CN111432577B - Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board - Google Patents
Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board Download PDFInfo
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- CN111432577B CN111432577B CN202010138956.3A CN202010138956A CN111432577B CN 111432577 B CN111432577 B CN 111432577B CN 202010138956 A CN202010138956 A CN 202010138956A CN 111432577 B CN111432577 B CN 111432577B
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 230000008569 process Effects 0.000 title claims abstract description 44
- 239000004642 Polyimide Substances 0.000 title claims abstract description 23
- 229920001721 polyimide Polymers 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 63
- 229910052802 copper Inorganic materials 0.000 claims abstract description 63
- 239000010949 copper Substances 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 238000003825 pressing Methods 0.000 claims abstract description 25
- 238000005553 drilling Methods 0.000 claims abstract description 23
- 238000005530 etching Methods 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 20
- 230000008021 deposition Effects 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 238000011161 development Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 238000000227 grinding Methods 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 229910000831 Steel Inorganic materials 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 239000010959 steel Substances 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 13
- 238000012546 transfer Methods 0.000 claims description 13
- 239000000654 additive Substances 0.000 claims description 11
- 230000000996 additive effect Effects 0.000 claims description 11
- 239000002390 adhesive tape Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 abstract description 13
- 230000010354 integration Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 28
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003984 copper intrauterine device Substances 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 229920001155 polypropylene Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flex board comprises the following steps: selecting a hard metal plate as a substrate, and forming holes in the hard plate area; plugging holes with resin and grinding; laminating the first TPI layer on two sides; drilling; performing copper deposition and whole-plate copper plating; exposing and developing; etching to remove seed copper uncovered by the dry film in the non-circuit area; demoulding; pressing a second TPI layer on the back of the electroplated circuit board; drilling; carrying out copper deposition and whole-plate copper plating; exposing and developing; etching to remove seed copper uncovered by the dry film in the non-circuit area; demoulding; laser TPI; exposure and development: etching the metal plate; demoulding; and (5) solder resist. The method has the advantages of simple process, easy processing, thinner product thickness of the prepared rigid-flex board in the Z direction, smaller size in the XY direction, high strength, difficult deformation and high wiring integration level, and meanwhile, the production efficiency is high and the cost is lower.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flexible printed circuit board.
Background
With the continuous progress of technology, the functional requirements on electronic products are higher and higher, and meanwhile, the appearance is also very important to be short, small, light and thin, so that circuit boards with multilayer integrated functions are adopted more and more, and particularly, a rigid-flex board is developed rapidly in recent years. In the preparation process of the rigid-flex board, a plurality of problems still exist, the production difficulty is high, the process is complex, the cost is high, the defects of poor binding force, deformation and layering exist, the product percent of pass and the performance are not greatly broken through all the time, and especially in the preparation of the ultrathin rigid-flex board, the problems exist more, and the method is concentrated on the following aspects:
1. the prepreg formed by combining epoxy resin and glass fiber is used as a hard board supporting layer, if the strength of a product is to be improved, the thickness of PP (polypropylene) needs to be increased, so that the size in the Z direction is increased, and the product is thickened;
2. the conventional cover film is formed by combining epoxy resin glue and polyimide, and is bonded with a product through the epoxy resin glue, and the cover film needs to meet the bending requirement, so that the modulus, the tensile strength and the Tg point of the glue layer are lower, and the integral strength of a soft board area is limited under the condition of the same thickness;
3. the hard board layer of the conventional rigid-flexible printed circuit board is provided with epoxy resin glue, polyimide (PI) of a covering film, epoxy resin of a glass fiber prepreg, silicon dioxide filler, solder resist ink and the like, the materials are of many types, the thermal expansion coefficients are difficult to match, and the deformation is difficult to control after reflow soldering;
4. traditional metal reinforcements such as steel sheets, copper sheets, nickel sheets and the like are bonded through conductive adhesive, so that products are bonded and conducted with the metal reinforcements, the conductive adhesive is a mixture of resin and conductive particles, moisture is easily absorbed at normal temperature, and the conductive particles are oxidized to influence conductivity; after the high-temperature process of over-reflow, the resin is easy to expand to influence the conductivity, and the poor plate explosion can be caused seriously;
fifthly: in the routing bonding process, the supporting strength of a product is one of important influence factors of routing quality when a cleaver is pressed down, the supporting force of the product is good, the routing yield is high, a resin layer covering a film is arranged in a traditional soft and hard combination plate structure, the strength is low, and the routing effect can be influenced.
Therefore, a new ultrathin plate preparation process needs to be designed to meet the production requirements.
Disclosure of Invention
The invention aims to solve the technical problem of providing a photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flex board with simple and reasonable process and easy processing, and the manufactured rigid-flex board has the characteristics of thin thickness, difficult deformation and high wiring integration level.
The technical scheme adopted by the invention for solving the technical problems is as follows: a photosensitive polyimide addition and subtraction circuit process of an ultrathin rigid-flex board is characterized by comprising the following steps:
1) Selecting a hard metal plate as a substrate, and obtaining an opening in the hard plate area of the metal substrate by etching, mechanical drilling or laser drilling;
2) Carrying out resin hole plugging and grinding on the opening position of the hard plate area;
3) Laminating a first TPI layer on two sides of the metal plate;
4) Drilling;
5) An addition process comprises the following steps: carrying out copper deposition and whole-plate copper plating;
6) Exposure and development: pressing photosensitive dry films on two sides, and exposing circuits on the two sides to realize pattern transfer; after developing, removing the dry film in the non-circuit area;
7) The subtraction process comprises the following steps: etching to remove the uncovered copper of the dry film in the non-circuit area;
8) Removing the dry film, and forming a two-sided circuit on the first TPI layer;
9) Carrying out second TPI layer lamination on the back of the electroplated circuit board;
10 Hole drilling;
11 ) an addition process: performing copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface;
12 Exposure development: one side is pressed with a photosensitive dry film, the other side is pasted with an electroplating-resistant adhesive tape, and the circuit is exposed on the single side, so that the pattern transfer is realized; after developing, removing the dry film in the non-circuit area;
13 ) a subtractive process: etching to remove the uncovered copper of the dry film in the non-circuit area;
14 Removing the dry film to form a single-sided wiring on the second TPI layer;
15 Laser process): removing the TPI layer in the middle non-hard board area and the tail hard board area on the metal substrate;
16 Exposure development: pressing photosensitive dry films on two sides, and exposing on a single side to realize pattern transfer; after developing, removing the dry film in the non-hard plate area of the metal substrate;
17 Etching to remove the hard metal plate on the non-hard plate region of the metal substrate;
18 Removing the dry film to form an ultrathin soft-hard combined plate structure;
19 Screen printing solder resist: printing ink to obtain a solder resist screen printing layer, and obtaining the ultrathin rigid-flexible printed circuit board.
Preferably, the hard metal plate in step 1) is a steel plate, a copper plate, a nickel plate or other hard metal plates, and the optimal thickness of the hard metal plate is 90-110um.
As a modification, the step 1) of opening is obtained by etching, mechanical drilling or laser drilling.
As a modification, the hard board areas in step 2) refer to a head part and a tail part, and the product is exemplified by a head part opening; grinding is to grind the resin convex part at the opening of the hole until the resin is level with the hard metal plate.
And improving the step 3), wherein the first TPI layer is pressed by vacuum pressing or ordinary quick pressing, the first TPI layer is made of thermoplastic polyimide materials, and the optimal thickness is 10-40um.
Preferably, the drilling in step 4) and step 10) is laser drilling.
Preferably, the step 5) is an addition process: and (4) performing copper deposition and whole-plate copper plating, wherein the optimal thickness of the copper deposition and the whole-plate copper plating is 10-20 mu m.
And improving, wherein the exposure line in the step 6) is film exposure or LDI machine exposure, and the pattern transfer is realized.
Further, the second TPI layer in step 9) is pressed by vacuum pressing or normal rapid pressing, and is made of a thermoplastic polyimide material, and the optimal thickness is 10-40um.
Further, the step 11) is an addition process: and performing copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface, wherein the optimal thickness of the copper deposition and the whole-plate copper plating is 10-20 mu m.
Further, the exposure line in the step 12) is film exposure or exposure of an LDI machine, so that pattern transfer is realized; the other side is pasted with an anti-electroplating adhesive tape to prevent the etching liquid from biting the circuit, thereby playing a role in protection.
Further, the step 15) of laser processing: and removing the TPI layer in the middle non-hard board area and the tail hard board area on the metal substrate.
Preferably, the optimal thickness of the printing ink in the step 19) is 15-30um.
The product described herein is a three-layer laminate that can be prepared by repeating the steps 9) 10) 11) 12) above if a multilayer preparation is to be performed.
Compared with the prior art, the invention has the advantages that: a steel plate, a copper plate or a nickel plate is used as a substrate and is directly embedded below the top layer, so that the supporting force during chip mounting can be increased, and the chip deformation is reduced; the steel plate, the copper plate or the nickel plate is embedded into the circuit board, so that the requirements of grounding, heat dissipation and supporting can be met, and the strength of the hard board is greatly improved by taking metal as a hard board processing layer; the steel plate, the copper plate or the nickel plate are directly connected with the circuit through the copper conductor, the grounding conduction resistance value can be below 1 omega, and the change caused by the high temperature of reflow soldering can be avoided; the insulating material adopts pure PI, so that the processing is easy, the material is single, and the thermal expansion coefficients are easy to match; TPI materials are used, and based on SAP addition line technology, the wiring integration level is higher; the method has the advantages of simple process, easy processing, thinner product thickness of the prepared rigid-flex board in the Z direction, smaller size in the XY direction, high strength, difficult deformation and high wiring integration level, and meanwhile, the production efficiency is high and the cost is lower.
Drawings
FIG. 1 is a flow chart of an additive and subtractive process of photosensitive polyimide according to an embodiment of the present invention, wherein (1) steel plate is fed, (2) via holes are drilled, (3) holes are plugged with resin, (4) grinding, (5) a first TPI layer is pressed, (6) holes are drilled, and (7) copper is plated; (8) For exposure and development, (9) for etching, (10)
Stripping, (11) pressing a second TPI layer on one side, (12) drilling, and (13) depositing copper on one side; (14) Exposure development, (15) etching, (16) stripping, (17) laser TPI, (18) exposure development, (19) etching, (20) stripping, and (21) solder resist.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
As shown in fig. 1, the structure of the ultra-thin rigid-flex board of this embodiment is divided into three parts, namely, a head rigid board part a, a flexible board connecting band area B and a tail rigid board area C, the thickness requirement of the head rigid board part a of the conventional board is 0.3-0.4mm, the thickness requirement of the tail rigid board area C is 0.3-0.45mm, and the thickness requirement of the flexible board connecting band area B is 0.08-0.12mm; the thickness of the head hard plate part A of the ultrathin soft and hard combined plate is required to be 0.2-0.3mm, the thickness of the tail hard plate area C is required to be 0.15-0.2mm, and the thickness of the soft plate connecting belt area B is required to be 0.04-0.08mm, and the specific preparation process comprises the following steps:
1) Selecting a hard metal plate as a substrate, wherein the hard metal plate in the step 1) is a steel plate, a copper plate or a nickel plate, and the optimal thickness of the hard metal plate is 90-110um, the metal plate in the embodiment example is recommended to be a steel plate 1, and the thickness of the steel plate 1 is 100um; and etching, mechanically drilling or laser drilling is adopted in the hard board area of the metal substrate to obtain an opening 11, see fig. 1 (1);
2) Plugging the hole 11 in the step 1) with resin 12, and grinding; the product is exemplified by a head opening, the opening 11 is filled with resin, the resin 12 is usually plugged by an epoxy resin material, and then the resin convex part at the opening of the opening 11 is ground until the resin 12 is flush with the hard metal plate, see fig. 1 (3), (4);
3) Laminating first TPI layers 2 on two sides of a steel plate 1, wherein the first TPI layers 2 are subjected to vacuum lamination or common quick pressing, the first TPI layers 2 are made of thermoplastic polyimide materials, and the optimal thickness is 10-40 mu m; see fig. 1 (5);
4) The drilling is laser drilling; processing a hole with a diameter smaller than that of the metal plate open hole 11 in the open hole 11 so as to form a new through hole 10, and forming a blind hole 10.1 on the first TPI layer 2 on the steel plate 1; see fig. 1 (6);
5) An addition process comprises the following steps: copper deposition and whole-plate copper plating are carried out, the optimal thickness of the copper deposition and the copper plating is 10-20um, and a copper material layer 10.2 is filled on the hole wall of the new via hole 10 in an electroplating mode and is communicated with the seed copper 3; the blind hole 10.1 is filled with copper material in the hole in an electroplating way and is communicated with the seed copper 3, see fig. 1 (7);
6) Exposure and development: pressing a photosensitive dry film 4 on two sides and exposing circuits on two sides to realize pattern transfer, exposing the exposed circuits by adopting film exposure or an LDI machine, and removing the dry film in the circuit area after developing to form a circuit pattern layer 4.1, which is shown in figure 1 (8);
7) A subtraction process: etching to remove the seed copper 3 uncovered by the dry film in the non-circuit area, see fig. 1 (9);
8) Removing the dry film 4, and forming a first circuit electroplated layer 3.1 on two sides on the first TPI layer; see fig. 1 (10);
9) Pressing a second TPI layer 6 on the back surface of the electroplated circuit board, wherein the pressing of the second TPI layer 6 adopts vacuum pressing or ordinary rapid pressing, the second TPI layer 6 is made of a thermoplastic polyimide material, and the optimal thickness is 10-40um; in the pressing process, part of the TPI material is filled in the new via hole 10 and the first line electroplated layer 3.1 at the lower part, so that the first TPI layer 2 and the second TPI layer 6 under the steel plate 1 are pressed together, and see fig. 1 (11);
10 Drilling is performed by laser drilling to form blind holes 6.1 in the second TPI layer 6 on the first wiring plating layer 3.1, see fig. 1 (12);
11 ) an addition process: copper deposition and whole-plate copper plating are carried out, the optimal thickness of the copper deposition and the copper plating is 10-20um, the blind hole 6.1 is filled with copper materials in an electroplating mode and is communicated with seed copper 7, and an electroplating resistant adhesive tape can be pasted on the other surface for operation, which is shown in a figure 1 (13);
12 Exposure development: pressing a photosensitive dry film 5 on one side under the seed copper layer 7, exposing a circuit on one side to realize pattern transfer, exposing the exposed circuit by adopting film exposure or an LDI machine, removing the dry film in the circuit area after developing to form a circuit pattern layer 5.1, and pasting an electroplating-resistant adhesive tape 30 on the other side for operation; see fig. 1 (14);
13 ) a subtractive process: etching to remove the seed copper 7 uncovered by the dry film in the non-circuit area, see fig. 1 (15);
14 Removing the dry film 5 to form a second line plating layer 7.1 on the second TPI layer, see fig. 1 (16);
15 Laser process): removing the first TPI layer 2 in the middle non-hard plate region B and the tail hard plate region C on the metal substrate, see fig. 1 (17);
16 Exposure development: pressing photosensitive dry films 8 on two sides, exposing a circuit on a single side to realize pattern transfer, and removing dry films in non-hard plate areas of the metal substrate after developing, which is shown in a figure 1 (18);
17 Etching away the hard metal plate on the non-hard plate region of the metal substrate, see fig. 1 (19);
18 Removing the dry film 8 to form an ultra-thin soft and hard combined plate structure, see fig. 1 (20);
19 Screen printing solder resist: printing ink to obtain a solder mask silk-screen layer 9, wherein the optimal thickness of the printing ink is 15-30um, and performing surface treatment, testing, appearance and the like to obtain the ultrathin soft and hard combined board, which is shown in figure 1 (21).
The ultrathin rigid-flexible combined board prepared by the invention has the following main characteristics:
1. the product thickness in the Z direction is thinner, and the size in the XY direction is smaller;
2. TPI materials are used, and based on SAP addition line technology, the wiring integration level is higher;
3. the insulating material is pure PI, so that the processing is easy, the material is single, and the thermal expansion coefficients are easy to match;
4. metal materials such as steel sheets, copper sheets, nickel sheets and the like are directly embedded below the top layer, so that the supporting force during chip mounting can be increased, and the chip deformation is reduced;
5. metal materials such as steel sheets, copper sheets, nickel sheets and the like are embedded into the circuit board, so that the requirements of grounding, heat dissipation and supporting can be met, and the strength is greatly improved by taking metal as a hard board processing layer;
6. the metal materials such as the steel sheet, the copper sheet, the nickel sheet and the like are directly connected with the circuit through the copper conductor, the grounding conduction resistance value can be below 1 omega, and the change caused by the high temperature of the reflow soldering is avoided.
Claims (11)
1. A photosensitive polyimide addition and subtraction line process of an ultrathin rigid-flex board is characterized by comprising the following steps:
1) Selecting a hard metal plate as a substrate, and obtaining an opening in the hard plate area of the metal substrate by etching, mechanical drilling or laser drilling;
2) Carrying out resin hole plugging and grinding on the opening position of the hard plate area;
3) Laminating a first TPI layer on two sides of the metal plate;
4) Drilling; processing a hole with a diameter smaller than that of the metal plate hole in the hole to form a new via hole, and forming a blind hole on the first TPI layer on the metal plate;
5) An addition process comprises the following steps: copper deposition and whole plate copper plating are carried out;
6) Exposure and development: pressing a photosensitive dry film on two sides, and exposing circuits on the two sides to realize pattern transfer; after developing, removing the dry film in the non-circuit area;
7) The subtraction process comprises the following steps: etching to remove the copper uncovered by the dry film in the non-circuit area;
8) Removing the dry film, and forming a two-sided circuit on the first TPI layer;
9) Carrying out second TPI layer lamination on the back of the electroplated circuit board;
10 Hole drilling; forming a blind hole in the second TPI layer;
11 ) an addition process: performing copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface;
12 Exposure development: pressing a photosensitive dry film on one surface, pasting an electroplating-resistant adhesive tape on the other surface, and exposing a circuit on one surface to realize pattern transfer; after developing, removing the dry film in the non-circuit area;
13 ) a subtractive process: etching to remove the copper uncovered by the dry film in the non-circuit area;
14 Removing the dry film to form a single-sided wiring on the second TPI layer;
15 Laser process): removing the first TPI layer in the middle non-hard board area and the tail hard board area on the metal substrate;
16 Exposure development: pressing photosensitive dry films on two sides, and exposing on one side to realize pattern transfer; after developing, removing the dry film in the non-hard plate area of the metal substrate;
17 Etching to remove the hard metal plate on the non-hard plate region of the metal substrate;
18 Removing the dry film to form an ultrathin soft-hard combined plate structure;
19 Screen printing solder resist: printing ink to obtain a solder resist screen printing layer, and obtaining the ultrathin rigid-flexible printed circuit board.
2. The photosensitive polyimide additive, subtractive process according to claim 1, wherein: the hard metal plate in the step 1) is a steel plate, a copper plate or a nickel plate, and the thickness of the hard metal plate is 90-110 mu m.
3. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the hard board area in the step 2) refers to a head part and a tail part, and the product takes a head part opening as an example for illustration; and grinding is to grind the resin convex part at the opening of the hole until the resin is flush with the hard metal plate.
4. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the first TPI layer in the step 3) is pressed by vacuum pressing or ordinary rapid pressing, and is made of a thermoplastic polyimide material with the thickness of 10-40 mu m.
5. The photosensitive polyimide additive, subtractive process according to claim 1, wherein: the drilling in the step 4) and the step 10) is laser drilling.
6. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the step 5) is an addition process: and (4) carrying out copper deposition and whole-plate copper plating, wherein the thickness of the copper deposition and the copper plating is 10-20 mu m.
7. The photosensitive polyimide additive, subtractive process according to claim 1, wherein: and 6) exposing the circuit by a film exposure or an LDI machine to realize pattern transfer.
8. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: and 9) pressing the second TPI layer by vacuum pressing or ordinary quick pressing, wherein the second TPI layer is made of a thermoplastic polyimide material and has the thickness of 10-40 mu m.
9. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the step 11) is an addition process: and (4) carrying out copper deposition and whole-plate copper plating, and pasting an anti-electroplating adhesive tape on the other surface, wherein the thickness of the copper deposition and the whole-plate copper plating is 10-20 mu m.
10. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the exposure line in the step 12) is film exposure or LDI machine exposure, and graph transfer is realized; the other side is pasted with an anti-electroplating adhesive tape to prevent the etching liquid from biting the circuit, thereby playing a role in protection.
11. The photosensitive polyimide additive, subtractive line process according to claim 1, wherein: the thickness of the printing ink in the step 19) is 15-30 mu m.
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| CN117355055A (en) * | 2023-12-05 | 2024-01-05 | 福莱盈电子股份有限公司 | Preparation process of Mini-LED carrier circuit board |
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| JP2006066525A (en) * | 2004-08-25 | 2006-03-09 | Matsushita Electric Ind Co Ltd | Flexible printed wiring board |
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| US20100294544A1 (en) * | 2005-07-29 | 2010-11-25 | Atsushi Momota | Bending-Type Rigid Printed Wiring Board and Process for Producing the Same |
| CN101087494A (en) * | 2007-07-27 | 2007-12-12 | 日月光半导体制造股份有限公司 | Method for making circuit board |
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Denomination of invention: A photosensitive polyimide additive and subtractive circuit process for ultra-thin soft hard bonding board Granted publication date: 20230217 Pledgee: Ningbo Yuyao Rural Cooperative Bank Pledgor: NINGBO HUAYUAN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980031712 |