CN111935909B - Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof - Google Patents
Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof Download PDFInfo
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- CN111935909B CN111935909B CN202010758247.5A CN202010758247A CN111935909B CN 111935909 B CN111935909 B CN 111935909B CN 202010758247 A CN202010758247 A CN 202010758247A CN 111935909 B CN111935909 B CN 111935909B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a preparation method of a recyclable paper base material type electronic circuit, wherein a first conductive circuit layer is prepared by adopting a laser etching stripping process, the laser etching stripping process does not need the help of any tool, the manufacture of a complex electronic circuit can be rapidly and flexibly completed, the processing precision and the position control precision of laser are higher and are incomparable to a die cutting process, after the electronic circuit prepared by the preparation method is used, the paper base material can be recycled, and the maximum recovery rate can reach 95%.
Description
Technical Field
The invention belongs to the field of structural design and preparation methods of electronic circuits, and particularly relates to a recyclable paper substrate type electronic circuit and a preparation method and a recycling method thereof.
Background
At present, various electronic circuits are widely applied, which causes severe environmental stress. Electronic circuit recycling has received increasing attention. The cost of manufacturing electronic circuits using inexpensive paper substrates can be significantly reduced, but paper substrates have some application limitations due to their own characteristics. For example, the original paper substrate has no waterproof property, and when a metal circuit is prepared, wet electroplating, wet etching and other processes are often required, so that the surface of the paper substrate must be coated with a waterproof protective layer. The waterproof protective layer is often made of a thermosetting resin material, which is a typical thermosetting polymer, has excellent chemical resistance and long-term stability in a natural environment, but is hardly degraded and cannot be recycled, and is a main factor causing environmental stress.
In addition, in the aspect of electronic circuit manufacturing, the traditional etching process for metal circuits has high circuit yield and good performance, but the process is complex, low in processing speed and high in cost, various chemicals harmful to the environment can be used, and a large amount of waste liquid is generated to be discharged. The printing process has the advantages of simple process procedure and high processing speed, and the defects of low conductivity, poor consistency, poor performance and high cost of the printed conductive material. The cutting die cutting process has the advantages of high production speed, suitability for mass production and low cost, and has the defect that complex and refined electronic circuits cannot be processed. For example, the minimum clearance for die cutting is about 0.5mm, and NFC (near field communication) lines cannot be processed. People urgently need to find a processing method which has the advantages of high production speed, low price, environmental friendliness and capability of manufacturing complex and refined electronic circuits.
Disclosure of Invention
The invention aims to provide a recyclable electronic circuit with a paper substrate, a preparation method and a recycling method thereof, which have the advantages of high production speed, low price, environmental friendliness and capability of manufacturing complex and refined electronic circuits.
In order to solve the problems, the technical scheme of the invention is as follows:
a preparation method of a recyclable electronic circuit with a paper substrate comprises the following steps:
s1: providing a paper substrate comprising opposing first and second surfaces;
s2: coating a first glue coating layer on the first surface of the paper base material;
s3: attaching a metal foil layer to the first adhesive coating layer;
s4: according to a preset electronic circuit pattern, removing the part of the metal foil layer outside the area forming the electronic circuit by adopting a laser etching stripping process, and forming a first conductive circuit layer by the left metal foil layer;
s5: preparing regional insulating layers on the surface of the first conductive circuit layer and the first surface of the paper substrate on two sides of the first conductive circuit layer;
s6: preparing second conductive circuit layers on the regional insulating layer and on the surfaces of the first conductive circuit layers at two ends of the regional insulating layer;
s7: and surface mounting elements are mounted on the surface of the first conductive circuit layer.
Based on the same inventive concept, the invention also provides a preparation method of the recyclable electronic circuit with the paper substrate, which comprises the following steps:
a1: providing a paper substrate comprising opposing first and second surfaces;
a2: coating a first glue coating layer in the same direction as the wiring direction of an electronic circuit on the first surface of a paper substrate according to a preset electronic circuit pattern, wherein the width of the first glue coating layer is larger than or equal to the width of the actual electronic circuit;
a3: attaching a metal foil layer to the first adhesive coating layer;
a4: according to a preset electronic circuit pattern, removing the metal foil layer along the outer contour of the electronic circuit by adopting a laser etching stripping process, removing the unnecessary metal foil layer by using modes of air pressure blowing or bonding-stripping and the like, and forming a first conductive circuit layer by using the remaining metal foil layer;
a5: preparing regional insulating layers on the surface of the first conductive circuit layer and the first surface of the paper substrate on two sides of the first conductive circuit layer;
a6: preparing second conductive circuit layers on the regional insulating layer and on the surfaces of the first conductive circuit layers at two ends of the regional insulating layer;
a7: and surface mounting elements are mounted on the surface of the first conductive circuit layer.
Preferably, the step S5 further includes: preparing a regional insulating layer on the surface of the first conductive circuit layer and the first surface of the paper base material on two sides of the first conductive circuit layer by adopting a screen printing process, an ink-jet printing process, an ultraviolet curing process or a thermosetting process; or
The step a5 further includes: and preparing the area insulating layer on the surface of the first conductive circuit layer and the first surface of the paper base material on two sides of the first conductive circuit layer by adopting a screen printing process, an ink-jet printing process, an ultraviolet curing process or a thermosetting process.
Preferably, the step S6 further includes: preparing a second conductive circuit layer on the area insulating layer and on the surface of the first conductive circuit layer at two ends of the area insulating layer by adopting a screen printing process or an ink-jet printing process or an ultraviolet curing process or a thermosetting process; or
The step a6 further includes: and preparing a second conductive circuit layer on the area insulating layer and on the surface of the first conductive circuit layer at two ends of the area insulating layer by adopting a screen printing process or an ink-jet printing process or an ultraviolet curing process or a thermosetting process.
Preferably, after the step S7, a glue is coated on the first surface of the paper substrate, the surface of the first conductive circuit layer, the surface of the second conductive circuit layer, and the surface of the surface-mounted component by using a glue coating process or a pressing process to coat a second glue coating layer; or
And after the step A7, coating a second glue coating layer on the first surface of the paper substrate, the surface of the first conducting circuit layer, the surface of the second conducting circuit layer and the surface of the surface-mounted element by adopting a casting process or a glue coating process.
Preferably, the thickness of the paper substrate is 10 μm to 500 μm.
Preferably, the thickness of the first rubber coating layer is 0.5-10 μm.
Preferably, the thickness of the first conductive circuit layer is 1 μm to 50 μm.
Preferably, the thickness of the regional insulating layer is 2 μm to 50 μm.
Preferably, the thickness of the second conductive trace layer is 1 μm to 50 μm.
Preferably, the thickness of the second rubber coating layer is 0.5-50 μm.
Preferably, the thickness of the release layer is greater than or equal to 2 μm.
Based on the same inventive concept, the invention also provides a method for recycling the recyclable paper-based electronic circuit, which comprises the following steps:
b1: selecting a recyclable paper base material electronic circuit to be recycled, and cutting the recyclable paper base material electronic circuit into a plurality of recyclable paper base material electronic circuits with certain sizes;
b2: b1, soaking the recyclable electronic paper substrate in water;
b3: crushing the recyclable electronic circuit of the paper substrate treated in the step B2 into pulp;
b4: filtering the paper pulp obtained by the step B3 to obtain good pulp;
b5: the fine pulp is used for making paper.
Based on the same inventive concept, the invention also provides a recyclable electronic circuit with a paper substrate, which comprises the following components:
the paper substrate includes opposing first and second surfaces;
the first glue coating layer is coated on the first surface of the paper base material;
the first conductive circuit layer is attached to the first glue coating layer;
the area insulating layer is arranged on the surface of the first conducting circuit layer and the first surface of the paper base material on two adjacent sides of the first conducting circuit layer;
the second conductive circuit layer is arranged on the surface of the area insulating layer and the first conductive circuit layer connected with the two ends of the area insulating layer;
the surface-mounted element is arranged on the first conducting circuit layer;
the second glue coating layer is coated on the first surface of the paper substrate, the surface of the first conducting circuit layer, the surface of the second conducting circuit layer and the surface of the surface-mounted element in a comprehensive mode;
the release paper is attached to the second glue coating layer.
Preferably, the material of the paper base material is any one of glassine paper, corrugated paper, white cardboard, kraft paper and laminating paper.
Preferably, the first rubberized layer and the second rubberized layer are made of any one of acrylic resin, epoxy resin, polyurethane resin and silicone rubber resin.
Preferably, the first conductive circuit layer and the second conductive circuit layer are made of any one or a combination of aluminum, copper, silver, graphite and carbon powder.
Preferably, the surface-mounted element is any one or a combination of several of a semiconductor chip, a capacitor, a resistor and an inductor.
Preferably, the material of the area insulating layer is non-conductive heat-curable ink or ultraviolet-curable ink.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
1) the electronic circuit manufacturing method provided by the invention is very simple and convenient, has short processing flow and environment-friendly processing technology, and is suitable for application scenes of various industries and consumption industries.
2) After the electronic circuit provided by the invention is used, the electronic circuit can be recycled by the method provided by the invention, and the maximum recovery rate can reach more than 95% according to actual tests.
3) The electronic circuit provided by the invention is composed of paper base materials, has the characteristic of extremely low cost, and is suitable for large-scale industrial production.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a recyclable paper-based electronic circuit according to an embodiment of the present invention;
fig. 2 is a structure obtained in step S2 of a method for manufacturing a recyclable paper-based electronic circuit according to an embodiment of the present invention;
fig. 3 is a structure obtained in step S3 of a method for manufacturing a recyclable electronic circuit with a paper substrate according to an embodiment of the present invention;
fig. 4 is a structure obtained in step S4 of a method for manufacturing a recyclable paper-based electronic circuit according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a recyclable paper-based electronic circuit according to a second embodiment of the present invention;
fig. 6 is a structure obtained in step a2 of a method for manufacturing a recyclable paper-based electronic circuit according to a second embodiment of the present invention;
fig. 7 is a structure obtained in step a3 of a method for manufacturing a recyclable paper-based electronic circuit according to a second embodiment of the present invention;
fig. 8 is a structure obtained in step a4 of a method for manufacturing a recyclable electronic circuit made of a paper substrate according to a second embodiment of the present invention;
fig. 9 is a flowchart of a recycling method for a recyclable electronic circuit on a paper substrate according to a third embodiment of the present invention;
fig. 10 is a schematic structural diagram of a recyclable paper-based electronic circuit according to a twelfth embodiment of the present invention.
Description of reference numerals:
1, paper base material; 2: a first glue layer; 3: a metal foil layer; 31: a first conductive circuit layer; 4: a region insulating layer; 5: a second conductive circuit layer; 6: a surface mount component; 7: a second glue coating layer; 8: and (4) release paper.
Detailed Description
The present invention provides a paper-based recyclable electronic circuit, a method for manufacturing the same, and a recycling method thereof, which are further described in detail below with reference to the accompanying drawings and specific examples. Advantages and features of the present invention will become apparent from the following description and from the claims.
The electronic circuit is widely applied to the design of an antenna radiator, a data transmission line and a radio frequency transmission line, and in the aspect of electronic circuit manufacturing, the laser etching stripping process is adopted, the process does not need the help of any tool, the manufacturing of a complex electronic circuit can be rapidly and flexibly completed, the processing precision and the position control precision of laser are high, and the laser etching stripping process is incomparable to a die cutting process.
Example one
Referring to fig. 1, the present invention provides a method for preparing a recyclable paper-based electronic circuit, comprising the following steps:
s1: referring to fig. 2, a paper substrate 1 is provided, the paper substrate 1 including opposing first and second surfaces;
s2: coating a first glue coating layer 2 on the first surface of the paper base material 1, in this embodiment, coating an ultrathin first glue coating layer 2 with a thickness of 0.5-10 μm on the first surface of the paper base material 1;
s3: attaching a metal foil layer 3 to the first adhesive layer 2, as shown in fig. 3, specifically including attaching a metal foil layer 3 of 1 to 50 μm to one side of the ultrathin first adhesive layer 2, pressing the metal foil layer 3 at a certain temperature and pressure, and drying at a certain temperature after pressing;
s4: according to a preset electronic circuit pattern, a laser etching stripping process is adopted to remove the part of the metal foil layer 3 outside the area forming the electronic circuit, the remaining metal foil layer forms a first conductive circuit layer 31, and as shown in fig. 4, when laser etching is carried out, the unnecessary metal foil layer 3 can be blown away from the paper base material 1 by air flow near a laser head;
s5: preparing a regional insulating layer 4 on the surface of the first conductive circuit layer 31 and the first surface of the paper substrate on two sides of the first conductive circuit layer 31, wherein the thickness of the regional insulating layer is 2-50 μm, and the specific steps are that according to the pattern design of the regional insulating layer 4, the regional insulating layer is prepared on the surface of the first conductive circuit layer 31 and the surface of the paper substrate by utilizing one or a combination of several processes of silk-screen printing, ink-jet printing, ultraviolet curing or thermosetting, as shown in fig. 10, the regional insulating layer 4 is arranged at the lower left corner of the first conductive circuit layer 31, and two ends of the regional insulating layer 4 are connected with the first conductive circuit layer 31;
s6: referring to fig. 10, a second conductive circuit layer 5 is prepared on the surface of the first conductive circuit layer 31 on the area insulating layer 4 and at the two ends of the area insulating layer, and the thickness of the second conductive circuit layer 5 is 1 μm to 50 μm, specifically, the method comprises the steps of preparing the second conductive circuit layer 5 on the surface of the first conductive circuit layer 31 on the area insulating layer 4 and at the two ends of the area insulating layer by using one or a combination of several processes of screen printing, ink-jet printing, ultraviolet curing or thermosetting;
s7: a surface-mounted component 6 is mounted on the surface of the first conductive trace layer 31, in this embodiment, the surface-mounted component 6 is any one or a combination of several of a semiconductor chip, a capacitor, a resistor, and an inductor;
s8: coating a second glue coating layer 7 on the first surface of the paper substrate 1, the surface of the first conductive circuit layer 31, the surface of the second conductive circuit layer 5 and the surface of the surface-mounted element 6, wherein the thickness of the second glue coating layer 7 is 0.5-50 microns, and the method specifically comprises the steps of coating the second glue coating layer 7 on the first surface of the paper substrate 1, the surface of the first conductive circuit layer 31, the surface of the second conductive circuit layer 5 and the surface of the surface-mounted element 6 by using a tape casting process or a glue coating process;
s9: and attaching release paper 8 to the surface of the second gluing layer 7, wherein the thickness of the release paper 8 is more than or equal to 2 micrometers.
It should be noted that, although the present embodiment describes a method for manufacturing an electronic circuit using a sheet material, the present embodiment is also applicable to a method for manufacturing an electronic circuit from a roll to a roll, and a device for feeding and discharging may be changed to a device suitable for a roll to roll process flow.
According to the preparation method of the recyclable paper-based electronic circuit, the first conductive circuit layer is prepared by adopting a laser etching stripping process, the laser etching stripping process does not need the help of any tool, the complex electronic circuit can be rapidly and flexibly prepared, the processing precision and the position control precision of laser are high, and the method is incomparable to a die cutting process.
Example two
Referring to fig. 5, based on the same inventive concept, the present invention also provides a method for manufacturing a recyclable paper-based electronic circuit, comprising the following steps:
a1: providing a paper substrate 1, the paper substrate 1 comprising opposing first and second surfaces;
a2: coating a first glue coating layer 2 which is similar to an electronic circuit trace and has a glue line width larger than or equal to the actual electronic circuit width on the first surface of the paper substrate 1 according to a preset electronic circuit pattern, namely, the pattern of the first glue coating layer 2 is similar to the pattern of the first conductive circuit layer 31, as shown in fig. 6, the width of the first glue coating layer 2 is slightly wider than the actual electronic circuit width, and the thickness of the first glue coating layer 2 is 0.5-10 μm;
a3: attaching a metal foil layer 3 to the first adhesive layer 2, as shown in fig. 7, specifically including attaching a metal foil layer 3 of 1 to 50 μm to one side of the ultrathin first adhesive layer 2, pressing the metal foil layer 3 at a certain temperature and pressure, and drying at a certain temperature after pressing;
a4: according to a preset electronic circuit pattern, referring to fig. 8, a laser etching stripping process is adopted to remove the metal foil layer 3 along the outer contour of the electronic circuit, an air pressure blowing mode is used to remove the unnecessary metal foil layer, the remaining metal foil layer forms a first conductive circuit layer 31, and the unnecessary metal foil layer 3 can be blown away from the paper substrate 1 by air flow near a laser head during laser etching;
a5: preparing a regional insulating layer 4 on the surface of the first conductive circuit layer 31 and the first surface of the paper substrate on two sides of the first conductive circuit layer 31, wherein the thickness of the regional insulating layer is 2-50 μm, and the specific steps are that according to the pattern design of the regional insulating layer 4, the regional insulating layer is prepared on the surface of the first conductive circuit layer 31 and the surface of the paper substrate by utilizing one or a combination of several processes of silk-screen printing, ink-jet printing, ultraviolet curing or thermosetting, as shown in fig. 10, the regional insulating layer 4 is arranged at the lower left corner of the first conductive circuit layer 31, and two ends of the regional insulating layer 4 are connected with the first conductive circuit layer 31;
a6: referring to fig. 10, a second conductive circuit layer 5 is prepared on the surface of the first conductive circuit layer 31 on the area insulating layer 4 and at the two ends of the area insulating layer, and the thickness of the second conductive circuit layer 5 is 1 μm to 50 μm, specifically, the method comprises the steps of preparing the second conductive circuit layer 5 on the surface of the first conductive circuit layer 31 on the area insulating layer 4 and at the two ends of the area insulating layer by using one or a combination of several processes of screen printing, ink-jet printing, ultraviolet curing or thermosetting;
a7: a surface-mounted component 6 is mounted on the surface of the first conductive trace layer 31, in this embodiment, the surface-mounted component 6 is any one or a combination of several of a semiconductor chip, a capacitor, a resistor, and an inductor;
a8: coating a second glue coating layer 7 on the first surface of the paper substrate 1, the surface of the first conductive circuit layer 31, the surface of the second conductive circuit layer 5 and the surface of the surface-mounted element 6, wherein the thickness of the second glue coating layer 7 is 0.5-50 microns, and the method specifically comprises the steps of coating the second glue coating layer 7 on the first surface of the paper substrate 1, the surface of the first conductive circuit layer 31, the surface of the second conductive circuit layer 5 and the surface of the surface-mounted element 6 by using a tape casting process or a glue coating process;
a9: and attaching release paper 8 to the surface of the second gluing layer 7, wherein the thickness of the release paper 8 is more than or equal to 2 micrometers.
It should be noted that, although the present embodiment describes a method for manufacturing an electronic circuit using a sheet material, the present embodiment is also applicable to a method for manufacturing an electronic circuit from a roll to a roll, and a device for feeding and discharging may be changed to a device suitable for a roll to roll process flow.
EXAMPLE III
Based on the same inventive concept, referring to fig. 9, the invention further provides a method for recycling a recyclable paper substrate electronic circuit, comprising the following steps:
b1: selecting a certain weight of recyclable paper base material electronic circuits to be recycled, and cutting the recyclable paper base material electronic circuits into a plurality of recyclable paper base material electronic circuits with certain sizes;
b2: b1, soaking the recyclable electronic circuit of the paper base material in water at 50-70 ℃ for 30-60 min;
b3: crushing the recyclable electronic circuit of the paper substrate treated in the step B2 into pulp;
b4: filtering the paper pulp obtained by the step B3 to obtain good pulp;
b5: separating solid components in the good pulp obtained in the step B4 by using a centrifugal machine, wherein the rotating speed of the centrifugal machine is 2-6 krpm, and the centrifugal time is 1-10 min;
b6: and B5, preparing paper by using papermaking equipment from the fine pulp processed in the step B for preparing the recyclable electronic circuit with the paper substrate.
According to the method for recovering the recyclable paper-based electronic circuit, the electronic circuit is recovered by the method after the electronic circuit is used, and the maximum recovery rate can reach over 95%.
Example four
The embodiment provides a method for preparing a paper substrate recyclable electronic circuit, which is a specific application of the method for preparing an electronic circuit provided by the embodiment, and the method comprises the following steps:
1) providing a paper substrate made of glassine paper, wherein the thickness of the paper substrate is 100 mu m;
2) coating a 3-micrometer ultrathin epoxy resin adhesive layer on a paper base material;
3) lightly attaching an aluminum foil metal layer with the thickness of 35 mu m to the ultrathin epoxy resin adhesive layer, pressing the metal foil layer at a specific temperature and pressure, and drying at a certain temperature after pressing;
4) then according to the pattern design of the first conductive circuit layer, etching an unnecessary metal foil layer by using infrared laser with the power of 20W and the wavelength of 1064nm, blowing the unnecessary aluminum foil away from a paper substrate by compressed air near a laser head while performing laser etching, leaving a required circuit pattern on the paper substrate, and preparing the first conductive circuit layer on the paper substrate, wherein the external dimension of an antenna is 50 x 25mm, the scanning speed of the laser is 2000mm/s, and the laser processing time of a single product is 20 s;
5) preparing area insulating layers on the surface of the first conducting circuit layer and the first surface of the paper base material on two sides of the first conducting circuit layer, wherein the thickness of the area insulating layer is 10 micrometers, and the area insulating layer is prepared by solder resist ink made of thermosetting epoxy resin;
6) preparing a second conductive circuit layer on the regional insulating layer and on the surface of the first conductive circuit layer at two ends of the regional insulating layer, wherein the second conductive circuit layer is prepared by silver prize and has the thickness of 10 mu m;
7) mounting a surface-mounted element on the surface of the first conductive circuit layer, wherein the surface-mounted element is a semiconductor chip with the model number of NXPSlix 2;
8) coating a second glue coating layer on the first surface of the paper substrate, the surface of the first conductive circuit layer, the surface of the second conductive circuit layer and the surface of the surface-mounted element, wherein the second glue coating layer is made of acrylic resin and has the thickness of 5 micrometers;
9) and attaching release paper to the surface of the second gluing layer, wherein the release paper adopts laminating paper and has the thickness of 65 mu m.
EXAMPLE five
The embodiment provides a method for preparing a paper substrate recyclable electronic circuit, which is a specific application of the method for preparing an electronic circuit provided by the embodiment, and the method comprises the following steps:
1) providing a paper substrate made of glassine paper, wherein the thickness of the paper substrate is 100 mu m;
2) coating a 3-micrometer ultrathin epoxy resin adhesive layer on a paper base material;
3) lightly attaching an aluminum foil metal layer with the thickness of 17 mu m to the ultrathin epoxy resin adhesive layer, pressing the metal foil layer at a specific temperature and pressure, and drying at a certain temperature after pressing;
4) then according to the pattern design of the first conductive circuit layer, etching an unnecessary metal foil layer by using infrared laser with the power of 20W and the wavelength of 1064nm, blowing the unnecessary aluminum foil away from a paper substrate by compressed air near a laser head while performing laser etching, leaving a required circuit pattern on the paper substrate, and preparing the first conductive circuit layer on the paper substrate, wherein the external dimension of an antenna is 50 x 25mm, the scanning speed of the laser is 2000mm/s, and the laser processing time of a single product is 15 s;
5) preparing area insulating layers on the surface of the first conducting circuit layer and the first surface of the paper base material on two sides of the first conducting circuit layer, wherein the thickness of the area insulating layer is 10 micrometers, and the area insulating layer is prepared by solder resist ink made of thermosetting epoxy resin;
6) preparing a second conductive circuit layer on the regional insulating layer and on the surface of the first conductive circuit layer at two ends of the regional insulating layer, wherein the second conductive circuit layer is prepared by silver prize and has the thickness of 10 mu m;
7) mounting a surface-mounted element on the surface of the first conductive circuit layer, wherein the surface-mounted element is a semiconductor chip with the model number of NXPSlix 2;
8) coating a second glue coating layer on the first surface of the paper substrate, the surface of the first conductive circuit layer, the surface of the second conductive circuit layer and the surface of the surface-mounted element, wherein the second glue coating layer is made of acrylic resin and has the thickness of 5 micrometers;
9) and attaching release paper to the surface of the second gluing layer, wherein the release paper adopts laminating paper and has the thickness of 65 mu m.
EXAMPLE six
The invention also provides a preparation method of the recyclable paper substrate electronic circuit, which is a specific application of the preparation method of the electronic circuit provided by the embodiment II and comprises the following steps:
1) providing a paper substrate made of glassine paper, wherein the thickness of the paper substrate is 100 mu m;
2) coating a 3-micrometer ultrathin epoxy resin adhesive layer on a paper substrate according to a preset electronic circuit pattern, wherein the pattern of the printed adhesive layer is similar to that of the first conductive circuit layer, and the width of the circuit of the adhesive layer is 50 micrometers wider than that of the actual electronic circuit on one side;
3) lightly attaching an aluminum foil metal layer with the thickness of 12 microns to the ultrathin epoxy resin adhesive layer, pressing the metal foil layer at a specific temperature and pressure, and drying at a certain temperature after pressing;
4) then according to the pattern design of the first conductive circuit layer, etching the outline of an unnecessary metal layer by using green laser with the power of 25W and the wavelength of 532nm, keeping the width of the laser etched outline at 100 mu m, ensuring that an adhesive layer exceeding an actual electronic circuit can be etched, enabling the laser to simultaneously penetrate through a metal foil and the adhesive layer and be ablated to a paper substrate, removing the unnecessary aluminum foil layer by using a bonding-stripping mode after the laser etching, leaving a required circuit pattern on the paper substrate, preparing the first conductive circuit layer on the paper substrate, wherein the outline size of an antenna is 50 x 25mm, the scanning speed of the laser is 1000mm/s, and the laser processing time of a single product is 8 s;
5) preparing area insulating layers on the surface of the first conducting circuit layer and the first surface of the paper base material on two sides of the first conducting circuit layer, wherein the thickness of the area insulating layer is 10 micrometers, and the area insulating layer is prepared by solder resist ink made of thermosetting epoxy resin;
6) preparing second conductive circuit layers on the regional insulating layers and on the surfaces of the first conductive circuit layers at two ends of the regional insulating layers, wherein the second conductive circuit layers are prepared by screen printing silver medals and are 10 micrometers in thickness;
7) mounting a surface-mounted element on the surface of the first conductive circuit layer, wherein the surface-mounted element is a semiconductor chip with the model number of NXPSlix 2;
8) coating a second glue coating layer on the first surface of the paper substrate, the surface of the first conductive circuit layer, the surface of the second conductive circuit layer and the surface of the surface-mounted element, wherein the second glue coating layer is made of acrylic resin and has the thickness of 5 micrometers;
9) and attaching release paper to the surface of the second gluing layer, wherein the release paper adopts laminating paper and has the thickness of 65 mu m.
EXAMPLE seven
The invention also provides a preparation method of the recyclable paper substrate electronic circuit, which is a specific application of the preparation method of the electronic circuit provided by the embodiment II and comprises the following steps:
1) providing a paper substrate made of glassine paper, wherein the thickness of the paper substrate is 100 mu m;
2) coating a 3-micrometer ultrathin epoxy resin adhesive layer on a paper substrate according to a preset electronic circuit pattern, wherein the pattern of the printed adhesive layer is similar to that of the first conductive circuit layer, and the width of the circuit of the adhesive layer is 50 micrometers wider than that of the actual electronic circuit on one side;
3) lightly attaching an aluminum foil metal layer with the thickness of 12 microns to the ultrathin epoxy resin adhesive layer, pressing the metal foil layer at a specific temperature and pressure, and drying at a certain temperature after pressing;
4) then according to the pattern design of the first conductive circuit layer, etching the outline of an unnecessary metal layer by using infrared laser with the power of 200W and the wavelength of 10.6nm, keeping the width of the laser-etched outline at 100 mu m, ensuring that an adhesive layer exceeding an actual electronic circuit can be etched, enabling the laser to simultaneously penetrate through a metal foil and the adhesive layer and be ablated to a paper substrate, removing the unnecessary aluminum foil layer by using a bonding-stripping mode after the laser etching, leaving a required circuit pattern on the paper substrate, preparing the first conductive circuit layer on the paper substrate, wherein the outline dimension of an antenna is 50 x 25mm, the scanning speed of the laser is 4000mm/s, and the laser processing time of a single product is 6 s;
5) preparing area insulating layers on the surface of the first conducting circuit layer and the first surface of the paper base material on two sides of the first conducting circuit layer, wherein the thickness of the area insulating layer is 10 micrometers, and the area insulating layer is prepared by solder resist ink made of thermosetting epoxy resin;
6) preparing second conductive circuit layers on the regional insulating layers and on the surfaces of the first conductive circuit layers at two ends of the regional insulating layers, wherein the second conductive circuit layers are prepared by screen printing silver medals and are 10 micrometers in thickness;
7) mounting a surface-mounted element on the surface of the first conductive circuit layer, wherein the surface-mounted element is a semiconductor chip with the model number of NXPSlix 2;
8) coating a second glue coating layer on the first surface of the paper substrate, the surface of the first conductive circuit layer, the surface of the second conductive circuit layer and the surface of the surface-mounted element, wherein the second glue coating layer is made of acrylic resin and has the thickness of 5 micrometers;
9) and attaching release paper to the surface of the second gluing layer, wherein the release paper adopts laminating paper and has the thickness of 65 mu m.
Example eight
This embodiment provides a method for recycling the recyclable electronic circuit made of the paper substrate of the fourth embodiment, which includes the following steps:
1) selecting 300g of recyclable electronic circuits of paper substrates to be recycled, and cutting the recyclable electronic circuits into the sizes of about 25 x 25mm by using a cutting device;
2) soaking the paper base material recyclable electronic circuit subjected to cutting treatment in 18kg of warm water at the temperature of 70 ℃ for 60 min;
3) crushing the recyclable electronic circuit of the soaked paper base material into pulp by using mechanical crushing equipment, wherein the rotating speed of the mechanical crushing equipment is 3krpm, and the crushing time is 8 min;
4) filtering the paper pulp obtained in the step 3) by using filtering equipment with the aperture of 0.25mm, repeating the operation for 3 times to obtain good pulp after filtering, and weighing the good pulp to ensure that the proportion of the good pulp is 85%;
5) separating solid components in the good pulp obtained in the step 4) by using a centrifugal machine, wherein the rotating speed of the centrifugal machine is 4krpm, and the centrifugal time is 5 min;
6) the glassmaking equipment is utilized to prepare glassine paper, the obtained glassine paper can be used as a paper base material, and the paper base material environment-friendly electronic circuit is repeatedly prepared.
Example nine
This embodiment provides a method for recycling the recyclable electronic circuit made of the paper substrate in the fifth embodiment, which includes the following steps:
1) selecting 300g of recyclable electronic circuits of paper substrates to be recycled, and cutting the recyclable electronic circuits into the sizes of about 25 x 25mm by using a cutting device;
2) soaking the paper base material recyclable electronic circuit subjected to cutting treatment in 18kg of warm water at the temperature of 70 ℃ for 60 min;
3) crushing the recyclable electronic circuit of the soaked paper base material into pulp by using mechanical crushing equipment, wherein the rotating speed of the mechanical crushing equipment is 3krpm, and the crushing time is 8 min;
4) filtering the paper pulp obtained in the step 3) by using filtering equipment with the aperture of 0.25mm, repeating the operation for 3 times to obtain good pulp after filtering, and weighing the good pulp to obtain 88 percent of good pulp;
5) separating solid components in the good pulp obtained in the step 4) by using a centrifugal machine, wherein the rotating speed of the centrifugal machine is 4krpm, and the centrifugal time is 5 min;
6) the glassmaking equipment is utilized to prepare glassine paper, the obtained glassine paper can be used as a paper base material, and the paper base material environment-friendly electronic circuit is repeatedly prepared.
Example ten
This embodiment provides a method for recycling the recyclable electronic circuit made of the paper substrate of the sixth embodiment, which includes the following steps:
1) selecting 300g of recyclable electronic circuits of paper substrates to be recycled, and cutting the recyclable electronic circuits into the sizes of about 25 x 25mm by using a cutting device;
2) soaking the paper base material recyclable electronic circuit subjected to cutting treatment in 18kg of warm water at the temperature of 70 ℃ for 60 min;
3) crushing the recyclable electronic circuit of the soaked paper base material into pulp by using mechanical crushing equipment, wherein the rotating speed of the mechanical crushing equipment is 3krpm, and the crushing time is 8 min;
4) filtering the paper pulp obtained in the step 3) by using filtering equipment with the aperture of 0.25mm, repeating the operation for 3 times to obtain good pulp after filtering, and weighing the good pulp to obtain 86% of good pulp;
5) separating solid components in the good pulp obtained in the step 4) by using a centrifugal machine, wherein the rotating speed of the centrifugal machine is 4krpm, and the centrifugal time is 5 min;
6) the glassmaking equipment is utilized to prepare glassine paper, the obtained glassine paper can be used as a paper base material, and the paper base material environment-friendly electronic circuit is repeatedly prepared.
EXAMPLE eleven
This example provides a method for recycling the recyclable paper substrate electronic circuit of example seven, comprising the steps of:
1) selecting 300g of recyclable electronic circuits of paper substrates to be recycled, and cutting the recyclable electronic circuits into the sizes of about 25 x 25mm by using a cutting device;
2) soaking the paper base material recyclable electronic circuit subjected to cutting treatment in 18kg of warm water at the temperature of 70 ℃ for 60 min;
3) crushing the recyclable electronic circuit of the soaked paper base material into pulp by using mechanical crushing equipment, wherein the rotating speed of the mechanical crushing equipment is 3krpm, and the crushing time is 8 min;
4) filtering the paper pulp obtained in the step 3) by using filtering equipment with the aperture of 0.25mm, repeating the operation for 3 times to obtain good pulp after filtering, and weighing the good pulp to obtain 90% of good pulp;
5) separating solid components in the good pulp obtained in the step 4) by using a centrifugal machine, wherein the rotating speed of the centrifugal machine is 4krpm, and the centrifugal time is 5 min;
6) the glassmaking equipment is utilized to prepare glassine paper, the obtained glassine paper can be used as a paper base material, and the paper base material environment-friendly electronic circuit is repeatedly prepared.
Example twelve
Based on the same inventive concept, referring to fig. 10, the embodiment provides a recyclable electronic circuit with a paper substrate, which includes a paper substrate 1, a first glue coating layer 2 (the first glue coating layer is located below a first conductive circuit layer, and therefore is not shown in fig. 10), a first conductive circuit layer 31, a regional insulating layer 4, a second conductive circuit layer 5, a surface-mounted component 6, a second glue coating layer 7, and release paper 8:
the paper base material 1 comprises a first surface and a second surface which are opposite, the material of the paper base material 1 is any one of glassine paper, corrugated paper, white cardboard, kraft paper and laminating paper, and the thickness of the paper base material 1 is 10-500 mu m;
the first glue coating layer 2 is coated on the first surface of the paper base material 1, the material of the first glue coating layer 2 is any one of acrylic resin, epoxy resin, polyurethane resin and silicon rubber resin, and the thickness of the first glue coating layer 2 is 0.5-10 mu m;
the first conductive circuit layer 31 is attached to the first glue coating layer 2, the first conductive circuit layer 31 is made of any one or a combination of more of aluminum, copper, silver, graphite and carbon powder, and the thickness of the first conductive circuit layer 31 is 1-50 μm;
the regional insulation layer 4 is arranged on the surface of the first conductive circuit layer 31 and the first surface of the paper substrate 1 on two adjacent sides of the first conductive circuit layer 31, the material of the regional insulation layer 4 is non-conductive thermosetting ink or ultraviolet curing ink, and the thickness of the regional insulation layer 4 is 2-50 μm;
the second conductive circuit layer 5 is arranged on the surface of the regional insulating layer 4 and the first conductive circuit layer 31 connected with the two ends of the regional insulating layer 4, the material of the second conductive circuit layer 5 is any one or a combination of more of aluminum, copper, silver, graphite and carbon powder, and the thickness of the second conductive circuit layer 5 is 1-50 μm;
the surface-mounted element 6 is arranged on the first conducting circuit layer, and the surface-mounted element 6 is any one or combination of a plurality of semiconductor chips, capacitors, resistors and inductors;
the second glue coating layer 7 is coated on the first surface of the paper base material 1, the surface of the first conductive circuit layer 31, the surface of the second conductive circuit layer 5 and the surface of the surface-mounted element 6 in a whole manner, the material of the second glue coating layer 7 is any one of acrylic resin, epoxy resin, polyurethane resin and silicon rubber resin, and the thickness of the second glue coating layer 7 is 0.5-50 mu m;
the release paper 8 is attached to the second glue coating layer 7, the release paper 8 is made of any one of a PET release film, a PBT release film or release paper, and the thickness of the release paper 8 is greater than or equal to 2 micrometers.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (17)
1. A preparation method of a recyclable electronic circuit with a paper substrate is characterized by comprising the following steps:
s1: providing a paper substrate comprising opposing first and second surfaces;
s2: coating a first glue coating layer on the first surface of the paper base material;
s3: attaching a metal foil layer to the first adhesive coating layer;
s4: according to a preset electronic circuit pattern, removing the part of the metal foil layer outside the area forming the electronic circuit by adopting a laser etching stripping process, and forming a first conductive circuit layer by the left metal foil layer;
s5: preparing regional insulating layers on the surface of the first conductive circuit layer and the first surface of the paper substrate on two sides of the first conductive circuit layer;
s6: preparing second conductive circuit layers on the regional insulating layer and on the surfaces of the first conductive circuit layers at two ends of the regional insulating layer;
s7: and surface mounting elements are mounted on the surface of the first conductive circuit layer.
2. A preparation method of a recyclable electronic circuit with a paper substrate is characterized by comprising the following steps:
a1: providing a paper substrate comprising opposing first and second surfaces;
a2: coating a first glue coating layer in the same direction as the wiring direction of an electronic circuit on the first surface of a paper substrate according to a preset electronic circuit pattern, wherein the width of the first glue coating layer is larger than or equal to the width of the actual electronic circuit;
a3: attaching a metal foil layer to the first adhesive coating layer;
a4: according to a preset electronic circuit pattern, removing the metal foil layer along the outer contour of the electronic circuit by adopting a laser etching stripping process, removing the unnecessary metal foil layer by using air pressure blowing or a bonding-stripping mode, and forming a first conductive circuit layer by the remaining metal foil layer;
a5: preparing regional insulating layers on the surface of the first conductive circuit layer and the first surface of the paper substrate on two sides of the first conductive circuit layer;
a6: preparing second conductive circuit layers on the regional insulating layer and on the surfaces of the first conductive circuit layers at two ends of the regional insulating layer;
a7: and surface mounting elements are mounted on the surface of the first conductive circuit layer.
3. The method for preparing a paper-based recyclable electronic circuit as claimed in claim 1 or 2, wherein the step S5 further comprises: preparing a regional insulating layer on the surface of the first conductive circuit layer and the first surface of the paper base material on two sides of the first conductive circuit layer by adopting a screen printing process, an ink-jet printing process, an ultraviolet curing process or a thermosetting process; or
The step a5 further includes: and preparing the area insulating layer on the surface of the first conductive circuit layer and the first surface of the paper base material on two sides of the first conductive circuit layer by adopting a screen printing process, an ink-jet printing process, an ultraviolet curing process or a thermosetting process.
4. The method for preparing a paper-based recyclable electronic circuit as claimed in claim 1 or 2, wherein the step S6 further comprises: preparing a second conductive circuit layer on the area insulating layer and on the surface of the first conductive circuit layer at two ends of the area insulating layer by adopting a screen printing process or an ink-jet printing process or an ultraviolet curing process or a thermosetting process; or
The step a6 further includes: and preparing a second conductive circuit layer on the area insulating layer and on the surface of the first conductive circuit layer at two ends of the area insulating layer by adopting a screen printing process or an ink-jet printing process or an ultraviolet curing process or a thermosetting process.
5. The method for manufacturing the recyclable electronic circuit with the paper substrate as claimed in claim 1 or 2, wherein after the step S7, the method further comprises applying glue to the first surface of the paper substrate, the surface of the first conductive circuit layer, the surface of the second conductive circuit layer, and the surface of the surface-mounted component by using a glue application process or a press-fit process to apply a second glue layer; or
And after the step A7, coating a second glue coating layer on the first surface of the paper substrate, the surface of the first conducting circuit layer, the surface of the second conducting circuit layer and the surface of the surface-mounted element by adopting a casting process or a glue coating process.
6. The method for the preparation of the paper substrate recoverable electronic circuit according to claim 1 or 2, wherein the thickness of the paper substrate is between 10 and 500 μm.
7. The method for the production of recyclable electronic circuits with paper substrates according to claim 1 or 2, characterized in that the thickness of the first glue layer is comprised between 0.5 and 10 μm.
8. The method for preparing the recyclable electronic circuit based on the paper substrate as claimed in claim 1 or 2, wherein the first conductive circuit layer has a thickness of 1 μm to 50 μm.
9. The method of making a paper-based recyclable electronic circuit as in claim 1 or 2, wherein the regional insulating layer has a thickness of 2 to 50 μm.
10. The method for manufacturing the recyclable electronic circuit based on the paper substrate as claimed in claim 1 or 2, wherein the thickness of the second conductive circuit layer is 1 μm to 50 μm.
11. The method of claim 5, wherein the second glue layer has a thickness of 0.5-50 μm.
12. An electronic circuit with a recyclable paper substrate, which is prepared by the method for preparing the electronic circuit with the recyclable paper substrate according to any one of claims 1 to 11, and comprises the following components:
the paper substrate includes opposing first and second surfaces;
the first glue coating layer is coated on the first surface of the paper base material;
the first conductive circuit layer is attached to the first glue coating layer;
the area insulating layer is arranged on the surface of the first conducting circuit layer and the first surface of the paper base material on two adjacent sides of the first conducting circuit layer;
the second conductive circuit layer is arranged on the surface of the area insulating layer and the first conductive circuit layer connected with the two ends of the area insulating layer;
the surface-mounted element is arranged on the first conducting circuit layer;
the second glue coating layer is coated on the first surface of the paper substrate, the surface of the first conducting circuit layer, the surface of the second conducting circuit layer and the surface of the surface-mounted element in a comprehensive mode;
the release paper is attached to the second glue coating layer.
13. The recyclable electronic circuit as defined in claim 12, wherein the paper substrate is made of any one of glassine paper, corrugated paper, white cardboard, kraft paper and laminating paper.
14. The recyclable electronic circuit with paper substrate as claimed in claim 12, wherein the first and second glue layers are made of any one of acrylic resin, epoxy resin, polyurethane resin and silicone resin.
15. The recyclable electronic circuit with paper substrate as claimed in claim 12, wherein the first conductive circuit layer and the second conductive circuit layer are made of one or more of aluminum, copper, silver, graphite and carbon powder.
16. The paper substrate recyclable electronic circuit as claimed in claim 12, wherein the surface mount component is any one or combination of semiconductor chip, capacitor, resistor and inductor.
17. The paper substrate recyclable electronic circuit of claim 12, wherein the regional insulating layer is made of a non-conductive thermally curable ink or a uv curable ink.
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| JP2006196723A (en) * | 2005-01-14 | 2006-07-27 | Omron Corp | Regenerating method for soluble printed circuit board, water-soluble ic tag, magnetically sucked ic tag, and raw material and regenerating method for paper material |
| TWI383715B (en) * | 2008-05-16 | 2013-01-21 | Nan Ya Printed Circuit Board | High density package substrate and method for fabricating the same |
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| CN103458629B (en) * | 2012-05-30 | 2016-12-21 | 碁鼎科技秦皇岛有限公司 | Multilayer circuit board and preparation method thereof |
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