CN108617095A - A kind of manufacture craft of the double-deck unilateral copper-based wiring board - Google Patents
A kind of manufacture craft of the double-deck unilateral copper-based wiring board Download PDFInfo
- Publication number
- CN108617095A CN108617095A CN201810436791.0A CN201810436791A CN108617095A CN 108617095 A CN108617095 A CN 108617095A CN 201810436791 A CN201810436791 A CN 201810436791A CN 108617095 A CN108617095 A CN 108617095A
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- CN
- China
- Prior art keywords
- copper
- plates
- wiring board
- layer circuit
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of manufacture craft of the double-deck unilateral copper-based wiring board, FR4 plate baking sheets obtain internal layer circuit on FR4 plates, silk-screen solder mask on internal layer circuit；Gong goes out slot on several slots and/or through-hole copper base and is lined with high temperature glued membrane or release film on copper base；FR4 plates, adhesive sheet and copper base high-temperature laminating；FR4 twist drill blind holes, sink baking sheet and etching after copper on FR4 plates, obtain outer-layer circuit.In the padded temperature glued membrane in hollow out position or release film before pressing, increase pressing cushion effect, effectively avoids pressing lamination uneven and solder mask is caused to fall oil；By baking sheet and gasket high-temperature laminating, wiring board is avoided easily to be layered and bubble；The dry film of 45~55um is selected, is covered tightly at blind hole, blind hole ruptures when avoiding developing and etching, and layers of copper is avoided to rupture.
Description
Technical field
The present invention relates to wiring boards, more particularly, to a kind of manufacture craft of the double-deck unilateral copper-based wiring board.
Background technology
In the common double-deck unilateral process for pressing of MPCB, FR4 and Metal Substrate are pressed.Using commonly pressing copper-based hollow out
Plate flow process can cause poor reliability, easily layering blistering；FR4 panels largely fall oil after pressing；Make line film
When, occur the serious holes phenomenon of large area after development, blind hole layers of copper is caused to crack after etched.
Invention content
In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a kind of making of the double-deck unilateral copper-based wiring board
Technique promotes the quality of wiring board.
The present invention be solve its technical problem the technical solution adopted is that：
A kind of manufacture craft of the double-deck unilateral copper-based wiring board, includes the following steps：
Step a cuts to obtain FR4 plates according to process, and FR4 plates include FR4 core material layers, are arranged in core material layer both sides
Layers of copper, FR4 plates carry out baking sheet, 135~165 DEG C of baking sheet temperature, 3.6~4.5h of baking sheet time；The heavy copper of single side, obtains on FR4 plates
The interior layers of copper thickeied；
Step b, interior layers of copper obtain internal layer circuit by patch dry film, exposure and etching, on FR4 plates where internal layer circuit
One face silk-screen obtains solder mask；
Step c, gong goes out several slots and/or through-hole on copper base；FR4 plates, adhesive sheet and copper base stack successively, FR4
One side on plate where internal layer circuit away from bonding sheet and is lined with high temperature away from the one side where slot on bonding sheet, copper base
Glued membrane or release film；FR4 plates, adhesive sheet and copper base high-temperature laminating, 160~200 DEG C of pressing-in temp；
Step d, FR4 twist drill blind hole, blind hole connect copper base；
Away from the heavy copper of the one side of adhesive sheet on step e, FR4 plate, the outer layer copper thickeied；Outer layer copper carries out baking sheet, bakes
160~190 DEG C of plate temperature, 1.8~2.2h of baking sheet time, it is desirable that do not play copper sheet, not bubble in hot internal stress test；
Step f, the outer layer copper after baking sheet have patch dry film, exposure and etching successively, obtain outer-layer circuit, development and/
Or it is that the dry film of 45~55um pastes copper base that thickness is selected in etching.
Another specific implementation mode according to the present invention, further has, and further includes having step g, glue is pasted on copper base
Paper or high temperature dwell cuticula, wiring board carry out electroplating processes.
Another specific implementation mode according to the present invention, further has, and in the step e, it is real that outer layer copper carries out drift tin
It tests, outer layer copper is not stratified, not bubble.
Another specific implementation mode according to the present invention, further has, and in the step c, bonding is connected on copper base
The one side brown of piece is handled.
Another specific implementation mode according to the present invention, further has, in the step d, on Plate grinder, and wiring board phase
The movement for having transverse direction and longitudinal direction to polishing part, polishes to blind hole, 1.3~1.7m/min of movement speed.
Another specific implementation mode according to the present invention, further has, in the step f, after making outer-layer circuit,
A face silk-screen on FR4 plates where outer-layer circuit obtains solder mask, and solder mask covering outer-layer circuit is simultaneously filled in outer-layer circuit
Gap.
Another specific implementation mode according to the present invention, further has, in the step a, internal layer circuit institute on FR4 plates
A face silk-screen solder mask after, character silk printing on solder mask.
A kind of manufacture craft for double-deck unilateral copper-based wiring board that the present invention uses, has the advantages that：In pressing
It is preceding to increase pressing cushion effect in the padded temperature glued membrane in hollow out position or release film, it effectively avoids pressing lamination uneven and causes welding resistance
Layer falls oil；By baking sheet and gasket high-temperature laminating, wiring board is avoided easily to be layered and bubble；Select the dry film of 45~55um, blind hole
Place's covering is tight, and blind hole ruptures when avoiding developing and etching, and layers of copper is avoided to rupture.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Specific implementation mode
The specific implementation mode of the present invention is described in further detail below in conjunction with attached drawing.
As shown in Figure 1, a kind of double-deck unilateral copper-based wiring board.The manufacture craft of the double-deck unilateral copper-based wiring board, including with
Lower step a to e.
Step a cuts to obtain FR4 plates 1 according to process, and FR4 plates 1 include FR4 core material layers 12, are arranged in core material layer two
The layers of copper of side, FR4 plates 1 carry out baking sheet, 135~165 DEG C of baking sheet temperature, 3.6~4.5h of baking sheet time；Single side is heavy on FR4 plates 1
Copper, the interior layers of copper thickeied.
Baking sheet thickeies layers of copper again, and the internal layer steel structure of thickening is stablized, is not easy to be layered, has been not easy copper sheet and bubble；Interior layer line
The current carrying capacity of 11 stable structure of road, larger, internal layer circuit 11 improves.Preferably, 145~155 DEG C of baking sheet temperature.
Step b, interior layers of copper obtain internal layer circuit 11 by patch dry film, exposure and etching, 11 institute of internal layer circuit on FR4 plates 1
A face silk-screen obtain solder mask.Solder mask covers internal layer circuit 11, welding resistance matter fill line gap.
Step c, gong goes out several slots and/or through-hole on copper base 3；FR4 plates 1, adhesive sheet 2 and copper base 3 stack successively,
One side on FR4 plates 1 where internal layer circuit 11 away from bonding sheet and is padded away from the one side where slot on bonding sheet, copper base 3
There are high temperature glued membrane or release film；3 high-temperature laminating of FR4 plates 1, adhesive sheet 2 and copper base, 160~200 DEG C of pressing-in temp.
The padded temperature glued membrane in hollow out position or release film of copper base 3, increase pressing cushion effect, and lifting process ability is effectively kept away
Exempt to press lamination uneven and welding resistance is caused to fall oil；Ensure that FR4 middle layer plates, adhesive sheet 2 and copper base 3 press well simultaneously,
Avoid the occurrence of Relative sliding dislocation.
1 drilling blind hole 14 of step d, FR4 plate, blind hole 14 connect copper base 3.Blind hole 14 is drilled out on copper base 3, blind hole 14 connects
To copper base 3, the radiating efficiency of circuit board component is promoted, improves the service life of component, reduces customer service circuit plate
Use cost.
Away from the heavy copper of the one side of adhesive sheet 2 on step e, FR4 plate 1, the outer layer copper thickeied；Outer layer copper carries out baking sheet,
160~190 DEG C of baking sheet temperature, 1.8~2.2h of baking sheet time, it is desirable that do not play copper sheet, not bubble in hot internal stress test.
Step f, the outer layer copper after baking sheet have patch dry film, exposure and etching, obtain outer-layer circuit 13, develops successively
And/or it is that the dry film of 45~55um pastes copper base 3 that thickness is selected in etching.It is the dry film cap bore of 45~55um to select thickness,
Cap bore is preferable, and anti-developer pressure protrudes, and blind hole 14 ruptures when avoiding developing and etching, and layers of copper is avoided to rupture.Preferably, dry film 48
Dry film can preferably cover blind hole 14 in~55um, development and/or etching.
Further include having step g, gummed paper or high temperature dwell cuticula are pasted on copper base 3, wiring board carries out electroplating processes.Before plating
3 sealing paper of copper base or patch high temperature dwell cuticula blocking, prevent to ooze liquid medicine at blind hole 14, plate face are caused to pollute.
In step e, outer layer copper carry out drift tin experiment, 280~295 DEG C of temperature, 8~12s of single duration, 10~14 times, outside
Layer copper is not stratified, not bubble, is further ensured that the product of production is the certified products of function admirable.
In step c, the one side brown processing of adhesive sheet 2 is connected on copper base 3, improves wiring board antioxygenic property.
In step d, on Plate grinder, wiring board has the movement of transverse direction and longitudinal direction relative to polishing part, polishes blind hole 14,
1.3~1.7m/min of movement speed solves 14 burr of blind hole.
In step f, after making outer-layer circuit 13, the face silk-screen on FR4 middle layer plates where outer-layer circuit 13 obtains welding resistance
Layer, solder mask covering outer-layer circuit 13 simultaneously fill the gap in outer-layer circuit 13.
In step a, after the face silk-screen solder mask on FR4 middle layer plates where internal layer circuit 11, character silk printing on solder mask.
The above embodiments are merely illustrative of the technical solutions of the present invention and is not intended to limit it, all without departing from the present invention
Any modification of spirit and scope or equivalent replacement, shall fall within the scope of the technical solution of the present invention.
Claims (7)
1. a kind of manufacture craft of the double-deck unilateral copper-based wiring board, which is characterized in that include the following steps：
Step a cuts to obtain FR4 plates (1) according to process, and FR4 plates (1) include FR4 core material layers (12), are arranged in core material layer
The layers of copper of both sides, FR4 plates (1) carry out baking sheet, 135~165 DEG C of baking sheet temperature, 3.6~4.5h of baking sheet time；It is single on FR4 plates (1)
Face sinks copper, the interior layers of copper thickeied；
Step b, interior layers of copper obtain internal layer circuit (11) by patch dry film, exposure and etching, internal layer circuit (11) on FR4 plates (1)
The one face silk-screen at place obtains solder mask；
Step c, gong goes out several slots and/or through-hole on copper base (3)；FR4 plates (1), adhesive sheet (2) and copper base (3) are successively
It stacks, the one side on FR4 plates (1) where internal layer circuit (11) deviates from away from the one side where slot on bonding sheet, copper base (3)
Bonding sheet is simultaneously lined with high temperature glued membrane or release film；FR4 plates (1), adhesive sheet (2) and copper base (3) high-temperature laminating, pressing temperature
160~200 DEG C of degree；
Step d, FR4 plate (1) drilling blind hole (14), blind hole (14) connect copper base (3)；
Away from the heavy copper of the one side of adhesive sheet (2) on step e, FR4 plate (1), the outer layer copper thickeied；Outer layer copper carries out baking sheet,
160~190 DEG C of baking sheet temperature, 1.8~2.2h of baking sheet time, it is desirable that do not play copper sheet, not bubble in hot internal stress test；
Step f, the outer layer copper after baking sheet have patch dry film, exposure and etching successively, obtain outer-layer circuit (13), development and/
Or it is that the dry film of 45~55um pastes copper base (3) that thickness is selected in etching.
2. a kind of manufacture craft of double-deck unilateral copper-based wiring board according to claim 1, which is characterized in that further include having
Step g, gummed paper or high temperature dwell cuticula are pasted on copper base (3), and wiring board carries out electroplating processes.
3. a kind of manufacture craft of double-deck unilateral copper-based wiring board according to claim 1, which is characterized in that the step
In e, outer layer copper carries out drift tin experiment, and outer layer copper is not stratified, not bubble.
4. a kind of manufacture craft of double-deck unilateral copper-based wiring board according to claim 1, which is characterized in that the step
In c, the one side brown processing of adhesive sheet (2) is connected on copper base (3).
5. a kind of manufacture craft of double-deck unilateral copper-based wiring board according to claim 1, which is characterized in that the step
In d, on Plate grinder, wiring board has the movement of transverse direction and longitudinal direction relative to polishing part, polishes blind hole (14), movement speed
1.3~1.7m/min.
6. a kind of manufacture craft of double-deck unilateral copper-based wiring board according to claim 1, which is characterized in that the step
In f, after making outer-layer circuit (13), the face silk-screen on FR4 plates (1) where outer-layer circuit (13) obtains solder mask, solder mask
Covering outer-layer circuit (13) simultaneously fills the gap in outer-layer circuit (13).
7. a kind of manufacture craft of double-deck unilateral copper-based wiring board according to claim 1, which is characterized in that the step
In a, after the face silk-screen solder mask on FR4 plates (1) where internal layer circuit (11), character silk printing on solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810436791.0A CN108617095B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of double-layer single-side copper-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810436791.0A CN108617095B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of double-layer single-side copper-based circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108617095A true CN108617095A (en) | 2018-10-02 |
| CN108617095B CN108617095B (en) | 2020-06-30 |
Family
ID=63662427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810436791.0A Active CN108617095B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of double-layer single-side copper-based circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN108617095B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587936A (en) * | 2018-12-13 | 2019-04-05 | 广东全宝科技股份有限公司 | A kind of manufacture craft of the unilateral double-deck circuit base plate |
| CN109803491A (en) * | 2018-12-13 | 2019-05-24 | 珠海精路电子有限公司 | A kind of unilateral double-deck copper base and its manufacture craft |
| CN110677978A (en) * | 2019-09-11 | 2020-01-10 | 珠海精路电子有限公司 | Printed circuit board and manufacturing method thereof |
| CN110856352A (en) * | 2019-11-23 | 2020-02-28 | 湖南东神自动化设备有限公司 | Circuit board preheating device |
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| JPH01268188A (en) * | 1988-04-20 | 1989-10-25 | Hitachi Chem Co Ltd | Manufacture of metal base board |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
| CN102368890A (en) * | 2011-10-09 | 2012-03-07 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
| CN202503804U (en) * | 2012-03-23 | 2012-10-24 | 深圳市博敏兴电子有限公司 | Single-side double-layer circuit board |
| CN104219898A (en) * | 2014-10-09 | 2014-12-17 | 博敏电子股份有限公司 | Multilayer rigid-flex board plated filled through-hole manufacturing process |
| CN205071476U (en) * | 2015-09-23 | 2016-03-02 | 天津普林电路股份有限公司 | Laminated structure who contains high density lamination board press and fit process of ladder groove structure |
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| JPH01268188A (en) * | 1988-04-20 | 1989-10-25 | Hitachi Chem Co Ltd | Manufacture of metal base board |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587936A (en) * | 2018-12-13 | 2019-04-05 | 广东全宝科技股份有限公司 | A kind of manufacture craft of the unilateral double-deck circuit base plate |
| CN109803491A (en) * | 2018-12-13 | 2019-05-24 | 珠海精路电子有限公司 | A kind of unilateral double-deck copper base and its manufacture craft |
| CN109803491B (en) * | 2018-12-13 | 2024-08-27 | 珠海精路电子有限公司 | Single-side double-layer copper substrate and manufacturing process thereof |
| CN110677978A (en) * | 2019-09-11 | 2020-01-10 | 珠海精路电子有限公司 | Printed circuit board and manufacturing method thereof |
| CN110856352A (en) * | 2019-11-23 | 2020-02-28 | 湖南东神自动化设备有限公司 | Circuit board preheating device |
| CN110856352B (en) * | 2019-11-23 | 2021-07-23 | 湖南东神自动化设备有限公司 | Circuit board preheating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108617095B (en) | 2020-06-30 |
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