KR101154567B1 - Method for manufacturing of a printed circuit board - Google Patents

Abstract

PURPOSE: A method for manufacturing a printed circuit board is provided to improve productivity by forming via holes on a plurality of substrates all at once. CONSTITUTION: A second insulation substrate is attached to a first insulation substrate. A first via hole(140) is formed on the first insulation substrate. A second via hole(230) is formed on the insulation substrate. A conductive via is formed by plating the first via hole and the second via hole. The first insulation substrate with the conductive via is separated from the second insulation substrate with the conductive via.

Description

Method for manufacturing of a printed circuit board

The present invention relates to a method of manufacturing a printed circuit board.

Printed Circuit Boards (PCBs) are like copper on electrically insulating substrates.

Is formed by printing a circuit line pattern with a conductive material, and refers to a board immediately before mounting an electronic component. That is, it means the circuit board which fixed the mounting position of each component, and printed and fixed the circuit pattern which connects components to the flat surface surface, in order to mount many electronic elements of various types densely on a flat plate.

In such a printed circuit board, via holes are formed through a laser drill process and a plating layer is formed in the via holes in order to electrically connect circuit patterns disposed above and below the insulating layer to form conductive vias.

1A to 1D are cross-sectional views illustrating a method of manufacturing a printed circuit board according to the prior art, in the order of a process.

Referring to FIG. 1A, in the method of manufacturing a printed circuit board according to the related art, the conductive layer 2 is laminated on the upper and lower surfaces of the insulating plate 1.

In this case, when the insulating plate 1 is an insulating layer, the laminated structure of the insulating layer and the conductive layer 2 may be a conventional copper clad laminate (CCL).

Next, referring to FIG. 1B, the conductive layer 2 stacked on the insulating plate 1 is etched to form a pattern.

In this case, the pattern may be formed by partially etching the conductive layer 2 through exposure, development and etching using a photosensitive film.

Next, referring to FIG. 1C, a via hole 3 is formed in the insulating plate 1 of the etched portion. The via hole 3 may be formed through a general CO 2 laser facility.

Next, referring to FIG. 1D, the formed via hole 3 is plated by a peel plating method to form a conductive via 4.

As described above, a printed circuit board according to the related art is manufactured by forming a via hole 3 in an insulating plate 1 using a Co ₂ facility, and forming a conductive via 4 by plating the formed via hole 3. do.

However, when the laminated structure of the insulating layer and the conductive layer 2 is a thin plate CCL, it is difficult to form the via hole 3 as described above in a general installation.

That is, when the via hole is formed in the CCL of the thin plate (40 μm or less), work is not possible in general wet facilities, and there is a problem that via hole formation is possible only in specially manufactured facilities.

The embodiment provides a method of manufacturing a new printed circuit board.

In addition, the embodiment provides a method of manufacturing a printed circuit board to easily form a via hole for a CCL of a thin plate.

In addition, the embodiment provides a method of manufacturing a printed circuit board that can improve productivity.

According to an embodiment of the present disclosure, a method of manufacturing a printed circuit board may include attaching a first insulating substrate and a second insulating substrate, forming a first via hole in the attached first insulating substrate, and forming a second via substrate on the second insulating substrate. Forming a second via hole, plating the formed first via hole and the second via hole to form a conductive via, and separating the first insulating substrate from which the conductive via is formed and the second insulating substrate; .

The attaching may include attaching the back surface of the first insulating substrate and the second insulating substrate to face each other.

The attaching may include preparing the first insulating substrate, applying an adhesive to one surface of the first insulating substrate, and applying the first insulating substrate and the second insulating substrate to which the adhesive is applied. In close contact.

In addition, the adhesive is selectively applied to an edge region of one surface of the first insulating substrate, and the region to which the adhesive is applied is a dummy region.

In addition, a vacuum state is maintained between the attached first insulating substrate and the second insulating substrate by the applied adhesive.

In addition, the separating is a step of trimming the portion to which the adhesive is applied.

The first and second insulating substrates may include a core insulating layer and a metal layer attached to at least one of upper and lower portions of the core insulating layer.

The forming of the first and second via holes may include removing the metal layer in the region where the via hole is to be formed, and etching the core insulating layer, which is opened by removing the metal layer, by laser etching the first and second via holes. Forming a step.

The forming of the conductive via may be performed by plating the metal into the formed first and second via holes to fill the first and second via holes.

The forming of the conductive via may include forming a first conductive layer in the formed first via hole and a second via hole, and forming a second conductive layer on the formed first conductive layer.

In addition, the first conductive layer is formed of an alloy containing copper, and the second conductive layer is formed of an alloy including at least one of nickel, chromium, and gold (Au).

The forming of the second conductive layer may include forming a mask layer exposing the formed first conductive layer on the first and second insulating substrates, and using the mask layer on the first conductive layer. Plating a metal to form a second conductive layer; and removing the formed mask layer.

The method may further include forming a circuit pattern by etching the metal layers of the first and second insulating substrates.

In addition, the circuit pattern and the conductive via include the same metal.

According to the embodiment of the present invention, the via hole can be formed even in the thin plate, and since the via hole is formed in a plurality of substrates at once, the productivity can be improved and the manufacturing cost can be reduced.

1A to 1C are cross-sectional views illustrating a method of manufacturing a printed circuit board according to the prior art in the order of processes.
2 is a cross-sectional view illustrating a printed circuit board according to a first embodiment of the present invention.
3 to 9 are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to the first embodiment of the present invention.
10 is a cross-sectional view of a printed circuit board according to a second exemplary embodiment of the present invention.
11 to 18 are cross-sectional views illustrating a method of manufacturing a printed circuit board according to a second embodiment of the present invention in the order of process.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. On the contrary, when a part is "just above" another part, there is no other part in the middle.

In the drawings, the thickness or size of each layer is exaggerated, omitted or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not entirely reflect the actual size.

2 is a cross-sectional view illustrating a printed circuit board according to a first embodiment of the present invention.

Referring to FIG. 2, the printed circuit board according to the first embodiment includes a first printed circuit board 100 and a second printed circuit board 200.

In addition, the first printed circuit board 100 may include a first circuit pattern 125 formed by etching the first insulating layer 110 and the first metal layer 120 formed on and under the first insulating layer 110. ) And a first conductive via 150 filling the first via hole 140 formed by removing the first insulating layer 110.

In addition, the second printed circuit board 220 may include a second circuit pattern formed by etching the second insulating layer 210 and the second metal layer 220 formed on and under the second insulating layer 210. 225 and a second conductive via 240 filling the second via hole 230 formed in the second insulating layer 210.

In this embodiment, the first conductive via 150 formed in the first printed circuit board 100 and the conductive via 240 formed in the second printed circuit board 200 are formed together by the same operation. It is characterized by.

The first insulating layer 110 and the second insulating layer 210 may be a supporting substrate of a printed circuit board formed in a single circuit pattern. However, as shown in FIG. 2, a plurality of laminated structures may include at least one of the printed circuit boards. It may also mean an insulating layer region in which a circuit pattern is formed.

In the case where the first insulating layer 110 and the second insulating layer 210 mean any one of a plurality of stacked structures, an upper portion of the first and second insulating layers 110 and 210 or / And a plurality of circuit patterns 125 and 225 may be continuously formed in the lower portion.

The first insulating layer 110 and the second insulating layer 210 may be a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite material substrate, or a glass fiber impregnated substrate, and may include an epoxy resin. It may include a system-based insulating resin, alternatively may include a polyimide-based resin.

The first metal layer 120 and the second metal layer 220 are formed on and under each of the first insulating layer 110 and the second insulating layer 210. For example, the first metal layer 120 and the second metal layer 220 may be formed of an alloy including copper.

In this case, the stacking structure of the first insulating layer 110 and the first metal layer 120 and the stacking structure of the second insulating layer 210 and the second metal layer 220 may be conventional CCL (Copper Clad Laminate). .

The first via hole 140 is formed by selectively removing the first insulating layer 110 and the first metal layer 120 of the first printed circuit board 100, and the formed first via hole ( The first conductive via 150 is formed by filling the 140.

The first conductive via 150 electrically connects the circuit pattern formed on the upper surface of the first insulating layer 110 and the circuit pattern 125 formed on the lower surface of the first conductive via 150.

In this case, the first conductive via 150 includes the same metal as the first circuit pattern 125 formed by etching the first metal layer 120. In other words, if the first circuit pattern 125 is formed of an alloy containing copper, the first conductive via 150 is formed of an alloy containing copper in the same manner as the first circuit pattern 125. desirable.

In addition, a second via hole 230 is formed by selectively removing the second insulating layer 210 and the second metal layer 220 of the second printed circuit board 200, and the second formed through the peel plating method. The second conductive via 240 filling the via hole 230 is formed.

Here, the second conductive via 240 electrically connects the second circuit pattern 225 formed on the second insulating layer 210 and the second circuit pattern 225 formed on the lower portion of the second conductive via 240.

The second circuit pattern 225 is formed by etching the second metal layer 220 formed on upper and lower portions of the second insulating layer 210.

In this case, the first conductive via 150 formed on the first printed circuit board 100 and the second conductive via 240 formed on the second printed circuit board 200 may be formed together.

Hereinafter, a manufacturing method of a printed circuit board according to a first embodiment of the present invention will be described with reference to the accompanying drawings.

3 to 9 are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to the first embodiment of the present invention.

First, referring to FIG. 3, a first insulating substrate having the first metal layer 120 formed on at least one of the upper and lower portions of the first insulating layer 110 is prepared.

In this case, the first insulating substrate may be a conventional CCL (Copper Clad Laminate).

Next, referring to FIG. 4, an adhesive 130 is coated on the first metal layer 120 formed on one surface of the first insulating layer 110.

That is, the adhesive 130 is coated on the first metal layer 120 formed on the first insulating layer 110 or the adhesive 130 is applied on the first metal layer 120 formed on the lower portion of the first insulating layer 110.

At this time, the adhesive 130 is preferably to be selectively applied to the edge of the first metal layer 120. That is, the adhesive 130 is selectively applied only to the portion removed by a later trimming process, that is, the dummy region.

That is, referring to FIG. 5, the adhesive 130 is selectively applied to the edge region of the first metal layer 120.

This is to easily separate the first and second insulating substrates which are later attached by the adhesive 130 application region.

Next, referring to FIG. 6, the second insulating substrate 210 and the second insulating substrate on which the second metal layer 220 is formed are brought into close contact with the adhesive applied to the first insulating substrate. 2 Attach the insulation board.

More specifically, the second insulating substrate is laminated on the adhesive applying region of the first insulating substrate, and then heated and pressed to attach the second insulating substrate to the first insulating substrate by the applied adhesive 130. do.

In this case, the back surface of the first insulating substrate and the second insulating substrate are attached to face each other, so that via holes may be easily formed in the attached first insulating substrate and the second insulating substrate later.

In addition, since the adhesive 130 is selectively applied only to the edge region of the first insulating substrate, the edge region of the second insulating substrate is in close contact with the edge region of the first insulating substrate so that the first and second insulating substrates are in close contact with each other. Are attached to each other.

Accordingly, the region A, in which the adhesive 130 is not applied, is in a vacuum state among the close contact regions of the first insulating substrate and the second insulating substrate.

In other words, the first and second insulating substrates are attached to each other while maintaining a vacuum state by the adhesive 130 selectively applied to the edge region.

Next, the metal layers 120 and 220 formed on one surface of the first insulating substrate and the second insulating substrate that are in close contact as described above are selectively removed.

In this case, the removal process is performed through an exposure, development and etching process using a photosensitive film laminated on the first metal layer 120 and the second metal layer 220.

In this case, the region removed by the etching process among the first metal layer 120 and the second metal layer 220 corresponds to a region where the first via hole 140 and the second via hole 230 are to be formed. In other words, the first metal layer 120 and the second metal layer 220 are etched and removed to open the region where the first via hole 140 and the second via hole 230 are to be opened.

In addition, when a part of the metal layers 120 and 220 are removed as described above, the first via hole 140 may be selectively removed by selectively removing the first insulating layer 110 and the second insulating layer 210 exposed by the removal process. ) And the second via hole 230 are formed.

In this case, the first via hole 140 and the second via hole 230 may be formed through general Co 2 laser processing.

That is, the first via hole 140 is formed by selectively removing the first insulating layer 110 formed on the first insulating substrate through laser processing. In addition, the second via hole 230 may be formed by selectively removing the second insulating layer 220 formed on the second insulating substrate.

Next, referring to FIG. 8, the first conductive via 150 and the second conductive via 240 filling the first via hole 140 and the second via hole 230 are formed by performing a plating process.

The first conductive via 150 and the second conductive via 240 may be formed by a fill plating method.

That is, the first conductive via 150 filling the first via hole 140 formed by the removal of the first insulating layer 110 is formed through the peel plating method. In addition, a second conductive via 240 filling the second via hole 230 formed by removing the second insulating layer 210 is formed.

In this case, the first and second conductive vias 150 and 240 include the same metal as the first metal layer 120 and the second metal layer 220. In other words, the first and second conductive vias 150 and 240 are formed by plating the same metal as the first and second metal layers 1120 and 220 in the first and second via holes 140 and 240.

Next, referring to FIG. 9, when the first conductive via 150 and the second conductive via 240 are formed as described above, the first insulating substrate and the second insulating substrate that are in close contact with each other by performing a trimming process. Remove the substrate.

In other words, when the conductive via is formed by the plating process, the edge region to which the adhesive 130 is applied, that is, the dummy region is selectively trimmed to separate the first insulating substrate and the second insulating substrate.

In this case, when the trimming process is performed, the vacuum state formed in the close contact area between the first insulating substrate and the second insulating substrate is released, and the first insulating substrate and the second insulating substrate are naturally separated.

In addition, when the first insulating substrate and the second insulating substrate are separated, the first circuit pattern 125 is formed by selectively etching the first metal layer 120 formed on and under the first insulating substrate.

In addition, a second circuit pattern 225 is formed by selectively etching the second metal layer 220 formed on the upper and lower portions of the second insulating substrate.

As described above, according to the first exemplary embodiment of the present invention, the plurality of insulating substrates are brought into close contact with each other, and the conductive via forming process is performed on the plurality of insulating substrates, thereby improving productivity twice and at the same time in general wet equipment. The conductive via may be formed.

10 is a cross-sectional view of a printed circuit board according to a second exemplary embodiment of the present invention.

Referring to FIG. 10, a printed circuit board according to the second embodiment of the present invention includes a first printed circuit board 300 and a second printed circuit board 400.

In this case, the first printed circuit board 300 and the second printed circuit board 400 according to the second embodiment are the first printed circuit board 100 and the second printed circuit board 200 according to the first embodiment. Are the same overall, and differ only for the conductive vias.

Accordingly, in the description of the printed circuit board according to the second embodiment for the convenience of description, the same parts as those already described in the first embodiment will be omitted.

The first printed circuit board 300 includes a first conductive layer 350 filling the first via hole 340 and a second conductive layer 370 formed on the first conductive layer 350.

In addition, the second printed circuit board 400 may include a third conductive layer 440 filling the second via hole 430 and a fourth conductive layer 460 formed on the third conductive layer 440. .

The first conductive layer 350 and the third conductive layer 440 may be formed by a plating method, and may be formed of the same copper material as the first metal layer 320 and the second metal layer 420.

In addition, the second conductive layer 370 and the fourth conductive layer 460 may be formed by a sputtering or plating method using the mask layers 360 and 450 formed separately.

In this case, the second conductive layer 370 and the fourth conductive layer 460 are formed of a material different from that of the first conductive layer 350 and the third conductive layer 440. For example, the second conductive layer 370 and the fourth conductive layer 460 may be formed of at least one of an alloy containing nickel, an alloy containing chromium, and an alloy containing gold.

As described above, the first printed circuit board 300 is formed on the circuit pattern and the bottom surface formed on the upper surface of the first insulating layer 310 by the formed first conductive layer 350 and the second conductive layer 370. The formed circuit pattern 325 is electrically connected.

In addition, the second printed circuit board 400 may include a circuit pattern formed on the upper portion of the second insulating layer 410 by the third conductive layer 440 and the fourth conductive layer 460, and a circuit pattern formed on the lower portion of the second printed circuit board 400. 425 is electrically connected.

Hereinafter, a method of manufacturing a printed circuit board according to the second embodiment of the present invention will be described.

11 to 17 are views for explaining a method of manufacturing a printed circuit board according to the second embodiment of the present invention in the order of process.

Referring to FIG. 11, first, a first insulating layer 310, a first insulating substrate having a first metal layer 320 stacked on the top and bottom surfaces of the first insulating layer 310, is prepared. In this case, the first insulating substrate may be a conventional CCL (Copper Clad Laminate).

In addition, when the first insulating substrate is prepared, an adhesive 330 is applied to one surface of the first insulating substrate. In this case, the adhesive 330 is preferably applied to the edge region of the first insulating substrate for easy separation of the second insulating substrate to be in close contact thereafter. That is, the adhesive 330 is selectively applied only to the dummy region of the first insulating substrate.

Next, referring to FIG. 12, the second insulating layer 410 and the second insulating substrate on which the second metal layer 420 is formed are in close contact with the adhesive 330 applied to the first insulating substrate.

More specifically, the second insulating substrate is laminated on the adhesive coating region of the first insulating substrate, and then heated and pressed to closely adhere the first insulating substrate and the second insulating substrate by the applied adhesive 330. do.

At this time, since the adhesive 330 is selectively applied only to the edge region of the first insulating substrate, as described above, the first insulating substrate and the second insulating substrate are in close contact with each other while maintaining a vacuum state.

Next, referring to FIG. 13, the metal layers 320 and 420 formed on one surface of the first insulating substrate and the second insulating substrate that are in close contact as described above are selectively removed.

In this case, the removal process is performed through an exposure, development and etching process using a photosensitive film laminated on the first metal layer 320 and the second metal layer 420.

In addition, when a portion of the metal layers 320 and 420 are removed as described above, the first via hole 340 is selectively removed by selectively removing the first insulating layer 310 and the second insulating layer 410 exposed by the removal process. ) And the second via hole 430 are formed.

In this case, the first via hole 340 and the second via hole 430 may be formed through general Co2 laser processing. That is, the first via hole 340 is formed by selectively removing the first insulating layer 310 formed on the first insulating substrate through laser processing. In addition, a second via hole 430 is formed by selectively removing the second insulating layer 420 formed on the second insulating substrate.

14, the first conductive layer 350 and the third conductive layer 440 filling the first via hole 340 and the second via hole 430 are formed by performing a plating process.

The first conductive layer 350 and the third conductive layer 440 may be formed by plating an alloy including copper by a plating method.

That is, the first plating layer 350 is formed by plating an alloy including copper on the first via hole 340 formed by removing the first insulating layer 310. In addition, an alloy including copper is plated on the second via hole 430 formed by removing the second insulating layer 410 to form the third plating layer 440.

Next, referring to FIG. 15, except for regions adjacent to the first via hole 340 and the second via hole 430, a first mask layer on the first metal layer 320 and the second metal layer 420. 360 and a second mask layer 450 are formed.

That is, a first mask layer 360 is formed on the first metal layer 320 to expose the formed first via hole 340, and the second via hole 430 is exposed on the second metal layer 420. The second mask layer 450 is formed.

In this case, the first mask layer 360 and the second mask layer 450 may be formed of a dry film.

Next, referring to FIG. 16, a second conductive layer 370 is formed on the first conductive layer 350 using the formed first mask layer 360 as a mask.

In addition, a fourth conductive layer 460 is formed on the third conductive layer 440 by using the formed second mask layer 450 as a mask.

In this case, the second conductive layer 370 and the fourth conductive layer 460 may be formed through a sputtering or plating method.

In addition, the second conductive layer 370 and the fourth conductive layer 460 may be formed of a material different from that of the first conductive layer 350 and the third conductive layer 440. For example, the second conductive layer 370 and the fourth conductive layer 460 may be formed of any one of an alloy containing nickel, an alloy containing chromium, and an alloy containing gold.

As described above, when the second conductive layer 370 and the fourth conductive layer 460 are formed, the formed first mask layer 360 and the second mask layer 450 are peeled off.

Next, referring to FIG. 17, portions of the formed second conductive layer 370 and the fourth conductive layer 460 are etched and removed.

In other words, a portion of the second conductive layer 370 is formed to protrude from the first metal layer 320, and a portion of the fourth conductive layer 460 is formed to protrude from the third metal layer 420. Accordingly, the protruding region of the second conductive layer 370 and the protruding region of the fourth conductive layer 460 are etched and removed. In this case, since the second conductive layer 370 and the fourth conductive layer 460 are formed of a different type of metal from the first metal layer 320 and the second metal layer 420, the second conductive layer 370 and the fourth conductive layer 460 may be formed by the etching process. The first metal layer 320 and the second metal layer 420 are not removed.

Then, a trimming process is performed to separate the first and second insulating substrates that are in close contact with each other.

In other words, when the conductive layers are formed by the plating process, only the edge region to which the adhesive 330 is applied is selectively trimmed to separate the first insulating substrate and the second insulating substrate.

In this case, when the trimming process is performed, the vacuum state formed in the close contact area between the first insulating substrate and the second insulating substrate is released, and the first insulating substrate and the second insulating substrate are naturally separated.

Next, as shown in FIG. 18, a first circuit pattern 325 is formed by selectively removing the first metal layer 320 formed on the upper and lower portions of the first insulating substrate, and forming the second insulating substrate. A second circuit pattern 425 is formed by selectively removing the second metal layer 420 formed on the upper and lower portions.

As described above, according to the exemplary embodiment of the present invention, the via holes may be formed in the thin plate, and the via holes may be formed in the plurality of substrates at one time, thereby increasing productivity and reducing manufacturing costs.

In addition, the preferred embodiment of the present invention is for the purpose of illustration, those skilled in the art will be possible to various modifications, changes, replacements and additions through the spirit and scope of the appended claims, such modifications and changes are the following patents It should be regarded as belonging to the claims.

100, 200, 300, 400: printed circuit board
110, 210, 310, 410: insulation layer
120, 220, 320, 420: metal layer
130, 330: adhesive
140, 230, 340, 430: Via Hole
150 and 240: challenge vias
350, 370, 440, 460: conductive layer

Claims (15)

Preparing a first insulating substrate and selectively applying an adhesive to an edge region of one surface of the first insulating substrate;
Attaching a second insulating substrate to the first insulating substrate using the applied adhesive;
Forming a first via hole in the first insulating substrate and forming a second via hole in the second insulating substrate;
Plating the formed first and second via holes to form conductive vias; And
Separating the first insulating substrate and the second insulating substrate on which the conductive vias are formed;
And a space between the first and second insulating substrates on which the adhesive is not applied by the selectively applied adhesive maintains a vacuum state. The method of claim 1,
The attaching step
And attaching the back surface of the first insulating substrate and the second insulating substrate to face each other. delete delete The method of claim 1,
And a region where the adhesive is applied is a dummy region. delete The method of claim 1,
The separating step is
Method of manufacturing a printed circuit board which is the step of trimming the portion coated with the adhesive. The method of claim 1,
And the first and second insulating substrates include a core insulating layer and a metal layer attached to at least one of upper and lower portions of the core insulating layer. The method of claim 8,
Forming the first and second via holes
Removing the metal layer in the region where the via hole is to be formed, and
And etching the core insulating layer opened by removing the metal layer with a laser to form the first and second via holes. The method of claim 1,
Forming the conductive via
And plating the first and second via holes to fill the first and second via holes, thereby filling the first and second via holes. The method of claim 1,
Forming the conductive via
Forming a first conductive layer in the formed first via hole and the second via hole;
And forming a second conductive layer on the formed first conductive layer. 12. The method of claim 11,
The first conductive layer is formed of an alloy containing copper,
The second conductive layer is a manufacturing method of a printed circuit board formed of an alloy containing at least one of nickel, chromium and gold (Au). 12. The method of claim 11,
Forming the second conductive layer
Forming a mask layer exposing the formed first conductive layer on the first and second insulating substrates,
Plating a metal on the first conductive layer using the mask layer to form a second conductive layer, and
Removing the formed mask layer. The method of claim 8,
And etching the metal layers of the first and second insulating substrates to form a circuit pattern. The method of claim 14,
The circuit pattern and the conductive via is a manufacturing method of a printed circuit board comprising the same metal.

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