JP2011249534A - Flexible wiring board, light-emitting module, manufacturing method of light-emitting module, and manufacturing method of flexible wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible wiring board, a light-emitting module, manufacturing method of the light-emitting module, and manufacturing method of the flexible wiring board for easily forming a three-dimensional shape by flexure, and for favorably and reliably ensuring heat dissipation.SOLUTION: The flexible wiring board 2 includes a flexible circuit board 5 having an insulation resin layer and a wiring layer, a plate base material 4 on which the flexible circuit board 5 is laminated as to cover one surface of the plate base material 4, and a groove 6 formed on the plate base material 4 such that a part of the plate base material 4 is easily flexed. Electronic components 3 are mounted on the flexible circuit board 5. The flexible wiring board 2 realizes a three-dimensional shape flexure by flexure at the position of the groove 6 on the plate base material 4.

Description

  The present invention relates to a light emitting module that can be used as a light source device in a lighting device, a display device for displaying characters, images, and the like, a method for manufacturing the light emitting module, and a bendable wiring board that can be used for manufacturing the light emitting module. And a manufacturing method thereof.

In recent years, in display devices and lighting devices for displaying characters, images, etc., the use of LEDs (Light Emitting Diodes) as a light source with high efficiency and long life is rapidly spreading. .
An illumination device and a display device using LEDs as a light source have a simple structure in which, for example, an LED mounting surface side of a substrate with LEDs in which one or a plurality of LEDs are mounted on a rigid printed wiring board is covered with a light-transmitting cover. Therefore, the structure can be simplified and the size can be easily reduced as compared with the case where an incandescent bulb or a fluorescent lamp is used as a light source.

Further, for example, as in Patent Document 1, a light source device having a structure in which a substrate with LED is attached to an umbrella-shaped outer shell member integrated with an E-shaped base for a general incandescent bulb, or a spherical shape that covers a substrate with LED Light source device (hereinafter also referred to as a bulb-type LED light source device) having a cover (hereinafter also referred to as a bulb), a plastic cylindrical shape in which a light diffusion material such as silica particles is mixed (or a light diffusion film is formed) An elongated external appearance (hereinafter also referred to as an elongated LED light source device) having a configuration in which an elongated plate-like printed wiring board having a plurality of LEDs mounted therein is housed in a cover has been commercialized.
The above-described bulb-type LED light source device does not require gas to be sealed in the bulb as in a well-known incandescent bulb, and does not require the hermeticity of the bulb, can use a plastic bulb instead of a glass bulb, etc. Compared to incandescent bulbs, it is easier to manufacture and has better luminous efficiency.
Many elongated LED light source devices have the same length as standard straight tube fluorescent lamps, and are provided with the same base as the straight tube fluorescent lamps at both ends in the longitudinal direction. Compared to known fluorescent lamps, this elongated LED light source device is easy to manufacture because it does not require gas filling, and does not require special equipment such as a starter device or ballast required for lighting the fluorescent lamp. There are advantages.

However, as is well known, LEDs are highly directional point light sources. For this reason, in a lighting device that is required to emit light over a wide range, such as a lighting device for indoor lighting, a light diffusion material such as silica particles is mixed (or a light diffusion film is formed). Although the output light of the LED is diffused by the light transmission cover, the emission direction of the emitted light from the LED is limited to a fairly narrow range, so it is not easy to equalize the emitted light from the cover to the outside. The reality is that variations in brightness tend to occur. The same applies to the above-described light bulb-shaped and elongated LED light source devices.
Further, in view of this problem, for example, by the unevenness formed on the light transmission cover of the illumination device or the cover of the LED light source device (bulb of the light bulb-type light source device, cylindrical cover of the elongated light source device), Although it is conceivable to adopt a diffusion structure that diffuses the light emitted from the LED in a complicated manner, there is a problem that the light that is not emitted from the cover to the outside increases due to reflection inside the cover, leading to a decrease in luminous efficiency. .

Moreover, as an illuminating device or a display device using an LED as a light source, there are various types such as a bent plate shape such as an L-shaped plate shape and a U-shaped plate shape, and a polygonal cylindrical shape such as a triangular, quadrangular, pentagonal, and hexagonal shape. Development of products with various shapes is also expected.
In order to realize the above-mentioned bent plate-like or polygonal cylindrical device shape, a device such as a lighting device or a display device is usually assembled using a plurality of rigid printed wiring boards mounted with LEDs (for example, Patent Document 2).
However, an apparatus using a plurality of substrates with LEDs in this way requires fixing parts for fixing each substrate with LEDs in a predetermined direction, depending on the number of substrates with LEDs. There is a problem that it takes time to assemble. In addition, if there are a large number of boards with LEDs to be used, the wiring for power supply to each board with LEDs becomes complicated, and it takes time to connect the wiring, and the circuit wiring of the printed wiring board of the board with LEDs is electrically connected. The connected power supply line is likely to be an obstacle to the assembly work of the entire device, it may be necessary to secure a space for the power supply wiring in the device, and in some cases, the size of the device and product design may be affected. Problems also arise.

In view of this, for example, as disclosed in Patent Documents 3 and 4, there is also proposed a lighting device that is assembled by attaching a flexible printed wiring board (hereinafter also referred to as FPC) on which an LED is mounted to a member formed in a desired shape in advance. ing. As can be seen with reference to FIG. 1 and the like, the lighting device disclosed in Patent Document 3 is changed from a mounting base 8 to which a base 9 that can be mounted on a socket for a general white light bulb is fixed to the mounting base 8. It has a columnar core 5 protruding into a fixed external spherical transparent or translucent cap 12, and is formed in a radial shape (cross shape in FIG. 2) that is flat when deployed as shown in FIG. The FPC is bonded so as to cover the tip of the core 5. Further, FIGS. 5 to 7 of Patent Document 3 disclose an illuminating device in which a LED is mounted on a radial FPC that is flat when unfolded and bonded to the inner surface of the cylindrical portion 26 of the reflector 25. .
Patent Document 4 discloses an illumination device having a configuration in which an FPC having an LED mounted thereon is attached to the inner surface of an umbrella-shaped housing 4.

JP 2009-32466 A JP 2002-184207 A JP 2006-244725 A JP 2002-83506 A

  However, as in Patent Documents 3 and 4, in the configuration in which the FPC with the LED mounted thereon is pasted on a member formed in a desired shape in advance, the efficiency of the pasting work is poor, and the FPC is bent carelessly in the pasting work. There is a problem that inconveniences such as damage to the soldering part are likely to occur. That is, since FPC has high flexibility, it follows the shape of a member to be affixed (hereinafter also referred to as an affixing base material) well, but bends freely during the affixing operation. It is easy to damage the attachment part.

Also, when using adhesive fixing as a means to fix the FPC to the pasting substrate that has been formed in the desired shape, hold down the FPC so that it does not rise from the pasting substrate until the adhesive is cured. It is necessary to attach it. However, at this time, it is difficult to press the FPC evenly so as not to damage the LED mounted on the FPC or the wiring of the FPC.
For example, when pressing and selecting a part that does not have an LED or wiring, the FPC is likely to be lifted with respect to the base material for pasting, so that the adhesive fixing is insufficient and it is easy to peel off, such as aluminum The heat dissipation by sticking to the said base material for affixing with high heat dissipation is also not expectable. Instead of fixing using an adhesive, for example, a configuration may be adopted in which a plurality of locations on the outer periphery of the FCP are mechanically pressed by hooks or the like protruding from the pasting base material. It is difficult to mount the material so that the raised portion does not occur.

  Further, in the configuration as in Patent Documents 3 and 4, since the shape of the FPC is determined by the shape of the base material for pasting the FPC, when manufacturing a lighting device having a complicated shape, it is for pasting the complicated shape. Requires a substrate. For this reason, depending on the shape of the base material for pasting, a base material for pasting composed of a plurality of members may be required, which may increase the time and cost of assembly, and such pasting. Also, it takes time to apply the FPC to the base material.

  In view of the above problems, the present invention provides a foldable wiring board, a light emitting module, a method for manufacturing a light emitting module, and a foldable wiring board that can be easily formed into a three-dimensional shape by bending and that can ensure good heat dissipation. The purpose is to provide a manufacturing method.

In order to solve the above problems, the present invention provides the following configuration.
The bendable wiring board of the present invention is laminated such that a flexible circuit board portion having an electrically insulating insulating resin layer and a wiring layer covers one side of a plate-like base material, A groove for easily bending a part of the base material is formed on one or both surfaces of the plate-like base material, and the flexible circuit board portion is divided by the groove of the plate-like base material. Among the plurality of base plate pieces, provided to extend over at least two base plate pieces, at least of the plate-like portions in which the flexible circuit board portion is laminated on the base plate pieces. An electrode part for mounting an electronic component is provided on the flexible circuit board part in the two plate-like parts, and it can be bent and formed into a three-dimensional shape by bending at the position where the groove of the plate-like substrate is formed. With foldable wiring board That.
As the resin for forming the insulating resin layer of the flexible circuit board portion, a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer is preferable.
The plate-like substrate is preferably made of an aluminum plate or a copper plate, a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer.

The light emitting module of the present invention is a light emitting module in which light emitting elements are mounted on at least two plate-like portions of the plate-like portions of the bendable wiring board.
The light-emitting module of the present invention is a light-emitting device that is the plate-like portion on which the light-emitting element is mounted, wherein the bendable wiring board of the light-emitting module is bent at the groove-forming position of the plate-like base material to form a solid shape. In the light emitting module, a bendable portion is formed by bending the bendable wiring board at a position where the groove of the plate-like base material is formed between the plate-like portions with elements.
It is preferable that a member for fixing the shape of the bendable wiring board is provided on the back side of the plate-like substrate.
It is preferable that the bendable wiring board has a portion that is bent at a position where a plurality of the grooves formed in parallel to each other on the plate-like base material is formed into a bowl shape or a cylindrical shape.

The method of manufacturing a light emitting module according to the present invention includes mounting a light emitting element on the flexible circuit board portion of the foldable wiring board, and separating the plurality of boards of the foldable wiring board divided by the grooves of the plate-like base material. A light emitting element mounting step of providing light emitting elements on at least two plate-like portions of the shape-like portion, and a bending forming step of bending the foldable wiring board at the groove-forming position of the plate-like base material to form a three-dimensional shape; It comprises.
The light emitting module manufacturing method of the present invention includes a substrate shape fixing step of providing a shape fixing member of the foldable wiring board on the back side of the plate-like base material and fixing the shape of the foldable wiring board. can do.

The method for manufacturing a foldable wiring board according to the present invention includes a groove forming step of forming the groove in the plate-like base material, and copper on only one side of the thermoplastic resin film on one side of the plate-like base material. A flexible substrate bonding step for bonding a single-sided copper-clad flexible substrate integrated with a foil by thermally welding the thermoplastic resin film, and after the flexible substrate bonding step, patterning the copper foil to form the electrode portion The flexible circuit board portion having the wiring pattern as the wiring layer and the thermoplastic resin film as the insulating resin layer is formed on one side of the plate-like base material by forming a wiring pattern including the wiring pattern. A patterning step of obtaining a laminated board with wiring, and performing the groove forming step, the flexible substrate bonding step, and the patterning step, to the plate-like base material. There is a groove formed with the plate-shaped substrates preform one side to the said foldable lines get board bendable wiring board manufacturing method of the structure to which the flexible circuit board portion is integrated in.
The method for manufacturing a foldable wiring board according to the present invention includes a groove forming step of forming the groove in the plate-like base material, and a curable resin layer that is a semi-cured curable resin layer formed on one side of the copper foil. A curable semi-cured resin sheet, which is a sheet formed separately from the copper foil and the plate-like base material by a semi-cured resin layer or a semi-cured curable resin, the copper foil and the plate-like A flexible substrate forming step of forming a curable resin layer by heating and curing in a state of being sandwiched between the substrate base material and integrating the copper foil into the plate base material base material, and this flexible substrate forming step Thereafter, the copper foil is patterned to form a wiring pattern including the electrode portion, whereby the flexible circuit board portion having the wiring pattern as the wiring layer and the curable resin layer as the insulating resin layer is formed on the plate. Integrated on one side of the base material A patterning step of obtaining a laminated board with wiring, and performing the groove forming step, the flexible substrate forming step, and the patterning step to form a groove in which the groove is formed in the plate-shaped base material The manufacturing method of the bendable wiring board which obtains the bendable wiring board of the structure by which the said flexible circuit board part was integrated on the single side | surface of an attached plate-shaped base material may be sufficient.
The method for manufacturing a foldable wiring board according to the present invention includes a groove forming step of forming the groove in the plate-shaped base material, and a copper-clad flexible substrate in which copper foil is integrated on one side or both sides of a resin film. A substrate bonding step for bonding to one side of the plate-like base material using an adhesive, and after this substrate bonding step, the plate-like base material is opposite to the plate-like base material via the film of the copper-clad flexible substrate By patterning the copper foil located on the side to form a wiring pattern including the electrode part, the flexible circuit board part using the wiring pattern as the wiring layer and the film as the insulating resin layer is used as the plate-like substrate. A patterning step of obtaining a laminated board with wiring having a configuration integrated on one side of the base material, and performing the groove forming step, the substrate bonding step, and the patterning step, and the plate-like base material base material Before It may be a method for producing a foldable wiring board obtaining the bendable wiring board of grooves the flexible circuit board portion on one side of the formed grooved plate base material is an integral material.
Examples of the resin for forming the thermoplastic resin film on the single-sided copper-clad substrate, the resin for forming the curable semi-cured resin layer or the curable semi-cured resin sheet, and the resin for forming the resin film on the copper-clad substrate include: It may be a filler-mixed resin mixed with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer.

According to the present invention, since the bendable wiring board can be bent and formed into a three-dimensional shape by bending at the position where the groove of the plate-like base material is formed, light emitting modules of various shapes can be easily obtained. it can.
In bending, the flexible circuit board portion is not bent except at the groove forming portion, so that the electronic component and the soldered portion are not damaged.
Furthermore, since the adhesiveness between the plate-like base material and the flexible circuit board portion can be ensured satisfactorily, the heat dissipation required when an LED or the like is mounted can be ensured favorably and reliably.
In addition, since the bendable wiring board can be bent in the groove, it can be configured to maintain a three-dimensional shape by using a base plate piece having sufficient rigidity.
That is, since the three-dimensional shape can be made autonomously (that is, without excessively depending on other support members), the structure can be simplified. Therefore, manufacturing can be facilitated and cost can be reduced. Furthermore, the durability of the bendable wiring board can be increased.

Further, according to the manufacturing method of the present invention, the flexible circuit board is laminated on the plate-like base material before being bent, so that the plate-like base material is compared with the conventional method in which FPC is attached to a three-dimensional base material. The accuracy of positioning of the flexible circuit board portion with respect to the material can be increased.
Therefore, it is possible to prevent the electronic component or the soldered portion from reaching the folding position of the plate-like base material due to the displacement of the flexible circuit board portion, and to prevent damage to them.

1 is an overall perspective view of a light emitting module according to a first embodiment of the present invention. It is a cross-sectional view of the light emitting module of FIG. FIG. 2 is an enlarged partial cross-sectional view of the light emitting module of FIG. 1. It is a whole perspective view of the illuminating device using the light emitting module of FIG. It is process drawing which shows the 1st manufacturing method of a bendable wiring board. It is process drawing which shows the 2nd manufacturing method of a bendable wiring board. It is a figure explaining the modification of the 2nd manufacturing method of the bendable wiring board, Comprising: Copper foil is integrated with a board | substrate base material using the thermosetting semi-hardened resin sheet separate from a copper foil and a board | substrate base material. It is sectional drawing which shows the flexible substrate part formation process converted into. It is process drawing which shows the 3rd manufacturing method of a bendable wiring board. It is a cross-sectional view of the light emitting module of the second embodiment of the present invention. It is a cross-sectional view of the light emitting module of the third embodiment of the present invention. It is a perspective view of the light emitting module of 4th Embodiment of this invention. It is sectional drawing of the light emitting module shown to a previous figure. It is a top view which shows the state before the bending process of the bendable wiring board. It is sectional drawing of the light emitting module of 5th Embodiment of this invention. It is a block diagram which shows the state before bending of the bendable wiring board by which the groove | channel was formed in one surface.

Hereinafter, a light emitting module using a bendable wiring board according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a light emitting module 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the light emitting module 1. FIG. 3 is an enlarged cross-sectional view of a main part of the light emitting module 1. FIG. 4 is an overall perspective view of a lighting device using the light emitting module 1.
As shown in FIG. 1, the light emitting module 1 is obtained by mounting a light emitting element 3 such as an LED as an electronic component on a bendable wiring board 2 and bending the bendable wiring board 2 into a three-dimensional shape.

As shown in FIGS. 2 and 3, the bendable wiring board 2 is configured such that the flexible circuit board portion 5 is laminated so as to cover one surface 4 a (one surface) of the plate-like substrate 4.
As the plate-like substrate 4, a metal plate such as an aluminum plate or a copper plate can be used. In addition, a resin plate made of a filler mixed resin in which a filler having a higher thermal conductivity than the base resin is mixed in the base resin, a liquid crystal polymer, or the like can be used.
Examples of the base resin include an epoxy resin and a urethane resin. As the filler, a material made of a high thermal conductive ceramic (Al ₂ O ₃ , SiC, etc.) can be used.
By using the metal or the resin as a constituent material of the plate-like substrate 4, the heat generated by the light emitting element 3 can be efficiently dissipated, so that the heat dissipation of the light emitting module 1 can be improved.

As shown in FIG. 3, the other surface 4b (back surface) of the plate-like substrate 4 is formed with one or a plurality of grooves 6 for easily bending a part of the plate-like substrate 4, and the plate-like substrate. The material 4 is divided into a plurality of base plate pieces 12 by grooves 6 (see FIG. 5). The base plate piece 12 preferably has a bending rigidity that does not cause bending deformation in a bending process described later.
The groove 6 is formed so as to be cut from the other surface 4b, and is formed along the length direction of the plate-like substrate 4 (see FIG. 1). In the illustrated example, the groove 6 has a V-shaped cross section before being bent (see FIG. 5), and the inner surfaces 6a are preferably in contact with each other in the bent state shown in FIG.
In addition, the groove | channel 6 should just be what can form the bending part 10 in the plate-shaped base material 4, and a shape is not limited to the example of illustration. For example, the cross-sectional shape may be rectangular, semicircular, trapezoidal, or the like. Further, the groove 6 may be formed on one or both surfaces of the plate-like substrate 4.

As shown in FIG. 1, the plurality of grooves 6 are formed in parallel to each other, and the base plate piece 12 has a plurality of elongated plates that are parallel to each other.
In the bendable wiring board 2 of the illustrated example, the plate-like base material 4 is bent at the groove 6 so that one surface 4a on which the flexible circuit board portion 5 is formed is on the outer surface side (outer peripheral side). It has a bowl shape centering on an axis parallel to the forming direction (in the illustrated example, a bowl shape having a C-shaped cross section).

A portion where the plate-like substrate 4 is bent at the groove 6 is referred to as a bent portion 10.
Further, a configuration including the base plate piece 12 and the portion of the flexible circuit board 5 laminated thereon is referred to as a plate-like portion 16. The bendable wiring board 2 of the illustrated example is a bowl-like shape as a whole by combining 12 elongated plate-like plate-like portions 16 composed of an elongated plate-like base plate piece portion 12 and a flexible circuit board portion 5 having the same shape. It has become.

In addition, although the flexible circuit board part 5 of the example of illustration is formed over all the base-material board piece parts 12, it is not restricted to this but may be formed over at least 2 of the some base-material board piece parts 12. That's fine.
The shape of the bendable wiring board 2 is not limited to a bowl shape, and may be a cylindrical shape. The entire bendable wiring board 2 may have a three-dimensional shape such as a bowl or a cylinder, but only a part thereof may have the three-dimensional shape.

The flexible circuit board portion 5 has a configuration in which a wiring layer 14 (see FIG. 3) for forming a wiring pattern is laminated on one surface 13a (one surface) of an electrically insulating insulating resin layer 13.
A surface 13 b (the other surface) opposite to the surface on which the wiring layer 14 is formed of the insulating resin layer 13 is laminated on one surface 4 a of the plate-like substrate 4.
In the illustrated light emitting module 1, a protective resin layer 17 (specifically, a solder resist in the illustrated example) is provided on the outer surface of the flexible circuit board portion 5 (the surface opposite to the plate-like substrate 4). .

The wiring pattern formed by the wiring layer 14 has a plurality of mounting portions 7 for mounting electronic components (light emitting elements 3). In the wiring layer 14, electrode portions 15 for mounting the light emitting elements 3 are formed corresponding to the respective mounting portions 7.
External circuit connection terminal portions 8 are formed at a plurality of locations on the flexible circuit board portion 5. In the example of illustration, the external circuit connection terminal part 8 is formed in the two plate-like parts 16 located in the both-sides edge part of the plate-shaped base material 4 among the some plate-like parts 16, respectively.
The wiring pattern of the wiring layer 14 is formed so as to connect all the mounting portions 7 and the external circuit connection terminal portions 8, and the power supply lines 9 of the external circuit for power supply (see FIG. 1) are connected to the external circuit connection terminal portions 8. ) Can be fed to all the mounting parts 7.

Thereby, electric power can be supplied to all the electronic components (here, the light emitting element 3) mounted on the mounting portion 7. With this structure, an external power supply circuit for supplying power to a plurality of electronic components can be simplified. Further, it is possible to save labor for electrically connecting all the electronic components and the power supply external circuit.
The light emitting element 3 disposed in the mounting portion 7 is mounted on the mounting portion 7 by connecting the lead 3a to the electrode portion 15 with solder (not shown) or the like.
The wiring layer 14 is covered with a protective resin layer 17 laminated on the entire outer surface side (the side opposite to the plate-like substrate 4) of the flexible circuit board portion 5, avoiding the electrode portion 15 and the external circuit connection terminal portion 8. In addition, electrical insulation of the wiring layer 14 and adhesion of water droplets are prevented.
Here, the protective resin layer 17 is specifically a solder resist made of a coating film of a liquid resin material, but is not limited thereto, and may be an electrically insulating resin protective film or the like.

As the resin for forming the insulating resin layer 13, a thermoplastic resin, a thermosetting resin, or the like can be used. As the thermoplastic resin, a polyimide resin or the like can be used, and as the thermosetting resin, an epoxy resin, a so-called glass epoxy material (a glass fiber (for example, glass nonwoven fabric) mixed) or the like can be used.
In addition, as the resin for forming the insulating resin layer 13, it is possible to use a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer. Moreover, highly heat conductive resin can also be used.
The base resin includes the thermoplastic resin (polyimide resin, etc.), the thermosetting resin (epoxy resin, etc.), and the filler is made of a high thermal conductive ceramic (Al ₂ O ₃ , SiC, etc.). Can be used.
By using these materials (filler-mixed resin, liquid crystal polymer, etc.), it is possible to impart thermal conductivity to the flexible circuit board 5 and efficiently transmit the heat generated by the light emitting element 3 to the plate-like substrate 4. The heat dissipation effect can be enhanced.

Here, LEDs are employed as the light emitting elements 3. The light emitting element 3 is mounted on the outer surface side of each plate-like portion 16.
In the illustrated example, a plurality of light emitting elements 3 are arranged along the longitudinal direction of each plate-like portion 16.
In the illustrated example, all the plate-like portions 16 are provided with the light-emitting elements 3, but at least two of the plurality of plate-like portions 16 may be provided with the light-emitting elements 3.

As shown in FIGS. 2 and 3, a shape fixing member for fixing the shape of the bendable wiring board 2 in a state of being bent by the groove 6 to the other surface 4 b (back surface) of the plate-like substrate 4. 11 is preferably provided.
Although it may be provided on the entire back surface side of the bendable wiring board 2, it may be provided only on a portion including the bent portion 10.
The shape fixing member 11 is formed by applying a curable resin such as a semi-cured thermosetting resin (such as an epoxy resin), a moisture curable resin, or an ultraviolet curable resin to a necessary portion, and curing the resin after application. Can be formed.
By providing the shape fixing member 11, the three-dimensional shape of the bendable wiring board 2 can be reliably maintained.
The shape fixing member is not limited to this, and may be a plate material (resin plate, metal plate, or the like) provided at a necessary location by adhesive fixing using an adhesive, welding fixing, assembly, or the like.

As shown in FIGS. 2 and 4, the light emitting module 1 of this embodiment can be used in a lighting device.
The illuminating device 20 shown here has a configuration in which the light emitting module 1 is accommodated in the exterior body 21.
As shown in FIG. 4, the exterior body 21 has a configuration in which a base portion 22 is provided at both ends of the cylindrical cover 18, and the base portion 22 is fitted in a socket of an existing lighting device (such as a fluorescent lamp lighting device). A terminal 23 that can be connected.
As shown in FIG. 2, in the light emitting module 1, both side edges 2 a and 2 a of the bendable wiring board 2 are held by a holding body 19 and accommodated in a cylindrical cover 18.
Since the light emitting module 1 has a plurality of light emitting elements 3 mounted on the concave plate-like foldable wiring board 2 along the length direction, the light emitting module 1 is arranged in a light-transmitting cylindrical cover 18. Similarly to fluorescent lamps and neon lamps, they can be used as light sources for indoor lighting equipment, outdoor lighting equipment, advertising light panels, and the like.

Next, a first manufacturing method of the bendable wiring board 2 will be described with reference to FIG.
In this manufacturing method, the groove 6 is formed in a flat plate base material 18 (plate base material base material) such as a metal plate (aluminum plate, copper plate, etc.), a resin plate (filler-mixed resin, liquid crystal polymer, etc.). A forming step, a flexible substrate joining step for joining the single-sided copper-clad flexible substrate 22 to one side of the plate base material 18, and a patterning step for patterning the copper foil 24 to form a wiring pattern to obtain a laminated board 25 with wiring. And including.

As shown in FIG. 5A, in the groove forming step, the groove 6 is formed on the other surface 18b of the plate base material 18 of the laminated board 25 with wiring.
For the formation of the groove 6, a known method such as laser processing or cutting can be employed.
As shown in FIG. 5 (b), the flexible substrate bonding step is a single-sided copper in which a copper foil 24 (metal layer) is integrated on one side of an insulating (electrically insulating, the same applies below) thermoplastic resin film 23. The tension flexible substrate 22 is brought into surface contact with one surface 18 a of the plate base material 18, and the thermoplastic resin film 23 is thermally welded to be joined to the plate base material 18.
Here, as the single-sided copper-clad flexible board 22, a board formed in a planar shape that matches the flexible circuit board portion 5 of the foldable wiring board 2 to be manufactured is used.
The thermoplastic resin film 23 becomes the insulating resin layer 13 by heat welding to the plate base material 18.

  The thermoplastic resin film 23 forms the insulating resin layer 13 of the flexible circuit board portion 5, and a thermoplastic resin such as a polyimide resin or a liquid crystal polymer can be adopted as the material thereof. Further, as the thermoplastic resin film 23, a filler mixed resin obtained by mixing a filler having higher thermal conductivity than the base resin (polyimide resin, liquid crystal polymer, etc.) into the base resin can also be used.

In the patterning step, after the flexible substrate bonding step, the copper foil 24 is patterned to form a wiring pattern (see FIG. 5C).
The patterning can be performed by various known methods such as a photolithography method using a photoresist, laser processing, an ion beam method, and the like.
The wiring pattern formed by patterning includes wiring that connects all the mounting portions 7 and electrode portions 15 corresponding to the mounting portions 7. By forming the wiring layer 14 having a desired wiring pattern by such patterning, the wiring in which the flexible circuit board portion 5 having the thermoplastic resin film 23 as the insulating resin layer 13 is integrated on one side of the plate base material 18 The laminated board 25 with attachment can be produced.
The protective resin layer 17 described above is provided on the surface on the wiring layer 14 side of the flexible circuit board portion 5 so as to cover the entire portion excluding the electrode portion 15 and the external circuit connection terminal portion 8 after the production of the laminated board 25 with wiring. It is done.
Through the above steps, the bendable wiring board 2 in which the flexible circuit board portion 5 is laminated on one surface 4a of the plate-like base material 4 and the groove 6 is formed on the other surface 4b is obtained.

Next, the light emitting module 1 is manufactured using the bendable wiring board 2.
The light emitting module 1 is manufactured by a light emitting element mounting process and a bending process. Here, the case where the bending molding process is performed after the light emitting element mounting process will be described, but either of these processes may be performed first, and the order thereof is a working environment such as a manufacturing apparatus or other processing. It is set appropriately according to.

As shown in FIG. 5D, the light emitting element mounting step is a step of mounting the light emitting element 3 as an electronic component on the bendable wiring board 2. The light emitting element 3 is mounted on a mounting portion 7 formed on the bendable wiring board 2.
In mounting the light emitting element 3, the lead 3a of the light emitting element 3 is electrically connected to the electrode portion 15 by soldering or the like.

The bending process is a process in which the bendable wiring board 2 is bent at the groove 6 to form a three-dimensional shape. Since the base plate piece 12 has sufficient bending rigidity, the plate-like portion 16 hardly bends.
Through this bending process, the concave plate-shaped light emitting module 1 shown in FIG. 1 can be manufactured.

  After the bending process, a substrate shape fixing process can be performed as necessary. In this step, as shown in FIGS. 2 and 3, the shape fixing member 11 described above is provided on the back side opposite to the front side where the flexible circuit board portion 5 is provided. By providing the shape fixing member 11, the three-dimensional shape of the light emitting module 1 can be reliably maintained.

For the production of the bendable wiring board 2, the following second production method can be employed.
Hereinafter, the second manufacturing method of the bendable wiring board 2 will be described with reference to FIG. In the following description, description of procedures common to the first manufacturing method is omitted or simplified.
As shown in FIGS. 6A and 6B, in the second manufacturing method, after the groove 6 is formed in the plate base material 18 by the groove forming process, the flexible substrate portion bonding process is performed on one surface of the copper foil 24. A semi-cured resin layer-attached copper foil 27 having a structure in which a semi-cured thermosetting resin layer (thermosetting semi-cured resin layer 28) is integrated is joined to the plate member 18 described above to form a thermosetting semi-cured resin layer. The cured resin layer 28 is cured by heating to form the insulating resin layer 13.
Examples of the thermosetting semi-cured resin layer 28 include an uncured (semi-cured) epoxy resin, a so-called glass epoxy material in which glass fibers (may be a glass nonwoven fabric) are mixed into the epoxy resin (however, an epoxy resin is used). Semi-cured state) can be employed.
The thermosetting semi-cured resin layer 28 functions as an adhesive layer that joins the plate base material 18 and integrates the copper foil 24 with the plate base material 18. For this reason, the curable semi-cured resin layer 28 is cured to form the insulating resin layer 13, whereby the copper foil 24 is integrated with the plate base material 18 via the insulating resin layer 13.

As the copper foil 27 with a semi-cured resin layer, a copper foil 27 having a planar shape that matches the flexible circuit board portion 5 of the bendable wiring board 2 to be manufactured is used.
As the thermosetting semi-cured resin layer 28 of the copper foil 27 with the semi-cured resin layer, for example, a coating layer obtained by applying a liquid thermosetting resin material on one surface of the copper foil 24, or a semi-cured thermosetting resin. The thermosetting semi-cured resin sheet to be attached to one side of the copper foil 24 can be exemplified.
The copper foil 27 with the semi-cured resin layer is affixed until the heat curing of the thermosetting semi-cured resin layer 28 is completed on the plate base material 18 due to the adhesiveness of the thermosetting semi-cured resin layer 28. Can be kept stable, and misalignment with respect to the plate base material 18 hardly occurs. For this reason, the flexible board | substrate part formation process using the copper foil 27 with a semi-hardened resin layer can ensure high work efficiency, and is suitable at the point of the productivity improvement of the bendable wiring board 2. FIG.
Further, as the thermosetting semi-cured resin layer 28, a filler mixed resin obtained by mixing a filler having a high thermal conductivity with a base resin can be used, and thus the flexible circuit board portion 5 has a good thermal conductivity. Can be granted.

A patterning process (refer FIG.6 (c)) is performed after a flexible substrate part formation process, and the bendable wiring board 2 is obtained. The patterning step is the same as in the first manufacturing method.
By performing the light emitting element mounting process (see FIG. 6D) and the bending process similar to those of the first manufacturing method described above on the bendable wiring board 2 manufactured in this way, FIG. The concave plate-like light emitting module 1 shown in FIG. The order of the light emitting element mounting process and the bending process is appropriately set according to the working environment such as a manufacturing apparatus and other processes.

As shown in FIG. 7, the method for manufacturing a foldable wiring board according to the present invention performs the flexible substrate portion forming step of the second manufacturing method by using a thermosetting half separate from the copper foil 24 and the plate base material 18. The thing changed into the structure performed using the cured resin sheet 29 is also included.
The thermosetting semi-cured resin sheet 29 is a sheet-like member made of a semi-cured thermosetting resin. As a forming material of the thermosetting semi-cured resin sheet 29, an epoxy resin, a glass epoxy material (however, an epoxy resin in a semi-cured state) or the like can be employed.
In the flexible substrate portion forming step, the thermosetting semi-cured resin sheet 29 is interposed between the copper foil 24 and the plate base material 18, and the copper foil 24 is inserted into the plate mother via the thermosetting semi-cured resin sheet 29. After being bonded to the material 18, the thermosetting semi-cured resin sheet 29 is heated and cured to form the insulating resin layer 13, whereby the copper foil 24 is integrated with the plate base material 18.
In the case of the flexible substrate forming process using the thermosetting semi-cured resin sheet 29, the state in which the copper foil 24 is adhered to the plate base material 18 by the adhesiveness of the thermosetting semi-cured resin sheet 29 is stably maintained. It is possible to prevent the displacement of the material 18.
In this specification, this manufacturing method is treated as a modification of the second manufacturing method.

FIG. 8 shows a manufacturing method according to the third embodiment of the present invention.
This third manufacturing method includes a groove forming step (see FIG. 8A), a copper-clad flexible board in which a copper foil 24 is integrated on one side or both sides of the resin film 31 (in the illustrated example, a double-sided copper-clad flexible board). 32) a substrate bonding step (see FIGS. 8A and 8B) for bonding and integrating the above-described plate base material 18 using the adhesive 33, and a patterning step (see FIG. 8C). including.
This third manufacturing method differs from the first manufacturing method in that it includes a substrate bonding step instead of the flexible substrate bonding step. The steps after the substrate bonding step are the same as in the first manufacturing method.

As shown in FIGS. 8A and 8B, in the substrate bonding step, a double-sided copper-clad flexible substrate 32 in which the copper foil 24 is integrated on both surfaces of the resin film 31 is attached to the plate base material 18 via an adhesive 33. Glue. An epoxy adhesive or the like can be used as the adhesive.
As the resin film 31 of the copper-clad flexible substrate 32, a filler mixed resin in which a filler having high thermal conductivity is mixed with a base resin, a liquid crystal polymer, or the like can be used. Thermal conductivity can be imparted.

  The three-dimensional light emitting module 1 shown in FIG. 1 is manufactured by performing the light emitting element mounting process (refer FIG.8 (d)) and bending process similar to embodiment mentioned above with respect to the bendable wiring board 2. FIG. Can do. Then, the solid shape of the light emitting module 1 can be reliably maintained by performing the substrate shape fixing step as necessary.

In the third manufacturing method and the manufacturing method using the flexible circuit board on which the wiring layer is already formed, the copper-clad flexible board or the flexible circuit board is bonded and fixed to the board base material using an adhesive. However, the first and second manufacturing methods (including the modified example of the second manufacturing method) do not use an adhesive, and the resin itself for forming the insulating resin layer 13 is directly covered on the plate base material. By forming the insulating resin layer 13 by attaching, the insulating resin layer 13 and the copper foil 24 can be integrated with the plate base material 18.
Therefore, there is no separate adhesive layer for bonding and fixing between the insulating resin layer 13 of the flexible circuit board portion 5 and the plate-like substrate 4, and the insulating resin layer 13 is directly covered on the plate-like substrate 4. An integrated structure can be obtained. For this reason, compared with the case where the adhesive layer for the adhesion fixation of a flexible circuit board part and the plate-shaped base material 4 exists separately, there exists an advantage that high heat dissipation (heat dissipation to a plate-shaped base material) can be ensured. is there.

In the first to third manufacturing methods of the bendable wiring board 2, the plate base material 18 may be of a size that allows a plurality of plate-like base materials 4 to be cut out. That is, the plate base material 18 may have a size corresponding to the plurality of light emitting modules 1.
In this case, in the method of manufacturing the light emitting module 1, a cutting process for cutting the plate base material 18 into a predetermined size and shape is performed. That is, the light emitting module 1 is manufactured by a light emitting element mounting process, a bending process, and a cutting process. The cutting process is a process of cutting the plate base material 18 by press working or the like.

The bendable wiring board 2 can mount the light emitting element 3 on at least two plate-like portions 16 and can be bent into a three-dimensional shape by being bent at the groove 6, so that various shapes of light emitting modules can be easily obtained. it can. During bending, the flexible circuit board portion 5 is not bent except at the portion where the groove 6 is formed, so that the light emitting element 3 and the soldered portion are not damaged.
Moreover, since the flexible circuit board part 5 is laminated | stacked on the plate-shaped base material 4 before bending molding, the floating of the flexible circuit board part 5 with respect to the plate-shaped base material 4 does not arise easily.
For this reason, the adhesiveness of the plate-shaped base material 4 and the flexible circuit board part 5 is securable. Therefore, the heat transfer efficiency from the flexible circuit board part 5 to the plate-like base material 4 can be improved, and the heat dissipation required when the LED or the like is mounted can be ensured satisfactorily. Moreover, peeling and dropping off of the flexible circuit board portion 5 can be prevented.
Moreover, since the flexible circuit board part 5 is laminated | stacked on the plate-shaped base material 4 before bending shaping | molding, compared with the conventional product with which FPC is affixed on a complicated three-dimensional shaped base material, the flexible circuit board part 5 is easily plate-mounted. The substrate 4 can be laminated without a gap.
Therefore, manufacture becomes easy and cost reduction becomes possible. Furthermore, a complicated three-dimensional shape can be realized by appropriately setting the shape, position, and the like of the groove 6.

Since the bendable wiring board 2 is bendable in the groove 6, it can be configured so that the three-dimensional shape can be maintained by using the base plate piece portion 12 having sufficient rigidity.
That is, since the three-dimensional shape can be made autonomously (that is, without excessively depending on other support members), the structure can be simplified. Therefore, manufacturing can be facilitated and cost can be reduced. Furthermore, the durability of the bendable wiring board 2 can be enhanced.

Moreover, in the manufacturing method of the bendable wiring board 2, the flexible circuit board portion 5 is laminated on the plate-like base material 4 before being bent, and therefore, compared with the conventional method in which FPC is attached to a three-dimensional base material. And the precision of positioning of the flexible circuit board part 5 with respect to the plate-shaped base material 4 can be improved.
Therefore, it is possible to prevent the light emitting element 3 and the soldered portion from reaching the bent position of the plate-like base material 4 due to the positional deviation of the flexible circuit board portion 5 and prevent the light emitting element 3 and the soldered portion from being damaged.

FIG. 9 is a cross-sectional view of the light emitting module 31 of the second embodiment.
The light emitting module 31 is different from the light emitting module 1 of the first embodiment in that the entire bendable wiring board 2 has a concave plate shape with the flexible circuit board portion 5 side on the inside.
In the light emitting module 31, the groove 6 is formed on one surface 4 a of the plate-like substrate 4, and the plate-like substrate 4 is bent at the groove 6 with the one surface 4 a inside. For this reason, the light emitting element 3 is provided on the inner surface side of the bendable wiring board 2.
The shape of the bendable wiring board 2 is fixed by a shape fixing member 11 on the outer surface side of the bendable wiring board 2.
FIG. 15 shows a state before bending of the bendable wiring board 2 in which the groove 6 is formed on the one surface 4a. It is preferable that the inner surfaces 6a of the grooves 6 are in contact with each other when the plate-like substrate 4 is bent.

FIG. 10 is a cross-sectional view of the light emitting module 41 of the third embodiment.
The light emitting module 41 is different from the light emitting module 1 of the first embodiment in that the bendable wiring board 2 has a concave plate shape with the flexible circuit board portion 5 side inward in a part in the width direction.
In the light emitting module 41 of the illustrated example, the groove 6 is one of the plate-like substrates 4 in two of the four bent portions 10 (the bent portions 10A to 10D) (the bent portions 10B and 10C) that are close to the center in the width direction. The groove 6 is formed on the other surface 4b of the plate-like substrate 4 in the other two (folded portions 10A, 10D) formed on the surface 4a.
In the bent portions 10B and 10C, the plate-like substrate 4 is bent with one surface 4a inside, and in the bent portions 10A and 10D, the other surface 4b is bent inside. As a result, the light emitting module 41 has a concave plate shape in which the central portion in the width direction (the portion between the bent portions 10A and 10D) has the flexible circuit board portion 5 side inside.

FIGS. 11-13 shows the light emitting module 51 of 4th Embodiment.
FIG. 11 is a perspective view of the light emitting module 51. FIG. 12 is a cross-sectional view of the light emitting module 51. FIG. 13 is a plan view when the bendable wiring board 2 has a flat plate shape that is not bent.
The bendable wiring board 2 of the light emitting module 51 includes five base plate pieces 12, that is, a rectangular plate-like top plate portion 12 a, with a plate-like base 4 formed by a groove 6 formed on the other surface 4 b. It is divided into trapezoidal plate-like side plate portions 12b extending from the four side portions of the top plate portion 12a while being widened.
The plate-like substrate 4 is formed in a three-dimensional shape having a top plate portion 12a and four side plate portions 12b. That is, the plate-like base material 4 is inclined so that the side plate portion 12b descends outward from the four side portions of the top plate portion 12a. ) It is a bent body.

  The flexible circuit board portion 5 is formed by a top surface portion 5a corresponding to a rectangular top surface (top surface formed by the top plate portion 12a) and four side surfaces (four side plate portions 12b) of a five-sided bent body. A side surface portion 5b corresponding to a total of four side surfaces). Each side surface part 5b is located around the four directions in the top surface part 5a in a state of being connected to the top surface part 5a. That is, each side surface portion 5b is integrated with the top surface portion 5a via the connecting portions 5c extending from the four sides of the top surface portion 5a.

External circuit connection terminal portions 8 are formed on the two side surface portions 5 b of the flexible circuit board portion 5.
The wiring pattern of the wiring layer 14 is formed so that power can be supplied to all the mounting portions 7 by connecting the power supply wires 9 (see FIG. 1) of the power supply external circuit to the external circuit connection terminal portions 8. ing.
In addition, although the flexible circuit board part 5 of the example of illustration is formed over all the base-material board piece parts 12, it is not restricted to this but may be formed over at least 2 of the some base-material board piece parts 12. That's fine.

A configuration including the base plate piece 12 and the portion of the flexible circuit board 5 laminated thereon is referred to as a plate-like portion 16. The bendable wiring board 2 in the illustrated example includes a rectangular plate-like plate-like portion 16 (top plate portion 12a and top surface portion 5a) and four trapezoidal plate-like plate-like portions 16 (side plate portion 12b and side surface portion 5b). It is combined.
Each plate-like portion 16 is provided with an electrode portion 15 (see FIGS. 5 and 6), and a plurality of light emitting elements 3 are mounted on the electrode portion 15. In the illustrated example, all the plate-like portions 16 are provided with the light-emitting elements 3, but at least two of the plurality of plate-like portions 16 may be provided with the light-emitting elements 3.

In order to manufacture the bendable wiring board 2 of the light emitting module 51, the above-described first to third manufacturing methods can be applied.
That is, it can be manufactured by the first manufacturing method (see FIG. 5) using the single-sided copper-clad flexible substrate 22 having the thermoplastic resin film 23, or with a semi-cured resin layer having a thermosetting semi-cured resin layer 28. It can also be manufactured by a second manufacturing method (see FIG. 6) using the copper foil 27.
In the second manufacturing method, a thermosetting semi-cured resin sheet 29 that is separate from the copper foil 24 can also be used (see FIG. 7).
The bendable wiring board 2 can also be manufactured by a third manufacturing method including a substrate bonding step in which a copper-clad flexible substrate is bonded to one surface of a plate-like base material using an adhesive.

The light emitting module 51 is manufactured through a light emitting element mounting process and a bending process.
The light emitting element mounting step is a step of mounting the light emitting element 3 as an electronic component on the mounting portion 7 of the bendable wiring board 2.
The bending process is a process in which the bendable wiring board 2 is bent at the groove 6 to form a three-dimensional shape.
For example, after the light emitting element 3 is mounted on the bendable wiring board 2, the light emitting module 51 is mounted on the bendable wiring board 2 (light emitting module) with the light emitting element 3 so that the flexible circuit board portion 5 is on the outer surface side. It can be produced by bending the three-dimensional shape of a five-sided bent body and fixing the inner plate-like substrate 4 with the shape fixing member 11.
Note that the order of the light emitting element mounting process and the bending process is appropriately set in accordance with the manufacturing environment and the working environment such as other processing.
After the bend forming step, a substrate shape fixing step of providing the shape fixing member 11 on the inner surface side of the plate-like substrate 4 is performed as necessary.

As shown in FIG. 13, in manufacturing the foldable wiring board 2, it is preferable to use a plate base material 18 having a size that allows the plate-like substrate 4 to be cut out. In the illustrated example, the plate base material 18 has a rectangular shape including the plate-like substrate 4.
The method for manufacturing the light emitting module 1 includes a cutting step of cutting the plate base material 18 into a predetermined size and shape. That is, the light emitting module 1 is manufactured by a light emitting element mounting process, a bending process, and a cutting process.
The cutting process is a process of cutting the plate base material 18 by press working or the like. Specifically, this is a step of cutting off the excess portion 18 c from the rectangular plate base material 18.
The order of these processes (light emitting element mounting process, bending process, cutting process) is appropriately set according to the working environment such as an apparatus for manufacturing and other processes.

  The light emitting module 1 is capable of diffusing light over a wide range of surroundings by a configuration in which a plurality of light emitting elements 3 are mounted on each surface of a foldable wiring board 2 constituting a multi-surface (five-surface) bent body. For this reason, it can be used as a light source device in the same manner as a general light bulb, for example, by disposing it in a light-transmitting spherical cover or cylindrical cover.

FIG. 14 shows a light emitting module 61 of the fifth embodiment.
In the light emitting module 61, the groove 6 is formed on one surface 4 a of the plate-like substrate 4, and the plate-like substrate 4 is bent in the groove 6 with the one surface 4 a inside. Thus, the bendable wiring board 2 is bent and formed into a five-sided bent body with the flexible circuit board portion 5 facing the inner surface.
The shape of the bendable wiring board 2 is fixed by fixing the plate-like substrate 4 on the outer surface side with the shape fixing member 11.
In the light emitting module 61, for example, after the light emitting element 3 is mounted on the bendable wiring board 2, the bendable wiring board 2 (light emitting module) with the light emitting element 3 is arranged so that the flexible circuit board portion 5 is on the inner surface side. Then, it can be produced by bending and forming the three-dimensional shape of a five-sided bent body and fixing the outer plate-like substrate 4 with the shape fixing member 11.

In addition, this invention is not limited to the above-mentioned embodiment.
The shape of the light emitting module is not limited to that of the above-described embodiment, and can be changed as appropriate.
The light emitting module according to the present invention can realize various shapes by bending a bendable wiring board. For example, the concave plate-like bendable wiring board and the light emitting module are not limited to those having a C-shaped cross section, and may be, for example, those having a square cross section or a U-shaped cross section.
Electronic components mounted on the bendable wiring board are not limited to light emitting elements such as LEDs. A light emitting element other than an LED, for example, an LD (semiconductor laser element; LD: Laser Diode) may be employed. In addition to the light emitting element, the electronic component may be provided with an IC chip for driving control such as blinking of the light emitting element.
Moreover, it is also possible to employ a light emitting element that outputs ultraviolet light or infrared light. In this case, the light source of the device for light irradiation to a photoresponsive material such as a photocurable resin material, food, It can be widely used as a light source for medical sterilization devices, a laser light source for medical laser irradiation devices, and the like.

DESCRIPTION OF SYMBOLS 1, 31, 41, 51 ... Light emitting module, 2 ... Bendable wiring board, 3 ... Light emitting element (electronic component), 4 ... Plate-like base material, 5 ... Flexible circuit board part , 6 ... groove, 10 ... bent portion, 11 ... shape fixing member, 12, 12a, 12b ... base plate piece, 13 ... insulating resin layer, 14 ... wiring Layer, 15 ... electrode part, 16 ... plate-like part, 22 ... single-sided copper-clad flexible substrate, 23 ... plastic resin film, 24 ... copper foil, 25 ... laminated board with wiring 27 ... Copper foil with semi-cured resin layer, 28 ... Thermosetting semi-cured resin layer, 29 ... Thermosetting semi-cured resin layer, 31 ... Resin film, 32 ... Copper-clad Flexible substrate, 33 ... adhesive.

Claims (13)

A flexible circuit board portion having an electrically insulating insulating resin layer and a wiring layer is laminated so as to cover one side of the plate-like base material,
In the plate-like substrate, a groove for easily bending a part of the plate-like substrate is formed on one or both surfaces of the plate-like substrate,
The flexible circuit board portion is provided so as to extend over at least two base plate pieces out of a plurality of base plate pieces separated by the grooves of the plate-like base material,
An electrode part for mounting an electronic component is provided on the flexible circuit board part in at least two of the plate-like parts formed by laminating the flexible circuit board part on the base plate piece part,
A foldable wiring board characterized in that it can be bent into a three-dimensional shape by being bent at a position where the groove of the plate-like substrate is formed.   The resin for forming the insulating resin layer of the flexible circuit board portion is a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer. The foldable wiring board as described.   3. The plate-like base material is made of an aluminum plate or a copper plate, or a filler mixed resin in which a filler having a higher thermal conductivity than the base resin is mixed with a base resin, or a liquid crystal polymer. Bendable wiring board.   A light emitting module, wherein a light emitting element is mounted on at least two plate-like portions of the plate-like portion of the bendable wiring board according to claim 1. The bendable wiring board of the light emitting module according to claim 4 is bent at a formation position of the groove of the plate-like base material to form a three-dimensional shape,
Between the plate-like portion with the light-emitting element, which is the plate-like portion on which the light-emitting element is mounted, there is a bent portion where the bendable wiring board is bent at the position where the groove of the plate-like substrate is formed. The light emitting module according to claim 4.   6. The light emitting module according to claim 5, wherein a member for fixing the shape of the foldable wiring board is provided on the back side of the plate-like substrate.   5. The bendable wiring board has a portion that is bent at a formation position of a plurality of grooves formed in parallel to each other on the plate-like base material to form a bowl shape or a cylindrical shape. The light emitting module in any one of -6. A plurality of plates of the bendable wiring board, wherein a light emitting element is mounted on the flexible circuit board portion of the bendable wiring board according to any one of claims 1 to 3, and is divided by the grooves of the plate-like base material. A light emitting element mounting step of providing a light emitting element on at least two plate-like parts of the shape parts;
A method of manufacturing a light emitting module, comprising: a bending step of bending the bendable wiring board at a position where the groove of the plate-like base material is formed to form a three-dimensional shape.   9. The light emitting device according to claim 8, further comprising a substrate shape fixing step of providing a shape fixing member of the foldable wiring board on a back surface side of the plate-like base material and fixing the shape of the foldable wiring board. Module manufacturing method. A method for manufacturing the bendable wiring board according to any one of claims 1 to 3,
A groove forming step of forming the groove in the plate-like base material; and
A flexible substrate bonding step of bonding a single-sided copper-clad flexible substrate in which a copper foil is integrated only on one side of a thermoplastic resin film to one side of a plate-like base material by thermally welding the thermoplastic resin film; ,
After the flexible substrate bonding step, the flexible circuit is formed by patterning the copper foil to form a wiring pattern including the electrode portion, thereby using the wiring pattern as the wiring layer and the thermoplastic resin film as the insulating resin layer. And a patterning step of obtaining a laminated board with wiring in a configuration in which the substrate portion is integrated on one side of the plate-like base material, and
The flexible circuit board portion is formed on one side of the grooved plate-like base material, in which the groove is formed in the plate-like base material by performing the groove forming step, the flexible substrate joining step, and the patterning step. A method of manufacturing a foldable wiring board, comprising: obtaining the foldable wiring board having an integrated configuration. A method for manufacturing the bendable wiring board according to any one of claims 1 to 3,
A groove forming step of forming the groove in the plate-like base material; and
A curable semi-cured resin layer, which is a semi-cured curable resin layer formed on one side of the copper foil, or separated from the copper foil and the plate-like substrate base material by a semi-cured curable resin. A curable semi-cured resin sheet, which is a formed sheet, is heated and cured in a state of being sandwiched between the copper foil and a plate-like substrate base material to form a curable resin layer, and the copper foil is A flexible substrate forming process integrated with the base material of the substrate,
After the flexible substrate forming step, the flexible circuit is formed by patterning the copper foil to form a wiring pattern including the electrode portion, thereby using the wiring pattern as the wiring layer and the curable resin layer as the insulating resin layer. And a patterning step of obtaining a laminated board with wiring in a configuration in which the substrate portion is integrated on one side of the plate-like base material, and
The flexible circuit board portion is integrated on one surface of the grooved plate base material in which the groove is formed in the plate base material by performing the groove forming step, the flexible substrate forming step, and the patterning step. A method for manufacturing a bendable wiring board, comprising: obtaining the bendable wiring board having the above-described configuration. A method for manufacturing the bendable wiring board according to any one of claims 1 to 3,
A groove forming step of forming the groove in the plate-like base material; and
A substrate bonding step in which a copper-clad flexible substrate in which copper foil is integrated on one side or both sides of a resin film is bonded to one side of a plate-like base material using an adhesive;
After this substrate bonding step, by patterning a copper foil located on the opposite side of the plate-like base material through the film of the copper-clad flexible substrate, a wiring pattern including the electrode part is formed. A patterning step of obtaining a laminated board with wiring having a configuration in which the flexible circuit board portion having the wiring pattern as the wiring layer and the film as the insulating resin layer is integrated on one side of the plate-like base material; Equipped,
The flexible circuit board portion is integrated on one side of the grooved plate base material in which the groove is formed on the plate base material by performing the groove forming step, the substrate bonding step, and the patterning step. A method for manufacturing a bendable wiring board, comprising: obtaining the bendable wiring board having a configuration described above.   A resin for forming a thermoplastic resin film on a single-sided copper-clad substrate according to claim 10, a resin for forming a curable semi-cured resin layer or a curable semi-cured resin sheet according to claim 11, or a resin for a copper-clad substrate according to claim 12. The film-forming resin is a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than that of the base resin, or a liquid crystal polymer. A method of manufacturing a foldable wiring board.

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