JP2002184209A - Lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance production efficiency by automating a three-dimensional arrangement of a light emitting diode and to obtain a higher light output by inhibiting drop of an emission efficiency accompanying with a temperature rise of the light emitting diode in a production step. SOLUTION: In the lighting system, an emission part is disposed in a case 1 provided with a body part 4 having a front opening part 3. The emission part 2 has a flexible board 8 and a plurality of light emitting diodes 9 mounted to one surface of the flexible board 8. The flexible board 8 is disposed in the case 1 such that the other surface of the flexible board 8 on which the light emitting diodes 9 are not mounted and an inner surface of the body part 4 are opposed to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting device.

[0002]

2. Description of the Related Art Recently, light-emitting diodes have high efficiency and long life, and blue and white light-emitting diodes have been put into practical use. It has been proposed for use in devices.

[0003] For example, a plurality of LED modules each configured by mounting a plurality of light emitting diodes on a flat substrate are provided.
An LE formed by mounting a plurality of light emitting diodes on a flat plate-like substrate on the front surface of the side light emitting unit arranged in a cylindrical shape so that the light emitting diodes are located outside.
A light-emitting unit having a front light-emitting unit provided with a D module is housed in a reflector that emits light emitted from the light-emitting unit from a front opening (Japanese Patent Laid-Open No. 10-83709). Gazette).

When a light emitting diode is used as a light source of a lighting device, although the light output per light emitting diode is small, a plurality of light emitting diodes are three-dimensionally arranged and integrated as in the above light emitting unit. A high light output can be obtained without increasing the size of the lighting device.

[0005]

However, the work of assembling a flat substrate into a tubular shape, that is, three-dimensionally, is as follows.
There is a problem that production efficiency is poor because automation is difficult and manual work must be performed. In addition, since the light emitting diodes are integrated in order to increase the light output of the lighting device, the mounting density of the light emitting diodes on the substrate increases,
There has been a problem that the temperature of each light emitting diode rises abnormally, the luminous efficiency of the light emitting diode decreases, and as a result, the light output of the lighting device decreases.

The present invention has been made in order to solve such a problem. In the manufacturing process, it is possible to automate the three-dimensional arrangement of the light emitting diodes, thereby improving the production efficiency. It is another object of the present invention to provide a lighting device capable of suppressing a decrease in luminous efficiency of a light emitting diode with a rise in temperature, and capable of obtaining a higher light output.

[0007]

A lighting device according to the present invention is a lighting device in which a light emitting unit is disposed in a case having a main body having a front opening, wherein the light emitting unit includes a flexible substrate and a flexible substrate. A plurality of light-emitting diodes mounted on one surface of the flexible substrate, and the other surface of the flexible substrate on which the light-emitting diodes are not mounted and the inner surface of the main body face each other and are inside the case. It has a configuration that is arranged.

Thus, in the manufacturing process, after the light emitting diodes are mounted on one surface of the flat flexible substrate in advance, the light emitting diodes can be easily arranged three-dimensionally by deforming the flexible substrate.
Therefore, automation of manufacturing can be easily performed. Also,
Since the light-emitting portion is disposed in the case with the other surface of the flexible substrate on which the light-emitting diode is not mounted and the inner surface of the main body facing each other, the outer dimensions of the lighting device are reduced to those of the conventional lighting device. It is possible to increase the surface area of the flexible substrate on which the light-emitting diodes can be mounted while keeping the same, and thus, if the number of light-emitting diodes used is the same as the number of light-emitting diodes of the conventional lighting device, the light-emitting diode substrate Since the mounting density of the light emitting diode can be reduced, a rise in the temperature of the light emitting diode can be suppressed, so that a decrease in the luminous efficiency of the light emitting diode can be suppressed.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

The lighting device according to the first embodiment of the present invention has a total length of 44 mm and a maximum outer diameter of 50 mm, and as shown in FIG. And a light emitting unit 2.

The case 1 has a main body 4 having a front opening 3 with an opening diameter of 45 mm, and a maximum outer portion provided at the other end of the main body 4 and having a GU 5.3 type base pin 5a for 12V attached thereto. And a cylindrical base 5 having a diameter of 20 mm.

A light-transmitting front cover 6 made of glass or resin is attached to the front opening 3 with a fastener (not shown). The translucent front cover 6 may be colorless and transparent or translucent, may be colored as necessary, and may have a lens function. In particular, when the translucent translucent front cover 6 is used,
The light emitted from the light emitting unit 2 described below can be diffused, and the light emitted from the case 1 can be made uniform. Further, a phosphor film (not shown) is formed on the inner surface of the light-transmitting front cover 6, and a light-emitting diode that emits ultraviolet light is used as a light-emitting diode 9 described later, so that the light-transmitting front cover 6 emits light. Can also.

The inner surface of the main body 4 has an optical axis (shown by an arrow A in FIG. 1) of each light emitting diode 9 mounted on the flexible substrate 8 when the flexible substrate 8 is provided on the inner surface as described later. ) Pass through the front opening 3 of the main body 4, and are constituted by a plurality of planes or a plurality of rotationally curved surfaces such as a plurality of paraboloids of revolution or ellipsoids of revolution.
Light radiated from the light emitting diode 9 can be efficiently radiated to the outside of the case 1. In addition, by appropriately adjusting the size, angle, and the like of a plurality of planes or a plurality of quadratic curved surfaces forming the inner surface shape of the main body 4, the direction of all or individual optical axes of the light emitting diodes 9 can be arbitrarily changed. Therefore, desired light distribution characteristics can be obtained.

The light axis of the light emitting diode 9 is perpendicular to the light emitting surface of the light emitting diode 9.

Further, the material of the main body 4 is made of, for example, aluminum having thermal conductivity, and the flexible substrate 8 having thermal conductivity is used, and the main body 4 having thermal conductivity and the flexible substrate 8 are thermally connected. Connected, the heat generated from the light emitting diode 9 may be conducted to the main body 4 via the flexible substrate 8 and radiated to the outside,
Thereby, the temperature rise of the light emitting diode 9 can be suppressed.

It should be noted that high thermal conductivity can be obtained even when a resin material in which an insulating resin and a high thermal conductive material such as alumina is mixed with an epoxy resin is used as the material of the main body 4.

Further, when the main body 4 and the flexible substrate 8 are thermally connected, as shown in FIG. 2, the outer surface of the main body 4 has a length of 20 mm, a width of 5 mm, and a maximum depth of 1 mm. It is preferable that a plurality of vertically long concave portions 7 are provided. Thereby, since the surface area of the main body 4 can be increased, the heat radiation effect of the main body 4 can be further enhanced, and the temperature rise of the light emitting diode 9 can be further suppressed.

Even when a convex portion (not shown) is provided on the outer surface of the main body portion 4 instead of the concave portion 7, the heat radiation effect of the main body portion 4 can be further enhanced as described above, and the light emitting diode 9 Temperature rise can be further suppressed.

The light emitting section 2 includes a flexible substrate 8 made of polyimide having a reflective surface, for example, painted white or metallic on one surface, and a plurality of light emitting diodes 9 mounted on the reflective surface of the flexible substrate 8 at equal intervals. And The reflection surface of the flexible substrate 8 may be colored other than white to obtain a desired emission color.

The flexible substrate 8 is deformed along the shape of the inner surface of the main body 4 so that the other surface on which the light emitting diode 9 is not mounted and the inner surface of the main body 4 face each other. Is fixedly provided on the inner surface with an adhesive (not shown) or the like.

The flexible substrate 8 does not necessarily need to be provided on the inner surface of the main body 4 in a deformed state along the inner surface shape of the main body 4, and need not be completely in contact with the inner surface of the main body 4. Absent.

The flexible substrate 8 is preferably made of a multilayer substrate including a metal layer made of, for example, copper or a graphite layer in order to obtain thermal conductivity.

As shown in FIG. 3, when the flexible substrate 8 is developed on a plane, a circular bottom portion 10 having a diameter of 20 mm disposed at the end of the main body portion 4 on the base 5 side, and the bottom portion 1
0 and a comb-shaped side portion 11 that is mechanically and electrically connected to the inner surface of the main body 4. When such a flexible board 8 is used, in order to facilitate the work of incorporating the light emitting unit 2 into the case 1, before putting the flexible board 8 on which the light emitting diode 9 is mounted into the main body 4, a side surface section is required. It is preferable that 11 is formed in a tapered shape such that the reflection surface is on the inside.

As the light emitting diode 9, for example, InG
An aN-based white light emitting diode is used. In addition, white light can be obtained by combining the multicolor light emitting diodes 9 represented by three primary colors such as red, blue, and green. Furthermore, a luminescent color other than white light can be obtained by using only the light emitting diode 9 of each color other than white according to the purpose.

Further, by mounting the bare chip of the light emitting diode 9 on the flexible substrate 8, the integration of the light emitting diode 9 can be further improved.

As shown in FIG. 1, a drive circuit 12 for driving the light emitting diode 9 is mounted on a surface of the bottom surface 10 of the flexible substrate 8 opposite to the reflection surface, and the base 5 of the case 1 Is located within. By mounting the drive circuit 12 on the flexible board 8 in this manner, another board for the drive circuit is not required, so that the cost can be reduced and the size of the lighting device can be reduced. This eliminates the need for a separate step of incorporating the driving circuit substrate into the lighting device, thereby improving production efficiency.

Next, the lamp characteristics of the lighting device according to the first embodiment of the present invention (hereinafter referred to as “product A of the present invention”) were examined.

First, ten products A of the present invention were manufactured, and each manufactured lighting device was subjected to a DC voltage of 12 V and a DC current of 20 mA.
, And the temperature of the light emitting diode 9 after 15 minutes of lighting and the light output of the lighting device were examined.

For comparison, as shown in FIG. 7, a light emitting unit having a light emitting diode 9 mounted on a front surface portion 25a on the reflection surface side and a tapered side surface portion 25b of a flexible substrate 25 having a reflection surface. 26 is disposed so as to be located substantially at the center of the case 1 and a reflection surface is formed on the inner surface of the main body 4 of the case 1 according to the first embodiment of the present invention. For lighting devices that have the same configuration as a certain lighting device (hereinafter referred to as “comparative products”),
The lighting was performed under the same conditions as the product A of the present invention, and the temperature of the light emitting diode 9 after 15 minutes of lighting and the light output of the lighting device were examined.

FIG. 8 shows the light emitting section 26 used for the comparative product.
FIG.

The light emitting diode 9 includes the product A of the present invention.
In each of the comparative examples, 120 InGaN-based white light-emitting diodes (NSSW440, manufactured by Nichia Corporation) were used. The measured temperature of the light emitting diode is 120
Is the average value of

As a result, in the product A of the present invention, the temperature of the light emitting diode 9 was 45 ° C. after lighting for 15 minutes. On the other hand, in the comparative product, the light emitting diode 9 after lighting for 15 minutes has elapsed.
Was 100 ° C. Thus, the product A of the present invention 1
The temperature of the light-emitting diode 9 after 5 minutes of lighting is 1 compared to the temperature of the light-emitting diode 9 of the comparative product after 15 minutes of lighting.
/ 2 or less. This is because, in the case of the product A of the present invention, the light emitting unit 2 is disposed in the case 1 with the surface of the flexible substrate 8 on which the light emitting diode 9 is not mounted and the inner surface of the main body unit 4 facing each other. The surface area of the flexible substrate 8 on which the light emitting diode 9 can be mounted can be made larger than the surface area of the flexible substrate 25 on which the light emitting diode 9 can be mounted in the case of the comparative product. The mounting density of the light emitting diodes 9 is smaller than the mounting density of the light emitting diodes 9 on the substrate 25 in the case of the comparative product, the heat radiation of the heat generated by each light emitting diode 9 itself is increased, and the adjacent light emitting diodes 9 are generated. This is probably due to the fact that it was hardly affected by heat.

The light emitting diode 9 used in this experiment was
Are 15 lm / W when the temperature of the light emitting diode 9 is 45 ° C. and 12 lm / W when the temperature of the light emitting diode 9 is 100 ° C. Therefore, in the product A of the present invention, it was confirmed that a decrease in the luminous efficiency of the light emitting diode 9 can be suppressed.

In the product A of the present invention, the light output of the lighting device was 100 lm. On the other hand, in the comparative product, the light output of the lighting device was 80 lm.

As described above, according to the configuration of the illuminating device according to the first embodiment of the present invention, since the flexible substrate 8 is used as the substrate on which the light emitting diodes 9 are mounted, a flat The light emitting diode 9 is mounted on one surface of the flexible substrate 8 in a shape, and then the flexible substrate 8 is deformed, so that the light emitting diode 9 can be easily arranged three-dimensionally, thereby facilitating the automation of manufacturing. And production efficiency can be improved. In addition, since the light emitting unit 2 is disposed in the case 1 with the other surface of the flexible substrate 8 on which the light emitting diode 9 is not mounted and the inner surface of the main body unit 4 facing each other, the external dimensions of the lighting device are reduced. The light emitting diode 9 remains substantially the same as the external dimensions of the lighting device of FIG.
When the number of light emitting diodes 9 used is the same as the number of light emitting diodes of the conventional lighting device, the mounting density of the light emitting diodes 9 on the substrate 8 can be increased. Since the size of the light emitting diode can be reduced, a rise in temperature of the light emitting diode can be suppressed, and a decrease in luminous efficiency of the light emitting diode can be suppressed. As a result, the light output of the lighting device can be further increased.

In particular, since a plurality of light emitting diodes 9 are mounted on the reflecting surface of the flexible substrate 8 having a reflecting surface, of the light emitted from the light emitting diodes 9, light not directly emitted to the outside of the case 1. Can be reflected by the reflecting surface and radiated to the outside of the case 1, and the light output of the lighting device can be further increased.

In the first embodiment, the case where the flexible substrate 8 having the circular bottom portion 10 is used in a state where the flexible substrate is expanded in a plane has been described. Even when used, the same effects as above can be obtained.

Next, as shown in FIG. 4, the lighting device according to the second embodiment of the present invention has a configuration in which the flexible substrate 14 of the light emitting section 13 is developed in a plane, and
Is 15 m in diameter arranged at the end of the main body 4 on the side of the base 5.
25m length extending radially from the m-shaped bottom part 16
It has the same configuration as the lighting device according to the first embodiment of the present invention except that it has a plurality of extending portions 17 having a width of 15 mm and a width of 15 mm.

When such a light emitting portion 13 is incorporated in the case 1, first, the bottom portion 16 of the flexible substrate 14 is held by a holder (not shown), and the flat flexible substrate 14 is not deformed in advance. It is put into the case 1 as it is and fixed to the end of the main body 4 on the side of the base 5. Since the side portion 15 of the flexible substrate 14 is formed of the extending portion 17 radially extending from the bottom portion 16, when the light emitting portion 13 is put in the case 1, the side portion 15 naturally deforms along the inner surface shape of the main body 4. Therefore, after fixing the bottom part 16, it is fixed to the inner surface of the main body part 4 in the deformed state.

In the flexible board 14 having such a shape, although not shown, in the state where the flexible board 14 is provided on the inner surface of the main body 4, the long sides of the adjacent extension portions 17 do not overlap with each other. The inside of 4 is exposed. Therefore, the main body 4
In order to efficiently radiate the light emitted from the light emitting diode 9 to the outside of the case 1, it is preferable to form a reflective surface painted with white paint or metallic paint on the inner surface of the case 1.

As described above, according to the configuration of the lighting apparatus according to the second embodiment of the present invention, in addition to the function and effect of the lighting apparatus according to the first embodiment of the present invention, the light emitting unit 13
It is not necessary to deform the flexible board 14 into a three-dimensional shape in advance when the flexible board 14 is incorporated in the case 1, and the flexible board 14 can be directly deformed and incorporated into the case 1 in a flat state. The workability of assembling with the part 13 can be improved, and the production efficiency can be further improved.

Next, as shown in FIG. 5, a lighting device according to a third embodiment of the present invention has a tapered case 18 having a total length of 25 mm and a maximum outer diameter of 50 mm, and is disposed in the case 18. And a light emitting unit 19.

The case 18 is provided with a main body 21 having a front opening 20 having an opening diameter of 45 mm, and a maximum outer portion provided at the other end of the main body 21 and having a GU 5.3 type base pin 5a for 12V. And a cylindrical base 22 having a diameter of 20 mm.

A light-transmitting front cover 6 made of glass or resin is attached to the front opening 20 by a fastener (not shown).

On the inner surface of the main body 21, for example, a reflecting surface painted with white paint or metallic paint is formed in order to reflect light radiated from the light emitting diode 9 described later and radiate it efficiently to the outside of the case 18. I have. In addition, a step 23 is formed in a spiral shape on the inner surface of the main body 21.

The light emitting section 19 has a spiral flexible substrate 24 made of polyimide and a plurality of light emitting diodes 9 mounted on one surface of the flexible substrate 24 at equal intervals.

FIG. 6 shows a perspective view of the light emitting section 19.

The flexible substrate 24 faces the other surface on which the light-emitting diode 9 is not mounted and the inner surface of the main body, and the optical axes of the light-emitting diode 9 (FIG. 5).
The middle and the arrow A pass through the front opening 20 of the case 1 without overlapping each other, and the direction of the optical axis of the light emitting diode 9 and the center axis of the case 18 (indicated by the symbol X in FIG. 5).
Steps 2 on the inner surface of the main body 4 so that
3 is provided by being fixed with an adhesive (not shown) or the like.

The flexible substrate 24 is a multilayer substrate including a metal layer made of, for example, copper or the like or a graphite layer in order to obtain thermal conductivity.

The drive circuit 12 for driving the light emitting diode 9 is mounted on the surface of the flexible substrate 24 opposite to the reflection surface, and is disposed in the base 22 of the case 18.

Next, the lamp characteristics of the lighting device according to the third embodiment of the present invention (hereinafter referred to as the product B of the present invention) were examined.

First, 10 products B of the present invention were manufactured, and each manufactured lighting device was subjected to a DC voltage of 12 V and a DC current of 20 mA.
, And the temperature of the light emitting diode 9 after 15 minutes of lighting and the light output of the lighting device were examined.

The light emitting diode 9 has InGaN
White light emitting diode (Nichia Corporation: NS)
SW440) were used. The measured value of the temperature of the light emitting diode is an average value of 120 light emitting diodes.

As a result, in the product B of the present invention, the temperature of the light-emitting diode after lighting for 15 minutes was 45 ° C., and the light output of the lighting device was 120 lm.

As described above, according to the configuration of the lighting device according to the third embodiment of the present invention, in addition to the functions and effects of the lighting device according to the first embodiment of the present invention, the flexible substrate 24 The inner surfaces of the main body 21 are so arranged that the optical axes of the light emitting diodes 9 pass through the front opening 20 without overlapping each other, and that the direction of the optical axis of the light emitting diodes 9 and the direction of the central axis of the case 18 substantially match. Since the light is radiated from the light emitting diode 9 to the outside of the case 18, the light is radiated to the outside of the case 18 more efficiently because it is provided in the formed step 23.

The lighting device of the present invention can be applied to indoor and outdoor general lighting, vehicles, signal lights, and the like.

[0057]

As described above, according to the present invention, it is possible to automate the three-dimensional arrangement of the light emitting diodes in the manufacturing process, thereby improving the production efficiency, and improving the temperature of the light emitting diodes. It is an object of the present invention to provide an illuminating device capable of suppressing a decrease in luminous efficiency due to an increase, and obtaining a higher light output.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view of a lighting device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the lighting device.

FIG. 3 is an exploded plan view of a flexible substrate similarly used in a light emitting unit of the lighting device.

FIG. 4 is an exploded plan view of a flexible substrate used in a light emitting unit of a lighting device according to a second embodiment of the present invention.

FIG. 5 is a partially cutaway front view of a lighting device according to a third embodiment of the present invention.

FIG. 6 is a perspective view of a light emitting unit of the lighting device.

FIG. 7 is a partially cutaway front view of a lighting device as a comparative product.

FIG. 8 is a perspective view of a light emitting unit of the lighting device.

[Explanation of symbols]

 1,18 Case 2,13,19 Light-Emitting Portion 3,20 Front Opening 4,21 Main Body 5,22 Cap 5a Cap Pin 6 Translucent Front Cover 7 Recess 8,14,24,25 Flexible Board 9 Light-Emitting Diode 10, 16 bottom portion 11, 15 side portion 12 drive circuit 17 extension portion 23 step portion

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masanori Shimizu 1-1, Yukicho, Takatsuki-shi, Osaka, Japan Matsushita Electronics Corporation (72) Inventor Nobuyuki Matsui 1-1, Yukicho, Takatsuki-shi, Osaka, Matsushita Electronics Inside the corporation

Claims (8)

[Claims] 1. A lighting device in which a light-emitting unit is disposed in a case having a main body having a front opening, wherein the light-emitting unit includes a flexible substrate and a plurality of light-emitting units mounted on one surface of the flexible substrate. A light-emitting diode, wherein the other surface of the flexible substrate on which the light-emitting diode is not mounted and the inner surface of the main body face each other and are arranged in the case. . 2. The lighting device according to claim 1, wherein the surface of the flexible substrate on which the light emitting diodes are mounted is a reflective surface. 3. The flexible substrate includes a bottom surface having a circular or polygonal shape and a side surface having a plurality of extending portions radially extending from the bottom surface in a state where the flexible substrate is developed on a plane. Claim 1 or Claim 2
The lighting device according to the above. 4. A stepped portion is formed on an inner surface of the main body, and the flexible substrate passes through the front opening without the optical axes of the light emitting diodes overlapping each other, and the flexible substrate has a stepped portion. The lighting device according to claim 1, wherein the lighting device is provided on the step portion such that a direction of an optical axis and a direction of a center axis of the case substantially match. 5. The lighting device according to claim 1, wherein the case and the flexible substrate both have thermal conductivity and are thermally connected. . 6. The lighting device according to claim 5, wherein the flexible substrate is a multilayer substrate including a metal layer or a graphite layer. 7. The lighting device according to claim 5, wherein a concave portion or a convex portion is formed on an outer surface of the case. 8. The lighting device according to claim 1, wherein a driving circuit of the light emitting diode is mounted on the flexible substrate.