KR102049380B1 - Light emitting module - Google Patents

Light emitting module Download PDF

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Publication number
KR102049380B1
KR102049380B1 KR1020130060080A KR20130060080A KR102049380B1 KR 102049380 B1 KR102049380 B1 KR 102049380B1 KR 1020130060080 A KR1020130060080 A KR 1020130060080A KR 20130060080 A KR20130060080 A KR 20130060080A KR 102049380 B1 KR102049380 B1 KR 102049380B1
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South Korea
Prior art keywords
disposed
light emitting
adhesive member
cover
emitting module
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KR1020130060080A
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Korean (ko)
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KR20140139720A (en
Inventor
김하나
김병목
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엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020130060080A priority Critical patent/KR102049380B1/en
Priority to PCT/KR2014/004217 priority patent/WO2014189221A1/en
Priority to CN201480029387.1A priority patent/CN105229806B/en
Priority to US14/892,906 priority patent/US9799802B2/en
Priority to EP14801082.0A priority patent/EP3001466B1/en
Publication of KR20140139720A publication Critical patent/KR20140139720A/en
Application granted granted Critical
Publication of KR102049380B1 publication Critical patent/KR102049380B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Embodiments relate to a light emitting module.
The light emitting module according to the embodiment includes a light source unit including a light emitting element for emitting ultraviolet light; A body including a lower end disposed with the light source part and a wall part disposed on the lower end surrounding the light source part; A cover disposed on the wall of the body and including an optical member disposed in an opening formed on the light source; And an adhesive member disposed between the wall portion of the body and the cover, wherein at least one of the lower portion and the wall portion is a ceramic substrate composed of a single layer or multilayer ceramic layers, and at least one of the body and the cover. A portion of the interposed portion is disposed between the adhesive member and the light source unit to prevent the ultraviolet ray from being directed to the adhesive member. The light emitting module according to this embodiment can prevent discoloration or deterioration due to ultraviolet rays, and can block light that can be removed from the adhesive member to the light source, thereby improving light extraction efficiency.

Description

Light emitting module {LIGHT EMITTING MODULE}

Embodiments relate to a light emitting module.

Group III nitrides such as gallium nitride (GaN), aluminum nitride (AlN), and indium gallium nitride (InGaN) have excellent thermal stability and have a direct transition energy band structure, which is mainly used in light emitting diodes (LEDs). have. Specifically, group III nitrides are widely used in ultraviolet light emitting diodes (UV LEDs) as well as blue light emitting diodes (Blue LEDs).

UV LEDs that emit ultraviolet light are packaged in a predetermined body (or case) and manufactured and sold. Here, ultraviolet light emitted from the UV LED may discolor or deteriorate the body and other components, such as the cover. Discoloration or deterioration of the body or cover by ultraviolet rays may adversely affect the reliability or durability of the light emitting module having the UV LED.

Embodiments provide a light emitting module capable of preventing discoloration or deterioration of a body and a cover by ultraviolet rays.

In addition, the embodiment provides a light emitting module that can prevent the light extraction efficiency is lowered by the metal generated in the adhesive member when the body and the cover are combined.

The light emitting module according to the embodiment includes a light source unit including a light emitting element for emitting ultraviolet light; A body including a lower end disposed with the light source part and a wall part disposed on the lower end surrounding the light source part; A cover disposed on the wall of the body and including an optical member disposed in an opening formed on the light source; And an adhesive member disposed between the wall portion of the body and the cover, wherein at least one of the lower portion and the wall portion is a ceramic substrate composed of a single layer or multilayer ceramic layers, and at least one of the body and the cover. A portion of the interposed portion is disposed between the adhesive member and the light source unit to prevent the ultraviolet ray from being directed to the adhesive member. The light emitting module according to this embodiment can prevent discoloration or deterioration due to ultraviolet rays, and can block light that can be removed from the adhesive member to the light source, thereby improving light extraction efficiency.

Here, the adhesive member, the first adhesive member including any one selected from the group consisting of gold (Au), nickel (Ni), titanium (Ti), copper (Cu) and chromium (Cr); And one selected from the group consisting of tin (Sn), germanium (Ge), silicon (Si), and antimony (Sb) and an alloy composed of gold (Au), or a group consisting of lead (Pb) and silver (Ag) And a second adhesive member including an alloy composed of any one selected from tin (Sn). The light emitting module according to this embodiment may be firmly coupled through utero bonding.

Here, the body further comprises an upper end disposed on the wall, the cover includes a protrusion extending from the lower surface of the cover, the upper end is disposed on the inner side of the upper surface of the wall, the protrusion is the wall It is disposed on the outer side of the upper surface of the portion, the first adhesive member and the second adhesive member is disposed between the wall portion of the body and the protrusion of the cover. The light emitting module according to this embodiment may improve light extraction efficiency by blocking the metal that can be picked up from the second adhesive member to the light source unit.

Here, the height of the upper end may be greater than the height of the protrusion, and the upper end may support the cover.

Here, the body further comprises an upper end disposed on the wall, the cover includes a protrusion extending from the lower surface of the cover, the upper end is disposed on the outer side of the upper surface of the wall, the protrusion is the wall It is disposed on the inner side of the upper surface of the portion, wherein the first adhesive member and the second adhesive member is disposed between the upper end of the body and the cover. The light emitting module according to this embodiment may improve light extraction efficiency by blocking the metal that can be picked up from the second adhesive member to the light source unit.

Here, the height of the protrusion may be greater than the height of the upper end.

Here, the body is disposed on the wall portion, and further comprises a first upper end and a second upper end spaced from each other, the cover includes a protrusion extending from the lower surface of the cover, the protrusion and the first upper end and The second adhesive member is disposed between the second upper end portion, and the first adhesive member and the second adhesive member are disposed between the protrusion and the wall portion. The light emitting module according to this embodiment may improve light extraction efficiency by blocking the metal that can be picked up from the second adhesive member to the light source unit.

Here, the height of the first upper end and the second upper end may be greater than the height of the protrusion, and the first upper end and the second upper end may support the cover.

Using the light emitting module according to the embodiment has an advantage of preventing discoloration or deterioration of the body and the cover.

In addition, when the body and the cover are combined, there is an advantage that can prevent the light extraction efficiency is lowered by the metal generated from the adhesive member.

1 is a cross-sectional perspective view of a light emitting module according to a first embodiment.
FIG. 2 is a perspective view of a body and a cover separated from the light emitting module shown in FIG. 1; FIG.
3 is a cross-sectional view of the light emitting module shown in FIG. 1.
4 is a sectional perspective view of a light emitting module according to a second embodiment.
5 is an exploded perspective view of the body and the cover of the light emitting module shown in FIG. 4.
6 is a cross-sectional view of the light emitting module shown in FIG. 4.
7 is a view for explaining a modification of the upper end shown in FIG.
8 is a cross-sectional view of a light emitting module according to a fourth embodiment.
9 is a cross-sectional view of a light emitting module according to a fifth embodiment.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

In the description of the embodiment according to the present invention, when one element is described as being formed on the "on or under" of another element, it is either above or below. (On or under) includes both two elements are directly in contact with each other (directly) or one or more other elements are formed indirectly between the two elements (indirectly). In addition, when expressed as “on” or “under”, it may include the meaning of the downward direction as well as the upward direction based on one element.

Hereinafter, a light emitting module according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional perspective view of a light emitting module according to a first embodiment, FIG. 2 is a perspective view of a body and a cover of the light emitting module illustrated in FIG. 1, and FIG. 3 is a cross-sectional view of the light emitting module illustrated in FIG. 1.

1 to 3, the light emitting module according to the first embodiment includes a body 100, a light source unit 200, a first adhesive member 300, a second adhesive member 400, and a cover 500. And an optical member 600.

The light source unit 200, the first adhesive member 300, the second adhesive member 400, the cover 500, and the optical member 400 are disposed on the body 100. Specifically, the body 100 accommodates the light source unit 200 therein, the body 100 and the cover 500 are coupled to each other through the first adhesive member 300 and the second adhesive member 400, and the optical member. 600 is coupled to cover 500. Let's look at the body 100 in more detail.

The body 100 may include a lower end 110 and a wall 130. Here, the lower end portion 110 and the wall portion 130 may be integrally formed as the same material, or may be separately manufactured and combined as the same or different materials.

The light source 200 and the wall 130 may be disposed on the lower end 110. In detail, the light source 200 and the wall 130 may be disposed on the upper surface of the lower end 110. Here, the light source unit 200 may be disposed at the center portion of the upper surface of the lower end portion 110, and the wall portion 130 may be disposed at an outer portion of the upper surface of the lower end portion 110 to surround the light source portion 200.

The lower end 110 may be a single layer or a multilayer ceramic substrate. Here, when the lower end 110 is a single layer ceramic substrate, it may be implemented using high temperature co-fired ceramic (HTCC) technology. In this case, the high temperature co-fired ceramic (HTCC) may be formed by co-firing ceramic layers at a high temperature of 1200 ° C. or higher. On the other hand, when the lower end 110 is a multilayer ceramic substrate, for example, it may be composed of high temperature co-fired ceramic (HTCC) or Low Temperature Cofired Ceramics (LTCC). . When the lower end 110 is a multilayer ceramic substrate, the thickness of each layer may be the same or different, and there is no limitation thereto. When the lower end 110 is made of an inorganic ceramic, even if a light source unit emitting deep UV or near UV having a wavelength of about 200 to 405 nm is used, the lower end 110 may be formed by ultraviolet light. There is no fear of discoloration or deterioration, so the reliability can be maintained.

The lower end 110 may be made of an insulating material of nitride or oxide. For example, it may include SiO 2 , Si x O y , Si 3 N 5 , SiO x N y , Al 2 O 3 , or AlN.

The upper surface of the lower end 110, in particular, the central portion of the upper surface where the light source unit 200 is disposed may be deposited or coated with a material capable of reflecting light, thereby improving light extraction efficiency of the light emitting module according to the first embodiment.

The wall portion 130 is disposed on the upper surface of the lower portion 110. In detail, the wall 130 may be disposed at an outer portion of the upper surface of the lower end 110. The wall unit 130 may be disposed to be spaced apart from the light source unit 200 by a predetermined interval and surround or surround the light source unit 200. For example, the wall portion 130 may be disposed to surround or surround the light source unit 200 in a shape of a circle or polygon on an outer portion of the upper surface of the lower end 110, but is not limited thereto.

The wall unit 130 may include an outer wall exposed to the outside and an inner wall surrounding the light source unit 200. The inner wall may be perpendicular to the upper surface of the lower end 110, and may form an obtuse angle or an acute angle with the upper surface of the lower end 110. The inner wall may be coated or deposited with a material that is easy to reflect the light emitted from the light source unit 200. The wall portion 130 having an inner wall having such a light reflection function can improve light extraction efficiency of the light emitting module according to the first embodiment.

The wall portion 130 may be a ceramic substrate composed of a single layer or multiple ceramic layers, similar to the bottom portion 110. Here, when the wall portion 130 is a multilayer ceramic substrate, the thickness of each layer may be the same or different, and there is no limitation on this. If the wall portion 130 is made of an inorganic ceramic material, even if a light source portion emitting deep UV or near ultraviolet rays having a wavelength of about 200 to 405 nm is used, the lower portion 130 may be formed by ultraviolet light. There is no fear of discoloration or deterioration, so the reliability can be maintained.

By the wall portion 130, the light emitting module according to the first embodiment may have a cavity 135. The cavity 135 may be an empty space formed by inner walls of the wall 130 and an upper surface of the lower end 110. The light source unit 200 may be disposed in the cavity 135. In addition, the cavity 135 may be in a vacuum state and filled with nitrogen (N 2 ) gas or forming gas.

The light source unit 200 is disposed in the body 100. In detail, the light source unit 200 may be disposed on the upper surface of the lower end 110 and disposed in the cavity 135.

The light source unit 200 may include a substrate 210 and a light emitting device 250.

The substrate 210 may be a conductive substrate or an insulating substrate, and may include, for example, materials in consideration of thermal conductivity and thermal expansion coefficient, such as Si, SiC, or AlN.

The substrate 210 may be a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like may be used. It may include.

The surface of the substrate 210 may be a material that efficiently reflects light, or may be coated with a color that efficiently reflects light, for example, white, silver, or the like.

The light emitting device 250 emits ultraviolet (UV) light, and is, for example, a deep UV light emitting diode (LED) or a near UV light using a semiconductor layer of a group III-V group element. It can be an LED. In addition, the light emitting device 250 may be an LED emitting one or more of blue, green, red, and white.

The first adhesive member 300 and the second adhesive member 400 are interposed between the body 100 and the cover 500 and are an adhesive material for bonding the body 100 and the cover 500 to each other. More specifically, the first and second adhesive members 300 and 400 may be a material for sealing the body 100 and the cover 500 by eutectic bonding.

The first adhesive member 300 is disposed on the upper surface of the wall portion 130. Here, the first adhesive member 300 may be disposed on the entire upper surface of the wall portion 130, or may be disposed on a portion.

The first adhesive member 300 may be a metal or a material including a metal. For example, the first adhesive member 300 may include any one selected from the group consisting of gold (Au), nickel (Ni), titanium (Ti), copper (Cu), and chromium (Cr).

The second adhesive member 400 is disposed under the cover 500 and is disposed on the first adhesive member 300. The second adhesive member 400 may be disposed on the entire lower surface of the cover 500 or may be disposed on a portion of the cover 500.

The second adhesive member 400 may be a metal or an alloy having a melting point of 260 degrees (° C.) or more.

Specifically, the second adhesive member 400 may be a single metal composed of gold (Au). In addition, the second adhesive member 400 may be an alloy composed of any one selected from the group consisting of tin (Sn), germanium (Ge), silicon (Si), and antimony (Sb) and gold (Au). In addition, the second adhesive member 400 may be an alloy composed of any one selected from the group consisting of lead (Pb) and silver (Ag) and tin (Sn). The metal or alloy that can be used as the second adhesive member 400 and the characteristics thereof will be described in detail as shown in Table 1 below.

Figure 112013047048517-pat00001

On the other hand, the position of the first adhesive member 300 and the second adhesive member 400 may be reversed. That is, the first adhesive member 300 may be disposed on the second adhesive member 400.

When the first adhesive member 300 and the second adhesive member 400 described above are used, the body 100 and the cover 500 may be coupled by eutectic bonding. According to the eutectic bonding, there is an advantage that can be firmly coupled to the body 100 and the cover 500.

The cover 500 is disposed on the body 100 and is coupled to each other through the body 100 and the first and second adhesive members 300 and 400.

The cover 500 may not transmit the light emitted from the light source unit 200, and may have a separate opening for transmitting the light. Here, the opening may be formed in the center of the cover 500, the optical member 500 may be disposed in the opening.

The cover 500 is a metallic material, and may be a material that does not become discolored or altered by ultraviolet rays. For example, it may be a single metal or an alloy composed of a metallic material such as iron (Fe) and nickel (Ni). For example, the cover 500 may be a kovar.

The inner surface of the cover 500 may be deposited or coated with a material that can easily reflect the light emitted from the light emitting device 250 of the light source unit 200.

The optical member 600 is disposed on the light source unit 200 and is coupled to the cover 500. In detail, the optical member 600 may be disposed on the light emitting device 250 and disposed in an opening formed at the center of the cover 500.

The optical member 600 transmits the direct or indirect light emitted from the light source unit 200. The optical member 600 may not only transmit the light from the light source unit 200 but may also diffuse or condense the light.

The optical member 600 may be made of a transparent material and a non-reflective coating film so as not to absorb the light generated by the light source unit 200 and pass to the outside. For example, SiO 2 (Quartz, UV Fused Silica), Al 2 O 3 (Sapphire), LiF, MgF 2 , CaF 2 , Low iron transparent glass, glass materials including B 2 O 3 , polycarbonate ( PC) and PMMA.

In addition, the optical member 600 may change the wavelength of the light from the light source unit 200. To this end, the optical member 600 may include a wavelength conversion material such as a phosphor.

On the other hand, when the body 100 and the cover 500 of the light emitting module according to the first embodiment are bonded to each other by a eutectic bonding process under a predetermined pressure and temperature, the second adhesive member 400 is composed of two metals. In the case of an alloy, a phenomenon in which any one of the metals that are more unstable (for example, gasification and oxidation) is more likely to stick to the light emitting surface of the light emitting device 250 of the light source unit 200 (or splashing). ) May occur. This phenomenon may reduce the light emitting area of the light emitting surface of the light emitting device 250, thereby reducing the light extraction efficiency of the light emitting module. Therefore, a light emitting module that can solve such a problem will be described below with reference to FIGS. 4 to 6.

4 is a cross-sectional perspective view of the light emitting module according to the second embodiment, FIG. 5 is an exploded perspective view of the body and the cover of the light emitting module shown in FIG. 4, and FIG. 6 is a cross-sectional view of the light emitting module shown in FIG. 4.

4 to 6, the light emitting module according to the second embodiment may prevent a phenomenon in which one or more metals among the various metals constituting the second adhesive member 400 stick to the light emitting device 250. have.

The light emitting module according to the second embodiment includes a body 100 ′, a light source unit 200, first and second adhesive members 300 and 400, a cover 500 ′, and an optical member 600.

In the following description of the light emitting module according to the second embodiment shown in FIGS. 4 to 6, the same components as those of the light emitting module according to the first embodiment shown in FIGS. 1 to 3 have the same reference numerals. . Therefore, a detailed description of the configuration having the same reference numerals will be replaced with the above description.

The body 100 ′ of the light emitting module according to the second embodiment includes a lower end 110, a wall 130, and an upper end 150.

The upper end 150 is disposed on the wall 130. Specifically, the upper end 150 may be disposed on a portion of the upper surface of the wall 130, in particular, the upper end 150 may be disposed on the inner side of the upper surface. In addition, the upper end 150 may protrude outward from the wall 130. For example, the upper end 150 may protrude in a direction perpendicular to the upper surface of the lower end 110 from the wall 130. The shape of the upper end 150 may be formed in a circular or polygonal shape according to the shape of the wall 130, but is not limited thereto.

The upper end 150 may be a ceramic substrate composed of a single layer or multiple ceramic layers, similar to the lower end 110 or the wall 130. Here, when the wall portion 150 is a multilayer ceramic substrate, the thickness of each layer may be the same or different, and there is no limitation on this.

Body 100 ′ may have a cavity 135 ′. The cavity 135 ′ may be an empty space formed by an inner surface of the upper end 150, an inner wall of the wall 130, and an upper surface of the lower end 110.

The cover 500 ′ may include a cover 510 and a protrusion 530.

The cover 510 may have the same shape as the cover 500 illustrated in FIGS. 1 to 3.

The protrusion 530 may protrude or extend outward from the lower surface of the cover 510. In more detail, the protrusion 530 may protrude or extend from the outer side of the bottom of the cover 510 toward the top of the lower end 110.

The protrusion 530 of the cover 500 'is disposed on the wall portion 130 of the body 100' and is disposed next to the upper end 150 of the body 100 '. The first and second adhesive members 300 and 400 are disposed between the protrusion 530 of the cover 500 'and the wall 130 of the body 100'. In the light emitting module according to the second embodiment, since the upper end 150 of the body 100 ′ is interposed between the second adhesive member 400 and the light emitting element 250, the body 100 ′ and the cover 500. In the utic bonding of '), any one or more of the metals constituting the second adhesive member 400 may be prevented from moving to the light emitting device 250 in advance. Therefore, the light emitting module according to the second embodiment has an advantage that the light extraction efficiency does not decrease by the second adhesive member 400 during the utic bonding.

Meanwhile, the upper end 150 may support the cover 500 '. This will be described with reference to FIG. 7.

FIG. 7 is a diagram for describing a modified example of the upper end illustrated in FIG. 6.

The upper end 150 ′ illustrated in FIG. 7 may support the cover 500 ′ unlike the upper end 150 illustrated in FIG. 6. In detail, the upper end 150 ′ may support the cover 510 of the cover 500 ′. Since the upper end 150 ′ supports the cover 500 ′, the first and second adhesive members 300 and 400 may have a height (thickness) as designed in advance. This may be useful in the following example. For example, as shown in FIG. 6, if the upper end 150 does not support the cover 500 ', a predetermined force applied to the cover 500' when the cover 500 'and the body 100' are coupled to each other. The protrusion 530 of the cover 500 ′ may be very close to the wall 130 of the body 100 ′ due to the pressure. In this case, a part of the first and second adhesive members 300 and 400 may be moved between the outer wall of the wall 130, the outer wall of the protrusion 530, or the upper end 150 and the cover 510 by the pressure. have. This may be unnecessary waste of the first and second adhesive members 300 and 400. Therefore, as illustrated in FIG. 7, when the upper end 150 ′ supports the cover 500 ′, unnecessary waste of the first and second adhesive members 300 and 400 may be eliminated.

In order to support the cover 500 ', the height of the upper end 150' is greater than the height of the protrusion 530. More specifically, the height of the upper end 150 ′ may be a value obtained by adding the height of the protrusion 530 and the height of the first and second adhesive members 300 and 400.

8 is a cross-sectional view of the light emitting module according to the fourth embodiment, which is a modification of the light emitting module according to the second embodiment shown in FIG. 6.

In the light emitting module according to the fourth embodiment shown in FIG. 8, the position and the cover of the upper end 150 ″ of the body 100 ″ may be compared with the light emitting module according to the second embodiment illustrated in FIG. 6. There is a difference in the position of the protrusion 530 'of 500' ').

Specifically, the upper end 150 ″ of the body 100 ″ of the light emitting module according to the fourth embodiment illustrated in FIG. 8 is disposed at an outer side of the upper surface of the wall 130 and the cover 500 ″ of the cover 500 ″. The protrusion 530 ′ is disposed at an inner side of the bottom surface of the cover 510.

The protrusion 530 'of the cover 500' 'is disposed on the wall 130 of the body 100' 'and is disposed next to the upper end 150' 'of the body 100' '. The first and second adhesive members 300 and 400 are disposed between the upper end portion 150 '′ of the body 100 ′ ′ and the cover portion 510 of the cover 500 ′ ′. In the light emitting module according to the fourth embodiment, since the protrusion 530 'of the cover 500' 'is interposed between the second adhesive member 400 and the light emitting device 250, In the utic bonding of the cover 500 ″, any one or more of the metals constituting the second adhesive member 400 may be prevented from moving to the light emitting device 250 in advance. Therefore, the light emitting module according to the fourth embodiment has the advantage that the light extraction efficiency is not lowered by the second adhesive member 400 during the eutectic bonding, similarly to the light emitting module according to the second embodiment.

Meanwhile, the height of the protrusion 530 ′ illustrated in FIG. 8 may be greater than the height of the upper end 150 ″ in order to prevent unnecessary waste of the first and second adhesive members 300 and 400. More specifically, the height of the protrusion 530 ′ may be the sum of the height of the upper end 150 ″ and the height of the first and second adhesive members 300 and 400.

9 is a cross-sectional view of a light emitting module according to the fifth embodiment, and is a modified example of the light emitting module according to the second embodiment shown in FIG. 6.

The light emitting module according to the fifth embodiment shown in FIG. 9 has upper ends 151 and 153 and the cover 500 of the body 100 ′ ″ in contrast to the light emitting module according to the second embodiment shown in FIG. 6. There is a difference in the protrusion 530 '' of '' ').

Specifically, the upper ends 151 and 153 of the body 100 ′ ′ ′ of the light emitting module according to the fifth embodiment shown in FIG. 9 include a first upper end 151 and a second upper end 153.

The first and second upper ends 151 and 153 are disposed on an upper surface of the wall 130, and the first upper end 151 and the second upper end 153 are disposed to be spaced apart from each other. Since the first upper end 151 and the second upper end 153 are spaced apart from each other, the body 100 ′ ′ ′ may have a groove 155.

The first upper end 151 is disposed on the outer side of the upper surface of the wall 130, and the second upper end 153 is disposed on the inner side of the upper surface of the wall 130.

The cover 500 '' includes a cover portion 510 and a protrusion 530 ''. The protrusion 530 ′ ′ may protrude outward from the center of the bottom surface of the cover 510. The protrusion 530 '' is disposed between the first upper end 151 of the body 100 '' 'and the second upper end 153 of the body 100' ''. In addition, the protrusion 530 ′ ′ may be disposed on an intermediate portion of the top surface of the wall 130 of the body 100 ′ ′ ′. Here, the middle portion of the upper surface of the wall portion 130 refers to the portion between the inner portion and the outer portion of the upper surface of the wall portion 130.

The first and second adhesive members 300 and 400 may each include a protrusion 530 '' of the cover 500 '' ', a first upper end 151 and a second upper end 153 of the body 100' ''. Disposed between (or between grooves 155).

In the light emitting module according to the fifth embodiment, since the second upper end portion 153 of the body 100 ′ ″ is interposed between the second adhesive member 400 and the light emitting element 250, the body 100 ″ may be used. ') And the cover 500' '' may prevent the movement of any one or more of the metals constituting the second adhesive member 400 to the light emitting device 250 in advance. . Therefore, the light emitting module according to the fifth embodiment has the advantage that the light extraction efficiency is not lowered by the second adhesive member 400 during the eutectic bonding similarly to the light emitting module according to the second embodiment. In addition, unlike the light emitting module according to the fourth embodiment, the light emitting module according to the fifth embodiment is the first and second adhesive members 300 and 400, which are not exposed to the outside. And deterioration of the second adhesive members 300 and 400.

Meanwhile, the heights of the first and second upper end portions 151 and 153 shown in FIG. 9 prevent the unnecessary waste of the first and second adhesive members 300 and 400 and support the cover 500 '''. , May be greater than the height of the protrusion 530 ″. More specifically, the height of the first and second upper end portions 151 and 153 may be a value obtained by adding the height of the protrusion 530 ″ and the height of the first and second adhesive members 300 and 400.

The upper ends 150, 150 ′ and 150 ″ of the light emitting modules according to the second and fourth embodiments and the upper ends 151 and 153 of the light emitting modules according to the fifth embodiment may be at least 50 μm or more. If the heights of the upper ends 150, 150 ', 150'', 151, and 153 are 50 μm or more, when the upper ends 150, 150', 150 '', 151, and 153 are ceramic substrates, the upper ends 150, 150 ', There is an advantage in the manufacturing process of 150 '', 151, 153. Specifically, when the wall 130 is a ceramic substrate made of the same material as the upper ends 150, 150 ′, 150 ″, 151 and 153, manufacturing of the upper ends 150, 150 ′, 150 ″, 151 and 153 is performed. Instead of using a separate process for forming, in the process of forming the ceramic wall portion 130 of the multi-layer structure, one additional ceramic layer for manufacturing the upper portions 150, 150 ', 150'', 151, 153 can be formed. have. That is, the upper end portions 150, 150 ′, 150 ″, 151 and 153 may be simultaneously manufactured together with the wall portion 130 in one process. Here, the height of 50 μm is the minimum thickness of one ceramic layer that can be manufactured in the present process, when forming a ceramic substrate of a multi-layer structure. Therefore, it should be noted that the height may be further reduced with the development of the process of forming the ceramic layer.

Although the above description has been made mainly on the embodiments, these are merely examples and are not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains should not be exemplified above unless they depart from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in embodiment can be modified and implemented. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100, 100 ', 100'',100''': body
200: light source
300: first adhesive member
400: second adhesive member
500, 500 ', 500'',500''': cover
600: optical member

Claims (12)

A body comprising a cavity;
An ultraviolet light emitting element disposed in the cavity;
A cover disposed on the body; And
And an adhesive member disposed between the cover and the body.
The body includes a lower end and a wall disposed on the lower end to surround the cavity,
The wall portion includes a top portion extending from the top to the top,
The cover includes a protrusion protruding toward the wall portion,
The adhesive member is disposed in an area where the protrusion part and the wall part overlap in a vertical direction,
The protruding portion and the adhesive member are disposed outside the upper end of the light emitting module.
A body comprising a cavity;
An ultraviolet light emitting element disposed in the cavity;
A cover disposed on the body; And
And an adhesive member disposed between the cover and the body.
The body includes a lower end and a wall disposed on the lower end to surround the cavity,
The wall portion includes a top portion extending from the top to the top,
The cover includes a protrusion protruding toward the wall portion,
The adhesive member is disposed in an area where the upper end portion and the cover overlap in a vertical direction,
The upper end portion and the adhesive member are disposed on the outside of the protruding portion.
The method according to claim 1 or 2,
The adhesive member,
In the group consisting of gold (Au), nickel (Ni), titanium (Ti), copper (Cu) and chromium (Cr)
A first adhesive member including any one selected from the group; And
Among the group consisting of tin (Sn), germanium (Ge), silicon (Si) and antimony (Sb)
A light-emitting module comprising a second adhesive member comprising an alloy selected from any one selected from the group consisting of gold (Au) or an alloy selected from the group consisting of lead (Pb) and silver (Ag) and tin (Sn) .
The method according to claim 1 or 2,
The height of the upper end is greater than the height of the protrusion,
The upper end of the light emitting module for supporting the cover.
The method according to claim 1 or 2,
The height of the protrusion is greater than the height of the upper end of the light emitting module.
The method of claim 1,
The upper end of the light emitting module to block the ultraviolet light emitted from the ultraviolet light emitting element is incident on the adhesive member.
The method of claim 2,
The protruding portion is a light emitting module for blocking the ultraviolet light emitted from the ultraviolet light emitting element is incident on the adhesive member.
The method according to claim 1 or 2,
At least one of the lower end and the wall portion of the light emitting module comprises a single layer or a multilayer ceramic layer.
The method according to claim 1 or 2,
The upper end includes a first upper end and a second upper end spaced from each other,
The protrusion is disposed between the first upper end and the second upper end,
The adhesive member is disposed between the protrusion and the wall portion,
The height of the first upper end and the second upper end is greater than the height of the protrusion,
The first upper end and the second upper end of the light emitting module supporting the cover.
The method according to claim 1 or 2,
The cover includes an opening disposed in a central region,
Light emitting module comprising an optical member disposed in the opening.
The method according to claim 1 or 2,
The adhesive member includes a first adhesive member disposed between the wall portion and the cover and a second adhesive member disposed between the first adhesive member and the cover.
The method of claim 11,
The first adhesive member and the second adhesive member has a light emitting module having a different composition.
KR1020130060080A 2013-05-23 2013-05-28 Light emitting module KR102049380B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020130060080A KR102049380B1 (en) 2013-05-28 2013-05-28 Light emitting module
PCT/KR2014/004217 WO2014189221A1 (en) 2013-05-23 2014-05-12 Light-emitting module
CN201480029387.1A CN105229806B (en) 2013-05-23 2014-05-12 Light emitting module
US14/892,906 US9799802B2 (en) 2013-05-23 2014-05-12 Light emitting module
EP14801082.0A EP3001466B1 (en) 2013-05-23 2014-05-12 Light-emitting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130060080A KR102049380B1 (en) 2013-05-28 2013-05-28 Light emitting module

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KR20140139720A KR20140139720A (en) 2014-12-08
KR102049380B1 true KR102049380B1 (en) 2019-11-28

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Publication number Priority date Publication date Assignee Title
KR102309671B1 (en) * 2015-01-30 2021-10-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package and lighiting device
KR102300558B1 (en) * 2014-12-26 2021-09-14 삼성전자주식회사 Light source module
WO2018235925A1 (en) * 2017-06-22 2018-12-27 Ａｇｃ株式会社 Window material, and optical package

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KR101789825B1 (en) * 2011-04-20 2017-11-20 엘지이노텍 주식회사 The light emitting device package having UV light emitting diode

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