CN111432577A - Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board - Google Patents
Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board Download PDFInfo
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- CN111432577A CN111432577A CN202010138956.3A CN202010138956A CN111432577A CN 111432577 A CN111432577 A CN 111432577A CN 202010138956 A CN202010138956 A CN 202010138956A CN 111432577 A CN111432577 A CN 111432577A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
A photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flex board comprises the following steps: selecting a hard metal plate as a substrate, and forming holes in the hard plate area; plugging holes with resin and grinding; laminating the first TPI layer on two sides; drilling; carrying out copper deposition and whole-plate copper plating; exposing and developing; etching to remove seed copper uncovered by the dry film in the non-circuit area; demoulding; pressing a second TPI layer on the back of the electroplated circuit board; drilling; carrying out copper deposition and whole-plate copper plating; exposing and developing; etching to remove seed copper uncovered by the dry film in the non-circuit area; demoulding; laser TPI; exposure and development: etching the metal plate; demoulding; and (5) solder resist. The method has the advantages of simple process, easy processing, thinner product thickness of the prepared rigid-flex board in the Z direction, smaller size in the XY direction, high strength, difficult deformation and high wiring integration level, and meanwhile, the production efficiency is high and the cost is lower.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flex board.
Background
With the continuous progress of technology, the functional requirements on electronic products are higher and higher, and meanwhile, the appearance is also very important to be short, small, light and thin, so that circuit boards with multilayer integrated functions are adopted more and more, and particularly, a rigid-flex board is developed rapidly in recent years. In the preparation process of the rigid-flex board, a plurality of problems still exist, the production difficulty is high, the process is complex, the cost is high, the defects of poor binding force, deformation and layering exist, the product percent of pass and the performance are not greatly broken through all the time, and especially in the preparation of the ultrathin rigid-flex board, the problems exist more, and the method is concentrated on the following aspects:
firstly, a prepreg formed by combining epoxy resin and glass fiber is used as a hard board supporting layer, if the strength of a product is to be improved, the thickness of PP (polypropylene) needs to be increased, so that the size in the Z direction is increased, and the product is thickened;
the conventional cover film is formed by combining epoxy resin glue and polyimide, the epoxy resin glue is bonded with a product, and the cover film needs to meet the bending requirement, so that the modulus, the tensile strength and the Tg point of the glue layer are lower, and the integral strength of a soft board area is limited under the condition of the same thickness;
thirdly, the hard board layer of the conventional rigid-flexible board is provided with epoxy resin glue, Polyimide (PI) of a covering film, epoxy resin of a glass fiber prepreg, silicon dioxide filler, solder resist ink and the like, the materials are of many types, the thermal expansion coefficients are difficult to match, and the deformation is difficult to control after reflow soldering;
fourthly, traditional metal reinforcements such as steel sheets, copper sheets and nickel sheets are bonded through conductive adhesive, so that products and the metal reinforcements are bonded and conducted, the conductive adhesive is a mixture of resin and conductive particles, moisture is easy to absorb at normal temperature, and the conductive particles are oxidized to influence conductivity; after the high-temperature process of over-reflow, the resin is easy to expand to influence the conductivity, and the poor explosion plate can be seriously caused;
fifthly: in the routing bonding process, the supporting strength of a product is one of important influence factors of routing quality when a cleaver is pressed down, the supporting force of the product is good, the routing yield is high, a resin layer covering a film is arranged in a traditional soft and hard combination plate structure, the strength is low, and the routing effect can be influenced.
Therefore, a new ultrathin plate preparation process needs to be designed to meet the production requirements.
Disclosure of Invention
The invention aims to solve the technical problem of providing a photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flexible printed circuit board which is simple and reasonable in process and easy to process.
The technical scheme adopted by the invention for solving the technical problems is as follows: a photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flex board is characterized by comprising the following steps:
1) selecting a hard metal plate as a substrate, and obtaining an opening in the hard plate area of the metal substrate by etching, mechanical drilling or laser drilling;
2) carrying out resin hole plugging and grinding on the opening position of the hard plate area;
3) laminating a first TPI layer on two sides of the metal plate;
4) drilling;
5) an addition process comprises the following steps: carrying out copper deposition and whole-plate copper plating;
6) exposure and development: pressing a photosensitive dry film on two sides, and exposing circuits on the two sides to realize pattern transfer; after developing, removing the dry film in the non-circuit area;
7) the subtraction process comprises the following steps: etching to remove the uncovered copper of the dry film in the non-circuit area;
8) removing the dry film, and forming a two-sided circuit on the first TPI layer;
9) carrying out second TPI layer lamination on the back of the electroplated circuit board;
10) drilling;
11) an addition process comprises the following steps: performing copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface;
12) exposure and development: pressing a photosensitive dry film on one surface, pasting an electroplating-resistant adhesive tape on the other surface, and exposing a circuit on one surface to realize pattern transfer; after developing, removing the dry film in the non-circuit area;
13) the subtraction process comprises the following steps: etching to remove the uncovered copper of the dry film in the non-circuit area;
14) removing the dry film, and forming a single-sided circuit on the second TPI layer;
15) the laser process comprises the following steps: removing the TPI layer in the middle non-hard board area and the tail hard board area on the metal substrate;
16) exposure and development: pressing photosensitive dry films on two sides, and exposing on one side to realize pattern transfer; after developing, removing the dry film in the non-hard plate area of the metal substrate;
17) etching to remove the hard metal plate on the non-hard plate area of the metal substrate;
18) removing the dry film to form an ultrathin soft and hard combined plate structure;
19) and (3) screen printing solder resist: printing ink to obtain a solder resist screen printing layer, and obtaining the ultrathin rigid-flexible printed circuit board.
Preferably, the hard metal plate in step 1) is a steel plate, a copper plate, a nickel plate or other hard metal plates, and the optimal thickness is 90-110 um.
As a modification, the step 1) of opening is obtained by etching, mechanical drilling or laser drilling.
As a modification, the hard board areas in step 2) refer to a head part and a tail part, and the product is exemplified by a head part opening; and grinding is to grind the resin convex part at the opening of the hole until the resin is flush with the hard metal plate.
And improving the step 3), wherein the first TPI layer is pressed by vacuum pressing or ordinary quick pressing, the first TPI layer is made of thermoplastic polyimide materials, and the optimal thickness is 10-40 um.
Preferably, the drilling in step 4) and step 10) is performed by laser drilling.
Preferably, the step 5) is an addition process: and (4) performing copper deposition and whole-plate copper plating, wherein the optimal thickness of the copper deposition and the whole-plate copper plating is 10-20 mu m.
And in a further improvement, the exposure line in the step 6) is film exposure or L DI machine exposure, so as to realize pattern transfer.
Further, the second TPI layer in the step 9) is pressed by vacuum pressing or ordinary quick pressing, and is made of a thermoplastic polyimide material, and the optimal thickness is 10-40 um.
Further, the step 11) is an addition process: and performing copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface, wherein the optimal thickness of the copper deposition and the whole-plate copper plating is 10-20 mu m.
Further, the exposure circuit in the step 12) is film exposure or L DI machine exposure to realize pattern transfer, and the other side is pasted with an anti-electroplating adhesive tape to prevent etching liquid from biting the circuit, so as to play a protection role.
Further, the step 15) of laser processing: and removing the TPI layer in the middle non-hard board area and the tail hard board area on the metal substrate.
Preferably, the optimal thickness of the printing ink in the step 19) is 15-30 um.
The product described herein is a three-layer laminate that can be prepared by repeating the steps 9)10)11)12) above if a multilayer preparation is to be performed.
Compared with the prior art, the invention has the advantages that: a steel plate, a copper plate or a nickel plate is used as a substrate and is directly embedded below the top layer, so that the supporting force during chip mounting can be increased, and the chip deformation is reduced; the steel plate, the copper plate or the nickel plate is embedded into the circuit board, so that the requirements of grounding, heat dissipation and supporting can be met, and the strength of the hard board is greatly improved by taking metal as a hard board processing layer; the steel plate, the copper plate or the nickel plate are directly connected with the circuit through the copper conductor, the grounding conduction resistance value can be below 1 omega, and the change caused by the high temperature of reflow soldering can be avoided; the insulating material adopts pure PI, so that the processing is easy, the material is single, and the thermal expansion coefficients are easy to match; TPI materials are used, and based on SAP addition line technology, the wiring integration level is higher; the method has the advantages of simple process, easy processing, thinner product thickness of the prepared rigid-flex board in the Z direction, smaller size in the XY direction, high strength, difficult deformation and high wiring integration level, and meanwhile, the production efficiency is high and the cost is lower.
Drawings
FIG. 1 is a flow chart of an additive and subtractive process of photosensitive polyimide according to an embodiment of the present invention, wherein (1) steel plate is fed, (2) via holes are drilled, (3) holes are plugged with resin, (4) grinding, (5) a first TPI layer is pressed, (6) holes are drilled, and (7) copper is plated; (8) exposing and developing, (9) etching, (10) stripping, (11) single-side pressing of a second TPI layer, (12) drilling, and (13) single-side deposition copper plating; (14) exposure development, (15) etching, (16) stripping, (17) laser TPI, (18) exposure development, (19) etching, (20) stripping, and (21) solder resist.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
As shown in fig. 1, the photosensitive polyimide additive and subtractive line process (i.e., the additive and subtractive process is combined) of the ultrathin soft-hard board is divided into three parts, namely a head hard board part a, a soft board connecting band area B and a tail hard board area C, wherein the thickness of the head hard board part a of the conventional board is 0.3-0.4mm, the thickness of the tail hard board area C of the conventional board is 0.3-0.45mm, and the thickness of the soft board connecting band area B of the conventional board is 0.08-0.12 mm; the thickness of the head hard plate part A of the ultrathin soft and hard combined plate is required to be 0.2-0.3mm, the thickness of the tail hard plate area C is required to be 0.15-0.2mm, and the thickness of the soft plate connecting belt area B is required to be 0.04-0.08mm, and the specific preparation process comprises the following steps:
1) selecting a hard metal plate as a substrate, wherein the hard metal plate in the step 1) is a steel plate, a copper plate or a nickel plate, and the optimal thickness of the hard metal plate is 90-110um, the metal plate in the embodiment example is recommended to be a steel plate 1, and the thickness of the steel plate 1 is 100 um; and etching, mechanically drilling or laser drilling is adopted in the hard board area of the metal substrate to obtain an opening 11, see fig. 1;
2) plugging the hole 11 in the step 1) with resin 12, and grinding; the product is exemplified by a head opening, the opening 11 is filled with resin, the resin 12 is usually plugged by an epoxy resin material, and then the resin convex part at the opening of the opening 11 is ground until the resin 12 is flush with the hard metal plate, see fig. 3 and 4;
3) laminating first TPI layers 2 on two sides of a steel plate 1, wherein the first TPI layers 2 are subjected to vacuum lamination or common quick pressing, the first TPI layers 2 are made of thermoplastic polyimide materials, and the optimal thickness is 10-40 mu m; see fig (5);
4) the drilling is laser drilling; machining a hole with a diameter smaller than that of the metal plate open hole 11 in the open hole 11 so as to form a new through hole 10, and forming a blind hole 10.1 on the first TPI layer 2 on the steel plate 1; see fig (6);
5) an addition process comprises the following steps: copper deposition and whole-plate copper plating are carried out, the optimal thickness of the copper deposition and the copper plating is 10-20um, and a copper material layer 10.2 is filled on the hole wall of the new through hole 10 in an electroplating mode and is communicated with the seed copper 3; the blind hole 10.1 is filled with copper material in the hole in an electroplating way and is communicated with the seed copper 3, see figure (7);
6) exposing and developing, namely pressing a photosensitive dry film 4 and two exposure circuits on two sides to realize pattern transfer, exposing the exposure circuits by adopting film exposure or L DI machine, and removing the dry film in the circuit area after developing to form a circuit pattern layer 4.1, as shown in a figure (8);
7) the subtraction process comprises the following steps: etching to remove the seed copper 3 uncovered by the dry film in the non-circuit area, see fig. 9;
8) removing the dry film 4, and forming a first circuit electroplated layer 3.1 on two sides on the first TPI layer; see fig (10);
9) pressing a second TPI layer 6 on the back surface of the electroplated circuit board, wherein the pressing of the second TPI layer 6 adopts vacuum pressing or ordinary quick pressing, the second TPI layer 6 is made of thermoplastic polyimide materials, and the optimal thickness is 10-40 um; in the pressing process, part of TPI material is filled in the new via hole 10 and the first circuit electroplated layer 3.1 of the lower part, so that the first TPI layer 2 and the second TPI layer 6 under the steel plate 1 are pressed together, and the drawing is shown in figure (11);
10) drilling is carried out by adopting laser drilling, and blind holes 6.1 are formed in the second TPI layer 6 on the first circuit electroplated layer 3.1, and the blind holes are shown in a figure (12);
11) an addition process comprises the following steps: copper deposition and whole-plate copper plating are carried out, the optimal thickness of the copper deposition and the copper plating is 10-20 mu m, the blind hole 6.1 is filled with copper materials in the hole in an electroplating mode and communicated with seed copper 7, and an anti-electroplating adhesive tape can be pasted on the other surface for operation, which is shown in a figure (13);
12) exposing and developing, namely pressing a photosensitive dry film 5 on one side under the seed copper layer 7, exposing a circuit on one side to realize pattern transfer, exposing the exposed circuit by adopting film exposure or L DI machine exposure, removing the dry film in the circuit area after developing to form a circuit pattern layer 5.1, and pasting an electroplating-resistant adhesive tape 30 on the other side for operation, and referring to a figure (14);
13) the subtraction process comprises the following steps: etching to remove the seed copper 7 uncovered by the dry film in the non-circuit area, see fig. 15;
14) removing the dry film 5, and forming a second line electroplated layer 7.1 on the second TPI layer, as shown in figure (16);
15) the laser process comprises the following steps: removing the first TPI layer 2 of the middle non-hard board region B and the tail hard board region C on the metal substrate, see fig. 17;
16) exposure and development: pressing photosensitive dry films 8 on two sides, exposing a circuit on a single side to realize pattern transfer, and removing dry films in non-hard plate areas of the metal substrate after developing, which is shown in a figure (18);
17) etching to remove the hard metal plate on the non-hard plate region of the metal substrate, see fig. 19;
18) removing the dry film 8 to form an ultrathin soft and hard combined plate structure, see fig. 20;
19) and (3) screen printing solder resist: printing ink to obtain a solder mask silk-screen layer 9, wherein the optimal thickness of the printing ink is 15-30um, and performing surface treatment, testing, appearance and the like to obtain the ultrathin soft and hard combined board, which is shown in a figure (21).
The ultrathin rigid-flexible combined board prepared by the invention has the following main characteristics:
firstly, the product thickness in the Z direction is thinner, and the size in the XY direction is smaller;
TPI materials are used, and based on SAP addition line technology, the wiring integration level is higher;
thirdly, the insulating material is pure PI, so that the processing is easy, the material is single, and the thermal expansion coefficients are easy to match;
metal materials such as a steel sheet, a copper sheet, a nickel sheet and the like are directly embedded below the top layer, so that the supporting force during chip mounting can be increased, and the chip deformation is reduced;
fifthly, metal materials such as steel sheets, copper sheets, nickel sheets and the like are embedded into the circuit board, so that the requirements of grounding, heat dissipation and supporting can be met, and the strength is greatly improved by taking metal as a hard board processing layer;
sixthly, metal materials such as steel sheets, copper sheets and nickel sheets are directly connected with the circuit through a copper conductor, the grounding conduction resistance value can be below 1 omega, and the change caused by high temperature of reflow soldering is avoided.
Claims (13)
1. A photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flex board is characterized by comprising the following steps:
1) selecting a hard metal plate as a substrate, and obtaining an opening in the hard plate area of the metal substrate by etching, mechanical drilling or laser drilling;
2) carrying out resin hole plugging and grinding on the opening position of the hard plate area;
3) laminating a first TPI layer on two sides of the metal plate;
4) drilling;
5) an addition process comprises the following steps: carrying out copper deposition and whole-plate copper plating;
6) exposure and development: pressing a photosensitive dry film on two sides, and exposing circuits on the two sides to realize pattern transfer; after developing, removing the dry film in the non-circuit area;
7) the subtraction process comprises the following steps: etching to remove the uncovered copper of the dry film in the non-circuit area;
8) removing the dry film, and forming a two-sided circuit on the first TPI layer;
9) carrying out second TPI layer lamination on the back of the electroplated circuit board;
10) drilling;
11) an addition process comprises the following steps: performing copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface;
12) exposure and development: pressing a photosensitive dry film on one surface, pasting an electroplating-resistant adhesive tape on the other surface, and exposing a circuit on one surface to realize pattern transfer; after developing, removing the dry film in the non-circuit area;
13) the subtraction process comprises the following steps: etching to remove the uncovered copper of the dry film in the non-circuit area;
14) removing the dry film, and forming a single-sided circuit on the second TPI layer;
15) the laser process comprises the following steps: removing the TPI layer in the middle non-hard board area and the tail hard board area on the metal substrate;
16) exposure and development: pressing photosensitive dry films on two sides, and exposing on one side to realize pattern transfer; after developing, removing the dry film in the non-hard plate area of the metal substrate;
17) etching to remove the hard metal plate on the non-hard plate area of the metal substrate;
18) removing the dry film to form an ultrathin soft and hard combined plate structure;
19) and (3) screen printing solder resist: printing ink to obtain a solder resist screen printing layer, and obtaining the ultrathin rigid-flexible printed circuit board.
2. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the hard metal plate in the step 1) is a steel plate, a copper plate or a nickel plate, and the optimal thickness of the hard metal plate is 90-110 um.
3. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the holes in the step 1) are obtained by etching, mechanical drilling or laser drilling.
4. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the hard board area in the step 2) refers to a head part and a tail part, and the product takes a head part opening as an example for illustration; and grinding is to grind the resin convex part at the opening of the hole until the resin is flush with the hard metal plate.
5. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the first TPI layer in the step 3) is pressed by vacuum pressing or ordinary quick pressing, the first TPI layer is made of thermoplastic polyimide materials, and the optimal thickness is 10-40 mu m.
6. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the drilling in the step 4) and the step 10) is laser drilling.
7. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the step 5) is an addition process: and (4) performing copper deposition and whole-plate copper plating, wherein the optimal thickness of the copper deposition and the copper plating is 10-20 mu m.
8. The photosensitive polyimide additive and subtractive line process according to claim 1, wherein said exposure line of step 6) is a film exposure or an L DI machine exposure to achieve pattern transfer.
9. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: and 9) laminating the second TPI layer and the copper foil in the step 9) by adopting vacuum lamination or ordinary quick lamination, wherein the second TPI layer is made of a thermoplastic polyimide material, and the optimal thickness is 10-40 mu m.
10. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the step 11) is an addition process: and performing copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface, wherein the optimal thickness of the copper deposition and the whole-plate copper plating is 10-20 mu m.
11. The photosensitive polyimide additive and subtractive line process according to claim 1, wherein the exposure line of step 12) is a film exposure or an L DI exposure to realize pattern transfer, and the other side is coated with an electroplating-resistant tape to prevent etching solution from biting the line and protect the line.
12. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the step 15) laser process: and removing the TPI layer in the middle non-hard board area and the tail hard board area on the metal substrate.
13. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the optimal thickness of the printing ink in the step 19) is 15-30 um.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113825305A (en) * | 2021-09-30 | 2021-12-21 | 乐健科技（珠海）有限公司 | Metal-based double-sided circuit board and preparation method thereof |
| CN117355055A (en) * | 2023-12-05 | 2024-01-05 | 福莱盈电子股份有限公司 | Preparation process of Mini-LED carrier circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113825305A (en) * | 2021-09-30 | 2021-12-21 | 乐健科技（珠海）有限公司 | Metal-based double-sided circuit board and preparation method thereof |
| CN117355055A (en) * | 2023-12-05 | 2024-01-05 | 福莱盈电子股份有限公司 | Preparation process of Mini-LED carrier circuit board |
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| CN111432577B (en) | 2023-02-17 |
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