WO2014010072A1 - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
WO2014010072A1
WO2014010072A1 PCT/JP2012/067890 JP2012067890W WO2014010072A1 WO 2014010072 A1 WO2014010072 A1 WO 2014010072A1 JP 2012067890 W JP2012067890 W JP 2012067890W WO 2014010072 A1 WO2014010072 A1 WO 2014010072A1
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WO
WIPO (PCT)
Prior art keywords
flexible substrate
transparent flexible
light
housing
lighting device
Prior art date
Application number
PCT/JP2012/067890
Other languages
French (fr)
Japanese (ja)
Inventor
泰弘 山下
篤規 平野
修 岡村
純一 高砂
悠也 佐々木
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2012/067890 priority Critical patent/WO2014010072A1/en
Priority to JP2014524564A priority patent/JP5956577B2/en
Publication of WO2014010072A1 publication Critical patent/WO2014010072A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

  • the technology disclosed herein relates to a lighting device.
  • Japanese Patent Laid-Open No. 2002-184209 discloses an illumination device.
  • This illuminating device has a housing, a flexible substrate disposed on the surface of the housing, and a plurality of light-emitting diodes mounted flexibly.
  • the surface of the flexible substrate on which the light emitting diode is mounted is painted in white or metallic color, and serves as a reflective surface that reflects the light of the light emitting diode.
  • the white or metallic paint When the white or metallic paint is applied to the flexible substrate, the light emitted from the light emitting diode is prevented from being absorbed by the flexible substrate. Therefore, the illuminance of the lighting device can be improved.
  • a plurality of terminals connected to the light emitting diodes are provided on the front surface of the flexible substrate. If paint adheres to these terminals, poor connection with the light emitting diodes occurs. Therefore, in the conventional configuration, it is necessary to perform a fine painting operation while avoiding these terminals.
  • a transparent flexible substrate is adopted as the flexible substrate on which the light source is mounted.
  • the transparent flexible substrate it is possible to dispose a reflective layer between the housing and the transparent flexible substrate. That is, it is not necessary to form a reflective layer on the front surface of the flexible substrate, that is, the surface on which the light emitting diode is mounted. Therefore, the lighting device can be easily manufactured.
  • the lighting device is positioned between the casing, the transparent flexible substrate disposed on the surface of the casing, at least one light source mounted on the transparent flexible substrate, and the casing and the transparent flexible substrate.
  • a reflective layer According to this configuration, light incident on the transparent flexible substrate passes through the transparent flexible substrate and is reflected by the reflective layer. The reflected light passes through the transparent flexible substrate again and is irradiated toward the illumination target. Since light absorption by the flexible substrate or the housing is prevented, the illuminance of the lighting device can be improved.
  • FIG. 3 is a schematic diagram illustrating the lighting device 10 according to the first embodiment.
  • 1 is a block diagram illustrating a circuit structure of a lighting device 10 according to a first embodiment.
  • FIG. 2 is a schematic diagram illustrating a cross section of the illumination device 10 according to the first embodiment.
  • FIG. 6 is a schematic diagram illustrating a lighting device 110 according to a second embodiment.
  • the transparent flexible substrate may have a transmittance of 80% or more, more preferably 90% or more with respect to light in a visible light region emitted from at least a light source.
  • the reflective layer may be a coating film made of a white, light or metallic paint.
  • the reflective layer may be a plated layer made of a metal material.
  • These coating films or plating layers may be provided on the back surface of the transparent flexible substrate, or may be provided on the surface of the casing on which the transparent flexible substrate is disposed.
  • the reflective layer is preferably a film formed on the surface of the casing. This is because the surface of the housing having a certain strength is easier to form the reflective layer than the back surface of the flexible transparent flexible substrate.
  • the surface itself can be made a reflective surface by making the housing material white, light or metallic.
  • the surface layer portion of the casing is regarded as a reflective layer positioned between the casing and the transparent flexible substrate.
  • the reflective layer may be a sheet member disposed between the housing and the transparent flexible substrate.
  • the sheet member is preferably white, light or metallic.
  • the material of the sheet member may be any of a paper material, a resin material, a rubber material, and a metal material, for example, and is not particularly limited.
  • the housing has an inner surface having an opening and a rotationally symmetric shape with respect to the central axis of the opening.
  • the transparent flexible substrate is preferably disposed on the inner surface of the housing. According to this configuration, most of the light emitted from the light source can be emitted from the opening toward the illumination target.
  • the configuration and shape of the housing are not particularly limited.
  • the housing may be curved plate, flat plate or other shape.
  • the light source is preferably a light emitting diode.
  • a light emitting diode is employed as the light source, the power consumption of the lighting device can be significantly reduced.
  • the color of the light emitting diode is not particularly limited, and may be, for example, red, blue, green, or white.
  • the lighting device 10 of the first embodiment will be described.
  • the illuminating device 10 of a present Example is an example, it is used for industrial apparatuses, such as a mounting machine which mounts an electronic component on a circuit board.
  • industrial apparatuses such as a mounting machine which mounts an electronic component on a circuit board.
  • an electronic component sucked by a suction nozzle is photographed by a camera, and it is inspected whether or not the electronic component is correctly held with respect to the suction nozzle.
  • the illuminating device 10 of this embodiment is equipped to illuminate the nozzles and electronic components that are the subject of photographing.
  • the illuminating device 10 of a present Example is not restricted to industrial equipment, It can employ
  • the lighting device 10 includes a housing 12 and a base portion 20 that supports the housing 12.
  • the base portion 20 is provided with a plurality of pairs of power input terminals 22 and 24.
  • the housing 12 is a hollow member having an opening 12b.
  • the opening 12 b is located on the side opposite to the base portion 20.
  • the inner surface 12a of the housing 12 has a rotationally symmetric shape with respect to the central axis of the opening 12b.
  • the inner surface 12a of the housing 12 is curved inward along the base portion 20 from the opening 12b.
  • the inner surface 12a of the housing 12 has a generally mortar shape.
  • the casing 12 of the present embodiment is made of a resin material.
  • the housing 12 is not limited to a resin material, and can be formed of a metal or other material.
  • the housing 12 of a present Example is an example, it is comprised by eight segments arrange
  • the lighting device 10 has a plurality of transparent flexible substrates 16.
  • the plurality of transparent flexible substrates 16 are respectively disposed on the inner surface 12 a of each segment of the housing 12.
  • the transparent flexible substrate 16 can be formed of, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or other transparent resin materials.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the transparent flexible substrate 16 of the present embodiment is substantially colorless and transparent, and has a transmittance of 90% or more with respect to light in the visible light range.
  • a plurality of light emitting diodes 18 which are light sources of the lighting device 10 are mounted on the transparent flexible substrate 16.
  • the plurality of light emitting diodes 18 are arranged at equal intervals along the transparent flexible substrate 16.
  • the light source of the illuminating device 10 is not limited to a light emitting diode, and may be another light emitter.
  • the color of light emitted from the light source is not particularly limited.
  • the transparent flexible substrate 16 described above may have a transmittance of 80% or more, preferably 90% or more, with respect to light in the visible light range emitted from the light source of the lighting device 10.
  • FIG. 2 is a block diagram showing a circuit configuration of the lighting device 10.
  • each transparent flexible substrate 16 is provided with a printed wiring 26 and a plurality of terminals 28.
  • Each terminal 28 is provided on the printed wiring 26 and is electrically connected to a corresponding one light emitting diode 18.
  • the printed wiring 26 connects the plurality of light emitting diodes 18 in series and electrically connects the plurality of light emitting diodes 18 to the pair of power input terminals 22 and 24.
  • the printed wiring 26 and the terminal 28 can be formed of, for example, copper or other conductive material.
  • the printed wiring 26 and the terminal 28 may be formed of a transparent conductive material such as indium tin oxide (ITO).
  • ITO indium tin oxide
  • the printed wiring 26 may connect a plurality of light emitting diodes 18 in parallel.
  • FIG. 3 is a cross-sectional view showing a laminated structure of the housing 12 and the transparent flexible substrate 16.
  • the transparent flexible substrate 16 has a front side surface 16 a on which a plurality of light emitting diodes 18 are mounted, and a back side surface 16 b facing the inner surface 12 a of the housing 12.
  • the printed wiring 26 and the terminal 28 described above are provided on the front surface 16 a of the transparent flexible substrate 16.
  • a reflective layer 14 is provided between the housing 12 and the transparent flexible substrate 16.
  • the reflective layer 14 reflects light that has passed through the transparent flexible substrate 16.
  • the reflective layer 14 of the present embodiment is a white or metallic paint film, and is formed on the inner surface 12 a of the housing 12.
  • the reflective layer 14 is not particularly limited as long as it can reflect light, and its configuration and material are not particularly limited.
  • the light from the light emitting diode 18 and the light reflected by the illumination target enter the transparent flexible substrate 16 (see arrow X in FIG. 3).
  • Incident light X on the transparent flexible substrate 16 passes through the transparent flexible substrate 16 and is reflected by the reflective layer 14 (see arrow Y in FIG. 3).
  • the reflected light Y passes through the transparent flexible substrate 16 again and is irradiated to the illumination target.
  • the lighting device 10 can illuminate the illumination target more strongly.
  • a transparent flexible substrate 16 is employed, and a reflective layer 14 is disposed between the housing 12 and the transparent flexible substrate 16.
  • the reflective layer 14 can be formed on the inner surface 12 a of the housing 12 and the back surface 16 b of the transparent flexible substrate 16.
  • the printed wiring 26 and the plurality of terminals 28 are formed on the front surface 16 a of the transparent flexible substrate 16. Since it is not necessary to form the reflective layer 14 on such a front surface 16a, the lighting device 10 can be easily manufactured.
  • the reflective layer 14 of this example is a white or metallic paint film
  • the reflective layer 14 may be a paint film of another color that can reflect light.
  • the color of the reflective layer 14 may be selected according to the color of light emitted from the light emitting diode 18. For example, when the light emitting diode 18 emits red light, the reflective layer 14 may be red.
  • the reflective layer 14 is not limited to a coating film, and may be a metal foil or other sheet material interposed between the housing 12 and the transparent flexible substrate 16.
  • the illuminating device 110 of Example 2 is demonstrated.
  • the lighting device 110 includes a housing 112, a transparent flexible substrate 116 disposed on the surface of the housing 112, and a plurality of light emitting diodes 118 mounted on the transparent flexible substrate 116, as in the first embodiment.
  • a reflective layer 114 that is located between the surface of the housing 112 and the transparent flexible substrate 116 and reflects light transmitted through the transparent flexible substrate 116.
  • printed wiring (not shown) for electrically connecting each light emitting diode 118 to the pair of power input terminals 122 and 124 is formed.
  • the housing 112 has a flat plate shape, which is different from the lighting device 10 of the first embodiment in this respect. About another structure, it is the same as that of the illuminating device 10 of Example 1.
  • FIG. The shapes of the housings 12 and 112 can be variously changed according to the purpose and object of illumination.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

This illumination device is provided with a frame, a transparent flexible substrate arranged on the surface of the frame, at least one light source mounted on the transparent flexible substrate, and a reflection layer positioned between the frame and the transparent flexible substrate. In this configuration, light incident on the transparent flexible substrate passes through the transparent flexible substrate and is reflected by the reflection layer. The reflected light passes again through the transparent flexible substrate and is irradiated at an object to be illuminated. Because absorption of light by the flexible substrate and frame is prevented, this illumination device has a high illuminance.

Description

照明装置Lighting device
 ここで開示する技術は、照明装置に関する。 The technology disclosed herein relates to a lighting device.
 特開2002-184209号公報に、照明装置が記載されている。この照明装置は、筺体と、筺体の表面に配置されたフレキシブル基板と、前記フレキシブルに実装された複数の発光ダイオードを有する。フレキシブル基板の発光ダイオードが実装された表面は、白色又はメタリック色で塗装されており、発光ダイオードの光を反射する反射面となっている。 Japanese Patent Laid-Open No. 2002-184209 discloses an illumination device. This illuminating device has a housing, a flexible substrate disposed on the surface of the housing, and a plurality of light-emitting diodes mounted flexibly. The surface of the flexible substrate on which the light emitting diode is mounted is painted in white or metallic color, and serves as a reflective surface that reflects the light of the light emitting diode.
 フレキシブル基板に白色又はメタリック色の塗装を施すと、発光ダイオードの発した光がフレキシブル基板によって吸収されることが防止される。従って、照明装置の照度を向上することができる。しかしながら、このような構成では、フレキシブル基板の発光ダイオードが実装される表面(以下、単に表側表面ということがある)に、塗装膜を形成しなければならない。フレキシブル基板の表側表面には、発光ダイオードに接続される複数の端子が設けられている。それらの端子に塗料が付着すれば、発光ダイオードとの間で接続不良が生じてしまう。そのことから、従来の構成では、これらの端子を避けながら、細かい塗装作業を行わなければならない。 When the white or metallic paint is applied to the flexible substrate, the light emitted from the light emitting diode is prevented from being absorbed by the flexible substrate. Therefore, the illuminance of the lighting device can be improved. However, in such a configuration, it is necessary to form a coating film on the surface of the flexible substrate on which the light emitting diode is mounted (hereinafter simply referred to as the front surface). A plurality of terminals connected to the light emitting diodes are provided on the front surface of the flexible substrate. If paint adheres to these terminals, poor connection with the light emitting diodes occurs. Therefore, in the conventional configuration, it is necessary to perform a fine painting operation while avoiding these terminals.
 上記の問題を考慮し、ここでは、製造の簡単な構成で照明装置の照度を向上する技術を開示する。 Considering the above problems, here, a technique for improving the illuminance of the lighting device with a simple configuration of manufacture is disclosed.
 本技術では、光源を実装するフレキシブル基板に、透明フレキシブル基板を採用する。透明フレキシブル基板を採用することで、筺体と透明フレキシブル基板との間に反射層を配置することが可能となる。即ち、フレキシブル基板の表側表面、即ち、発光ダイオードが実装される表面に、反射層を形成する必要がない。従って、この照明装置の製造は容易に行うことができる。 In this technology, a transparent flexible substrate is adopted as the flexible substrate on which the light source is mounted. By adopting the transparent flexible substrate, it is possible to dispose a reflective layer between the housing and the transparent flexible substrate. That is, it is not necessary to form a reflective layer on the front surface of the flexible substrate, that is, the surface on which the light emitting diode is mounted. Therefore, the lighting device can be easily manufactured.
 本技術の一実施形態では、照明装置が、筺体と、筺体の表面に配置された透明フレキシブル基板と、透明フレキシブル基板に実装された少なくとも一つの光源と、筺体と透明フレキシブル基板との間に位置する反射層を有する。この構成によると、透明フレキシブル基板に入射する光は、透明フレキシブル基板を透過し、反射層によって反射される。反射光は、透明フレキシブル基板を再び透過し、照明対象に向けて照射される。フレキシブル基板や筺体による光の吸収が防止されるので、照明装置の照度を向上することができる。 In one embodiment of the present technology, the lighting device is positioned between the casing, the transparent flexible substrate disposed on the surface of the casing, at least one light source mounted on the transparent flexible substrate, and the casing and the transparent flexible substrate. A reflective layer. According to this configuration, light incident on the transparent flexible substrate passes through the transparent flexible substrate and is reflected by the reflective layer. The reflected light passes through the transparent flexible substrate again and is irradiated toward the illumination target. Since light absorption by the flexible substrate or the housing is prevented, the illuminance of the lighting device can be improved.
実施例1の照明装置10を示す模式図。FIG. 3 is a schematic diagram illustrating the lighting device 10 according to the first embodiment. 実施例1の照明装置10の回路構造を示すブロック図。1 is a block diagram illustrating a circuit structure of a lighting device 10 according to a first embodiment. 実施例1の照明装置10の断面を示す模式図。FIG. 2 is a schematic diagram illustrating a cross section of the illumination device 10 according to the first embodiment. 実施例2の照明装置110を示す模式図。FIG. 6 is a schematic diagram illustrating a lighting device 110 according to a second embodiment.
 本技術の一実施形態では、透明フレキシブル基板が、少なくとも光源が発する可視光域の光に対して、80パーセント以上、より好ましくは90パーセント以上の透過率を有するとよい。 In one embodiment of the present technology, the transparent flexible substrate may have a transmittance of 80% or more, more preferably 90% or more with respect to light in a visible light region emitted from at least a light source.
 本技術の一実施形態では、反射層が、白色、淡色又はメタリック色の塗料による塗装膜とすることができる。ただし、反射層は、金属材料によるメッキ層であってもよい。これらの塗装膜又はメッキ層は、透明フレキシブル基板の裏側表面に設けてもよいし、透明フレキシブル基板が配置された筺体の表面に設けてもよい。 In one embodiment of the present technology, the reflective layer may be a coating film made of a white, light or metallic paint. However, the reflective layer may be a plated layer made of a metal material. These coating films or plating layers may be provided on the back surface of the transparent flexible substrate, or may be provided on the surface of the casing on which the transparent flexible substrate is disposed.
 本技術の一実施形態では、反射層が、筺体の表面に形成された被膜であることが好ましい。柔軟な透明フレキシブル基板の裏側表面よりも、一定の強度を有する筺体の表面の方が、反射層を形成しやすいからである。あるいは、筺体の材質を白色、淡色又はメタリック色のものにするなどして、表面自体を反射面とすることもできる。この場合は、筺体の表層部が、筺体と透明フレキシブル基板との間に位置する反射層とみなされる。 In one embodiment of the present technology, the reflective layer is preferably a film formed on the surface of the casing. This is because the surface of the housing having a certain strength is easier to form the reflective layer than the back surface of the flexible transparent flexible substrate. Alternatively, the surface itself can be made a reflective surface by making the housing material white, light or metallic. In this case, the surface layer portion of the casing is regarded as a reflective layer positioned between the casing and the transparent flexible substrate.
 本技術の一実施形態では、反射層が、筺体と透明フレキシブル基板の間に配置されたシート部材であってもよい。この場合、シート部材は、白色、淡色又はメタリック色であることが好ましい。シート部材の材料は、例えば紙材料、樹脂材料、ゴム材料、金属材料のいずれであってもよく、特に限定されない。 In one embodiment of the present technology, the reflective layer may be a sheet member disposed between the housing and the transparent flexible substrate. In this case, the sheet member is preferably white, light or metallic. The material of the sheet member may be any of a paper material, a resin material, a rubber material, and a metal material, for example, and is not particularly limited.
 本技術の一実施形態では、筺体が、開口部を有するとともに、開口部の中心軸に対して回転対称の形状を有する内側表面を有することが好ましい。この場合、透明フレキシブル基板は、その筺体の内側表面に配置されていることが好ましい。この構成によると、光源の発する光の多くを、開口部から照明対象に向けて照射することができる。ただし、筺体の構成や形状は特に限定されない。筺体は、曲板状、平板状又はその他の形状であってもよい。 In one embodiment of the present technology, it is preferable that the housing has an inner surface having an opening and a rotationally symmetric shape with respect to the central axis of the opening. In this case, the transparent flexible substrate is preferably disposed on the inner surface of the housing. According to this configuration, most of the light emitted from the light source can be emitted from the opening toward the illumination target. However, the configuration and shape of the housing are not particularly limited. The housing may be curved plate, flat plate or other shape.
 本技術の一実施形態では、光源が、発光ダイオードであることが好ましい。光源として発光ダイオードを採用すると、照明装置の消費電力を有意に削減することができる。ここで、発光ダイオードの色は、特に限定されず、例えば赤色、青色、緑色、白色であってもよい。 In one embodiment of the present technology, the light source is preferably a light emitting diode. When a light emitting diode is employed as the light source, the power consumption of the lighting device can be significantly reduced. Here, the color of the light emitting diode is not particularly limited, and may be, for example, red, blue, green, or white.
 図面を参照して、実施例1の照明装置10について説明する。本実施例の照明装置10は、一例ではあるが、回路基板に電子部品を実装する実装機などの産業用機器に用いられる。例えば実装機では、吸着ノズルに吸着された電子部品をカメラによって撮影し、吸着ノズルに対して電子部品が正しく保持されているのか否かを検査している。本実施例の照明装置10は、その撮影対象であるノズル及び電子部品を照明するために装備されている。ただし、本実施例の照明装置10は、産業用機器に限られず、様々な装置において広く採用することができる。 Referring to the drawings, the lighting device 10 of the first embodiment will be described. Although the illuminating device 10 of a present Example is an example, it is used for industrial apparatuses, such as a mounting machine which mounts an electronic component on a circuit board. For example, in a mounting machine, an electronic component sucked by a suction nozzle is photographed by a camera, and it is inspected whether or not the electronic component is correctly held with respect to the suction nozzle. The illuminating device 10 of this embodiment is equipped to illuminate the nozzles and electronic components that are the subject of photographing. However, the illuminating device 10 of a present Example is not restricted to industrial equipment, It can employ | adopt widely in various apparatuses.
 図1に示すように、照明装置10は、筺体12と、筺体12を支持するベース部20を有している。ベース部20には、複数対の電力入力端子22、24が設けられている。筺体12は、開口部12bを有する中空部材である。開口部12bは、ベース部20とは反対側に位置している。筺体12の内側表面12aは、開口部12bの中心軸に対して回転対称の形状を有している。筺体12の内側表面12aは、開口部12bからベース部20に沿って、内側に向けて湾曲している。簡単に言えば、筺体12の内側表面12aは、概してすり鉢の形状を有している。本実施例の筺体12は、樹脂材料で形成されている。ただし、筺体12は、樹脂材料に限られず、金属やその他の材料で形成することもできる。なお、本実施例の筺体12は、一例ではあるが、周方向に配置された8つのセグメントによって構成されている。 As shown in FIG. 1, the lighting device 10 includes a housing 12 and a base portion 20 that supports the housing 12. The base portion 20 is provided with a plurality of pairs of power input terminals 22 and 24. The housing 12 is a hollow member having an opening 12b. The opening 12 b is located on the side opposite to the base portion 20. The inner surface 12a of the housing 12 has a rotationally symmetric shape with respect to the central axis of the opening 12b. The inner surface 12a of the housing 12 is curved inward along the base portion 20 from the opening 12b. In brief, the inner surface 12a of the housing 12 has a generally mortar shape. The casing 12 of the present embodiment is made of a resin material. However, the housing 12 is not limited to a resin material, and can be formed of a metal or other material. In addition, although the housing 12 of a present Example is an example, it is comprised by eight segments arrange | positioned in the circumferential direction.
 図1に示すように、照明装置10は、複数の透明フレキシブル基板16を有している。複数の透明フレキシブル基板16は、筺体12の各セグメントの内側表面12aにそれぞれ配置されている。透明フレキシブル基板16は、例えばポリエチレンテレプタラート(PET)、ポリエチレンナフタレート(PEN)、その他の透明な樹脂材料で形成することができる。本実施例の透明フレキシブル基板16は、実質的に無色透明であり、可視光域の光に対して90パーセント以上の透過率を有する。 As shown in FIG. 1, the lighting device 10 has a plurality of transparent flexible substrates 16. The plurality of transparent flexible substrates 16 are respectively disposed on the inner surface 12 a of each segment of the housing 12. The transparent flexible substrate 16 can be formed of, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or other transparent resin materials. The transparent flexible substrate 16 of the present embodiment is substantially colorless and transparent, and has a transmittance of 90% or more with respect to light in the visible light range.
 透明フレキシブル基板16には、照明装置10の光源である複数の発光ダイオード18が実装されている。複数の発光ダイオード18は、透明フレキシブル基板16に沿って等間隔で配列されている。なお、照明装置10の光源は発光ダイオードに限定されず、他の発光体であってもよい。また、光源が発する光の色も特に限定されない。但し、前記した透明フレキシブル基板16は、照明装置10の光源が発する可視光域の光に対して、80パーセント以上、好ましくは90パーセント以上の透過率を有するとよい。 A plurality of light emitting diodes 18 which are light sources of the lighting device 10 are mounted on the transparent flexible substrate 16. The plurality of light emitting diodes 18 are arranged at equal intervals along the transparent flexible substrate 16. In addition, the light source of the illuminating device 10 is not limited to a light emitting diode, and may be another light emitter. Further, the color of light emitted from the light source is not particularly limited. However, the transparent flexible substrate 16 described above may have a transmittance of 80% or more, preferably 90% or more, with respect to light in the visible light range emitted from the light source of the lighting device 10.
 図2は、照明装置10の回路構成を示すブロック図である。図2に示すように、各々の透明フレキシブル基板16には、プリント配線26と複数の端子28が設けられている。各々の端子28は、プリント配線26上に設けられているとともに、対応する一つの発光ダイオード18と電気的に接続されている。プリント配線26は、複数の発光ダイオード18を直列に接続するとともに、それらの複数の発光ダイオード18を一対の電力入力端子22、24へ電気的に接続している。プリント配線26及び端子28は、例えば、銅やその他の導電性材料で形成することができる。なお、プリント配線26及び端子28は、酸化インジウムスズ(ITO)といった透明な導電性材料で形成してもよい。また、プリント配線26は、複数の発光ダイオード18を並列に接続するものであってもよい。 FIG. 2 is a block diagram showing a circuit configuration of the lighting device 10. As shown in FIG. 2, each transparent flexible substrate 16 is provided with a printed wiring 26 and a plurality of terminals 28. Each terminal 28 is provided on the printed wiring 26 and is electrically connected to a corresponding one light emitting diode 18. The printed wiring 26 connects the plurality of light emitting diodes 18 in series and electrically connects the plurality of light emitting diodes 18 to the pair of power input terminals 22 and 24. The printed wiring 26 and the terminal 28 can be formed of, for example, copper or other conductive material. Note that the printed wiring 26 and the terminal 28 may be formed of a transparent conductive material such as indium tin oxide (ITO). The printed wiring 26 may connect a plurality of light emitting diodes 18 in parallel.
 図3は、筺体12と透明フレキシブル基板16との積層構造を示す断面図である。図3に示すように、透明フレキシブル基板16は、複数の発光ダイオード18が実装された表側表面16aと、筺体12の内側表面12aに対向する裏側表面16bを有する。前述したプリント配線26や端子28は、透明フレキシブル基板16の表側表面16aに設けられている。筺体12と透明フレキシブル基板16との間には、反射層14が設けられている。反射層14は、透明フレキシブル基板16を透過した光を反射する。本実施例の反射層14は、白色又はメタリック色の塗装膜であり、筺体12の内側表面12aに形成されている。ただし、反射層14は、光を反射できるものであればよく、その構成や材質については特に限定されない。 FIG. 3 is a cross-sectional view showing a laminated structure of the housing 12 and the transparent flexible substrate 16. As shown in FIG. 3, the transparent flexible substrate 16 has a front side surface 16 a on which a plurality of light emitting diodes 18 are mounted, and a back side surface 16 b facing the inner surface 12 a of the housing 12. The printed wiring 26 and the terminal 28 described above are provided on the front surface 16 a of the transparent flexible substrate 16. A reflective layer 14 is provided between the housing 12 and the transparent flexible substrate 16. The reflective layer 14 reflects light that has passed through the transparent flexible substrate 16. The reflective layer 14 of the present embodiment is a white or metallic paint film, and is formed on the inner surface 12 a of the housing 12. However, the reflective layer 14 is not particularly limited as long as it can reflect light, and its configuration and material are not particularly limited.
 図3に示すように、発光ダイオード18の光や、照明対象で反射された光は、透明フレキシブル基板16に入射する(図3中の矢印X参照)。透明フレキシブル基板16への入射光Xは、透明フレキシブル基板16を透過し、反射層14によって反射される(図3中の矢印Y参照)。この反射光Yは、透明フレキシブル基板16を再び透過し、照明対象に照射される。このように、発光ダイオード18の発した光の多くが照明対象に照射されることから、照明装置10は照明対象をより強く照明することができる。 As shown in FIG. 3, the light from the light emitting diode 18 and the light reflected by the illumination target enter the transparent flexible substrate 16 (see arrow X in FIG. 3). Incident light X on the transparent flexible substrate 16 passes through the transparent flexible substrate 16 and is reflected by the reflective layer 14 (see arrow Y in FIG. 3). The reflected light Y passes through the transparent flexible substrate 16 again and is irradiated to the illumination target. Thus, since most of the light emitted from the light emitting diode 18 is irradiated onto the illumination target, the lighting device 10 can illuminate the illumination target more strongly.
 本実施例の照明装置10では、透明フレキシブル基板16が採用され、筺体12と透明フレキシブル基板16との間に反射層14が配置されている。この構成によれば、反射層14を、筺体12の内側表面12aや、透明フレキシブル基板16の裏側表面16bに形成することができる。前述したように、透明フレキシブル基板16の表側表面16aには、プリント配線26や複数の端子28が形成されている。そのような表側表面16aに反射層14を形成する必要がないので、照明装置10の製造は容易に行うことができる。 In the lighting device 10 of the present embodiment, a transparent flexible substrate 16 is employed, and a reflective layer 14 is disposed between the housing 12 and the transparent flexible substrate 16. According to this configuration, the reflective layer 14 can be formed on the inner surface 12 a of the housing 12 and the back surface 16 b of the transparent flexible substrate 16. As described above, the printed wiring 26 and the plurality of terminals 28 are formed on the front surface 16 a of the transparent flexible substrate 16. Since it is not necessary to form the reflective layer 14 on such a front surface 16a, the lighting device 10 can be easily manufactured.
 本実施例の反射層14は、白色又はメタリック色の塗装膜であったが、反射層14は光を反射し得る他の色の塗装膜であってもよい。特に、反射層14の色は、発光ダイオード18の発する光の色に応じて選択するよい。例えば、発光ダイオード18が赤色光を発する場合、反射層14は赤色系であってもよい。また、反射層14は、塗装膜に限定されず、筺体12と透明フレキシブル基板16の間に介在させた金属箔その他のシート材であってもよい。 Although the reflective layer 14 of this example is a white or metallic paint film, the reflective layer 14 may be a paint film of another color that can reflect light. In particular, the color of the reflective layer 14 may be selected according to the color of light emitted from the light emitting diode 18. For example, when the light emitting diode 18 emits red light, the reflective layer 14 may be red. The reflective layer 14 is not limited to a coating film, and may be a metal foil or other sheet material interposed between the housing 12 and the transparent flexible substrate 16.
 図4を参照して、実施例2の照明装置110について説明する。図4に示すように、照明装置110は、実施例1と同様に、筺体112と、筺体112の表面に配置された透明フレキシブル基板116と、透明フレキシブル基板116に実装された複数の発光ダイオード118と、筺体112と透明フレキシブル基板116との面の間に位置し、透明フレキシブル基板116を透過した光を反射する反射層114を有している。透明フレキシブル基板116には、各々の発光ダイオード118を一対の電力入力端子122、124へ電気的に接続するプリント配線(図示省略)が形成されている。 With reference to FIG. 4, the illuminating device 110 of Example 2 is demonstrated. As illustrated in FIG. 4, the lighting device 110 includes a housing 112, a transparent flexible substrate 116 disposed on the surface of the housing 112, and a plurality of light emitting diodes 118 mounted on the transparent flexible substrate 116, as in the first embodiment. And a reflective layer 114 that is located between the surface of the housing 112 and the transparent flexible substrate 116 and reflects light transmitted through the transparent flexible substrate 116. On the transparent flexible substrate 116, printed wiring (not shown) for electrically connecting each light emitting diode 118 to the pair of power input terminals 122 and 124 is formed.
 本実施例では、筺体112が平板形状を有しており、この点において実施例1の照明装置10と異なっている。その他の構成については、実施例1の照明装置10と同様である。筺体12、112の形状は、照明する目的や対象に応じて、様々に変更することができる。 In this embodiment, the housing 112 has a flat plate shape, which is different from the lighting device 10 of the first embodiment in this respect. About another structure, it is the same as that of the illuminating device 10 of Example 1. FIG. The shapes of the housings 12 and 112 can be variously changed according to the purpose and object of illumination.
 以上、本発明の具体例を詳細に説明したが、これらは例示にすぎず、請求の範囲を限定するものではない。請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。 Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
 本明細書または図面に説明した技術要素は、単独であるいは各種の組み合わせによって技術的有用性を発揮するものであり、出願時の請求項に記載の組み合わせに限定されるものではない。また、本明細書または図面に例示した技術は複数目的を同時に達成するものであり、そのうちの一つの目的を達成すること自体で技術的有用性を持つものである。 The technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.
10、110:照明装置
12、112:筺体
14、114:反射層
16、116:透明フレキシブル基板
18、118:発光ダイオード
26:プリント配線
28:端子
DESCRIPTION OF SYMBOLS 10, 110: Illuminating device 12, 112: Housing 14, 114: Reflective layer 16, 116: Transparent flexible substrate 18, 118: Light emitting diode 26: Printed wiring 28: Terminal

Claims (5)

  1.  筺体と、
     前記筺体の表面に配置された透明フレキシブル基板と、
     前記透明フレキシブル基板に実装された少なくとも一つの光源と、
     前記筺体と前記透明フレキシブル基板との面の間に位置し、前記透明フレキシブル基板を透過した光を反射する反射層と、
     を備える照明装置。
    The body,
    A transparent flexible substrate disposed on the surface of the housing;
    At least one light source mounted on the transparent flexible substrate;
    A reflective layer that is located between the housing and the surface of the transparent flexible substrate and reflects light transmitted through the transparent flexible substrate;
    A lighting device comprising:
  2.  前記透明フレキシブル基板は、少なくとも前記光源が発する可視光域の光に対して、80パーセント以上の透過率を有することを特徴とする請求項1に記載の照明装置。 The lighting device according to claim 1, wherein the transparent flexible substrate has a transmittance of 80% or more for at least light in a visible light range emitted from the light source.
  3.  前記反射層は、前記筺体の表面に形成された被膜であることを特徴とする請求項1又は2に記載の照明装置。 The lighting device according to claim 1 or 2, wherein the reflective layer is a film formed on a surface of the casing.
  4.  前記筺体は、開口部を有するとともに、開口部の中心軸に対して回転対称の形状を有する内側表面を有し、
     前記透明フレキシブル基板は、前記筺体の内側表面に配置されていることを特徴とする請求項1から3のいずれか一項に記載の照明装置。
    The housing has an opening and an inner surface having a rotationally symmetric shape with respect to the central axis of the opening,
    The lighting device according to any one of claims 1 to 3, wherein the transparent flexible substrate is disposed on an inner surface of the casing.
  5.  前記光源は、発光ダイオードであることを特徴とする請求項1から4のいずれか一項に記載の照明装置。 The lighting device according to any one of claims 1 to 4, wherein the light source is a light emitting diode.
PCT/JP2012/067890 2012-07-13 2012-07-13 Illumination device WO2014010072A1 (en)

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