JP2018181869A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress infiltration of water into a space where a semiconductor element is accommodated.SOLUTION: A light-emitting device comprises: a substrate 110 having a first surface 110a; a light-emitting element 120 located on the first surface; and a lid member 130A located at the first surface side of the substrate and that covers the light-emitting element. The light-emitting element is accommodated in a space CV prescribed by the first surface of the substrate and the lid member. The substrate has a vent hole 110v communicated with the space. The vent hole includes a first opening 110va located in a region inside the space of the first surface, and a second opening 110vb located in a region outside the space. In a cross section vertical to a path that the vent hole extends, a cross sectional area of the vent hole at a first position on the path and a cross sectional area of the vent hole at a second position on the path that is closer to the second opening than the first position, are different from each other.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a light emitting device.

  Light emitting semiconductor devices such as laser diodes and light receiving semiconductor devices such as photodiodes are widely used. Patent Document 1 below discloses a structure in which a semiconductor element is fixed in a recess of a base having a recess, and a light-transmissive lid covering the recess is bonded to the base. In the structure described in Patent Document 1, by providing two or more through holes in the base, nitrogen gas or the like can be circulated in the space in which the semiconductor element is accommodated through the through holes.

  Patent Document 2 below discloses a structure in which a semiconductor element is accommodated in a cavity of a package body having a cavity and a tubular through hole, and a glass substrate is bonded to the package body. The through hole of the package body functions as a vent for communicating the cavity to the outside. Patent Document 2 proposes to prevent the entry of foreign matter from the outside by providing a bent structure in the ventilation part. Patent Document 3 below proposes that a through hole is formed in advance in a lead frame to which a solid-state imaging device is connected.

Unexamined-Japanese-Patent No. 2001-351998 JP 2007-128987 A Unexamined-Japanese-Patent No. 2003-152123

  It is useful to be able to suppress the entry of foreign matter into the space in which the semiconductor element is accommodated, in particular, the entry of water, while avoiding that the space in which the semiconductor element is accommodated becomes airtight.

  A light emitting device of the present disclosure includes a substrate having a first surface and a second surface located on the opposite side of the first surface, a light emitting element having an emission surface, and located on the first surface, and the substrate. A lid member positioned on the first surface side and covering the light emitting element, wherein the light emitting device is accommodated in a space defined by the first surface of the substrate and the lid member; The substrate has a vent communicating with the space, and the vent is a first opening located in an area inside the space on the first surface, and a second opening located in an area outside the space. And a cross section perpendicular to the path through which the vent extends, the cross section of the vent at a first position on the path, and the path closer to the second opening than the first position. The cross-sectional area of the vent in the upper second position is different.

  According to the light emitting device of the present disclosure, it is possible to suppress the entry of water into the space in which the semiconductor element is accommodated.

FIG. 1 is a schematic cross-sectional view of a light emitting device according to an embodiment of the present disclosure. FIG. 2 is a view schematically showing an example of a cross section when the substrate 110 is cut at a first position on the path where the vent holes 110v extend. FIG. 3 is a view schematically showing an example of a cross section when the substrate 110 is cut at a second position on the path where the vent holes 110v extend. FIG. 4 is a view for explaining an exemplary manufacturing process of the light emitting device 110A shown in FIG. 1, and is a top view of a substrate 210 having a plurality of vent holes 110v. FIG. 5 is a view for explaining an exemplary manufacturing process of light emitting device 110A shown in FIG. 1, and is a top view of composite substrate 200 in which light emitting element 120 and bonding member 140 are arranged on substrate 210. FIG. 6 is a schematic cross-sectional view of a light emitting device 100B provided with a vent 110s having a shape such that the cross-sectional area gradually decreases from the second position toward the first position. FIG. 7 is a perspective view showing a substrate 110A having a laminated structure including a first layer 110p, a second layer 110q, and a third layer 110r sandwiched therebetween. FIG. 8 is an exploded perspective view showing the first layer 110p, the second layer 110q, and the third layer 110r of the substrate 110A shown in FIG. 7 separately. FIG. 9 is a cross-sectional view along line A-A 'of the substrate 110A. FIG. 10 is a schematic cross-sectional view showing a modification of the shape of the vent. FIG. 11 is a schematic cross-sectional view showing another modification of the shape of the vent. FIG. 12 is a schematic cross-sectional view showing another modification of the shape of the vent. FIG. 13 is a schematic cross-sectional view showing another modification of the shape of the vent. FIG. 14 is a schematic cross-sectional view showing another modification of the light emitting device. FIG. 15 is a schematic cross-sectional view showing still another modification of the light emitting device.

  Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiments are exemplifications, and the configuration of the light emitting device according to the present disclosure and the method of manufacturing the same are not limited to the following embodiments. For example, the numerical values, shapes, materials, steps, order of the steps, and the like shown in the following embodiments are merely examples, and various modifications are possible as long as no technical contradiction arises.

  In the following description, terms indicating a specific direction or position (for example, "upper", "lower", "right", "left" and other terms including those terms) may be used. However, these terms are only used for the sake of clarity as to the relative orientation or position in the referenced drawings. If the relative directions or positions in terms of terms such as "upper" and "lower" in the referred drawings are the same, the drawings other than the present disclosure, actual products, etc. do not have the same arrangement as the referred drawings. May be In the following description, components having substantially the same function are denoted by the same reference numerals, and the description may be omitted. Moreover, in order to avoid that a drawing becomes too complicated, illustration of some elements may be abbreviate | omitted. The sizes, positional relationships, etc. of the components shown in the drawings may be exaggerated for the sake of easy understanding, and the size in the actual light emitting device or the magnitude relationship between the components in the actual light emitting device It may not be reflected. In the present disclosure, “parallel” and “perpendicular” (or “orthogonal”) mean, unless otherwise stated, two straight lines, sides or faces, etc. by about 0 ° to ± 5 ° and 90 ° to ± 5. Including the case in the range of ° degree.

(Structure of light emitting device)
FIG. 1 schematically illustrates a cross section of a light emitting device according to an embodiment of the present disclosure. A light emitting device 100A shown in FIG. 1 includes a substrate 110, a light emitting element 120 located on one main surface (first surface) 110a of the substrate 110, and a light emitting element 120 located on the main surface 110a side of the substrate 110. And a cover member 130A for covering. The light emitting element 120 is accommodated in a space CV defined by the main surface 110 a of the substrate 110 and the lid member 130 </ b> A.

  FIG. 1 schematically shows a cross section when the light emitting device 100A is cut along a plane perpendicular to the major surface 110a of the substrate 110. As schematically shown in FIG. 1, the substrate 110 is provided with at least one air vent 110 v communicating with the space CV that accommodates the light emitting element 120. By providing the substrate 110 with the vent 110v communicating with the space CV, for example, the gas generated when bonding the lid member 130A to the substrate 110 using an adhesive can be extracted from the space CV through the vent 110v. Can escape to the outside of the Since the gas can be released to the outside through the vent holes 110v, an increase in pressure in the space CV due to the generation of gas from the adhesive can be suppressed, and deformation of the temporarily cured adhesive can be reduced. Since deformation of the adhesive in the pre-cured state is reduced, it is possible to prevent the lid member 130A from being dislocated when bonding to the substrate 110.

  As will be described in detail later, in the embodiment of the present disclosure, the cross-sectional area of the vent 110v at a first position on the extending path of the vent 110v is at a second position different from the first position. It is different from the cross section of By making the cross-sectional area of the vent hole 110v in the cut surface perpendicular to the path where the vent hole 110v extends constant not along the path, it is possible to more effectively suppress the entry of foreign matter into the space CV via the vent hole 110v. It can.

  Hereinafter, each component will be described in detail with reference to the drawings.

[Light-emitting element 120]
The light emitting element 120 is a semiconductor light emitting element such as a light emitting diode (LED) or a laser diode (LD). The light emitting element 120 may be in the form of a bare chip, or may be in the form of a die or the like in which a semiconductor die is disposed in the recess of the light reflective package having the recess. Here, as the light emitting element 120, a die of an LED in which the upper surface 120a opposite to the bottom surface facing the main surface 110a of the substrate 110 is an emitting surface is illustrated.

[Lid member 130A]
In the configuration illustrated in FIG. 1, the lid member 130 </ b> A includes a wall 132 and a roof 134 supported by the wall 132. The base 132 s of the wall 132 is bonded to the main surface 110 a of the substrate 110 by a bonding member 140 described later.

  As schematically shown in FIG. 1, the roof portion 134 has a light transmitting portion 134 t at a portion facing the upper surface 120 a of the light emitting element 120. The portion of the lid member 130A other than the light transmitting portion 134t is formed of, for example, a resin material in which a light reflective filler is dispersed, and has a reflectance of, for example, 60% or more to light from the light emitting element 120. As the light reflective filler, metal particles or particles of an inorganic material or an organic material having a refractive index higher than that of a resin material in which the light reflective filler is dispersed can be used. Examples of light reflective fillers include titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, silicon oxide, various rare earth oxides (eg, yttrium oxide) , Gadolinium oxide, etc.). As a resin material for dispersing the light reflective filler, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea resin, phenol resin, acrylic resin, urethane resin or fluorine resin, or resin of these resins Resin containing 2 or more types can be used. The reflectance to light from the light emitting element 120 of the portion of the lid member 130A other than the light transmitting portion 134t may be 70% or more, 80% or 90% or more, and may be set appropriately.

  The light transmitting portion 134t can be formed using a light transmitting material such as a transparent resin or glass. The light emitted from the light emitting element 120 is extracted to the outside of the light emitting device 100A through the light transmitting portion 134t. The shape of the light transmitting portion 134t is not limited to a flat plate as illustrated in FIG. 1 and may include a lens-like portion.

[Joining member 140]
The bonding member 140 fixes the lid member 130A to the substrate 110. As the bonding member 140, for example, an ultraviolet curing / thermo curing combined type adhesive (hereinafter, may be simply referred to as “adhesive”) which is a known sealing material can be used. After an adhesive is applied on the main surface 110a of the substrate 110 and the lid 130A is disposed on the main surface 110a, the adhesive is temporarily cured by irradiating the bonding portion between the lid 130A and the substrate 110 with ultraviolet light. Let Thereafter, the lid member 130A can be bonded to the substrate 110 by heat curing the adhesive. As a material of the bonding member 140, a thermosetting adhesive may be used instead of the ultraviolet curing / thermosetting combined adhesive.

  The adhesive generates a gas upon heat curing. When the space CV is filled with the gas generated at the time of heat curing of the adhesive, the pressure in the space CV may rise, and the adhesive in the temporarily cured state may be deformed. The deformation of the adhesive in the pre-cured state causes positional displacement of the lid member 130A. In addition, when the pressure in the space CV is increased, voids may be generated in the temporarily cured adhesive. In the embodiment of the present disclosure, since the vent 110v is provided in the substrate 110, the gas generated during the thermosetting of the adhesive is discharged to the outside of the space CV through the vent 110v of the substrate 110. Can. Therefore, the rise of the pressure in space CV by generation of gas is controlled. Since the rise of the pressure in the space CV is suppressed, it is possible to prevent the positional deviation of the lid member 130A due to the deformation of the adhesive in the temporarily cured state with the rise of the pressure in the space CV.

[Substrate 110]
The substrate 110 has a main surface 110a on which the light emitting element 120 and the lid member 130A are disposed, and a main surface (second surface) 110b opposite to the main surface 110a. For example, an inner lead (not shown in FIG. 1) is disposed on the main surface 110a of the substrate 110, and an electrode (not shown in FIG. 1) electrically connected to the inner lead is provided on the main surface 110b. The light emitting element 120 is electrically connected to the inner lead by a metal wire, a bump or the like. The light emitting device 100A is mounted on the wiring substrate by connecting the electrode on the main surface 110b side of the substrate 110 to, for example, the wiring substrate by a bump or the like.

Examples of the material of the substrate 110 are resin, ceramics, glass and metal. As the resin, phenol resin, epoxy resin, polyimide resin, bismaleimide triazine resin (BT resin), polyphthalamide (PPA), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or the like can be used. Ceramics may be selected as the material of the substrate 110 from the viewpoint of excellent heat resistance and light resistance. Examples of the ceramic include alumina, mullite, forsterite, glass ceramics, nitrides (eg, AlN), carbides (eg, SiC), and low temperature co-fired ceramics (LTCC). The substrate 110 may be formed of a composite material, and for example, an inorganic filler such as glass fiber, SiO ₂ , TiO ₂ , or Al ₂ O ₃ may be mixed with the above-described resin. Thereby, the mechanical strength of the substrate 110 can be improved, the thermal expansion coefficient can be reduced, and the light reflectance can be improved. For example, a glass fiber reinforced resin (glass epoxy resin) or the like may be used as the material of the substrate 110. The thickness of the substrate 110 can be selected as appropriate.

  As described above, the substrate 110 has at least one vent 110v in communication with the space CV defined by the main surface 110a and the lid member 130A described later. In FIG. 1, one vent 110v is shown to avoid over-complicating the drawing. The vent holes 110v may be tubular with a diameter in the range of, for example, 0.1 mm or more and 0.5 mm or less.

  Vent 110v includes a first opening 110va located in an area inside space CV of main surface 110a and a second opening 110vb located in an area outside space CV. In this example, the second opening 110 vb is provided on the main surface 110 b side of the substrate 110 and in the vicinity of the peripheral edge of the substrate 110. The position of the second opening 110vb is not limited to this example, and may be another position. The second opening 110vb may be provided in the main surface 110a as long as it is located in the region outside the space CV, or may be provided at a position other than the main surfaces 110a and 110b.

  In the configuration illustrated in FIG. 1, the vent hole 110 v extends from the first opening 110 va on the main surface 110 a toward the main surface 110 b from the first opening 110 va perpendicular to the main surface 110 a, and on the main surface 110 b It includes a second portion 112 extending perpendicularly to the major surface 110a from the two openings 110vb to the major surface 110a, and a third portion 113 extending in a plane parallel to the major surface 110a. By the vent 110v having the first portion 111, the second portion 112 and the third portion 113, the connection portion of the first portion 111 and the third portion 113, and the second portion 112 and the third portion inside the substrate 110. Two bending structures are formed in the connecting portion 113. By providing the vent 110v with a bent structure, the effect of preventing foreign matter from entering the space CV through the vent 110v can be obtained.

  As shown in FIG. 1, in this example, the third portion 113 has a shape that narrows from the second opening 110 vb toward the first opening 110 va along the extending path of the vent 110 v. FIG. 2 shows an example of a cross section when the substrate 110 is cut at a first position on the extending path of the vent 110v, which is shown by the thick arrow P1 in FIG. 1, and FIG. 3 shows the thick arrow in FIG. An example of a cross section when the board | substrate 110 is cut | disconnected in the 2nd position on the extending path of the vent 110v shown by P2 is shown. The cross sections shown in FIG. 2 and FIG. 3 are all cross sections when the substrate 110 is cut in a plane perpendicular to the extending path of the vent 110v. Here, as shown in FIG. 1, the second position is a position closer to the second opening 110 vb than the first position.

  As can be seen from the comparison of FIG. 2 and FIG. 3, in the embodiment of the present disclosure, in the cross section perpendicular to the extending path of the vent 110v, the vent 110v is broken at a first position on the extending path of the vent 110v. The area is different from the cross-sectional area of the vent 110v at a second position on the extending path of the vent 110v. Thus, in the embodiment of the present disclosure, the vent hole 110v may have a portion where the cross-sectional area of the vent hole 110v in the cutting plane perpendicular to the extending path of the vent hole 110v changes along the path. Of the cross section perpendicular to the path through which the vent 110v extends, the cross-sectional area of the vent 110v at the first position on the path and the second position on the path closer to the second opening 110vb than the first position. By making the cross-sectional area of the vent 110v different, it is possible to more effectively suppress the entry of foreign matter into the space CV.

  In the configuration illustrated in FIGS. 2 and 3, the shape (hereinafter simply referred to as “cross-sectional shape”) of the vent hole 110 v in a cross section perpendicular to the path in which the vent hole 110 v extends is a circle. The cross-sectional shape of the vent 110v is arbitrary, and may be elliptical, polygonal or irregular. It is not necessary for the cross-sectional shape of the vent 110v to be constant between the first opening 110va and the second opening 110vb. For example, the shape of the first opening 110va may be different from the shape of the second opening 110vb.

  As illustrated in FIG. 1, by making the cross-sectional area of the vent 110v in the first position different from the cross-sectional area of the vent 110v in the second position, the space CV via the vent 110v can be obtained. In particular, it is possible to suppress the ingress of water into the space CV. Hereinafter, this point will be described.

  In the light emitting device 100A, for example, a composite substrate in which a plurality of sets of the light emitting element 120 and the lid member 130A are arranged on the main surface is divided into a plurality of portions by using the set of the light emitting element 120 and the lid member 130A as a unit. It can be manufactured. For example, as shown in FIG. 4, a substrate 210 having a plurality of vent holes 110v is prepared. In the example shown in FIG. 4, a plurality of vent holes 110 v are arranged in a matrix in the substrate 210.

  After preparing the substrate 210, the plurality of light emitting elements 120 are disposed on the substrate 210 so as to correspond to the respective vents 110v. Although not shown in FIG. 4, a part of the inner lead may be located on the surface of the substrate 210. In FIG. 4, a two-dotted line rectangle indicates a unit region 10 </ b> C in which the light emitting element 120 should be disposed.

  After disposing the light emitting element 120 on the substrate 210, a material (for example, an adhesive) of the bonding member 140 is applied onto the substrate 210, and the lid member 130A is disposed for each unit region 10C. After arranging the lid member 130A, the material of the bonding member 140 is cured to fix the lid member 130A on the substrate 210. FIG. 5 shows an example of the composite substrate 200 in which the light emitting element 120 and the bonding member 140 are disposed on the substrate 210.

  Next, the composite substrate 200 is divided into a plurality of units each including a set of the light emitting element 120 and the bonding member 140 by cutting the substrate 210 using, for example, a dicing apparatus. The broken lines in FIG. 5 indicate cutting lines in dicing. By dividing the composite substrate 200, the plurality of light emitting devices 100A can be efficiently manufactured.

  In the division of the composite substrate 200, cutting may be performed while supplying a large amount of water or in a state where the composite substrate 200 is submerged in water. If the cross-sectional area of the vent in the cross section perpendicular to the path where the vent extends is constant along the path, water infiltrates into the space in which the light emitting element is accommodated through the vent, and the defect rate of the light emitting device May be high. On the other hand, in the embodiment of the present disclosure, as described with reference to FIGS. 1 to 3, in the cross section perpendicular to the path in which the vent 110 v extends, the vent 110 v in the first position on the path is The cross-sectional area is different from the cross-sectional area of the vent 110v at the second position on the path. Therefore, it is possible to more effectively suppress the entry of water into the space CV in which the light emitting element 120 is accommodated. According to the embodiment of the present disclosure, even when the plurality of light emitting devices 100A are manufactured by cutting the composite substrate 200 in which the plurality of light emitting elements 120 are disposed in a state of being submerged in water, the light emitting elements 120 are accommodated. It is possible to suppress the infiltration of water or the like through the vent holes 110v into the space CV. Therefore, a plurality of light emitting devices can be provided more efficiently.

  In the example shown in FIGS. 1 to 3, the cross-sectional area of the vent 110 v at the first position is smaller than the cross-sectional area of the vent 110 v at the second position. By making the cross-sectional area of the vent 110v at the first position smaller than the cross-sectional area of the vent 110v at the second position closer to the second opening 110vb than the first position, the effect of preventing the entry of water is obtained. It can be improved.

  In the configuration illustrated in FIG. 1, the vent 110v is shaped such that its cross-sectional area decreases continuously from the second position toward the first position. However, it is not essential for the cross-sectional area of the vent 110v to decrease continuously from the second position toward the first position. As illustrated in FIG. 6, the cross-sectional area of the vent may be gradually changed from the second position toward the first position. For example, the substrate 110 of the light emitting device 100B illustrated in FIG. 6 is provided with a vent 110s having a shape such that the cross-sectional area thereof gradually decreases from the second position toward the first position. Even if the cross-sectional area is shaped so as to gradually decrease from the second position toward the first position, it is common in that the effect of suppressing the entry of water can be obtained. Thus, it is not essential that the portion between the second position and the first position in the wall surface defining the vent is smooth, as illustrated in FIG. 6, from the second position The portion up to the first position may include a step.

  The above-mentioned Patent Document 3 proposes providing a combination of a vent whose cross-sectional area increases toward the mounting substrate and a vent whose cross-sectional area decreases toward the mounting substrate on the bottom side of the semiconductor device. ing. However, this is intended to actively generate an air flow in the hollow portion in which the solid-state imaging device is accommodated, and there is no viewpoint of preventing the infiltration of water.

  In the embodiment of the present disclosure, the number of vents formed in the substrate may be one or two or more. However, from the viewpoint of preventing the entry of water into the space CV, it is advantageous that the number of vent holes provided in the substrate is one.

(Example of formation method of vent and other modified examples)
FIG. 7 shows a modification of the substrate 110. The substrate 110A shown in FIG. 7 has a laminated structure including a first layer 110p, a second layer 110q, and a third layer 110r sandwiched therebetween. FIG. 8 shows the first layer 110p, the second layer 110q and the third layer 110r in isolation, and FIG. 9 shows a cross section along the line AA 'of the substrate 110A. The first layer 110p has a first hole 111h including a first opening 110va, and the second layer 110q has a second hole 112h including a second opening 110vb. The third layer 110r has a third hole 113h. As schematically shown in FIG. 8, when viewed in the normal direction of the main surface 110 a, a part of the third hole 113 h overlaps the first hole 111 h, and the other part of the third hole 113 h A portion overlaps the second hole 112 h. That is, the third layer 110r has the third hole 113h communicating with the first hole 111h and the second hole 112h.

  As shown in FIG. 9, in this example, the vent holes 110v from the first opening 110va to the second opening 110vb are connected to the substrate 110A by combining the first layer 110p, the second layer 110q and the third layer 110r. It is formed. In other words, in this example, the vent 110v includes the first hole 111h, the second hole 112h, and the third hole 113h. Thus, the substrate 110A having a multilayer structure may be applied. By forming a vent by combining a plurality of layers each having a hole, it is possible to improve the design freedom regarding the shape of the vent.

  In the configuration illustrated in FIG. 8, the third hole 113 h extends in a straight line in a plane parallel to the main surface of the third layer 110 r. However, the shape of the third hole 113 h is not limited to this example, and may be bent in a plane parallel to the main surface of the third layer 110 r or may include a branch. In the configuration illustrated in FIG. 9, of the wall surface of the third hole 113 h, the portion positioned on the main surface 110 b side is inclined with respect to the main surface 110 a. Such a shape can be realized, for example, by end milling. For example, the inclined surface can be formed by moving the object to be processed (here, the third layer 110r) in a plane parallel to the main surface while moving the end mill along the axial direction. Alternatively, the processing may be performed in a state where the processing object is inclined. In addition, if the end mill is moved stepwise along the axial direction, it is possible to form a wall surface having a stepped shape as shown in FIG.

  10 to 13 show modified examples of the shape of the vent. The cross sections shown in FIGS. 10 to 13 correspond to the cross sections when the substrate is cut perpendicularly to the substrate at the position of the line A-A ′ shown in FIG. 7.

  The air vent 110 x formed in the substrate 110 B shown in FIG. 10 has a branch portion 115. The branch portion 115 includes a first branch portion 117, a second branch portion 118 and a third branch portion 119. As shown in FIG. 10, one end of the first branch 117 communicates with the first opening 110va, and one end of the second branch 118 communicates with the second opening 110vb. One end of the third branch portion 119 is closed. By providing such a branched portion 115 in the middle of the air hole 110x, it is possible to hold water inside the third branch portion 119 when water intrudes into the air hole 110x, and it is possible to Water entry can be further suppressed.

  The substrate 110C shown in FIG. 11 has a vent 110y including a first portion 111 and a second portion 112 extending perpendicularly to the major surface 110a, and a third portion 113 extending in a plane parallel to the major surface 110a. . In the configuration illustrated in FIG. 11, the first portion 111 has a shape that narrows from the third portion 113 toward the first opening 110 va. Similarly, the second portion 112 of the vent hole 110y has a shape that narrows from the second opening 110vb to the third portion 113. As in this example, the shapes of the first portion 111 and the second portion when cut in a plane perpendicular to the extending path of the vent 110v may be changed along the extending path of the vent 110v. In this example, focusing on the first portion 111, for example, the cross-sectional area of the vent 110y at the first position indicated by the thick arrow P1 in FIG. 11 is at the second position indicated by the thick arrow P2 in FIG. It is different from the cross-sectional area of the vent 110y. In this example, the vent 110y has two branches. Thus, the vent may have two or more branches.

  The substrate 110D shown in FIG. 12 has a vent 110z. The third portion 113 of the vent hole 110z has a shape such that the cross-sectional area when cut along a plane perpendicular to the path in which the vent hole 110z extends gradually decreases along the path. As shown in FIG. 12, not only the first portion 111 and the second portion 112, but also the third portion 113 should be shaped so that the cross-sectional area decreases from the second opening 110vb to the first opening 110va. Thus, the function of suppressing the infiltration of water can be further improved.

  Alternatively, as in the case of the vent hole 110w of the substrate 110E shown in FIG. 13, for example, the shapes of the first portion 111 and the second portion 112 increase in cross-sectional area from the second opening 110vb to the first opening 110va. It may be a shape. However, the shape in which the cross-sectional area decreases from the second opening 110vb toward the first opening 110va can more effectively suppress the entry of water.

  14 and 15 show other modified examples of the light emitting device. In the light emitting device 100C shown in FIG. 14, the second opening 110vb is located near the center of the substrate 110F. As described with reference to FIG. 1, the second opening 110vb may be located in the area outside the space CV, and as shown in FIG. 14, for example, even if it is located near the center of the substrate 110F. Good.

  The shape of the substrate supporting the light emitting element 120 is not limited to a flat shape. A light emitting device 100D shown in FIG. 15 includes a substrate 110G and a flat lid member 130B. The substrate 110 </ b> G has a wall 110 </ b> Gs that rises from the major surface 110 a. By the substrate 110G having the wall portion 110Gs, the recess 116 is formed on the side of the substrate 110G opposite to the main surface 110b. The light emitting element 120 is located in the recess 116.

  In the configuration illustrated in FIG. 15, the lid member 130B includes a light transmitting portion 134t and a support portion 134s surrounding the light transmitting portion 134t. In this example, the light transmitting portion 134t of the lid member 130B is bonded to the wall portion 110Gs of the substrate 110G by the bonding member 140, whereby the lid member 130B is fixed to the substrate 110G. The point in which the light emitting element 120 is accommodated in the space CV defined by the main surface 110a of the substrate 110G and the lid member 130B is the same as the example described above. As in this example, the substrate may be provided with a recess.

  The light emitting device according to the embodiment of the present disclosure can be used as a light source for various illuminations, a light source for vehicles, a light source for backlight, and the like.

100A to 100D Light emitting device 110, 110A to 110G Substrate 110a, 110b Main surface of substrate 110p First layer 110q Second layer 110r Third layer 110s, 110v to 110z Air vent 110va First opening 110vb Second opening 111 First portion 111h First hole portion 112 Second portion 112 h Second hole portion 113 Third portion 113 h Third hole portion 115 Branch portion 117 First branch portion 118 Second branch portion 119 Third branch portion 120 Light emitting element 130 A, 130 B Cover member 140 Member 200 composite board

Claims (7)

A substrate having a first surface and a second surface located opposite the first surface;
A light emitting element having an emitting surface and located on the first surface;
A lid member positioned on the first surface side of the substrate and covering the light emitting element;
The light emitting element is accommodated in a space defined by the first surface of the substrate and the lid member,
The substrate has a vent communicating with the space;
The air vent includes a first opening located in an area inside the space of the first surface, and a second opening located in an area outside the space,
The cross-sectional area of the vent at a first position on the path and the second cross section on the path closer to the second opening than the first position, of the cross section perpendicular to the path where the vent extends A light emitting device, wherein the cross-sectional area of the vent in position is different.   The light emitting device according to claim 1, wherein a cross-sectional area of the vent at the first position is smaller than a cross-sectional area of the vent at the second position.   The light emitting device according to claim 1, wherein a cross-sectional area of the vent hole continuously decreases from the second position toward the first position.   The light emitting device according to any one of claims 1 to 3, wherein the second opening is provided on the second surface of the substrate. The substrate is
A first layer having a first hole including the first opening;
A second layer having a second hole including the second opening;
And a third layer having a third hole interposed between the first layer and the second layer and communicating with the first hole and the second hole;
The light emitting device according to any one of claims 1 to 4, wherein the air vent includes the first hole, the second hole, and the third hole.   The vent has a branch portion including a first branch portion having one end communicating with the first opening, a second branch portion having one end communicating with the second opening, and a third branch portion having one end closed. The light-emitting device according to any one of claims 1 to 5, comprising:   The light emitting device according to any one of claims 1 to 6, wherein the air vent includes a bending structure inside the substrate.

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