CN102559092A - Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method - Google Patents
Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method Download PDFInfo
- Publication number
- CN102559092A CN102559092A CN201210026233XA CN201210026233A CN102559092A CN 102559092 A CN102559092 A CN 102559092A CN 201210026233X A CN201210026233X A CN 201210026233XA CN 201210026233 A CN201210026233 A CN 201210026233A CN 102559092 A CN102559092 A CN 102559092A
- Authority
- CN
- China
- Prior art keywords
- resin
- conducting
- conductive
- conductive resin
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a conductive adhesive for conducting the plug hole of a circuit board, comprising the following components in ratio by weight: 5-29% of (A) high-temperature-resistant resin, at least 70-5% of (B) tin or tin alloy conductive particles, and the balance of (C) other metallic or non-metallic conductive particles. The invention further discloses a double-sided multi-layer printed circuit board produced by the conductive adhesive and a method for producing the circuit board, wherein the method comprises the following steps of: pre-pressing the copper foil of one side on any one side of an insulating base material at a low temperature to form a single-sided copper-coated base material; machining a conducting hole, compounding the copper foil of the other side on the other side of the insulating base material to form the conducting hole; printing the conductive adhesive containing 5-29% by volume of high-temperature-resistant resin, 70-5% of tin or tin alloy particles, and conductive particles in a groove and then curing, so as to electrically connect the copper foils of the both sides; and machining circuits on the both sides of the double-sided circuit board. The conductive adhesive for conducting the plug hole of a circuit board disclosed by the invention has the advantages of being less in cost, good in adsorbability, wide in application range, good in quality guarantee coefficient, and convenient in operation.
Description
Technical field
The present invention relates to a kind of conductive resin, more particularly, relate in particular to conductive resin that a kind of consent uses and single double-sided multi-layer printed substrate made from this conductive resin.
Background technology
Well-known, it is electroplating technology mostly that the communicating pores technology of the double-sided multi-layer wiring board on the current market adopts, and electroplating technology also causes great pressure to enterprise on production cost except causing environmental pollution.So; Increasing printed circuit board enterprise will consider and not adopt electroplating technology to handle communicating pores, generally all can adopt gimmicks such as silver paste hole filled, copper slurry perforation, carbon ink perforation, and silver paste hole filled cost is high; Scarcely be used; Carbon ink resistance value is big, and the use range limitation is very big, and can only make the lower product of ask for something.Copper slurry perforation cost is moderate, but because the copper oxidation is fast, and operation difficulty during production, particularly acid and alkali-resistance not easily by acid and alkali corrosion, cause the perforation ability to have a greatly reduced quality.Also there is the safety of heat shock resistance in several kinds of above perforation methods, the stability of resistance value with adhere to problems such as dynamics dies down.
Like the patent No. be: the patent of invention of " 99106371.6 " discloses the conductive resin that a kind of aperture is filled usefulness, and this conductive resin is in order to improve the heat shock resistance safety, the stability of resistance value and the problems such as stability of sticking power; The viscosity and the TI value that have proposed conductive resin are low more good more; The TI value is adjusted at below 1.0 to strengthen the effect of printing, makes through hole full, be but the professional person is total to knowledge in the industry; This practice will inevitably cause the substrate two sides to have conductive resin to emerge; Must increase the polishing operation, the conductive resin that will emerge grinds off, otherwise damaged or because the problems such as line short that excessive glue causes of upper layer Copper Foil behind the hot pressing can occur.In addition, this conductive resin for increase its substrate and and Copper Foil between sticking power, and the ratio of the carrier-epoxy compound resin of conductive resin is set at more than 30%; As everyone knows, the high conducting material of resin content will its resistance value of corresponding minimizing will reduce, and resin content is high; After receiving thermal shocking, the rate of expansion of conductive resin is just higher, further influences resistance value; Like this, in the actual production operating process of wiring board, the operating parameters of each construction just requires strict relatively; There have deviation to cause slightly to be bad, makes its quality ensure that coefficient reduces, and potential quality risk is bigger.Also have, the metal conductive particles that this conductive resin requires " median size is 0.5～20um, and its specific surface area is 0.05～105m
2/ g " on the selecting materials of conducting particles, also bring inconvenience, cost rises.Also have this conductive resin to bigger via, ward off like the hole more than the 0.5mm, in the hole, cause bubble easily, easy blast hole or the like diminishes its range of application, degradation situation under the operation ease after thermal shocking.Therefore, how to address the above problem, be problem demanding prompt solution.
Summary of the invention
The present invention aims to provide that cost is few, excellent adsorption, applied range, and quality ensures coefficient better and the conductive resin of a kind of wiring board consent conducting of being convenient to operate, and the present invention also provides single double-sided multi-layer printed substrate and the making method of using this conductive resin.
A kind of conductive resin that is used for the conducting of wiring board consent of the present invention comprises weight ratio and is: (A) fire resistant resin of 5%～29%, comprise 70%～5% (B) tin or (C) other metal or the nonmetallic conducting particles of tin alloy conducting particles and surplus at least.
The above-mentioned conductive resin that is used for the conducting of wiring board consent; Described fire resistant resin comprises epoxy compound resin, polyimide based resin, resol, selects at least a in polyvinyls, acrylics, polyethers, vibrin, polyamide resin, the urethane.
The above-mentioned conductive resin that is used for the conducting of wiring board consent, the scope of selecting materials of metal conductive particles is following:
1. from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, select at least a particle.
The alloy particle of the arbitrary combination of 2. from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, selecting.
3. be nuclear with conduction or non-conductive particle, use the particle of from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, selecting at least a metallic cover.
4. be nuclear with conduction or non-conductive particle, use the particle of the alloy coating of the arbitrary combination of from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, selecting.
The above-mentioned conductive resin that is used for the conducting of wiring board consent, the nonmetal conducting particles scope of selecting materials is following:
The particle that comprises any one particles such as carbon black, thomel, graphite or any one combination.
The above-mentioned conductive resin that is used for the conducting of wiring board consent, described fire resistant resin also comprise stopping composition that is complementary with resin and conducting particles and the various promotors that are complementary with resin and stopping composition; The stopping composition of described stopping composition conductive titanium dioxide class; Described promotor is the promotor of resin curing agent, softening agent, skimmer, TI adjustment agent class.
The above-mentioned conductive resin that is used for the conducting of wiring board consent, described tin alloy conducting particles is Sn-Al alloy, sn-bi alloy, sn-ag alloy, gun-metal, tin lead closes entirely, tin indium oxide, antimony doped tin oxide and various tin plated materials.
A kind of double-sided multi-layer printed substrate of the present invention; Comprise insulating substrate, be compounded in the copper foil layer of insulating substrate one side; On above-mentioned composition board, offer via; At the opposite side of the insulating substrate copper foil layer that has been sticked, be arranged on up and down in the via between the Copper Foil like the described conductive resin of above-mentioned arbitrary claim.
Above-mentioned double-sided multi-layer printed substrate, described insulating substrate can be polyester, polycarbonate, the high temperature material of polyimide or the composite base material or the glass epoxide type base materials of infiltration of tynex cloth or coated heat thermosetting resin that has the hot melt viscose glue.
The making method of a kind of double-sided multi-layer printed substrate of the present invention comprises the steps: 1) with a Copper Foil with any one side of low temperature precompressed at insulating substrate, form single face and cover the copper base-material, process via then; 2) the another side Copper Foil is compounded on the another side of insulating substrate, via forms " recessed " groove; 3) the described conductive resin of above-mentioned arbitrary claim is executed seal to described " recessed " in-tank-solidification, make the circuit on two sides Copper Foil conducting and processing double-sided PCB two sides.
Above-mentioned a kind of making method of making the double-sided multi-layer printed substrate with conductive resin; On the basis of above-mentioned step 1～3, increase step: be laminated with insulating substrate and the Copper Foil that one deck processes via 4) and then on the internal layer two sides; Form " recessed " groove, execute the seal conductive resin, make internal layer and the circuit of outer one deck line conduction with processing double-sided PCB two sides; Step is analogized according to this, forms the more multilayer circuit board of multilayer number.
Above-mentioned a kind of making method of making the double-sided multi-layer printed substrate with conductive resin, the conductive resin of the groove of multilayer circuit board also can be processed circuit earlier and again conductive resin executed to print to groove and solidify.
The conductive resin that this programme is made has the advantage of following several respects: the first, the carrier of conductive resin-A material, its preferred weight ratio is set at 15-25%, has reduced the coefficient of expansion of A material after receiving thermal shocking, reduces the influence of thermal shocking to it.The second, A material chosen scope can be hydrophilic resin, also can be oil loving resin, and the curing mode of conductive resin also is various, can be seasoning also can be UV exsiccant and thermofixation etc.Three, most critical is; This programme be set with preferred weight ratio be 20-50% the tin particle inside; The wiring board making method that cooperates this programme to propose, tin particle stand tin pellet melting behind the high temperature through operation section at the weldering electronic component of thermal shocking or the wiring board made the time; Closely follow the metallics and the Copper Foil of wiring board that are set in this programme, so its sticking power can be very good.Four, the scope of selecting materials of C material is very wide in this programme, so long as 1500 orders are above, convenient metallics through printing screen plate, no matter be sheet or round bead shape, or other irregular shape can be selected for use, greatly reduces cost.Five, antiacid caustic corrosion ability is strong, because of the alkali corrosion resistance ability of metallic tin own is strong, so the conductive resin of this programme need not painstakingly to avoid the soda acid thing, has made things convenient for the making of processing procedure in wiring board making and use.Six, the viscosity of this programme conductive resin and TI value do not need special setting, cooperate the use of the making wiring board method of this programme proposition, only need satisfy the printshop and ask just, the application when having made things convenient for the making of conductive resin and having made wiring board.
Description of drawings
To combine the specific embodiment in the accompanying drawing that the present invention is done to specify further below, but not constitute any restriction of the present invention.
Fig. 1 is the structure and the step synoptic diagram of the making method of a kind of double-sided multi-layer printed substrate of the present invention;
Fig. 2 is the structure and the step synoptic diagram of the making method of another kind of double-sided multi-layer printed substrate of the present invention;
Fig. 3 is the structure and the step synoptic diagram of the making method of another double-sided multi-layer printed substrate of the present invention.
Fig. 4 is a kind of double-sided multi-layer printed circuit board arrangement synoptic diagram of the present invention.
Embodiment
A kind of conductive resin that is used for the conducting of wiring board consent of the present invention comprises weight ratio and is: (A) fire resistant resin of 5%～29%, comprise 70%～5% (B) tin or (C) other metal or the nonmetallic conducting particles of tin alloy conducting particles and surplus at least.
Fire resistant resin comprises epoxy compound resin, polyimide based resin, resol, selects at least a in polyvinyls, acrylics, polyethers, vibrin, polyamide resin, the urethane.
The scope of selecting materials of metal conductive particles is following:
1. from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, select at least a particle.
The alloy particle of the arbitrary combination of 2. from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, selecting.
3. be nuclear with conduction or non-conductive particle, use the particle of from gold, platinum, silver, palladium, copper, nickel, aluminium indium, selecting at least a metallic cover.
4. be nuclear with conduction or non-conductive particle, use the particle of the alloy coating of the arbitrary combination of from gold, platinum, silver, palladium, copper, nickel, aluminium indium, selecting.
The nonmetal conducting particles scope of selecting materials is following:
The particle that comprises any one particles such as carbon black, thomel, graphite or any one combination.
Fire resistant resin also comprises stopping composition that is complementary with resin and conducting particles and the various promotors that are complementary with resin and stopping composition; The stopping composition of described stopping composition conductive titanium dioxide class; Described promotor is the promotor of resin curing agent, softening agent, skimmer, TI adjustment agent class.
The tin alloy conducting particles is Sn-Al alloy, sn-bi alloy, sn-ag alloy, gun-metal, and tin lead closes entirely, tin indium oxide, antimony doped tin oxide and various tin plated materials.
Various materials in the C material can be round bead shape or sheet or other irregular status.
Shown in Fig. 1～3; A kind of double-sided multi-layer printed substrate; Comprise insulating substrate 1, be compounded in the copper foil layer 2 of insulating substrate 1 one sides; On above-mentioned composition board, offer via 3, at the opposite side of insulating substrate 1 copper foil layer 2 that has been sticked, like above-mentioned conductive resin 4) be arranged on up and down in the via 3 between the Copper Foil.
Insulating substrate can be high temperature material or the composite base material or the glass epoxide type base materials of infiltration of tynex cloth or coated heat thermosetting resin such as the polyester that has the hot melt viscose glue, polycarbonate, polyimide.
This combination conductive resin is applied to single, double, the bonding coat between circuit printing when multilayer circuit board is manufactured (directly replace conducting circuit) and layer and the layer, layer with layer between through hole conducting, line and line between bonding, repairing is connected and wiring board and electronic component between effects such as welding.
This combination conductive resin can also be applicable to FPC and gentle-hard combined circuit board except that being applied to rigid wiring board, and is printed on the materials such as polyester, polycarbonate, polyimide, uses as bonding, grout, conducting, circuit connection and welding.
This combination conductive resin can also be applied to bonding, the encapsulation and the welding of various electronic components and use.
Shown in Fig. 1～2, a kind of making method of double-sided multi-layer printed substrate comprises the steps: 1) with a Copper Foil with any one side of low temperature precompressed at insulating substrate, form single face and cover the copper base-material, process via then; 2) the another side Copper Foil is compounded on the another side of insulating substrate, via forms " recessed " groove; 3) the described conductive resin of above-mentioned arbitrary claim is executed seal to described " recessed " in-tank-solidification, make the circuit on two sides Copper Foil conducting and processing double-sided PCB two sides.
As shown in Figure 3; A kind of making method of making the double-sided multi-layer printed substrate with conductive resin increases step on the basis of the described step 1 of claim 9～3: 4) and then on the internal layer two sides be laminated with insulating substrate and the Copper Foil that one deck processes via, form " recessed " groove; Execute the seal conductive resin; Make internal layer and outer one deck line conduction, step is analogized according to this, forms the more multilayer circuit board and the circuit of processing the double-sided PCB two sides of multilayer number.
A kind of making method of making the double-sided multi-layer printed substrate with conductive resin, the conductive resin of the groove of multilayer circuit board also can be processed circuit earlier and again conductive resin executed to print to groove and solidify.
Making method during the conductive resin practical implementation:
1, the fire resistant resin in the A material is dissolved in the solvent that is complementary with it, adds stopping composition and each function promotor etc. then, be made into solution one;
2, the solidifying agent with fire resistant resin in the A material is dissolved in the solvent, fully grinds through three-roll grinder, is made into solution two.(resin according to the A material of selecting for use decides, and as not needing solidifying agent, then removes this operation from);
3, B material and C material are added respectively among the solution that is complementary with the A material, after fully stirring, grind two to four times, be made into solution three through three-roll grinder.
When 4, using solution two is added in the solution three in proportion, stir, use the thinner modulation to be fit to the viscosity of printing or coating, can use.As do not have solidifying agent then directly adjust viscosity after use.
5, the coating after printing or the coating is solidified or is got final product through 130 ℃-230 ℃ * 15-30 minute (solidified mode and condition temperature are decided because of resin and the solidifying agent selected for use) curing through natural air drying or UV.
The specific embodiment of the making of conductive resin:
Originally the scheme of giving an example adopts is that (vibrin is one of resin of often using of various conductive silver pastes, conductive copper paste, conductive carbon paste for about 98% vibrin; All be easy to obtain in each Chemical market) as the A material; Adopt 2000 purpose pure tin powder as the B material; Adopt 2000 purposes silver copper-clad sheet powder as C material (above product all has sale in Chemical market), adopt 783 slow curing water to do the water solvent allotment, the employing ratio does; A material 20%B material 35%C material 45%, 783 slow curing water is in requisition for adding.
At first each C material of B material is added a small amount of 783 slow curing water respectively; Make it moistening, with after fully stirring in B material and the C material adding A material, put into three-roll grinder and grind three times then; Make conductive resin; The RION VISCOTESTER VT-04F viscometer that adopts Japan to produce detects pin for No. 2 and detects, and is 100PS when conductive resin viscosity is adjusted to 25 ℃, can use.
3,6, No. 9 article
Fire resistant resin adopts 5% volume and tin or tin alloy particle to adopt 5% volume, and then copper powder adopts 90% volume.
4,7, No. 10 article
Fire resistant resin adopts 25% volume and tin or tin alloy particle to adopt 30% volume, and then copper powder adopts 45% volume.
No. 12 article
Fire resistant resin adopts 35% volume and tin or tin alloy particle to adopt 30% volume, and then copper powder adopts 35% volume.
No. 13 article
Fire resistant resin adopts 29% volume and tin or tin alloy particle to adopt 41% volume, and then copper powder adopts 30% volume.
(1) base material is selected for use:
1, the no hot melt adhesive polyimide base material of 0.1mm thickness.
2, the single face of 0.1mm thickness is coated with the polyimide base material (hot melt adhesive thickness is 30um) of semicure hot melt adhesive
3, the two-sided polyimide base material (hot melt adhesive thickness is 30um) that is coated with the semicure hot melt adhesive of 0.1mm thickness
4, thickness is the pure copper foil of 18um.
Above material market all has sale.
(2) wiring board is made embodiment:
Embodiment one (making of single sided board)
The no hot melt adhesive polyimide of base material: 0.1MM;
The silk screen of printing equipment: 77T (i.e. 200 orders);
Working method:
1, cut behind the base material dust oil stain of substrate surface etc. is removed clean;
2, adopt the 77T silk screen directly at the substrate surface printed wiring;
3, printing is after 130 ℃ of oven dry in-150 ℃ * 30 minutes promptly obtain line layer;
4, be total to the method for knowing in the application industry and make resist and character layer, can draw complete wiring board.
Embodiment two (one of making of dual platen)
Base material: 1, the single face of 0.1mm thickness is coated with the polyimide base material (hot melt adhesive thickness is 30um) of semicure hot melt adhesive;
2,18UM Copper Foil
The aperture of via: 0.5MM
Printing equipment: 77T (i.e. 200 orders) silk screen
Working method 1, elder generation adopt mechanical stamping with the polyimide base material that single face is covered with the semicure thermosol resin of 30um thickness according to engineering data, forms such as machine drilling or laser drill processing via and pilot hole etc.;
The base material and the Copper Foil that 2, will process via press together, and the pressing condition is 180 ℃ of temperature, 100 kilograms of pressure, 60 seconds time;
3, solidified in 150 ℃ * 60 minutes in pressing is good base material footpath;
4, adopt the caustic solution of knowing in the industry that the circuit of the one side of Copper Foil is made;
5, adopt the method printed wiring that connects plug band seal with this programme conductive resin in the one side that does not have Copper Foil.Conductive resin passes via and the copper-clad surface conducting of staying before this.After oven dry in 150 ℃ * 30 minutes, just process the wiring board of double-side conduction.
6, promptly draw complete dual platen wiring board with institute's well-known process making welding resisting layer and character within the row;
7, the 4th step gathered with the 5th step order of gathering and can change sequentially built flexibly according to the status of equipment of factory and engineering staff's practical situation such as plan in this embodiment, and its way is the same with effect.
Embodiment three (dual platen making two)
Base material: 1, the two-sided polyimide base material (hot melt adhesive thickness is 30um) that is coated with the semicure hot melt adhesive of 10.1mm thickness
2,18UM Copper Foil;
The aperture of via: 0.5MM.
Printing equipment: 77T (i.e. 200 orders) silk screen.
Working method: 1, earlier a Copper Foil precompressed is combined on the one side of the two-sided base material that covers glue, condition is: temperature 80-100 ℃, and pressure 60-80 kilogram, time 15-25 second.
2 and then it is processed through hole and pilot hole etc. according to engineering data.
3, again another side (not having copper-clad surface) is covered with Copper Foil, through pressing machine pressing and forming, the pressing condition is: 180 ℃ of temperature, pressure 100-120 kilogram, 80 seconds time.
4, again that pressing is good two-sided copper foil base material solidified through 150 ℃ * 60 minutes and has just made wherein a Copper Foil and do not open the hole, and another side connects the substrate that base-material is held through hole together successfully, and the through hole is " recessed " groove shape.
5, the printing conductive glue at " recessed " groove place.Get final product through oven dry in 150 ℃ * 30 minutes then.
6, produce the two sides circuit with the method for being known in the industry again.
7, make welding resisting layer and character etc. with the method for being known in the industry again and just formed complete wiring board.
8, the 5th in this embodiment step gather with the 6th step gather can be mutually flexibly transposing in proper order its making method be the same with effect.
Embodiment four (four laminates of the making of multi-ply wood are made)
1, adopt the method for the embodiment three of originally giving an example to produce the two or three layer line road earlier.
2, adopt and two-sidedly to cover the precompressed of glue polyimide and go out the first layer and the 4th layer of Copper Foil.
3, the first layer that precompressed is got togather and the 4th layer of processing via and pilot hole.
The first layer and the 4th layer that 4, will process via are pressed together on respectively on second and the 3rd layer.
5, groove is executed the seal conductive resin and is solidified on the two sides.
6, adopt the method for being known in the industry to make the first and the 4th layer line road.
7, the method that adopts industry to know makes welding resisting layer and character layer promptly is made into four layers of complete wiring board.
In addition: wiring board can be got final product toward additional layer by the lining according to the 2nd, 3,4,5,6 steps in the scheme four more than six layers.
Three, function test
(1) test condition:
Base material: the polyimide base material of the double-sided belt semicure hot melt adhesive of 0.1MM thickness (hot melt adhesive thickness is 30UM)
Copper thickness: 18UM
Via diameter: 0.5MM
Printing equipment: the aluminium flake consent half tone of 0.1MM thickness
(2) making processes
1, earlier with a Copper Foil precompressed on the wherein one side of base material, prefabricating condition: 80 ℃ of temperature, pressure 80KG, 20 seconds time.
2, the base material with a Copper Foil of precompressed adopts mechanical drilling method to bore the via that diameter is 0.5MM.
The base material and the another side Copper Foil that 3, will bore via press together, be made into one wear through hole the double-sided copper-clad base material.
4, make aluminium flake consent half tone according to the borehole data of base material.
5, the method that adopts the wiring board industry to be known is produced circuit.
6, execute seal conductive resin and curing etc.
(3) test article
No. 1 article: the ASAHI TU-30SK conductive carbon paste that Japan produces.
No. 2 article: the ASAHI conductive silver paste that Japan produces.
Above A, B, C material all have sale in each Chemical market.
(4) test event and method
Project and detection method that test event and method thereof adopt wiring board need detect usually detect.
(5) appearance and sticking power test result.
(6) resistance value test result (unit: u Ω .cm)
Above test result, No. 3 article, No. 6 article and No. 9 article be because of resin content is low excessively, capacity antacid and anti-relatively poor around Qu Nengli, and solvent wiping check and 3M gummed paper are pullled the result of check all can not be satisfactory.No. 4 article, No. 7 article and No. 10 article can both satisfy the processing requirement of wiring board well; Reach good conducting effect; No. 5 article, No. 8 article and No. 11 article also are good selections if consider production cost and wiring board itself factor such as less demanding to impedance! And No. 12 article are higher than scope because of amount of resin, its sticking power and antiacid, anti-all satisfied around effects such as songs, but resistance value is higher, and particularly behind 280 ℃ of high temperature impacts, it is very unstable that its resistance value becomes, so can't use.
The function test concrete analysis:
3,6, No. 9 article
Fire resistant resin adopts 5% volume and tin and tin alloy particle to adopt 5% volume, and then copper powder adopts 90% volume, alcohol and solvent test: slight dry linting, and attach poor power test: cutting shoulder slightly comes off along conductive resin; Acid proof test: nothing comes off, slight corrosion, and alkaline-resisting test: nothing comes off; The surface is intact, and the solvent test: nothing comes off, and the surface is intact; SaltSprayTest: nothing comes off, and the surface is intact, high temperature resistant test: nothing comes off; The surface is intact, and the thermal cycling test: the surface is intact, tests around song: the conductive resin cracking.
4,7, No. 10 article
Fire resistant resin adopts 25% volume and tin and tin alloy particle to adopt 30% volume, and then copper powder adopts 45% volume, alcohol and solvent test: slight dry linting, and attach poor power test: cutting shoulder slightly comes off along conductive resin; Acid proof test: nothing comes off, slight corrosion, and alkaline-resisting test: nothing comes off; The surface is intact, and the solvent test: nothing comes off, and the surface is intact; SaltSprayTest: nothing comes off, and the surface is intact, high temperature resistant test: nothing comes off; The surface is intact, and the thermal cycling test: the surface is intact, and test around song: conductive resin does not have cracking.
No. 12 article
Fire resistant resin adopts 35% volume and tin and tin alloy particle to adopt 30% volume, and then copper powder adopts 35% volume, alcohol and solvent test: slight dry linting, and attach poor power test: cutting shoulder slightly comes off along conductive resin; Acid proof test: nothing comes off, slight corrosion, and alkaline-resisting test: nothing comes off; The surface is intact, and the solvent test: nothing comes off, and the surface is intact; SaltSprayTest: nothing comes off, and the surface is intact, high temperature resistant test: nothing comes off; The surface is intact, and the thermal cycling test: the surface is intact, and test around song: conductive resin does not have cracking.
No. 13 article
Fire resistant resin adopts 29% volume and tin and tin alloy particle to adopt 41% volume, and then copper powder adopts 30% volume, alcohol and solvent test: slight dry linting, and attach poor power test: cutting shoulder slightly comes off along conductive resin; Acid proof test: nothing comes off, slight corrosion, and alkaline-resisting test: nothing comes off; The surface is intact, and the solvent test: nothing comes off, and the surface is intact; SaltSprayTest: nothing comes off, and the surface is intact, high temperature resistant test: nothing comes off; The surface is intact, and the thermal cycling test: the surface is intact, and test around song: conductive resin does not have cracking.
Above test result: 3,6, No. 9 article are because of resin content is low excessively, capacity antacid and anti-relatively poor around Qu Nengli, and solvent wiping check and 3M gummed paper are pullled the result of check all can not be satisfactory; 4,7, No. 10 article can both satisfy the processing requirement of wiring board well, reach good conducting effect.If consider production cost and wiring board itself factor such as less demanding to impedance; No. 13 article also are good selections; And No. 12 article are higher than scope because of amount of resin, its sticking power and antiacid, anti-all satisfied around effects such as songs, but resistance value is higher, and particularly behind 280 ℃ of high temperature impacts, it is very unstable that its resistance value becomes, so can't use.
In sum, the present invention processes actual sample and through repeatedly use test, sees that from the effect of use test provable the present invention can reach the purpose that it is expected like specification sheets and diagramatic content, and practical value is unquestionable.The above embodiment that lifts only is used for conveniently illustrating the present invention; Be not that the present invention is done any pro forma restriction; Have common knowledge the knowledgeable in the technical field under any,, utilize disclosed technology contents to do the local equivalent embodiment that changes or modify if in the scope that does not break away from technical characterictic that the present invention carries; And do not break away from technical characterictic content of the present invention, all still belong in the scope of technical characterictic of the present invention.
Claims (10)
1. conductive resin that is used for the conducting of wiring board consent comprises weight ratio and is: (A) fire resistant resin of 5%～29%, comprise 70%～5% (B) tin or (C) other metal or the nonmetallic conducting particles of tin alloy conducting particles and surplus at least.
2. the conductive resin that is used for the conducting of wiring board consent according to claim 1; It is characterized in that: described fire resistant resin comprises epoxy compound resin, polyimide based resin, resol, selects at least a in polyvinyls, acrylics, polyethers, vibrin, polyamide resin, the urethane.
3. the conductive resin that is used for the conducting of wiring board consent according to claim 1 is characterized in that: the scope of selecting materials of metal conductive particles is following:
1. from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, select at least a particle.
The alloy particle of the arbitrary combination of 2. from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, selecting.
3. be nuclear with conduction or non-conductive particle, use the particle of from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, selecting at least a metallic cover.
4. be nuclear with conduction or non-conductive particle, use the particle of the alloy coating of the arbitrary combination of from gold, platinum, silver, palladium, copper, nickel, aluminium, indium, selecting.
4. the conductive resin that is used for the conducting of wiring board consent according to claim 1 is characterized in that: the nonmetal conducting particles scope of selecting materials is following:
The particle that comprises any one particles such as carbon black, thomel, graphite or any one combination.
5. the conductive resin that is used for the conducting of wiring board consent according to claim 1 is characterized in that: described fire resistant resin also comprises stopping composition that is complementary with resin and conducting particles and the various promotors that are complementary with resin and stopping composition; The stopping composition of described stopping composition conductive titanium dioxide class; Described promotor is the promotor of resin curing agent, softening agent, skimmer, TI adjustment agent class.
6. the conductive resin that is used for the conducting of wiring board consent according to claim 1; It is characterized in that: described tin alloy conducting particles is Sn-Al alloy, sn-bi alloy, sn-ag alloy, gun-metal; Tin lead closes entirely, tin indium oxide, antimony doped tin oxide and various tin plated materials.
7. double-sided multi-layer printed substrate; It is characterized in that: comprise insulating substrate (1), be compounded in the copper foil layer (2) of insulating substrate (1) one side; On above-mentioned composition board, offer via (3); At the opposite side of insulating substrate (1) copper foil layer (2) that has been sticked, be arranged on up and down in the via (3) between the Copper Foil like the described conductive resin of above-mentioned arbitrary claim (4).
8. double-sided multi-layer printed substrate according to claim 7 is characterized in that: described insulating substrate can be polyester, polycarbonate, the high temperature material of polyimide or the composite base material or the glass epoxide type base material of infiltration of tynex cloth or coated heat thermosetting resin that has the hot melt viscose glue.
9. the making method of a double-sided multi-layer printed substrate comprises the steps: 1) with a Copper Foil with any one side of low temperature precompressed at insulating substrate, form single face and cover the copper base-material, process via then; 2) the another side Copper Foil is compounded on the another side of insulating substrate, via forms " recessed " groove; 3) the described conductive resin of above-mentioned arbitrary claim is executed seal to described " recessed " in-tank-solidification, make the circuit on two sides Copper Foil conducting and processing double-sided PCB two sides.
10. a kind of making method of making the double-sided multi-layer printed substrate with conductive resin according to claim 9; On the basis of the described step 1 of claim 9～3, increase step: be laminated with insulating substrate and the Copper Foil that one deck processes via 4) and then on the internal layer two sides; Form " recessed " groove, execute the seal conductive resin, make internal layer and the circuit of outer one deck line conduction with processing double-sided PCB two sides; Step is analogized according to this, forms the more multilayer circuit board of multilayer number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210026233XA CN102559092A (en) | 2012-01-09 | 2012-01-09 | Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210026233XA CN102559092A (en) | 2012-01-09 | 2012-01-09 | Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102559092A true CN102559092A (en) | 2012-07-11 |
Family
ID=46405739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210026233XA Pending CN102559092A (en) | 2012-01-09 | 2012-01-09 | Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102559092A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN103635006A (en) * | 2012-08-23 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| WO2014113937A1 (en) * | 2013-01-23 | 2014-07-31 | Henkel IP & Holding GmbH | Flexible conductive ink |
| CN104497924A (en) * | 2014-11-25 | 2015-04-08 | 四川大学 | New antistatic hot melt adhesive and preparation method thereof |
| CN104629643A (en) * | 2015-03-06 | 2015-05-20 | 廊坊市高瓷电子技术有限公司 | Conductive glue, preparation method thereof and circuit board |
| CN104661440A (en) * | 2015-03-06 | 2015-05-27 | 廊坊市高瓷电子技术有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN105792544A (en) * | 2015-12-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | Manufacturing method of multi-layer flexible circuit board, multi-layer flexible circuit board and mobile terminal |
| CN106155403A (en) * | 2015-04-27 | 2016-11-23 | 南昌欧菲光显示技术有限公司 | Touch control component |
| CN106537519A (en) * | 2015-02-27 | 2017-03-22 | 拓自达电线株式会社 | Conductive paste and multilayer substrate using same |
| CN107718916A (en) * | 2017-09-28 | 2018-02-23 | 苏州优诺电子材料科技有限公司 | A kind of printing preparation technology of pressure sensitive adhesive applied to FPC |
| CN109135612A (en) * | 2018-08-10 | 2019-01-04 | 云南科威液态金属谷研发有限公司 | A kind of low-melting-point metal micro-nano powder conducting resinl and preparation method thereof |
| CN109415613A (en) * | 2016-07-04 | 2019-03-01 | 东亚合成株式会社 | Adhesive composition and cover film, flexible copper clad laminate and the bonding sheet for using it |
| CN110322985A (en) * | 2018-03-28 | 2019-10-11 | 上海逻骅投资管理合伙企业（有限合伙） | A kind of electrocondution slurry and its preparation method and application |
| CN110324963A (en) * | 2018-03-28 | 2019-10-11 | 上海逻骅投资管理合伙企业（有限合伙） | Electrocondution slurry and its preparation method and application |
| CN110505757A (en) * | 2019-08-19 | 2019-11-26 | 广德鼎星电子科技有限公司 | A kind of production method of the non-porous conducting of FPC |
| CN111668621A (en) * | 2020-06-09 | 2020-09-15 | 业成科技（成都）有限公司 | Flexible circuit board, laminating method and circuit board assembly |
| CN111925746A (en) * | 2020-08-24 | 2020-11-13 | 烟台元申新材料有限公司 | High-heat-resistance conductive silver adhesive and preparation method thereof |
| CN116200160A (en) * | 2022-11-16 | 2023-06-02 | 深圳市励高表面处理材料有限公司 | Non-microetching organic copper surface bonding agent and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665899A (en) * | 2002-09-04 | 2005-09-07 | 纳美仕有限公司 | Conductive adhesive and circuit comprising same |
-
2012
- 2012-01-09 CN CN201210026233XA patent/CN102559092A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665899A (en) * | 2002-09-04 | 2005-09-07 | 纳美仕有限公司 | Conductive adhesive and circuit comprising same |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635006A (en) * | 2012-08-23 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN103635006B (en) * | 2012-08-23 | 2016-09-28 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| WO2014113937A1 (en) * | 2013-01-23 | 2014-07-31 | Henkel IP & Holding GmbH | Flexible conductive ink |
| US10995232B2 (en) | 2013-01-23 | 2021-05-04 | Henkel Ag & Co. Kgaa | Flexible conductive ink |
| CN104497924A (en) * | 2014-11-25 | 2015-04-08 | 四川大学 | New antistatic hot melt adhesive and preparation method thereof |
| CN104497924B (en) * | 2014-11-25 | 2016-08-24 | 四川大学 | A kind of antistatic PUR and preparation method thereof |
| CN106537519A (en) * | 2015-02-27 | 2017-03-22 | 拓自达电线株式会社 | Conductive paste and multilayer substrate using same |
| CN104629643B (en) * | 2015-03-06 | 2017-11-28 | 廊坊市高瓷电子技术有限公司 | Conducting resinl, its preparation method and wiring board |
| CN104629643A (en) * | 2015-03-06 | 2015-05-20 | 廊坊市高瓷电子技术有限公司 | Conductive glue, preparation method thereof and circuit board |
| CN104661440A (en) * | 2015-03-06 | 2015-05-27 | 廊坊市高瓷电子技术有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN106155403A (en) * | 2015-04-27 | 2016-11-23 | 南昌欧菲光显示技术有限公司 | Touch control component |
| CN105792544A (en) * | 2015-12-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | Manufacturing method of multi-layer flexible circuit board, multi-layer flexible circuit board and mobile terminal |
| CN109415613B (en) * | 2016-07-04 | 2022-02-11 | 东亚合成株式会社 | Adhesive composition, coverlay film using same, flexible copper-clad laminate, and adhesive sheet |
| CN109415613A (en) * | 2016-07-04 | 2019-03-01 | 东亚合成株式会社 | Adhesive composition and cover film, flexible copper clad laminate and the bonding sheet for using it |
| CN107718916A (en) * | 2017-09-28 | 2018-02-23 | 苏州优诺电子材料科技有限公司 | A kind of printing preparation technology of pressure sensitive adhesive applied to FPC |
| CN110324963A (en) * | 2018-03-28 | 2019-10-11 | 上海逻骅投资管理合伙企业（有限合伙） | Electrocondution slurry and its preparation method and application |
| CN110322985A (en) * | 2018-03-28 | 2019-10-11 | 上海逻骅投资管理合伙企业（有限合伙） | A kind of electrocondution slurry and its preparation method and application |
| CN109135612A (en) * | 2018-08-10 | 2019-01-04 | 云南科威液态金属谷研发有限公司 | A kind of low-melting-point metal micro-nano powder conducting resinl and preparation method thereof |
| CN110505757A (en) * | 2019-08-19 | 2019-11-26 | 广德鼎星电子科技有限公司 | A kind of production method of the non-porous conducting of FPC |
| CN111668621A (en) * | 2020-06-09 | 2020-09-15 | 业成科技（成都）有限公司 | Flexible circuit board, laminating method and circuit board assembly |
| CN111925746A (en) * | 2020-08-24 | 2020-11-13 | 烟台元申新材料有限公司 | High-heat-resistance conductive silver adhesive and preparation method thereof |
| CN116200160A (en) * | 2022-11-16 | 2023-06-02 | 深圳市励高表面处理材料有限公司 | Non-microetching organic copper surface bonding agent and preparation method thereof |
| CN116200160B (en) * | 2022-11-16 | 2024-04-09 | 深圳市励高表面处理材料有限公司 | Non-microetching organic copper surface bonding agent and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102559092A (en) | Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method | |
| US5822850A (en) | Circuit devices and fabrication Method of the same | |
| JP5141249B2 (en) | Conductive paste and multilayer printed wiring board using the same | |
| CN102265718B (en) | Multilayer wiring substrate, and method for producing multilayer wiring substrate | |
| CN102884872B (en) | Multilayer wiring board and method for manufacturing multilayer wiring board | |
| CN101252817B (en) | Design producing method of multi-layer printed circuit board | |
| CN101370353A (en) | Circuit board with conductive paste | |
| CN202697035U (en) | LED circuit board with conducting adhesive lines, and LED lamp band | |
| CN105246313B (en) | A kind of electromagnetic shielding film, the preparation method containing the printed wiring board of the screened film and the wiring board | |
| CN103400633B (en) | A kind of crystal silicon solar battery back face electrode unleaded electrocondution slurry and preparation method thereof | |
| CN109890124B (en) | Multilayer anisotropic puncture type conductive cloth adhesive and FPC reinforcing shielding structure using same | |
| CN102858087A (en) | Blind-hole-conduction double-sided circuit board and processing method thereof | |
| CN201813610U (en) | Double-sided circuit board and led lamp belt | |
| JP2009088474A (en) | Inter layer conduction method for printed circuit board | |
| CN201383900Y (en) | Blind hole type circuit board | |
| CN103348778A (en) | Wiring board and manufacturing method therefor | |
| TW202007725A (en) | An innovative single liquuid type conductive composition and its preparation method and its some application technology in printed circuit board. | |
| CN112533352A (en) | High-shielding-performance flexible circuit board and preparation method thereof | |
| CN106879188A (en) | The preparation method and circuit board of a kind of built-in component type circuit board | |
| CN102883519A (en) | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof | |
| JP2003086944A (en) | Method for manufacturing multilayer interconnection circuit substrate | |
| CN108617095A (en) | A kind of manufacture craft of the double-deck unilateral copper-based wiring board | |
| CN107046765A (en) | The manufacture craft of double-side aluminum printed board | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN201383902Y (en) | Metal-base printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |