreover, the heat dissipation effect can be enhanced by supporting the substrate support plate 5 made of a high thermal conductivity material with the LED support plate restraint 41 and attaching it to the metal housing 2. Further, by mounting a high heat radiating member such as the heat radiating fin 24 on the back surface of the housing 2, the heat radiating characteristics can be further improved.
さらに、LED素子12の放熱性を高めた結果、LED特有の波長シフトをかなり低い範囲に抑えることができ、結果、複数蛍光体を用いる場合にもそのそれぞれ発光スペクトル変動を極めて少なくし安定した発光色を得ることが可能である。   Furthermore, as a result of improving the heat dissipation of the LED element 12, the wavelength shift peculiar to the LED can be suppressed to a considerably low range. As a result, even when a plurality of phosphors are used, the emission spectrum fluctuation is extremely reduced and stable light emission is achieved. It is possible to obtain a color.
また、筐体2の凹部の反射面2aに直接、波長変換部3を設ける他に、図7に示すようなフレキシブルな波長変換材料付加用シート25上にあらかじめ波長変換部3を塗布するなどしておいて、それを反射部29に接着させる方法でもよい。このような構成にすることで、直接波長変換部3を塗布するような場合、反射面2aや反射部29の形状が複雑であるために、塗布膜厚の均斉度が悪くなるなどの現象を無くすることができる。また、製造方法が簡単で発光効率を高くすることができる。   In addition to providing the wavelength conversion unit 3 directly on the reflection surface 2a of the concave portion of the housing 2, the wavelength conversion unit 3 is applied in advance on a flexible wavelength conversion material addition sheet 25 as shown in FIG. Alternatively, it may be a method of adhering it to the reflecting portion 29. With such a configuration, when the wavelength conversion unit 3 is applied directly, the shape of the reflection surface 2a and the reflection unit 29 is complicated, so that the uniformity of the coating film thickness deteriorates. Can be eliminated. Further, the manufacturing method is simple and the luminous efficiency can be increased.
この際、波長変換部3は図33に示すように構成主材料である単一または複数種蛍光体60を、それらを固定化させるバインダ61に含有し構成する。このバインダ主材は例えば樹脂や水であるが、蛍光体との間で化学変化を生じないことや光機能に障害を与えないものを前提として選定する。本実施の形態では加工性、耐候性、透光性に良好で、また湾曲した凹部の反射面2aに対応可能な形状柔軟性のある例えばシリコーン材料で形成可能である。
また、波長変換材料付加用シート25の表面を、少なくともLED素子12が放射する短波長光に対し高反射率である鏡面あるいは拡散性の材料で構成する。このような構成にすることで一度は波長変換部3を通り抜けた光(UV11)を、この波長変換材料付加用シート25の表面により効率よくバインダへ再入射(UV12)させ、再度、波長変換機会を与えることができ結果として波長変換効率を向上することが可能である。このとき波長変換材料付加用シート25の表面反射率が波長変換後の光に対しても高反射率を有する材料であれば、バインダ内で波長変換された光を効率よく装置内部へ向け反射できるため、さらに、発光効率の高い発光装置を得ることが可能である。なお、波長変換材料付加用シート25として、例えば、PET、アルミ、銀などの多層構造によるシートを用いることができる。
At this time, as shown in FIG. 33, the wavelength conversion unit 3 includes the single or plural kinds of phosphors 60 as the main constituent materials in a binder 61 that fixes them. The binder main material is, for example, resin or water, but is selected on the assumption that it does not cause a chemical change between the phosphor and the optical function. In the present embodiment, it can be formed of, for example, a silicone material that is excellent in workability, weather resistance, and translucency, and has shape flexibility that can correspond to the reflecting surface 2a of the curved recess.
Further, the surface of the wavelength conversion material adding sheet 25 is made of at least a mirror surface or a diffusive material having a high reflectivity with respect to the short wavelength light emitted from the LED element 12. With such a configuration, the light (UV11) that has once passed through the wavelength conversion unit 3 is efficiently reincident (UV12) on the surface of the wavelength conversion material addition sheet 25, and the wavelength conversion opportunity is once again. As a result, it is possible to improve the wavelength conversion efficiency. At this time, if the surface reflectance of the wavelength conversion material addition sheet 25 is a material having a high reflectance with respect to the light after wavelength conversion, the light whose wavelength is converted in the binder can be efficiently reflected toward the inside of the apparatus. Therefore, it is possible to obtain a light emitting device with high luminous efficiency. In addition, as the wavelength conversion material addition sheet | seat 25, the sheet | seat by multilayer structure, such as PET, aluminum, silver, can be used, for example.
これは筐体2の凹部の反射面2aに直接、波長変換部3を設ける際、少なくとも波長変換部3の敷設される部分を高反射率材料で形成することでも同様の効果を得ることができる。本高反射率材料は筐体と同一材料でもよく、あるいは、筐体2上にアルミや銀などの金属蒸着や金属メッキすることで形成してもよい。
また、発光装置の波長変換部3は、波長変換部3の配設部に蛍光体を混入したバインド材料を直接塗布、あるいは噴霧したもの、あるいは蛍光体を蒸着形成させたものであってもよく、この際、上記同様に、少なくとも波長変換部3の配設部を高反射率材料で形成することで高い発光効率を有する発光装置を得ることができる。
The same effect can be obtained by forming at least the portion where the wavelength conversion unit 3 is laid with a high reflectivity material when providing the wavelength conversion unit 3 directly on the reflection surface 2a of the concave portion of the housing 2. . This high reflectivity material may be the same material as the housing, or may be formed on the housing 2 by metal deposition such as aluminum or silver or metal plating.
Further, the wavelength conversion unit 3 of the light emitting device may be one in which a binding material mixed with a phosphor is directly applied or sprayed on an arrangement part of the wavelength conversion unit 3, or a phosphor is formed by vapor deposition. In this case, similarly to the above, a light emitting device having high luminous efficiency can be obtained by forming at least the arrangement portion of the wavelength converting portion 3 with a high reflectance material.
さらに、図7に示すように透光性板1の内側背面に、LED素子12の発光波長部分を反射し、それ以外の波長領域の光を透過するフィルタや蒸着膜などのLED発光光反射部26を設けることで、LED素子12の発光光を直接外部へ発光させず、再度、波長変換部3からの発光に寄与するような部材として用いることができるため、発光効率を高めることが可能となる。
なお、LED発光光反射部26の有無に関係なく、透光性板1により筐体2表面を完全に塞ぎ、さらに筐体2内部に窒素ガスを封入、あるいは真空状態にすることなどで気密性を高める構成としてもよい。また、本透光性板1は装置内部の部品への接触保護や耐候性を高める機能を有するが、使用条件によっては本発光装置の基本機能の実現により必ずしも装着しなくてもよい。
Further, as shown in FIG. 7, an LED emission light reflecting portion such as a filter or a vapor deposition film that reflects the emission wavelength portion of the LED element 12 and transmits light in other wavelength regions on the inner back surface of the translucent plate 1. 26 can be used as a member that contributes to the light emission from the wavelength conversion unit 3 again without directly emitting the emitted light of the LED element 12 to the outside, so that the light emission efficiency can be increased. Become.
Regardless of the presence or absence of the LED emission light reflecting portion 26, the surface of the casing 2 is completely closed by the translucent plate 1, and nitrogen gas is sealed inside the casing 2 or a vacuum state is provided. It is good also as a structure which raises. In addition, the translucent plate 1 has a function of improving contact protection and weather resistance to components inside the apparatus, but depending on use conditions, the translucent board 1 may not be necessarily mounted by realizing the basic function of the light emitting apparatus.
また、筐体2の開口部にレンズ系27を用いるように構成することで配光を任意に変えることができる。レンズは耐光性のよい光学ガラスやシリコーン材料で構成し、目的に応じてレンズ形状を凸型、あるいは凹型というように形状を変え構成する(図はある程度装置前面中央に光が集まるようにしたもの)。   In addition, the light distribution can be arbitrarily changed by using the lens system 27 in the opening of the housing 2. The lens is made of light-resistant optical glass or silicone material, and the shape of the lens is changed depending on the purpose, such as convex or concave (the figure shows the light collected in the center of the device to some extent) ).
また、基板支持板5の上に、例えば、高反射率の拡散反射性マスク28を設置することで、発光面側からみたときのLED素子12の光源のイメージをなくすことをできるとともに、拡散反射性マスク28自体のイメージも弱めることができる。   Further, for example, by installing a highly reflective diffuse reflective mask 28 on the substrate support plate 5, it is possible to eliminate the image of the light source of the LED element 12 when viewed from the light emitting surface side, and diffuse reflection. The image of the sex mask 28 itself can also be weakened.
なお、図1、6、7において筐体2の凹部の形状を湾曲状としているが、例えば、凹部底面が平面となるような形状でもよく、凹部の形状により本発光装置の機能が失われることはない。例として、図34に凹部底面及び側面を平面状にした場合、図35に凹部の一部の底面を平面にし、側面を湾曲状にした場合の構成図を示す。
反射面2aは放物面が望ましいが、放物面の少なくとも一部の放物面を、前記放物面にほぼ近似する平面に代えてもよく、作りやすくすることができる。
また、上記では基板支持板を単独構成部品とし説明したが、それは熱伝導性の筐体2と一体構造、あるいは図7の反射面下に設けた金属板などと一体構造としてもよく、単独部品構成時と同じように放熱性機能は保たれる。
1, 6, and 7, the shape of the concave portion of the housing 2 is curved, but the shape of the concave portion may be flat, for example, and the function of the light emitting device is lost due to the shape of the concave portion. There is no. As an example, FIG. 34 shows a configuration diagram when the bottom surface and the side surface of the recess are made flat, and FIG. 35 shows a configuration when the bottom surface of a part of the recess is made flat and the side surface is curved.
The reflecting surface 2a is preferably a paraboloid, but at least a part of the paraboloid may be replaced with a plane that is substantially approximate to the paraboloid, and can be easily made.
In the above description, the substrate support plate is described as a single component, but it may be integrated with the heat conductive casing 2 or a metal plate provided under the reflecting surface of FIG. The heat dissipation function is maintained in the same way as in the configuration.
実施の形態2.
図8はこの発明の実施の形態2を示す発光装置の断面図(図9のB断面)、図9は発光装置の上面図である。
図8、図9において、実施の形態1の図1と同一または相当部分には同一の符号を付し説明を省略する。
筐体2の開口部縁部の向かい合う2辺に高熱伝導性部材40が、側面を凹部の底部の反射面2a2を向くように内側に張り出すように傾斜して取り付けられている。底部の反射面2a2は平面であり、高熱伝導性部材40が取り付けられる向かい合った側面2a3は底部の反射面2a2から開口部に向けて外側に広がるように形成され、その他の向かい合った側面2a4は底部の反射面2a2に垂直に形成されている。
そして、高熱伝導性部材40の内面側にLED素子の発光面を凹部底面の反射面2a2に向けてLED実装基板4が取り付けられる。
Embodiment 2. FIG.
FIG. 8 is a cross-sectional view of the light emitting device (cross section B of FIG. 9) showing Embodiment 2 of the present invention, and FIG. 9 is a top view of the light emitting device.
8 and 9, the same or corresponding parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
High heat conductive members 40 are attached to two opposite sides of the opening edge of the housing 2 so as to protrude inward so that the side faces the reflecting surface 2a2 at the bottom of the recess. The reflective surface 2a2 at the bottom is a flat surface, and the opposite side surface 2a3 to which the high thermal conductive member 40 is attached is formed so as to spread outward from the reflective surface 2a2 at the bottom, and the other opposed side surface 2a4 is the bottom. Is formed perpendicular to the reflective surface 2a2.
Then, the LED mounting substrate 4 is attached to the inner surface side of the high thermal conductivity member 40 with the light emitting surface of the LED element facing the reflecting surface 2a2 on the bottom surface of the recess.
この構成において、LED実装基板4のLED素子12から発する光を励起光として筐体2の凹部の反射面2aに設けられた波長変換部3で波長が変換されて発光した第二の光が透光性板1を経由して放射される。このとき、LED素子12から発生する熱がLED実装基板4、基板支持板5、高熱伝導性部材40、放熱フィン24を介して放熱される。   In this configuration, the light emitted from the LED element 12 of the LED mounting substrate 4 is converted into excitation light, and the second light emitted by the wavelength conversion unit 3 provided on the reflection surface 2a of the concave portion of the housing 2 is converted. Radiated via the light plate 1. At this time, the heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the substrate support plate 5, the high thermal conductivity member 40, and the radiation fins 24.
以上のように、筐体2の開口縁部内側に内側面を凹部底面の反射面2a2に向けて取り付けられた高熱伝導性部材40に、LED素子12の発光面を底部の反射面2a2に向けてLED実装基板4が取り付けられたので、透光性板1の表側からはLED素子12の光源のイメージが直接見えないようにすることができ、また、波長変換部3を実施の形態1と同様の構成として白色発光を得ることができる。
また、LED実装基板4の放熱性を高めることができ、LED素子12自体の発光効率低下、短寿命化を防ぐことができる。
As described above, the high thermal conductivity member 40 attached to the inner side of the opening edge of the housing 2 with the inner surface facing the reflecting surface 2a2 of the bottom of the recess, and the light emitting surface of the LED element 12 facing the reflecting surface 2a2 of the bottom. Since the LED mounting substrate 4 is attached, the image of the light source of the LED element 12 can be prevented from being directly seen from the front side of the translucent plate 1, and the wavelength conversion unit 3 is the same as that of the first embodiment. White light emission can be obtained with the same configuration.
Moreover, the heat dissipation of the LED mounting board | substrate 4 can be improved, and the luminous efficiency fall of LED element 12 itself and a lifetime shortening can be prevented.
なお、本実施の形態ではLED実装基板4が、筐体2の開口部の縁部で向かい合う2辺としたが、図10に示すように4辺に設けるようにしてもよい。また、筐体2の凹部底面形状を平面状としたが、例えば、湾曲状にしてもよくこれにより発光機能に影響を与えるものではない。図36にその場合の側面図を示す。
また、筐体2の凹部は上面視4辺形としたが、円形としてもよい。
また、図11(図12の断面図B)、図12のように高熱伝導性部材40の背面に放熱フィン24を設けて、さらに放熱効果を得るようにしてもよい。
また、本実施の形態では、筐体2の開口縁部にLED実装基板4を支持する高熱伝導性部材40を取り付けたが、高熱伝導性部材40の部分を取り付ける代わりに、少なくともこの部分を高熱伝導性部材で構成するようにしてもよい。
また、上記基板支持板を熱伝導性の筐体と一体構造としても構わず、その場合単独部品構成時と同じように放熱性機能は保たれる。
In the present embodiment, the LED mounting substrate 4 has two sides facing each other at the edge of the opening of the housing 2, but may be provided on four sides as shown in FIG. Further, although the bottom surface of the concave portion of the housing 2 is flat, it may be curved, for example, and this does not affect the light emitting function. FIG. 36 shows a side view in that case.
Moreover, although the recessed part of the housing | casing 2 was made into the quadrilateral top view, it is good also as a circle.
Further, as shown in FIG. 11 (cross-sectional view B in FIG. 12) and FIG. 12, heat radiation fins 24 may be provided on the back surface of the high thermal conductivity member 40 to further obtain a heat radiation effect.
Further, in the present embodiment, the high thermal conductivity member 40 that supports the LED mounting substrate 4 is attached to the opening edge of the housing 2, but instead of attaching the portion of the high thermal conductivity member 40, at least this portion is heated to high temperature. You may make it comprise with a conductive member.
Further, the substrate support plate may be integrated with a thermally conductive casing, and in that case, the heat dissipation function is maintained as in the case of a single component configuration.
実施の形態3.
図13はこの発明の実施の形態3を示す発光装置の断面図(図14のB断面)、図14は発光装置の上面図である。図13、図14において、実施の形態1の図1と同一または相当部分には同一の符号を付し説明を省略する。
筐体2の凹部の反射面2aは、中央部の稜線部2a1とこの稜線部2a1に沿って両側に谷部を有する樋状の二つの放物面状の反射面2a2からなり、稜線部2a1に平行な向かい合った両側面2a3に、LED素子12の発光面を反射面2a2に各々向けてLED実装基板4が取り付けられている。
そして、筐体2の両側面2a3の背面に放熱フィン24などの高放熱性部材を装着している。また、光取出し側の筐体開口面の縁部に内側に張り出すように、拡散反射性のマスク28を設け、直接、LED素子12の光源のイメージが見えないようにしている。
Embodiment 3 FIG.
FIG. 13 is a cross-sectional view of the light emitting device (cross section B of FIG. 14) showing Embodiment 3 of the present invention, and FIG. 14 is a top view of the light emitting device. 13 and 14, the same reference numerals are given to the same or corresponding parts as in FIG. 1 of the first embodiment, and the description thereof is omitted.
The reflective surface 2a of the concave portion of the housing 2 is composed of a ridge line portion 2a1 at the center and two parabolic reflective surfaces 2a2 having troughs on both sides along the ridge line portion 2a1, and the ridge line portion 2a1. The LED mounting substrate 4 is attached to the opposite side surfaces 2a3 parallel to each other with the light emitting surface of the LED element 12 facing the reflecting surface 2a2.
A high heat radiating member such as a heat radiating fin 24 is attached to the back surface of both side surfaces 2 a 3 of the housing 2. Further, a diffuse reflective mask 28 is provided so as to project inwardly at the edge of the opening surface of the housing on the light extraction side so that the image of the light source of the LED element 12 cannot be seen directly.
この構成において、LED実装基板4のLED素子12から発する光を励起光として筐体2の凹部の反射面2a2に設けられた波長変換部3で波長が変換されて発光した第二の光(白色光)が透光性板1を経由して放射される。このとき、LED素子12から発生する熱がLED実装基板4、筐体2の側面2a3、放熱フィン24を介して放熱される。   In this configuration, the light emitted from the LED element 12 of the LED mounting substrate 4 is excited by using the wavelength converted portion 3 provided on the reflecting surface 2a2 of the concave portion of the housing 2 as the second light (white color). Light) is emitted via the translucent plate 1. At this time, the heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the side surface 2 a 3 of the housing 2, and the radiation fins 24.
以上のように、筐体2の凹部の反射面2aは、中央部の稜線部2a1とこの稜線部2a1に沿って両側に谷部を有する樋状の二つの放物面からなる反射面2a2からなり、稜線部2a1に平行な向かい合った両側面2a3に、LED素子12の発光面を反射面2a2に各々向けてLED実装基板4が取り付けられ、両側面2a3に、放熱フィン24が取り付けられているので、LED素子12から発する熱が、筐体2の側面の放熱フィン24を介して空気中へ放熱されるため、LED素子12の発光効率を高く保つことができるとともに、LED素子12の寿命を長くすることができる。
また、開口面の縁部に拡散反射性マスク28を設けたので、発光面側からみたときのLED素子12の光源のイメージをなくすことをできる。
As described above, the reflecting surface 2a of the concave portion of the housing 2 is formed from the reflecting surface 2a2 composed of the central ridgeline portion 2a1 and two bowl-shaped paraboloids having valleys on both sides along the ridgeline portion 2a1. The LED mounting substrate 4 is attached to the opposite side surfaces 2a3 parallel to the ridge line portion 2a1 with the light emitting surface of the LED element 12 facing the reflecting surface 2a2, respectively, and the radiation fins 24 are attached to the side surfaces 2a3. Therefore, since the heat generated from the LED element 12 is radiated into the air through the radiation fins 24 on the side surface of the housing 2, the luminous efficiency of the LED element 12 can be kept high and the life of the LED element 12 can be increased. Can be long.
Further, since the diffuse reflection mask 28 is provided at the edge of the opening surface, the image of the light source of the LED element 12 when viewed from the light emitting surface side can be eliminated.
なお、放熱フィン24を装着せず、少なくともLED実装基板4が取り付けられる筐体2の凹部の両側面2a3を高熱伝導性部材で構成するようにしてもよく、放熱フィン24も装着してさらに放熱効果を高めてもよい。   Note that at least both side surfaces 2a3 of the concave portion of the housing 2 to which the LED mounting substrate 4 is attached may be formed of a high thermal conductivity member without mounting the heat dissipation fins 24, and the heat dissipation fins 24 may be mounted to further dissipate heat. The effect may be enhanced.
また、図15(図16B断面)、図16に示すように、筐体2の凹部の両側面2a3のLED実装基板4が取り付けられる部分にLED実装基板4と同じ大きさの開口部を設け、その筐体凹部からの光漏れがないように、かつ、開口部を介してLED実装基板4が直接空気に接するような構成にして、放熱特性を良好にしてもよい。この際、LED実装基板4の背面に放熱フィン24を設けることによりさらに放熱特性を高めることが可能となる。   Moreover, as shown in FIG. 15 (FIG. 16B cross section) and FIG. 16, the opening part of the same magnitude | size as the LED mounting board | substrate 4 is provided in the part to which the LED mounting board | substrate 4 of the both-sides 2a3 of the recessed part of the housing | casing 2 is attached, The LED mounting substrate 4 may be in direct contact with the air through the opening so as not to leak light from the housing recess, and the heat dissipation characteristics may be improved. At this time, it is possible to further improve the heat dissipation characteristics by providing the heat dissipation fins 24 on the back surface of the LED mounting substrate 4.
また、図13の波長変換部3を設けた筐体凹部の稜線部2a1はLED素子12の光軸中心(図13中C線)より上方向に位置するように構成することで、LED素子12からの発光する光を効率よく波長変換部に照射することができ、高い波長変換効率を得ることができる。なお図13で稜線部として構成した反射面は、図37のようにその反射面に平面部を有する構成であっても波長変換機能を保つことができる。   Further, the ridge line portion 2a1 of the housing recess provided with the wavelength conversion unit 3 of FIG. 13 is configured to be positioned above the center of the optical axis of the LED element 12 (C line in FIG. 13). The light emitted from the light can be efficiently irradiated onto the wavelength conversion unit, and high wavelength conversion efficiency can be obtained. In addition, even if the reflective surface comprised as a ridgeline part in FIG. 13 is a structure which has a plane part in the reflective surface like FIG. 37, a wavelength conversion function can be maintained.
また、図17、図18に示すように筐体2の凹部は円形状とし、中央部に凸部2a5と、この凸部1a5の外周に沿って形成された円形の放物面からなる反射面2a2を設けたものでもよい。この構成により波長変換効率及び光取出し効率を向上させることができる。また、筐体2の凹部の円形状は円形に近い多角形状でもよい。   As shown in FIGS. 17 and 18, the concave portion of the housing 2 has a circular shape, and a reflective surface comprising a convex portion 2 a 5 at the center and a circular paraboloid formed along the outer periphery of the convex portion 1 a 5. 2a2 may be provided. With this configuration, the wavelength conversion efficiency and the light extraction efficiency can be improved. Moreover, the circular shape of the recessed part of the housing | casing 2 may be a polygonal shape near circular.
また、LED実装基板4としては放熱性の高い金属基板やセラミクス基板で構成してもよいが、筐体2への実装容易性を考慮して、例えば、耐熱性の高いポリイミドのようなフレキシブル基板で構成してもよい。さらに、図14のように筐体2の背面に放熱フィン24を装着することで放熱効果を高めることができる。   The LED mounting substrate 4 may be a metal substrate or a ceramic substrate with high heat dissipation, but considering the ease of mounting on the housing 2, for example, a flexible substrate such as polyimide with high heat resistance. You may comprise. Furthermore, the heat radiation effect can be enhanced by attaching the heat radiation fins 24 to the back surface of the housing 2 as shown in FIG.
実施の形態4.
図19はこの発明の実施の形態4を示す発光装置の断面図(図20のB断面)、図20は発光装置の上面図、図21は発光装置の断面図(図20のA断面)である。
図19から21において、実施の形態1の図1と同一または相当部分には同一の符号を付し説明を省略する。
Embodiment 4 FIG.
19 is a cross-sectional view of the light-emitting device (cross-section B of FIG. 20) showing Embodiment 4 of the present invention, FIG. 20 is a top view of the light-emitting device, and FIG. 21 is a cross-sectional view of the light-emitting device (cross-section A of FIG. 20). is there.
19 to 21, the same or corresponding parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
筐体2の凹部の反射面2aは、両側の稜線部2a1とこの稜線部2a1の間に谷部を有する上面視長方形の樋状の放物面からなる反射面2a2が複数の稜線部2a1で接して並べられて構成され、各反射面2a2の稜線部2a1方向の両端部が筐体の側面2a3で支持されている。そして、LED実装基板4に実装されたLED素子12の光軸が各放物面からなる反射面2a2の間を通るようにLED実装基板4が向かい合った筐体の側面2a3に取り付けられている。
このように、LED素子12の発光軸に沿うように、また、隣り合うLED素子12間に稜線部2a1が位置するように、複数の湾曲ストライプ状をなしている。
The reflection surface 2a of the concave portion of the housing 2 is composed of a plurality of ridge line portions 2a1 having a plurality of ridge line portions 2a1 and a reflection surface 2a2 formed of a bowl-shaped paraboloid having a trough portion between the ridge line portions 2a1 and the ridge line portions 2a1. Both ends of each reflecting surface 2a2 in the direction of the ridge line 2a1 are supported by the side surface 2a3 of the housing. Then, the LED mounting substrate 4 is attached to the side surface 2a3 of the housing facing each other so that the optical axis of the LED element 12 mounted on the LED mounting substrate 4 passes between the reflecting surfaces 2a2 formed of paraboloids.
In this way, a plurality of curved stripes are formed so that the ridge line portion 2a1 is positioned between the LED elements 12 adjacent to each other along the light emission axis of the LED elements 12.
この構成において、LED実装基板4のLED素子12から発する光を励起光として筐体2の凹部の各々の反射面2a2に設けられた波長変換部3で波長が変換されて発光した第二の光が透光性板1を経由して放射される。このとき、LED素子12から発生する熱がLED実装基板4、筐体2の側面2a3、放熱フィン24を介して放熱される。   In this configuration, the light emitted from the LED element 12 of the LED mounting substrate 4 is excited light, and the second light emitted by the wavelength conversion unit 3 provided on each reflection surface 2a2 of the recess of the housing 2 is converted in wavelength. Is emitted via the translucent plate 1. At this time, the heat generated from the LED element 12 is radiated through the LED mounting substrate 4, the side surface 2 a 3 of the housing 2, and the radiation fins 24.
以上のように、反射面2aは、複数の稜線部2a1とこの稜線部2a1に沿って両側に谷部を有する樋状の複数の放物面からなる反射面2a2からなり、各反射面2a2の各両端の筐体の側面2a3に、LED実装基板4の発光面を反射面2a2に各々向けてLED実装基板4が取り付けられたので、LED素子12から多方面に発光する光を光軸に沿った限定的な範囲で波長変換することができ、大きな光損失がない状態で波長変換部3において波長変換されることから、波長変換効率及び、本発光装置からの光取り出し効率を向上することができる。   As described above, the reflection surface 2a is composed of the plurality of ridge line portions 2a1 and the reflection surface 2a2 including a plurality of parabolic surfaces having valleys on both sides along the ridge line portion 2a1, and each of the reflection surfaces 2a2 Since the LED mounting substrate 4 is attached to the side surface 2a3 of the housing at each end with the light emitting surface of the LED mounting substrate 4 facing the reflecting surface 2a2, the light emitted from the LED element 12 in various directions is along the optical axis. The wavelength conversion can be performed within a limited range, and the wavelength conversion is performed in the wavelength conversion unit 3 in a state where there is no large light loss, so that the wavelength conversion efficiency and the light extraction efficiency from the light emitting device can be improved. it can.
実施の形態5.
図22〜図25はこの発明の実施の形態5を示す発光装置の断面図である。
図22、図23、図24は実施の形態1の図6、実施の形態2の図8、実施の形態3の図13を各々リプロットした図であり、図25は図6の波長変換部3の大きさを示したものである。
Embodiment 5 FIG.
22 to 25 are cross-sectional views of a light-emitting device showing Embodiment 5 of the present invention.
22, FIG. 23, and FIG. 24 are replots of FIG. 6 of the first embodiment, FIG. 8 of the second embodiment, and FIG. 13 of the third embodiment, and FIG. 25 is the wavelength conversion unit 3 of FIG. It shows the size of.
図22〜図24において、実施の形態1の図4に示すLED実装基板上板13の反射孔14反射部角度や透明性モールド材料17のモールド形状を調整し、図22〜図24に示すようにLED実装基板4のLED素子12から発する光の配光を、LED素子12から見た筐体2の凹部内に入るような(図中のLED素子12の光軸からの角度δ以下に入るように)構成とする。   22 to 24, the reflection hole 14 reflection portion angle of the LED mounting substrate upper plate 13 shown in FIG. 4 of the first embodiment and the mold shape of the transparent molding material 17 are adjusted, as shown in FIGS. 22 to 24. The light distribution of the light emitted from the LED elements 12 of the LED mounting substrate 4 enters the recesses of the housing 2 as viewed from the LED elements 12 (entering an angle δ or less from the optical axis of the LED elements 12 in the figure). And so on.
このような構成とすることとにより、LED素子12からの発光光を効率良く波長変換部3に照射することが可能となり、効率のよい発光装置を実現できる。   By setting it as such a structure, it becomes possible to irradiate the light-emission light from the LED element 12 to the wavelength conversion part 3 efficiently, and an efficient light-emitting device is realizable.
さらに、図25に示すように、筐体2の凹部の反射面2aに設けられた波長変換部3の占有する部分をLED素子12の発光光の照射した範囲(照射角度β)に合わせて構成する。
この構成により波長変換部3の面積を小さくでき、波長変換部のコストを削減することが可能となり装置を安価にすることができる。
Furthermore, as shown in FIG. 25, the portion occupied by the wavelength conversion unit 3 provided on the reflection surface 2a of the concave portion of the housing 2 is configured to match the range (irradiation angle β) irradiated with the emitted light of the LED element 12. To do.
With this configuration, the area of the wavelength conversion unit 3 can be reduced, the cost of the wavelength conversion unit can be reduced, and the apparatus can be made inexpensive.
この際、波長変換部材料の施されていない反射面2aを高反射性の状態にすることで高発光効率を保つことが可能となる。反射面2aをアルミなどの鏡面反射材料で構成してもよいが、拡散反射性の高い白色材料で構成すれば、発光面側から見て波長変換部3と反射面2aの境界を認識しにくく見栄えのよい発光装置を得ることができる。   At this time, it is possible to maintain high light emission efficiency by making the reflecting surface 2a to which the wavelength conversion portion material is not applied in a highly reflective state. The reflection surface 2a may be made of a specular reflection material such as aluminum. However, if the reflection surface 2a is made of a white material having a high diffuse reflection property, it is difficult to recognize the boundary between the wavelength converter 3 and the reflection surface 2a when viewed from the light emitting surface side. A light-emitting device with good appearance can be obtained.
実施の形態6.
図26、図28〜30はこの発明の実施の形態6を示す発光装置を用いた照明器具の断面図(図27A断面図)、図27は図26、図28〜30の上面図である。
本実施の形態は、実施形態1〜3で示した発光装置を各々4台用いて最も構成が簡単な下面開放照明器具としたものである。
Embodiment 6 FIG.
26 and 28 to 30 are sectional views (sectional view of FIG. 27A) of a lighting fixture using the light emitting device according to Embodiment 6 of the present invention, and FIG. 27 is a top view of FIGS. 26 and 28 to 30.
In the present embodiment, the light emitting device shown in Embodiments 1 to 3 is used, and each of the four light emitting devices is used to form a bottom-open luminaire having the simplest configuration.
図26〜図30において、照明器具の上部に発光装置51を点灯するための点灯装置52を備え、点灯装置52へは照明器具の電源入力部53を介して商用電源を供給可能とし、また、点灯装置52を介して発光装置51に設けた電源入力部へLED素子12の点灯用の電力を供給するように構成している。発光装置51は中心部から4方向に4台配置されている。   26-30, it has the lighting device 52 for lighting the light-emitting device 51 in the upper part of a lighting fixture, and can supply commercial power to the lighting device 52 via the power supply input part 53 of a lighting fixture, The power for lighting the LED element 12 is supplied to the power input unit provided in the light emitting device 51 via the lighting device 52. Four light emitting devices 51 are arranged in four directions from the center.
図26は実施の形態1の発光装置51を用いたものであり、発光装置51の金属などで構成された高熱伝導性部材40が照明器具の照明器具筐体50に直接、あるいは高熱伝導性シールなどを介して設置される。   FIG. 26 uses the light emitting device 51 of the first embodiment, and the high heat conductive member 40 made of metal or the like of the light emitting device 51 is directly attached to the lighting fixture housing 50 of the lighting fixture or a high thermal conductive seal. It is installed through etc.
このような構成において、発光装置51のLEDから発生する熱がLED実装基板4、基板支持板5、高熱伝導性部材40を介して照明器具筐体50へ放熱される。   In such a configuration, heat generated from the LEDs of the light emitting device 51 is radiated to the lighting fixture housing 50 via the LED mounting substrate 4, the substrate support plate 5, and the high thermal conductivity member 40.
図28は放熱フィン24を装着した実施形態1の発光装置51を照明器具に適用したものである。照明器具の発光装置51の装着部において発光装置51の放熱フィン24は、直接空気中に触れるように構成する。
このような構成にしたことにより照明器具上部の対流による冷却も可能になり、さらに方熱効果を向上させることができる。
FIG. 28 shows a case where the light emitting device 51 of Embodiment 1 with the radiation fins 24 mounted thereon is applied to a lighting fixture. The radiating fin 24 of the light emitting device 51 is configured to directly touch the air in the mounting portion of the light emitting device 51 of the lighting fixture.
By adopting such a configuration, it is possible to cool the upper part of the lighting fixture by convection and further improve the heat effect.
図29は実施の形態2において、高熱伝導性部材40を取り付けた発光装置51を用いたものであり、発光装置51の高熱伝導性部材40が照明器具の照明器具筐体50に直接、あるいは高熱伝導性シールなどを介して設置される。
このような構成において、発光装置51のLEDから発生する熱がLED実装基板4、高熱伝導性部材40を介して照明器具筐体50へ放熱される。
FIG. 29 shows the use of the light emitting device 51 to which the high thermal conductivity member 40 is attached in the second embodiment, and the high thermal conductivity member 40 of the light emitting device 51 is directly or highly heated to the lighting fixture housing 50 of the lighting fixture. It is installed through a conductive seal.
In such a configuration, heat generated from the LED of the light emitting device 51 is radiated to the lighting fixture housing 50 via the LED mounting substrate 4 and the high thermal conductivity member 40.
図30は実施の形態3において、放熱フィン24の代わりに、高熱伝導性部材40が取り付けられた発光装置51を用いたものであり、発光装置51の筐体2のLED実装基板4が取付けられた部分が照明器具の照明器具筐体50に直接、あるいは高熱伝導性シールなどを介して設置される。
このような構成において、発光装置51のLEDから発生する熱がLED実装基板4、筐体2の高熱伝導性部材40を介して照明器具筐体50へ放熱される。
FIG. 30 shows a third embodiment in which a light emitting device 51 to which a high thermal conductivity member 40 is attached is used instead of the radiation fin 24, and the LED mounting substrate 4 of the housing 2 of the light emitting device 51 is attached. The part is installed directly on the lighting fixture housing 50 of the lighting fixture or through a high thermal conductive seal.
In such a configuration, heat generated from the LEDs of the light emitting device 51 is radiated to the lighting fixture housing 50 via the LED mounting substrate 4 and the high thermal conductivity member 40 of the housing 2.
以上のように、LED素子12の温度上昇を抑制することができ、発光効率がよく長寿命の照明装置を得ることができる。
また、照明光は一部が発光装置51からの発光光、また他の一部は反射板56で反射された光として、その混光によって得ることが可能である。
この際、反射板56は照明効率向上の面から高反射性材料が望ましく、目的とする照明用途に合わせ拡散面、あるいは鏡面仕上げとするようにしてもよい。
As described above, the temperature rise of the LED element 12 can be suppressed, and a lighting device with high luminous efficiency and long life can be obtained.
Further, the illumination light can be obtained by mixing the light as part of the light emitted from the light emitting device 51 and the other part as the light reflected by the reflecting plate 56.
At this time, the reflecting plate 56 is preferably made of a highly reflective material from the viewpoint of improving the illumination efficiency, and may be a diffusing surface or a mirror finish depending on the intended lighting application.
実施の形態7.
図38はこの発明の実施の形態7を示す発光装置の断面図(図39のB断面)、図39は発光装置の上面図である。図38、37において、実施の形態1の図1と同一または相当部分には同一の符号を付し説明を省略する。実施例1などと同様短波長光を放射するLED素子12が実装されたLED実装基板4と、凹部にLED素子の短波長光により変換光を発光する波長変換部3が設けられた反射面2aを有する筐体とを備えている。
ここで反射面2aは、LED実装基板4に対向して形成された放物面からなり、LED基板4は筐体凹部内の一側面にLED実装基板4の発光面を反射面2aに各々向けて取付けるように構成する。このような筐体2内の一辺にLED実装基板4を設けた発光装置においては、その透過性板1を下側に向けて使用する他、LED実装基板4が上側になるように透過性板1を横に向けた使用方法においても、LED素子12の発する熱は筐体に沿って上方へ向け放熱することができ、放熱性がよく発光効率の高い発光装置を得ることが可能である。
Embodiment 7 FIG.
FIG. 38 is a cross-sectional view of the light emitting device (cross section B of FIG. 39) showing Embodiment 7 of the present invention, and FIG. 39 is a top view of the light emitting device. 38 and 37, the same or corresponding parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Similar to the first embodiment, the LED mounting substrate 4 on which the LED element 12 that emits short-wavelength light is mounted, and the reflection surface 2a in which the wavelength conversion section 3 that emits converted light by the short-wavelength light of the LED element is provided in the recess. And a housing having
Here, the reflective surface 2a is formed of a parabolic surface formed to face the LED mounting substrate 4, and the LED substrate 4 faces the light emitting surface of the LED mounting substrate 4 toward the reflective surface 2a on one side surface inside the housing recess. To be installed. In such a light emitting device in which the LED mounting substrate 4 is provided on one side in the housing 2, the transparent plate 1 is used so that the LED mounting substrate 4 is on the upper side. Also in the usage method in which 1 is directed sideways, the heat generated by the LED element 12 can be dissipated upward along the housing, and a light emitting device with good heat dissipation and high light emission efficiency can be obtained.
この際、LED発光光の最大配光角を図38の最大配光の角度δのように反射面2a内に制限することで、波長変換部一次励起光となるLED発光光を効率よく波長変換部3に照射することができ、発光効率の高い発光装置を実現することができる。また図40のように実施の形態3に類似する表面が鏡面あるいは拡散性で高反射率の光反射マスク62を用いても、直接透光性板1に入射するLED発光光の割合を低くすることができ、やはり発光効率のよい発光装置を得ることができる。なお光反射マスク62は筐体と一体構造であってかまわない。また、凹部の反射面2aは例えば図41のように、放物面にほぼ近似した平面から構成してもよく、また、図42のように放物面と平面部とから構成としても、波長変換機能を実現することが可能である。   At this time, by limiting the maximum light distribution angle of the LED light emission within the reflection surface 2a as shown by the maximum light distribution angle δ in FIG. 38, the wavelength conversion of the LED light that becomes the wavelength converter primary excitation light is efficiently performed. It is possible to irradiate the unit 3 and to realize a light emitting device with high luminous efficiency. 40, even if a light reflection mask 62 having a mirror-like surface or a diffusive surface having a high reflectance is used, the ratio of the LED emission light directly incident on the translucent plate 1 is lowered. Thus, a light emitting device with high luminous efficiency can be obtained. The light reflection mask 62 may be integrated with the housing. Further, the reflecting surface 2a of the concave portion may be constituted by a plane approximately approximate to a paraboloid as shown in FIG. 41, for example, or may be constituted by a paraboloid and a plane portion as shown in FIG. It is possible to realize a conversion function.
また、図43(図44のB断面)に波長変換部3がLED基板4に対向して形成された放物面からなり、筐体凹部の開口縁部に設けられた一つの傾斜部材である高熱伝導性部材40にLED実装基板4の発光面を反射面2aに向けて取付けるように構成してもよい。図38、図39同様、透過性板1を下側に向けて使用する他、LED実装基板4が上側になるように透過性板1を横に向けた使用方法においても、放熱性がよく発光効率の高い発光装置を得ることが可能である。
図45はLED実装基板4背面が厚みのある高熱伝導性部材54で構成した例であり高い放熱効果を得ることが可能である。ここで図45に示すように光源設置側の側面にも波長変換部3を配設する構成としてもよい。
43 (cross section B in FIG. 44), the wavelength conversion unit 3 is a single inclined member formed of a paraboloid formed facing the LED substrate 4 and provided at the opening edge of the housing recess. You may comprise so that the light emission surface of the LED mounting board | substrate 4 may be attached to the highly heat conductive member 40 toward the reflective surface 2a. 38 and 39, the transmissive plate 1 is used with the transmissive plate 1 facing downward, and the transmissive plate 1 is oriented sideways so that the LED mounting substrate 4 faces upward. A highly efficient light-emitting device can be obtained.
FIG. 45 shows an example in which the back surface of the LED mounting substrate 4 is composed of a thick high thermal conductive member 54, and a high heat dissipation effect can be obtained. Here, as shown in FIG. 45, the wavelength conversion unit 3 may be disposed also on the side surface on the light source installation side.
なお、図43、図45では反射面2aが放物面の場合を示したが、放物面の少なくとも一部の放物面を、前記放物面にほぼ近似する平面に代えてもよく、LED実装基板4の取付位置により底部が平面でもよく、また、放物面と平面部とから構成して作りやすくすることができる。   43 and 45 show the case where the reflecting surface 2a is a paraboloid, but at least a part of the paraboloid of the paraboloid may be replaced with a plane that approximates the paraboloid, Depending on the mounting position of the LED mounting substrate 4, the bottom may be a flat surface, or it may be made of a paraboloid and a flat surface for easy manufacture.
また、図46のように筐体2内部の底面の一部に凹部を設け、その凹部内に波長変換部3を配設し、少なくともLED光軸より透光性板1側のLED素子12の最大配光の角度δがその領域内に収まるような構成とすることでも発光効率が高い発光装置を得ることができる。さらに配光角を狭め波長変換部領域を小さくすることでコスト的に安価な発光装置を得ることができる。   Further, as shown in FIG. 46, a recess is provided in a part of the bottom surface inside the housing 2, and the wavelength conversion unit 3 is disposed in the recess, and at least the LED element 12 on the translucent plate 1 side from the LED optical axis. A light emitting device with high luminous efficiency can also be obtained by adopting a configuration in which the angle δ of the maximum light distribution falls within the region. Further, by reducing the light distribution angle and reducing the wavelength conversion region, a light emitting device that is inexpensive in cost can be obtained.
また、本実施の形態で示した構成の発光装置51は、例えば図47(器具断面図を示す)のように本発光装置の放熱性を高めるような照明器具筐体50に組み込み、発光効率の高い大光束照明器具として使用することができる。本発光装置を紙面方向に複数個配列する長方形状の照明器具の場合にも、図のように装置側面あるいは筐体背面が高熱伝導性材料で成形された照明器具筐体50に接触(密着)するようにし放熱性を確保する構成としている。
また、図48(器具断面図を示す)のように複数の発光装置51をその放熱性を高める構成で配置した照明器具として使用することができ、紙面奥行き方向にも複数個配列することで広い大光束面の照明器具を得ることができる。図48は熱伝導性材料で形成された照明器具筐体50に開口部50cを設け、それにあわせて発光装置の発光面(透光性板1)を設置した例である。
In addition, the light emitting device 51 having the configuration shown in the present embodiment is incorporated in a lighting fixture housing 50 that enhances the heat dissipation of the light emitting device as shown in FIG. It can be used as a high luminous flux luminaire. Even in the case of a rectangular luminaire in which a plurality of the light emitting devices are arranged in the direction of the paper, the side surface of the device or the back surface of the housing is in contact with (contacted with) the luminaire housing 50 formed of a high thermal conductivity material as shown in the figure. Thus, the heat dissipation is ensured.
Further, as shown in FIG. 48 (showing a sectional view of the appliance), a plurality of light emitting devices 51 can be used as a lighting fixture arranged in a configuration that enhances heat dissipation, and a plurality of light emitting devices 51 can be arranged in the depth direction of the paper. A lighting device having a large luminous flux surface can be obtained. FIG. 48 shows an example in which an opening 50c is provided in a lighting fixture housing 50 made of a heat conductive material, and a light emitting surface (translucent plate 1) of the light emitting device is installed accordingly.
照明器具筐体50は、前面に前面開口部50a(照明器具の発光面表面)、底部50bに発光装置51の筐体2の発光面側が挿着される開口部50cを有し、箱状に形成され、底部50bの内側表面は高反射率材料で覆われ、前面開口部50aは拡散透過板63で覆われている。
なお、前面開口部50aから裏側に立設部50dを設け、照明器具筐体50と発光装置51との熱伝導をよくするとともに固定し易くしている。また、照明器具筐体50の底部50bと発光装置の透光性板1の各々の面は段差がないようにするのが望ましい。
The lighting fixture housing 50 has a front opening 50a (light emitting surface surface of the lighting fixture) on the front surface, and an opening 50c into which the light emitting surface side of the housing 2 of the light emitting device 51 is inserted in the bottom 50b. The inner surface of the bottom 50b is covered with a highly reflective material, and the front opening 50a is covered with a diffuse transmission plate 63.
In addition, the standing part 50d is provided in the back side from the front opening part 50a, and makes it easy to fix while improving heat conduction with the lighting fixture housing | casing 50 and the light-emitting device 51. FIG. Further, it is desirable that there are no steps between the bottom 50b of the luminaire housing 50 and the surfaces of the light-transmitting plate 1 of the light emitting device.
この構成において、発光装置51から放射された光は、拡散透過板63を透過して放射され、また、拡散透過板63で反射した光は照明器具筐体50の底部50bの高反射率材料で反射し、拡散透過板63を透過して放射される。
また、発光装置51から発生する熱は筐体2から照明器具筐体50の立設部50dを介して照明器具筐体50へ放熱される。
In this configuration, the light emitted from the light emitting device 51 is radiated through the diffusing and transmitting plate 63, and the light reflected by the diffusing and transmitting plate 63 is a high reflectance material at the bottom 50 b of the luminaire housing 50. The light is reflected and radiated through the diffuse transmission plate 63.
Further, the heat generated from the light emitting device 51 is radiated from the housing 2 to the lighting fixture housing 50 via the standing portion 50 d of the lighting fixture housing 50.
このように、LED素子12の温度上昇を抑制することができ、発光効率がよく長寿命の照明装置を得ることができる。
また、照明光は一部が発光装置51からの発光光、また他の一部は照明器具筐体50の底部50bの高反射率材料で反射した光が拡散透過板63を透過して放射されるので、均一のものとすることができ、高い発光効率で均一な照明光の照明器具を得ることができる。
Thus, the temperature rise of the LED element 12 can be suppressed, and a lighting device with high luminous efficiency and long life can be obtained.
Further, part of the illumination light is emitted from the light emitting device 51, and the other part of the light reflected by the high reflectivity material on the bottom 50b of the luminaire housing 50 is transmitted through the diffuse transmission plate 63 and emitted. Therefore, it can be made uniform, and a lighting apparatus with uniform illumination light can be obtained with high luminous efficiency.
以下、本発光装置の波長変換部3の他の構成について図49、図50、図51を用い説明する。図49図、48発光装置の断面図、図51は図49、図50の平面図である。
図49の波長変換部3はその配設部分を高反射率面での構成し、波長変換部3表面形状を凹凸状に形成している。このような構造によりある固定寸法を有する筐体において、波長変換部3が平坦で構成される場合に対して、その表面のLED照射面積を広く確保することができ、結果高効率の発光装置を得ることができる。さらに図50のように波長変換部3の表面を凹凸形状に構成するとともに、その形状に合わせて反射面2aを形成する構成によってもLED照射面積を増やしつつ蛍光変換部の厚みを一定にできるため、図49同様に高い発光効率で、かつ安価な発光装置を得ることが可能である。
Hereinafter, another configuration of the wavelength conversion unit 3 of the light emitting device will be described with reference to FIGS. 49, 50, and 51. 49 and 48 are cross-sectional views of the light-emitting device, and FIG. 51 is a plan view of FIGS.
The wavelength conversion unit 3 in FIG. 49 is configured with a high reflectance surface in the arrangement portion, and the surface of the wavelength conversion unit 3 is formed in an uneven shape. In a case having a fixed dimension due to such a structure, it is possible to secure a wide LED irradiation area on the surface of the case where the wavelength conversion unit 3 is configured to be flat, resulting in a highly efficient light-emitting device. Obtainable. Further, as shown in FIG. 50, the surface of the wavelength conversion unit 3 is configured to have an uneven shape, and the thickness of the fluorescence conversion unit can be made constant while increasing the LED irradiation area by the configuration in which the reflection surface 2a is formed in accordance with the shape. As in FIG. 49, it is possible to obtain a light emitting device with high luminous efficiency and at low cost.
なお、波長変換部3の凹凸形状は、例えば、図51(a)に示すように、ピラミット形状としてもよく、図51(b)のように直線の三角波形状(点線が稜線、実線が谷を示す)としてもよい。また、図51(c)のように曲線の三角波形状としてもよい。いずれも、反射面2aの傾斜部分のピッチを平面部より小さくしている。図51(c)に示すものは、LED素子12の数が少ない場合、凹凸形状部とLED素子12との距離を等しくでき効果的である。
また、この波長変換部の構成は本実施の形態に制限されるものでなく、構成前述した実施例の波長変換部においても実施可能である。
例えば、実施の形態7の図46で示した波長変換部3などに用いると効果的である。
The uneven shape of the wavelength conversion unit 3 may be a pyramid shape, for example, as shown in FIG. 51A, and a straight triangular wave shape (a dotted line is a ridge line and a solid line is a valley as shown in FIG. 51B). It may also be shown). Moreover, it is good also as a triangular wave shape of a curve like FIG.51 (c). In either case, the pitch of the inclined portion of the reflecting surface 2a is made smaller than that of the plane portion. In the case shown in FIG. 51 (c), when the number of the LED elements 12 is small, the distance between the concavo-convex shape portion and the LED elements 12 can be made equal, which is effective.
Further, the configuration of the wavelength conversion unit is not limited to the present embodiment, and the configuration can also be implemented in the wavelength conversion unit of the example described above.
For example, it is effective when used for the wavelength converter 3 shown in FIG. 46 of the seventh embodiment.
以上、本実施の形態は、発光装置51とそれを用いた照明器具を示したが、本実施の形態で示した発光装置51を実施の形態6で示した照明器具に用いても同様な効果を得ることができる。   As mentioned above, although this Embodiment showed the light-emitting device 51 and the lighting fixture using the same, even if it uses the light-emitting device 51 shown in this Embodiment for the lighting fixture shown in Embodiment 6, the same effect is shown. Can be obtained.
この発明の実施の形態1を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 1 of this invention. 図1の上面図である。FIG. 2 is a top view of FIG. 1. この発明の実施の形態1を示す発光装置のLED実装基板の上面図である。It is a top view of the LED mounting board | substrate of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態1を示す発光装置のLED実装基板の断面図である。It is sectional drawing of the LED mounting board | substrate of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態1を示す発光装置の波長変換材料の構成説明図である。It is composition explanatory drawing of the wavelength conversion material of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態1を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態1を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態2を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 2 of this invention. 図8の上面図である。FIG. 9 is a top view of FIG. 8. この発明の実施の形態2を示す発光装置の上面図である。It is a top view of the light-emitting device which shows Embodiment 2 of this invention. この発明の実施の形態2を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 2 of this invention. 図11の上面図である。FIG. 12 is a top view of FIG. 11. この発明の実施の形態3を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 3 of this invention. 図13の上面図である。FIG. 14 is a top view of FIG. 13. この発明の実施の形態3を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 3 of this invention. 図15の上面図である。FIG. 16 is a top view of FIG. 15. この発明の実施の形態3を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 3 of this invention. 図17の上面図である。FIG. 18 is a top view of FIG. 17. この発明の実施の形態4を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 4 of this invention. 図19の上面図である。FIG. 20 is a top view of FIG. 19. この発明の実施の形態4を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 4 of this invention. この発明の実施の形態5を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 5 of this invention. この発明の実施の形態5を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 5 of this invention. この発明の実施の形態5を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 5 of this invention. この発明の実施の形態5を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 5 of this invention. この発明の実施の形態6を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows Embodiment 6 of this invention. 図26の上面図である。It is a top view of FIG. この発明の実施の形態6を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows Embodiment 6 of this invention. この発明の実施の形態6を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows Embodiment 6 of this invention. この発明の実施の形態6を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows Embodiment 6 of this invention. この発明の実施の形態1を示す発光装置の基板支持板の一構成例を示す断面図である。It is sectional drawing which shows one structural example of the board | substrate support plate of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態1を示す発光装置の基板支持板の一構成例を示す断面図である。It is sectional drawing which shows one structural example of the board | substrate support plate of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態1の波長変換部の一構成例を示す図である。It is a figure which shows the example of 1 structure of the wavelength converter of Embodiment 1 of this invention. この発明の実施の形態1を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態1を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 1 of this invention. この発明の実施の形態2を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 2 of this invention. この発明の実施の形態3を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 3 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の上面図である。It is a top view of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の上面図である。It is a top view of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7の発光装置を用いた照明器具の断面図である。It is sectional drawing of the lighting fixture using the light-emitting device of Embodiment 7 of this invention. この発明の実施の形態7の発光装置を用いた照明器具の断面図である。It is sectional drawing of the lighting fixture using the light-emitting device of Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. この発明の実施の形態7を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. 図49、図50の平面図である。It is a top view of FIG. 49, FIG.
符号の説明Explanation of symbols
1 透光性板、2 筐体、2a、2a2 反射面、2a1 稜線部、2a3、2a4 側面、3 波長変換部、4 LED実装基板、5 基板支持板、12 LED素子、24 放熱フィン、40 高熱伝導性部材、50 照明器具筐体、51 発光装置。
60 蛍光体、61バインダ、62光反射マスク、63拡散透過板。
DESCRIPTION OF SYMBOLS 1 Translucent board, 2 Housing | casing, 2a, 2a2 Reflecting surface, 2a1 Ridge part, 2a3, 2a4 Side surface, 3 Wavelength conversion part, 4 LED mounting board, 5 Substrate support plate, 12 LED element, 24 Radiation fin, 40 High heat Conductive member, 50 luminaire housing, 51 light emitting device.
60 phosphor, 61 binder, 62 light reflection mask, 63 diffuse transmission plate.

Claims (21)

  1. 短波長光を放射するLED素子が実装されたLED実装基板と、
    凹部に前記LED素子の前記短波長光により変換光を発光する波長変換部が設けられた反射面を有する筐体と、
    前記筐体の開口縁部内側に内側面を前記凹部底面を向けて設けられたLED基板支持板と、
    を備え、
    前記LED基板支持板に前記LED素子の発光面を前記反射面の前記凹部底面に向けて前記LED実装基板が取り付けられ
    前記波長変換部は、前記LED素子からの発光光が照射される前記反射面の部分のみに設けられ、
    前記発光光が照射されない前記反射面の部分には、反射性材料を設けたことを特徴とする発光装置。
    An LED mounting substrate on which an LED element that emits short-wavelength light is mounted;
    A housing having a reflective surface provided with a wavelength conversion section that emits converted light by the short wavelength light of the LED element in a recess;
    An LED board support plate provided on the inner side of the opening edge of the housing with the inner side facing the bottom of the recess;
    With
    The LED mounting substrate is attached to the LED substrate support plate with the light emitting surface of the LED element facing the bottom surface of the concave portion of the reflecting surface ,
    The wavelength conversion unit is provided only in a part of the reflection surface irradiated with light emitted from the LED element,
    A light-emitting device, wherein a reflective material is provided on a portion of the reflective surface that is not irradiated with the emitted light.
  2. 短波長光を放射するLED素子が実装された複数のLED実装基板と、
    凹部に前記LED素子の前記短波長光により変換光を発光する波長変換部が設けられた反射面を有する筐体と、
    を備え、
    前記反射面は、中央部の稜線部とこの稜線部に沿って両側に谷部を有する樋状の放物面からなり、
    前記稜線部に対向する筐体の両側面に、前記LED素子の発光面を前記反射面に各々向けて前記LED実装基板が取り付けられ
    前記波長変換部は、前記LED素子からの発光光が照射される前記反射面の部分のみに設けられ、
    前記発光光が照射されない前記反射面の部分には、反射性材料を設けたことを特徴とする発光装置。
    A plurality of LED mounting substrates on which LED elements emitting short wavelength light are mounted;
    A housing having a reflective surface provided with a wavelength conversion section that emits converted light by the short wavelength light of the LED element in a recess;
    With
    The reflective surface is composed of a ridge line part at the center and a bowl-shaped paraboloid having valleys on both sides along the ridge line part,
    The LED mounting substrate is attached to both side surfaces of the casing facing the ridge line portion with the light emitting surfaces of the LED elements facing the reflecting surfaces, respectively .
    The wavelength conversion unit is provided only in a part of the reflection surface irradiated with light emitted from the LED element,
    A light-emitting device, wherein a reflective material is provided on a portion of the reflective surface that is not irradiated with the emitted light.
  3. 短波長光を放射するLED素子が実装されたLED実装基板と、
    凹部に前記LED素子の前記短波長光により変換光を発光する波長変換部が設けられ、中央部の凸部及びこの凸部の外周に沿って形成された略円形の放物面からなる反射面を有する筐体と、
    を備え、
    前記凸部を囲む筐体の側面に、前記LED素子の発光面を前記反射面に各々向けて前記LED実装基板が取り付けられ
    前記波長変換部は、前記LED素子からの発光光が照射される前記反射面の部分のみに設けられ、
    前記発光光が照射されない前記反射面の部分には、反射性材料を設けたことを特徴とする発光装置。
    An LED mounting substrate on which an LED element that emits short-wavelength light is mounted;
    A reflective surface comprising a convex portion at the center and a substantially circular paraboloid formed along the outer periphery of the convex portion provided with a wavelength conversion portion that emits converted light by the short wavelength light of the LED element in the concave portion A housing having
    With
    The LED mounting substrate is attached to the side surface of the casing surrounding the convex portion with the light emitting surface of the LED element facing the reflecting surface, respectively .
    The wavelength conversion unit is provided only in a part of the reflection surface irradiated with light emitted from the LED element,
    A light-emitting device, wherein a reflective material is provided on a portion of the reflective surface that is not irradiated with the emitted light.
  4. 前記反射面の稜線部、または、凸部の頂点は、前記LED素子の光軸よりも前記筐体の開口面側に位置することを特徴とする請求項2または請求項3記載の発光装置。   4. The light emitting device according to claim 2, wherein an edge of the reflecting surface or a vertex of the convex portion is located closer to the opening surface of the housing than the optical axis of the LED element.
  5. 短波長光を放射するLED素子が実装された複数のLED実装基板と、
    凹部に前記LED素子の前記短波長光により変換光を発光する波長変換部が設けられた反射面を有する筐体と、
    を備え、
    前記反射面は、複数の稜線部とこの稜線部に沿って両側に谷部を有する樋状の複数の放物面からなり、
    前記各放物面の各両端の筐体側面に、前記LED実装基板の発光面を前記反射面に各々向けて前記LED実装基板が取り付けられ
    前記波長変換部は、前記LED素子からの発光光が照射される前記反射面の部分のみに設けられ、
    前記発光光が照射されない前記反射面の部分には、反射性材料を設けたことを特徴とする発光装置。
    A plurality of LED mounting substrates on which LED elements emitting short wavelength light are mounted;
    A housing having a reflective surface provided with a wavelength conversion section that emits converted light by the short wavelength light of the LED element in a recess;
    With
    The reflective surface is composed of a plurality of ridgeline portions and a plurality of bowl-shaped paraboloids having valleys on both sides along the ridgeline portions,
    The LED mounting substrate is attached to the side surfaces of the casings at both ends of each paraboloid, with the light emitting surface of the LED mounting substrate facing the reflecting surface, respectively .
    The wavelength conversion unit is provided only in a part of the reflection surface irradiated with light emitted from the LED element,
    A light-emitting device, wherein a reflective material is provided on a portion of the reflective surface that is not irradiated with the emitted light.
  6. 短波長光を放射するLED素子が実装されたLED実装基板と、
    凹部に前記LED素子の前記短波長光により変換光を発光する波長変換部が設けられた反射面を有する筐体とを備え、
    前記反射面は、前記LED実装基板に対向して形成された放物面からなり、前記LED実装基板は前記筐体凹部内の一側面、または、前記筐体凹部の開口縁部の一辺に設けられた傾斜部材に前記LED素子の発光面を前記反射面に向けて取付けられ
    前記波長変換部は、前記LED素子からの発光光が照射される前記反射面の部分のみに設けられ、
    前記発光光が照射されない前記反射面の部分には、反射性材料を設けたことを特徴とする発光装置。
    An LED mounting substrate on which an LED element that emits short-wavelength light is mounted;
    A housing having a reflection surface provided with a wavelength conversion unit that emits converted light by the short wavelength light of the LED element in the recess,
    The reflective surface is a parabolic surface formed to face the LED mounting substrate, and the LED mounting substrate is provided on one side surface in the housing recess or on one side of the opening edge of the housing recess. The light emitting surface of the LED element is attached to the inclined member that is directed toward the reflecting surface ,
    The wavelength conversion unit is provided only in a part of the reflection surface irradiated with light emitted from the LED element,
    A light-emitting device, wherein a reflective material is provided on a portion of the reflective surface that is not irradiated with the emitted light.
  7. 前記反射面を構成する放物面の少なくとも一部の放射面を、前記放物面にほぼ近似する平面に代えたことを特徴とする請求項2〜5のいずれかに記載の発光装置。   The light-emitting device according to claim 2, wherein at least a part of the radiating surface of the paraboloid constituting the reflecting surface is replaced with a plane substantially approximate to the paraboloid.
  8. 少なくとも前記LED実装基板が取付られた前記筐体の部分を熱伝導性材としたことを特徴とする請求項1〜7のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein at least a portion of the housing to which the LED mounting substrate is attached is a heat conductive material.
  9. 前記LED実装基板が取付られた前記筐体の背面に放熱フィンを装着したことを特徴とする請求項1〜8のいずれかに記載の発光装置。   The light-emitting device according to claim 1, wherein a heat radiation fin is attached to a back surface of the casing to which the LED mounting substrate is attached.
  10. 前記LED素子からの発光光の配光角度は、前記発光光が対向する反射面内に入るように照射される角度であることを特徴とする請求項1〜9のいずれかに記載の発光装置。   10. The light emitting device according to claim 1, wherein a light distribution angle of emitted light from the LED element is an angle at which the emitted light is irradiated so as to enter an opposing reflection surface. .
  11. 前記筐体の開口部に取り付けられた透光性板と、
    前記透光性板の少なくとも一面に前記短波長光の一部または全部の波長の光を反射し、前記波長変換部により変換される変換光のうち、一部または全部の波長を含む光を透過的に取出すLED発光光反射部と、
    を備えたことを特徴とする請求項1〜10のいずれかに記載の発光装置。
    A translucent plate attached to the opening of the housing;
    A part or all of the short wavelength light is reflected on at least one surface of the translucent plate, and light including part or all of the converted light converted by the wavelength converter is transmitted. LED light-emitting light reflecting part to be taken out ,
    The light emitting device according to any one of claims 1 to 10, characterized in that with a.
  12. 前記反射面の少なくとも前記波長変換部が配設される表面が、前記LED素子が放射する短波長光、及び波長変換された光に対し高反射率材料で形成されていることを特徴とする請求項1〜11のいずれかに記載の発光装置。 The surface on which at least the wavelength conversion part of the reflection surface is disposed is formed of a high reflectivity material with respect to short wavelength light and wavelength converted light emitted from the LED element. Item 12. The light emitting device according to any one of Items 1 to 11 .
  13. 前記反射面の少なくとも前記波長変換部が配設される表面に、少なくとも前記LED素子が放射する短波長光、及び波長変換された光に対し高反射率の反射シートを配設したことを特徴とする請求項1〜12のいずれかに記載の発光装置。 A reflection sheet having a high reflectance with respect to at least short-wavelength light emitted from the LED element and wavelength-converted light is disposed on at least a surface of the reflection surface on which the wavelength conversion unit is disposed. the light emitting device according to any one of claims 1 to 12.
  14. 前記波長変換部構成材料が透光性、かつ、形状柔軟性のある樹脂に蛍光体を混入したシート状材料であることを特徴とする請求項1〜13のいずれかに記載の発光装置。 The light emitting device according to any one of claims 1 to 13, wherein said wavelength converting portion constituting material is translucent, and is a sheet-like material obtained by mixing a phosphor in a resin with a shape flexibility.
  15. 前記波長変換部の表面が凹凸状に形成されていることを特徴とする請求項1〜14のいずれかに記載の発光装置。 The light emitting device according to any one of claims 1 to 14, characterized in that the surface of the wavelength converting part is formed in an uneven shape.
  16. 前記LED実装基板の表面が、前記LED素子が放射する短波長光及び波長変換部により変換された変換波長光に対し、高反射率材料で形成されていることを特徴とする請求項1〜15のいずれかに記載の発光装置。 Surface of the LED mounting substrate, wherein the relative conversion wavelength light converted by the short wavelength light and the wavelength conversion unit LED element emits, according to claim 1 to 15, characterized in that it is formed of a high reflectivity material The light emitting device according to any one of the above.
  17. 前記LED実装基板が高熱伝導性材料により構成されたものであることを特徴とする請求項1〜16のいずれかに記載の発光装置。 The light emitting device according to any one of claims 1 to 16, wherein the LED mounting substrate is one that is constituted by a high thermal conductivity material.
  18. 前記短波長光が紫色、あるいは、青紫色の光であることを特徴とする請求項1〜17のいずれかに記載の発光装置。 The short-wavelength light purple or light emitting device according to any one of claims 1 to 17, characterized in that the light of the blue-violet.
  19. 請求項1〜18のいずれかに記載の発光装置を照明器具に用いたことを特徴とする照明器具。 Luminaire, characterized in that the light-emitting device according to the luminaire to claim 1-18.
  20. 照明器具の筐体は熱伝導性材料からなり、前記発光装置の筐体の熱伝導性部材の少なくとも一部が前記照明器具の前記筐体に接触するようにしたことを特徴とする請求項19記載の照明器具。 Housing of the luminaire is made of thermally conductive material, according to claim 19 in which at least a portion of the thermally conductive member of the housing of the light emitting device is characterized by being in contact with the housing of the luminaire The luminaire described.
  21. 前記照明器具の筐体は、前面に前面開口部、底部に前記発光装置の前記筐体の発光面側が挿着される開口部を有する箱状に形成され、前記底部の表面は高反射率材料からなり、前記前面開口部は拡散透過板で覆われることを特徴とする請求項20記載の照明器具。 The housing of the lighting fixture is formed in a box shape having a front opening at the front and an opening into which the light emitting surface side of the housing of the light emitting device is inserted at the bottom, and the surface of the bottom is a highly reflective material The lighting device according to claim 20 , wherein the front opening is covered with a diffuse transmission plate.
JP2007196736A 2003-12-05 2007-07-27 Light emitting device and lighting apparatus using the same Active JP4804429B2 (en)

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