TWI573246B - Light source module and manufacturing method of the same - Google Patents

Description

Light source module and manufacturing method thereof

The invention relates to a light source structure and a manufacturing method thereof, and in particular to a light source structure having a substrate made of a rubber material and a manufacturing method thereof.

A light-emitting diode (LED Light Bar) is used as a light source in a backlight module of a Light Emitting Diode (LED). A light-emitting diode strip is a component in which a plurality of light-emitting diodes are attached to a circuit board by surface mount technology (SMT). The light-emitting diode strip is fixed on the bottom of the back plate by screws or additional heat-dissipating tape, and a reflective sheet is attached above the light-emitting diode strip to reflect light to improve the optical efficiency of the backlight. Finally, the components such as the diaphragm and the plastic frame are assembled, which becomes a complete backlight module.

The circuit board used for the above-mentioned light-emitting diode strip can be a general printed circuit board (PCB) or a metal core board (MCPCB). The function of the circuit board is to carry the light-emitting diodes, and electrically connect the light-emitting diodes through the copper foil wires inside the circuit board. A general rigid circuit board is processed by a conventional process, that is, a conductive wire is formed on a cut circuit board by an etching process, and an insulating layer is formed on the circuit board through a printing process, wherein the wire etching process needs to be coated. Steps such as photoresist, exposure development, etching, and photoresist removal. Because the circuit board process made by the traditional process is more complicated, the guide The conventional light-emitting diode strip structure is not only complicated in processing but also takes a long time, thereby increasing the manufacturing cost. If a metal substrate having a better heat dissipation property is used, the manufacturing cost will be higher.

It is an object of the present invention to provide a light source module that uses a substrate made of a rubber material to simplify the structure of the light source module and thereby reduce manufacturing costs.

Another object of the present invention is to provide a method for fabricating a light source module, which uses a substrate made of a rubber material to simplify the manufacturing process of the light source module, thereby reducing the manufacturing cost.

To achieve the above advantages, the present invention provides a light source module including a substrate, a conductive line structure, and a plurality of light emitting elements. The substrate is made of a rubber material. The conductive circuit structure is disposed on the substrate. The plurality of light emitting elements are disposed on the substrate and electrically connected to the conductive line structure.

In an embodiment of the invention, the light source module further includes a backing plate having a bottom wall and a side wall. The side wall extends from the periphery of the bottom wall, and the side wall surrounds the accommodating space for accommodating the substrate. .

In an embodiment of the invention, the light source module further includes a reflective insulating layer covering the substrate and exposing the plurality of light emitting elements and the portion of the conductive line structure.

In an embodiment of the invention, the substrate has a plurality of hollow regions, and the hollow regions are respectively disposed between adjacent ones of the plurality of light emitting elements.

In an embodiment of the invention, the substrate is a thermal conductive film, and the adhesive material is a thermal conductive adhesive.

In an embodiment of the invention, the conductive line structure is made of silver glue.

In an embodiment of the invention, the conductive circuit structure comprises a plurality of The wire is connected to the plurality of pads, and the wires are electrically connected to the corresponding pads, and the pads are electrically connected to the corresponding light-emitting elements.

In order to achieve the above advantages, the present invention further provides a method for fabricating a light source module, comprising the steps of: providing a substrate made of a rubber material; forming a conductive circuit structure on the substrate; and providing a plurality of light emitting elements on the substrate and making these The light emitting element is electrically connected to the conductive line structure.

In an embodiment of the invention, the method for fabricating the light source module further includes the following steps: providing a backplane; attaching the substrate to the backplane.

In an embodiment of the present invention, the method for fabricating the light source module further includes the following steps: providing a backplane; and attaching the substrate to the backplane before the step of disposing the plurality of light emitting components on the substrate.

In an embodiment of the invention, the step of forming the conductive line structure on the substrate is a conductive material coating process or a conductive material printing process.

In an embodiment of the invention, the method for fabricating the light source module further includes the steps of covering the reflective insulating layer on the substrate and exposing the light emitting elements and the portion of the conductive line structure.

In another embodiment of the invention, the conductive line structure is made of silver paste.

In another embodiment of the invention, the substrate is a thermal conductive film, and the adhesive material is a thermal conductive adhesive.

In the present invention, the light source module adopts a substrate made of a rubber material, and the conductive circuit structure disposed on the substrate is completed through a coating process or a printing process, and the conductive process is completed through an etching process in a conventional manufacturing method. The line circuit structure, the light source module described in the present invention is simplified in the manufacturing method. In addition, since the substrate is made of a rubber material, the substrate itself has adhesiveness. When the substrate and the back plate are combined, the substrate can be directly bonded to the back plate, and the step of applying the adhesive colloid on the back plate is omitted, which is effective. Reduce production costs.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

1, 1a, 1b‧‧‧ light source module

10, 10b‧‧‧ substrate

11‧‧‧Electrical circuit structure

12‧‧‧Lighting elements

13‧‧‧ Backplane

14‧‧‧Reflective insulation

100‧‧‧ hollow area

111‧‧‧Wire

112‧‧‧ pads

130‧‧‧ accommodating space

131‧‧‧ bottom wall

132‧‧‧ side wall

FIG. 1 is a cross-sectional view of a light source module according to an embodiment of the invention.

2A is a top plan view of a light source module that does not cover a reflective insulating layer according to an embodiment of the invention.

2B is a top plan view of a light source module after covering a reflective insulating layer according to an embodiment of the invention.

3 is a cross-sectional view of a light source module according to another embodiment of the present invention.

4A is a cross-sectional view of a light source module according to still another embodiment of the present invention.

4B is a top plan view of a light source module that has not covered the reflective insulating layer according to still another embodiment of the present invention.

5A to 5D are schematic flow charts showing a method of fabricating the light source module shown in FIG. 1.

6A-6E are schematic flow charts of a method for fabricating the light source module shown in FIG. 3.

Please refer to FIG. 1 , which is a cross-sectional view of a light source module according to an embodiment of the present invention. As shown in FIG. 1 , the light source module 1 of the embodiment includes a substrate 10 , a conductive line structure 11 , and a plurality of light emitting elements 12 . The substrate 10 is made of a rubber material. The conductive line structure 11 is disposed on the substrate 10. The plurality of light emitting elements 12 are disposed on the substrate 10 and electrically connected to the conductive line structure 11.

Referring to FIG. 1 , the light source module 1 of the embodiment may further include a reflective insulating layer 14 . The reflective insulating layer 14 covers the substrate 10 and exposes the plurality of light emitting elements 12 And a portion of the conductive line structure 11.

In the above, the substrate 10 described in this embodiment is, for example, a thermal conductive film, and the adhesive material is, for example, a thermal conductive adhesive. The thermal conductive film is provided with a release paper and has a certain thickness, and the thickness is, for example, 0.25 mm, but the invention is not limited thereto. The material of the conductive circuit structure 11 described in this embodiment is, for example, silver paste, but the invention is not limited thereto. In addition, the plurality of light-emitting elements 12 described in this embodiment are, for example, light-emitting diodes, but the invention is not limited thereto.

2A and FIG. 2B , FIG. 2A is a top view of the light source module 1 not covering the reflective insulating layer 14 , and FIG. 2B is a top view of the light source module 1 after covering the reflective insulating layer 14 . As shown in FIG. 2A, the conductive circuit structure 11 of the light source module 1 of the present embodiment includes a wire 111 and a plurality of pads 112. The wires 111 are electrically connected to the pads 112, and the pads 112 are electrically connected. The corresponding light-emitting elements 12 are connected. As shown in FIG. 2B, when the reflective insulating layer 14 is covered on the substrate 10, the plurality of pads 112 of the conductive trace structure 11 are exposed outside the reflective insulating layer 14, and the conductive lines 111 of the conductive trace structure 11 are reflected. The insulating layer 14 is covered.

Please refer to FIG. 3 , which is a cross-sectional view of a light source module according to another embodiment of the present invention. As shown in FIG. 3, the light source module 1a of the present embodiment is similar to the light source module 1 of FIG. 1, except that the light source module 1a includes a backing plate 13. The back plate 13 has a bottom wall 131 and a side wall 132. The side wall 132 extends from the periphery of the bottom wall 131, and the side wall 132 surrounds the accommodating space 130. When the substrate 10 is assembled on the back plate 13 , the accommodating space 130 is used for accommodating the substrate 10 . Since the substrate 10 is made of a rubber material, it has adhesiveness, so that the substrate 10 can be directly attached to the bottom wall 131 of the back plate 13 for fixation. The light source module 1a having the back plate 13 can be used as, for example, a backlight in a direct type light emitting diode display device. The embodiment depicted in FIG. 3 is that the reflective insulating layer 14 covers only the substrate 13 , while in another embodiment, the reflective insulating layer 14 extends beyond the substrate 13 and covers the bottom wall 131 of the backing plate 13 .

Please refer to FIG. 4A and FIG. 4B, wherein FIG. 4A is another embodiment of the present invention. A schematic cross-sectional view of the source module 1b, and FIG. 4B is a top plan view of the light source module 1b that has not covered the reflective insulating layer 14. The light source module 1b of the present embodiment is similar to the light source module 1 of FIG. 1 except that the substrate 10b of the present embodiment has a plurality of hollow regions 100. These hollow regions 100 are respectively disposed between adjacent ones of the plurality of light-emitting elements 12 . The provision of these hollowed areas 100 can reduce the amount of substrate raw materials used and thus reduce the cost, and the hollowed out area 100 can be set according to actual needs.

Please refer to FIG. 5A to FIG. 5D , which are schematic flowcharts of the manufacturing method of the light source module 1 shown in FIG. 1 . As shown in FIG. 5A, firstly, a substrate 10 (for example, a thermal conductive film) made of a rubber material is provided, and the size of the substrate 10 can be cut according to the size of the back plate; then, as shown in FIG. 5B, the conductive material is transparent. The material coating process or the conductive material printing process forms the conductive line structure 11 on the substrate 10 to make the substrate 10 a circuit substrate; then, as shown in FIG. 5C, a plurality of light emitting elements 12 are formed on the substrate 10, for example, by forming The conductive adhesive 12 bonds the light-emitting elements 12 to the substrate 10. At the same time, the light-emitting elements 12 are electrically connected to the conductive circuit structure 11. Finally, as shown in FIG. 5D, the reflective insulating layer 14 is covered on the substrate 10 and exposed. The plurality of light-emitting elements 12 and the portion of the conductive wiring structure 11 (the exposed portions are as shown in FIG. 1 of the pads 112, and the portions of the wires 111 are covered). Through the above-described manufacturing method flow, the light source module 1 shown in FIG. 1 is completed.

Please refer to FIG. 6A to FIG. 6E , which are schematic flowcharts of the manufacturing method of the light source module 1 shown in FIG. 3 . In the flow of the manufacturing method of the embodiment, the steps shown in FIG. 6A to FIG. 6D are similar to those of FIG. 5A to FIG. 5D, and the different steps are as shown in FIG. 6E, through the adhesion of the substrate 10 made of the rubber material. The substrate 10 is attached to the backing plate 13 to complete the light source module 1a as shown in FIG. In the flow of the manufacturing method described in this embodiment, the step shown in FIG. 6C can be reversed with the step shown in FIG. 6E, that is, after the conductive line structure 11 is formed on the substrate 10 (as shown in FIG. 6B). In the step, the substrate 10 can be attached to the back plate 13 first, then the plurality of light-emitting elements 12 are formed on the substrate 10, and finally the reflective insulating layer 14 is covered on the substrate 10.

In summary, the light source module of the present invention uses a substrate made of a rubber material instead of the rigid circuit board or metal substrate used in the prior art, and the conductive circuit structure is formed on the rubber material. On the substrate, it can be done using a relatively simple coating process or printing process. Compared with the conventional manufacturing method, the conductive circuit structure needs to be completed through an etching process, and the light source module described in the present invention is simplified in the manufacturing method, and also avoids the pollution caused by the circuit board etching process. In addition, the light source module in one embodiment of the present invention uses a reflective insulating layer instead of the insulating layer which is merely used as an insulating layer, which not only has an insulating effect, but also has a light for reflecting the light emitted by the light emitting element to effectively utilize the light. , effectively reduce production costs. Furthermore, since the substrate is made of a rubber material, the substrate itself has adhesiveness. When the substrate and the back plate are combined, the substrate can be directly bonded to the back plate, and the step of applying the adhesive colloid on the back plate or the substrate is omitted. Or use the screw to lock the substrate to the backboard, which effectively reduces the manufacturing cost.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, all the simple equivalent changes and modifications made according to the claims and the contents of the specification still belong to the present invention. Within the scope of patent coverage. In addition, any of the embodiments or the claims of the present invention are not required to achieve all of the objects or advantages or features disclosed herein. In addition, the abstract and the names of the inventions are only used to assist the patent search and are not intended to limit the scope of the invention.

1‧‧‧Light source module

10‧‧‧Substrate

11‧‧‧Electrical circuit structure

12‧‧‧Lighting elements

14‧‧‧Reflective insulation

Claims (11)

A light source module comprising: a substrate made of an adhesive material; a conductive circuit structure disposed on the substrate; a plurality of light emitting elements disposed on the substrate and electrically connected to the conductive circuit structure a reflective insulating layer covering the substrate and exposing the light emitting elements and a portion of the conductive line structure; and a backing plate directly bonded to the backing plate for fixing. The light source module of claim 1, wherein the back plate has a bottom wall and a side wall extending from a periphery of the bottom wall, and the side wall surrounds an accommodating space for The substrate is housed. The light source module of claim 1, wherein the substrate has a plurality of hollow regions, and the hollow regions are respectively disposed between adjacent ones of the light emitting elements. The light source module of claim 1, wherein the substrate is a thermal conductive film, and the adhesive material is a thermal conductive adhesive. The light source module of claim 1, wherein the conductive circuit structure is made of a silver paste. The light source module of the first aspect of the invention, wherein the conductive circuit structure comprises a plurality of wires and a plurality of pads, wherein the wires are electrically connected to the corresponding ones Pads, and the pads are electrically connected to the corresponding light-emitting elements. A method for fabricating a light source module, the method comprising the steps of: providing a substrate made of an adhesive material; forming a conductive circuit structure on the substrate; providing a backing plate; directly bonding the substrate Fixing on the backplane; disposing a plurality of light emitting elements on the substrate and electrically connecting the plurality of light emitting elements to the conductive line structure; and covering a reflective insulating layer on the substrate, and exposing the light emitting elements And a portion of the conductive line structure. The method for fabricating a light source module according to claim 7, wherein the step of forming the conductive line structure on the substrate is a conductive material coating process or a conductive material printing process. The method for manufacturing a light source module according to the seventh aspect of the invention, wherein the conductive circuit structure is made of a silver paste. The method of manufacturing a light source module according to the seventh aspect of the invention, wherein the substrate is a thermal conductive film, and the adhesive material is a thermal conductive adhesive. A method for fabricating a light source module, the method comprising the steps of: providing a substrate made of an adhesive material; forming a conductive circuit structure on the substrate; and providing a plurality of light emitting elements on the substrate Having the plurality of light emitting elements and the conductive line The circuit structure is electrically connected; covering a reflective insulating layer on the substrate, and exposing the light-emitting elements and a portion of the conductive circuit structure; providing a back plate; and directly bonding the substrate to the back plate for fixing.