CN109135612B - Low-melting-point metal micro-nano powder conductive adhesive and preparation method thereof - Google Patents
Low-melting-point metal micro-nano powder conductive adhesive and preparation method thereof Download PDFInfo
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- CN109135612B CN109135612B CN201810928952.8A CN201810928952A CN109135612B CN 109135612 B CN109135612 B CN 109135612B CN 201810928952 A CN201810928952 A CN 201810928952A CN 109135612 B CN109135612 B CN 109135612B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
Abstract
The invention provides a low-melting-point metal micro-nano powder conductive adhesive which comprises 50-90% of conductive filler and 10-50% of matrix resin by mass ratio; the conductive filler comprises the following components in percentage by mass: 50-90% of low-melting-point metal micro-nano powder and 10-50% of silver powder. The invention also provides preparation and application of the low-melting-point metal micro-nano powder conductive adhesive. Compared with Pd-Sn alloy and lead-free solder, the conductive adhesive has the advantages of environmental friendliness, low-temperature bonding, good adhesion, strong fine line printing capability and capability of being used for connecting a flexible circuit; compared with the conductive silver adhesive and the copper adhesive in the current market, the conductive adhesive has the advantages of good heat conductivity, small volume resistivity, high bonding strength, simple process and the like, and meanwhile, the preparation method is simple, easy to operate and far lower in cost than the conductive silver adhesive.
Description
Technical Field
The invention belongs to the technical field of integrated circuits, and particularly relates to a chip packaging material and a preparation method thereof.
Background
At present, there are two types of materials for replacing Sn-Pb solder at home and abroad, namely lead-free solder and conductive adhesive. The soldering temperature of Sn-Ag and Sn-Ag-Cu brazing filler metals with the most application prospect in the lead-free brazing filler metals is about 40 ℃ higher than that of Sn-Pb brazing filler metals, most of welding components cannot bear the temperature, and the reliability of electronic components is greatly reduced due to the use of the lead-free brazing filler metals. In addition, solder materials such as Sn-Bi and Sn-In are limited In their application due to their rare components and high price.
The conductive adhesive is an adhesive with certain conductive performance after being cured or dried, and generally takes matrix resin and conductive filler, namely conductive particles as main components, and the conductive particles are combined together to form a conductive path through the bonding action of the matrix resin, so that the conductive connection of the bonded materials is realized.
The most widely used conductive adhesives traditionally use silver and copper powders as conductive fillers. The silver powder has good conductivity, and the oxide of the silver powder also has certain conductivity, so the silver powder or silver-plated material is widely applied as conductive filler, silver powder conductive adhesive is generally used in some fields requiring the conductive adhesive to have good conductivity, but the silver powder conductive adhesive is easy to generate electromigration in a humid environment, and the reliability of the conductive adhesive is reduced. The silver powder conductive adhesive has high cost and poor settling stability; copper powder has better conductivity, the cost is greatly lower than that of silver powder, but copper conductive adhesive is easy to oxidize, the conductivity is greatly reduced after oxidation, even a conductive path cannot be formed, and the copper conductive adhesive has made great progress after decades of development, but the instability is still a long-term problem. Such as limited impact resistance, long-term mechanical properties and stable conductivity, the conductive adhesive has not been widely accepted in the electronics industry to replace soldering.
In order to solve the problems in the aspect, the invention provides a low-melting-point metal micro-nano powder conductive adhesive, which uses low-melting-point metal powder with low melting point and high conductivity and silver powder to be mixed as conductive filler, and has the following advantages: (1) the characteristic of low melting point can ensure that the silver powder is better combined and mutually contacted to form a line or surface passage in the curing process, and the formation of gaps among metal particles is reduced; (2) the consumption of the noble metal silver powder is reduced while good conductivity is ensured, and the production cost is greatly reduced; (3) the low-melting-point metal has good mechanical property, and the tensile shear strength of the conductive adhesive is improved after the low-melting-point metal is cured, so that the adaptability is enhanced.
Disclosure of Invention
The invention aims to overcome the defects of high welding temperature, large thermal stress, high energy consumption, harm to the environment and the like of the traditional Sn-Pb solder and lead-free solder, and simultaneously overcomes the defects of poor heat conduction, poor bonding performance, large volume resistivity, complex process, high cost and the like of the conductive silver adhesive in the existing market, thereby providing the low-melting-point metal micro-nano powder conductive adhesive.
The second purpose of the invention is to provide a preparation method of the low-melting-point metal micro-nano powder conductive adhesive.
The third purpose of the invention is to provide the application of the low-melting-point metal micro-nano powder conductive adhesive.
The purpose of the invention is realized by the following technical scheme:
a low-melting-point metal micro-nano powder conductive adhesive comprises 50-90% of conductive filler and 10-50% of matrix resin by mass ratio; the conductive filler comprises the following components in percentage by mass: 50-90% of low-melting-point metal micro-nano powder and 10-50% of silver powder.
The base resin comprises the following components in parts by mass: 100 parts of resin, 10-20 parts of curing agent, 0.5-1.5 parts of accelerator, 0.5-3 parts of coupling agent, 8-18 parts of diluent, 0.5-1 part of defoaming agent and 0.1-0.8 part of antioxidant.
The resin is one or more of polybutadiene resin, polyvinyl alcohol resin, polyvinylpyrrolidone, bisphenol A epoxy resin, bisphenol F epoxy resin, polybutadiene resin, polyvinylidene fluoride, polystyrene, polytetrafluoroethylene, epoxy resin, polyacrylic resin, polyester resin, alkyd resin, polyurethane, silicone resin, silicone-acrylate resin, vinyl resin and Arabic gum.
Wherein the curing agent is one or more of polythiol type, isocyanate type, triethanolamine, 2-ethyl-4-methylimidazole, methyl hexahydrophthalic anhydride, methyl T-31 modified amine, YH-82 modified amine, aliphatic polyamine, alicyclic polyamine, polyamide, 2-undecylimidazole, aromatic polyamine, acid anhydride, phenolic resin, amino resin, dicyandiamide and hydrazide;
the accelerant is one or more of triethylamine, imidazole, DMP-30, EP-184, BDMA, CT-152X, DBU, EP-184, 399, K-61B, CT-152X and 2E4 MZ.
Wherein the coupling agent is one or more of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl tri (beta-ethylenemethoxyethoxy) silane, titanate, aluminate, gamma-trismercaptopropyl triethoxysilane and 3-aminopropyl triethoxysilane;
the diluent is one or more of alkylene glycidyl ether, butyl glycidyl ether, 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, C12-14 fatty glycidyl ether, benzyl glycidyl ether and 1, 6-hexanediol diglycidyl ether.
Wherein the defoaming agent is one or more of emulsified silicone oil, a high-alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether, polydimethylsiloxane and a phosphate ester defoaming agent;
the antioxidant is one or more of IRGANOX1010, IRGANOX245, IRGANOX1726, UV1130, 3, 5-di-tert-butyl-4-hydroxy propionate, HHY-534 amine antioxidant, tris (2, 4-di-tert-butylphenyl) phosphite and 2, 6-di-tert-butylphenol.
The low-melting-point metal micro-nano powder is selected from one or more of elementary metal, binary alloy, ternary alloy, quaternary alloy and multi-element alloy, and the elementary metal is selected from one or two of tin, indium, zinc, bismuth and aluminum; the binary alloy is selected from one of binary alloys of tin bismuth, tin indium, tin zinc, tin aluminum, indium bismuth, indium zinc, indium aluminum, zinc bismuth, zinc aluminum, bismuth aluminum, tin silver and tin copper; the ternary alloy is selected from one or more of ternary alloys of bismuth indium tin, bismuth indium zinc, bismuth indium aluminum, bismuth tin zinc, bismuth tin aluminum, bismuth zinc aluminum, indium tin zinc, indium tin aluminum, indium zinc aluminum, tin bismuth silver, tin bismuth copper and tin silver copper; the quaternary alloy is selected from one of bismuth indium tin zinc, bismuth indium tin aluminum, bismuth indium zinc aluminum, bismuth tin zinc aluminum, indium tin zinc aluminum and tin bismuth copper silver quaternary alloy; the multi-element alloy is one of medium and low temperature multi-element alloys prepared by one or more of tin, indium, zinc, bismuth, aluminum, silver, copper and nickel and one of binary alloy, ternary alloy and quaternary alloy.
The particle size of the low-melting-point metal micro-nano powder is 1 nanometer to 25 micrometers.
Preferably, the conductive filler is prepared by fully mixing micro-nano powder of tin, indium, silver, indium tin bismuth, silver copper, tin zinc aluminum and tin bismuth copper silver according to a mass ratio of 60 (1-2): (10-20): 8-12): 3-6): 8-12): 1-3): 1-2.
The preparation method of the low-melting-point metal micro-nano powder conductive adhesive comprises the following steps:
1) weighing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant according to the proportion, and fully stirring and mixing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant to obtain matrix resin; the stirring mode is manual stirring and/or magnetic stirring;
2) weighing low-melting-point metal micro-nano powder, silver powder and other conductive fillers, and manually stirring and fully mixing the powder to obtain the conductive filler;
3) adding the conductive filler obtained in the step 2) into the uniform matrix resin obtained in the step 1), and fully mixing and rolling by using rolling equipment until a paste is formed, namely the low-melting-point metal micro-nano powder conductive adhesive.
Preferably, the rolling equipment is a three-roll mill or a planetary ball mill.
The low-melting-point metal micro-nano powder conductive adhesive is applied to chip packaging.
The invention has the beneficial effects that:
(1) compared with Pd-Sn alloy and lead-free solder, the conductive adhesive has the advantages of environmental friendliness, low-temperature bonding, good adhesion, strong fine line printing capability and capability of being used for connecting a flexible circuit; (2) compared with the conductive silver adhesive and the copper adhesive in the current market, the conductive adhesive has the advantages of good heat conductivity, small volume resistivity, high bonding strength, simple process and the like, and meanwhile, the preparation method is simple, easy to operate and far lower in cost than the conductive silver adhesive.
Drawings
FIG. 1: the invention relates to a flow chart of a preparation method of a low-melting-point metal micro-nano powder conductive adhesive.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the embodiment, the tin, indium, silver and indium tin powder is flaky or dendritic, and the particle size is 1 nanometer to 8 micrometers; the bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver powder are spherical, and the particle size is 5-25 microns. The conductive filler is prepared by fully manually stirring and mixing tin, indium, silver, indium tin bismuth, tin silver copper, tin zinc aluminum and tin bismuth copper silver micro-nano powder according to a mass ratio of 60:1:15:10:5:10:2:2, wherein the stirring time is 10-20 min.
The conductive filler has the beneficial effects that the conductive path of the metal powder in the conductive adhesive can be increased, and the volume resistivity of the conductive adhesive is obviously reduced; by adding the ternary alloy powder, the oxidation resistance of the conductive adhesive is obviously improved, and the service life of the conductive adhesive is prolonged.
Example 1
The invention provides a low-melting-point metal micro-nano powder conductive adhesive which is composed of 30% of matrix resin and 70% of conductive filler by mass ratio. Wherein the matrix resin is prepared by mixing bisphenol F type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, carbon 12-14 alkyl glycidyl ether, a phosphate ester defoaming agent and IRGANOX1726 according to the mass ratio of 100:16:1.2:2:10:0.8: 0.5; the conductive filler is prepared by fully mixing tin, indium, silver, indium tin, bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver micro-nano powder according to a mass ratio of 60:1:15:10:5:10:2: 2.
The preparation method of the low-melting-point metal micro-nano powder conductive adhesive is shown in a flow chart of fig. 1. The preparation method comprises the following steps:
1) weighing the epoxy resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant according to the proportion, and fully stirring and mixing the epoxy resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant to obtain matrix resin;
2) weighing low-melting-point metal micro-nano powder, silver powder and other conductive fillers, and manually stirring and fully mixing the powder to obtain the conductive filler;
3) adding the conductive filler obtained in the step 2) into the uniform matrix resin obtained in the step 1), and fully mixing and rolling by using rolling equipment until a paste is formed, namely the low-melting-point metal micro-nano powder conductive adhesive.
Example 2:
the invention provides a low-melting-point metal micro-nano powder conductive adhesive which is composed of 25% of matrix resin and 75% of conductive filler in a mass ratio. Wherein the matrix resin is prepared by mixing bisphenol F type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, carbon 12-14 alkyl glycidyl ether, a phosphate ester defoaming agent and IRGANOX1726 according to the mass ratio of 100:16:1.2:2:10:0.8: 0.5; the conductive filler is prepared by fully mixing tin, indium, silver, indium tin, bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver micro-nano powder according to a mass ratio of 60:1:15:10:5:10:2: 2.
The preparation method of the low-melting-point metal micro-nano powder conductive adhesive is shown in a flow chart of fig. 1. The preparation method comprises the following steps:
1) weighing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant according to the proportion, and fully stirring and mixing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant to obtain matrix resin;
2) weighing low-melting-point metal micro-nano powder, silver powder and other conductive fillers, and manually stirring and fully mixing the powder to obtain the conductive filler;
3) adding the conductive filler obtained in the step 2) into the uniform matrix resin obtained in the step 1), and fully mixing and rolling by using rolling equipment until a paste is formed, namely the low-melting-point metal micro-nano powder conductive adhesive.
Example 3:
the invention provides a low-melting-point metal micro-nano powder conductive adhesive which is composed of 20% of matrix resin and 80% of conductive filler in a mass ratio. Wherein the matrix resin is prepared by mixing bisphenol F type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, carbon 12-14 alkyl glycidyl ether, a phosphate ester defoaming agent and IRGANOX1726 according to the mass ratio of 100:16:1.2:2:10:0.8: 0.5; the conductive filler is prepared by fully mixing tin, indium, silver, indium tin, bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver micro-nano powder according to a mass ratio of 60:1:15:10:5:10:2: 2.
The preparation method of the low-melting-point metal micro-nano powder conductive adhesive is shown in a flow chart of fig. 1. The preparation method comprises the following steps:
1) weighing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant according to the proportion, and fully stirring and mixing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant to obtain matrix resin;
2) weighing low-melting-point metal micro-nano powder, silver powder and other conductive fillers, and manually stirring and fully mixing the powder to obtain the conductive filler;
3) adding the conductive filler obtained in the step 2) into the uniform matrix resin obtained in the step 1), and fully mixing and rolling by using rolling equipment until a paste is formed, namely the low-melting-point metal micro-nano powder conductive adhesive.
Example 4:
the invention provides a low-melting-point metal micro-nano powder conductive adhesive which is composed of 15% of matrix resin and 85% of conductive filler in a mass ratio. Wherein the matrix resin is prepared by mixing bisphenol F type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, carbon 12-14 alkyl glycidyl ether, a phosphate ester defoaming agent and IRGANOX1726 according to the mass ratio of 100:16:1.2:2:10:0.8: 0.5; the conductive filler is prepared by fully mixing tin, indium, silver, indium tin, bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver micro-nano powder according to a mass ratio of 60:1:15:10:5:10:2: 2.
The preparation method of the low-melting-point metal micro-nano powder conductive adhesive is shown in a flow chart of fig. 1. The preparation method comprises the following steps:
1) weighing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant according to the proportion, and fully stirring and mixing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant to obtain matrix resin;
2) weighing low-melting-point metal micro-nano powder, silver powder and other conductive fillers, and manually stirring and fully mixing the powder to obtain the conductive filler;
3) adding the conductive filler obtained in the step 2) into the uniform matrix resin obtained in the step 1), and fully mixing and rolling by using rolling equipment until a paste is formed, namely the low-melting-point metal micro-nano powder conductive adhesive.
Example 5:
the invention provides a low-melting-point metal micro-nano powder conductive adhesive which is composed of 10% of matrix resin and 90% of conductive filler by mass ratio. Wherein the matrix resin is prepared by mixing bisphenol F type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, carbon 12-14 alkyl glycidyl ether, a phosphate ester defoaming agent and IRGANOX1726 according to the mass ratio of 100:16:1.2:2:10:0.8: 0.5; the conductive filler is prepared by fully mixing tin, indium, silver, indium tin, bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver micro-nano powder according to a mass ratio of 60:1:15:10:5:10:2: 2.
The preparation method of the low-melting-point metal micro-nano powder conductive adhesive is shown in a flow chart of fig. 1. The preparation method comprises the following steps:
1) weighing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant according to the proportion, and fully stirring and mixing the resin, the curing agent, the accelerator, the coupling agent, the diluent, the defoaming agent and the antioxidant to obtain matrix resin;
2) weighing low-melting-point metal micro-nano powder, silver powder and other conductive fillers, and manually stirring and fully mixing the powder to obtain the conductive filler;
3) adding the conductive filler obtained in the step 2) into the uniform matrix resin obtained in the step 1), and fully mixing and rolling by using rolling equipment until a paste is formed, namely the low-melting-point metal micro-nano powder conductive adhesive.
In the above embodiments, from example 1 to example 5, the content of the conductive filler is increased from 70% to 90%, and the conductive performance of the conductive adhesive is improved. And can be adjusted between 50% and 90% according to actual requirements. The conductive pastes prepared in examples 1 to 5 were tested. The results are shown in Table 1.
Table 1: conductive adhesive testing performance parameters
Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all of them should be covered by the claims of the present invention.
Claims (5)
1. The low-melting-point metal micro-nano powder conductive adhesive is characterized by comprising 50-90% of conductive filler and 10-50% of matrix resin by mass ratio; the conductive filler is prepared by fully mixing micro-nano powder of tin, indium, silver, indium tin, bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver according to a mass ratio of 60:1:15:10:5:10:2: 2; the matrix resin is prepared by mixing bisphenol F type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, carbon 12-14 alkyl glycidyl ether, a phosphate defoaming agent and IRGANOX1726 according to the mass ratio of 100:16:1.2:2:10:0.8: 0.5.
2. The low-melting-point metal micro-nano powder conductive adhesive according to claim 1, wherein the particle size of tin, indium tin bismuth, indium tin, tin silver copper, tin zinc aluminum, tin bismuth copper silver is 1 nanometer-25 micrometers.
3. The preparation method of the low-melting-point metal micro-nano powder conductive adhesive according to claim 1 or 2, which is characterized by comprising the following steps:
1) weighing the bisphenol F type epoxy resin, the tertiary amine triethanolamine, the 2-ethyl-4-methylimidazole, the 3-aminopropyltriethoxysilane, the C12-14 alkyl glycidyl ether, the phosphate defoamer and the IRGANOX1726 according to the proportion, and fully stirring and mixing to obtain a matrix resin; the stirring mode is manual stirring and/or magnetic stirring;
2) weighing tin, indium, silver, indium tin, bismuth indium tin, tin silver copper, tin zinc aluminum and tin bismuth copper silver, and manually stirring and fully mixing the powder to obtain the conductive filler;
3) adding the conductive filler obtained in the step 2) into the uniform matrix resin obtained in the step 1), and fully mixing and rolling by using rolling equipment until a paste is formed, namely the low-melting-point metal micro-nano powder conductive adhesive.
4. The method according to claim 3, wherein the rolling device is a three-roll mill or a planetary ball mill.
5. The use of the low-melting-point metal micro-nano powder conductive adhesive of claim 1 or 2 in chip packaging.
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| CN110964461A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Thermosetting anisotropic conductive adhesive and preparation method thereof |
| CN109679552B (en) * | 2018-11-16 | 2021-07-13 | 云南科威液态金属谷研发有限公司 | Liquid metal conductive adhesive and application thereof |
| CN110213883B (en) * | 2019-06-28 | 2020-04-28 | 智玻蓝新科技(武汉)有限公司 | Preparation process of glass-based circuit board conductive circuit |
| CN110580970B (en) * | 2019-09-02 | 2021-01-26 | 东莞市银屏电子科技有限公司 | High-adhesion low-temperature conductive silver paste for solar HIT (heterojunction with intrinsic thin layer) cell and preparation method thereof |
| CN111040691B (en) * | 2019-11-29 | 2021-01-26 | 江苏富威尔电子材料科技有限公司 | Multi-component metal conductive adhesive based on different melting points and preparation method thereof |
| CN111334221A (en) * | 2020-04-02 | 2020-06-26 | 苏州鑫导电子科技有限公司 | Conductive adhesive and application thereof |
| CN112898929A (en) * | 2021-02-07 | 2021-06-04 | 中国科学院工程热物理研究所 | Instant-curing liquid metal composite thermal interface material and preparation method thereof |
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| CN109135612A (en) | 2019-01-04 |
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