WO2014010072A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
WO2014010072A1
WO2014010072A1 PCT/JP2012/067890 JP2012067890W WO2014010072A1 WO 2014010072 A1 WO2014010072 A1 WO 2014010072A1 JP 2012067890 W JP2012067890 W JP 2012067890W WO 2014010072 A1 WO2014010072 A1 WO 2014010072A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
transparent flexible
light
housing
lighting device
Prior art date
Application number
PCT/JP2012/067890
Other languages
English (en)
Japanese (ja)
Inventor
泰弘 山下
篤規 平野
修 岡村
純一 高砂
悠也 佐々木
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2012/067890 priority Critical patent/WO2014010072A1/fr
Priority to JP2014524564A priority patent/JP5956577B2/ja
Publication of WO2014010072A1 publication Critical patent/WO2014010072A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

  • the technology disclosed herein relates to a lighting device.
  • Japanese Patent Laid-Open No. 2002-184209 discloses an illumination device.
  • This illuminating device has a housing, a flexible substrate disposed on the surface of the housing, and a plurality of light-emitting diodes mounted flexibly.
  • the surface of the flexible substrate on which the light emitting diode is mounted is painted in white or metallic color, and serves as a reflective surface that reflects the light of the light emitting diode.
  • the white or metallic paint When the white or metallic paint is applied to the flexible substrate, the light emitted from the light emitting diode is prevented from being absorbed by the flexible substrate. Therefore, the illuminance of the lighting device can be improved.
  • a plurality of terminals connected to the light emitting diodes are provided on the front surface of the flexible substrate. If paint adheres to these terminals, poor connection with the light emitting diodes occurs. Therefore, in the conventional configuration, it is necessary to perform a fine painting operation while avoiding these terminals.
  • a transparent flexible substrate is adopted as the flexible substrate on which the light source is mounted.
  • the transparent flexible substrate it is possible to dispose a reflective layer between the housing and the transparent flexible substrate. That is, it is not necessary to form a reflective layer on the front surface of the flexible substrate, that is, the surface on which the light emitting diode is mounted. Therefore, the lighting device can be easily manufactured.
  • the lighting device is positioned between the casing, the transparent flexible substrate disposed on the surface of the casing, at least one light source mounted on the transparent flexible substrate, and the casing and the transparent flexible substrate.
  • a reflective layer According to this configuration, light incident on the transparent flexible substrate passes through the transparent flexible substrate and is reflected by the reflective layer. The reflected light passes through the transparent flexible substrate again and is irradiated toward the illumination target. Since light absorption by the flexible substrate or the housing is prevented, the illuminance of the lighting device can be improved.
  • FIG. 3 is a schematic diagram illustrating the lighting device 10 according to the first embodiment.
  • 1 is a block diagram illustrating a circuit structure of a lighting device 10 according to a first embodiment.
  • FIG. 2 is a schematic diagram illustrating a cross section of the illumination device 10 according to the first embodiment.
  • FIG. 6 is a schematic diagram illustrating a lighting device 110 according to a second embodiment.
  • the transparent flexible substrate may have a transmittance of 80% or more, more preferably 90% or more with respect to light in a visible light region emitted from at least a light source.
  • the reflective layer may be a coating film made of a white, light or metallic paint.
  • the reflective layer may be a plated layer made of a metal material.
  • These coating films or plating layers may be provided on the back surface of the transparent flexible substrate, or may be provided on the surface of the casing on which the transparent flexible substrate is disposed.
  • the reflective layer is preferably a film formed on the surface of the casing. This is because the surface of the housing having a certain strength is easier to form the reflective layer than the back surface of the flexible transparent flexible substrate.
  • the surface itself can be made a reflective surface by making the housing material white, light or metallic.
  • the surface layer portion of the casing is regarded as a reflective layer positioned between the casing and the transparent flexible substrate.
  • the reflective layer may be a sheet member disposed between the housing and the transparent flexible substrate.
  • the sheet member is preferably white, light or metallic.
  • the material of the sheet member may be any of a paper material, a resin material, a rubber material, and a metal material, for example, and is not particularly limited.
  • the housing has an inner surface having an opening and a rotationally symmetric shape with respect to the central axis of the opening.
  • the transparent flexible substrate is preferably disposed on the inner surface of the housing. According to this configuration, most of the light emitted from the light source can be emitted from the opening toward the illumination target.
  • the configuration and shape of the housing are not particularly limited.
  • the housing may be curved plate, flat plate or other shape.
  • the light source is preferably a light emitting diode.
  • a light emitting diode is employed as the light source, the power consumption of the lighting device can be significantly reduced.
  • the color of the light emitting diode is not particularly limited, and may be, for example, red, blue, green, or white.
  • the lighting device 10 of the first embodiment will be described.
  • the illuminating device 10 of a present Example is an example, it is used for industrial apparatuses, such as a mounting machine which mounts an electronic component on a circuit board.
  • industrial apparatuses such as a mounting machine which mounts an electronic component on a circuit board.
  • an electronic component sucked by a suction nozzle is photographed by a camera, and it is inspected whether or not the electronic component is correctly held with respect to the suction nozzle.
  • the illuminating device 10 of this embodiment is equipped to illuminate the nozzles and electronic components that are the subject of photographing.
  • the illuminating device 10 of a present Example is not restricted to industrial equipment, It can employ
  • the lighting device 10 includes a housing 12 and a base portion 20 that supports the housing 12.
  • the base portion 20 is provided with a plurality of pairs of power input terminals 22 and 24.
  • the housing 12 is a hollow member having an opening 12b.
  • the opening 12 b is located on the side opposite to the base portion 20.
  • the inner surface 12a of the housing 12 has a rotationally symmetric shape with respect to the central axis of the opening 12b.
  • the inner surface 12a of the housing 12 is curved inward along the base portion 20 from the opening 12b.
  • the inner surface 12a of the housing 12 has a generally mortar shape.
  • the casing 12 of the present embodiment is made of a resin material.
  • the housing 12 is not limited to a resin material, and can be formed of a metal or other material.
  • the housing 12 of a present Example is an example, it is comprised by eight segments arrange
  • the lighting device 10 has a plurality of transparent flexible substrates 16.
  • the plurality of transparent flexible substrates 16 are respectively disposed on the inner surface 12 a of each segment of the housing 12.
  • the transparent flexible substrate 16 can be formed of, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or other transparent resin materials.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the transparent flexible substrate 16 of the present embodiment is substantially colorless and transparent, and has a transmittance of 90% or more with respect to light in the visible light range.
  • a plurality of light emitting diodes 18 which are light sources of the lighting device 10 are mounted on the transparent flexible substrate 16.
  • the plurality of light emitting diodes 18 are arranged at equal intervals along the transparent flexible substrate 16.
  • the light source of the illuminating device 10 is not limited to a light emitting diode, and may be another light emitter.
  • the color of light emitted from the light source is not particularly limited.
  • the transparent flexible substrate 16 described above may have a transmittance of 80% or more, preferably 90% or more, with respect to light in the visible light range emitted from the light source of the lighting device 10.
  • FIG. 2 is a block diagram showing a circuit configuration of the lighting device 10.
  • each transparent flexible substrate 16 is provided with a printed wiring 26 and a plurality of terminals 28.
  • Each terminal 28 is provided on the printed wiring 26 and is electrically connected to a corresponding one light emitting diode 18.
  • the printed wiring 26 connects the plurality of light emitting diodes 18 in series and electrically connects the plurality of light emitting diodes 18 to the pair of power input terminals 22 and 24.
  • the printed wiring 26 and the terminal 28 can be formed of, for example, copper or other conductive material.
  • the printed wiring 26 and the terminal 28 may be formed of a transparent conductive material such as indium tin oxide (ITO).
  • ITO indium tin oxide
  • the printed wiring 26 may connect a plurality of light emitting diodes 18 in parallel.
  • FIG. 3 is a cross-sectional view showing a laminated structure of the housing 12 and the transparent flexible substrate 16.
  • the transparent flexible substrate 16 has a front side surface 16 a on which a plurality of light emitting diodes 18 are mounted, and a back side surface 16 b facing the inner surface 12 a of the housing 12.
  • the printed wiring 26 and the terminal 28 described above are provided on the front surface 16 a of the transparent flexible substrate 16.
  • a reflective layer 14 is provided between the housing 12 and the transparent flexible substrate 16.
  • the reflective layer 14 reflects light that has passed through the transparent flexible substrate 16.
  • the reflective layer 14 of the present embodiment is a white or metallic paint film, and is formed on the inner surface 12 a of the housing 12.
  • the reflective layer 14 is not particularly limited as long as it can reflect light, and its configuration and material are not particularly limited.
  • the light from the light emitting diode 18 and the light reflected by the illumination target enter the transparent flexible substrate 16 (see arrow X in FIG. 3).
  • Incident light X on the transparent flexible substrate 16 passes through the transparent flexible substrate 16 and is reflected by the reflective layer 14 (see arrow Y in FIG. 3).
  • the reflected light Y passes through the transparent flexible substrate 16 again and is irradiated to the illumination target.
  • the lighting device 10 can illuminate the illumination target more strongly.
  • a transparent flexible substrate 16 is employed, and a reflective layer 14 is disposed between the housing 12 and the transparent flexible substrate 16.
  • the reflective layer 14 can be formed on the inner surface 12 a of the housing 12 and the back surface 16 b of the transparent flexible substrate 16.
  • the printed wiring 26 and the plurality of terminals 28 are formed on the front surface 16 a of the transparent flexible substrate 16. Since it is not necessary to form the reflective layer 14 on such a front surface 16a, the lighting device 10 can be easily manufactured.
  • the reflective layer 14 of this example is a white or metallic paint film
  • the reflective layer 14 may be a paint film of another color that can reflect light.
  • the color of the reflective layer 14 may be selected according to the color of light emitted from the light emitting diode 18. For example, when the light emitting diode 18 emits red light, the reflective layer 14 may be red.
  • the reflective layer 14 is not limited to a coating film, and may be a metal foil or other sheet material interposed between the housing 12 and the transparent flexible substrate 16.
  • the illuminating device 110 of Example 2 is demonstrated.
  • the lighting device 110 includes a housing 112, a transparent flexible substrate 116 disposed on the surface of the housing 112, and a plurality of light emitting diodes 118 mounted on the transparent flexible substrate 116, as in the first embodiment.
  • a reflective layer 114 that is located between the surface of the housing 112 and the transparent flexible substrate 116 and reflects light transmitted through the transparent flexible substrate 116.
  • printed wiring (not shown) for electrically connecting each light emitting diode 118 to the pair of power input terminals 122 and 124 is formed.
  • the housing 112 has a flat plate shape, which is different from the lighting device 10 of the first embodiment in this respect. About another structure, it is the same as that of the illuminating device 10 of Example 1.
  • FIG. The shapes of the housings 12 and 112 can be variously changed according to the purpose and object of illumination.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention a trait à un dispositif d'éclairage doté d'un bâti, d'un substrat souple transparent disposé sur la surface de ce bâti, d'au moins une source de lumière montée sur ledit substrat souple transparent, et d'une couche de réflexion placée entre le bâti et le substrat souple transparent. Dans cette configuration, la lumière qui frappe ledit substrat souple transparent le traverse et est réfléchie par la couche de réflexion. La lumière réfléchie traverse à nouveau le substrat souple transparent et atteint un objet à éclairer. Puisque ni le substrat souple ni le bâti n'absorbent la lumière, ce dispositif d'éclairage a un grand éclairement.
PCT/JP2012/067890 2012-07-13 2012-07-13 Dispositif d'éclairage WO2014010072A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2012/067890 WO2014010072A1 (fr) 2012-07-13 2012-07-13 Dispositif d'éclairage
JP2014524564A JP5956577B2 (ja) 2012-07-13 2012-07-13 照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/067890 WO2014010072A1 (fr) 2012-07-13 2012-07-13 Dispositif d'éclairage

Publications (1)

Publication Number Publication Date
WO2014010072A1 true WO2014010072A1 (fr) 2014-01-16

Family

ID=49915574

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/067890 WO2014010072A1 (fr) 2012-07-13 2012-07-13 Dispositif d'éclairage

Country Status (2)

Country Link
JP (1) JP5956577B2 (fr)
WO (1) WO2014010072A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015207556A (ja) * 2014-04-11 2015-11-19 株式会社半導体エネルギー研究所 発光装置
JP2019220300A (ja) * 2018-06-19 2019-12-26 三菱電機株式会社 照明具、照明装置、及び、照明具の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184209A (ja) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd 照明装置
JP2011091058A (ja) * 2011-01-25 2011-05-06 Semiconductor Energy Lab Co Ltd 照明器具
WO2011142097A1 (fr) * 2010-05-13 2011-11-17 パナソニック株式会社 Carte de montage, procédé de fabrication de celle-ci, module électroluminescent et dispositif d'éclairage
JP2012119585A (ja) * 2010-12-02 2012-06-21 Showa Denko Kk 発光ダイオード、発光ダイオードランプ及び照明装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006180855A (ja) * 2004-12-25 2006-07-13 N Bii T Kk 光を用いた移動式昆虫捕獲器
US7726865B2 (en) * 2005-08-12 2010-06-01 Sharp Kabushiki Kaisha Backlight unit and liquid crystal display device
JP5910042B2 (ja) * 2010-12-17 2016-04-27 ソニー株式会社 照明装置および表示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184209A (ja) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd 照明装置
WO2011142097A1 (fr) * 2010-05-13 2011-11-17 パナソニック株式会社 Carte de montage, procédé de fabrication de celle-ci, module électroluminescent et dispositif d'éclairage
JP2012119585A (ja) * 2010-12-02 2012-06-21 Showa Denko Kk 発光ダイオード、発光ダイオードランプ及び照明装置
JP2011091058A (ja) * 2011-01-25 2011-05-06 Semiconductor Energy Lab Co Ltd 照明器具

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015207556A (ja) * 2014-04-11 2015-11-19 株式会社半導体エネルギー研究所 発光装置
JP2019220300A (ja) * 2018-06-19 2019-12-26 三菱電機株式会社 照明具、照明装置、及び、照明具の製造方法
JP7236821B2 (ja) 2018-06-19 2023-03-10 三菱電機株式会社 照明具、照明装置、及び、照明具の製造方法

Also Published As

Publication number Publication date
JPWO2014010072A1 (ja) 2016-06-20
JP5956577B2 (ja) 2016-07-27

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