CN108882569B - PCB manufacturing method and PCB - Google Patents
PCB manufacturing method and PCB Download PDFInfo
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- CN108882569B CN108882569B CN201811011373.3A CN201811011373A CN108882569B CN 108882569 B CN108882569 B CN 108882569B CN 201811011373 A CN201811011373 A CN 201811011373A CN 108882569 B CN108882569 B CN 108882569B
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- conductive bonding
- bonding sheet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a PCB manufacturing method and a PCB, and relates to the technical field of printed circuit boards. The manufacturing method comprises the following steps: providing at least one semi-cured substrate, and forming a conductive through hole on the at least one semi-cured substrate; adhering a first conductive bonding sheet to each semi-solidified substrate; providing a second conductive bonding sheet; and respectively cutting the first conductive bonding sheet and the second conductive bonding sheet to obtain the circuit patterns of each layer. According to the invention, the circuit pattern is manufactured by cutting the conductive bonding sheet, all the processes are dry processes, the processes are short, and the used materials are few, so that the influence factors influencing the circuit yield are reduced, and the method is environment-friendly; meanwhile, the conductive bonding sheet plays a role of combining the copper layer and the prepregs, and the thickness of each layer of prepreg can be reduced by the finished PCB under the condition that the thickness of the board needs to be controlled.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a PCB manufacturing method and a PCB.
Background
The conventional circuit pattern manufacturing of the PCB comprises the steps of manufacturing a photosensitive coating layer on a copper-clad plate, exposing, developing, etching and the like, the process flow is long, the influence factors of the circuit yield are more, various materials such as films, photosensitive films and liquid medicines need to be used, the process flow comprises a plurality of wet processes, the pollution to the environment is large, and the cost of drying the plate, treating waste water and the like is increased.
Moreover, the copper-clad plates are bonded through prepregs, and if a PCB with a smaller plate thickness needs to be manufactured, the conventional structure is difficult to meet the requirement.
Disclosure of Invention
The invention aims to provide a PCB manufacturing method and a PCB, wherein the manufacturing process is a dry process, the used materials are less, the process is short, and the thickness of the PCB can be reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a method for manufacturing a PCB, including:
providing at least one semi-cured substrate, and forming a conductive through hole on the at least one semi-cured substrate;
adhering a first conductive bonding sheet to each semi-solidified substrate;
providing a second conductive bonding sheet;
and respectively cutting the first conductive bonding sheet and the second conductive bonding sheet to obtain the circuit patterns of each layer.
Wherein providing a second conductive bonding sheet comprises:
the second conductive adhesive sheet is adhered to the lining paper.
Correspondingly, after the first conductive bonding sheet and the second conductive bonding sheet are respectively cut to obtain the circuit patterns of each layer, the method further comprises the following steps:
laminating the semi-cured substrate adhered with the first conductive bonding sheet and the second conductive bonding sheet in sequence and pressing to obtain a laminated board;
the liner paper is torn off.
Alternatively, providing a second conductive adhesive sheet comprises:
and (3) taking a semi-cured substrate of the PCB bottom layer, and adhering the second conductive adhesive sheet to one surface which is not adhered with the first conductive adhesive sheet.
Correspondingly, after the first conductive bonding sheet and the second conductive bonding sheet are respectively cut to obtain the circuit patterns of each layer, the method further comprises the following steps:
and laminating the semi-cured substrate stuck with the first conductive bonding sheet and the semi-cured substrate at the bottom layer in sequence, and laminating to obtain the laminated board.
Further, selecting a semi-solidified substrate with a corresponding thickness according to the thickness requirement of each layer of medium.
Further, according to the thickness requirement of each layer of circuit pattern, selecting the first conductive bonding sheet and the second conductive bonding sheet with corresponding thicknesses.
Further, after obtaining the laminated board, the method further comprises the following steps:
and the laminated board is provided with a non-conductive hole.
Wherein cutting the first conductive bonding sheet and the second conductive bonding sheet, respectively, to obtain a line pattern of each layer includes:
respectively cutting the first conductive bonding sheet and the second conductive bonding sheet by using laser equipment according to the circuit patterns of each layer;
removing the non-circuit pattern portions of the first conductive bonding sheet and the second conductive bonding sheet;
and reserving the first conductive bonding sheet and the second conductive bonding sheet which are covered at two ends of the conductive through hole.
Further, cutting the first conductive bonding sheet and the second conductive bonding sheet to obtain the circuit patterns of the respective layers, further includes:
and setting the cutting compensation value so that the line width of each layer of the obtained line pattern is smaller than the design value.
On the other hand, the invention provides a PCB which is manufactured by the manufacturing method and comprises the following steps: a semi-cured substrate and a conductive bonding sheet;
the outermost layer of the PCB is the conductive bonding sheet, and the semi-solidified substrate is arranged between two adjacent layers of the conductive bonding sheets;
at least one semi-solidified substrate is provided with a conductive through hole, and the conductive bonding sheet is cut into circuit patterns of each layer;
and the conductive through hole is filled with conductive adhesive which is melted by the conductive bonding sheet flowing in when pressing.
The invention has the beneficial effects that:
according to the invention, the circuit pattern is manufactured by cutting the conductive bonding sheet, all the processes are dry processes, the processes are short, and the used materials are few, so that the influence factors influencing the circuit yield are reduced, and the method is environment-friendly; meanwhile, the conductive bonding sheet plays a role of combining the copper layer and the prepregs, and the thickness of each layer of prepreg can be reduced by the finished PCB under the condition that the thickness of the board needs to be controlled.
Drawings
FIG. 1 is a flow chart of a method for fabricating a PCB according to one embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating steps of a method for fabricating a PCB according to a first embodiment of the present invention;
FIG. 3 is a cross-sectional view of a PCB in a second embodiment of the invention.
In the figure: 1. a semi-cured substrate; 2. a conductive via; 3. a first conductive adhesive sheet; 4. a second conductive adhesive sheet; 5. lining paper; 6. a conductive adhesive sheet.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
Example one
The present embodiment provides a method for manufacturing a PCB, which can manufacture a PCB having a small thickness by a dry process.
Fig. 1 is a flowchart of a method for manufacturing a PCB in the present embodiment. As shown in fig. 1, the manufacturing method includes the following steps:
and S11, providing at least one semi-solidified substrate, and forming a conductive through hole on the at least one semi-solidified substrate.
And selecting the semi-solidified substrate with the corresponding thickness according to the thickness requirement of each layer of medium. Copper layers are not arranged on two sides of the semi-solidified substrate, the main component of the semi-solidified substrate is B-stage resin, the semi-solidified substrate has certain fluidity under special conditions, and the semi-solidified substrate is arranged between two adjacent layers of circuit patterns. And selecting a corresponding number of semi-solidified substrates according to the number of layers of the circuit pattern designed by the PCB.
Fig. 2 is a schematic step diagram of a method for manufacturing a PCB in the present embodiment. As shown in fig. 2, according to the conduction requirement between the circuit patterns of each layer, a conductive through hole 2 is formed on one or more semi-cured substrates 1 between two layers of circuit patterns which are mutually conducted.
And S12, adhering a first conductive bonding sheet to each semi-solidified substrate.
The conductive bonding sheet has conductivity and bonding capability, has low fluidity, and is used for manufacturing circuit patterns. For the PCB with N layers of circuit patterns, the circuit patterns of the 1 st to the N-1 st layers are all made of first conductive bonding sheets, the first conductive bonding sheets 3 with corresponding thicknesses are selected according to the thickness requirements of the circuit patterns of all layers, and the first conductive bonding sheets 3 are slightly bonded on the corresponding semi-solidified substrates 1.
S13, providing a second conductive bonding sheet.
As the above step S12, the second conductive bonding sheet 4 is used to make the circuit pattern of the nth layer, and the second conductive bonding sheet 4 with the corresponding thickness is selected according to the thickness requirement of the circuit pattern. The second conductive adhesive sheet 4 is stuck on the mount paper 5. The lining paper 5 can be kraft paper or release paper.
And S14, cutting the first conductive bonding sheet and the second conductive bonding sheet respectively to obtain the circuit patterns of the layers.
According to the circuit pattern design of each layer, respectively cutting the first conductive bonding sheet 3 and the second conductive bonding sheet 4 by adopting laser cutting equipment; it should be noted that the parameters of the laser cutting device are adjusted so that the conductive bonding sheet can be cut without damaging the underlying prepreg or backing paper.
After cutting, removing the non-circuit pattern portions of the first conductive bonding sheet 3 and the second conductive bonding sheet 4; but it is necessary to leave the first conductive adhesive sheet 3 and the second conductive adhesive sheet 4 covered at both ends of the conductive through-hole 2.
Further, a cut compensation value is set so that the line width of each layer of the obtained line pattern is smaller than a design value. Since the low fluidity of the conductive adhesive sheet during lamination makes the line width obtained after lamination slightly larger than the line width during cutting, in order to ensure that the line width after lamination is equivalent to the design value, the line width should be properly reduced during cutting.
And S15, sequentially laminating the semi-solidified substrate adhered with the first conductive bonding sheet and the second conductive bonding sheet and laminating to obtain the laminated board.
During pressing, parameters such as temperature, pressure and the like are adjusted to respectively cure the conductive bonding sheet and the semi-cured substrate. Preferably, the parameters during pressing are adjusted, so that the first conductive bonding sheet 3 and the second conductive bonding sheet 4 are melted and filled in the conductive through hole 2 and are solidified, and then the semi-solidified substrate 1 is melted and filled in the non-circuit pattern part and is solidified.
After obtaining the laminated board, the method further comprises the following steps: and tearing off the lining paper 5, and forming non-conductive holes in the laminated plate.
In other embodiments, in step S13, the second conductive bonding sheet is used to make the circuit pattern of the nth layer, and the second conductive bonding sheet is attached to the side of the semi-cured substrate of the PCB bottom layer to which the first conductive bonding sheet is not attached.
Correspondingly, the semi-cured substrate pasted with the first conductive bonding sheet and the semi-cured substrate at the bottom layer are overlapped in sequence, and the laminated plate is obtained through pressing.
In the embodiment, the circuit pattern is manufactured by cutting the conductive bonding sheet, all the processes are dry processes, the processes are short, and the used materials are few, so that the influence factors influencing the yield of the circuit are reduced, and the method is environment-friendly; meanwhile, the conductive bonding sheet plays a role of combining the copper layer and the prepregs, and the thickness of each layer of prepreg can be reduced by the finished PCB under the condition that the thickness of the board needs to be controlled.
Example two
The embodiment provides a PCB manufactured by the manufacturing method of the embodiment, and is used for solving the same technical problems and achieving the same technical effects.
Fig. 3 is a sectional view of the PCB in the present embodiment. As shown in fig. 3, the PCB includes: a semi-cured substrate 1 and a conductive bonding sheet 6;
the outermost layer of the PCB is the conductive bonding sheet 6, and the semi-solidified substrate 1 is arranged between two adjacent layers of the conductive bonding sheets 6;
at least one semi-solidified substrate 1 is provided with a conductive through hole 2 for realizing the conduction between the circuit patterns of different layers, and the conductive bonding sheet 6 is cut into the circuit patterns of each layer;
the conductive through hole 2 is filled with conductive adhesive melted by the conductive bonding sheet 6 which flows in when pressed, and the non-circuit pattern part inside the PCB is filled with the melted semi-solidified substrate 1 when pressed.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (7)
1. A method for manufacturing a PCB is characterized by comprising the following steps:
providing at least one semi-cured substrate, and forming a conductive through hole on the at least one semi-cured substrate;
adhering a first conductive bonding sheet to each semi-solidified substrate;
providing a second conductive bonding sheet;
the second conductive bonding sheet is pasted on the lining paper, or the second conductive bonding sheet is pasted on one surface, which is not pasted with the first conductive bonding sheet, of the semi-solidified substrate of the PCB bottom layer;
respectively cutting the first conductive bonding sheet and the second conductive bonding sheet to obtain circuit patterns of each layer, and reserving the first conductive bonding sheet and the second conductive bonding sheet which are covered at two ends of the conductive through hole;
sequentially overlapping and pressing the semi-cured substrate adhered with the first conductive bonding sheet and the second conductive bonding sheet, and adjusting temperature and pressure parameters during pressing to melt and fill the conductive through holes and solidify the conductive bonding sheets;
a laminate panel is obtained.
2. The method of manufacturing as claimed in claim 1, further comprising, after obtaining the laminated board:
the liner paper is torn off.
3. The method of manufacturing according to claim 1, further comprising:
selecting a semi-solidified substrate with corresponding thickness according to the thickness requirement of each layer of medium;
and selecting the first conductive bonding sheet and the second conductive bonding sheet with corresponding thicknesses according to the thickness requirement of each layer of circuit pattern.
4. The method of manufacturing according to claim 1, further comprising, after obtaining the laminated board:
and the laminated board is provided with a non-conductive hole.
5. The method of manufacturing according to claim 1, wherein cutting the first conductive bonding sheet and the second conductive bonding sheet to obtain the wiring patterns of the respective layers comprises:
respectively cutting the first conductive bonding sheet and the second conductive bonding sheet by using laser equipment according to the circuit patterns of each layer;
removing the non-circuit pattern portions of the first conductive bonding sheet and the second conductive bonding sheet.
6. The manufacturing method according to any one of claims 1 or 5, wherein the first conductive bonding sheet and the second conductive bonding sheet are cut respectively to obtain the wiring patterns of the respective layers, further comprising:
and setting the cutting compensation value so that the line width of each layer of the obtained line pattern is smaller than the design value.
7. A PCB manufactured by the manufacturing method of any one of claims 1 to 6, comprising: a semi-cured substrate and a conductive bonding sheet;
the outermost layer of the PCB is the conductive bonding sheet, and the semi-solidified substrate is arranged between two adjacent layers of the conductive bonding sheets;
at least one semi-solidified substrate is provided with a conductive through hole, and the conductive bonding sheet is cut into circuit patterns of each layer;
and the conductive through hole is filled with conductive adhesive which is melted by the conductive bonding sheet flowing in when pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811011373.3A CN108882569B (en) | 2018-08-31 | 2018-08-31 | PCB manufacturing method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811011373.3A CN108882569B (en) | 2018-08-31 | 2018-08-31 | PCB manufacturing method and PCB |
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| CN108882569A CN108882569A (en) | 2018-11-23 |
| CN108882569B true CN108882569B (en) | 2021-02-09 |
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| CN110412450B (en) * | 2019-08-28 | 2021-06-25 | 生益电子股份有限公司 | Connection detection method for heat dissipation medium and conductive medium and PCB |
| CN110505750B (en) * | 2019-08-28 | 2020-10-16 | 生益电子股份有限公司 | PCB detection method and PCB |
| CN111935909B (en) * | 2020-07-31 | 2021-12-17 | 上海安费诺永亿通讯电子有限公司 | Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof |
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| JP2001320173A (en) * | 2000-05-09 | 2001-11-16 | Matsushita Electric Ind Co Ltd | Circuit board member, method of manufacturing both- sided circuit board and method of manufacturing multilayer circuit board |
| TWI512555B (en) * | 2011-06-09 | 2015-12-11 | Shih Hua Technology Ltd | Touch panel and method for making the same |
| CN103455179A (en) * | 2012-05-28 | 2013-12-18 | 东元奈米应材股份有限公司 | High-resolution laser etching method for transparent conducting layer of touch panel |
| CN104349613A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and manufacturing method thereof |
| CN104812157A (en) * | 2014-01-23 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Power supply printed circuit board and processing method thereof |
| JP6344476B2 (en) * | 2014-08-29 | 2018-06-20 | 株式会社村田製作所 | Multilayer circuit board |
| US10076025B2 (en) * | 2016-02-22 | 2018-09-11 | Nippon Mektron, Ltd. | Stretchable circuit board and method for manufacturing the same |
| JP6715052B2 (en) * | 2016-03-25 | 2020-07-01 | デクセリアルズ株式会社 | Method for manufacturing connection structure |
| CN108235574A (en) * | 2016-12-15 | 2018-06-29 | 吴勇杰 | Circuit board and preparation method thereof |
| CN108430174B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
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