CN109135611A - One kind is i.e. with low temperature curing type liquid metal conducting resinl in using and preparation method thereof - Google Patents
One kind is i.e. with low temperature curing type liquid metal conducting resinl in using and preparation method thereof Download PDFInfo
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- CN109135611A CN109135611A CN201810907262.4A CN201810907262A CN109135611A CN 109135611 A CN109135611 A CN 109135611A CN 201810907262 A CN201810907262 A CN 201810907262A CN 109135611 A CN109135611 A CN 109135611A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0893—Zinc
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Abstract
The present invention proposes one kind i.e. with low temperature curing type liquid metal conducting resinl in using, including liquid metal, matrix resin, curing agent, diluent, functional additive, and the functional additive is one of promotor, coupling agent, defoaming agent or a variety of；The liquid metal is one of gallium-base alloy, bismuth-base alloy, indium-base alloy or kamash alloy, and the liquid metal is liquid at 5 DEG C~232 DEG C.The present invention also proposes the method i.e. with preparation and the application of low temperature curing type liquid metal conducting resinl in using.Conducting resinl proposed by the present invention is uniformly scattered in liquid metal alloy in matrix resin organic carrier at normal temperature using the characteristic that liquid metal fusing point is low, electric conductivity is high, forms the functional conductive phase of partial size very little.It after heat preservation solidification, contacts with each other to form line or face access between liquid metal particle, reduces the formation in gap between metallic particles, improve the electric conductivity of conducting resinl.
Description
Technical field
The invention belongs to technical field of microelectronic material, and in particular to a kind of conducting resinl of middle low-temperature setting and its preparation side
Method.
Background technique
With the fast development of microelectric technique, the high density of the miniaturization of electronic component, micromation and printed circuit board
Change the rapid development with Highgrade integration.Conducting resinl is as a kind of adhesive for being provided simultaneously with electric conductivity and adhesive property, hair
Wave increasingly important role.In recent years, conducting resinl is as a kind of base electronic material with specific function, and conducting resinl is
It is widely used in pcb component, light emitting diode, liquid crystal display, smart card, ceramic condenser, IC chip etc.
The encapsulation and bonding of electronic component.
Conducting resinl is a kind of special adhesive solidified and have certain electric conductivity after dry, by organic polymer
Curing agent, conductive filler and other auxiliary agents etc. is added in matrix resin to be prepared.Have after conductive adhesive curing close with metal
Electric conductivity, connected storeroom can be made to form galvanic circle by of the same race or same conductive material does not link together.
Conventional conductive glue uses one or more kinds of solid conduction powder such as gold, silver, copper as conductive filler, mainly micro-
Nanoscale powder.Under identical preparation condition, the partial size of metal powder is smaller, after certain temperature is sintered or is solidified
Gap between metallic is just smaller, and the conductive channel of the generation in unit volume is more, and the conductive network electric conductivity of formation is just got over
It is good.High-purity, the fine granularity demand of metallic particles, propose higher technical requirements to the preparation of metal powder, this can extend
The preparation time of powder, the loss for increasing equipment, increase the cost put into needed for production, virtually also largely increase
The cost of manufacture of conducting resinl.
To solve the problems, such as to exist in this respect, the present invention proposes that a kind of liquid metal conducting resinl, conducting resinl utilize liquid gold
Belong to the characteristic that fusing point is low, electric conductivity is high and liquid metal alloy is uniformly scattered in matrix resin organic carrier at normal temperature
In, form the functional conductive phase of partial size very little.Its typical advantages is as follows: (1) liquid metal alloy and resin and other function are tried
The organic carrier of agent composition, which forms homogeneous phase, reduces cost without preparing alloying pellet；(2) in organic carrier add promotor,
Coupling agent, diluent etc. reduce the surface tension of liquid metal alloy, improve the adhesiveness of conducting resinl and matrix；(3) heat preservation is solid
It after change, contacts with each other to form line or face access between liquid metal particle, reduces the formation in gap between metallic particles, raising is led
The electric conductivity of electric glue.
Summary of the invention
One of the objects of the present invention is to provide one kind i.e. with low temperature curing type liquid metal conducting resinl in using, and overcomes existing
The technical problems such as metal dust preparation technology is complicated in some conducting resinls, at high cost, contact resistance is big；
The second object of the present invention is to provide above-mentioned a kind of i.e. with low temperature curing type liquid metal conducting resinl in using
Preparation method directly disperses liquid metal alloy in matrix resin, and it is all mixed uniformly that each component is obtained after mechanical stirring
Conducting resinl.
The third object of the present invention, which is to provide, described answers with low temperature curing type liquid metal conducting resinl in i.e. use
Use method.
Above-mentioned purpose of the invention is achieved through the following technical solutions:
One kind i.e. with i.e. use in low temperature curing type liquid metal conducting resinl, including liquid metal, matrix resin, curing agent,
Diluent, functional additive, the functional additive are one of promotor, coupling agent, defoaming agent or a variety of；The liquid
Metal is one of gallium-base alloy, bismuth-base alloy, indium-base alloy or kamash alloy, and the liquid metal is at 5 DEG C~232 DEG C
At a temperature of be liquid.
Wherein, the liquid metal is one of gallium indium, gallium tin, gallium zinc, bismuth indium bianry alloy；It or is gallium indium tin, gallium
One of indium zinc, indium tin zinc, bismuth indium tin, bismuth indium-zinc ternary alloy；One of gallium indium tin zinc, bismuth indium tin zinc quaternary alloy；
Or it a variety of is formulated by one of lead, silver, copper, aluminium or chromium or with one of above-mentioned binary, ternary, quaternary alloy
Middle low temperature multicomponent alloy.
Described matches low temperature curing type liquid metal conducting resinl in i.e. use, preferably includes the following component of mass parts:
180-400 parts of liquid metals, 100 parts of matrix resins, 10-20 parts of curing agent, 10-15 parts of diluents, 0.5-2 parts of promotors, 1-3
Part coupling agent, 0-2 parts of defoaming agents.
Wherein, described matrix resin be unsaturated polyester resin, epoxy resin, phenolic resin, melamine resin,
One of furane resins, polybutadiene, organic siliconresin, polyimides are a variety of；
The curing agent is ethylenediamine, diamines, diethylenetriamine, triethylene tetramine, diethylaminopropylamine, isophthalic two
One of amine, maleic anhydride, tertiary ammonia class triethanolamine are a variety of.
Wherein, the diluent is alkylidene glycidol ether, butyl glycidyl ether, 1,4-butanediol 2-glycidyl
Ether, ethylene glycol diglycidylether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, C12-14 fatty glycidyl
One or more of ether, benzyl glycidyl ether, 1,6- hexanediol diglycidyl ether；
The coupling agent is vinyltriethoxysilane, vinyltrimethoxysilane, (the β alkene methoxyl group of vinyl three
Ethyoxyl) silane, titanate esters, Aluminate, tri- mercaptopropyltriethoxysilane of γ, one of 3- aminopropyl triethoxysilane
Or it is a variety of.
Wherein, the promotor is DMP-30, EP-184, BDMA, CT-152X, DBU, EP-184,399, K-61B, CT-
One of 152X, 2E4MZ (2-ethyl-4-methylimidazole) or a variety of；
The defoaming agent be silicone emulsion, the fatty acid ester compounded object of higher alcohols, polyoxyethylene polyoxypropylene pentaerythrite ether,
Polyoxyethylene polyoxy propyl alcohol amidogen ether, polypropylene glycerol aether and polyoxyethylene polyoxypropylene glycerin ether, dimethyl silicone polymer, phosphorus
One of acid esters defoaming agent is a variety of.
It is highly preferred that described matrix resin is bisphenol f type epoxy resin, curing agent is tertiary amines triethanolamine etc., is promoted
Agent is 2-ethyl-4-methylimidazole etc., and coupling agent is 3- aminopropyl triethoxysilane etc., and diluent is the contracting of carbon 12-14 alkyl
Water glycerin ether, defoaming agent are phosphate defoaming agent.
The preparation method i.e. with low temperature curing type liquid metal conducting resinl in using, comprising steps of
1) liquid metal alloy, matrix resin, curing agent, diluent, functional additive are weighed according to the proportion；
2) weighed curing agent, diluent, functional additive are sequentially added in matrix resin, stirring while adding makes
It is mixed into uniform organic carrier, stands at room temperature；
Wherein, in step 2), the agitating mode is that hand operated mixing and magnetic agitation successively carry out；The magnetic agitation turns
Speed is that the interval 500rad/min -1500rad/min rises, and every 5min increases by 200 turns；
The mixing time is 0.5-2h.
The preparation method, further comprises the steps of:
If 3) the liquid metal fusing point is higher than room temperature, the liquid metal alloy that the fusing point is higher than room temperature is placed in air
In or vacuum in make constant temperature processing；Constant temperature processing time, treatment temperature are that liquid metal alloy is changed into liquid condition and is
Preferably；Preferably, the constant temperature processing time is 0.5-2h；Preferably, the treatment temperature is greater than or equal to low-melting alloy
Fusing point, it is further preferable that the treatment temperature is higher than 1-10 DEG C of the low-melting alloy fusing point.
4) liquid metal alloy being in a liquid state in step 3) is added in the uniform organic carrier in step 2), in stirring shape
Under state, high-speed stirred makes its dispersion under room temperature or heating environment, until forming paste；
Preferably, the heating stirring environment temperature is greater than or equal to the fusing point of low-melting alloy, it is further preferable that described
Heating temperature is higher than 1-10 DEG C of the liquid metal alloy fusing point.
Application method of the present invention i.e. with low temperature curing type liquid metal conducting resinl in using, comprising:
Manufactured liquid metal conducting resinl is applied to test module, carries out solidification work using DSC differential scanning calorimeter
Skill determines, according to the corresponding temperature of heat release peak-to-peak value of test, the corresponding temperature of the peak value+(5-20) DEG C at a temperature of,
Solidify 0.5-2h.
The beneficial effects of the present invention are:
(1) organic carrier that liquid metal alloy and resin and other functional reagents form forms homogeneous phase, without preparation
Alloying pellet reduces cost；(2) promotor, coupling agent, diluent etc. are added in organic carrier, reduce liquid metal alloy
Surface tension improves the adhesiveness of conducting resinl and matrix；(3) it after heat preservation solidification, contacts with each other to be formed between liquid metal particle
Line or face access reduce the formation in gap between metallic particles, improve the electric conductivity of conducting resinl.
Detailed description of the invention
Fig. 1 is the differential thermal map that liquid metal conducting resinl curing process determines in embodiment 1.
Specific embodiment
In order to be more clear the purpose of the present invention, technical advantage, feature, below by preferred implementation case to the present invention
It is described further, but the content of present invention is not limited to following embodiment.
Embodiment 1:
By way of stirring, bisphenol f type epoxy resin, triethanolamine 2-ethyl-4-methylimidazole, 3- aminopropyl three
Ethoxysilane, carbon 12-14 alkyl glycidyl ether, which sequentially add, is mixed into milky organic carrier, then carries out magnetic agitation
(revolving speed increases by 200 turns from 500rad/min to 1500rad/min, every 5 minutes), is stirred 0.5h to solution and forms it into
Mixing is sufficiently formed organic carrier；
The GaInSnZn alloy being in a liquid state at room temperature and above-mentioned organic carrier are mixed again, carry out magnetic force again after hand operated mixing
It is mixed into homogeneous phase after stirring (revolving speed 1500rad/min) 0.5h, that is, can be made into liquid metal conducting resinl.
The total component of the conducting resinl and as shown in the table according to the mass fraction:
Manufactured liquid metal conducting resinl is applied to test module, carries out solidification work using DSC differential scanning calorimeter
Skill determines that test heat release peak-to-peak value is 137.8 DEG C (referring to Fig. 1), determines that its curing process is to keep the temperature 0.5h at 150 DEG C.
After solidification, " (rigid material is to rigid for the measurement of GB-7124-2008-T- adhesive-tensile shear strength for reference standard
Property material) " carry out sample preparation and on WDW-50D microcomputer controlled electro minor universal testing machine carry out tensile shear strength test,
Test result is shear strength 8.2Mpa；According to standard, " ASTM D257-2007 be " insulating materials D.C. resistance or conductivity
Standard test method " " sample preparation is carried out in testing its volume resistivity 4.2 × 10 on four probe resistance rate testers-3Ω·cm。
Embodiment 2:
By way of stirring, bisphenol f type epoxy resin, triethanolamine 2-ethyl-4-methylimidazole, 3- aminopropyl three
Ethoxysilane, carbon 12-14 alkyl glycidyl ether, phosphate defoaming agent SF-561 are sequentially added and are mixed into milky white solution,
Carrying out magnetic agitation again, ((revolving speed increases by 200 turns from 500rad/min to 1500rad/min, every 5 minutes), carries out solution
Stirring 0.5h forms it into mixing and is sufficiently formed organic carrier；
The GaInSnZn alloy being in a liquid state at room temperature and above-mentioned organic carrier are mixed again, carry out magnetic force again after hand operated mixing
It is mixed into homogeneous phase after stirring (revolving speed 1500rad/min) 0.5h, that is, can be made into liquid metal conducting resinl.
The total component of the conducting resinl and as shown in the table according to the mass fraction:
Manufactured liquid metal conducting resinl is applied to test module, carries out solidification work using DSC differential scanning calorimeter
Skill determines that test peak heat release peak-to-peak value is 138.5 DEG C, determines that its curing process is to keep the temperature 0.5h. at 150 DEG C
After solidification, " (rigid material is to rigid for the measurement of GB-7124-2008-T- adhesive-tensile shear strength for reference standard
Property material) " carry out sample preparation and on WDW-50D microcomputer controlled electro minor universal testing machine carry out tensile shear strength test,
Test result 9.0Mpa；According to standard " " the code test side of insulating materials D.C. resistance or conductivity ASTM D257-2007
Method " " sample preparation is carried out in testing its volume resistivity 3.8 × 10 on four probe resistance rate testers-3Ω·cm。
Embodiment 3:
By way of stirring, bisphenol f type epoxy resin, triethanolamine 2-ethyl-4-methylimidazole, 3- aminopropyl three
Ethoxysilane, carbon 12-14 alkyl glycidyl ether, phosphate defoaming agent SF-561 are sequentially added and are mixed into milky white solution,
Magnetic agitation (revolving speed increases by 200 turns from 500rad/min to 1500rad/min, every 5 minutes) is carried out again, and solution is stirred
It mixes 0.5h and forms it into mixing and be sufficiently formed organic carrier；
The GaInSnZn alloy being in a liquid state at room temperature and above-mentioned organic carrier are mixed again, carry out magnetic force again after hand operated mixing
It is mixed into homogeneous phase after stirring (revolving speed 1500rad/min) 0.5h, that is, can be made into liquid metal conducting resinl.
The total component of the conducting resinl and as shown in the table according to the mass fraction:
Manufactured liquid metal conducting resinl is applied to test module, carries out solidification work using DSC differential scanning calorimeter
Skill determines that test heat release peak-to-peak value is 145.8 DEG C, determines that its curing process is to keep the temperature 0.5h at 150 DEG C.
After solidification, " (rigid material is to rigid for the measurement of GB-7124-2008-T- adhesive-tensile shear strength for reference standard
Property material) " carry out sample preparation and on WDW-50D microcomputer controlled electro minor universal testing machine carry out tensile shear strength test,
Test result 9.1Mpa；According to standard " " the code test side of insulating materials D.C. resistance or conductivity ASTM D257-2007
Method " " sample preparation is carried out in testing its volume resistivity 4.0 × 10 on four probe resistance rate testers-3Ω·cm。
Finally it should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although reference
Preferred embodiment describes the invention in detail, it will be appreciated by those skilled in the art that can be to technical side of the invention
Case is modified or replaced equivalently, and without departing from the spirit and scope of the technical solution of the present invention, should all be covered in this hair
In bright scope of the claims.
Claims (10)
1. one kind is i.e. with low temperature curing type liquid metal conducting resinl in using, which is characterized in that including liquid metal, matrix tree
Rouge, curing agent, diluent, functional additive, the functional additive are one of promotor, coupling agent, defoaming agent or more
Kind；The liquid metal is one of gallium-base alloy, bismuth-base alloy, indium-base alloy or kamash alloy, and the liquid metal
It is liquid at a temperature of 5 DEG C~232 DEG C.
2. according to claim 1 i.e. with low temperature curing type liquid metal conducting resinl in using, which is characterized in that the liquid
State metal is one of gallium indium, gallium tin, gallium zinc, bismuth indium bianry alloy；Or for gallium indium tin, gallium indium zinc, indium tin zinc, bismuth indium tin,
One of bismuth indium-zinc ternary alloy；One of gallium indium tin zinc, bismuth indium tin zinc quaternary alloy；Or for by lead, silver, copper, aluminium or
One of chromium or a variety of middle low temperature multicomponent alloys being formulated with one of above-mentioned binary, ternary, quaternary alloy.
3. according to claim 1 i.e. with low temperature curing type liquid metal conducting resinl in using, which is characterized in that including matter
Measure part following component: 180-400 parts of liquid metals, 100 parts of matrix resins, 10-20 parts of curing agent, 10-15 parts of diluents,
0.5-2 parts of promotors, 1-3 parts of coupling agents, 0-2 parts of defoaming agents.
4. according to claim 1 i.e. with low temperature curing type liquid metal conducting resinl in using, which is characterized in that the base
Body resin is unsaturated polyester resin, epoxy resin, phenolic resin, melamine resin, furane resins, polybutadiene tree
One of rouge, organic siliconresin, polyimides are a variety of；
The curing agent is ethylenediamine, diamines, diethylenetriamine, triethylene tetramine, diethylaminopropylamine, m-phenylene diamine (MPD), suitable
One of anhydride maleique, tertiary ammonia class triethanolamine are a variety of.
5. according to claim 1 i.e. with low temperature curing type liquid metal conducting resinl in using, which is characterized in that described dilute
Releasing agent is alkylidene glycidol ether, butyl glycidyl ether, 1,4- butanediol diglycidyl ether, ethylene glycol diglycidyl
Ether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, C12-14 fatty glycidyl ether, benzyl glycidyl ether, 1,
One or more of 6- hexanediol diglycidyl ether；
The coupling agent is vinyltriethoxysilane, vinyltrimethoxysilane, (the β alkene methoxyl group ethoxy of vinyl three
Base) silane, titanate esters, Aluminate, tri- mercaptopropyltriethoxysilane of γ, one of 3- aminopropyl triethoxysilane or more
Kind.
6. according to claim 1 i.e. with low temperature curing type liquid metal conducting resinl in using, which is characterized in that the rush
It is DMP-30, EP-184, BDMA, CT-152X, DBU, EP-184,399, K-61B, CT-152X, 2E4MZ (2- ethyl -4- into agent
Methylimidazole) one of or it is a variety of；
The defoaming agent is silicone emulsion, the fatty acid ester compounded object of higher alcohols, polyoxyethylene polyoxypropylene pentaerythrite ether, polyoxy
Ethylene polyoxy propyl alcohol amidogen ether, polypropylene glycerol aether and polyoxyethylene polyoxypropylene glycerin ether, dimethyl silicone polymer, phosphate
One of defoaming agent is a variety of；
Described matrix resin is bisphenol f type epoxy resin, and curing agent is tertiary amines triethanolamine etc., and promotor is 2- ethyl -4-
Methylimidazole etc., coupling agent are 3- aminopropyl triethoxysilane etc., and diluent is carbon 12-14 alkyl glycidyl ether, defoaming
Agent is phosphate defoaming agent.
7. the preparation method described in any one of claims 1-6 i.e. with low temperature curing type liquid metal conducting resinl in using,
It is characterized in that, comprising steps of
1) liquid metal alloy, matrix resin, curing agent, diluent, functional additive are weighed according to the proportion；
2) weighed curing agent, diluent, functional additive are sequentially added in matrix resin, stirring while adding keeps it mixed
Uniform organic carrier is synthesized, is stood at room temperature.
8. preparation method according to claim 7, which is characterized in that in step 2), the agitating mode is hand operated mixing
It is successively carried out with magnetic agitation；The magnetic agitation rotating speed is the rising of the interval 500rad/min-1500rad/min, and every 5min increases
Add 200 turns；
The mixing time is 0.5-2h.
9. preparation method according to claim 7, which is characterized in that further comprise the steps of:
If 3) the liquid metal fusing point be higher than room temperature, by the fusing point be higher than room temperature liquid metal alloy be placed in air or
Make constant temperature processing in vacuum；Constant temperature processing time, treatment temperature are that liquid metal alloy is changed into liquid condition and is advisable；It is excellent
Selection of land, the constant temperature processing time is 0.5-2h；Preferably, the treatment temperature is greater than or equal to the fusing point of low-melting alloy,
It is further preferable that the treatment temperature is higher than 1-10 DEG C of the low-melting alloy fusing point；
4) liquid metal alloy being in a liquid state in step 3) is added in the uniform organic carrier in step 2), in stirring
Under, high-speed stirred makes its dispersion under room temperature or heating environment, until forming paste；
Preferably, the heating stirring environment temperature is greater than or equal to the fusing point of low-melting alloy, it is further preferable that the heating
Temperature is higher than 1-10 DEG C of the liquid metal fusing point.
10. the application method described in any one of claims 1-6 i.e. with low temperature curing type liquid metal conducting resinl in using,
It is characterized in that, comprising:
Manufactured liquid metal conducting resinl is applied to test module, it is true to carry out curing process using DSC differential scanning calorimeter
It is fixed, according to the corresponding temperature of heat release peak-to-peak value of test, the corresponding temperature of the peak value+(5-20) DEG C at a temperature of, solidification
0.5-2h。
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Cited By (7)
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| CN109852281A (en) * | 2019-02-01 | 2019-06-07 | 东南大学 | A kind of preparation method of the anisotropy conductiving glue based on liquid metal |
| CN110564157A (en) * | 2019-09-05 | 2019-12-13 | 西安电子科技大学 | Mixed material of liquid metal polymer and preparation method thereof |
| CN111128441A (en) * | 2020-01-07 | 2020-05-08 | 北京梦之墨科技有限公司 | Liquid metal conductive paste and electronic device |
| CN111128440A (en) * | 2020-01-07 | 2020-05-08 | 北京梦之墨科技有限公司 | Liquid metal conductive slurry, preparation method thereof and electronic device |
| CN112898929A (en) * | 2021-02-07 | 2021-06-04 | 中国科学院工程热物理研究所 | Instant-curing liquid metal composite thermal interface material and preparation method thereof |
| CN112961633A (en) * | 2021-02-05 | 2021-06-15 | 深圳市福英达工业技术有限公司 | Low-temperature cured conductive adhesive and preparation method thereof |
| CN115232603A (en) * | 2022-05-20 | 2022-10-25 | 桂林电子科技大学 | Gallium-based liquid metal thermal interface material capable of being solidified at low temperature and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10144139A (en) * | 1996-11-12 | 1998-05-29 | Matsushita Electric Ind Co Ltd | Conductive paste fr filling via hole and printed wiring board using the paste |
| JP2002008442A (en) * | 2000-06-26 | 2002-01-11 | Tokuriki Honten Co Ltd | Thermo setting low resistant conductive paste |
| CN107274965A (en) * | 2017-07-03 | 2017-10-20 | 云南科威液态金属谷研发有限公司 | Electric slurry and its manufacture method based on low-melting-point metal micro-nano powder |
| CN107452436A (en) * | 2017-07-04 | 2017-12-08 | 云南科威液态金属谷研发有限公司 | A kind of liquid metal electric slurry and preparation method thereof |
-
2018
- 2018-08-07 CN CN201810907262.4A patent/CN109135611A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10144139A (en) * | 1996-11-12 | 1998-05-29 | Matsushita Electric Ind Co Ltd | Conductive paste fr filling via hole and printed wiring board using the paste |
| JP2002008442A (en) * | 2000-06-26 | 2002-01-11 | Tokuriki Honten Co Ltd | Thermo setting low resistant conductive paste |
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Application publication date: 20190104 |