WO2018105619A1 - Liquid sealed led - Google Patents

Liquid sealed led Download PDF

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Publication number
WO2018105619A1
WO2018105619A1 PCT/JP2017/043679 JP2017043679W WO2018105619A1 WO 2018105619 A1 WO2018105619 A1 WO 2018105619A1 JP 2017043679 W JP2017043679 W JP 2017043679W WO 2018105619 A1 WO2018105619 A1 WO 2018105619A1
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WIPO (PCT)
Prior art keywords
liquid
led
led chip
space
sealed
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PCT/JP2017/043679
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French (fr)
Japanese (ja)
Inventor
一乃大 八木
和樹 板谷
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シーシーエス株式会社
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Publication of WO2018105619A1 publication Critical patent/WO2018105619A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

Definitions

  • the present invention relates to a liquid-sealed LED.
  • the main object of the present invention is to increase the amount of light extracted and increase the radiant flux emitted from the liquid-sealed LED while suppressing the manufacturing cost in the liquid-sealed LED.
  • the liquid-sealed LED according to the present invention includes an LED chip, a sealing case having a housing space for installing the LED chip, and a liquid sealed in the housing space of the sealing case, and the sealing
  • the case is provided on the optical axis of the LED chip and has a light-transmitting part protruding toward the LED chip side, and the optical axis of the LED chip is directed vertically upward
  • the side is arranged so as to be in contact with the liquid in the accommodation space or the liquid surface, and at least a part of the base end side is arranged in a space not filled with the liquid in the accommodation space.
  • the light emitted from the LED chip enters the light-transmitting part through the liquid in the accommodation space, the light is transmitted through a space not filled with the liquid (for example, a gas phase or a vacuum phase).
  • the reflection due to the difference in refractive index on the surface of the light transmitting part is reduced as compared with the case where the light enters the light part. Thereby, attenuation of the light at the time of entering into a translucent part is reduced.
  • the light that has entered the light-transmitting portion and has reached the base-end-side surface of the light-transmitting portion is all inward on the base-end-side surface because the base end is disposed in a space that is not filled with liquid. Since the light is reflected and emitted from the light transmitting portion, the amount of light extracted from the LED chip can be increased.
  • the sealing case includes a main body in which a bottomed hole that opens in a predetermined direction is formed, and a lid that closes the opening of the main body. May be provided.
  • the lid may be made of a material having translucency.
  • a cross-sectional shape orthogonal to the optical axis of the LED chip in the housing space may be formed in a rectangular shape.
  • the space not filled with the liquid in the storage space is large so that the expansion of the liquid sealed in the storage space can be flexibly handled.
  • the shape and size of the translucent part are the former and the latter in which the cross-sectional shape perpendicular to the optical axis of the LED chip in the housing space is formed in a rectangular shape and the cross-sectional shape formed in a circular shape.
  • the former shortest width and the latter width are compared to each other, the former has a larger cross-sectional area than the latter, and as a result, the space that is not filled with liquid increases. It is possible to increase the proportion of the space that is not filled with liquid in this, and this makes it easier to allow the liquid to expand. (See Figure 5)
  • the amount of light extracted increases, and the light emitted from the liquid-sealed LED can be increased in output.
  • the liquid-sealed LED 100 is an LED in which an LED chip is sealed with a liquid, and in particular, a high-power LED chip that generates high heat during operation (the type of emitted light is not limited at all) is used.
  • the structure is suitable.
  • a liquid-sealed LED 100 includes a main body 10 having a bottomed hole that opens in a predetermined direction, and a lid that forms an accommodation space 20 by closing the opening of the main body 10.
  • the main body 10 is formed in a block shape, and one surface facing a predetermined direction (upward in FIGS. 1 and 2) is opened.
  • a truncated cone-shaped pedestal 11 is formed on the bottom of the main body 10 so as to protrude from the center toward the accommodation space 20, and the LED chip 50 is directed to the pedestal 11 in the light emission direction (FIG. 2). It is installed with the inside (indicated by the arrow direction X) facing toward the accommodation space 20 (upward).
  • the main body 10 is made of a ceramic material, and the LED chip 50 is connected to the main body 10 by a bonding wire 51. Then, power is supplied to the LED chip 50 through the bonding wire 51 from the main body 10 connected to a power source (not shown).
  • the lid body 30 is made of a light-transmitting material, and a thin plate-like frame portion 31 fixed to the opening edge of the main body 10 and a light-transmitting portion provided integrally with a central portion of the frame portion 31.
  • Part 32 In the translucent part 32, the outer surface side facing outward of the sealing case 40 is flush with the outer surface of the frame part 31, and the inner surface side facing inward of the sealing case 40 faces the LED chip 50 side. It protrudes in the shape of a truncated cone, and the protruding tip surface is formed in a convex lens shape.
  • the translucent part 32 needs to be formed of a material that is not deteriorated or hardly deteriorated by light emitted from the LED chip 50, and may be formed of, for example, glass.
  • the liquid 60 and the gas 70 are enclosed in the accommodation space 20.
  • the pedestal 11 protruding from the bottom of the main body 10 and the translucent part 32 protruding from the lid 30 are opposed to each other with a gap.
  • the light transmitting part 32 is provided on the optical axis Y (indicated by a one-dot chain line in FIG. 1) of the LED chip 50, and light from the LED chip 50 passes through the light transmitting part 32.
  • the accommodation space 20 includes a ring-shaped first space 21 formed so as to surround the pedestal 11 and a ring-shaped second space 22 formed so as to surround the protruding portion of the light transmitting part 32.
  • the base 11 and the translucent part 32 are connected via a gap.
  • the liquid 60 sealed in the accommodation space 20 is electrically insulative and does not react or reacts with the material forming the LED chip 50 itself or the light emitted from the LED chip 50. Specifically, it is necessary to use a fluorine-based hydrocarbon such as florinate (trade name).
  • the liquid-sealed LED 100 when the liquid-sealed LED 100 is in a posture in which the optical axis Y of the LED chip 50 is horizontal, one side surface of the sealing case 40 in the housing space 20 (FIG. 3).
  • the gas 70 is accumulated in the space connecting the first space 21 and the second space 22 along the upper surface) to form a gas phase, and the remaining space in the accommodation space 20 is Filled with liquid 60, a liquid phase is formed. That is, the liquid-sealed LED 100 is in a state in which the liquid 60 is filled in the gap between the LED chip 50 and the translucent part 32 regardless of the posture.
  • the gas 10 moves around the first space 21 so as to avoid the pedestal 11, the LED chip 50 and the light transmitting part 32 in the accommodation space 20 are moved unless the liquid-sealed LED 100 is moved very vigorously.
  • the gas 70 does not enter between the two. Thereby, even if the situation where the liquid-sealed LED 100 tilts occurs, it is difficult for the gas phase to intervene between the light transmitting portion 32 and the LED chip 50, and the light amount of light emitted from the liquid-sealed LED 100 is reduced. Can be prevented.
  • the gas 70 accumulates above the second space 22 in the accommodation space 20.
  • a gas phase is formed, and the remaining space in the accommodation space 20 is filled with the liquid 60 to form a liquid phase.
  • the distal end side (lower side in FIG. 1) of the light transmitting portion 32 is located in the liquid 60, and at least the proximal end side (upper side in FIG. 1) except the distal end side of the light transmitting portion 32 is air. It will be in the state arrange
  • the light emitted from the LED chip 50 and incident on the light transmitting portion 32 and reaches the base end side peripheral surface of the light transmitting portion 32 is totally reflected inward on the base end side peripheral surface, and Since the peripheral surface of the light transmitting part 32 is formed in a taper shape that expands in the light emitting direction of the LED chip 50, the light totally reflected inwardly on the base end side peripheral surface is transmitted.
  • the light is efficiently emitted from the light unit 32. Therefore, the attenuation of light incident on the light transmitting part 32 is reduced, and the amount of light extracted from the liquid-sealed LED 100 is increased.
  • the cross-sectional shape perpendicular to the optical axis Y of the LED chip 50 in the housing space 20 is formed in a square shape (see FIG. 5A),
  • the cross-sectional shape formed in a circular shape is compared with the light transmitting portion 32 having the same shape and the shortest width of the former is matched with the diameter of the latter, the former is the latter Since the sectional area of the accommodation space 20 becomes wider than that, and the space in which the gas 70 can be enclosed increases accordingly, the amount of the gas 70 enclosed in the accommodation space 20 can be increased. Thereby, it becomes possible to flexibly cope with the expansion of the liquid 60 sealed in the accommodation space 20.
  • the said cross section is formed in square shape, it is not limited to this, A rectangular shape may be sufficient.
  • a liquid-sealed LED 200 according to another embodiment is obtained by changing the shape of the main body 10 and the configuration of the lid 30 in the liquid-sealed LED 100.
  • the main body 10 is formed in a cylindrical shape, and an annular frame 34 in which the lid 30 is fixed to the opening edge of the main body 10, and the opening of the frame 34.
  • the transparent body 33 is fixed to a surface of the frame body 34 that is located on the housing space 20 side. Therefore, the whole translucent body 33 becomes the translucent part 32 protruding to the LED chip 50 side in the embodiment, and the frame body 34 becomes the frame part 31 in the embodiment.
  • the peripheral surface of the translucent body 33 is parallel to the optical axis Y of the LED chip 50 (indicated by a one-dot chain line in FIG. 6).
  • the lid 30 includes a frame 31 fixed to the opening edge of the main body 10, and an octagonal translucent body 33 that closes the circular opening of the frame 31.
  • the translucent body 33 is fixed to the surface of the frame 31 on the LED chip 50 side.
  • the sealing case 40 is formed with a recess serving as the accommodating space 20 on the main body 10 side where the LED chip 50 is provided, but on the lid body 30 side where the translucent part 32 is provided.
  • a recess that becomes the accommodation space 20 may be formed, and a recess that becomes an accommodation space is formed on both the main body 10 side and the lid body 30 side, and the main body 10 and the lid body 30 are made to coincide with each other. 20 may be formed.
  • the liquid-sealed LEDs 100 and 200 are installed in a posture in which the optical axis Y of the LED chip 50 is vertically upward, and the distal end side of the translucent part 32 is in the liquid 60 of the accommodation space 20. Although it is in an arranged state, like the liquid-sealed LED 200, the tip side of the translucent part 32 is formed in a flat shape, and the tip surface is arranged so as to be in contact with the surface of the liquid 60 in the storage space 20 It may be.
  • the lid body 30 is provided in the main body 10 so that the optical axis Y of the LED chip 50 and the central axis of the translucent part 32 or the translucent body 33 are parallel. Even if the inner surface of the frame portion 31 or the frame body 34 (the surface on the housing space 20 side) is inclined, such as by providing the central axis of the light portion 32 or the translucent body 33 to be inclined with respect to the optical axis Y of the LED chip 50. good.
  • the peripheral surface of the translucent portion 32 is parallel to the optical axis Y of the LED chip 50 or spreads in the direction of light emission from the LED chip 50. What is necessary is just to be formed in the shape.
  • the storage space A space not filled with the liquid 60 in 20 may be a vacuum phase.
  • the amount of light extracted increases, and the light emitted from the liquid-sealed LED can be increased in output.

Abstract

The present invention increases the radiant flux discharged from a liquid sealed LED by increasing the light extraction amount, while suppressing the production cost of the liquid sealed LED. A liquid sealed LED according to the present invention is configured of: a sealing case 40 that is composed of a main body 10 which is provided with a bottomed hole that opens in a predetermined direction and a cover 30 which forms a container space 20 by closing the opening of the main body 10; an LED chip 50 that is affixed within the container space 20 of the sealing case 40; and a liquid 60 and a gas 70, which are sealed in the container space 20 of the sealing case 40.

Description

液体封止LEDLiquid sealed LED
 本発明は、液体封止LEDに関するものである。 The present invention relates to a liquid-sealed LED.
従来のLEDとして、LEDチップを熱から保護するために、該LEDチップを液体で封止した構造のものがあり、例えば、特許文献1及び2には、基板上に設置されたLEDチップをキャップ(筐体)で被覆し、該キャップ(筐体)内に液体を封入し、該LEDチップから射出される光を該キャップに設けられたレンズを介して該キャップ外に透過させる構造のものが開示されている。 As a conventional LED, there is a structure in which the LED chip is sealed with a liquid in order to protect the LED chip from heat. For example, in Patent Documents 1 and 2, an LED chip installed on a substrate is capped. A structure in which a liquid is enclosed in the cap (housing) and light emitted from the LED chip is transmitted outside the cap through a lens provided on the cap. It is disclosed.
 ところが、前記液体封止LEDにおいて、LEDチップを被覆するキャップ内に液体を封入する場合には、液体の膨張を許容するため、キャップ内にある程度液体で満たされない空間を設ける必要があるが、この場合、前記特許文献1の図1に示されたLEDのように、LEDチップとレンズとの間に液体で満たされない空間が介在すると、LEDチップから射出された光がレンズに入射する際に、屈折率の差によって前記光の一部がレンズ表面で反射されて大きく減衰し、これにより、光の取り出し量が減少して液体封止LEDから射出される放射束が低下してしまうという問題点があり、一方、前記特許文献1の図7及び図8や前記特許文献2の図11に示されたLEDのように、キャップにおけるLEDチップの光軸上に位置する部分を該LEDチップ側に窪ませ、その先端にレンズを取り付け、窪みの周囲に液体で満たされないリング状の空間を設ける構造にすると、LEDチップとレンズとの間に液体で満たされない空間が介在しなくなるが、LEDチップから射出された光がレンズを透過した後、キャップの窪みの内面で反射する際に、前記光の一部が前記窪みの内面によって大きく減衰し、前記特許文献1の図1に示されたLEDと同様に放射束が低下するという問題が生じ、これを解消するには、前記窪みの内面に反射率を向上させるための加工が必要となって製造コストが増加するという問題点があった。 However, in the liquid-sealed LED, when the liquid is sealed in the cap covering the LED chip, in order to allow the liquid to expand, it is necessary to provide a space that is not filled with the liquid to some extent. In this case, when a space that is not filled with liquid is interposed between the LED chip and the lens as in the LED shown in FIG. 1 of Patent Document 1, when the light emitted from the LED chip enters the lens, Due to the difference in refractive index, a part of the light is reflected by the lens surface and greatly attenuated, thereby reducing the amount of light extracted and reducing the radiant flux emitted from the liquid-sealed LED. On the other hand, like the LED shown in FIG. 7 and FIG. 8 of Patent Document 1 and FIG. 11 of Patent Document 2, a part located on the optical axis of the LED chip in the cap Is formed on the tip of the LED chip, a lens is attached to the tip of the LED chip, and a ring-shaped space that is not filled with liquid is provided around the depression, a space that is not filled with liquid is interposed between the LED chip and the lens. However, when the light emitted from the LED chip is reflected by the inner surface of the recess of the cap after passing through the lens, a part of the light is greatly attenuated by the inner surface of the recess, and FIG. As in the LED shown in FIG. 2, there is a problem that the radiant flux is lowered, and in order to solve this problem, a process for improving the reflectance is required on the inner surface of the recess, resulting in an increase in manufacturing cost. There was a point.
特許第3351103号公報Japanese Patent No. 3351103 特許第3700482号公報Japanese Patent No. 3700482
 そこで、本発明は、液体封止LEDにおいて、製造コストを抑えながら、光の取り出し量を増やし、液体封止LEDから射出される放射束を増加させることを主たる課題とするものである。 Accordingly, the main object of the present invention is to increase the amount of light extracted and increase the radiant flux emitted from the liquid-sealed LED while suppressing the manufacturing cost in the liquid-sealed LED.
 すなわち、本発明に係る液体封止LEDは、LEDチップと、前記LEDチップを設置する収容空間を有する封止ケースと、前記封止ケースの収容空間に封入される液体とを備え、前記封止ケースが、前記LEDチップの光軸上に設けられ、該LEDチップ側へ突出する透光部を有し、前記LEDチップの光軸を鉛直方向上向きに向けた状態において、前記透光部の先端側が前記収容空間の液体内又は液体表面に接するように配置されると共に、基端側の少なくとも一部が前記収容空間の液体で満たされていない空間に配置されることを特徴とするものである。 That is, the liquid-sealed LED according to the present invention includes an LED chip, a sealing case having a housing space for installing the LED chip, and a liquid sealed in the housing space of the sealing case, and the sealing In the state where the case is provided on the optical axis of the LED chip and has a light-transmitting part protruding toward the LED chip side, and the optical axis of the LED chip is directed vertically upward, the tip of the light-transmitting part The side is arranged so as to be in contact with the liquid in the accommodation space or the liquid surface, and at least a part of the base end side is arranged in a space not filled with the liquid in the accommodation space. .
 このようなものであれば、LEDチップから射出された光が収容空間内の液体を介して透光部に入射するため、液体で満たされない空間(例えば、気相や真空相)を介して透光部に入射する場合に比べて透光部表面での屈折率差による反射が緩和される。これにより、透光部に入射する際の光の減衰が低減される。さらに、透光部に入射し、透光部の基端側表面に達した光は、該基端側が液体で満たされていない空間に配置されていることから基端側表面で内向きに全反射して該透光部から出射するため、LEDチップから射出される光の取り出し量を増加させることができる。 In such a case, since the light emitted from the LED chip enters the light-transmitting part through the liquid in the accommodation space, the light is transmitted through a space not filled with the liquid (for example, a gas phase or a vacuum phase). The reflection due to the difference in refractive index on the surface of the light transmitting part is reduced as compared with the case where the light enters the light part. Thereby, attenuation of the light at the time of entering into a translucent part is reduced. Further, the light that has entered the light-transmitting portion and has reached the base-end-side surface of the light-transmitting portion is all inward on the base-end-side surface because the base end is disposed in a space that is not filled with liquid. Since the light is reflected and emitted from the light transmitting portion, the amount of light extracted from the LED chip can be increased.
 また、前記液体封止LEDにおいて、前記封止ケースが、所定方向に開口する有底穴が形成された本体と、該本体の開口を閉じる蓋体とを備え、前記蓋体に前記透光部が設けられているものであってもよい。 In the liquid-sealed LED, the sealing case includes a main body in which a bottomed hole that opens in a predetermined direction is formed, and a lid that closes the opening of the main body. May be provided.
また、前記蓋体が、透光性を有する材料からなっているものであってもよい。 The lid may be made of a material having translucency.
また、前記液体封止LEDにおいて、前記収容空間の前記LEDチップの光軸と直交する断面形状が矩形状に形成されたものでもよい。 Moreover, in the liquid-sealed LED, a cross-sectional shape orthogonal to the optical axis of the LED chip in the housing space may be formed in a rectangular shape.
 前記液体封止LEDにおいては、前記収容空間に封入された液体の膨張に柔軟に対応できるように、前記収容空間の液体で満たされていない空間が大きい方が好ましい。そして、前記収容空間の前記LEDチップの光軸と直交する断面形状を矩形状に形成したものと、該断面形状を円形状に形成したものとを、前者と後者で透光部の形状・大きさを一致させると共に、前者の最短幅と後者の幅を一致させて比較すると、前者の方が後者よりも断面積が広くなり、これに伴って液体で満たされない空間が増すため、前記収容空間における液体で満たされない空間の割合を増加させることができるようになり、これにより、液体の膨張を許容し易くなる。(図5参照) In the liquid-sealed LED, it is preferable that the space not filled with the liquid in the storage space is large so that the expansion of the liquid sealed in the storage space can be flexibly handled. Then, the shape and size of the translucent part are the former and the latter in which the cross-sectional shape perpendicular to the optical axis of the LED chip in the housing space is formed in a rectangular shape and the cross-sectional shape formed in a circular shape. And the former shortest width and the latter width are compared to each other, the former has a larger cross-sectional area than the latter, and as a result, the space that is not filled with liquid increases. It is possible to increase the proportion of the space that is not filled with liquid in this, and this makes it easier to allow the liquid to expand. (See Figure 5)
 このように構成した本発明に係る液体封止LEDによれば、光の取り出し量が増加し、液体封止LEDから射出される光を高出力化することができる。 According to the liquid-sealed LED according to the present invention configured as described above, the amount of light extracted increases, and the light emitted from the liquid-sealed LED can be increased in output.
本実施形態に係る液体封止LEDを示す断面図である。It is sectional drawing which shows the liquid sealing LED which concerns on this embodiment. 図1に示した液体封止LEDの封止ケースを示す分解斜視図である。It is a disassembled perspective view which shows the sealing case of the liquid sealing LED shown in FIG. 図1に示した液体封止LEDの姿勢を変更した場合を示す断面図である。It is sectional drawing which shows the case where the attitude | position of the liquid sealing LED shown in FIG. 1 is changed. 図1に示した液体封止LEDの姿勢を変更した場合を示す断面図である。It is sectional drawing which shows the case where the attitude | position of the liquid sealing LED shown in FIG. 1 is changed. 図1に示した液体封止LEDの作用効果を説明する比較図である。It is a comparison figure explaining the effect of the liquid sealing LED shown in FIG. その他の実施形態に係る液体封止LEDを示す断面図である。It is sectional drawing which shows the liquid sealing LED which concerns on other embodiment. 図6に示した液体封止LEDの封止ケースを示す分解斜視図である。It is a disassembled perspective view which shows the sealing case of liquid sealing LED shown in FIG. その他の実施形態に係る蓋体を示す平面図である。It is a top view which shows the cover body which concerns on other embodiment.
 100 液体封止LED
 10 本体
 20 収容空間
 30 蓋体
 31 枠部
 32 透光部
 40 封止ケース
 50 LEDチップ
 60 液体
 70 気体 
100 Liquid sealed LED
DESCRIPTION OF SYMBOLS 10 Main body 20 Storage space 30 Lid body 31 Frame part 32 Translucent part 40 Sealing case 50 LED chip 60 Liquid 70 Gas
以下に、本発明に係る液体封止LEDを図面を参照して説明する。 Hereinafter, a liquid-sealed LED according to the present invention will be described with reference to the drawings.
 本実施形態に係る液体封止LED100は、LEDチップを液体によって封止したLEDであり、特に、動作時に高い発熱を生じる高出力LEDチップ(射出される光の種類は何ら限定されない)を使用する場合に好適な構造になっている。 The liquid-sealed LED 100 according to this embodiment is an LED in which an LED chip is sealed with a liquid, and in particular, a high-power LED chip that generates high heat during operation (the type of emitted light is not limited at all) is used. In this case, the structure is suitable.
 図1に示すように、本実施形態に係る液体封止LED100は、所定方向に開口する有底穴が形成された本体10及び該本体10の開口を塞ぐことによって収容空間20を形成する蓋体30からなる封止ケース40と、前記封止ケース40の収容空間20に固定されるLEDチップ50と、前記封止ケース40の収容空間20に封入される液体60及び気体70とから構成されている。 As shown in FIG. 1, a liquid-sealed LED 100 according to this embodiment includes a main body 10 having a bottomed hole that opens in a predetermined direction, and a lid that forms an accommodation space 20 by closing the opening of the main body 10. A sealing case 40 made of 30; an LED chip 50 fixed in the accommodation space 20 of the sealing case 40; and a liquid 60 and a gas 70 enclosed in the accommodation space 20 of the sealing case 40. Yes.
 図2に示すように、前記本体10は、ブロック状に形成されており、所定方向(図1及び図2において、上方向)を向く一つの面が開口している。前記本体10の底には、その中央から収容空間20側に向かって突出した円錐台状の台座11が形成されており、該台座11には、前記LEDチップ50が光の射出方向(図2中、矢印方向Xにて示す)を収容空間20側(上方向)に向けた状態で設置されている。なお、前記本体10は、セラミックス材料によって形成されており、前記LEDチップ50は、ボンディングワイヤー51によって本体10に接続されている。そして、図示しない電源に接続された本体10からボンディングワイヤー51を介してLEDチップ50に電力が供給されるようになっている。 As shown in FIG. 2, the main body 10 is formed in a block shape, and one surface facing a predetermined direction (upward in FIGS. 1 and 2) is opened. A truncated cone-shaped pedestal 11 is formed on the bottom of the main body 10 so as to protrude from the center toward the accommodation space 20, and the LED chip 50 is directed to the pedestal 11 in the light emission direction (FIG. 2). It is installed with the inside (indicated by the arrow direction X) facing toward the accommodation space 20 (upward). The main body 10 is made of a ceramic material, and the LED chip 50 is connected to the main body 10 by a bonding wire 51. Then, power is supplied to the LED chip 50 through the bonding wire 51 from the main body 10 connected to a power source (not shown).
 前記蓋体30は、透光性を有する材料によって形成されており、前記本体10の開口縁に固定される薄板状の枠部31と、該枠部31の中央部分に一体に設けられる透光部32とから構成されている。前記透光部32は、封止ケース40の外方へ向く外面側が前記枠部31の外面と面一になっており、封止ケース40の内方へ向く内面側がLEDチップ50側に向かって円錐台状に突出しており、その突出した先端面が凸レンズ状に形成されている。なお、前記透光部32は、前記LEDチップ50から射出される光によって劣化しない、或いは、劣化し難い材料によって形成する必要があり、例えば、ガラス等によって形成すればよい。 The lid body 30 is made of a light-transmitting material, and a thin plate-like frame portion 31 fixed to the opening edge of the main body 10 and a light-transmitting portion provided integrally with a central portion of the frame portion 31. Part 32. In the translucent part 32, the outer surface side facing outward of the sealing case 40 is flush with the outer surface of the frame part 31, and the inner surface side facing inward of the sealing case 40 faces the LED chip 50 side. It protrudes in the shape of a truncated cone, and the protruding tip surface is formed in a convex lens shape. The translucent part 32 needs to be formed of a material that is not deteriorated or hardly deteriorated by light emitted from the LED chip 50, and may be formed of, for example, glass.
 そして、前記収容空間20には液体60及び気体70が封入される。なお、前記封止ケース40内では、前記本体10の底から迫り出す台座11と前記蓋体30から隆起する透光部32とが隙間を開けて対向している。これにより、前記LEDチップ50の光軸Y(図1中、一点鎖線にて示す)上に前記透光部32が設けられた状態となり、該LEDチップ50からの光は該透光部32を介して封止ケース40外へ射出される。 And the liquid 60 and the gas 70 are enclosed in the accommodation space 20. In the sealing case 40, the pedestal 11 protruding from the bottom of the main body 10 and the translucent part 32 protruding from the lid 30 are opposed to each other with a gap. As a result, the light transmitting part 32 is provided on the optical axis Y (indicated by a one-dot chain line in FIG. 1) of the LED chip 50, and light from the LED chip 50 passes through the light transmitting part 32. Through the sealing case 40.
前記収容空間20は、前記台座11を囲むように形成されるリング状の第1空間21と、前記透光部32の突出部分を囲むように形成されるリング状の第2空間22とが、前記台座11と前記透光部32との間の隙間を介して繋がった形状になっている。なお、前記収容空間20に封入される液体60は、電気的に絶縁性を有し、前記LEDチップ50自体を形成する材料や該LEDチップ50から射出される光に反応しない、或いは、反応し難いものである必要があり、具体的には、フロリナート(商品名)等のフッ素系炭化水素などを使用することが好ましい。 The accommodation space 20 includes a ring-shaped first space 21 formed so as to surround the pedestal 11 and a ring-shaped second space 22 formed so as to surround the protruding portion of the light transmitting part 32. The base 11 and the translucent part 32 are connected via a gap. The liquid 60 sealed in the accommodation space 20 is electrically insulative and does not react or reacts with the material forming the LED chip 50 itself or the light emitted from the LED chip 50. Specifically, it is necessary to use a fluorine-based hydrocarbon such as florinate (trade name).
次に、本実態形態に係る液体封止LED100の姿勢を変更した場合における収容空間20内の液体60及び気体70とLEDチップ50及び透光部32との位置関係を説明する。 Next, the positional relationship between the liquid 60 and the gas 70 in the housing space 20, the LED chip 50, and the light transmitting part 32 when the posture of the liquid-sealed LED 100 according to the present embodiment is changed will be described.
図1に示すように、前記液体封止LED100を前記LEDチップ50の光軸Yが鉛直方向上向きとなる姿勢にすると、前記収容空間20における第2空間22の上側に気体70が溜まって気相(液体で満たされていない空間)が形成されると共に、前記収容空間20における残りの空間が液体60によって満たされて液相(液体で満たされた空間)が形成される。一方、図3(a)に示すように、前記液体封止LED100を前記LEDチップ50の光軸Yが鉛直方向下向きとなる姿勢にすると、前記収容空間20における第1空間21の上側に気体70が溜まって気相が形成されると共に、前記収容空間20における残りの空間が液体60によって満たされて液相が形成される。なお、図3(b)に示すように、前記液体封止LED100を前記LEDチップ50の光軸Yが水平となる姿勢にすると、前記収容空間20における前記封止ケース40の一側面(図3(b)において、上側に位置する面)に沿った第1空間21及び第2空間22を繋いだ空間に気体70が溜まって気相が形成されると共に、前記収容空間20における残りの空間が液体60によって満たされて液相が形成される。即ち、前記液体封止LED100は、前記いずれの姿勢になったとしても、前記LEDチップ50と前記透光部32との間の隙間に液体60が満たされた状態となる。 As shown in FIG. 1, when the liquid-sealed LED 100 is in a posture in which the optical axis Y of the LED chip 50 is vertically upward, a gas 70 is accumulated on the upper side of the second space 22 in the accommodation space 20, and the gas phase (Space not filled with liquid) is formed, and the remaining space in the accommodation space 20 is filled with the liquid 60 to form a liquid phase (space filled with liquid). On the other hand, as shown in FIG. 3A, when the liquid-sealed LED 100 is in a posture in which the optical axis Y of the LED chip 50 is directed downward in the vertical direction, a gas 70 is formed above the first space 21 in the accommodation space 20. Is accumulated to form a gas phase, and the remaining space in the accommodation space 20 is filled with the liquid 60 to form a liquid phase. As shown in FIG. 3B, when the liquid-sealed LED 100 is in a posture in which the optical axis Y of the LED chip 50 is horizontal, one side surface of the sealing case 40 in the housing space 20 (FIG. 3). In (b), the gas 70 is accumulated in the space connecting the first space 21 and the second space 22 along the upper surface) to form a gas phase, and the remaining space in the accommodation space 20 is Filled with liquid 60, a liquid phase is formed. That is, the liquid-sealed LED 100 is in a state in which the liquid 60 is filled in the gap between the LED chip 50 and the translucent part 32 regardless of the posture.
そして、前記液体封止LED100を前記各姿勢に移行させる途中においても、前記収容空間20における前記LEDチップ50と前記透光部32との間に気体70が介在するような事態が生じ難い。詳述すると、例えば、前記液体封止LED100を図1に示す姿勢から図3(b)に示す姿勢に移行させる場合には、図4(a)~(c)に示すように、気体70が透光部32を避けるように第2空間22を回り込んで移動し、同様に、前記液体封止LED100を図3(a)に示す姿勢から図3(b)に示す姿勢に移行させる場合には、気体10が台座11を避けるように第1空間21を回り込んで移動するため、前記液体封止LED100をよほど激しく動かさない限り、前記収容空間20における前記LEDチップ50と前記透光部32との間に気体70が入り込むことはない。これにより、液体封止LED100が傾くような事態が生じたとしても、透光部32とLEDチップ50との間に気相が介在し難く、液体封止LED100から射出される光の光量低下を防止することができる。 And even during the transition of the liquid-sealed LED 100 to the postures, a situation in which the gas 70 is interposed between the LED chip 50 and the translucent part 32 in the accommodation space 20 hardly occurs. More specifically, for example, when the liquid-sealed LED 100 is shifted from the posture shown in FIG. 1 to the posture shown in FIG. 3B, the gas 70 is changed as shown in FIGS. 4A to 4C. When moving around the second space 22 so as to avoid the translucent part 32, similarly, the liquid-sealed LED 100 is shifted from the posture shown in FIG. 3A to the posture shown in FIG. 3B. Since the gas 10 moves around the first space 21 so as to avoid the pedestal 11, the LED chip 50 and the light transmitting part 32 in the accommodation space 20 are moved unless the liquid-sealed LED 100 is moved very vigorously. The gas 70 does not enter between the two. Thereby, even if the situation where the liquid-sealed LED 100 tilts occurs, it is difficult for the gas phase to intervene between the light transmitting portion 32 and the LED chip 50, and the light amount of light emitted from the liquid-sealed LED 100 is reduced. Can be prevented.
また、図1に示すように、前記液体封止LED100を前記LEDチップ50の光軸Yが鉛直方向上向きとなる姿勢で設置すると、前記収容空間20における第2空間22の上側に気体70が溜まって気相が形成されると共に、前記収容空間20における残りの空間が液体60によって満たされて液相が形成される。これにより、前記透光部32の先端側(図1において、下側)が液体60内に位置し、前記透光部32の先端側を除く少なくとも基端側(図1において、上側)が気相に囲まれて気相空間に配置された状態となる。これにより、前記LEDチップ50から射出されて前記透光部32に入射し、透光部32の基端側周面に達した光は該基端側周面で内向きに全反射し、さらに、前記透光部32の周面が、前記LEDチップ50の光の射出方向に向かって広がるテーパー状に形成されていることにより、該基端側周面で内向きに全反射した光が透光部32から効率的に出射する。したがって、前記透光部32に入射した光の減衰が低減され、液体封止LED100から射出される光の取り出し量が増加する。 In addition, as shown in FIG. 1, when the liquid-sealed LED 100 is installed in a posture in which the optical axis Y of the LED chip 50 is vertically upward, the gas 70 accumulates above the second space 22 in the accommodation space 20. Thus, a gas phase is formed, and the remaining space in the accommodation space 20 is filled with the liquid 60 to form a liquid phase. Thereby, the distal end side (lower side in FIG. 1) of the light transmitting portion 32 is located in the liquid 60, and at least the proximal end side (upper side in FIG. 1) except the distal end side of the light transmitting portion 32 is air. It will be in the state arrange | positioned in gaseous-phase space among the phases. Thereby, the light emitted from the LED chip 50 and incident on the light transmitting portion 32 and reaches the base end side peripheral surface of the light transmitting portion 32 is totally reflected inward on the base end side peripheral surface, and Since the peripheral surface of the light transmitting part 32 is formed in a taper shape that expands in the light emitting direction of the LED chip 50, the light totally reflected inwardly on the base end side peripheral surface is transmitted. The light is efficiently emitted from the light unit 32. Therefore, the attenuation of light incident on the light transmitting part 32 is reduced, and the amount of light extracted from the liquid-sealed LED 100 is increased.
なお、本実施形態に係る液体封止LED100のように、前記収容空間20のLEDチップ50の光軸Yに直交する断面形状を正方形状に形成したもの(図5(a)参照)と、該断面形状を円形状に形成したもの(図5(b)参照)とを、同一形状の透光部32を設けると共に前者の最短幅と後者の直径を一致させて比較すると、前者の方が後者よりも前記収容空間20の断面積が広くなり、これに伴って気体70を封入できる空間が増すため、前記収容空間20に対する気体70の封入量を増加させることができる。これにより、前記収容空間20に封入された液体60の膨張に柔軟に対応できるようになる。なお、本実施形態においては、前記断面を正方形状に形成しているが、これに限定されず、長方形状であってもよい。 In addition, like the liquid-sealed LED 100 according to the present embodiment, the cross-sectional shape perpendicular to the optical axis Y of the LED chip 50 in the housing space 20 is formed in a square shape (see FIG. 5A), When the cross-sectional shape formed in a circular shape (see FIG. 5B) is compared with the light transmitting portion 32 having the same shape and the shortest width of the former is matched with the diameter of the latter, the former is the latter Since the sectional area of the accommodation space 20 becomes wider than that, and the space in which the gas 70 can be enclosed increases accordingly, the amount of the gas 70 enclosed in the accommodation space 20 can be increased. Thereby, it becomes possible to flexibly cope with the expansion of the liquid 60 sealed in the accommodation space 20. In addition, in this embodiment, although the said cross section is formed in square shape, it is not limited to this, A rectangular shape may be sufficient.
<その他の実施形態>
その他の実施形態に係る液体封止LED200は、前記液体封止LED100における本体10の形状及び蓋体30の構成を変更したものである。具体的には、図6及び図7に示すように、本体10が円筒状に形成され、蓋体30が本体10の開口縁に固定される円環状の枠体34と該枠体34の開口を塞ぐ円板状の透光体33とから構成されており、前記枠体34の収容空間20側に位置する面に前記透光体33が固定されている。よって、前記透光体33全体が、前記実施形態におけるLEDチップ50側に突出した透光部32となり、前記枠体34が、前記実施形態における枠部31となる。なお、透光体33の周面は、LEDチップ50の光軸Y(図6中、一点鎖線にて示す)と平行になっている。
<Other embodiments>
A liquid-sealed LED 200 according to another embodiment is obtained by changing the shape of the main body 10 and the configuration of the lid 30 in the liquid-sealed LED 100. Specifically, as shown in FIGS. 6 and 7, the main body 10 is formed in a cylindrical shape, and an annular frame 34 in which the lid 30 is fixed to the opening edge of the main body 10, and the opening of the frame 34. The transparent body 33 is fixed to a surface of the frame body 34 that is located on the housing space 20 side. Therefore, the whole translucent body 33 becomes the translucent part 32 protruding to the LED chip 50 side in the embodiment, and the frame body 34 becomes the frame part 31 in the embodiment. The peripheral surface of the translucent body 33 is parallel to the optical axis Y of the LED chip 50 (indicated by a one-dot chain line in FIG. 6).
また、その他の実施形態に係る蓋体30としては、液体封止LED200の蓋体30の構成を変更したものが挙げられる。具体的には、図8に示すように、蓋体30は、本体10の開口縁に固定される枠体31と、該枠体31の円形状の開口を塞ぐ八角形状の透光体33とから構成されており、前記枠体31のLEDチップ50側の面に前記透光体33を固定したものである。このように透光体33の形状を八角形状にすることにより、該透光体33を円形状にした場合に比べて加工性が向上する。なお、このような透光体33の形状としては、八角形状に限定されず、多角形状であればよい。但し、角数が少なくとなると、それに伴って開口の大きさが小さくなるため、六角形以上に形成することが好ましい。 Moreover, as the cover body 30 which concerns on other embodiment, what changed the structure of the cover body 30 of liquid sealing LED200 is mentioned. Specifically, as shown in FIG. 8, the lid 30 includes a frame 31 fixed to the opening edge of the main body 10, and an octagonal translucent body 33 that closes the circular opening of the frame 31. The translucent body 33 is fixed to the surface of the frame 31 on the LED chip 50 side. Thus, by making the shape of the light transmitting body 33 an octagonal shape, the workability is improved as compared with the case where the light transmitting body 33 is formed in a circular shape. In addition, as a shape of such a translucent body 33, it is not limited to octagon shape, What is necessary is just polygonal shape. However, as the number of corners decreases, the size of the opening decreases accordingly.
なお、前記各実施形態では、前記封止ケース40として、LEDチップ50が設けられる本体10側に収容空間20となる窪みを形成しているが、透光部32が設けられる蓋体30側に収容空間20となる窪みを形成してもよく、本体10側及び蓋体30側のいずれにも収容空間となる窪みを形成し、本体10及び蓋体30を合致させることにより、一つの収容空間20が形成されるようにしてもよい。 In each of the above embodiments, the sealing case 40 is formed with a recess serving as the accommodating space 20 on the main body 10 side where the LED chip 50 is provided, but on the lid body 30 side where the translucent part 32 is provided. A recess that becomes the accommodation space 20 may be formed, and a recess that becomes an accommodation space is formed on both the main body 10 side and the lid body 30 side, and the main body 10 and the lid body 30 are made to coincide with each other. 20 may be formed.
また、前記各実施形態では、液体封止LED100,200をLEDチップ50の光軸Yが鉛直方向上向きとなる姿勢に設置した状態で、透光部32の先端側が収容空間20の液体60内に配置された状態になっているが、液体封止LED200のように透光部32の先端側を平坦状に形成し、その先端面が収容空間20の液体60表面に接するように配置された状態となっていてもよい。 Further, in each of the above embodiments, the liquid-sealed LEDs 100 and 200 are installed in a posture in which the optical axis Y of the LED chip 50 is vertically upward, and the distal end side of the translucent part 32 is in the liquid 60 of the accommodation space 20. Although it is in an arranged state, like the liquid-sealed LED 200, the tip side of the translucent part 32 is formed in a flat shape, and the tip surface is arranged so as to be in contact with the surface of the liquid 60 in the storage space 20 It may be.
また、前記各実施形態では、LEDチップ50の光軸Yと透光部32又は透光体33の中心軸が平行となるように蓋体30が本体10に設けられていたが、例えば、透光部32又は透光体33の中心軸をLEDチップ50の光軸Yに対して傾斜させて設けるなど、枠部31又は枠体34の内面(収容空間20側の面)を傾斜させても良い。このような場合には、LEDチップ50の光軸Yが鉛直方向上向きとなる姿勢に設置すると、透光部32又は透光体33の基端側の一部が液体60で満たされていない空間に配置されることがある。具体的には、枠部31又は枠体34の内面における下方側は液体60で満たされるものの、上方側は液体60で満たされていない状態となり、したがって、枠部31又は枠体34の下方側の内面及び透光部32又は透光体33の下方側が液体60内に配置される一方、枠部31又は枠体34の上方側の内面及び透光部32又は透光体33の上方側が液体60で満たされていない空間に配置され、これにより、透光部32又は透光体33の基端側の一部(上方側)が液体60で満たされていない空間に配置される。 In each of the above embodiments, the lid body 30 is provided in the main body 10 so that the optical axis Y of the LED chip 50 and the central axis of the translucent part 32 or the translucent body 33 are parallel. Even if the inner surface of the frame portion 31 or the frame body 34 (the surface on the housing space 20 side) is inclined, such as by providing the central axis of the light portion 32 or the translucent body 33 to be inclined with respect to the optical axis Y of the LED chip 50. good. In such a case, when the LED chip 50 is installed in a posture in which the optical axis Y of the LED chip 50 is directed upward in the vertical direction, a space in which a part of the base end side of the light transmitting portion 32 or the light transmitting body 33 is not filled with the liquid 60. May be placed. Specifically, the lower side of the inner surface of the frame portion 31 or the frame body 34 is filled with the liquid 60, but the upper side is not filled with the liquid 60. Therefore, the lower side of the frame portion 31 or the frame body 34. The inner surface and the lower side of the translucent part 32 or the translucent body 33 are disposed in the liquid 60, while the upper inner surface of the frame part 31 or the frame body 34 and the upper side of the translucent part 32 or the translucent body 33 are liquid. Accordingly, a portion (upper side) of the base end side of the light transmitting portion 32 or the light transmitting body 33 is disposed in a space not filled with the liquid 60.
また、前記各実施形態から分かるように、前記透光部32の周面は、LEDチップ50の光軸Yと平行になっているか、或いは、LEDチップ50からの光の射出方向に向かって広がる形状に形成されていればよい。 Further, as can be seen from the above embodiments, the peripheral surface of the translucent portion 32 is parallel to the optical axis Y of the LED chip 50 or spreads in the direction of light emission from the LED chip 50. What is necessary is just to be formed in the shape.
 また、前記各実施形態においては、封止ケース40の収容空間20内に液体60及び気体70を封入し、収容空間20内の液体60で満たされていない空間を気相としているが、収容空間20内の液体60で満たされていない空間を真空相としてもよい。 Moreover, in each said embodiment, although the liquid 60 and the gas 70 are enclosed in the storage space 20 of the sealing case 40, and the space which is not filled with the liquid 60 in the storage space 20 is made into a gaseous phase, the storage space A space not filled with the liquid 60 in 20 may be a vacuum phase.
 本発明に係る液体封止LEDによれば、光の取り出し量が増加し、液体封止LEDから射出される光を高出力化することができる。
 
According to the liquid-sealed LED according to the present invention, the amount of light extracted increases, and the light emitted from the liquid-sealed LED can be increased in output.

Claims (4)

  1. LEDチップと、
    前記LEDチップを設置する収容空間を有する封止ケースと、
    前記封止ケースの収容空間に封入される液体とを備え、
    前記封止ケースが、前記LEDチップの光軸上に設けられ、該LEDチップ側へ突出する透光部を有し、
    前記LEDチップの光軸を鉛直方向上向きに向けた状態において、前記透光部の先端側が前記収容空間の液体内又は液体表面に接するように配置されると共に、基端側の少なくとも一部が前記収容空間の液体で満たされていない空間に配置されることを特徴とする液体封止LED。
    An LED chip;
    A sealing case having a housing space for installing the LED chip;
    Comprising a liquid sealed in a housing space of the sealing case,
    The sealing case is provided on the optical axis of the LED chip, and has a light-transmitting portion protruding toward the LED chip;
    In a state where the optical axis of the LED chip is directed upward in the vertical direction, the tip side of the translucent part is disposed so as to contact the liquid in the storage space or the liquid surface, and at least a part of the base end side is the A liquid-sealed LED, which is disposed in a space that is not filled with liquid in a housing space.
  2. 前記封止ケースが、所定方向に開口する有底穴が形成された本体と、該本体の開口を閉じる蓋体とを備え、前記蓋体に前記透光部が設けられている請求項1記載の液体封止LED。 The said sealing case is equipped with the main body in which the bottomed hole opened to a predetermined direction was formed, and the cover body which closes opening of this main body, The said translucent part is provided in the said cover body. Liquid-sealed LED.
  3. 前記蓋体が、透光性を有する材料からなっている請求項2記載の液体封止LED。 The liquid-sealed LED according to claim 2, wherein the lid is made of a translucent material.
  4. 前記収容空間の前記LEDチップの光軸と直交する断面形状が矩形状である請求項1記載の液体封止LED。

     
    The liquid-sealed LED according to claim 1, wherein a cross-sectional shape orthogonal to the optical axis of the LED chip in the housing space is a rectangular shape.

PCT/JP2017/043679 2016-12-06 2017-12-05 Liquid sealed led WO2018105619A1 (en)

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JP2016-236671 2016-12-06

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Citations (7)

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JP2001036153A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
JP2001036149A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
JP2001036148A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source
JP2003347601A (en) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Light emitting diode illuminator
JP2005093701A (en) * 2003-09-17 2005-04-07 Seiko Epson Corp Optical source device and projector
US20070216297A1 (en) * 2006-03-06 2007-09-20 Leng Margaret T K LED devices having improved containment for liquid encapsulant
US20150060932A1 (en) * 2013-09-02 2015-03-05 Industrial Technology Research Institute Liquid-filled packaging structure of heating component

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001036153A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
JP2001036149A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
JP2001036148A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source
JP2003347601A (en) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Light emitting diode illuminator
JP2005093701A (en) * 2003-09-17 2005-04-07 Seiko Epson Corp Optical source device and projector
US20070216297A1 (en) * 2006-03-06 2007-09-20 Leng Margaret T K LED devices having improved containment for liquid encapsulant
US20150060932A1 (en) * 2013-09-02 2015-03-05 Industrial Technology Research Institute Liquid-filled packaging structure of heating component

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