KR20220010780A - Pipeline type sewage disinfection system using semiconductor and the method using it - Google Patents

Abstract

The present invention relates to a pipe-type sewage disinfection system using a semiconductor, and more specifically, to a pipe-type sewage disinfection system using a semiconductor, which is an immersion-type sewage disinfection device, wherein E. coli is disinfected with UV rays irradiated by an LED PCB module equipped with a cooling control system as a pipe-type disinfection device in which compound semiconductors destroy E. coli DNA in a sewage treatment process, thereby maximizing performance, costs, and maintenance.

Description

Pipeline type sewage disinfection system using semiconductor and the method using it

The present invention relates to a tube-type sewage disinfection system using a semiconductor, and more particularly, a tube-type disinfection device in which a compound semiconductor destroys E. coli DNA in a sewage treatment process. An LED PCB module equipped with a cooling control system investigates It relates to a pipeline-type sewage disinfection system using a semiconductor, an immersion-type sewage disinfection device that maximizes performance, cost, and maintenance by sterilizing E. coli with UV ultraviolet rays.

As is well known, a light emitting diode (LED) is a device that emits light when a voltage is applied. The color of the emitted light creates a wavelength according to the combination of semiconductor chip elements, and the wavelength of this light is the color of the light. to decide

The above-described LED has advantages such as a long lifespan, eco-friendliness, and a fast response speed, and thus is used for lighting or mounted in an LCD backlight (Back Light).

The above-mentioned LED consumes only 1/5 of the power consumption compared to general incandescent bulbs, the response time is one million times faster, and the lifespan is semi-permanent. It is used in various fields ranging from various traffic safety signals and lighting equipment.

For example, Patent Application No. 10-2010-0004731 discloses a socket-type LED lighting fixture using the above-described LED.

Looking at the conventional general LED lighting fixture, a frame assembly, a disk-type heat sink attached to the lower end of the frame assembly, an LED substrate attached to the disk-type heat sink, a connection cap attached to the upper end of the frame assembly, and the connection A cap and a socket having a threaded portion for a socket formed on the other side while being fastened to the cap, wherein the frame assembly has a polygonal tubular shape as a whole, has a through hole inside and has heat dissipation fins formed inside and outside, and is detachable on the outside of the frame It includes an LED substrate that can be coupled to each other, wherein the disk-shaped heat sink and the LED substrate have vent holes and hollow holes at corresponding positions, respectively, the connection cap has a vent hole and a hollow hole, and the socket is a cap shape with an empty inside. It consists of having a vent hole at the top.

In addition, the prior Korean Patent Application Laid-Open No. 2018-0083780 discloses a reaction tank body having a conduit shape disposed horizontally with respect to the ground, an inlet portion disposed on one side in the longitudinal direction of the reaction tank body and through which a substance to be disinfected is introduced from the top to the bottom, a reaction tank disposed on the other side in the longitudinal direction of the reaction tank body and including a discharge part through which a material to be disinfected is discharged from the lower part to the upper part; a disinfection unit including a plurality of glass tubes arranged in the longitudinal direction inside the reaction vessel body, and an ultraviolet lamp provided inside the glass tube; a cleaning unit including a central axis fixed to both ends of the reaction vessel body and formed to be movable in the longitudinal direction, and a wiper ring connected to the central axis and formed to be in contact with the outer circumferential surface of the glass tube; and a baffle coupled to the inner circumferential surface of the reactor body in a radial direction to surround the disinfection unit and the washing unit, wherein a plurality of wiper rings are disposed in the longitudinal direction of the reactor body, and the baffle includes a plurality of wiper rings The wiper rings disposed one by one between the plurality of wiper rings and disposed at the outermost part of the inlet side of the plurality of wiper rings are disposed below the inlet part, and are disposed at a location spaced apart from the center of the reactor body at a predetermined interval from the center of the inlet part. Thus, some of the disinfection target material introduced through the inlet flows into the outside of the wiper ring disposed at the outermost side of the inlet side among the plurality of wipers, collides with the outer wall of the reactor body, and then flows, and the other part is the There is provided a tube-type UV disinfection device using vortex generation, characterized in that it flows inside a wiper ring disposed on the outermost side of the inlet side among a plurality of wiper rings.

Korean Patent Application Laid-Open No. 2005-0088762 discloses a control device for a UV sterilizer in which at least one UV lamp is installed in a water channel through which sewage is discharged, and disinfects waste water by UV light irradiated from the UV lamp. flow meter to detect the quantity; a permeation meter installed at the inlet of the water channel to detect transmittance according to the turbidity of the sewage flowing into the water channel; a driving unit for driving the ultraviolet lamp according to an input driving control signal; A control device for a UV sterilizer comprising a; to provide.

However, in the LED lamp assembled using the conventional general LED substrate configured as described above, the LED substrate must be fixed to the flat portion formed in the radial direction on the outer circumferential surface of the heat dissipation tube of the frame as described above, and also to the LED of the LED substrate. Since a separate converter PCB for supplying power is required, productivity due to assembly is inevitably reduced, and manufacturing cost is inevitably increased.

Existing LED UV requires a thermal cooling device, so complex equipment is required for disinfection, and the cooling effect cannot be maximized because it is not formed in three dimensions.

In addition, the conventional chemical disinfection system has a low disinfection performance, so water-borne diseases can easily occur, and in the case of the UV mercury lamp, in addition to bacterial disinfection (253 nm), low efficiency due to wide wavelength emission was a problem.

Therefore, there is a need for a new method that is more environmentally and economical than the existing disinfection methods (chemical and UV mercury lamp).

Japanese Patent Laid-Open No. 2002-184209 Japanese Laid-Open Patent No. 2010-182796 Japanese Patent Laid-Open No. 2011-249534

The present invention has been made to solve the above problems, and it is possible to sterilize E. coli with UVC LED ultraviolet rays generated in LED semiconductors, and it is an immersion type LED sewage disinfection device using cooling control, which is a technical limitation of semiconductors (heat problem) An object of the present invention is to provide a pipeline-type sewage disinfection system using a semiconductor that overcomes the

In order to solve the above problems, the present invention provides an LED sterilization unit in which a plurality of LED device mounting PCB boards equipped with wiring patterns are adhered to each other and configured in a polygonal column shape; a cylindrical module cover part which is fixed while enclosing the LED element mounting PCB board; and a cooling unit for internally circulating cooling in a tunnel through which one end and the other end of the module cover unit are penetrated.

The cooling unit is made of an aluminum material to dissipate heat generated when a plurality of LED elements connected at regular intervals are turned on.

The LED sterilization unit is provided in a hexagonal shape.

In order to cool the LED sterilization unit, a cooling system that performs three-dimensional cooling by rotating a fan in a tunnel having one end and the other end penetrated in a hexagonal shape to advance air generated in one direction.

The present invention further includes; a control system for controlling the cooling system to operate according to the temperature of the LED sterilization unit to maintain the optimum PCB temperature.

The present invention is a control system for controlling a cooling unit through which a plurality of LED element mounting PCB boards equipped with a wiring pattern are adhered to each other and fixed while enclosing an LED sterilization unit configured in a polygonal column shape and the LED element mounting PCB board. A method for disinfecting sewage using a pipe-type sewage disinfection system using a semiconductor comprising: sterilizing the sewage by operating an LED sterilizer; cooling the LED sterilization unit through a cooling system; Including; maintaining the optimum temperature of the PCB through the control system.

Through the cooling system, a fan is rotated in a tunnel through which one end and the other end of the cooling unit are penetrated to perform three-dimensional cooling through one-way cooling.

Control to operate the cooling system according to the temperature of the LED sterilization unit in order to maintain the optimum temperature of the PCB through the control system.

The present invention made as described above It does not use chemicals, so there is no problem of side effects, and it has high handling and stability. Compared to the UV mercury discharge lamp method, it is an eco-friendly method and the lifespan is increased by more than 5 times.

In addition, the present invention can sterilize E. coli with UVC LED ultraviolet rays (278 nm) generated in LED semiconductors, and solves the technical limitations (heat problem) of semiconductors with an immersion type LED sewage disinfection device using cooling control.

In addition, the present invention achieves high performance and high efficiency of disinfection facilities using light emitting semiconductors (LEDs), and overcomes the technical limitations of LEDs with water cooling or air cooling.

That is, in the case of LEDs, there was a problem that the efficiency was lowered due to the heat problem (over 40℃), but the LED heat problem was solved with the water-cooled and air-cooled methods.

In addition, the present invention is a disinfection method for controlling semiconductors, maintenance is convenient and stability is high.

In addition, the present invention can achieve maximum disinfection performance and cost reduction by three-dimensionally radiating LED UV and three-dimensional cooling method.

1 is a view showing a semiconductor disinfection apparatus according to an embodiment of the present invention.
2 is a view showing a semiconductor air cooling device according to an embodiment of the present invention.
3 is a view showing a semiconductor cooling structure according to an embodiment of the present invention.
4 is a view showing a pipe-type sewage disinfection system using a completed semiconductor according to another embodiment of the present invention.
5 is a view showing an embodiment applied to immersion UV sewage treatment according to another embodiment of the present invention.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. This example is provided to more completely explain the present invention to those of ordinary skill in the art. Accordingly, the shapes of elements in the drawings may be exaggerated to emphasize a clearer description. It should be noted that the same members in each drawing are sometimes shown with the same reference numerals. In addition, detailed descriptions of well-known functions and configurations determined to unnecessarily obscure the gist of the present invention will be omitted.

As shown in FIG. 1 , the module cover 10 having a cylindrical (cylinder) structure according to the present invention was the most hydrodynamically efficient in terms of experimental results.

In addition, the most efficient PCB assembly structure for a cylinder according to the present invention is a hexagonal column structure in which six LED element mounting PCB boards 20 on which LEDs (eg, UV-C LEDs) are mounted are joined to each other.

The LED element of the LED element mounting PCB board 20 preferably has a wavelength of 278 nm UV C ultraviolet rays.

And the LED element mounting PCB board 20 is assembled into a hexagonal pillar. However, it is not limited to hexagonal, and it can also be assembled into a column having a plurality of angles (as close to a cylindrical shape as possible). That is, the semiconductor module is inserted into the cover and assembled.

The LED semiconductor mounted on the LED element mounting PCB board 20 is emitted as 30% light and 70% heat. For example, above 40°C, the UV performance is reduced. That is, it is necessary to measure the heat generated by the hexagonal pillar module.

For example, it is possible to detect the generated temperature of the LED element mounting PCB board 20, transmit temperature information to the control device, and operate a cooling system according to the temperature to maintain the optimal temperature of the LED element mounting PCB board 20 have.

Alternatively, the LED element mounting PCB board 20 may be cooled by internal circulation or a three-dimensional cooling method with one-way cooling.

That is, in the present invention, the LED element mounting PCB board 20 on which the LED module is mounted is manufactured in a cylindrical shape so that the LED UV can be sterilized in three dimensions.

In the present invention, for air cooling by cooling, air circulates along the inner space formed by the plurality of LED element mounting PCB boards 20 to cool the air.

That is, it has a structure in which internal air is circulated through the internal space formed by the plurality of LED element mounting PCB boards 20 and the cooling system.

Therefore, it is possible to maintain an appropriate temperature by the cooling control system, for example, the semiconductor efficiency can be adjusted to below 40 ° C.

In addition, because UV is emitted in three dimensions, the disinfection efficiency is high and the cost is reduced, and it provides a water treatment disinfection technology that overcomes the limitations of the existing disinfection methods (chemical and UV mercury lamp).

In addition, the efficiency of the disinfection wavelength of the LED semiconductor is maximized due to the specificity of the structure, the process is simplified, and the UV-type LED is eco-friendly and cost-effective without side effects.

The UV-C LED mounted on the LED element mounting PCB board 20 is designed to emit ultraviolet light with a wavelength of 200 to 280 nanometers short, destroying the bacterial DNA of the surface of an object or flowing water and causing a chemical reaction with a special material. Used for sterilization or curing equipment.

The UV-C LED has a wavelength of 278 nm, and the light output is high, and the higher the light output, the stronger the sterilization device can be made. did

As another example of the present invention, UV-C LED is Wavelength 278nm, Forward Current 350 mA, Optical Power 100mW, Forward Voltage 7.0V, Beam Angle 120 Degree, or Wavelength 278nm, Forward Current 200 mA, Optical Power 200mW, Forward Voltage 30V , Beam Angle 120 Degree, Wavelength 278nm, Forward Current 350 mA, Optical Power 300mW, Forward Voltage 32V, Beam Angle 120 Degree.

The LED device mounting PCB board 20 and the adjacent other LED device mounting PCB board 20 are combined so that the UV-C LED faces outward with a predetermined space therebetween, and the predetermined space A flow path for the heat transfer medium is formed.

The LED element mounting PCB board 20 has a polygonal shape and a detachable structure in which UV-C LEDs are arranged in a matrix in two dimensions in a closed space.

That is, the UV-C LED is seated on the outer surface of the LED element mounting PCB board 20 and vertically arranged so that a liquid having certain characteristics flows therebetween.

Therefore, a method in which the liquid flowing in the lateral direction is sterilized by the plurality of LED element mounting PCB boards 20 is used without as much hindrance in the flow direction of the liquid having certain characteristics as possible.

The number of UV-C LEDs installed can be freely determined in consideration of the flow rate and flow direction of the raw water to be treated.

A fitting portion for fitting the upper and lower corners of the LED element mounting PCB board 20 to the external UV-C support module is included.

The LED device mounting PCB board 20 is combined with a pair of UV-C LED boards 21 so that the UV-C LEDs face outward with the UV-C LEDs interposed therebetween in a certain space of FIG. 2 , A flow path for a heat transfer medium is formed in the predetermined space.

For example, the LED device mounting PCB board 20 and other LED device mounting PCB boards 20 adjacent to each other are attached and detached from each other while being coupled and released by a bolt-nut coupling method, thereby facilitating replacement of defective products.

The LED device mounting PCB board 20 has a structure in which UV-C LEDs are arranged in a three-dimensional matrix in a closed space.

When the UV-C LEDs are arranged in a hexagonal arrangement, the ultraviolet irradiation direction of the UV-C LEDs may be adjusted to be focused on the liquid flowing in the conduit type sewage disinfection system using semiconductors, and the sterilization effect may be adjusted according to the arrangement number.

In the predetermined space, the cutting surface has a predetermined inclination and has a tapered shape that becomes narrower toward the upper side, and the speed at which the heat transfer medium moves through the flow path may gradually increase.

The present invention will be described with an example in which air is used as a heat transfer medium. Of course, the present invention is not limited to the cooling method by air, and other fluids may be used as the heat transfer medium.

It further includes a real-time monitoring system for sterilization performance and heat generation for detecting the abnormality of the pipeline-type sewage disinfection system using a semiconductor by grasping the operating state of the LED element mounting PCB board 20 in real time.

In the real-time monitoring system for sterilization performance and fever, sterilization information and fever information can be determined according to a reference value. It is set differently according to the characteristics of each detailed determination information.

In addition, the sterilization performance and fever real-time monitoring system may predict and notify the overheating time by collecting the heating rate increase per hour based on the sterilization information and the fever information.

In addition, the sterilization performance and fever real-time monitoring system is primarily connected to the manager terminal capable of wireless communication, and can be secondarily connected to the emergency contact terminal when the connection to the manager terminal is not established within a set time.

As another embodiment of the present invention, the real-time monitoring system for sterilization performance and heat generation provides convenience to maintenance by immediately sending an SMS to the manager when an abnormality or overheating of a pipe-type sewage disinfection system using a semiconductor occurs.

In addition, the present invention enables real-time operation monitoring at a remote location and quick response in case of an abnormality.

In addition, according to the present invention, the water quality status, emergency message status, and equipment status can be viewed on one screen on the main screen of the remote network-connected sterilization performance and fever real-time monitoring system.

The three-dimensional space formed by the LED element mounting PCB board 20 has a cut surface having a certain inclination and has a tapered shape that becomes narrower toward the upper side, and the speed at which the heat transfer medium flows is gradually increased.

Inclined at a certain angle of the space between the pair of plates 21 to which the UV-C LED is coupled so that the added pressure by the air compressor is transmitted through the extension tube and the air heated by the LED flows out and cools. lose

That is, the PCB plate 21 of the pair of LED element mounting PCB boards 20 facing each other can be inclined in the direction of each other so that the upper part is short and the lower part is wide, or it can be inclined in the opposite direction so that the upper part is wide and the lower part is short can

Therefore, when the air flow rises in a wide direction at the upper side, a temperature drop due to the slope may occur.

The length along the lower side of the LED element mounting PCB board 20 by extending from the air compressor so that the pressure by the air compressor is transmitted through the extension tube and the air heated by the UV-C LED flows out to the outside. It is attached to the direction and further includes an extension pipe in which an air outlet hole is formed on the side.

The material of the LED element mounting PCB board 20 is a material having a reflectance greater than or equal to a certain value, and ultraviolet rays emitted from the LED element mounting PCB board 20 facing it are sterilized by being reflected in flowing water or at the same time being reflected back to disinfect again. What can be repeated

The length along the lower side of the LED element mounting PCB board 20 by extending from the air compressor so that the pressure by the air compressor is transmitted through the extension tube and the air heated by the UV-C LED flows out to the outside. It is attached to the direction and further includes an extension pipe in which an air outlet hole is formed on the side.

Compressed air is supplied from the air compressor to guide the compressed air into the space between the LED element mounting PCB board 20 .

When a pair of opposing UV-C LED substrates are overlapped for bonding, they can be tilted in each other's directions so that the upper part is short and the lower part is wide, or they can be tilted in opposite directions so that the upper part is wide and the lower part is short.

Therefore, when the upper part of the air flow rises in a wide direction, the temperature may drop due to the expansion due to the inclination.

The material of the LED element mounting PCB board 20 is a material having a reflectance greater than or equal to a certain value, and is sterilized by irradiating the UV-C LED emitted from the facing UV-C LED to flowing water or at the same time in the LED element mounting PCB board 20 It is reflected back and disinfected again.

A cleaning unit is further included at a predetermined position in the internal space of the external UV-C support module to wash the lens.

In one embodiment, a cleaning unit is further included at a predetermined position in the inner space of the cylindrical (cylinder) structure of the module cover to wash the lens.

The cleaning unit is located adjacent to the LED element mounting PCB board 20 in the pipeline-type sewage disinfection system using the semiconductor, and includes a tiltable cleaning nozzle to automatically clean contaminants that may be attached to the lens. can

In addition, the cleaning unit automatically cleans the inside of the conduit type sewage disinfection system using a semiconductor when it detects a decrease in performance, so that the efficiency of the disinfection device is increased.

A small lidar sensor basically provides information on the reflectance of a surface. The reflectance mainly depends on the material of the surface, and the reflectance information on the surface of the LED driving circuit board can be used.

By creating a two-dimensional polar coordinate grid on the surface of the LED element mounting PCB board 20, the points having the maximum reflectance value in each grid are stored over several frames, and a lane is recognized through a method of setting an appropriate threshold value.

As another embodiment, a histogram of the reflectance of a plurality of points arbitrarily present (assumed) on the surface of the LED device mounting PCB board 20 is created, and a region of interest is created for a portion where data is concentrated, and the lane candidate group points in the region of interest are There is also a method of judging the poor bonding between the LED device mounting PCB boards 20 and the boards for only the LED device.

The lidar sensor is a technology capable of detecting a distance to an object, a direction, a speed, a temperature, a material distribution and concentration characteristics, and the like by shining a laser on a target.

In general, the lidar sensor utilizes the advantages of a laser capable of generating a pulse signal having a high energy density and a short period, and is used for more precise observation of the physical properties of the LED device mounting PCB board 20 and distance measurement.

In the present invention, the main requirements for selecting a BLE module in the IIoT gateway are approximately BLE Version 5.0 or higher required, long range, low power operation, size that can be embedded in a small space, serial interface, smooth control function through MCU, maximum output of 5 dBm or more etc are needed.

The semiconductor emits 30% light and 70% heat. For example, when it is above 40℃, the UV performance is reduced.

By attaching a sensor measuring the degree of adhesion of the LED element mounting PCB board 20 to each other, it is possible to repair in a timely manner, thereby maximizing the hydrodynamic efficiency of removing the turbulence or vortex generated from the inside to the outside.

The protective layer coated on the LED element mounting PCB substrate of the pipeline-type sewage disinfection system using the semiconductor is polyolefin, ethylene vinyl acetate (EVA), polyvinyl butyral (PVB), silicone resin, TP. (TPT; Tedlar/PET/Tedlar), TPE (TPE; Tedlar/PET/EVA), TAT (TAT; Tedlar/Al foil/Tedlar), TPAT (TPAT; Tedlar/PET/Al foil/Tedalr), LED elements from sudden impact while absorbing external solar heat, including one of TPOT (Tedlar/PET/Oxide/Tedlar), PAP (PEN/Al foil/PET) or Polyester The mounted PCB board 20 and the like are protected.

To this end, when the functional powder is contained in a weight ratio of 1 to 10 parts by weight with respect to 100 parts by weight of the protective layer coated on the surface of the LED element mounting PCB substrate 20, it continuously exhibits antibacterial and deodorizing power by emitting far-infrared rays. can make it

More specifically, the functional powder is 10 to 20 parts by weight of germanium, 1 to 3 parts by weight of cypress powder, 1 to 3 parts by weight of dandelion extract, 3 to 5 parts by weight of silicon dioxide nanoparticles, 1 to 3 parts by weight of olivine, photocatalyst 1 to 3 parts by weight, 0.1 to 0.5 parts by weight of the oxide powder, 1 to 3 parts by weight of red clay, and 25 to 35 parts by weight of the binder resin, the photocatalyst is titanium dioxide (TiO ₂ ) 5 to 10 parts by weight and nano silver It can be prepared by pulverizing the functional particle composition prepared by mixing in a weight ratio of 1 to 3 parts by weight of the powder.

As an embodiment, a fine dust meter installed inside or outside the fixed frames 10 and 20 to measure the outdoor fine dust concentration is further included.

10: module cover
20: LED element mounting PCB board
21: PCB plate
22: LED semiconductor

Claims (8)

A plurality of LED device mounting PCB (20) equipped with a wiring pattern is attached to each other, the LED sterilization unit configured in the shape of a polygonal column;
a module cover part in a cylindrical (cylinder) shape that is fixed while surrounding the LED element mounting PCB board 20;
A conduit-type sewage disinfection system using a semiconductor comprising a; a cooling unit for internally circulating cooling in a tunnel having one end and the other end of the module cover unit penetrated. According to claim 1,
The cooling unit is a conduit-type sewage disinfection system using a semiconductor, characterized in that it is made of an aluminum material to dissipate heat generated when a plurality of LED elements connected at regular intervals are turned on. According to claim 1,
The LED sterilization unit is formed in a hexagonal shape and is a pipe-type sewage disinfection system using a semiconductor, characterized in that it is provided. 4. The method of claim 3,
In order to cool the LED sterilization unit, a cooling system that performs three-dimensional cooling by rotating a fan in a tunnel having one end and the other end penetrated in a hexagonal shape to advance air generated in one direction; Pipeline sewage disinfection system. According to claim 1,
A control system for controlling the cooling system to operate according to the temperature of the LED sterilization unit in order to maintain the optimum PCB temperature. A plurality of LED element mounting PCB boards 20 equipped with wiring patterns are adhered to each other and fixed while enclosing the LED sterilization unit configured in a polygonal column shape and the LED element mounting PCB board 133, and one end and the other end are penetrated through the cooling In the sewage disinfection method using a pipe-type sewage disinfection system using a semiconductor consisting of a control system for controlling a part,
Disinfecting sewage by operating an LED sterilization unit formed in a hexagonal shape inside the pipeline-type sewage disinfection system;
cooling the inside of the LED sterilization unit through a cooling system;
Sterilization method using a conduit-type sewage disinfection system using a semiconductor comprising; maintaining the inside of the LED sterilization unit at a constant temperature through a control system. 7. The method of claim 6,
Disinfecting method using a tube-type sewage disinfection system using a semiconductor that performs three-dimensional cooling with one-way cooling by rotating a fan in a tunnel through which one end and the other end of the cooling unit pass through the cooling system. 7. The method of claim 6,
Disinfecting method using a tube-type sewage disinfection system using a semiconductor, characterized in that controlling the cooling system to operate according to the temperature of the LED sterilization unit in order to maintain the optimum temperature of the PCB through the control system.

Images