CN108617095B - Manufacturing process of double-layer single-side copper-based circuit board - Google Patents
Manufacturing process of double-layer single-side copper-based circuit board Download PDFInfo
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- CN108617095B CN108617095B CN201810436791.0A CN201810436791A CN108617095B CN 108617095 B CN108617095 B CN 108617095B CN 201810436791 A CN201810436791 A CN 201810436791A CN 108617095 B CN108617095 B CN 108617095B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing process of a double-layer single-side copper-based circuit board, wherein an FR4 board is baked, an inner-layer circuit is obtained on an FR4 board, and a solder mask is silk-screened on the inner-layer circuit; a plurality of grooves are milled on the copper substrate and/or the slotted holes on the through-hole copper substrate are padded with high-temperature glue films or release films; high-temperature pressing of the FR4 board, the bonding sheet and the copper substrate; drilling blind holes on an FR4 board, plating copper on the FR4 board, baking the board and etching to obtain an outer layer circuit. A high-temperature adhesive film or a release film is padded in the hollow position before lamination, so that the lamination buffer force is increased, and the phenomenon that oil falls from a solder mask layer due to nonuniform lamination is effectively avoided; through high-temperature pressing of the baking plate and the gasket, the circuit board is prevented from being easily layered and bubbles are avoided; a dry film of 45-55 um is selected, the blind hole is tightly covered, the blind hole is prevented from being broken during development and etching, and a copper layer is prevented from being broken.
Description
Technical Field
The invention relates to a circuit board, in particular to a manufacturing process of a double-layer single-side copper-based circuit board.
Background
In the common MPCB double-layer single-side pressing process, FR4 and a metal base are pressed to obtain the product. The common process for laminating the copper-based hollowed-out board can cause poor reliability and easy layering and foaming; FR4 panels were largely oil-draining after pressing; when a circuit film is manufactured, a large-area serious hole breaking phenomenon occurs after development, and a blind hole copper layer is cracked after etching.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a manufacturing process of a double-layer single-side copper-based circuit board, which improves the quality of the circuit board.
The technical scheme adopted for solving the technical problem is as follows:
a manufacturing process of a double-layer single-side copper-based circuit board comprises the following steps:
cutting according to the process size to obtain FR4 boards, wherein the FR4 boards comprise FR4 core material layers and copper layers arranged on two sides of the FR4 core material layers, and baking the FR4 boards at the temperature of 135-165 ℃ for 3.6-4.5 hours; depositing copper on one side of an FR4 board to obtain a thickened inner copper layer;
b, adhering a dry film to the inner copper layer, exposing and etching to obtain an inner layer circuit, and performing screen printing on the surface of the FR4 board where the inner layer circuit is located to obtain a solder mask;
c, routing a plurality of grooves and/or through holes on the copper substrate; the FR4 board, the bonding sheet and the copper substrate are sequentially stacked, one surface of the FR4 board where the inner layer circuit is located is close to the bonding sheet, one surface of the copper substrate where the slotted hole is located is away from the bonding sheet, and a high-temperature adhesive film or a release film is padded on the copper substrate; pressing the FR4 board, the bonding sheet and the copper substrate at a high temperature, wherein the pressing temperature is 160-200 ℃;
d, drilling a blind hole in the FR4 board, wherein the blind hole is connected with the copper substrate;
e, depositing copper on the surface of the FR4 board, which is far away from the bonding sheet, to obtain thickened outer-layer copper; baking the outer layer copper at the baking temperature of 160-190 ℃ for 1.8-2.2 h, wherein copper sheets and bubbles are not generated in the thermal internal stress test;
step f, sequentially attaching a dry film to the outer layer copper after baking the plate, exposing and etching to obtain an outer layer circuit, and attaching a dry film with the thickness of 45-55 um to the copper substrate in developing and/or etching;
in the step f, after the outer-layer circuit is manufactured, screen printing is carried out on the surface, where the outer-layer circuit is located, of the FR4 board to obtain a solder mask, the solder mask covers the outer-layer circuit and fills gaps in the outer-layer circuit;
and g, sticking gummed paper or a high-temperature protective film on the copper substrate, and electroplating the circuit board.
According to another embodiment of the present invention, further, in the step e, the outer layer copper is subjected to a tin floating experiment, and the outer layer copper does not delaminate and does not blister.
According to another embodiment of the present invention, further, in the step c, a surface of the copper substrate to which the bonding sheet is attached is browned.
According to another embodiment of the present invention, further, in the step d, the circuit board moves transversely and longitudinally relative to the polishing member on the board polishing machine to polish the blind holes, wherein the moving speed is 1.3-1.7 m/min.
According to another embodiment of the present invention, further, in step a, after the solder mask layer is silk-screened on the side of the FR4 board where the inner layer circuit is located, characters are silk-screened on the solder mask layer.
The manufacturing process of the double-layer single-side copper-based circuit board has the following beneficial effects: a high-temperature adhesive film or a release film is padded in the hollow position before lamination, so that the lamination buffer force is increased, and the phenomenon that oil falls from a solder mask layer due to nonuniform lamination is effectively avoided; through high-temperature pressing of the baking plate and the gasket, the circuit board is prevented from being easily layered and bubbles are avoided; a dry film of 45-55 um is selected, the blind hole is tightly covered, the blind hole is prevented from being broken during development and etching, and a copper layer is prevented from being broken.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
As shown in fig. 1, a double-layer single-sided copper-based wiring board. The manufacturing process of the double-layer single-side copper-based circuit board comprises the following steps of a to e.
Step a, cutting according to the process size to obtain an FR4 board 1, wherein the FR4 board 1 comprises an FR4 core material layer 12 and copper layers arranged on two sides of the FR4 core material layer, and baking the FR4 board 1 at the temperature of 135-165 ℃ for 3.6-4.5 hours; and (3) depositing copper on one side of the FR4 board 1 to obtain a thickened inner copper layer.
The copper layer is thickened on the baking plate, and the thickened inner layer copper has a stable structure, is not easy to delaminate and is not easy to generate copper sheets and bubbles; the inner layer line 11 has stable structure and enlarged size, and the current carrying capacity of the inner layer line 11 is improved. Preferably, the baking temperature is 145-155 ℃.
And b, adhering a dry film to the inner copper layer, exposing and etching to obtain an inner layer circuit 11, and performing silk-screen printing on the surface of the FR4 board 1 where the inner layer circuit 11 is located to obtain a solder mask. The solder resist layer covers the inner layer wiring 11, and the solder resist fills the wiring gap.
C, routing a plurality of grooves and/or through holes on the copper substrate 3; the FR4 board 1, the bonding sheet 2 and the copper substrate 3 are sequentially stacked, one surface of the FR4 board 1 where the inner layer circuit 11 is located is close to the bonding sheet, one surface of the copper substrate 3 where the slotted hole is located is far away from the bonding sheet, and a high-temperature adhesive film or a release film is padded on the surface; and (3) performing high-temperature lamination on the FR4 board 1, the bonding sheet 2 and the copper substrate 3 at the temperature of 160-200 ℃.
The hollow-out position of the copper substrate 3 is padded with a high-temperature adhesive film or a release film, so that the pressing buffer force is increased, the process capability is improved, and solder resist oil dropping caused by uneven pressing of laminated plates is effectively avoided; meanwhile, the FR4 core plate, the bonding sheet 2 and the copper substrate 3 are well pressed, and relative slippage and dislocation are avoided.
And d, drilling blind holes 14 in the FR4 board 1, wherein the blind holes 14 are connected with the copper substrate 3. Drilling out blind hole 14 on copper base plate 3, blind hole 14 is connected to copper base plate 3, promotes circuit board components and parts's radiating efficiency, has improved the life of components and parts, has reduced customer's circuit board use cost.
E, depositing copper on the surface of the FR4 board 1, which is far away from the bonding sheet 2, to obtain thickened outer-layer copper; and baking the outer layer copper at the temperature of 160-190 ℃ for 1.8-2.2 h, wherein the copper sheet and the bubbles are not generated in the thermal internal stress test.
And f, sequentially attaching a dry film to the outer layer copper after baking the board, exposing and etching to obtain an outer layer circuit 13, and attaching the dry film with the thickness of 45-55 um to the copper substrate 3 in developing and/or etching. Choose the dry film blind hole that thickness is 45~55um for use, the blind hole is better, and anti development pressure is outstanding, and blind hole 14 breaks when avoiding developing and etching, avoids the copper layer to break. Preferably, the dry film is 48-55 um, and the dry film can better cover the blind holes 14 in development and/or etching.
And step g, sticking adhesive paper or a high-temperature protective film on the copper substrate 3, and electroplating the circuit board. Before electroplating, the copper substrate 3 is blocked by sealing adhesive paper or pasting a high-temperature protective film, so that the liquid medicine is prevented from permeating into the blind hole 14 to cause the pollution of the board surface.
In the step e, the outer copper layer is subjected to a tin bleaching experiment at the temperature of 280-295 ℃ for 8-12 s and 10-14 times in a single time, and the outer copper layer is not layered or does not generate bubbles, so that the produced product is a qualified product with excellent performance.
In the step c, the surface of the copper substrate 3 connected with the bonding sheet 2 is subjected to brown oxidation treatment, so that the oxidation resistance of the circuit board is improved.
In the step d, on the plate grinding machine, the circuit board moves transversely and longitudinally relative to the grinding piece to grind the blind holes 14, the moving speed is 1.3-1.7 m/min, and burrs of the blind holes 14 are avoided.
In the step f, after the outer layer circuit 13 is manufactured, a solder mask is obtained by silk-screen printing on the surface of the FR4 core board where the outer layer circuit 13 is located, the solder mask covers the outer layer circuit 13, and the gap in the outer layer circuit 13 is filled with the solder mask.
In the step a, after a solder mask is silk-screened on the surface of the FR4 core board where the inner layer circuit 11 is located, characters are silk-screened on the solder mask.
The above embodiments are only for illustrating the technical solutions of the present invention and are not limited thereto, and any modification or equivalent replacement without departing from the spirit and scope of the present invention should be covered within the technical solutions of the present invention.
Claims (5)
1. A manufacturing process of a double-layer single-side copper-based circuit board is characterized by comprising the following steps:
step a, cutting according to the process size to obtain an FR4 board (1), wherein the FR4 board (1) comprises an FR4 core material layer (12) and copper layers arranged on two sides of the FR4 core material layer (12), and baking the FR4 board (1) at the temperature of 135-165 ℃ for 3.6-4.5 h; depositing copper on one side of an FR4 board (1) to obtain a thickened inner copper layer;
b, adhering a dry film to the inner copper layer, exposing and etching to obtain an inner layer circuit (11), and performing silk-screen printing on the surface of the FR4 board (1) where the inner layer circuit (11) is located to obtain a solder mask;
c, routing a plurality of grooves and/or through holes on the copper substrate (3); the FR4 board (1), the bonding sheet (2) and the copper substrate (3) are sequentially stacked, one surface of the FR4 board (1) where the inner layer circuit (11) is located is close to the bonding sheet (2), one surface of the copper substrate (3) where the slotted hole is located is far away from the bonding sheet (2), and a high-temperature adhesive film or a release film is padded on the copper substrate (3); high-temperature pressing is carried out on the FR4 board (1), the bonding sheet (2) and the copper substrate (3), and the pressing temperature is 160-200 ℃;
d, drilling a blind hole (14) in the FR4 board (1), wherein the blind hole (14) is connected with the copper substrate (3);
e, depositing copper on the surface of the FR4 board (1) departing from the bonding sheet (2) to obtain thickened outer-layer copper; baking the outer layer copper at the baking temperature of 160-190 ℃ for 1.8-2.2 h, wherein copper sheets and bubbles are not generated in the thermal internal stress test;
step f, sequentially attaching a dry film to the outer layer copper after baking the board, exposing and etching to obtain an outer layer circuit (13), and attaching a dry film with the thickness of 45-55 um to the copper substrate (3) in developing and/or etching;
in the step f, after the outer layer circuit (13) is manufactured, screen printing is carried out on the surface, where the outer layer circuit (13) is located, of the FR4 board (1) to obtain a solder mask, the solder mask covers the outer layer circuit (13), and gaps in the outer layer circuit (13) are filled;
and step g, sticking adhesive paper or a high-temperature protective film on the copper substrate (3), and electroplating the circuit board.
2. The manufacturing process of the double-layer single-side copper-based circuit board according to claim 1, wherein in the step e, the outer layer copper is subjected to a tin floating experiment, and the outer layer copper is not layered and does not generate bubbles.
3. The manufacturing process of the double-layer single-side copper-based circuit board according to claim 1, wherein in the step c, the surface of the copper substrate (3) connected with the bonding sheet (2) is subjected to brown oxidation treatment.
4. The manufacturing process of the double-layer single-side copper-based circuit board according to claim 1, wherein in the step d, the circuit board moves transversely and longitudinally relative to the polishing piece on the plate polishing machine to polish the blind hole (14) at a moving speed of 1.3-1.7 m/min.
5. The manufacturing process of the double-layer single-side copper-based circuit board according to claim 1, wherein in the step a, after a solder mask is printed on the surface of the FR4 board (1) where the inner-layer circuit (11) is located, characters are printed on the solder mask in a silk-screen mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810436791.0A CN108617095B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of double-layer single-side copper-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810436791.0A CN108617095B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of double-layer single-side copper-based circuit board |
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| Publication Number | Publication Date |
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| CN108617095A CN108617095A (en) | 2018-10-02 |
| CN108617095B true CN108617095B (en) | 2020-06-30 |
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| CN201810436791.0A Active CN108617095B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of double-layer single-side copper-based circuit board |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587936A (en) * | 2018-12-13 | 2019-04-05 | 广东全宝科技股份有限公司 | A kind of manufacture craft of the unilateral double-deck circuit base plate |
| CN109803491A (en) * | 2018-12-13 | 2019-05-24 | 珠海精路电子有限公司 | A kind of unilateral double-deck copper base and its manufacture craft |
| CN110856352B (en) * | 2019-11-23 | 2021-07-23 | 湖南东神自动化设备有限公司 | Circuit board preheating device |
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| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
| CN104219898A (en) * | 2014-10-09 | 2014-12-17 | 博敏电子股份有限公司 | Multilayer rigid-flex board plated filled through-hole manufacturing process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01268188A (en) * | 1988-04-20 | 1989-10-25 | Hitachi Chem Co Ltd | Manufacture of metal base board |
| CN102368890B (en) * | 2011-10-09 | 2013-10-23 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
| CN202503804U (en) * | 2012-03-23 | 2012-10-24 | 深圳市博敏兴电子有限公司 | Single-side double-layer circuit board |
| CN205071476U (en) * | 2015-09-23 | 2016-03-02 | 天津普林电路股份有限公司 | Laminated structure who contains high density lamination board press and fit process of ladder groove structure |
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- 2018-05-09 CN CN201810436791.0A patent/CN108617095B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
| CN104219898A (en) * | 2014-10-09 | 2014-12-17 | 博敏电子股份有限公司 | Multilayer rigid-flex board plated filled through-hole manufacturing process |
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| CN108617095A (en) | 2018-10-02 |
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