CN113534525B - Vehicle-mounted LED high-brightness backlight source - Google Patents
Vehicle-mounted LED high-brightness backlight source Download PDFInfo
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- CN113534525B CN113534525B CN202110773495.1A CN202110773495A CN113534525B CN 113534525 B CN113534525 B CN 113534525B CN 202110773495 A CN202110773495 A CN 202110773495A CN 113534525 B CN113534525 B CN 113534525B
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Abstract
The application relates to the technical field of LED backlight sources, in particular to a vehicle-mounted LED high-brightness backlight source. The vehicle-mounted LED high-brightness backlight source comprises a high-heat-dissipation backlight plate, a reflecting film and LED lamps, wherein the LED lamps are fixedly connected to the high-heat-dissipation backlight plate in a dot matrix mode; the bottom of the LED lamp is integrally provided with a metal heat conducting plate; the metal heat-conducting plate is fixedly connected with an insulating high-heat-conducting adhesive layer; the surface of the insulating high-heat-conductivity adhesive layer, which is opposite to the metal heat-conducting plate, is fixedly connected to the upper surface of the high-heat-dissipation backlight plate; the reflecting film is fixedly connected to the upper surface of the high-heat-dissipation backlight plate. The vehicle-mounted backlight source has good heat dissipation performance, can avoid local heat aggregation of the backlight plate, and improves the reliability of the vehicle-mounted backlight source and prolongs the service life of the vehicle-mounted backlight source.
Description
Technical Field
The application relates to the technical field of LED backlight sources, in particular to a vehicle-mounted LED high-brightness backlight source.
Background
The backlight is an optical component in the LCD display product, and its quality determines important parameters such as brightness, uniformity, and color level of the LCD display, so that the quality of the backlight determines the display effect of the LCD display. With the widespread use of liquid crystal displays, the application range of backlight is extended to industrial equipment, banking terminals, office automation, communication, electronic toys, and the like.
The vehicle-mounted backlight source is an optical component for providing a backlight source for the vehicle-mounted display screen, and the vehicle-mounted backlight source product has relatively high requirements on brightness due to the influence of driving conditions of an automobile. In order to meet the brightness requirement of the vehicle-mounted backlight source, the current conventional means for improving the brightness of the vehicle-mounted display screen comprises the steps of increasing the number of LED lamps in the backlight source or increasing the use current of the LED lamps.
Referring to fig. 1, a vehicle-mounted backlight in the related art includes a backlight plate 9 and an LED lamp 100, the backlight plate 9 is a PCB made of FR-4 material, the LED lamp 100 is fixedly connected to the upper surface of the backlight plate 9, the LED lamp 100 and pins are welded on a printed circuit board of the backlight plate 9, and the LED lamp 100 is arranged on the upper surface of the backlight plate 9 in a lattice manner.
With respect to the vehicle-mounted backlight in the above related art, the inventors found that the above related art has the following drawbacks: the means of increasing the number of LEDs in the backlight source or increasing the current can enhance the display brightness of the vehicle-mounted display screen, but the problems that the vehicle-mounted backlight source is serious in local heat aggregation and difficult to effectively emit are caused, and the reliability of the vehicle-mounted backlight source is poor and the service life is short are brought.
Disclosure of Invention
In order to solve the problem of poor heat dissipation performance in the related art, the application aims to provide a vehicle-mounted LED high-brightness backlight source.
The application aim of the application is achieved through the following technical scheme:
the vehicle-mounted LED high-brightness backlight source comprises a high-heat-dissipation backlight plate, a reflecting film and LED lamps, wherein the LED lamps are fixedly connected to the high-heat-dissipation backlight plate in a dot matrix mode; the bottom of the LED lamp is fixedly connected with a metal heat conducting plate; the metal heat-conducting plate is integrally formed with an insulating high-heat-conducting adhesive layer; the surface of the insulating high-heat-conductivity adhesive layer, which is opposite to the metal heat-conducting plate, is fixedly connected to the upper surface of the high-heat-dissipation backlight plate; the reflecting film is fixedly connected to the upper surface of the high-heat-dissipation backlight plate; the reflective film is integrally formed with an installation area for fixedly connecting the LED lamp to the high heat dissipation backlight plate.
Through adopting above-mentioned technical scheme, this application adopts insulating high heat conduction glue film to consolidate the LED lamp, can strengthen the heat conduction efficiency between LED lamp and the high heat dissipation back light plate, can comparatively fast conduct the heat energy that the LED lamp produced to the high heat dissipation back light plate, in the heat release to the environment through the high heat dissipation back light plate, realized comparatively fast in the heat energy release to the environment that the LED lamp produced, therefore, this application has better heat dispersion, can avoid the excessive gathering of the local heat of back light plate, the reliability of vehicle-mounted backlight has been promoted and the life of the on-vehicle backlight of extension.
Preferably, the insulating high-heat-conductivity adhesive layer is prepared from the following raw materials in parts by weight: 100 parts of heat-conducting silica gel, 20-40 parts of heat-conducting framework filling particles and 5-25 parts of enhanced heat-conducting powder.
Through adopting above-mentioned technical scheme, adopt the heat conduction skeleton to fill the granule and construct and form the heat conduction skeleton body in the heat conduction silica gel, can be relatively quick with the heat conduction that the LED lamp produced to high heat dissipation back light plate, the enhancement nature heat conduction powder that fills in the heat conduction silica gel distributes between the heat conduction skeleton body that the heat conduction skeleton filled the granule and forms, can strengthen the heat conductivility of the heat conduction skeleton body to obtain the heat conductivility that promotes insulating high heat conduction glue film, realized promoting the reliability of on-vehicle backlight and the purpose of extension on-vehicle backlight's life.
Preferably, the heat-conducting framework filling particles are a mixture of 240-400-mesh spherical alumina particles and 2000-5000-mesh spherical alumina particles; the mass ratio of the spherical alumina granules with 240-400 meshes to the spherical alumina granules with 2000-5000 meshes is (4-7): 1, a step of; the enhanced heat conduction powder is high heat conduction graphene less than or equal to 10 microns.
By adopting the technical scheme, the insulating high-heat-conductivity adhesive with good heat-conductivity can be obtained, so that the reliability of the vehicle-mounted backlight source is improved and the service life of the vehicle-mounted backlight source is prolonged.
Preferably, the insulating high-heat-conductivity adhesive layer is prepared from the following raw materials in parts by weight: 100 parts of heat-conducting silica gel, 20-40 parts of heat-conducting framework filling particles, 5-25 parts of enhanced heat-conducting powder and 5-25 parts of phase-change particles.
Through adopting above-mentioned technical scheme, the phase transition granule absorbs the heat energy that the LED lamp produced and self physical form does not change through self phase transition, consequently, the addition of phase transition granule not only can reduce the temperature of LED lamp itself, improves the bulk temperature of backlight, but also can reduce the temperature of insulating high heat conduction glue film, has guaranteed the structural stability and the life of insulating high heat conduction glue film.
Preferably, the phase-change particles are prepared from the following raw materials: high thermal conductivity conductive media, phase change wax pellets; the high heat conduction medium accounts for 5-20% of the total mass of the phase change particles; the particle size of the phase-change particles is 0.2-0.8mm.
Through adopting above-mentioned technical scheme, adopt high heat conduction medium to lead the heat energy that the LED lamp produced in the phase transition granule fast, the phase transition granule absorbs the heat energy of LED lamp conduction, can reduce the temperature of insulating high heat conduction glue film and the temperature of LED lamp itself, promotes the radiating efficiency and the life of on-vehicle backlight.
Preferably, the high heat conduction medium is silver tungsten carbide graphene or MWNT carbon nanotubes.
Through adopting above-mentioned technical scheme, silver tungsten carbide graphite alkene or MWNT carbon nanotube can be with the heat energy quick conduction in the phase transition granule that the LED lamp produced, and the heat energy of the quick absorption LED lamp conduction of phase transition granule of being convenient for is favorable to reducing the temperature of LED lamp itself, promotes the duration of vehicle-mounted backlight.
Preferably, the preparation method of the insulating high thermal conductive adhesive layer comprises the following steps:
step 1, stirring heat-conducting silica gel with accurate measurement under the protection of nitrogen at 100-150rpm, uniformly dividing the heat-conducting framework filling particles into three parts during stirring, adding the three parts into the heat-conducting silica gel at intervals, and obtaining a semi-finished product material at intervals of 120-200s each time;
step 2, placing the reinforced heat-conducting powder with accurate measurement in a graphene material adding device, inputting the reinforced heat-conducting powder into a semi-finished product material by taking nitrogen as a carrier, wherein the content of the reinforced heat-conducting powder in the transported nitrogen is 200-600mg/L, and the flow rate of the transported nitrogen is 0.2-0.8m/s;
and 3, after the addition of the enhanced heat conduction powder is completed, the rotating speed is adjusted to 300-350rpm, the stirring is carried out for 200-240s, and the insulating high heat conduction adhesive is obtained after the blanking.
Through adopting above-mentioned technical scheme, adopt the mode of nitrogen gas transport reinforcing nature heat conduction powder, realized comparatively evenly distributed in the inside purpose of heat conduction silica gel with reinforcing nature heat conduction powder to the preparation obtains the insulating high heat conduction glue that has good heat conductivility, promotes the reliability of on-vehicle backlight and prolongs on-vehicle backlight's life.
Preferably, the preparation method of the phase-change particles comprises the following steps:
step 1, under the protection of nitrogen, heating the phase-change wax granules with accurate metering to be molten, and stirring and mixing for 30-40s at 50-80rpm to obtain a mixture;
step 2, placing a high-heat-conductivity conducting medium with accurate measurement in a graphene feeding device, inputting the high-heat-conductivity conducting medium into a mixture by taking nitrogen as a carrier, wherein the content of the high-heat-conductivity conducting medium in the nitrogen is 200-400mg/L, the flow rate of the nitrogen is 0.6-0.9m/s, and the adding amount of the high-heat-conductivity conducting medium is 0.8-2.8g/s;
step 3, after the addition of the high heat conduction medium is completed, the rotating speed is adjusted to be 200-240rpm, the stirring is carried out for 5min, and the semi-finished product is obtained by blanking;
and 4, carrying out injection molding on the semi-finished product, cooling and demolding to obtain the phase-change particles with the granularity of 0.2-0.8mm.
Through adopting above-mentioned technical scheme, adopt nitrogen load high heat conduction medium to mix high heat conduction medium in melting phase transition wax, can make high heat conduction medium comparatively evenly distributed in the phase transition wax inside to the preparation obtains the phase transition granule that has better heat absorption accuse temperature effect, promotes the structural stability and the life of insulating high heat conduction glue film, guarantees the reliability and the life of on-vehicle backlight.
Preferably, the preparation method of the insulating high thermal conductive adhesive layer comprises the following steps:
step 1, stirring heat-conducting silica gel with accurate measurement under the protection of nitrogen at 100-150rpm, uniformly dividing the heat-conducting framework filling particles into three parts during stirring, and adding the three parts into the heat-conducting silica gel at intervals, wherein the time between each time of adding is 120-200s, so as to obtain a component A;
step 2, uniformly dividing the phase-change particles with accurate measurement into three parts, adding the three parts into the component A at intervals, and obtaining a semi-finished product, wherein the interval feeding time is 200-240 s;
step 3, placing the high-heat-conductivity conductive medium with accurate measurement in a graphene feeding device, inputting the high-heat-conductivity conductive medium into a semi-finished product by taking nitrogen as a carrier, wherein the content of the high-heat-conductivity conductive medium in the nitrogen is 200-600mg/L, and the flow rate of the nitrogen is 0.2-0.8m/s;
and step 4, after the addition of the high heat conduction medium is completed, the rotating speed is adjusted to 300-350rpm, stirring is carried out for 200-240s, and the insulating high heat conduction adhesive is obtained after discharging.
By adopting the technical scheme, the high heat conduction medium and the phase change particles can be uniformly dispersed in the heat conduction silica gel, so that the insulating high heat conduction gel with good heat conduction performance, heat absorption and temperature control performance and heat stability performance is prepared, and the reliability and the service life of the vehicle-mounted backlight source are further ensured.
In summary, the present application has the following advantages:
1. the vehicle-mounted backlight source has good heat dissipation performance, can avoid excessive accumulation of local heat of the backlight plate, and improves the reliability of the vehicle-mounted backlight source and prolongs the service life of the vehicle-mounted backlight source.
2. The phase-change particles prepared in the application can absorb heat energy generated by the LED lamp and the physical form of the phase-change particles does not change, so that the overall temperature of the backlight source can be reduced, the dimensional stability and the service life of the insulating high-heat-conductivity adhesive layer are ensured, and the reliability and the service life of the vehicle-mounted backlight source are ensured.
Drawings
Fig. 1 is a schematic view of the overall structure of a vehicle-mounted backlight in the related art.
Fig. 2 is a schematic diagram of the overall structure of the graphene feeding device in the present application.
Fig. 3 is a schematic structural diagram of a gas distributor in the graphene feeding device of the present application.
Fig. 4 is a schematic diagram of the overall structure of the vehicle-mounted LED highlighting backlight in embodiment 1 of the present application.
Fig. 5 is a partial enlarged view at a in fig. 4.
In the figure, 1, a high heat dissipation backlight plate; 10. a reflective film; 100. an LED lamp; 101. a metal heat-conducting plate; 102. an installation area; 11. an insulating resistance film layer; 111. a circular hole region; 12. a copper foil layer; 13. a thermally conductive insulating layer; 14. an aluminum plate layer; 15. a heat radiation fin; 151. a copper substrate; 152. radiating copper foil; 2. a heat-dissipating metal outer frame; 20. an insulating high-heat-conductivity adhesive layer; 200. a heat radiation hole; 21. an aluminum alloy outer frame main body; 22. an aluminum alloy limiting body; 221. a heat dissipation duct; 3. a heat dissipation metal clamping frame group; 31. a first aluminum alloy heat dissipation frame; 32. a second aluminum alloy heat dissipation frame; 4. a thermally conductive silicone frame; 40. a shading tape; 5. a silver tin layer; 6. an optical film layer; 61. a first diffusion film; 62. a brightness enhancement film; 63. a second diffusion film; 9. a stirring tank main body; 90. a filler port; 91. a stirrer; 911. a driving motor; 912. a rotating shaft; 913. a stirrer; 92. a discharge pipe; 93. an air distributor; 931. an arc-shaped gas distributor body; 932. a cavity; 933. an air inlet duct; 94. a gas input tube; 95. a pulse valve.
Detailed Description
The present application is described in further detail below with reference to the drawings and examples.
Raw materials
Apparatus and method for controlling the operation of a device
Referring to fig. 2, the graphene adding device includes a stirring tank body 9, and a stirrer 91 is rotatably connected to the stirring tank body 9. The agitator 91 includes a driving motor 911, a rotation shaft 912, and three agitators 913, and the driving motor 911 is fixedly connected to the top of the agitator tank body 9. An output shaft of the driving motor 911 is fixedly connected with the rotation shaft 912 through a coupling. The stirrer 913 is a turbine stirrer, which can make the material flow axially. The stirrers 913 are fixedly connected to the circumference of the rotary shaft 912, and the intervals between adjacent stirrers 913 are equal.
Referring to fig. 2, a filler port 90 is fixedly connected to the top of the stirring tank body 9. The middle part outside the stirring tank main body 9 is fixedly connected with a discharging pipe 92, and the discharging pipe 92 is used for communicating a reaction kettle for preparing insulating high heat conduction glue or a stirring kettle for preparing phase change particles, and conveying high heat conduction graphene to the stirring kettle or conveying high heat conduction medium to the reaction kettle.
Referring to fig. 2, an air distributor 93 is fixedly connected to the lower portion of the inner wall of the agitation tank main body 9. The gas distributor 93 is fixedly connected with a gas input pipe 94, and a pulse valve 95 is fixedly connected with the gas input pipe 94. The gas input pipe 94 is connected at one end to the nitrogen cylinder and at the other end to the gas distributor 93.
Referring to fig. 3, the specific structure of the air distributor 93 is: the gas distributor 93 includes an arc gas distributor main body 931 attached to and fixedly connected to the inner wall of the agitation tank main body 9, a cavity 932 is integrally formed inside the arc gas distributor main body 931, and the surface of the arc gas distributor main body 931 facing the inner wall of the agitation tank main body 9 is fixedly communicated with the gas input pipe 94. The surface of the arc-shaped gas distributor main body 931, which is back to the inner wall of the stirring tank main body 9, is provided with a plurality of gas inlet holes 933, and the gas inlet holes 933 are distributed on the surface of the arc-shaped gas distributor main body 931 in a lattice mode.
The application mode of the graphene material adding device comprises the following steps: the high heat conduction medium is added into the stirring tank main body 9 through the filling port 90, the stirrer 91 is started to stir, then the pulse valve 95 is started, the pulse period is 0.5s, nitrogen enters the stirring tank main body 9 through the gas distributor 93 to be mixed with the high heat conduction graphene or the high heat conduction medium, and the gas input pipe 94 is opened, so that the high heat conduction graphene is conveyed in the stirring tank or the high heat conduction medium is conveyed in the reaction tank by taking the nitrogen as conveying carrier gas.
Preparation example
Preparation example 1
The insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules, 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-heat-conductivity graphene.
The preparation of the insulating high heat-conducting glue comprises the following steps:
step 1, weighing 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina particles and 0.4kg of spherical alumina particles with the primary crystal size of 2.8-3.2 mu m according to a proportion, putting 10kg of electronic liquid silica gel into a stirring kettle, stirring at a rotating speed of 120rpm under the protection of nitrogen, then uniformly dividing 1.6kg of 300-mesh spherical alumina particles into three parts, adding the three parts into the stirring kettle at intervals, wherein the feeding interval time is 60 seconds, and after the addition of 300-mesh spherical alumina particles, uniformly dividing three parts of 0.4kg of spherical alumina particles with the primary crystal size of 2.8-3.2 mu m, and adding the three parts into the stirring kettle at intervals, wherein the feeding interval time is 150 seconds;
step 2, adding 0.5kg of high-heat-conductivity graphene accurately measured into a stirring tank main body 9 through a filler port 90, inputting the high-heat-conductivity graphene into a stirring kettle by taking nitrogen as a carrier, wherein the content of the high-heat-conductivity graphene in the nitrogen is controlled to be a range value, the content of the high-heat-conductivity graphene is controlled to be within a range of 200-240mg/L, the flow rate of the nitrogen is stabilized to be within a range of 0.7-0.8m/s, and the adding amount of the high-heat-conductivity graphene in the stirring kettle is 1.2-1.7g/s;
and step 3, after the addition of the high-heat-conductivity graphene is completed, the rotating speed is adjusted to 320rpm, the stirring is carried out for 240s, and the insulating high-heat-conductivity adhesive is obtained after discharging.
Preparation example 2
Preparation 2 differs from preparation 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.75kg of 300-mesh spherical alumina granules, 0.25kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-heat-conductivity graphene.
Preparation example 3
Preparation 3 differs from preparation 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-heat-conductivity graphene.
Preparation example 4
Preparation example 4 differs from preparation example 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 2.5kg of high-heat-conductivity graphene.
Preparation example 5
Preparation 5 differs from preparation 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 1.2kg of high-heat-conductivity graphene.
Preparation example 6
The insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-heat-conductivity graphene and 0.5kg of phase-change particles.
The phase-change particles are prepared from the following raw materials: 25g of silver tungsten carbide graphene and 475g of phase-change wax particles, wherein the particle size of the phase-change particles is 0.5mm, and the phase-change particles are selected from the group consisting of fixed phase-change energy storage wax (Shanghai Joule wax Co., ltd.).
The preparation method of the phase-change particles comprises the following steps:
step 1, adding 0.5kg of sizing phase-change energy-storage wax raw materials with accurate measurement into a reaction kettle, introducing nitrogen into the reaction kettle for protection, heating to be molten, and stirring at 50rpm for 100s for later use;
step 2, adding 25g of silver tungsten carbide graphene with accurate measurement into a graphene adding device, inputting the silver tungsten carbide graphene into a reaction kettle by taking nitrogen as a carrier, wherein the content of the silver tungsten carbide graphene in conveying air is 240-280mg/L, the flow rate of the conveying air is 0.7-0.9m/s, the air inflow of the reaction kettle is 5.5-7.1L/s, and the addition amount of a high heat conduction medium in the reaction kettle is 1.32-1.98g/s;
step 3, after the addition of the silver tungsten carbide graphene is completed, the rotating speed is adjusted to 240rpm, the stirring is carried out for 5min, and the semi-finished product is obtained by blanking;
and 4, performing injection molding on the semi-finished product, cooling and demolding to obtain the phase-change particles with the granularity of 0.5 mm.
The preparation method of the insulating high-heat-conductivity adhesive layer comprises the following steps:
step 1, weighing 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina particles and 0.35kg of spherical alumina particles with primary crystal size of 2.8-3.2 mu m according to a proportion, placing 10kg of electronic liquid silica gel into a stirring kettle, stirring at a rotating speed of 120rpm under the protection of nitrogen, uniformly dividing 1.65kg of 300-mesh spherical alumina particles into three parts, adding the three parts into the stirring kettle at intervals, wherein the feeding interval time is 60 seconds, uniformly dividing 0.35kg of spherical alumina particles with primary crystal size of 2.8-3.2 mu m into three parts after the addition of 300-mesh spherical alumina particles is completed, and adding the three parts into the stirring kettle at intervals, wherein the feeding interval time is 150 seconds;
step 2, maintaining the stirring rotation speed at 120rpm, equally dividing 0.5kg of phase-change particles into three parts, and adding the three parts into a stirring kettle at intervals, wherein the feeding interval time is 200s;
step 3, placing 1.2kg of high-heat-conductivity graphene with accurate measurement into a graphene feeding device, inputting the high-heat-conductivity graphene into a stirring kettle by taking nitrogen as a carrier, wherein the content of the high-heat-conductivity graphene in the nitrogen is a range value, the content of the high-heat-conductivity graphene is in a range of 200-240mg/L, the flow rate of the nitrogen is stabilized in a range of 0.7-0.8m/s, and the adding amount of the high-heat-conductivity graphene in the stirring kettle is 1.1-1.7g/s;
and step 4, after the addition of the high-heat-conductivity graphene is completed, the rotating speed is adjusted to 320rpm, the stirring is carried out for 240s, and the insulating high-heat-conductivity adhesive is obtained after discharging.
Preparation example 7
Preparation 7 differs from preparation 6 in that: the phase-change particles are prepared from the following raw materials: 100g of high-silver tungsten carbide graphene, 400g of phase-change wax particles, wherein the granularity of the phase-change particles is 0.5mm, and the phase-change particles are shaped phase-change energy storage wax.
Preparation example 8
Preparation 8 differs from preparation 6 in that: the phase-change particles are prepared from the following raw materials: 50g of silver tungsten carbide graphene and 450g of phase-change wax granules, wherein the granularity of the phase-change particles is 0.5mm, and the phase-change particles are shaped phase-change energy storage wax.
Preparation example 9
Preparation 9 differs from preparation 6 in that: the phase-change particles are prepared from the following raw materials: 25g of MWNT carbon nano-tube and 475g of phase-change wax granules, wherein the granularity of the phase-change granules is 0.5mm, and the phase-change granules are shaped phase-change energy storage wax.
Preparation example 10
Preparation 10 differs from preparation 6 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-heat-conductivity graphene and 2.5kg of phase-change particles. The phase-change particles are prepared from the following raw materials: 250g of silver tungsten carbide graphene and 2250g of phase-change wax particles, wherein the particle size of the phase-change particles is 0.5mm, and the phase-change particles are shaped phase-change energy storage wax.
PREPARATION EXAMPLE 11
Preparation 11 differs from preparation 6 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-heat-conductivity graphene and 0.8kg of phase-change particles. The phase-change particles are prepared from the following raw materials: 80g of silver tungsten carbide graphene and 720g of phase-change wax particles, wherein the granularity of the phase-change particles is 0.5mm, and the phase-change particles are shaped phase-change energy storage wax.
Preparation example 12
Preparation 12 differs from preparation 6 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-heat-conductivity graphene and 1.8kg of phase-change particles. The phase-change particles are prepared from the following raw materials: 180g of silver tungsten carbide graphene and 1620g of phase-change wax particles, wherein the granularity of the phase-change particles is 0.5mm, and the phase-change particles are formed phase-change energy storage wax.
Preparation example 13
Preparation 13 differs from preparation 1 in that: the preparation of the insulating high heat-conducting glue comprises the following steps:
step 1, weighing 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina particles and 0.4kg of spherical alumina particles with primary crystal size of 2.8-3.2 mu m according to a proportion, placing 10kg of electronic liquid silica gel into a stirring kettle, stirring at a speed of 120rpm under the protection of nitrogen, uniformly dividing three parts of 1.6kg of 300-mesh spherical alumina particles, adding the three parts of spherical alumina particles into the stirring kettle at intervals, wherein the feeding interval time is 60s, uniformly dividing three parts of 0.4kg of spherical alumina particles with primary crystal size of 2.8-3.2 mu m after the addition of 300-mesh spherical alumina particles is completed, and adding the three parts of spherical alumina particles into the stirring kettle at intervals, wherein the feeding interval time is 150s;
and 2, putting 0.5kg of high-heat-conductivity graphene with accurate measurement into a stirring kettle, adjusting the rotating speed to 320rpm, stirring for 240s, and discharging to obtain the insulating high-heat-conductivity adhesive.
PREPARATION EXAMPLE 14
Preparation 14 differs from preparation 6 in that: the preparation method of the insulating high-heat-conductivity adhesive layer comprises the following steps:
step 1, weighing 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina particles and 0.35kg of spherical alumina particles with primary crystal size of 2.8-3.2 mu m according to a proportion, placing 10kg of electronic liquid silica gel into a stirring kettle, stirring at a speed of 120rpm under the protection of nitrogen, uniformly dividing three parts of 1.65kg of 300-mesh spherical alumina particles, adding the three parts of spherical alumina particles into the stirring kettle at intervals, wherein the feeding interval time is 60s, uniformly dividing three parts of 0.35kg of spherical alumina particles with primary crystal size of 2.8-3.2 mu m after the addition of 300-mesh spherical alumina particles is completed, and adding the three parts of spherical alumina particles into the stirring kettle at intervals, wherein the feeding interval time is 150s;
step 2, uniformly dividing the phase-change particles with accurate measurement into three parts, adding the three parts into a stirring kettle at intervals, wherein the feeding interval time is 200s, and the stirring rotating speed is maintained at 120rpm;
and 3, putting 1.2kg of high-heat-conductivity graphene with accurate measurement into a stirring kettle, adjusting the rotating speed to 320rpm, stirring for 240s, and discharging to obtain the insulating high-heat-conductivity adhesive.
Preparation example 15
Preparation 15 differs from preparation 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.2kg of 300-mesh spherical alumina granules, 0.8kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-heat-conductivity graphene.
PREPARATION EXAMPLE 16
Preparation example 16 differs from preparation example 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.8kg of 300-mesh spherical alumina granules, 0.2kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-heat-conductivity graphene.
Preparation example 17
Preparation 17 differs from preparation 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules, 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.3kg of high-heat-conductivity graphene.
PREPARATION EXAMPLE 18
Preparation 18 differs from preparation 1 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules, 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 3.2kg of high-heat-conductivity graphene.
Preparation example 19
Preparation 19 differs from preparation 6 in that: the phase-change particles are prepared from the following raw materials: 15g of silver tungsten carbide graphene and 485g of phase-change wax particles, wherein the granularity of the phase-change particles is 0.5mm, and the phase-change particles are shaped phase-change energy storage wax.
Preparation example 20
Preparation 20 differs from preparation 6 in that: the phase-change particles are prepared from the following raw materials: 150g of silver tungsten carbide graphene and 350g of phase-change wax particles, wherein the particle size of the phase-change particles is 0.5mm, and the phase-change particles are shaped phase-change energy storage wax.
Preparation example 21
Preparation 21 differs from preparation 6 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-heat-conductivity graphene and 0.3kg of phase-change particles. The phase-change particles are prepared from the following raw materials: 30g of silver tungsten carbide graphene and 220g of phase-change wax particles, wherein the granularity of the phase-change particles is 0.5mm, and the phase-change particles are shaped phase-change energy storage wax. .
PREPARATION EXAMPLE 22
Preparation 22 differs from preparation 6 in that: the insulating high heat-conducting adhesive is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-heat-conductivity graphene and 3.0kg of phase-change particles. The phase-change particles are prepared from the following raw materials: 300g of silver tungsten carbide graphene and 2700g of phase-change wax granules, wherein the granularity of the phase-change granules is 0.5mm, and the phase-change granules are shaped phase-change energy storage wax.
Examples
Examples
Referring to fig. 4, for a vehicle-mounted LED high-brightness backlight disclosed in the present application, the vehicle-mounted LED high-brightness backlight includes an LED lamp 100, a reflective film 10, an optical film layer 6 and a high-heat-dissipation backlight board 1, where the LED lamp 100 is a white LED manufactured by Lumileds, the rated power is 1W, the typical current is 350mA, the typical brightness is 2000mcd, and the current of the LED lamp 100 is 180-200 mA when in use, so that the electric energy utilization rate is ensured and the heat release is reduced. The LED lamps 100 are welded on the upper surface of the high-heat-dissipation backlight plate 1, and in order to ensure the light-emitting uniformity and brightness of the backlight source, the LED lamps 100 are distributed in a lattice mode, and the distance between adjacent LED lamps 100 is 18mm.
Referring to fig. 4, the reflective film 10 is a backlight reflective film, specifically an LED lamp reflective film purchased from Lu Jia reflective materials limited in dongguan. The reflective film 10 is adhered to the upper surface of the high heat dissipation backlight 1 by polyurethane hot melt adhesive. The reflective film 10 is integrally formed with a mounting region 102 for fixedly connecting the LED lamp 100 to the high heat dissipation backlight 1. The optical film layer 6 includes a first diffusion film 61, a brightness enhancement film 62, and a second diffusion film 63 sequentially disposed on the reflective film 10, wherein the first diffusion film 61 and the second diffusion film 63 are conventional diffusion films, and the brightness enhancement film 62 is a conventional brightness enhancement film.
Referring to fig. 5, in order to improve the overall heat dissipation performance, the high heat dissipation backlight plate 1 is connected with a heat dissipation metal outer frame 2, and a heat dissipation metal clamping frame set 3 is clamped in the heat dissipation metal outer frame 2. During installation, the heat dissipation metal clamping frame group 3 is fixedly connected in the heat dissipation metal outer frame 2 through friction force clamping, the high heat dissipation backlight plate 1 and the optical film layer 6 are fixedly connected between the heat dissipation metal outer frame 2 and the heat dissipation metal clamping frame group 3, the optical film layer 6 is positioned on the upper portion of the high heat dissipation backlight plate 1, and the optical film layer 6 is also positioned on the upper portion of the reflecting film 10.
Referring to fig. 4 and 5, the heat dissipation metal housing 2 is composed of an aluminum alloy housing main body 21 and an aluminum alloy stopper 22. In order to ensure the overall heat dissipation performance, the aluminum alloy housing main body 21 is provided with a plurality of heat dissipation holes 200. The aluminum alloy limiting body 22 is integrally formed on the inner wall of the aluminum alloy outer frame main body 21, and the lower surface of the aluminum alloy limiting body 22 is flush with the lower surface of the aluminum alloy outer frame main body 21. In order to improve the overall heat dissipation performance, the aluminum alloy limiting body 22 is provided with a plurality of heat dissipation channels 221 penetrating through the upper surface and the lower surface, and the heat dissipation channels 221 are distributed on the surface of the aluminum alloy limiting body 22 in a lattice mode.
Referring to fig. 4 and 5, the high heat dissipation backlight 1 is circumferentially covered with a heat conductive silica gel frame 4, the outer side wall of the heat conductive silica gel frame 4 is covered with a light shielding belt 40, and the heat conductive silica gel frame 4 is clamped to the aluminum alloy outer frame main body 21. The heat-conducting silica gel frame 4 is prepared by using the insulating high heat-conducting gel in preparation example 1, specifically, the length of the heat-conducting silica gel frame 4 is 0.6mm greater than the length of the aluminum alloy limiting body 22, and the width of the heat-conducting silica gel frame 4 is 0.6mm greater than the width of the aluminum alloy limiting body 22.
Referring to fig. 4 and 5, the heat-conducting silica gel frame 4 is mounted on the aluminum alloy outer frame main body 21, the light shielding strip 40 on the heat-conducting silica gel frame 4 is tightly abutted against the inner wall of the aluminum alloy outer frame main body 21, the lower surface of the heat-conducting silica gel frame 4 is abutted against the upper surface of the aluminum alloy limiting body 22, and the upper surface of the heat-conducting silica gel frame 4 is abutted against the lower surface of the heat-dissipating metal clamping frame set 3, so that the heat energy of the high-heat-dissipation backlight plate 1 can be conducted to the heat-dissipating metal outer frame 2 relatively quickly, and the overall heat dissipation performance is improved.
Referring to fig. 4 and 5, the heat dissipation metal clamping frame set 3 includes a first aluminum alloy heat dissipation frame 31 and a second aluminum alloy heat dissipation frame 32, and the first aluminum alloy heat dissipation frame 31 is clamped to the aluminum alloy outer frame main body 21 by friction force. The heat conduction silica gel frame body 4 is installed in aluminum alloy frame main part 21, and heat conduction silica gel frame body 4 upper surface butt is in first aluminum alloy heat dissipation frame 31 lower surface for the heat energy of high heat dissipation back light plate 1 can comparatively quick conduction in heat dissipation metal card frame group 3, thereby improves holistic heat dispersion. The second aluminum alloy heat dissipation frame 32 is clamped to the aluminum alloy outer frame main body 21 through friction force. The second aluminum alloy heat dissipation frame 32 is located at the upper part of the first aluminum alloy heat dissipation frame 31, and the upper surface of the second aluminum alloy heat dissipation frame 32 is flush with the upper surface of the aluminum alloy outer frame main body 21. The optical film layer 6 is fixedly connected between the first aluminum alloy heat dissipation frame 31 and the second aluminum alloy heat dissipation frame 32, so that the optical film layer 6 is fixedly connected with the aluminum alloy outer frame main body 21. When the optical film layer 6 is fixedly connected to the aluminum alloy outer frame body 21, the upper surface of the second diffusion film 63 in the optical film layer 6 is abutted against the lower surface of the second aluminum alloy heat dissipation frame 32, and the lower surface of the first diffusion film 61 in the optical film layer 6 is abutted against the upper surface of the first aluminum alloy heat dissipation frame 31.
Referring to fig. 4 and 5, the high heat dissipation backlight 1 includes an insulation resistance film layer 11, a copper foil layer 12, a heat conductive insulation layer 13, an aluminum plate layer 14, and heat dissipation fins 15, the insulation resistance film layer 11 being a flame retardant PC film (Sha Jingzhuo force adhesive product factory, shenzhen, baoan region). The reflective film 10 is fixedly attached to the upper surface of the insulation resistance film layer 11 by polyurethane hot melt adhesive. The insulating resistive film 11 is also reserved with a circular hole region 111 of the same size as the mounting region 102. The insulating resistance film layer 11 is fixedly connected to the upper surface of the copper foil layer 12 through electronic liquid silicone. The lower surface of the copper foil layer 12 is fixedly connected to the upper surface of the heat conducting and insulating layer 13. The heat conducting insulating layer 13 is prepared from electronic liquid silica gel, and can perform insulating function and simultaneously conduct out heat energy emitted by the copper foil layer 12. Printed wires are formed on the copper foil layer 12, and the pins and the LED lamps 100 are fixedly connected to the wires of the copper foil layer 12.
Referring to fig. 4 and 5, the lower surface of the heat conductive insulating layer 13 is fixedly connected to the upper surface of the aluminum plate layer 14. The bottom of the LED lamp 100 is fixedly connected with a metal heat-conducting plate 101; the metal heat-conducting plate 101 is fixedly connected with an insulating high heat-conducting glue layer 20. The insulating high thermal conductive adhesive layer 20 was prepared by using the insulating high thermal conductive adhesive in preparation example 1. The upper surface of the insulating high thermal conductive adhesive layer 20 is fixedly connected to the lower surface of the LED lamp 100, and the lower surface of the insulating high thermal conductive adhesive layer 20 is fixedly connected to the upper surface of the copper foil layer 12.
Referring to fig. 4 and 5, the insulating high thermal conductive adhesive layer 20 has good thermal conductivity, and can more rapidly conduct the heat energy generated by the LED lamp 100 to the copper foil layer 12, so as to reduce the temperature of the LED lamp 100, thereby ensuring the overall stability and service life. The LED lamp 100 and the leads are soldered with a silver-tin layer 5 fixedly connected to the copper foil layer 12, and the LED lamp 100 and the leads are connected to the printed wiring of the copper foil layer 12 through the silver-tin layer 5. The silver tin layer 5 has good heat conductivity, and increases the heat dissipation area of the LED lamp 100, so that the heat energy generated by the LED lamp 100 can be more rapidly conducted to the copper foil layer 12, the temperature of the LED lamp 100 is reduced, and the overall stability and the service life are ensured.
Referring to fig. 4 and 5, the specific structure of the heat radiating fin 15 is as follows: the heat dissipation fin 15 includes a copper substrate 151 and a heat dissipation copper foil 152, and the heat dissipation copper foil 152 is integrally formed on the lower surface of the copper substrate 151. The dimensions of the heat spreading copper foil 152 are 1.2mm by 0.5mm by 0.2mm. The spacing between adjacent heat spreading copper foils 152 is 1mm. The upper surface of copper base plate 151 passes through heat conduction silica gel fixed connection in the lower surface of aluminum plate layer 14, can comparatively release the heat energy that LED lamp 100 conducted, reduces the temperature of LED lamp 100 self, guarantees holistic stability and life.
Example 2
Example 2 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 2.
Example 3
Example 3 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 3.
Example 4
Example 4 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 4.
Example 5
Example 5 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 5.
Example 6
Example 6 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 6.
Example 7
Example 7 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 7.
Example 8
Example 8 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 8.
Example 9
Example 9 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 9.
Example 10
Example 10 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 10.
Example 11
Example 11 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 11.
Example 12
Example 12 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 12.
Comparative example
Comparative example 1
Comparative example 1 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 13.
Comparative example 2
Comparative example 1 differs from example 6 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 14.
Comparative example 3
Comparative example 3 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 15.
Comparative example 4
Comparative example 4 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 16.
Comparative example 5
Comparative example 5 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 17.
Comparative example 6
Comparative example 6 differs from example 1 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 18.
Comparative example 7
Comparative example 7 differs from example 6 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 19.
Comparative example 8
Comparative example 8 differs from example 6 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 20.
Comparative example 9
Comparative example 9 differs from example 6 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 21.
Comparative example 10
Comparative example 10 differs from example 6 in that: the insulating high thermal conductive paste in preparation example 1 used in example 1 was replaced with the insulating high thermal conductive paste in preparation example 22.
Performance test
1. And (3) testing the heat conductivity coefficient of the insulating high-heat-conductivity adhesive, wherein the testing instrument is a heat conductivity coefficient testing instrument LW-9389 of Taiwan Rui collar according to the ASTM D5470 standard.
2. Surface temperature measurement of a vehicle-mounted LED high-brightness backlight source: the test environment is 20+/-0.1 ℃, the humidity is 40+/-3%, the LED lamp rated current is 200mA, the temperatures at the four corners of the radiating metal outer frame after light emission for 1 hour and 4 hours are respectively measured, the temperature at the single corner is tested five times by adopting a JK-16 multipath temperature inspection instrument, five groups of data are obtained, the average value is taken as the temperature at the single corner, and the average value of the temperatures tested at the four corners is the temperature of the radiating metal outer frame.
Detection method
Table 1 shows experimental test parameters of examples 1-12 and comparative examples 1-10
Table 2 shows experimental test parameters of examples 1-12 and comparative examples 1-10
As can be seen from the combination of preparation examples 1 to 12 and preparation examples 13 to 22 and the combination of table 1, the thermal conductivity of the insulating high thermal conductive adhesive in preparation example 1 is greater than that of the insulating high thermal conductive adhesive in preparation example 13, and the thermal conductivity of the insulating high thermal conductive adhesive in preparation example 6 is greater than that of the insulating high thermal conductive adhesive in preparation example 14, therefore, the high thermal conductive graphene is fed into the reaction kettle by using nitrogen as carrier gas to be mixed with the thermal conductive silica gel by using the graphene feeding device, so that the high thermal conductive graphene is uniformly dispersed in the thermal conductive silica gel, and the thermal conductivity of the prepared insulating high thermal conductive adhesive is improved.
As can be seen from the combination of preparation examples 1 to 12 and preparation examples 13 to 22 and Table 1, the thermal conductivity of the insulating highly thermally conductive paste in preparation examples 1 to 3 was larger than that of the insulating highly thermally conductive paste in preparation examples 15 to 16, and therefore, the mass ratio of the spherical alumina particles of 240 to 400 mesh to the spherical alumina particles of 2000 to 5000 mesh was (4 to 7): 1, the prepared insulating high-heat-conductivity adhesive has better heat conductivity coefficient.
As can be seen from the combination of preparation examples 1 to 12 and preparation examples 13 to 22 and the combination of Table 1, the thermal conductivity of the insulating high thermal conductive adhesive in preparation examples 4 to 5 is greater than that of the insulating high thermal conductive adhesive in preparation examples 17 to 18, and therefore, when the amount of the reinforcing thermal conductive powder is 5 to 25 parts, the thermal conductivity of the insulating high thermal conductive adhesive prepared is good and the production cost is low.
As can be seen from the combination of preparation examples 1 to 12 and preparation examples 13 to 22 and the combination of Table 1, the thermal conductivity of the insulating high thermal conductive adhesive in preparation examples 10 to 12 is greater than that of the insulating high thermal conductive adhesive in preparation examples 21 to 22, and therefore, when the amount of the phase change particles is 5 to 25 parts, the thermal conductivity of the insulating high thermal conductive adhesive prepared is better and the production cost is lower.
It can be seen from the combination of examples 1-12, comparative examples 1-10 and preparation examples 1-22 and the combination of tables 1-2 that the backlight source prepared by the insulating high-heat-conductivity adhesive has better heat dissipation performance, can avoid excessive accumulation of local heat of the backlight plate, improves the reliability of the vehicle-mounted backlight source and prolongs the service life of the vehicle-mounted backlight source. As can be seen from comparison between example 1 and example 6, although the addition of the phase change particles reduced the thermal conductivity of the insulating high heat conductive adhesive, the heat dissipation performance of the prepared vehicle-mounted backlight was positively affected, and a vehicle-mounted LED high-brightness backlight with more excellent performance was obtained.
The embodiments of the present invention are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in this way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (2)
1. A vehicle-mounted LED highlight backlight source is characterized in that: the LED lamp (100) is fixedly connected to the high-heat-dissipation backlight plate (1) in a dot matrix mode; the bottom of the LED lamp (100) is integrally provided with a metal heat-conducting plate (101); the metal heat-conducting plate (101) is fixedly connected with an insulating high-heat-conducting adhesive layer (20); the surface of the insulating high-heat-conductivity adhesive layer (20) facing away from the metal heat-conducting plate (101) is fixedly connected to the upper surface of the high-heat-dissipation backlight plate (1); the reflecting film (10) is fixedly connected to the upper surface of the high-heat-dissipation backlight plate (1); the reflecting film (10) is integrally formed with a mounting area (102) for fixedly connecting the LED lamp (100) to the high-heat-dissipation backlight plate (1);
the insulating high-heat-conductivity adhesive layer (20) is prepared from the following raw materials in parts by weight: 100 parts of heat-conducting silica gel, 20-40 parts of heat-conducting framework filling particles, 5-25 parts of enhanced heat-conducting powder and 5-25 parts of phase-change particles;
the preparation method of the insulating high-heat-conductivity adhesive layer (20) comprises the following steps:
step 1, stirring the heat-conducting silica gel with accurate measurement under the rotation speed of 100-150rpm and the protection of nitrogen, uniformly dividing the heat-conducting framework filling particles into three parts during stirring, and adding the three parts into the heat-conducting silica gel at intervals, wherein the time between each time of adding is 120-200s, so as to obtain a component A;
step 2, uniformly dividing the phase-change particles with accurate measurement into three parts, adding the three parts into the component A at intervals, and obtaining a semi-finished product, wherein the interval feeding time is 200-240 s;
step 3, placing the reinforced heat-conducting powder with accurate measurement in a graphene feeding device, inputting the reinforced heat-conducting powder into a semi-finished product by taking nitrogen as a carrier, wherein the content of the reinforced heat-conducting powder in the transported nitrogen is 200-600mg/L, and the flow rate of the transported nitrogen is 0.2-0.8m/s;
step 4, after the addition of the enhanced heat conduction powder is completed, the rotating speed is adjusted to 300-350rpm, the stirring is carried out for 200-240s, and the insulating high heat conduction adhesive is obtained after the blanking;
the phase-change particles are prepared from the following raw materials: high thermal conductivity conductive media, phase change wax pellets; the high heat conduction medium accounts for 5-20% of the total mass of the phase change particles; the granularity of the phase-change particles is 0.2-0.8mm;
the preparation method of the phase-change particles comprises the following steps:
step 1, under the protection of nitrogen, heating the phase-change wax granules with accurate metering to be molten, and stirring and mixing for 30-40s at the rotating speed of 50-80rpm to obtain a mixture;
step 2, placing a high-heat-conductivity conducting medium with accurate measurement in a graphene feeding device, inputting the high-heat-conductivity conducting medium into a mixture by taking nitrogen as a carrier, wherein the content of the high-heat-conductivity conducting medium in the nitrogen is 200-400mg/L, the flow rate of the nitrogen is 0.6-0.9m/s, and the adding amount of the high-heat-conductivity conducting medium is 0.8-2.8g/s;
step 3, after the addition of the high heat conduction medium is completed, the rotating speed is adjusted to be 200-240rpm, the stirring is carried out for 5min, and the semi-finished product is obtained by blanking;
and 4, carrying out injection molding on the semi-finished product, cooling and demolding to obtain the phase-change particles with the granularity of 0.2-0.8mm.
2. The vehicle-mounted LED highlighting backlight of claim 1, wherein: the high heat conduction medium is silver tungsten carbide graphene or MWNT carbon nano tube.
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