TWI333819B - Printing template of legend and method of manufacturing printed circuit board using the same - Google Patents

Description

1333819 [0001] [0002] [0003] 096125610

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to the field of circuit board manufacturing, and more particularly to a text printing screen and a method of manufacturing a circuit board using the text printing screen. [Prior Art] In the information, communication and consumer electronics industries, the circuit board is an indispensable basic component of all electronic information products. The β circuit board can realize the electrical connection of various electronic components, so that each electronic component can co-process the transmission signal. . The circuit board manufacturing method generally includes the steps of blanking, conductive circuit fabrication, via hole fabrication, solder mask printing, text printing, gold forming, inspection and packaging. The blanking refers to cutting a raw material such as a copper clad laminate into a substrate of an appropriate size for easy production. Conductive circuit fabrication refers to the formation of conductive copper on a substrate, which is formed by lamination, exposure, development, and the like. The method for fabricating the via hole includes drilling and hole electroporation to realize interconnection of interlayer conductive lines. After the conductive traces and vias are fabricated, a solder mask is applied to the outer surface of the conductive traces of the substrate to protect the conductive traces to avoid soldering short circuits between the conductive traces during oxidation of the conductive traces and subsequent mounting. Text printing means that the corresponding text, trademark or part number is printed on the solder resist in the form of a screen printing, to indicate the type of the product or the location of the various parts or repairs. Mineral gold refers to the layer of high chemically blunt gold on the end of the board to protect the termination point and provide good electrical conductivity. Molding refers to the cutting of the substrate into the customer's needs by means of Wei-cut or stamping, etc. After forming the circuit board β, the final electrical material, impedance test and 珲 form number Α0101 are required before the packaging. 3 pages/total 20 pages 0993270775-0 1333819 On July 28, 099, the replacement page is tested for tin and thermal shock resistance. After the inspection is passed, the product can be packaged and shipped.

[0004] When a single-piece (Panel Form) circuit board is produced, a single substrate usually has a plurality of board sizes. In the production of Roll To Roll (RTR) boards, a roll of substrate typically includes dozens of boards. In order to avoid partial overlap of the solder resist inks of adjacent circuit boards during the solder mask printing, and thus the overlapping portions are contaminated by the terminal contacts due to insufficient curing, the circuit board products are scrapped, and usually the intervals between the boards on the substrate are set. Area. Since the spacer belongs to the scrap area, it will be discarded after molding. Therefore, the spacer is not fabricated and the solder resist layer is not applied. Therefore, in the subsequent gold plating process, the copper surface of the spacer will be plated with gold. The layer causes waste of gold-plated raw materials and an increase in manufacturing cost of the board. [0005] Therefore, it is necessary to provide a text printing screen that can avoid gold plating on a spacer and a method of manufacturing a circuit board using the text printing screen. [Summary of the Invention]

[0006] Hereinafter, a text printing screen which can avoid plating a gold layer in a spacer and a method of manufacturing a circuit board using the character printing screen will be described by way of embodiments. [0007] a text printing screen, comprising at least one first screen area 'at least one second screen area and at least one interval opening between the first screen area and the second screen area, the first The screen area is used for text printing on the first circuit board, and the second screen area is used for text printing on the second circuit board, and the spacing opening is used to correspond to the space between the first circuit board and the second circuit board. In order to print the ink on the spacer. 096125610 Form No. A0101 Page 4 of 20 0993270775-0 1333819 [0008]

A method of fabricating a circuit board, comprising the steps of: providing a substrate to be printed, the substrate comprising at least a first circuit board, at least one second circuit board, and at least one in the first a space between the circuit board and the second circuit board; providing a text printing screen, comprising at least a first screen area, at least a second screen area, and at least one of the first screen area and the second screen area a gap between the first screen area and the second screen area is formed in the gap opening; the text printing screen is aligned with the substrate, so that the first screen area corresponds to the first circuit board, The second screen area corresponds to the second circuit board, and the spacing opening corresponds to the spacing area; the ink is coated on the text printing screen so that the ink is formed on the surface of the first circuit board and the second circuit board by the pattern opening, by spacing the opening Forming in the spacer; separating the text printing screen and the substrate to obtain a substrate on which the ink is printed on the surface; performing gold plating on the substrate and forming a process to obtain the first circuit board product and the second circuit board product. [0009] The text printing screen in the technical solution and the method for manufacturing the circuit board using the text printing screen have the following advantages: First, the text printing screen has a spacing opening, which is applicable to the first circuit board and the second circuit board. The ink is printed on the interval between the two, so that the gold plating is avoided in the spacer during the subsequent gold plating process, the use of the gold plating material is reduced, and the manufacturing cost of the circuit board is saved. Secondly, the printing ink of the pair of spacers is printed. The steps do not increase the manufacturing process of the circuit board; again, the technical solution does not affect the rigidity and continuity of the substrate during the production process, and thus does not affect the progress of other processes. [Embodiment] [0010] Embodiments of the present technical solution will be further described below with reference to the accompanying drawings. 096125610 Form No. A0101 Page 5 of 20 0993270775-0 1333819

[0011] Detailed description. 4- Reference to "1 and _2, the text printing screen 10 of the embodiment of the present technical solution is for performing a text printing process on the silk of the literary brush. The substrate 2G to be printed is a substrate that has been subjected to steps such as conductive line fabrication, via hole fabrication, solder mask printing, etc., and is ready for text printing. The text printing refers to correlating the corresponding area of the circuit board semi-finished product on the substrate. Printing of text or graphics. The substrate 20 may be a substrate suitable for a single-piece (Panel Form) production process, or a substrate suitable for a roll-to-roll (RTR) production process. The substrate 20 includes at least two circuit boards, and each of the circuit boards has a spacer 0. [0012] Referring to FIG. 2, in the embodiment, the substrate 2 is suitable for a roll-to-roll (rtr) production process. The substrate. The substrate 2 is elongated. The two sides have a plurality of chain holes 25 arranged in sequence, and the substrate 2 is transported from the unwinder or retracted to the rewinder. The substrate 20 includes a first circuit board 21, a spacer 23, and a second circuit board 22 in the direction in which the feed wheel is to be fed or the take-up direction of the take-up reel.

[0013] δ青 Referring to FIG. 1, the letter printing screen 1 corresponding to the substrate 2 〇 includes the first screen area 11, the L area 12, and the 1_port 13^ the first screen area 11 and the first board Corresponding to 21, the threat to the first circuit board 21 related text "printing of the pattern. The second halftone area 12 corresponds to the second circuit board 22, and the first circuit board 22 is printed in a letter or pattern. The spacing opening 13 is defined between the first screen area u and the second screen area 12, corresponding to the space 23 between the first circuit board 21 and the second circuit (four), and the ink is printed on the space 23 . 096125610 Form No. A0101 Page 6 of 20 0993270775-0 1333819 Changed page by glucoside on July 28, 099

[0014] The first screen area 11 and the second screen area 12 are each provided with a plurality of pattern openings 14, and the plurality of pattern openings 14 are printed with corresponding characters or patterns at predetermined positions of the circuit board. The shape and position of the pattern opening 14 depends on the specific needs of the board product. The pattern opening 14 can be a text, a trademark, a part number, or other corresponding content that indicates the type of the board product or the location in which the various parts are assembled. The pattern opening 14 can be located at the corner of the board product or at the center of the board product. Generally speaking, the arrangement of various part numbers (such as R representing the resistor, C of the capacitor, U of the integrated circuit, etc.) is from the upper left corner of the surface of the board, first to the right and then down, according to the parts. Mark and number are assigned separately.

[0015] The parameters such as the structure and size of the first screen area 11, the second screen area 12, and the spacing opening 13 correspond to the structure and size of the circuit board to be processed. For example, the first circuit board 21, the second circuit board 22, and the spacer 23 to be processed are each a rectangular parallelepiped shape. Accordingly, the first screen area 11 and the second screen area 12 are each a rectangular parallelepiped shape. Since the shape of the spacing opening 13 depends on the shape of the first screen area 11 and the second screen area 12, the spacing opening 13 is also rectangular in this embodiment. [0016] Generally, when the circuit board is mass-produced, the first circuit board 21 and the second circuit board 22 on the substrate 20 have the same structure, and therefore, the first screen area 11 and the second screen area of the text printing screen 10 12 structure is the same. Of course, the structure of the first screen area 11 and the second screen area 12 may be different according to specific production conditions. [0017] In addition, in order to facilitate batch printing of the circuit board, the substrate 20 may include more than two boards. And more than one spacer, correspondingly, the text printing screen 10 may include more than two screen areas and two or more 096125610 form number A0101 page 7 / total 20 pages 0993270775-0 1333819 interval opening . On July 28, 099, Junzheng hid the page to realize the simultaneous printing of more than two boards [0018]. The electric pole "external surface except the complex terminal name = Γ coated solder resist layer 26 to protect the conductive line. The terminal connection 24 of the coffee conductive connection welding L and the circuit board can be a plug-in end point, such as a side joint; = / end point 'such as a disk; can also be a contact end point or other end point 3 to avoid long The use of the terminal contact 24 for oxidation affects the impetuousness and safety of the conductive line, and it is necessary to apply a gold layer to the final wrap 24 after the text printing step to secure the termination point 24.

[0019] The text printing screen 10 of the present technical solution has a spacing of π13, which can be used to deposit the ink m between the substrate 20 and continue to the terminal contact 24 for gold treatment. Metallic inks are not easily plated with gold, thus avoiding unnecessary waste of gold-plated materials in production. In addition, since the cost of the ink is lower than that of the key gold material, the production cost of the circuit board can be reduced. [0022] [0023] [0023] [0023] 096125610 The technical solution also provides a method for manufacturing a circuit board by the (four) text printing screen 10, which mainly comprises the following steps: First step 'providing the substrate 2 to be printed as above Hey. The second step is to provide the above-mentioned text printing screen. In the second step, as shown in FIG. 3, the character printing screen 1〇 is aligned with the substrate 2〇, so that the first screen area Η corresponds to the first circuit board 21, and the second screen area 12 and the The two circuit boards 22 correspond to each other. The interval opening 13 between the first screen area 丨丨 and the second screen area 12 corresponds to the first circuit board 21 and the second circuit form number Α0101, page 8 / total 20 pages 0993270775- 0

1333.819 On July 28, 099, the spacer 23 between the replacement pages 22 was corrected. [0024] In the fourth step, a text printing process is performed. The ink is applied to the screen printing screen 10 by spraying, brushing or spin coating, so that the ink is formed on the first circuit board 21 by the pattern opening 14 on the first circuit board 21 and the second circuit board 22, The surface of the second circuit board 22 is formed in the spacer 23 by the spacing opening 13. Referring to FIG. 4, when the pattern opening 14 and the opening 13 are filled with ink, the ink is removed from the surface of the text printing screen 10.

[0025] In the fifth step, the character printing screen 10 and the substrate 20 are separated to obtain a substrate 20 on which the ink is printed. Referring to FIG. 5, a portion of the first circuit board 21 and the second circuit board 22 corresponding to the plurality of pattern openings 14 is formed with a plurality of ink-based text printing patterns 27, the shape of the plurality of character printing patterns 27 and the shape of the pattern opening 14. Corresponding. An ink layer 28 is formed on the spacer 23. The ink may be a thermosetting ink or an ultraviolet curable ink. Generally, the main component of the ink is epoxy resin.

[0027] After printing the ink, it is usually necessary to harden the ink. The hardening method of the ink should be selected according to the type of the ink, that is, the thermosetting ink should be hard-hardened, and the ultraviolet-curing ink should be hardened by ultraviolet irradiation. [0028] After the above process is completed, the substrate 20 needs to be gold-plated. , molding process to obtain circuit board products. [0029] Gold plating refers to the plating of a plurality of terminal contacts 24 of the substrate 20 with a gold layer to provide stable, reliable electrical contact of the terminal contacts 24. In order to prevent the mutual diffusion of atoms between the copper layer and the gold layer of the conductive line, and to strengthen the hardness of the gold layer 096125610 Form No. A0101 Page 9 / Total 20 pages 0993270775-0 1333819 099 July 28th Junzheng #^ page, A recording layer is typically applied to the termination end 24 prior to the gold plating layer. The thickness of the nickel layer is generally not more than 8 micrometers. The thickness of the gold layer is generally not more than 3 micrometers. [0030] The substrate after the completion of the gold deposit includes a plurality of circuit boards. In practical applications, a molding method is required to obtain a separate circuit board product. . Molding refers to cutting a substrate into separate circuit board products along the boundary of the board on the substrate by die blanking or tool milling. Referring to FIG. 6, the substrate 20 of the present embodiment can be cut into a single first circuit board 21, a second circuit board, and a spacer 23, and the first circuit board 21 and the second circuit board 22 are predetermined circuit board products. The compartment 23 is waste and can be discarded. [0031] In order to ensure that the resulting board product meets the predetermined requirements, the board product is also inspected. The inspection refers to performing the final electrical conduction, impedance test, solderability, and thermal shock reliability test on the first circuit board 21 and the second circuit board 22, and moderately controlling the first circuit board 21 and the first circuit board 22. The baking is performed to eliminate the moisture absorbed by the circuit boards 21 and 22 during the process and the thermal stress accumulated in the process, and finally the circuit board products can be packaged and shipped in a vacuum bag to complete the production. [0032] Of course, the substrate in the production process includes more than two circuit boards, so that when there is more than one between the two, the corresponding text printing screen should also include more than two screen areas and more than one. The openings are spaced apart to print the ink between the respective boards, thereby preventing the spacer from being plated with gold in the subsequent gold plating process. The method for producing a circuit board by the text printing screen and the printing text printing screen in the technical solution has the following advantages: First, the text printing screen plate 096125610 Form No. A0101 Page 10 / Total 20 pages 0993270775-0 [0033] 1333.819 On July 28, 099, the shuttle replacement page has a spacing opening, which can print ink on the interval between the first circuit board and the second circuit board, thereby avoiding gold plating on the spacer during the subsequent gold plating process. The layer reduces the use of the gold-plated raw material and saves the manufacturing cost of the circuit board. Secondly, the step of printing the ink in the spacer does not increase the manufacturing process of the circuit board; again, the technical solution does not affect the rigidity of the substrate during the production process. And continuity, so it will not affect the transmission and production of other processes.

[0034] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are intended to be included in the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0035] FIG. 1 is a schematic diagram of a text printing screen provided by an embodiment of the present technical solution. [0036] FIG. 2 is a schematic diagram of a substrate provided by an embodiment of the present technical solution.

3 is a schematic diagram of the text printing screen provided by the embodiment of the present invention aligned with the substrate. 4 is a schematic diagram of text printing on a substrate by a text printing screen provided by an embodiment of the present technical solution. [0038] FIG. [0039] FIG. 5 is a schematic diagram of a substrate after text printing provided by an embodiment of the present technical solution. 6 is a schematic view of a substrate provided by an embodiment of the present technical solution. 096125610 Form No. A0101 Page 11 / Total 20 Pages 0993270775-0 1333819 July 28th, 2008, the shuttle is replacing the page [0041] [0044] [0048] [0048] [0048] [0051] [0051] [Main component symbol description] Text printing screen: 10 First screen area: 11 Second screen area · 1 2 Spacer opening: 13 Pattern opening: 14 substrate :20 First board: 21 Second board: 22 Spacer: 2 3 Chain hole: 25 Solder mask: 26 Text printing pattern: 2 7 Ink layer: 28

096125610 Form No. A0101 Page 12 of 20 0993270775-0

Claims (1)

Revised replacement page, patent application scope on July 28, 099. A text printing screen includes at least a first screen area, at least a second screen area, and at least one of the first screen area and the second network. a gap between the layout areas, the first screen area is used for text printing on the first circuit board, and the first screen area is used for text printing on the second circuit board, the spacing opening is used for corresponding first a spacer between the circuit board and the second circuit board to print ink on the spacer. The text printing screen according to claim 1, wherein the first screen area 'the second screen area is provided with a pattern opening for printing the first circuit board and the second circuit board correspondingly. Text or pattern. The poor printing printing screen according to claim 1, wherein the first screen area and the second screen area have the same structure J. A text printing screen for performing a text printing process on a substrate The substrate includes at least one first circuit board, at least one second circuit board, and at least one space between the first circuit board and the second circuit board. The text printing screen includes at least one first screen area, at least a second screen area and at least one interval opening between the first screen area and the second screen area, the first screen area corresponding to the first circuit board, configured to perform the first circuit board In the text printing, the first screen area corresponds to the second circuit board for performing text printing on the second circuit board, and the spacing opening corresponds to the spacing area, and the ink is printed on the spacing area. The text printing screen as described in claim 4, wherein the text printing screen corresponds to the structure 'size of the substrate. The text printing screen according to claim 5, wherein the first screen area corresponds to the structure and size of the first circuit board, and the second screen form number A0101 is 13/20 Page 0993270775-0 1333819 The correction replacement page area corresponds to the structure and size of the first circuit board on July 28, 099, and the spacing opening corresponds to the structure and size of the space area. 7. A method of fabricating a circuit board, comprising the steps of: providing a substrate to be printed, the substrate comprising at least a first circuit board, at least one second circuit board, and at least one of the first circuit board and the second circuit board The space between them, Providing a text printing screen, comprising at least a first screen area, at least a second screen area, and at least one interval opening between the first screen area and the second screen area, the first screen area and the first The second screen area is respectively formed with a pattern opening, and the text printing screen of the item is aligned with the substrate, so that the first screen area corresponds to the first circuit board, and the second screen area corresponds to the second circuit board. The spacing opening corresponds to the spacing area; the ink is coated on the text printing screen so that the ink is formed on the surface of the first circuit board and the second circuit board by the pattern opening, and is formed in the spacing area by the spacing opening; The text printing screen and the substrate are separated to obtain a substrate on which the ink is printed on the surface; the substrate is subjected to gold plating and a molding process to obtain a first circuit board product and a second circuit board product. 8. The method of producing a circuit board according to claim 7, wherein the method of applying the ink is spraying, brushing or spin coating. 9. The method of producing a circuit board according to claim 7, wherein after the ink is applied, the step of hardening the ink is further included. 10. The method of producing a circuit board according to claim 9, wherein the hardening treatment method is heat hardening or ultraviolet irradiation hardening. 096125610 Form No. A0101 Page 14 of 20 0993270775-0