JP2019121770A - Metal base printed wiring board and manufacturing method thereof - Google Patents
Metal base printed wiring board and manufacturing method thereof Download PDFInfo
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- 229910000914 Mn alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- -1 aluminum-manganese Chemical compound 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
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- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
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- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
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Abstract
Description
本発明は、折り曲げ加工可能な金属ベースプリント配線板と折り曲げ済み金属ベースプリント配線板の製造方法に関する。 The present invention relates to a bendable metal-based printed wiring board and a method of manufacturing a bent metal-based printed wiring board.
従来、金属板の一方の面に可撓性絶縁層と配線パターンとを順次積層した金属ベースプリント配線板の両端を直角に折り曲げ、図８に示すような断面コの字状構造体を形成する例が報告されている（特許文献１）。
金属ベースプリント配線板を折り曲げる（特に９０度の折り曲げ）必要性として、近年益々進む、電子機器製品の小型化への対応が挙げられる。
即ち、従来では、製品内への設置自由度の高いフレキシブルプリント配線板やリジッドフレックス多層プリント配線板を利用することで、プリント配線板の組み込みスペースの狭小化に対応していたが、フレキシブルプリント配線板やリジッドフレックス多層プリント配線板のフレキシブル部を直角方向に折り曲げたとしても、多少なりとも撓み部分が発生してしまい、その分、設置スペースを大きくする必要があったため、電子機器製品の更なる小型化に対応できないケースが出てきたからである（フレキシブルプリント配線板やリジッドフレックス多層プリント配線板を、金属ベースプリント配線板を折り曲げたものに置き換えることで、余分な設置スペースが不要になり、電子機器製品の更なる小型化に対応することができる）。
Conventionally, both ends of a metal base printed wiring board in which a flexible insulating layer and a wiring pattern are sequentially stacked on one surface of a metal plate are bent at right angles to form a U-shaped structure having a U-shaped cross section as shown in FIG. An example has been reported (US Pat.
As the necessity of bending a metal base printed wiring board (in particular, bending at 90 degrees), there is an increase in the size of electronic device products, which is increasing in recent years.
That is, in the past, flexible printed wiring boards and rigid flex multilayer printed wiring boards, which have a high degree of freedom in installation in products, were used to cope with the narrowing of the embedded space of printed wiring boards, but flexible printed wiring Even if the flexible part of the board or rigid flex multilayer printed wiring board is bent in the perpendicular direction, a bent part is generated at all, and it is necessary to increase the installation space by that amount. This is because there are cases where miniaturization can not be coped with (by replacing the flexible printed wiring board or rigid flex multilayer printed wiring board with a bent metal base printed wiring board, an extra installation space becomes unnecessary, and the electronic It can respond to further miniaturization of equipment products).
特許文献１の金属ベースプリント配線板では、アルミニウム−マンガン合金基板１１を折り曲げることで、金属ベースプリント配線板の折り曲げ形状を保持するようにしているが、実際に、図８のような９０度の折り曲げ加工を行った場合、折り曲げ部４に位置する配線パターン３が断線するケースが見られた。 In the metal-based printed wiring board of Patent Document 1, the bent shape of the metal-based printed wiring board is maintained by bending the aluminum-manganese alloy substrate 11, but in fact, it is 90 degrees as shown in FIG. When the bending process was performed, the case where the wiring pattern 3 located in the bending part 4 disconnected was seen.
本発明は、上記の如き従来の問題に鑑みてなされたものであり、金属ベースプリント配線板を折り曲げた際にその折り曲げ部に位置する配線パターンの導通信頼性を維持できる金属ベースプリント配線板と、このような配線パターンの導通信頼性に優れた折り曲げ済み金属ベースプリント配線板が容易に得られる製造方法を提供することを課題としている。 The present invention has been made in view of the conventional problems as described above, and when the metal base printed wiring board is bent, the metal base printed wiring board capable of maintaining the conduction reliability of the wiring pattern located in the bent portion An object of the present invention is to provide a manufacturing method by which a bent metal-based printed wiring board excellent in conduction reliability of such a wiring pattern can be easily obtained.
本発明者は、上記の課題を解決すべく種々研究を重ねた結果、金属ベースプリント配線板の折り曲げ部における金属板部分に、当該折り曲げ部において配線パターンと交差する貫通穴を形設すれば極めて良い結果が得られることを見い出し、本発明を完成した。 As a result of repeating various researches to solve the above-mentioned problems, the inventor of the present invention can form a through hole which intersects the wiring pattern in the bent portion in the metal plate portion of the bent portion of the metal base printed wiring board. Having found that good results can be obtained, the present invention has been completed.
すなわち、本発明は、金属板の一方の面に、可撓性絶縁層を介して配線パターンが形成されている金属ベースプリント配線板であって、当該金属ベースプリント配線板の折り曲げ部における金属板部に、当該折り曲げ部において配線パターンと交差する貫通穴が１つ以上形設されていることを特徴とする金属ベースプリント配線板により上記課題を解決したものである。
また、本発明は、少なくとも、金属板の一方の面に、可撓性絶縁層を介して配線パターンを形成する工程と、金属ベースプリント配線板の折り曲げ部における金属板部に、当該折り曲げ部において配線パターンと交差する貫通穴を１つ以上形設する工程と、金属ベースプリント配線板を当該折り曲げ部で折り曲げる工程と、を有することを特徴とする折り曲げ済み金属ベースプリント配線板の製造方法により上記課題を解決したものである。
That is, the present invention is a metal base printed wiring board in which a wiring pattern is formed on one side of a metal plate via a flexible insulating layer, and the metal plate in the bent portion of the metal base printed wiring board The above problem is solved by the metal base printed wiring board characterized in that at least one through hole intersecting with the wiring pattern is formed at the bent portion in the portion.
Further, according to the present invention, at least in the step of forming a wiring pattern on one surface of a metal plate via a flexible insulating layer, and in the metal plate portion in the bent portion of the metal base printed wiring board, A method of manufacturing a bent metal-based printed wiring board according to the above-mentioned method comprising the steps of: forming one or more through holes intersecting the wiring pattern; and bending the metal-based printed wiring board at the bending portion. It solves the problem.
本発明によれば、金属ベースプリント配線板の折り曲げ部において金属板部分に配線パターンと交差する貫通穴が存在するため、金属ベースプリント配線板を折り曲げた際にその折り曲げ部に位置する配線パターンの断線を防止することができ、配線パターンの導通信頼性に優れた折り曲げ済み金属ベースプリント配線板を得ることができる。 According to the present invention, a through hole which intersects the wiring pattern is present in the metal plate portion in the bent portion of the metal base printed wiring board, so when the metal base printed wiring board is bent, the wiring pattern located in the bent portion It is possible to prevent disconnection and to obtain a bent metal-based printed wiring board excellent in the conduction reliability of the wiring pattern.
以下本発明金属ベースプリント配線板の実施の形態を、図１を用いて説明する。
図１において、ｐｗは金属ベースプリント配線板で、金属板１と、当該金属板１の一方の面に積層された可撓性絶縁層２と、当該可撓性絶縁層２の外層側に形成された配線パターン３と、当該配線パターン３を保護するためのカバーレイ７（図１（ａ）において図示省略）と、当該金属ベースプリント配線板ｐｗの折り曲げ部４における金属板部に形設された、当該折り曲げ部４において当該配線パターン３と交差する長方形状の貫通穴５とから構成されている。
図１（ｂ）に示したように、金属板１に形設された貫通穴５は、折り曲げ部４において金属板１の外側面から可撓性絶縁層２に到達する穴である。金属ベースプリント配線板ｐｗを折り曲げ部４で折り曲げる際、当該折り曲げ部４における金属板部に当該貫通穴５が形設されていると、当該折り曲げ部４に位置する配線パターン３が断線するのを防止することができる。
当該貫通穴５は、当該折り曲げ部４に位置する配線パターン３の断線を防止する上で、折り曲げ部４を中心として左右対称になるように形設することが望ましい。
当該貫通穴５の短手巾としては、「金属板の厚さ１００％〜３００％の範囲」とするのが好ましい。その理由は、金属板の厚さ未満であると、９０度に近い形状での折り曲げ加工が困難になるという問題があり、また、３００％よりも大きくなると、曲げ強度が低下し、折り曲げ形状を保持できなくなる問題が出てくるからである。
なお、この実施の形態では、６本形設された配線パターン３のうち、２ヶ所の折り曲げ部においてそれぞれ３本ずつと交差する長方形状の貫通穴５が計４個形設されているが、その個数は特に限定されず、また、貫通穴５の形状自体は、長方形状に限らず、正方形状、円形状、楕円形状等任意に選択することができる。
Hereinafter, an embodiment of the metal-based printed wiring board of the present invention will be described with reference to FIG.
In FIG. 1, pw is a metal base printed wiring board, and is formed on the metal plate 1, the flexible insulating layer 2 laminated on one surface of the metal plate 1, and the outer layer side of the flexible insulating layer 2 The wiring pattern 3 is formed, a cover lay 7 (not shown in FIG. 1A) for protecting the wiring pattern 3 and a metal plate portion in the bent portion 4 of the metal base printed wiring board pw In addition, it is configured of a rectangular through hole 5 which intersects the wiring pattern 3 in the bent portion 4.
As shown in FIG. 1B, the through hole 5 formed in the metal plate 1 is a hole that reaches the flexible insulating layer 2 from the outer surface of the metal plate 1 at the bent portion 4. When the metal base printed wiring board pw is bent at the bending portion 4 and the through hole 5 is formed in the metal plate portion at the bending portion 4, the wiring pattern 3 located at the bending portion 4 is broken. It can be prevented.
The through holes 5 are desirably shaped so as to be symmetrical about the bent portion 4 in order to prevent disconnection of the wiring pattern 3 located in the bent portion 4.
The width of the through hole 5 is preferably in the range of 100% to 300% of the thickness of the metal plate. The reason is that if it is less than the thickness of the metal plate, there is a problem that bending at a shape close to 90 degrees becomes difficult, and if it is more than 300%, bending strength decreases and bending shape It is because the problem which can not be held comes out.
In this embodiment, a total of four rectangular through holes 5 are provided, each of which intersects three each in two bent portions among the six wiring patterns 3. The number thereof is not particularly limited, and the shape itself of the through hole 5 is not limited to a rectangular shape, and can be selected arbitrarily, such as a square shape, a circular shape, or an elliptical shape.
また、当該金属ベースプリント配線板ｐｗでは、図２に示したように、当該貫通穴５が存在しない折り曲げ部４における金属板部に溝６が形設されていることが、金属板の折り曲げ加工精度を向上でき、当該折り曲げ部４に位置する配線パターン３の断線をより確実に防止する上で望ましい。
図２（ｂ）に示したように、金属板１に形設された溝６は、折り曲げ部４において金属板１の外側面から可撓性絶縁層２に到達しない溝である。
当該溝６の形状は、図２（ｂ）に示したような断面円弧状に限らず、断面Ｖ字状であってもよい。
因みに、当該溝６は、図２（ａ）に示したように、必ずしも貫通穴５と繋げる必要はなく、折り曲げ部４の位置で、複数個所に分割して設けるようにすれば、折り曲げ加工精度と折り曲げ部の曲げ強度（折り曲げ形状を保持する強度）のいずれも向上させることができる（図２（ｃ）参照）。
また、当該溝６の短手巾としては、折り曲げ位置を安定、即ち、折り曲げ加工精度を向上させる上で、「金属板の厚さ１００％〜３００％の範囲」とするのが好ましく、さらに、その深さとしては、「金属板の厚さに対して３０％〜８０％の深さ」とするのが好ましい。その理由は、深さが金属板の厚さの３０％未満であると、折り曲げ加工精度が低下する問題があり、８０％よりも大きくなると、折り曲げ強度が低下し、金属板が割れてしまう懸念があるからである。
Further, in the metal base printed wiring board pw, as shown in FIG. 2, the groove 6 is formed in the metal plate portion at the bent portion 4 where the through hole 5 does not exist, and the metal plate is bent It is desirable to improve the accuracy and to more reliably prevent the disconnection of the wiring pattern 3 located in the bent portion 4.
As shown in FIG. 2 (b), the groove 6 formed in the metal plate 1 is a groove which does not reach the flexible insulating layer 2 from the outer surface of the metal plate 1 at the bent portion 4.
The shape of the groove 6 is not limited to an arc shape in cross section as shown in FIG. 2B, but may be a V shape in cross section.
Incidentally, as shown in FIG. 2 (a), the groove 6 does not necessarily have to be connected to the through hole 5. If the groove 6 is provided separately at a plurality of positions at the position of the bending portion 4, bending accuracy Both the bending strength of the bent portion (strength to hold the bent shape) can be improved (see FIG. 2C).
Moreover, as the width of the groove 6, the bending position is preferably stabilized, that is, in order to improve bending accuracy, it is preferable to set "the thickness of the metal plate in the range of 100% to 300%", and further The depth is preferably “a depth of 30% to 80% with respect to the thickness of the metal plate”. The reason is that if the depth is less than 30% of the thickness of the metal plate, there is a problem that the bending accuracy decreases, and if it exceeds 80%, the bending strength decreases and the metal plate may be broken. Because there is
続いて、上記本発明の金属ベースプリント配線板ｐｗの製造方法、並びに当該金属ベースプリント配線板ｐｗを折り曲げ加工した折り曲げ済み金属ベースプリント配線板ＰＷの製造方法を図４〜図７を用いて説明する。尚、折り曲げ済み金属ベースプリント配線板ＰＷは、個片の金属ベースプリント配線板ｐｗが複数面付けされたシート状の多面付け基板から折り曲げ加工後、最終工程で連結部をカットすることによって得られるが、説明の便宜上、折り曲げ加工工程までは、個片の金属ベースプリント配線板として説明を進めていく。 Subsequently, a method of manufacturing the metal base printed wiring board pw of the present invention and a method of manufacturing a bent metal base printed wiring board PW obtained by bending the metal base printed wiring board pw will be described with reference to FIGS. Do. The bent metal-based printed wiring board PW can be obtained by cutting the connecting portion in the final step after bending from the sheet-like multi-faced substrate on which a plurality of individual metal base printed wiring boards pw are attached. However, for convenience of explanation, the description will proceed as the individual metal base printed wiring board up to the bending process.
まず、図４（ａ）に示したように、金属板１の一方の面に可撓性絶縁層２と金属箔３ａを順次積層する。
金属板１としては、厚みが薄くても折り曲げ形状を保持できる材料であれば特に限定されず、例えば、ビッカース硬度が５０〜２００ＨＶの範囲に入る青銅や黄銅、アルミ合金、ステンレス等が好ましく利用できる。金属板の厚みは、例えば０．０２５〜０．２ｍｍであり、製品内に収める際の薄さと強度を考慮すると、０．１００〜０．１５ｍｍのものを用いるのが好ましい。
金属箔３ａとしては、一般的な銅箔が、導電性や加工性、コスト的な面で好ましく利用できる。その厚みは、例えば９〜１２μｍである。
また、可撓性絶縁層２としては、プリント配線板で広く使用されている「ポリイミド、放熱ＴＩＭシート、ＬＣＰ、ＰＴＦＥなどのフィルム材料」、「ガラスエポキシ材料」、「ポリイミドなどの電着コート」などが利用でき、その厚みは、例えば０．０１〜０．１０ｍｍである。
First, as shown in FIG. 4A, the flexible insulating layer 2 and the metal foil 3a are sequentially laminated on one surface of the metal plate 1.
The metal plate 1 is not particularly limited as long as it is a material capable of holding a bent shape even if the thickness is thin, and, for example, bronze, brass, aluminum alloy, stainless steel, etc. having Vickers hardness in the range of 50 to 200 HV . The thickness of the metal plate is, for example, 0.025 to 0.2 mm, and in view of thinness and strength when contained in a product, it is preferable to use one having a thickness of 0.100 to 0.15 mm.
A common copper foil can be preferably used as the metal foil 3a in terms of conductivity, processability, and cost. Its thickness is, for example, 9 to 12 μm.
Moreover, as the flexible insulating layer 2, "film materials such as polyimide, heat dissipation TIM sheet, LCP, PTFE, etc." widely used in printed wiring boards, "glass epoxy materials", "electrodeposited coats such as polyimide" And the like, and the thickness thereof is, for example, 0.01 to 0.10 mm.
金属板１の一方の面に可撓性絶縁層２を積層するにあたっては、金属板１の一方の面に、図示しない接着層を介して積層するようにし、また、可撓性絶縁層２の外層側への金属箔３ａの積層に関しては、予め両者が一体化されたものを金属板１上に積層するのが、製造工程を簡略化する上で望ましい。 In laminating the flexible insulating layer 2 on one side of the metal plate 1, the flexible insulating layer 2 is laminated on one side of the metal plate 1 via an adhesive layer (not shown). With regard to the lamination of the metal foil 3a to the outer layer side, it is desirable to laminate on the metal plate 1 one in which both are integrated in advance, in order to simplify the manufacturing process.
次に、金属箔３ａに、周知のフォトエッチングプロセス（金属箔上に感光性のエッチングレジスト膜をラミネートした後、露光用のマスクフィルムを介して露光処理を行い、次いで、現像処理（例えば、炭酸ナトリウム溶液による現像処理）を行うことによって、配線パターンとして残したい部分の金属箔上にエッチングレジストパターンを形成した後、当該エッチングレジストパターンから露出している金属箔をエッチング処理（例えば、塩化第二鉄溶液や塩化第二銅溶液等を用いたエッチング処理）及びレジスト剥離処理（例えば、苛性ソーダによる剥離処理）を順次行うことによって、所望の配線パターンを形成するという配線パターンの形成方法）を施すことによって、図４（ｂ）及び（ｃ）に示したように、配線パターン３を形成する。
ここで、折り曲げ部４に位置する複数の配線パターン３は、図４（ｄ）に示したように、その間隔を可能な限り近づけて他領域より密とするのが、後に、金属板１に形設する貫通穴５の総面積を小さくし、もって、金属ベースプリント配線板の剛性低下を軽減する上で望ましい（図１（ａ）、図３参照）。
Next, a well-known photo-etching process (laminate a photosensitive etching resist film on metal foil to metal foil 3a, and then perform exposure processing through a mask film for exposure, and then development processing (for example, carbon dioxide) An etching resist pattern is formed on the metal foil of a portion desired to be left as a wiring pattern by performing development processing with a sodium solution, and then the metal foil exposed from the etching resist pattern is etched (for example, the second chloride) A method of forming a wiring pattern in which a desired wiring pattern is formed by sequentially performing an etching process using an iron solution, a cupric chloride solution or the like and a resist peeling process (for example, peeling process with caustic soda) Form the wiring pattern 3 as shown in FIGS. 4 (b) and 4 (c). That.
Here, as shown in FIG. 4 (d), the plurality of wiring patterns 3 located in the bent portion 4 should be made as close as possible to each other to make the gaps as dense as possible in the metal plate 1 later. It is desirable to reduce the total area of the through holes 5 to be formed and to reduce the reduction in the rigidity of the metal base printed wiring board (see FIG. 1 (a) and FIG. 3).
続いて、図５（ｅ）及び（ｆ）に示したように、配線パターン３が形成された基板上に感光性のカバーレイフィルムを積層した後、露光・現像処理を行うことによって、一部の配線パターン３を露出する開口部８を形成し、次いで、ベーキング処理を行うことによって、カバーレイ７を硬化させた後、無電解ニッケル−金めっき処理を行うことによって、露出している配線パターン３上に図示しない金めっき膜を形成する。 Subsequently, as shown in FIGS. 5 (e) and 5 (f), a photosensitive cover lay film is laminated on the substrate on which the wiring pattern 3 is formed, and then exposure / development processing is performed to partially produce the same. Then, after forming the opening 8 for exposing the wiring pattern 3 of the above, and curing the coverlay 7 by performing the baking process, the exposed wiring pattern is performed by performing the electroless nickel-gold plating process. A gold plating film not shown is formed on 3.
続いて、図６（ｇ）及び（ｈ）に示したように、金属板１の金属ベースプリント配線板ｐｗの両端を折り曲げる際の折り曲げ部４における金属板部に、当該折り曲げ部４において配線パターン３と交差する貫通穴５と、当該貫通穴５が存在しない折り曲げ部４における金属板部に溝６を形成することによって、金属ベースプリント配線板ｐｗを得る。
金属板１における当該貫通穴５と溝６の形成は、いずれも上記で説明したフォトエッチングプロセスにより行うことができるが、溝６に関しては、フォトエッチングプロセスの他に、レーザ加工やＶカット加工でも行うことができる。
因みに、当該溝６をＶカット加工で形成した場合には、フォトエッチングプロセスやレーザ加工で形成した場合のように、断面円弧状にはならず（図２（ｂ）参照）、図６（ｉ）に示したような断面Ｖ字状となるため、折り曲げた際に隙間が発生せずに精度良く折り曲げ加工ができるが、フォトエッチングプロセスと比較して加工コストがかかる、図２（ａ）のように、折り曲げ部に連続的に設ける必要があるなどの制約があるため、用途に応じて選択すればよい。
Subsequently, as shown in FIGS. 6 (g) and 6 (h), in the metal plate portion in the bending portion 4 when bending both ends of the metal base printed wiring board pw of the metal plate 1, the wiring pattern in the bending portion 4 The metal base printed wiring board pw is obtained by forming the grooves 6 in the through holes 5 intersecting with 3 and the metal plate portions in the bent portions 4 where the through holes 5 do not exist.
Although the formation of the through holes 5 and the grooves 6 in the metal plate 1 can be performed by the photoetching process described above, the grooves 6 may be formed by laser processing or V-cut processing in addition to the photoetching process. It can be carried out.
Incidentally, when the groove 6 is formed by V-cut processing, it does not have an arc shape in cross section as in the case of forming it by a photo-etching process or laser processing (see FIG. 2B); Since the cross section is V-shaped as shown in Fig. 2B, it can be bent with high precision without any gaps when bent, but the processing cost is higher compared to the photo etching process, as shown in FIG. As described above, since there is a restriction that it is necessary to continuously provide the bent portion, it may be selected according to the application.
次に、金属ベースプリント配線板ｐｗの折り曲げ加工を行った後、連結部をカットする。
折り曲げ加工では、図７（ｊ）に示したように、まず、個片の金属ベースプリント配線板ｐｗの外形線に沿ったスリット９を設ける。続いて、折り曲げ部４で、例えば７０度程度折り曲げた後、更に９０度の折り曲げ加工を行う（図７（ｋ）参照）。
最後に連結部１０をカットすることによって、図７（ｌ）に示したように、両端が折り曲げ部４において折り曲げられた、折り曲げ済みの個片の金属ベースプリント配線板ＰＷを得る。
Next, after bending the metal base printed wiring board pw, the connection portion is cut.
In the bending process, as shown in FIG. 7 (j), first, slits 9 are provided along the outline of the individual metal base printed wiring board pw. Then, after bending about 70 degrees, for example by the bending part 4, the bending process of 90 degrees is further performed (refer FIG. 7 (k)).
Finally, by cutting the connecting portion 10, as shown in FIG. 7 (l), a bent individual piece of metal base printed wiring board PW is obtained in which both ends are bent at the bending portion 4.
本発明折り曲げ済み金属ベースプリント配線板ＰＷは、剛性が高く、薄型化が可能で、また、配線パターンの導通信頼性に優れるため、これ自体が、例えばカメラモジュールの筐体として利用することも可能である。 The bent metal-based printed wiring board PW of the present invention has high rigidity and can be thinned, and since it is excellent in the conduction reliability of the wiring pattern, it can also be used as a housing of a camera module, for example. It is.
なお、本発明を説明するに当たって、金属板１の一方の面に可撓性絶縁層２を介して配線パターン３が形成された単層金属ベースプリント配線板の形態を用いて説明してきたが、可撓性絶縁層２と配線パターン３を交互に複数積層する多層構造にも、本発明は利用可能である。
また、図９（ａ）に示したように、金属板１の表裏に可撓性絶縁層２と配線パターン３を順次形成し、表裏面から貫通穴５を設けるようにすれば、図９（ｂ）に示したような、クランク状に折り曲げた金属ベースプリント配線板ＰＷも得ることができる。
ただし、この構成とする場合には、折り曲げ部に設ける溝６の構成を図２（ｃ）のようにして（即ち、貫通穴５と溝６との間にスペースを設ける）、配線パターン３を通せるようにする必要がある。
In the description of the present invention, the embodiment has been described using the form of a single-layer metal-based printed wiring board in which the wiring pattern 3 is formed on one surface of the metal plate 1 via the flexible insulating layer 2. The present invention is also applicable to a multilayer structure in which a plurality of flexible insulating layers 2 and wiring patterns 3 are alternately stacked.
Further, as shown in FIG. 9A, if the flexible insulating layer 2 and the wiring pattern 3 are sequentially formed on the front and back of the metal plate 1 and the through holes 5 are provided from the front and back, FIG. A crank-shaped metal base printed wiring board PW as shown in b) can also be obtained.
However, in the case of this configuration, the configuration of the groove 6 provided in the bent portion is as shown in FIG. 2C (that is, a space is provided between the through hole 5 and the groove 6). You need to be able to go through it.
１：金属板
２：可撓性絶縁層
３：配線パターン
３ａ：金属箔
４：折り曲げ部
５：貫通穴
６：溝
７：カバーレイ
８：開口部
９：スリット
１０：連結部
１１：アルミニウム−マンガン合金基板
ｐｗ：金属ベースプリント配線板
ＰＷ：折り曲げ済み金属ベースプリント配線板
1: Metal plate 2: flexible insulating layer 3: wiring pattern 3a: metal foil 4: bent portion 5: through hole 6: groove 7: cover layer 8: opening 9: slit 10: connecting portion 11: aluminum-manganese Alloy substrate pw: Metal base printed wiring board PW: Bent metal base printed wiring board
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018002795A JP7017416B2 (en) | 2018-01-11 | 2018-01-11 | Metal base printed wiring board and its manufacturing method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS648693A (en) * | 1987-06-30 | 1989-01-12 | Furukawa Electric Co Ltd | Printed circuit board and manufacture thereof |
| JPH02260598A (en) * | 1989-03-31 | 1990-10-23 | Nec Corp | Manufacture of three-dimensional wiring board |
| JP2010258451A (en) * | 2009-04-22 | 2010-11-11 | Automotive Lighting Reutlingen Gmbh | Printed circuit board |
| JP2011129754A (en) * | 2009-12-18 | 2011-06-30 | Sanyo Electric Co Ltd | Circuit device, and method of manufacturing the same |
-
2018
- 2018-01-11 JP JP2018002795A patent/JP7017416B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS648693A (en) * | 1987-06-30 | 1989-01-12 | Furukawa Electric Co Ltd | Printed circuit board and manufacture thereof |
| JPH02260598A (en) * | 1989-03-31 | 1990-10-23 | Nec Corp | Manufacture of three-dimensional wiring board |
| JP2010258451A (en) * | 2009-04-22 | 2010-11-11 | Automotive Lighting Reutlingen Gmbh | Printed circuit board |
| JP2011129754A (en) * | 2009-12-18 | 2011-06-30 | Sanyo Electric Co Ltd | Circuit device, and method of manufacturing the same |
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| JP7017416B2 (en) | 2022-02-08 |
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