JPH11266077A - Edge face plated printed wiring board and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board with a plated edge face, wherein some of working processes in the manufacturing process of the printed wiring board are omitted for enabling the board to be reduced in manufacturing cost and shortened in a delivery time. SOLUTION: A base 10 comprises a printed wiring board 1, a subboard 2, a connector 8 which is used for connecting the printed board 1 and the waste board 2 together in a manufacturing process, and an elliptical through-hole 3 and cutouts 9 used for foldingly breaking the printed wiring board 1 and the subboard 2. The elliptical through-hole 3 is composed of an ellipse 4, a plating 5 deposited on the inner wall of the ellipse 4, and a land 6 of a solid pattern similar to the ellipse 4 and slightly larger than it. Fine pattern reliefs 7 formed as a pin-hole are provided to the land 6 at positions located near to both the lengthwise edges of the land 6 to be circumscribed with the elliptical through-hole 3. When an etching operation is carried out, plating located at the pattern reliefs is melted to disappear, and the plating 5 is left, being split into two, a waste board side and a printed wiring board side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board with end plating and a method for manufacturing the same, and more particularly, to a method for manufacturing a printed wiring board with end plating.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for printed wiring boards having been subjected to an end face plating process. However, as shown in FIG. Is formed.

[0003] First, a slot 4 corresponding to the shape of the printed wiring board 1 is formed in a base material 10 which is a material for manufacturing the printed wiring board 1 (see FIG. 4A). This long hole 4
Plating is applied to the perforated substrate 10, and plating 5 is adhered to the inner wall of the long hole 4. Thereby, the long hole 4 becomes the long hole through hole 3 [see FIG. 4 (b)].

At this time, the base material 10 is bent along the connecting portion 8 and the notch portion 9 and divided into the printed wiring board 1 and the waste board 2. At this time, since the plating 5 is still in the shape of a ring, if the plating 5 is simply divided into the printed wiring board 1 and the discarded board 2, the plating 5 is completely stripped from the slippery hole and the elongated through hole 3. Therefore, counterbore portions 12 are provided at both ends in the longitudinal direction of the elongated through hole 3 so that the ring-shaped plating 5 is divided into the discard plate 2 side and the printed board 1 side (see FIG. 4C).

In this state, when the base material 10 is bent along the connecting portion 8 and the notch portion 9 and divided into the printed wiring board 1 and the discarded board 2, the printed wiring board 1 having the end face plated is provided.
Remain [see FIG. 4 (d)].

[0006]

In the conventional printed wiring board described above, when plating the end face of the printed wiring board, after forming a long through hole for folding the printed wiring board into a discarded board, the length of the printed wiring board is reduced. In order to divide the ring-shaped plating applied to the inner wall of the through hole, it is necessary to provide counterbores at both ends in the longitudinal direction of the long hole.

[0007] Therefore, there is a problem that the number of working steps increases in the process of manufacturing the printed wiring board having the end face plating, and that the increase in the number of steps causes an increase in cost and a delay in delivery.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, to omit a work process in a manufacturing process of a printed circuit board plated with an end face, to reduce cost and shorten delivery time. It is an object of the present invention to provide a printed wiring board with plated end face and a method for manufacturing the same.

[0009]

SUMMARY OF THE INVENTION A printed wiring board with an end face plating according to the present invention is a printed wiring board with an end face plated with an end face, the through hole for separating the wiring board from a base material. In the vicinity of both ends in the longitudinal direction of the hole, a fine pattern relief is provided so as to be in contact with the long hole through hole, and a ring-shaped ring is formed on the inner wall of the long hole through hole by etching when forming a pattern on the wiring board. Is divided at the pattern escape portion so that the plating can be formed on the end face.

A method of manufacturing a printed wiring board with an end face plating according to the present invention is a method of manufacturing a printed wiring board with an end face plated with an end face, wherein an elongated hole for dividing the wiring board from a base material is formed. Forming, forming the elongated hole through hole by plating the elongated hole, and forming a ring on the inner wall of the elongated hole through hole during an etching process when forming a pattern on the wiring board. Forming a pattern relief for dividing the plating in the vicinity of both ends in the longitudinal direction of the elongated hole through hole so as to be in contact with the elongated hole through hole.

That is, in the printed wiring board of the present invention, in the etching step of forming a pattern on the wiring board, a plating cutting operation for melting only a required portion of the plating applied to the elongated hole is performed at the same time. In order to perform this operation, one or a plurality of pinhole-shaped fine pattern reliefs are provided at positions near both ends of the land of the long hole through hole and circumscribing the long hole.

This makes it possible to omit the plating cutting process in the manufacturing process of the printed wiring board having the end face plating, so that the cost can be reduced and the delivery time can be shortened. . Further, since it is only necessary to provide a small notch in the mask pattern for plating, it is not necessary to create complicated data in the process of creating mask pattern data.

[0013]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a substrate for manufacturing a printed wiring board according to one embodiment of the present invention. FIG.
FIG. 1A is a plan view of a substrate 10, and FIG.
It is an enlarged view of the A section of (a).

A base material 10 according to one embodiment of the present invention includes a printed wiring board 1, a discarded board 2, a connecting portion 8 for connecting the printed board 1 and the discarded board 2 in a manufacturing process, and a printed wiring board. It is configured to include an elongated through hole 3 and a notch 9 for breaking the plate 1 and the discard plate 2.

The elongated through-hole 3 has an elongated hole 4, a ring-shaped plating 5 provided on the inner wall thereof, and a land 6 having a similar solid pattern larger than the elongated hole 4.
It is composed of In the vicinity of both ends in the longitudinal direction in the land 6, pinhole-shaped fine pattern reliefs 7, that is, portions where no pattern is formed, are provided at positions circumscribing the long holes 3.

FIGS. 2A to 2D are views showing the steps of manufacturing the printed wiring board 1 according to one embodiment of the present invention. The manufacturing process of the printed wiring board 1 according to one embodiment of the present invention will be described with reference to FIGS.

First, an elongated hole 4 corresponding to the shape of the printed wiring board 1 is formed in a base material 10 which is a material for manufacturing the printed wiring board 1 (see FIG. 2A). This long hole 4
A plating process is performed on the opened base material 10, and a ring-shaped plating 5 is attached to the inner wall of the elongated hole 4. by this,
The long hole 4 becomes the long hole through hole 3 [see FIG. 2 (b)].

Subsequently, a transparent negative film (not shown) having a required pattern is placed on the entire surface of the copper foil substrate 10 having the long holes 3 formed therein, and the substrate is exposed to light. The copper foil on 10 is exposed.

At this point, the copper foil is divided into an exposed portion and a non-exposed portion, and the exposed portion changes color. Subsequently, the substrate 10 is immersed in an etchant, or the etchant is sprayed on the surface of the substrate 10.

Then, the unexposed portion of the copper foil is not melted by the etchant, and a pattern is formed on the printed wiring board 1. Further, since the plating has a thickness of about 30 μm, a hole slightly larger than a predetermined dimension is usually formed when a through hole is formed, and the plating is made to have a predetermined dimension after plating.

The fine pattern relief 7 having the size of a pinhole provided in the land 6 of the elongated through hole 3 has a thickness corresponding to the thickness of the plating 5 because its outer periphery is circumscribed with the elongated hole 3. Is not exposed.

Therefore, if the etching operation is performed as it is, the etching solution enters the inside of the elongated through hole 3 little by little while dissolving the plating 5, but does not enter an amount that dissolves the entire plating 5.

In this way, the plated portions at both ends (pattern relief 7) of the elongated through hole 3 are melted and lost, and as a result, the plating 5 is separated and left on the discard plate 2 side and the printed wiring board 1 side, respectively. As a result, the state is the same as when the plating cutting operation is performed [see FIG. 2 (c)].

In this state, when the base material 10 is bent along the connecting portion 8 and the notch portion 9 and divided into the printed wiring board 1 and the discarded board 2, the printed wiring board 1 having the end surface plated is provided.
Remain [see FIG. 2 (d)].

FIG. 3 is a plan view showing another example of the printed wiring board 1 according to one embodiment of the present invention. In this figure, in this example, a fine pattern relief 7 is provided at the end of the long hole through hole 3, and a pattern relief 11 is also provided at the linear portion of the long hole through hole 3 to change the shape of the plating 5. is there.

By providing these pattern reliefs 7 and 11, the plating 5 is divided and left on the discard plate 2 side and the printed wiring board 1 side, respectively, and further divided on the printed wiring board 1 side. In this example, the plating 5 is divided into two on the printed wiring board 1 side, but it is also possible to divide the plating into three or more, and the end face plating can be formed as needed.

As described above, in the etching step for forming a pattern on the printed wiring board 1, a plating cutting operation for melting only a required portion of the plating 5 applied to the long hole 4 is performed at the same time. Since the plating process in the manufacturing process of the printed wiring board 1 can be omitted, the cost of the printed wiring board 1 can be reduced and the delivery time can be shortened. Further, since only a small notch needs to be provided in the mask pattern, it is not necessary to create complicated data in the process of creating mask pattern data.

[0028]

As described above, according to the present invention, in a printed wiring board having an end surface plated with an end surface, a fine pattern is formed near an elongated through hole for separating the wiring board from a substrate. Performing the pattern escape, the ring-shaped plating applied to the inner wall of the long hole through hole by the etching process when forming the pattern on the wiring board is divided at the pattern escape portion so that plating can be formed on the end face As a result, an operation process can be omitted in the manufacturing process of the printed circuit board having the end face plating, and the cost and delivery time can be reduced.

[Brief description of the drawings]

1A is a plan view showing a substrate for manufacturing a printed wiring board according to one embodiment of the present invention, and FIG. 1B is an enlarged view of a portion A in FIG.

2 (a) to 2 (d) are views showing a manufacturing process of a printed wiring board according to one embodiment of the present invention.

FIG. 3 is a plan view showing another example of a printed wiring board according to one embodiment of the present invention.

4 (a) to 4 (d) are views showing a process for manufacturing a printed wiring board according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Discard plate 3 Slotted through hole 4 Slotted hole 5 Plating 6 Land 7,11 Pattern escape 8 Connection part 9 Notch part 10 Base material

Claims (6)

[Claims] An end-plated printed wiring board having an end face plated, wherein said printed wiring board is provided with said elongated hole through holes near both longitudinal ends thereof for separating said wiring board from a base material. Applying a fine pattern escape so as to contact, the ring-shaped plating applied to the inner wall of the elongated hole through hole by an etching process at the time of forming a pattern on the wiring board is divided at the portion of the pattern escape to the end face A printed wiring board with end plating, wherein the plating can be formed. 2. The printed wiring board according to claim 1, wherein the pattern escape is formed by masking a fine portion with a mask member for forming the pattern. 3. The pattern relief according to claim 1, wherein the pattern escape is performed so as to divide the ring-shaped plating and divide a plating portion remaining on the wiring board side into a plurality of patterns. Printed wiring board with plated end face. 4. A method of manufacturing a printed wiring board having an end surface plated with an end surface, the method comprising: forming a long hole for dividing a wiring board from a base material; Forming a long hole through-hole by performing the step of forming a pattern on the wiring board; and performing pattern escape for separating a ring-shaped plating applied to an inner wall of the long hole through-hole at the time of etching when forming a pattern on the wiring board. Forming a hole in the vicinity of both ends in the longitudinal direction of the hole through hole so as to be in contact with the long hole through hole. 5. The method according to claim 4, wherein the step of forming the pattern relief is performed by masking a fine portion with a mask member for forming the pattern.
A method for producing a printed wiring board with end face plating according to the above. 6. The method according to claim 4, wherein in the step of forming the pattern relief, a pattern relief for dividing a plated portion remaining on the wiring board side into a plurality of patterns is formed. 6. The method for producing a printed wiring board with end face plating according to 5.