JPH0462885A - Flexible circuit board - Google Patents
Flexible circuit boardInfo
- Publication number
- JPH0462885A JPH0462885A JP16610390A JP16610390A JPH0462885A JP H0462885 A JPH0462885 A JP H0462885A JP 16610390 A JP16610390 A JP 16610390A JP 16610390 A JP16610390 A JP 16610390A JP H0462885 A JPH0462885 A JP H0462885A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- film
- copper foil
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 19
- 239000011889 copper foil Substances 0.000 abstract description 19
- 238000005530 etching Methods 0.000 abstract description 8
- 238000005452 bending Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 230000001154 acute effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂を基材とするフィルム上にパターンを形
成したフレキシブル回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible circuit board in which a pattern is formed on a film based on resin.
本発明は、フレキシブル回路基板において、樹脂を基材
とするフィルム上に形成されたパターンの幾つかの部分
の厚みを薄くする事により、フレキシブル回路基板の折
り曲げ性を向」ニすると共に、鋭角的な折り曲げにより
、本発明のフレキシブル回路基板を組み込んだ製品のス
ペース効率を向上させ、製品の小型薄型化を達成したこ
とを特徴とするフレキシブル回路基板。The present invention improves the bendability of a flexible circuit board by reducing the thickness of some parts of a pattern formed on a resin-based film, and also improves the bendability of the flexible circuit board. A flexible circuit board characterized in that the space efficiency of a product incorporating the flexible circuit board of the present invention is improved by bending the flexible circuit board, and the product is made smaller and thinner.
従来のフレキシブル回路基板は第２図（ａ）に示す様に
、樹脂を基材とするフィルム１上に、パイロットホール
２を設け、さらにデバイス穴３を設けた後、銅箔を貼り
合わせ、レジスト膜形成、露光、現像、銅箔エツチング
により銅箔パターン４を形成し、回路基板として完成す
る。この時、エツチングして形成された銅箔パターンの
厚みは、どの部分も均一であった。また、従来のフレキ
シブル回路基板には、折り曲げ性向上をねらったものが
あった。このタイプのフレキシブル回路基板を第３図（
、ａ）に示す。第３図（ａ）のフレキシブル回路基板は
、折り曲げ部の樹脂基材にスリット５を入れたものであ
る。なお、第２図（ｂ）は、第２図（ａ）の従来のフレ
キシブル回路基板のＤＤ′部断面断面図２図（Ｃ）は、
Ｄ−Ｄ’部折り曲げ断面図。第３図（ｂ）は、第３図（
ａ）のスリットを有する従来のフレキシブル回路基板の
Ｄ−Ｄ’部部面面図第３図（Ｃ）は、Ｉ）−Ｄ’部折り
曲げ断面図である。従来のフレキシブル回路基板には、
接着剤６、ソルダーレジスト７の有るものと無いものか
ある。As shown in FIG. 2(a), a conventional flexible circuit board is constructed by forming pilot holes 2 and device holes 3 on a resin-based film 1, bonding copper foil, and applying resist. A copper foil pattern 4 is formed by film formation, exposure, development, and copper foil etching, and a circuit board is completed. At this time, the thickness of the etched copper foil pattern was uniform everywhere. Furthermore, some conventional flexible circuit boards are designed to improve bendability. This type of flexible circuit board is shown in Figure 3 (
, shown in a). The flexible circuit board shown in FIG. 3(a) has a slit 5 formed in the resin base material at the bent portion. Note that FIG. 2(b) is a cross-sectional view of the DD′ section of the conventional flexible circuit board of FIG. 2(a), and FIG. 2(C) is a cross-sectional view of the conventional flexible circuit board of FIG.
DD' section folding sectional view. Figure 3(b) is the same as Figure 3(b).
FIG. 3(C) is a partial cross-sectional view taken along line I-D' of a conventional flexible circuit board having slits as shown in FIG. 3(C). Traditional flexible circuit boards include
Some have adhesive 6 and solder resist 7, while others do not.
しかし、前述の従来技術では、折り曲げて使用する際、
折り曲げ部と折り曲げない部分の厚みの差が無い為に、
折り曲げにくい上に、折り曲げ部が円弧状態となり、従
来の回路基板を糾み込んだ製品内にデッドスペースを作
り、製品の小型薄型化を妨げていた。さらに、折り曲げ
部の樹脂ハエにスリット５を入れ、銅箔パターン４のみ
を折り曲げる様にした、改良タイプでは、折り曲げ部の
円弧状態かなくなり、製品の小型薄型化に効果はあるも
のの、強度のある樹脂がなくなり、銅箔ｊ、１１独での
折り曲げになる為、銅箔パターン４の折り曲げ部でクラ
ック８を発生し、歩留りの低下及び信頼性の低Ｆを引き
起こすという課題を有する。However, with the above-mentioned conventional technology, when folded and used,
Because there is no difference in thickness between the folded part and the unbent part,
In addition to being difficult to bend, the bent portion forms an arc, creating dead space within products that incorporate conventional circuit boards, and hindering miniaturization and thinning of products. Furthermore, in the improved type, in which a slit 5 is made in the resin fly at the bending part so that only the copper foil pattern 4 is bent, the arc shape at the bending part disappears, and although it is effective in making the product smaller and thinner, it is not strong enough. Since the resin is used up and the copper foils J and 11 are bent, cracks 8 occur at the folded portions of the copper foil pattern 4, resulting in lower yield and lower reliability.
そこで本発明はこのような課題を解決するものて、その
１］的とするところは、本発明のフレキシブル回路基板
を組み込んだ製品のスペース効率を向」ニさせ、製品の
小型薄型化を達成するところにある。Therefore, the present invention aims to solve these problems, and the purpose is to improve the space efficiency of products incorporating the flexible circuit board of the present invention, and to achieve smaller and thinner products. It's there.
本発明のフレキシブル回路基板は、樹脂を基本４とする
フィルム上にパターンを形成したフレキシブル回路基板
において、回路基板１ノ１り曲げ部のパターン厚みを薄
くする事を特徴とする。The flexible circuit board of the present invention is a flexible circuit board in which a pattern is formed on a film based on resin 4, and is characterized in that the thickness of the pattern at the bent portion of the circuit board 1 is made thinner.
本発明の」二部の構成によれば、フレキシブル回路基板
において、折り曲げ部の折り曲げ性を向」二すると共に
、鋭角的な折り曲げにより、本発明のフレキシブル回路
基板を組み込んだ製品のスペース効率を向」ニさせ、製
品の小型薄型化を達成できる為、回路基板折り曲げ部の
パターン厚みを薄くしないフレキシブル回路基板に比べ
て、フレキシブル回路基板を和み込んだ製品のスペース
効率を向上させ、製品の小型薄型化を達成することがで
きるのである。According to the two-part structure of the present invention, in the flexible circuit board, the bendability of the bent portion is improved, and the space efficiency of the product incorporating the flexible circuit board of the present invention is improved by bending at an acute angle. Compared to flexible circuit boards that do not reduce the pattern thickness at the bent part of the circuit board, the space efficiency of products with flexible circuit boards is improved, and products can be made smaller and thinner. It is possible to achieve this goal.
以下に本発明の実施例を図面にもとづいて説明する。第
１図（ａ）は、本発明のフレキシブル回路基板の平面図
。第１図（ｂ）は、本発明のフレキシブル回路基板の断
面図。第１図（ｃ）は、本発明のフレキシブル回路基板
を折り曲げた時の断面図である。Embodiments of the present invention will be described below based on the drawings. FIG. 1(a) is a plan view of the flexible circuit board of the present invention. FIG. 1(b) is a sectional view of the flexible circuit board of the present invention. FIG. 1(c) is a cross-sectional view of the flexible circuit board of the present invention when it is bent.
フィル１、］にプレス抜き、ＮＣカッター切断、レーザ
ーカット、化学エツチング等の方法でパイロットホール
２、デバイス六３を作成する。この後、銅箔をフィルム
］の上に貼り合わせ、銅箔の表面にレジスト膜をコータ
ーで形成した後、露光、現像を行い、ハーフエツチング
を行って、／”％−フエッチング部９を得る。この後、
レジスト膜剥離を行い、再び、レジスト膜コート、露光
、現像を行った後、エツチング、レジスト膜剥離を行い
、銅箔パターン４を形成した第１図（ａ）の平面図、第
１図（ｂ）の断面図に示す本発明のフレキシブル回路基
板を得る。本実施例は、フィルム１の上に接着剤６を積
層し、銅箔を貼り合わせた、３層フレキシブル回路基板
の例であるが、接着剤６の無い、２層フレキシブル回路
基板の場合も存在する。ハーフエツチング部９の配列は
、本実施例に示す２列配置の場合の他、１−列の場合、
多数配列の場合がある。本発明のフレキシブル回路基板
をハーフエツチング部４で、９０度折り曲げを行った場
合、ハーフエツチング部が他の部分に比べ、強度的に弱
くなっている為、ハーフエツチング部で鋭角的に折れ曲
り、第１図（Ｃ）の本発明のフレキシブル回路基板を折
り曲げた時の断面図に示す状態となる。A pilot hole 2 and a device 63 are created in the fill 1 by a method such as press punching, NC cutter cutting, laser cutting, chemical etching, etc. After this, the copper foil is bonded onto the film], a resist film is formed on the surface of the copper foil using a coater, and then exposed, developed, and half-etched to obtain the /''%-etched area 9. .After this,
After removing the resist film, coating the resist film again, exposing it, and developing it, etching and removing the resist film are performed to form a copper foil pattern 4. The plan view of FIG. 1(a) and FIG. ) is obtained. This example is an example of a three-layer flexible circuit board in which adhesive 6 is laminated on film 1 and copper foil is pasted, but there is also a case of a two-layer flexible circuit board without adhesive 6. do. In addition to the two-row arrangement shown in this embodiment, the half-etched portions 9 may be arranged in one row.
There may be multiple arrays. When the flexible circuit board of the present invention is bent 90 degrees at the half-etched part 4, the half-etched part is weaker in strength than other parts, so the half-etched part is bent at an acute angle. The state shown in FIG. 1(C) is a cross-sectional view when the flexible circuit board of the present invention is bent.
以上の実施例において、ハーフエツチング部が他の部分
に比べ強度的に弱くなっている為、ハーフエツチング部
で鋭角的に折り曲ると共に、ノ＼フエッチング部が銅箔
単体では無く、フィルムとの積層構造になっている為、
強度的に、銅箔のクラックの発生を防止する為、ハーフ
エツチング部を設けない従来のフレキシブル回路基板、
及びスリットを有する従来のフレキシブル回路基板に比
べて、フレキシブル回路基板を組み込んだ製品のスペー
ス効率を向上させ、製品の小型薄型化を達成することか
できる。In the above examples, the strength of the half-etched part is weaker than other parts, so the half-etched part is bent at an acute angle, and the half-etched part is not made of copper foil alone, but is made of a film. Because it has a laminated structure,
In terms of strength, in order to prevent cracks in the copper foil, conventional flexible circuit boards do not have half-etched parts.
Compared to conventional flexible circuit boards having slits and slits, the space efficiency of products incorporating flexible circuit boards can be improved, and products can be made smaller and thinner.
以」二述べたように発明によれば、回路基板折り曲げ部
のパターン厚みを薄くする事により、回路基板を折り曲
げた場合、ハーフエツチング部が他の部分に比べ強度的
に弱くなっている為、ハーフエツチング部で鋭角的に折
れ曲ると共に、ハーフエツチング部が銅箔用体では無く
、フィルムとの積層構造になっている為、強度的に、銅
箔のクラックの発生を防止することにより、従来のバタ
ン厚みを薄くしていないフレキシブル回路基板の場合と
比較ずれは、フレキシブル回路基板を組み込んだ製品の
スペース効率を向」−させ、製品の小型薄型化を達成で
きるという効果を有する。As mentioned above, according to the invention, by reducing the thickness of the pattern at the bent portion of the circuit board, when the circuit board is bent, the strength of the half-etched portion is weaker than other parts. The half-etched part is bent at an acute angle, and since the half-etched part is not a body for copper foil, but has a laminated structure with a film, it is strong and prevents cracks in the copper foil. Compared to the case of a conventional flexible circuit board in which the thickness of the panel is not reduced, the difference has the effect of improving the space efficiency of a product incorporating a flexible circuit board and making the product smaller and thinner.
第１図（ａ）は、本発明のフレキシブル回路基板の平面
図。第１図（ｂ）は、本発明のフレキシブル回路基板の
断面図。第１図（Ｃ）は、本発明のフレキシブル回路基
板を折り曲げた時の断面図。
第２図（ａ）は、従来のフレキシブル回路基板の平面図
。第２図（ｂ）は、従来のフレキシブル回路基板の断面
図。第２図（Ｃ）は、従来のフレキシブル回路基板を折
り曲げた時の断面図。第３図（ａ）は、従来のスリット
を有するフレキシブル回路基板の平面図。第３図（ｂ）
は、従来のスリットを有するフレキシブル回路基板の断
面図。第３図（Ｃ）は、従来のスリットを有するフレキ
ンプル回路基板を折り曲げた時の断面図である。
１ ・ ・
２ ・ ・
４ ・ ・
５ ・ ・
６ ・ ・
７ ・ ・
訃・
９・争
フィルム
バイロッＩ・ホール
デバイス穴
銅箔パターン
スリット
接着剤
ソルダーレジスト
クラック
ハーフエツチング部
ｃ’（
○つ
子
↓晰FIG. 1(a) is a plan view of the flexible circuit board of the present invention. FIG. 1(b) is a sectional view of the flexible circuit board of the present invention. FIG. 1(C) is a cross-sectional view of the flexible circuit board of the present invention when it is bent. FIG. 2(a) is a plan view of a conventional flexible circuit board. FIG. 2(b) is a sectional view of a conventional flexible circuit board. FIG. 2(C) is a cross-sectional view of a conventional flexible circuit board when it is bent. FIG. 3(a) is a plan view of a conventional flexible circuit board having slits. Figure 3(b)
1 is a cross-sectional view of a conventional flexible circuit board with slits. FIG. 3(C) is a cross-sectional view of a conventional flexible circuit board having slits when it is bent. 1 ・ ・ 2 ・ ・ 4 ・ ・ 5 ・ ・ 6 ・ ・ 7 ・ ・ Death ・ 9 ・ War film biro I ・ Hall device hole copper foil pattern slit adhesive solder resist crack half etching part c' ( ○ Tsuko ↓ Lucid
Claims (1)
たフレキシブル回路基板において、回路基板折り曲げ部
のパターン厚みを薄くする事を特徴とするフレキシブル
回路基板。(1) A flexible circuit board in which a pattern is formed on a resin-based film, characterized in that the pattern thickness at the bent portion of the circuit board is made thinner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16610390A JPH0462885A (en) | 1990-06-25 | 1990-06-25 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16610390A JPH0462885A (en) | 1990-06-25 | 1990-06-25 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0462885A true JPH0462885A (en) | 1992-02-27 |
Family
ID=15825074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16610390A Pending JPH0462885A (en) | 1990-06-25 | 1990-06-25 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0462885A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012169680A (en) * | 2005-05-20 | 2012-09-06 | Hitachi Chem Co Ltd | Printed wiring board |
| JP2013016232A (en) * | 2011-07-04 | 2013-01-24 | Nhk Spring Co Ltd | Wiring circuit board |
| US8664534B2 (en) | 2005-05-20 | 2014-03-04 | Hitachi Chemical Company, Ltd. | Printed wiring board |
| WO2014136856A1 (en) * | 2013-03-07 | 2014-09-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| JP2017011214A (en) * | 2015-06-25 | 2017-01-12 | 京セラ株式会社 | Flexible wiring board |
| JP2019140365A (en) * | 2018-02-13 | 2019-08-22 | ▲き▼邦科技股▲分▼有限公司 | Thin film flip chip package and flexible substrate thereof |
| JP2021015176A (en) * | 2019-07-11 | 2021-02-12 | 日本電気株式会社 | Optical module and manufacturing method for optical module |
-
1990
- 1990-06-25 JP JP16610390A patent/JPH0462885A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012169680A (en) * | 2005-05-20 | 2012-09-06 | Hitachi Chem Co Ltd | Printed wiring board |
| US8664534B2 (en) | 2005-05-20 | 2014-03-04 | Hitachi Chemical Company, Ltd. | Printed wiring board |
| JP2013016232A (en) * | 2011-07-04 | 2013-01-24 | Nhk Spring Co Ltd | Wiring circuit board |
| US10096669B2 (en) | 2013-03-07 | 2018-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP2019082690A (en) * | 2013-03-07 | 2019-05-30 | 株式会社半導体エネルギー研究所 | Electronic apparatus |
| US9543533B2 (en) | 2013-03-07 | 2017-01-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US11950474B2 (en) | 2013-03-07 | 2024-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP2018025807A (en) * | 2013-03-07 | 2018-02-15 | 株式会社半導体エネルギー研究所 | Display device and electronic apparatus |
| WO2014136856A1 (en) * | 2013-03-07 | 2014-09-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| US10263063B2 (en) | 2013-03-07 | 2019-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| CN105474290A (en) * | 2013-03-07 | 2016-04-06 | 株式会社半导体能源研究所 | Display device |
| US11678538B2 (en) | 2013-03-07 | 2023-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US11271070B2 (en) | 2013-03-07 | 2022-03-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US10680055B2 (en) | 2013-03-07 | 2020-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP2017011214A (en) * | 2015-06-25 | 2017-01-12 | 京セラ株式会社 | Flexible wiring board |
| US10580729B2 (en) | 2018-02-13 | 2020-03-03 | Chipbond Technology Corporation | Chip on film package and flexible substrate thereof |
| JP2019140365A (en) * | 2018-02-13 | 2019-08-22 | ▲き▼邦科技股▲分▼有限公司 | Thin film flip chip package and flexible substrate thereof |
| JP2021015176A (en) * | 2019-07-11 | 2021-02-12 | 日本電気株式会社 | Optical module and manufacturing method for optical module |
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