JPH02260598A - Manufacture of three-dimensional wiring board - Google Patents
Manufacture of three-dimensional wiring boardInfo
- Publication number
- JPH02260598A JPH02260598A JP8129289A JP8129289A JPH02260598A JP H02260598 A JPH02260598 A JP H02260598A JP 8129289 A JP8129289 A JP 8129289A JP 8129289 A JP8129289 A JP 8129289A JP H02260598 A JPH02260598 A JP H02260598A
- Authority
- JP
- Japan
- Prior art keywords
- board
- bent
- wiring board
- bending
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 238000005452 bending Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は金属芯配線板を立体的即ち三次元構造に加工す
る方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of processing a metal core wiring board into a three-dimensional structure.
従来、この種の金属芯配線板の立体構造加工は単に曲げ
加工のみを行っていた。Conventionally, three-dimensional structure processing of this type of metal core wiring board has been performed simply by bending.
上述した従来の曲げ加工では、金属芯と絶縁樹脂層と回
路を形成する銅層が一体となって曲げられるため、絶縁
樹脂層のように柔軟性を持たず、金属芯のように厚みと
強度を備えていない銅層が曲げ破断する危険を持つ欠点
がある。In the conventional bending process described above, the metal core, the insulating resin layer, and the copper layer forming the circuit are bent together, so they do not have flexibility like the insulating resin layer, but have the thickness and strength like the metal core. The disadvantage is that copper layers that are not equipped with this have the risk of bending and breaking.
即ち、曲げ部の曲率半径（Ｒ）を大きく取ることが必要
となる。その値は概ね０．５■厚のアルミニウム芯と０
．２１厚のガラスエポキシ樹脂層と３５μの銅層の場合
、３．０−の曲率半径以上が実用的といえる。That is, it is necessary to have a large radius of curvature (R) of the bent portion. The value is approximately 0.5cm thick aluminum core and 0.
．． In the case of a glass epoxy resin layer with a thickness of 21 μm and a copper layer with a thickness of 35 μm, a radius of curvature of 3.0 − or more is practical.
本発明の目的は前記課題を解決した立体配線板の製造方
法を提供することにある。An object of the present invention is to provide a method for manufacturing a three-dimensional wiring board that solves the above problems.
前記目的を達成するため、本発明は金属芯配線板を一部
曲げ加工を行い立体配線板を形成する製造方法において
、金属芯の曲げ加工すべき平面上の周囲をエツチング加
工して取り除き、その後に曲げ加工するものである。In order to achieve the above object, the present invention provides a manufacturing method in which a three-dimensional wiring board is formed by partially bending a metal core wiring board. It is used for bending.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明に係る立体配線板を示す斜視図である。FIG. 1 is a perspective view showing a three-dimensional wiring board according to the present invention.
図において、立体配線板１は金属芯２上に絶縁樹脂層３
が積層され、該絶縁樹脂層３上に銅の回路パターン４が
形成されており、その一端を上方に立上らせて折曲げ加
工しである。In the figure, a three-dimensional wiring board 1 has an insulating resin layer 3 on a metal core 2.
are laminated, and a copper circuit pattern 4 is formed on the insulating resin layer 3, one end of which is raised upward and bent.
第２図（ａ） 、 （ｂ） 、 （ａ） 、 （＋１）
は本発明の製造方法を工程順に示す縦断面図である。第
２図（ａ）に示すような金属芯２．絶縁樹脂層３．銅層
５から構成される基材に写真回路形成法等のエツチング
加工を行い５第２図（ｂ）に示すように銅層５に回路パ
ターン４を形成するとともに、金属芯（金属板）２のう
ち折曲げ加工すべき平面上の周囲をエツチング加工しス
リット状に切欠く。Figure 2 (a), (b), (a), (+1)
FIG. 1 is a vertical cross-sectional view showing the manufacturing method of the present invention in order of steps. A metal core 2 as shown in FIG. 2(a). Insulating resin layer 3. The base material composed of the copper layer 5 is etched using a photographic circuit forming method, etc. to form a circuit pattern 4 on the copper layer 5 as shown in FIG. 2(b), and a metal core (metal plate) 2 The periphery of the flat surface to be bent is etched and cut into a slit.
更に１部品６等のはんだ付組立を行った後、スリット状
に切欠いたエツチング加工部７で曲げ加工し、その一部
を上方に立上らせて立体配線板１を製造する。Further, after soldering and assembling one component 6, etc., it is bent using an etched portion 7 cut out in the shape of a slit, and a part thereof is raised upward to produce a three-dimensional wiring board 1.
以上説明したように本発明は金属芯配線板の金属芯部を
エツチング加工し、曲げ加工部分の曲げ強さを低下させ
ることにより、銅回路パターン部に曲げストレスを強く
与えることなく、曲げ加工を行うことができるという効
果を有する。As explained above, the present invention etches the metal core of a metal-core wiring board to reduce the bending strength of the bent portion, thereby allowing bending to be performed without applying strong bending stress to the copper circuit pattern portion. It has the effect that it can be carried out.
第１図は本発明に係る立体配線板を示す斜視図、第２図
（ａ） 、 （ｂ） 、 （ｃ） 、 （ｄ）は本発明
の製造方法を工程順に示す縦断面図である。FIG. 1 is a perspective view showing a three-dimensional wiring board according to the present invention, and FIGS. 2(a), (b), (c), and (d) are longitudinal cross-sectional views showing the manufacturing method of the present invention in order of steps.
Claims (1)
形成する製造方法において、金属芯の曲げ加工すべき平
面上の周囲をエッチング加工して取り除き、その後に曲
げ加工することを特徴とする立体配線板の製造方法。(1) In a manufacturing method in which a three-dimensional wiring board is formed by partially bending a metal core wiring board, the periphery of the metal core on a plane to be bent is removed by etching, and then the bending process is performed. A method for manufacturing a three-dimensional wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8129289A JPH02260598A (en) | 1989-03-31 | 1989-03-31 | Manufacture of three-dimensional wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8129289A JPH02260598A (en) | 1989-03-31 | 1989-03-31 | Manufacture of three-dimensional wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02260598A true JPH02260598A (en) | 1990-10-23 |
Family
ID=13742307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8129289A Pending JPH02260598A (en) | 1989-03-31 | 1989-03-31 | Manufacture of three-dimensional wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02260598A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
| FR2754416A1 (en) * | 1996-10-04 | 1998-04-10 | Thomson Csf | Manufacture of module of several ICs on interconnection structure |
| WO2004109774A3 (en) * | 2003-06-02 | 2005-02-17 | Intel Corp | Selective reference plane bridge(s) on folded package |
| WO2006112478A1 (en) * | 2005-04-19 | 2006-10-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board, led, and led light source unit |
| JP2010232354A (en) * | 2009-03-26 | 2010-10-14 | Nitto Denko Corp | Printed circuit board, and method of manufacturing the same |
| DE102010027149A1 (en) * | 2010-07-14 | 2012-01-19 | Fela Hilzinger Gmbh | Bendable metal core board |
| JP2019121770A (en) * | 2018-01-11 | 2019-07-22 | 日本シイエムケイ株式会社 | Metal base printed wiring board and manufacturing method thereof |
| CN111432577A (en) * | 2020-03-03 | 2020-07-17 | 宁波华远电子科技有限公司 | Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board |
-
1989
- 1989-03-31 JP JP8129289A patent/JPH02260598A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996010326A1 (en) * | 1994-09-27 | 1996-04-04 | Seiko Epson Corporation | Printed wiring board, method of producing the same and electronic devices |
| US6121988A (en) * | 1994-09-27 | 2000-09-19 | Seiko Epson Corporation | Printed wiring board and its manufacturing method, and electronic apparatus |
| KR100327686B1 (en) * | 1994-09-27 | 2002-08-24 | 세이코 엡슨 가부시키가이샤 | Multilayer printed wiring boards, liquid crystal display devices, and electronic printing devices |
| FR2754416A1 (en) * | 1996-10-04 | 1998-04-10 | Thomson Csf | Manufacture of module of several ICs on interconnection structure |
| WO2004109774A3 (en) * | 2003-06-02 | 2005-02-17 | Intel Corp | Selective reference plane bridge(s) on folded package |
| US7057116B2 (en) | 2003-06-02 | 2006-06-06 | Intel Corporation | Selective reference plane bridge(s) on folded package |
| WO2006112478A1 (en) * | 2005-04-19 | 2006-10-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board, led, and led light source unit |
| JP2010232354A (en) * | 2009-03-26 | 2010-10-14 | Nitto Denko Corp | Printed circuit board, and method of manufacturing the same |
| US8350159B2 (en) | 2009-03-26 | 2013-01-08 | Nitto Denko Corporation | Printed circuit board and method of manufacturing the same |
| US9095064B2 (en) | 2009-03-26 | 2015-07-28 | Nitto Denko Corporation | Method for manufacturing printed circuit board |
| DE102010027149A1 (en) * | 2010-07-14 | 2012-01-19 | Fela Hilzinger Gmbh | Bendable metal core board |
| JP2019121770A (en) * | 2018-01-11 | 2019-07-22 | 日本シイエムケイ株式会社 | Metal base printed wiring board and manufacturing method thereof |
| CN111432577A (en) * | 2020-03-03 | 2020-07-17 | 宁波华远电子科技有限公司 | Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board |
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