TW201017045A - High-performance heat dissipation device and method for manufacturing the same - Google Patents

Abstract

A high-performance heat dissipation device, comprising a flexible circuit board which is a flexible high-thermal conductive and electric insulation material layer made of macromolecule material mixed with heat conduction powder, with a high electric conductive metal foil equipped on its top surface that is treated with exposure and etching processes to form an electric conductive layer with suitable circuit patterns, on which electronic elements that generate heat such as LED chips are soldered. A thermal conductive adhesive layer can be equipped on the bottom side of the insulation material layer so as to provide self-adhering feature. By the self-adhering property and flexible property of the insulation material layer, the flexible circuit board can be tightly adhered to a heat dissipation device by which heat from heat generating components is transferred to the heat dissipation device efficiently and then dissipated to ambience.

Description

201017045 VI. Description of the Invention: [Technical Field] The present invention relates to a high-efficiency heat dissipating device having a good heat dissipating effect, particularly relating to a high-performance energy comprising a conductive layer and a high thermal conductivity and high insulating layer. A high-efficiency heat sink for the heat-dissipating substrate to provide efficient heat dissipation of electronic components and devices. The present invention also provides a method of manufacturing the high efficiency heat sink. b [prior art]

As the electronic chip continues to become high-performance, high-speed, and light and thin, the heat generation of electronic components and the relative heat flow (HeatFlux) are getting higher and higher. The heat issue has become the primary problem that the electronics industry has overcome. In practice, the heat dissipation of electronic components is often carried out by using a heat convection, a high surface area heat sink or a heat sink (Heat Fin), and the heat is mounted on the heat by using the 3 device. The component or electricity is "set", and the heat generated by the electronic component can be diverged to the outside by the scaly > 1. However, based on the process, the surface of the spread or fin # is flattened, f When it is assembled in a surface contact manner with a hot electronic component, the two are connected to each other. There is a gap in the surface of the surface, and the presence of the gap will be the result of the large amount of silk, because it exists in the =2 gap (10). The heat conducting wire of air is about 1 (r4 w/mK, usually regarded as the basin f μ, which carries the filament of the scale element, such as a metal substrate, and the surface will be surface treated 'but the surface is flat The sand is expected to be the same as the other ones. Therefore, it will constitute another obstacle in the heat dissipation process. The heat of the ^, the troubles of the prior art is in the heating body (such as hair, ',, and everything) and Thermally conductive medium filled with heat-dissipating fins 3 201017045 (Thermal Int Erface Material) 'For example, heat-conducting axe, thermal conductive raft, etc., although the thermal conductive material can achieve the purpose of void filling, but the thermal paste (or thermal adhesive) will shrink and shrink due to low temperature, and will evaporate due to high temperature' To meet the requirements of product durability. Furthermore, factors such as the tightness of the assembly process and the thickness of the heat transfer medium material can also cause difficulties in use and performance.

❹ The first example of the heat dissipation structure and its application are shown in Figure 1. Taking Light-Emitting Diode (LED) illumination as an example, the LED crystal is used to generate illumination after the LED is used, but when the LED chip is powered on. 'At the same time, it will emit a lot of heat. The LED chip 1 is mounted on a substrate 1〇2. The substrate contains a metal

=1, on the bottom of the heat-conducting material of Wei Zengwei, the insulating heat-conducting thermal material base is composed of a layer of insulating and thermal conductive layers (10) and (10) (for example, organic insulating conductive materials). The metal (10) is formed into a line by a known process such as exposure and side known processes, and (iv) the sheet 100 is subsequently attached thereto in an appropriate manner. A ♦ Gold on the 102 is usually green or copper or its alloy, which has good electrical conductivity for supplying electricity to the LED chip.

The same metal material also has good heat transfer performance f. For example, the thermal conductivity of the shoe is about 220W/Mk, and the heat conduction wire of the copper material is about 38〇w/mK = 〇 = 〇 heat generated to the metal. Insulation below the outline refers to Figure 2, in use, this installation of 1〇2 will be additionally installed on the surface of the radiator, so that the surface of the heat device m is in surface contact, * , hand = age or then, read and distribute to the outer ring axis. For example, the former household material fine G8 practice recording _ heat conduction material material U2 ‘such as thermal paste, the base _2 attached to the group of heat sinks, ^ 201017045 reduce the heat transfer impedance between the substrate 102 and the heat sink 110. After applying power to the LED wafer 100 via the line formed by the metal box 104, the LED chip 100 begins to emit light while generating heat, and the heat is transferred outwards, particularly through the heat conductive medium material 112 to the heat sink. The inner portion is dissipated into the external environment via the heat dissipation fins 116 generally disposed on the heat sink 110 to achieve heat dissipation. Although the surface of the structure described above can solve the heat dissipation of the heating element, there are still many problems to be overcome, such as: ...

(1) Insufficient heat dissipation. The conventional substrate 1A shown in Figs. 1 and 2 includes two insulating heat conductive layers 106 and 108. Taking an organic insulating heat conductive material as an example, these insulating heat conductive layers 106, 108 are usually made of an organic polymer material, which is mixed with a heat conducting medium to provide heat conducting properties. However, the thermal conductivity of the insulating and thermally conductive materials produced by this method mostly falls between 1W/mK and 7|/1111 (:, far less than the 220W/mK of aluminum and 380W/mK of copper, so it will increase seriously. The heat transfer is impeded, not to mention the fact that there are two layers of the paving material in the base 2, so there are three thermal obstacles in the teaching transfer process, which greatly reduces the heat conduction effect. (2) The surface of the substrate and the heat sink is not Flatness: the surface of the insulating and thermally conductive layer 108 of the substrate 1G2 and the surface of the heat sink 110 of the heat sink 110 due to processing errors and fineness, although the surface of the heat sink 110 is flat, but at an angle Both surfaces have high and low undulations. The relatively uneven substrate 1G2 and heat dissipation 11110 are hard structures. Therefore, when the two surfaces are in surface contact, voids are formed and the heat conduction effect is reduced. 66# ^ 1 Although products (such as LED street lamps) When the area becomes larger, the two hard and good parallel heat conducting layers will be more trapped in the middle and will be better, and the thicker heat conductive material (such as thermal conductive glue) on the crucible will be worse. Therefore, the shape = ^ glue, such as _ dielectric material, the thicker the mixed effect (3) another The problem is that the above method can not be applied to non-planar 5 201017045 or even = a lot of need to have heat dissipation _ is non-planar, there is no solution = _ product can not cope with the method, so make up The number of thermal conductivity layers is reduced in the direction of the interface text [invention]

The method, the preparation method [there is a need to have a practical application to provide - the species and the main purpose of the invention is to have a view of the 7: it provides i high-efficiency heat sink device, including a soft high guide a soft layer made of a material mixed with a heat conductive powder, which can be made into a conductive circuit having a suitable circuit trace

Filling in the feasibility improvement of the 'two = adhesive characteristics' borrowed - the characteristics of the flexible layer of the insulating material can be closely attached to a heat sink, by ==== the heat of the electronic component is transferred to the heat sink In addition, another aspect of the invention is that it provides a high-performance heat-dissipating device. The main steps are to first prepare a high-thermal-conducting flexible circuit board. The f-type circuit board is made of a highly thermally conductive insulating layer. - high-conductivity metal treatment, and into the metal processing, such as exposure and side, can form a suitable circuit, the circuit: can be used to solder the heating electronic components, the material of the insulating layer can be suitable a soft polymer material having a thermal conductivity of from 1 w/mK to 7 W/mK and which may be subjected to (four) side damage by a metal line, and the method of the present invention further comprises on the opposite side of the insulating layer from the metal foil Set the heat conduction 201017045 to clearly bind the soft circuit to the heat sink: _ layer of the nature of the record and the law, the following is a fine example of the financial transfer out of several examples to explain = send [implementation]

The present invention relates to a high-performance heat sink, and a high-performance heat sink is applied to an electronic component that generates heat f, such as a device, which is removed by high efficiency. Iii. The high-performance heat-dissipation of the present invention is structurally made -

;^), 敎H2G (y is used as a substrate (hereinafter also referred to as a flexible substrate) for removing heat from a heating element 202, such as an LED f, mounted thereon, as shown in the figure. In the preferred embodiment of the present invention, the high conductivity 含有 含有 includes a conductive layer 204 and a high thermal conductivity high insulating material ΐ 2. The electrical layer 2 〇 4 is composed of a metal book having high conductivity, for example =Pool or (4) 'The bottom of the county is combined with the layer of high thermal conductivity and high insulation material' and the metal enamel can be moderately reinforced, for example, by light exposure and = engraving, to form the desired conductive line to do The heat generating body 2〇2 (i.e., the LED chip in this embodiment) is soldered thereto. In the preferred embodiment, the thickness of the metal case used to form the conductive layer 204 is about 3 divisions to 14 inches. In the present embodiment, the high thermal conductive high insulating material layer 2〇6 is mixed with a highly conductive organic polymer substrate into a powder having high thermal conductivity, such as alumina, boron nitride, etc., through a general The mixing technology combines the thermal conductive powder with the polymer substrate to form the high thermal conductive high insulating material layer 2〇6 And the thermally conductive powder can form a good guide in the high thermal conductive high-insulation material layer 2〇6, 201017045. In the preferred embodiment, the polymer substrate can be selected from a high temperature All-aromatic polymer materials, aromatic fatty surface polymer materials, or copolymers containing aromatic structures, and the ethnic group in the group 'EpGxy, Miao Likang, and force type (cut 1 (6) , polyurethane type (bee _

In addition, the selection of the molecular substrate must have the physical and chemical properties that can withstand the above-mentioned processing processes for gold, and the process, that is, the polymer substrate must be able to withstand the physical and chemical properties caused by the processing of the metal foil. Maintain the desired properties after breaking the box. Grinding in metal In addition, according to an embodiment of the present invention, the thermally conductive powder mixed in the polymer substrate may be various oxides (such as yttrium oxide, oxidized, etc.), nitride particles (nitriding Ming A1N3) , nitriding BN, etc.), carbide (graphite, carbon black, carbon tube, carbon fiber, niobium carbide), and metal particles, etc., may also contain oxide or nitride particles made by Sd_Gel (4). In an embodiment of the present invention, the particle size of the thermally conductive powder is from Ο.ΟΙμπι to ΙΟΟμπι ′ and its shape is not limited, and may be planar, or the like. > In addition, the thermal conductive high-insulation material layer 206 is bonded to the bottom surface of the conductive layer 2〇4, and may be any known suitable method. For example, the liquid material of the high thermal conductive high-insulating material layer 206 can be directly molded on the bottom surface of the metal foil of the conductive layer 2〇4 by, for example, a coating method, a solution casting method, or a screen printing method. Alternatively, the raw material of the high thermal conductive high insulating material layer 206 may be first formed into a thermoplastic film, and the hot plastic film may be bonded to the bottom surface of the metal foil by a high temperature and high pressure process. Of course, the practice of the present invention is not limited to the foregoing materials and processes, and other equivalent materials or processes that can achieve the effects of the present invention can be applied. If necessary, another layer of high-insulation material (not shown) may be added to the bottom surface 201017045 of the conductive layer 204 by using the foregoing method or material. The other high-insulation material layer may be formed by the foregoing polymer material. Various processes are formed on the bottom surface of the conductive layer 204. For example, another layer of high insulating material may be formed on the bottom surface of the high thermal conductive high insulating material layer 206. The other layer of high insulating material may be mixed with a polymer substrate by other functional materials, such as electromagnetic wave materials or particles or powder thereof, or the other high insulating material layer may be mixed or made of a suitable material to enhance heat. Pass performance. According to another embodiment of the present invention, the high thermal conductive flexible circuit board 2 further includes a thermal conductive adhesive layer 208 coated on the high thermal conductive high insulating material layer 20 (or the other high insulating material layer as described above). The side opposite to the conductive layer 204, that is, the side of the high thermal conductive high insulating material layer 206 on which the wiring formed of the metal foil (ie, the conductive layer 204) is not disposed, so that the conductive layer 2〇4 and the heat conduction The glue layers 208 are respectively located on the top side and the bottom side surfaces of the high thermal conductive high insulating material layer 2〇6. The f-thermal adhesive layer 208 can provide the adhesion of the high thermal conductive flexible wiring board 200 for easily attaching the high thermal conductive flexible wiring board 200 to the heat dissipating fins or other heat sinks 210 (see Fig. 4). According to a preferred embodiment of the present invention, the thermal conductive adhesive layer 208 can be made of a thermal Sensitive Adhesive (hereinafter referred to as a pressure sensitive adhesive, glue) which can be adhesive under application of an external force. Alternatively, it may be made of a curable thermal conductive adhesive (hereinafter referred to as a curable thermal conductive adhesive) which can be produced by curing after heating. Of course, the invention is not limited to these examples of adhesives. According to still another embodiment of the present invention, in the case where the pressure sensitive thermal conductive adhesive is used as the thermal conductive adhesive layer 208, or in other suitable applications, the adhesive surface exposed on the thermal conductive adhesive layer 2〇8 can be attached. A release paper or release film 212 is attached. The release film 212 can be easily peeled off from the guide scale layer for bonding the adhesive layer 2 to 8 to the heat sink 2io, and at the same time, the heat conductive adhesive layer can be protected when not peeled off. The outer surface is protected from dirt or accidental adhesion to other objects. In this way, it facilitates the transportation, storage, and use of the high thermal conductivity flexible circuit board. 201017045 According to a preferred embodiment of the present invention, in the case where the pressure sensitive thermal adhesive is made into the conductive layer 208, the pressure sensitive adhesive may be epoxy type, erect, acrylic type, polyurethane type, or A hybrid type of these gums. By the soft features of the high thermal conductive flexible circuit board 2 of the present invention, the high-definition female line of the present invention is closely combined, and the micro-chip 210 of the mx-newer is tightly combined to substantially eliminate or completely eliminate the conventional substrate and The gap in the contact area between the two sides can effectively improve the heat conduction effect, and the area of the cymbal is too large, and the unevenness is the slope. Based on the characteristics of softness, ^ ginseng

The invented high thermal conductivity flexible circuit board 200 can perfectly combine the heat conduction efficiency to improve the thermal conduction path. The main method of the method for manufacturing the high-performance recording wire of the present invention is to prepare a flexible substrate with high thermal conductivity, that is, a high-flexible circuit board, and then use a conventional transparent optical circuit to process a high thermal conductive flexible circuit. The lion's conductive layer 2G4 is made of gold on the required line or circuit. After the missing electronic parts or heating element 2G2 (such as LED die) is soldered to the conductive ΐ ίίΜ1 'finally turn the guide 208 (such as If necessary, it can be peeled off and the release type = 12) combined with the heat sink 21 () to complete the hybrid. The following will be explained: Less JLl is made for high thermal conductivity; ^ First, a highly thermally conductive flexible substrate 200 is prepared, which comprises a conductive layer 204 and a high conductivity layer. The electrical layer 204 is mainly composed of a highly conductive metal. i high thermal conductivity and high insulation material (4) 2G6 is high insulation and ί mixed with hot powder (such as oxygen brain, boron nitride, etc.), the ϋϊΓ 练 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It can be (for example, the top surface), and its combination method, the field method is the same. For example, the liquid raw material ' of the high thermal conductive high insulating material layer 201017045 206 can be directly molded on the bottom surface of the metal foil of the conductive layer 204 by, for example, a coating method, a solution casting method, a screen printing method, or the like. Alternatively, the raw material of the high thermal conductive high insulating material layer 206 may be made into a thermoplastic mold, and the hot plastic film may be bonded to the bottom surface of the metal foil by a high temperature and high pressure process. In the preferred embodiment of the present invention, the polymer substrate may be a high-strength, σ-resistant polymer material selected from the group consisting of wholly aromatic polymer materials, aromatic fats: material group polymers ( Ar〇mati〇 materials, or groups containing aromatic "materials" also include epoxy resin, silicone, acrylic (Acr > iic), and polyamine (type) Polyurethane) and other polymer materials. It is better to use it to spray, and to conduct heat-conducting f H oxides in the polymer substrate (such as oxidized stone _ _, zinc oxide age fog, cockroach = nitrite Fine 3, boron nitride bn, etc., carbide (graphite black, crucible, carbon fiber, niobium carbide), and metal ribs, : package: =rrs - prepared == chemical = 〇〇ΐμίΐϋ f shot, The age of the antipyretic powder is from the same. Handsome and its shape is unlimited, it can be flat, fibrous and suitable metal box, with the knives processing caused by the same knife material must be able to withstand Metal box glue) with rubber or cured thermal conductive glue or other thermal conduction 204 opposite thermal conductivity and high insulation The material layer 206 is on the conductive layer (such as the bottom surface) to form the thermal conductive adhesive layer 208, 201017045. The field can be any known suitable process, for example, in the form of 'coating ϊ=^=Π4ί2()6 The bottom surface is provided with a detachable film 208. Optionally, a release film is attached to the thermal conductive adhesive layer 208 for protecting the thermal conductive adhesive layer 208. In a preferred embodiment of the present invention, the thermal conductive adhesive layer Movable =, teaching Kang type, acrylic type, polyurethane type, or a mixture of the above-mentioned glues 4, assembly application, such as coffee wafers, soldered to the above high thermal conductive flexible circuit layer 204, and high thermal conductivity soft lines The self-adhesive heat-conducting surface of the board (ie, the guiding layer (10))_to-m-n, the metal substrate taken from the high thermal conductive flexible circuit board prepared by the age of 1 combined gamma t is set to the side of the heating element On the top, it takes the softness of the soft board to be closely combined with the heat test, and its advantages include a layer of money to guide the ship, which is also effective in reducing costs compared with the conventional structure of 0 (five). "With thermal conductivity" fat iL) people use, the softness of the circuit board, can be more effective and heat The device is close to, σ σ, regardless of the area of the heat sink, or its surface = 2, Ϊ Ϊΐ Ϊΐ 是 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜 斜On the top, it can effectively improve the heat conduction path. Non-planar high thermal conductivity flexible circuit boards can be used according to the actual needs, and the following will be more detailed _ this (four) is that these classes are only Xiao Lai _ this hair green _ The sub-party is used to limit the scope of the invention. It is not 12 201017045 Example 1 PolyamicAcid is added, 70% of Ιμπι alumina powder is added, and after proper mixing, a highly thermally conductive polymer is prepared.醯imino acid glue' then apply the glue to 1 ounce (35μπ〇 metal foil (in this example, steel foil) to remove the solvent after baking at a high temperature of 350 ° C, while simultaneously brewing the imine The acid structure will be further dehydrated to form a highly thermally conductive polyimine polymer (Polyimide, PI)' to complete the fabrication of a highly thermally conductive flexible copper foil substrate. The polyamido acid solution used in this example is a reaction of a bis-anhydride and a bisamine in a strong polar solvent. This reaction is a conventional polymerization reaction. For a detailed description of the polymerization process, reference is made to the techniques disclosed in U.S. Patent Nos. 5,152,947 and 4,473,523. Dry film photoresist (such as Changchun AF-5000 series) is attached to the metal foil layer of the high thermal conductive flexible circuit board by a laminating machine, and the residual process is completed by using an exposure machine and a vaporized lanthanide etching solution. After ll 〇 ° C drying for 1 〇 minutes, stand by. The pressure sensitive thermal adhesive is coated on a wireless road surface, baked at 200 ° C for 30 minutes, and then finished to form a thermal conductive adhesive layer, and combined with the release film to complete the self-adhesive property of 0. The white LED chip is soldered or Appropriate adhesive technology is fixed on the conductive line of the etched climbing, and then the release paper on the self-adhesive surface is torn off for adhesion to the heat sink to complete the manufacture of the LED light-emitting element with thermal conductivity. In the second example, the Thermoplastic piazide acid solution (Therm〇piastic p〇iyamic Acid) was used to add 70% Ιμϊη oxidized powder. After proper mixing, a highly thermally conductive thermoplastic polyimide glue was prepared. Then, the glue is coated on a suitable carrier, such as a glass or stainless steel plate (wheel), and baked at a high temperature of 35 〇〇c to form a thermoplastic polyimine polymer (p). ^ 13 201017045 In this example, the preparation of a thermoplastic polyisic acid solution is also carried out by reacting both hepatic and diamine raw materials in a strong polar solvent. Here we can use a conventional chemical structure. Thermoplastic polyimine polymer materials, a detailed polymerization process similar to the reaction can be referred to Kaneka's thermoplastic polyimine TPI (Thermoplastic Polyimide, US Patent 5,621,068). The above thermoplastic polyimide film was laminated with a 1 ounce (35 μm) copper foil at a high temperature of 350 ° C to complete the production of a highly thermally conductive flexible copper foil substrate. Other subsequent line remnants, self-adhesiveness, and assembly applications, along with examples, are not described again. In the third example, a thermoplastic polyacrylic acid solution was added, and 7% by weight of 1 μm of alumina powder was added. After appropriate mixing, a highly thermally conductive thermoplastic polyimine glue was prepared, and the glue was coated thereon. A suitable carrier, such as a glass or stainless steel plate, is baked at a high temperature of 350 ° C to form a highly thermally conductive thermoplastic polyimine high (TPI) film. The above thermoplastic polyimine polymer film is laminated with two sheets of 丨 ounce (35 = m) copper foil, and the above thermoplastic polyimide film is laminated at a high temperature of 350 ° C. In combination, the fabrication of a highly thermally conductive flexible copper foil substrate is completed. In this example, a structure of a copper foil on one side of the aluminum foil can also be fabricated. In this structure, one side of the metal foil (copper foil or aluminum foil) is used to make the wiring, and the other side of the metal foil (copper foil or aluminum foil) is used to increase the efficiency of heat conduction. Dry film photoresist (such as Changchun's Αρ·_5 〇〇〇) is coated on a metal foil used as a line on a high thermal conductive flexible circuit board with a laminator, with an exposure machine and a lanthanum chloride etchant. The etching process is completed, and the cleaning is completed after drying for 1 minute: and before the etching step, the metal foil on the other side is to be adhered with the appropriate glue or photoresist, and removed after the end of the money. 201017045 Applying a pressure sensitive thermal paste to the metal of the other side of the wireless road for 30 minutes, knot, 'and mix with the release type, complete the rotation of such a method of mechanical composites · structure, _ scales The guide is far less than metal, so such practices will help heat dissipation in subsequent applications. The white LED chip is used to remove the release paper on the self-adhesive surface and is combined with the heat sink to complete the manufacture of the LED light-emitting element with high thermal conductivity. 70% - Example 4 Ο

According to the first example, the fabrication of the high thermal conductive flexible copper foil substrate is first completed. Then use the pressing female to dry the resistance (such as Changchun's .5_ phantom paste on the metal box layer of this high thermal conductive flexible circuit board, with the exposure machine and gasification iron-based residual liquid to complete the etching process, after cleaning (7) ^^ After drying for 1 minute, it is ready for use. 7. The white LED chip is fixed on the etched conductive line by soldering or appropriate adhesion technology; then the commercially obtained cured heat conductive adhesive is evenly coated on the soft thermal conductive board. Or on the heat sink, after the combination of the two, the curing is completed under appropriate conditions. (Refer to the curing information provided by the curing type thermal conductive adhesive manufacturer.) Finish the manufacture of LED light-emitting elements with high thermal conductivity. The description of the manufacturing process of the present invention is intended to be illustrative of the technical content of the present invention and the preferred embodiments of the present invention are not intended to limit the scope of the present invention. Furthermore, equivalent substitutions and modifications to the methods, ratios, materials, and the like of the present invention are intended to be within the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view schematically showing a conventional heat dissipating substrate structure. Fig. 2 is a cross-sectional view schematically showing a conventional heat dissipating substrate bonded to a heat sink. 15 201017045 3 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 4 is a cross-sectional view schematically showing the structure of a highly thermally conductive flexible circuit board of the present invention. Fig. 4 is a cross-sectional view schematically showing the bonding of a highly thermally conductive flexible circuit board of the present invention to a heat sink. Component symbol description] 100 LED wafer 102 substrate 104 metal foil 106 insulation thermal layer ❹ 108 insulation thermal layer 110 heat sink 112 thermal medium material 116 heat sink 200 200 high thermal conductivity flexible circuit board 202 heating element 204 conductive layer 206 high thermal conductivity high insulation material Layer 208 thermal conductive layer 〇 210 heat sink U 212 release film 16

Claims (1)

201017045 VII. Patent application scope: L A high-performance heat dissipating device, including: high score; the guiding system is made of high-insulation soft mixing technology to make the hot powder 'use=conducting ^^, the high thermal conductivity and high insulating material layer has - Top surface and bottom * Dao 2 m ' is made of high-conductivity metal, bonded to the top surface of the hot south insulating material layer, and is cured to form a conductive wire, which is thermally conductive with a high insulating material layer. The bottom surface can be coupled to a heat sink to which the electronic component can be coupled to provide electrical conductivity to the electronic component and to generate heat from the electronic component. The heat transfer path in the conductive layer and the high thermal conductive high insulating material layer is transferred to the heat sink. 2·= The high-performance heat sink according to claim 1, wherein the highly conductive metal foil used to form the conductive layer is copper foil. 3. The high performance heat sink according to claim 1, wherein the highly conductive metal foil used to form the conductive layer is an aluminum foil. 4. The high performance heat sink of claim 1, wherein the two conductive metal foils of the conductive layer have a thickness of from 3 μm to 140 μm. 5·=Application of the high-performance heat dissipating device described in the first paragraph of the patent scope, wherein the high-knive material is a temperature-resistant material selected from the group consisting of a wholly aromatic polymer material, an aromatic aliphatic polymer material, and a fragrance. A group of a group of polymeric materials or copolymeric materials containing aromatic structures. 6. The high-performance heat dissipating device according to claim 1, wherein the polymer material is selected from the group consisting of an epoxy resin system, a 矽立康系, a 'press type, a polyurethane type and the like. Ethnic group. The high-performance heat dissipating device of claim 1, wherein the high thermal conductive powder comprises a group selected from the group consisting of oxide particles, nitride particles, carbides, and metal particles. 8. The high performance heat sink of claim 1, wherein the high thermal conductivity powder comprises oxide or nitride particles prepared by a gel process. 9. The high performance heat dissipating device according to claim 1, wherein the high thermal conductive powder comprises particles having an unlimited size from Ο.ΟΙμιη to ΙΟΟμηη. The high performance heat dissipating device described in claim 1 further comprises a further thermally conductive metal foil disposed on the bottom surface of the layer of high thermal conductivity and high insulating material. 1L = The high performance heat sink of claim 1 further comprising a thermally conductive adhesive layer disposed on the bottom surface of the high thermal conductive high insulating material layer for adhesion to the heat sink. 12. The high performance heat dissipating device of claim 11, wherein the thermal adhesive layer is made of a pressure sensitive thermal adhesive. 13· ^Please apply the high-performance loose filament according to the 12th item, further comprising: a release film which is detachably attached to the conductive layer made of the pressure sensitive thermal adhesive for the purpose of The high-performance heat dissipating device is not bonded to the heat sink to protect the thermal conductive adhesive layer, and after being peeled off, the sensing layer is exposed for bonding to the heat sink. ”, 14. 15. 16. Face earning, in which the high-performance heat sink described in item H) of the patent is required, further including the other side: the heat conductive metal box and the high thermal conductivity such as the patent application scope The high-performance heat dissipating device according to Item 15, wherein the hot melt adhesive layer of the 201017045 is made of a pressure sensitive thermal conductive adhesive, and a release film is detachably attached to the thermal conductive adhesive layer for the high temperature. The thermal dissipating device protects the thermal adhesive layer before being bonded to the heat sink, and after being peeled off, the thermal adhesive layer is exposed for bonding to the heat sink. 17. 17. As claimed in the fifteenth item The high-performance heat dissipating device, wherein the thermal conductive adhesive layer is made of a curable thermal conductive adhesive. The high-performance heat dissipating device according to the above, wherein the high thermal conductive insulating material is The layer includes at least one thermally conductive layer and optionally a second layer comprising other functional materials. 19. The high performance heat sink of claim 18, wherein the second layer of the high thermal conductivity high insulating material has an anti-electromagnetic wave function. 20. The high performance heat sink of claim 18, wherein the second layer of the high thermal conductivity high insulating material has the function of increasing thermal conductivity. The high-performance heat dissipating device according to claim 12, wherein the pressure-sensitive heat conduction is selected from the group consisting of epoxy resin type, erikoprene type, acrylic type, polyurethane type or the like. Ethnic group. 2 The high-performance heat dissipating device described in Patent No. 16, wherein the pressure-sensing_ is selected from the group consisting of epoxy resin type, Shixia Likang type, acrylic type, polyurethane type, or the like. Ethnic group. The invention relates to a method for manufacturing a heat dissipation device, comprising the following steps: Eight-layer high-thermal conductive flexible circuit board: comprising a conductive layer on top surface of a layer of thermal high-insulation material, and the high thermal conductivity and high-insulation Α 4 Λ// The opposite side surface of the conductive layer forms the high-conductivity softness ίΪΪΪίί 'the electrical layer is a high-conducting gold material, and the high-conducting layer material has a high _ (four) polymer material mixed with high thermal conductivity powder = refining The technology allows the thermally conductive powder to combine with the polymer material to form a good heat conduction path therein; 21. 22. 23. 201017045 The line is turned off: the towel system will cover the light and block the light to cover the household; In conjunction with the exposure and _ conditions of the mask and the _ condition, the ancient 4th line of the ancient keel will be coated on the underside of the t-soft flexible circuit board to provide adhesive characteristics; Domain application: in which a heating element is fixed on the conductive layer: ί ' and the scale layer of the high thermal conductive flexible circuit board is viscous with its adhesive properties - residual red. W. The manufacturer of the high-performance heat sink described in Item 23 of the patent, 2 W ', in which the highly conductive gold used to make the conductive layer is the bronze pavilion.制造 Ϊ Ϊ Ϊ Ϊ Ϊ Ϊ Ϊ Ϊ 之 之 之 之 之 之 。 之 。 。 。 。 。 。 。 。 。 。 。 高性能 高性能 。 高性能 高性能 高性能 高性能 高性能 高性能26· t The manufacturer of the high-performance heat sink described in item 23 of the patent application scope is 〇μ〇. The high-conductivity metal foil of the conductive layer has a thickness of 3 至 至 至 至 ^ 申请 之 之 之 之 , , , , , , , , , , , , , , , , , , , , , , , , , , It includes a group of all kinds of polymer materials, aromatic polymer materials, (four) family polymer materials, or copolymer materials containing aromatic structures. 28·=Application of the high-performance heat dissipating device described in Item 23 of the patent application, wherein the polymer material is selected from the group consisting of epoxy resin, Shi Xi Li, acrylic, and polyurethane. Within the ethnic group. The manufacturing method of the high-performance heat dissipating device described in claim 23, wherein the high thermal conductive powder comprises a group selected from the group consisting of oxide granule particles, carbides and metal particles. The method of high performance heat sink according to claim 23, wherein the high thermal conductivity powder comprises an oxide 戋 20 201017045 nitride particle prepared by a gel process. The method of manufacturing a high-performance heat sink according to claim 23, wherein the high thermal conductive powder comprises particles having a size ranging from Ο.ΟΙμιη to 1〇〇μηη. 32. The method of manufacturing a high performance heat sink according to claim 23, wherein the high thermal conductivity high insulating material layer is directly formed by a coating method, a solution casting method, and a screen printing method. On the metal foil. 33. The method for manufacturing a high performance heat sink according to claim 23, wherein the high thermal conductivity high insulating material layer is formed into a highly thermally conductive ❿ thermoplastic film, and then combined by high temperature pressing. To the metal crucible. 34. The method of manufacturing a high performance heat sink according to claim 23, wherein the step (1) includes disposing a further thermally conductive metal foil in the layer of high thermal conductivity high insulating material and the conductive The opposite side surface of the layer is such that the other thermally conductive metal layer constitutes the bottom surface of the highly thermally conductive flexible wiring board. 35. The high-performance heat-dissipating device according to claim 23, wherein the step (3) further comprises attaching a release film to the thermal conductive adhesive in a peelable manner. a step of the layer, the release film is used to protect the thermal adhesive layer before the horse performance heat dissipating device is not bonded to the heat sink, and after the tear away, the thermal adhesive layer is exposed for bonding On the radiator. The method of claim 12, wherein the layer of high thermal conductivity and high insulating material comprises at least one layer, and optionally includes a second layer containing other functional materials. 37. 37. The high performance void J described in claim 36, wherein the second layer of the high thermal conductivity high insulating material has an anti-= 21 201017045 38. The manufacturer of the device has increased thermal conductivity as an application The high-performance heat-dissipation method described in claim 36 of the patents, wherein the second layer of the high-thermal-conductivity high-insulation material functions. ... = * month and the manufacturer of the hot-selling system. The high-performance heat-dissipating method described in Item 23 of the above-mentioned article, which is made of pressure-sensitive adhesive. The high-performance heat-dissipating heat-dissipating device described in item 39 of the patent scope is selected from the group consisting of epoxy tree (four), stone Ξ i i, acrylic type, polyurethane type, or the like. Ethnic group. 41. The invention relates to the high-performance heat sink method described in claim 23, wherein the heat conductive adhesive layer is made of a cured heat conductive adhesive. 42. Before the manufacturing step (2) of the high-performance heat sink described in item 34 of the Shenyuan Garden, the step further includes protecting the other 4: genus by a suitable film or photoresist. step. The manufacturing method of the high-performance heat dissipating device described in the item is included in the film or the photo-injection step.