JP2001320173A - Circuit board member, method of manufacturing both- sided circuit board and method of manufacturing multilayer circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board member for improving the connection reliability in a via hole of the circuit board and for making the dimension of the via hole, and to provide a method of manufacturing a circuit board with high reliability by using the member for a circuit board. SOLUTION: In the circuit board member (1) formed by providing macromolecular films on both surfaces of a prepreg, a diamond-like carbon film layer (3a) is provided on both surfaces or one surface of the macromolecular film (2), and the surface of the macromolecular film (2) on the diamond-like carbon film layer side is contacted with the prepreg (4). By constituting this, there can be provided the circuit board member for improving the connection reliability of the circuit board and for making the dimension of the via hole. A through hole is formed on a prescribed position on the circuit board member, a conductive paste is applied to the through hole, and then the macromolecular film is removed from the circuit board member, thereby forming the prepreg. By using the prepreg formed in this way, the circuit board with high reliability can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board member for forming an insulating layer of a circuit board used in electronic equipment,
Also, the present invention relates to a manufacturing method for providing a double-sided circuit board and a multilayer circuit board on which electronic components can be mounted at a high density using the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller, lighter, and more sophisticated, circuit boards have been required to be smaller, lighter, have higher signal processing, and have a higher density. In response to such demands, it is necessary for the circuit board technology to rapidly develop a technology for increasing the number of layers, reducing the diameter of via holes, and finer circuit patterns. However, it is extremely difficult to satisfy these requirements any more with a multilayer circuit board in which electrical connection between layers is made by a conventional through-hole structure. Therefore, a circuit board having a new structure and a manufacturing method thereof have been developed.

[0003] One of the representative examples is that, instead of a through-hole structure which has conventionally been the mainstream of interlayer connection of circuit boards,
Complete I with electrical connection between layers secured by conductive paste
A circuit board having a VH (inner via hole) structure has been developed (JP-A-6-268345).

In this method of manufacturing a circuit board, there is a step for forming a via hole made of a conductive paste. In this step, a through hole is formed at a predetermined position of a prepreg having a polymer film on both sides by a laser or the like, and the through hole is filled with a conductive paste by printing or the like. In this step, the polymer film has a role of preventing the conductive paste from adhering to an insulating portion other than the through holes when the conductive paste is filled, and a role of preventing contamination during transportation.

After the conductive paste is filled, the polymer film is peeled off from the prepreg to obtain a prepreg having via holes filled with the conductive paste. Alternatively, a circuit board having a complete IVH structure can be provided by a multilayer board method and circuit patterning. The conventional polymer film used in this step is polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), or the like, and a release agent is applied to a surface in contact with the prepreg. Sometimes.

[0006]

However, when a through hole is formed by a laser or the like in a circuit board member provided with a polymer film on the prepreg, the polymer film shrinks, that is, the hole diameter decreases due to heat during processing. growing. This phenomenon is considered to be one of the factors that work disadvantageously when reducing the diameter of the via hole in the circuit board. Moreover, since these polymer films are thermoplastic, the prepreg and the polymer film may be fused by heat during processing. In such a case, the film cannot be promptly peeled from the prepreg in the step of peeling the film after printing the conductive paste.

Further, since these phenomena occur around the through-hole of the prepreg, if this phenomenon can be improved, the quality around the via hole of the circuit board will be improved. That is, the improvement in quality around the via hole leads to improvement in reliability and performance of the circuit board.

Therefore, the present invention solves the above-mentioned problems,
An object of the present invention is to provide a circuit board member capable of suppressing or preventing the above-described phenomenon, and to provide a manufacturing method for obtaining a highly reliable circuit board using the circuit board member.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a circuit board member provided with a polymer film on both sides of a prepreg. A diamond-like carbon film layer is provided, and the diamond-like carbon film layer is in contact with the prepreg. When a through-hole is formed by a laser or the like in the circuit board member having at least this configuration,
The diamond-like carbon film layer of the polymer film provided on the prepreg can dissipate excessive heat at the time of processing, and can suppress the shrinkage of the polymer film. By using this circuit board member, the diameter of the via hole in the circuit board can be reduced.

[0010] In addition to the heat dissipation during the processing described above, since the diamond-like carbon film layer exists between the polymer film and the prepreg, fusion between the polymer film and the prepreg can be prevented. . Therefore, when the polymer film having the diamond-like carbon film layer is peeled from the prepreg, the film can be quickly peeled without any torque due to fusion, and the periphery of the through hole is not damaged. Furthermore, since the hole quality around the through hole of the circuit board member is extremely good, the reliability of the circuit board can be improved by using the prepreg.

In the above-mentioned circuit board member, the diamond-like carbon film layer needs to have a thickness which can be processed by a laser or the like, and which has the above-mentioned effect.
It is preferably about 00 to 5000 °. Further, a layer made of a material other than the diamond-like carbon film, for example, a release layer or a resin layer, may be provided on the polymer film.

Further, the present invention provides a circuit board member having a through hole formed at a predetermined position, filling the through hole with a conductive paste, and then forming a polymer film having at least a diamond-like carbon film layer. A method for manufacturing a double-sided circuit board formed by exfoliating to obtain a prepreg, sandwiching the prepreg with a metal foil, and heating under pressure is provided. By this method, a highly reliable double-sided circuit board is manufactured. be able to.

Further, according to the present invention, a through hole is formed at a predetermined position of the circuit board member, a conductive paste is filled in the through hole, and then a polymer film having at least a diamond-like carbon film layer is formed. Peeling is obtained to obtain a prepreg, and a desired number of the prepreg and a circuit board having a circuit pattern are alternately arranged (arranged so that a metal foil is an outermost layer) and heated under pressure. The present invention provides a method for manufacturing a multilayer circuit board formed by the method described above, and a highly reliable multilayer circuit board can be manufactured by this method.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the circuit board member of the present invention will be described with reference to FIGS.

(Embodiment 1) FIG. 1 is a schematic view of a circuit board member of the present invention in which a polymer film is provided on both sides of a prepreg, and a diamond-like carbon film layer is provided on both sides or one side of the polymer film. It is sectional drawing. In FIG. 1, reference numeral 1 denotes a polymer film having a diamond-like carbon film layer, reference numeral 2 denotes the polymer film, reference numerals 3a and 3b denote diamond-like carbon film layers, and reference numeral 4 denotes a prepreg.

When a through hole is formed in the circuit board member having the structure of the present embodiment with a laser or the like, excessive heat during processing can be dissipated by the diamond-like carbon film layers 3a and 3b. The shrinkage of the polymer film 2 can be suppressed. Further, since the diamond-like carbon film layer 3a is located between the polymer film 2 and the prepreg 4, fusion between the polymer film 2 and the prepreg 4 can be prevented. Therefore, in order to exhibit these effects, only the diamond-like carbon film layer 3a is sufficient, and in the present invention, the diamond-like carbon film layer 3b may not be provided.

The diamond-like carbon films 3a and 3b preferably have a structure in which microcrystalline diamond is contained in amorphous carbon. The diamond-like carbon having a high density, for example, having a specific gravity of 2.0 g / cc or more is preferable because of its high thermal conductivity.

(Embodiment 2) FIG. 2 is a schematic sectional view of a configuration in which a release layer is added to the configuration of FIG. In FIG. 2, reference numeral 5 denotes a polymer film having a diamond-like carbon film layer and a release layer, and reference numeral 6 denotes the release layer. Other numbers are the same as those in FIG.

In the case where a through hole is formed by a laser or the like in the circuit board member having the structure of the present embodiment, excessive heat during processing can be dissipated by the diamond-like carbon film layers 3a and 3b. The shrinkage of the polymer film 2 can be suppressed. Further, since the diamond-like carbon film layer 3a is located between the polymer film 2 and the prepreg 4, fusion between the polymer film 2 and the prepreg 4 can be prevented. Therefore, in order to exhibit these effects, only the diamond-like carbon film layer 3a is sufficient, and in the present invention, the diamond-like carbon film layer 3b may not be provided.

In this embodiment, since the release layer 6 is provided between the diamond-like carbon film layer 3a and the prepreg 4, when the polymer film 5 is released from the prepreg 4, the release layer 6 is further removed. Can be easily done. The release layer 6 is formed by applying a release agent such as a fluorine-based or silicone-based release agent, or is formed by applying a surface treatment such as fluororesin processing, or is formed of a film having a release property such as polyethylene. Can be formed.

(Embodiment 3) FIG. 3 is a schematic sectional view of a configuration in which a resin layer is added to the configuration of FIG. In FIG. 3, reference numeral 7 denotes a polymer film having a diamond-like carbon film layer and a resin layer, and reference numeral 8 denotes the resin layer. Other numbers are the same as those in FIG.

When a through hole is formed in the circuit board member having the structure of the present embodiment by a laser or the like, excessive heat during processing can be dissipated by the diamond-like carbon film layers 3a and 3b. The shrinkage of the polymer film 2 can be suppressed. Further, since the diamond-like carbon film layer 3a is located between the polymer film 2 and the prepreg 4, fusion between the polymer film 2 and the prepreg 4 can be prevented. Therefore, in order to exhibit these effects, only the diamond-like carbon film layer 3a is sufficient, and in the present invention, the diamond-like carbon film layer 3b may not be provided.

The resin layer 8 is preferably made of a thermosetting resin. Specifically, the resin layer 8 is made of at least one selected from epoxy resin, phenol resin, polyimide resin, polyester resin, silicone resin and melamine resin. Is preferred. The thickness of the resin layer is usually 0.01 to 20 μm, preferably 0.1 to 5 μm.
μm.

(Embodiment 4) FIG. 4 is a schematic sectional view of a configuration in which a resin layer is added to the configuration of FIG. 2. In FIG. 4, reference numeral 9 denotes a polymer film provided with a diamond-like carbon film layer, a release layer, and a resin layer. Other numbers are the same as those in FIG. 1 and FIG.

This embodiment is a combination of the second and third embodiments, and the configuration and effects are the same.

In the first to fourth embodiments, the thickness of the diamond-like carbon film layer is preferably such that the circuit board member can be processed by a laser or the like and the above-mentioned effects can be obtained. Is preferably about 100 to 5000 °.

The diamond-like carbon film preferably has a structure in which amorphous carbon contains microcrystalline diamond. Further, the diamond-like carbon having a high density, for example, having a specific gravity of 2.0 g / cc or more is preferable because of high heat conductivity.

In the first to fourth embodiments, the prepreg 4 may be a prepreg generally used as a material for an insulating layer of a circuit board, and is mainly composed of at least one of a heat-resistant organic fiber and an inorganic fiber. It is preferable to use a composite material obtained by impregnating a woven or nonwoven fabric with a thermosetting resin and further semi-curing the impregnated resin.

The non-woven fabric may be formed by binding heat-resistant organic fibers and / or inorganic fibers with a thermosetting resin such as an epoxy resin or a melamine resin, or by binding with a thermoplastic resin, or Melting pulp or fibers bound with fibers can be used.

Specifically, the heat-resistant organic fiber is at least one selected from aromatic polyamide (aramid), aromatic polyester, polyphenylenebisoxazole (PBO), polyphenylenebisthiazole (PBZ) and the like.
More than seeds can be used.

The prepreg 4 may have a semi-cured adhesive layer on both sides of a high heat-resistant polymer film, and more specifically, a thermosetting adhesive on both sides of a polyimide film or an aramid film. May be applied to form a semi-cured state, or an adhesive film may be laminated on both surfaces of the film. As the adhesive, an epoxy resin, a polyimide resin, or the like is preferable.

In the first to fourth embodiments, as the polymer film 2, polyethylene naphthalate, polyphenylene sulphite, polyethylene terephthalate, polypropylene, polyphenylene oxide and the like can be used. The thickness of the polymer film 2 is usually 4 to
It is 100 μm, preferably 6 to 40 μm.

Further, it is not always necessary to provide films having the same structure on both surfaces of the prepreg 4 as in the first to fourth embodiments. For example, a polymer film having a diamond-like carbon film layer 1 is provided on one surface of a prepreg 4,
Further, a combination of providing a polymer film having a diamond-like carbon film layer 5 and a release layer on the opposite side may be performed, and the polymer films having the respective configurations shown in the first to fourth embodiments may be used. The prepreg 4 can be used in any combination.

The present invention is not limited to the first to fourth embodiments, and a layer other than the above-described layers may be provided on the polymer film 2, but the polymer film has at least a diamond-like carbon film layer. And the diamond-like carbon film layer needs to be located between the prepreg and the polymer film.

Next, an embodiment of a method of manufacturing a circuit board according to the present invention will be described.

(Embodiment 5) Next, a method for manufacturing a double-sided circuit board will be described as an embodiment of the method for manufacturing a circuit board according to the present invention.

A through hole is formed at a predetermined position of the circuit board member of the present invention shown in the above-described first to fourth embodiments using a laser or the like, and a conductive paste is printed in the through hole by a method such as printing. Fill.

Next, only the prepreg filled with the conductive paste is taken out from the circuit board member. That is, a prepreg filled with a conductive paste can be obtained by peeling a polymer film having a diamond-like carbon film layer or the like from the prepreg.

After the peeling step, a metal foil is placed on both sides of the prepreg filled with the conductive paste, and heated and pressed to integrate the prepreg and the metal foils on both sides thereof to obtain a laminate. it can.

Finally, by processing the metal foil to form a circuit pattern, a double-sided circuit board can be obtained.

(Embodiment 6) Next, a method for manufacturing a multilayer circuit board will be described as an embodiment of the method for manufacturing a circuit board of the present invention.

A through hole is formed at a predetermined position of the circuit board member of the present invention shown in the above-described first to fourth embodiments by using a laser or the like, and a conductive paste is formed in the through hole by a method such as printing. Fill.

Next, only the prepreg filled with the conductive paste is taken out from the circuit board member. That is, a prepreg filled with a conductive paste can be obtained by peeling a polymer film having a diamond-like carbon film layer or the like from the prepreg.

After the peeling step, a circuit board having a circuit pattern of two or more layers is sandwiched between two sheets of prepreg filled with a conductive paste, and further, both sides thereof are sandwiched between metal foils.
This is integrated by heating and pressing to obtain a laminated plate.

Finally, a multilayer circuit board can be obtained by processing the metal foil to form a circuit pattern. Note that by repeating this step a plurality of times, it is possible to easily realize a multi-layer circuit board.

(Embodiment 7) Another embodiment of the method for manufacturing a multilayer circuit board of the present invention will be described below.

A through hole is formed at a predetermined position of the circuit board member of the present invention shown in the above-described first to fourth embodiments by using a laser or the like, and a conductive paste is formed in the through hole by a method such as printing. Fill.

Next, only the prepreg filled with the conductive paste is taken out from the circuit board member. That is, a prepreg filled with a conductive paste can be obtained by peeling a polymer film having a diamond-like carbon film layer or the like from the prepreg.

After the peeling step, two or more circuit boards having a circuit pattern of two or more layers and a prepreg filled with the paste by the above method are reduced by one to one from the number of prepared circuit boards.
A large number of sheets are prepared, they are alternately arranged, and finally they are sandwiched between metal foils, and they are integrated by heating and pressing to obtain a laminated board.

Finally, a multilayer circuit board can be obtained by processing a metal foil to form a circuit pattern. Note that by repeating this step a plurality of times, it is easy to increase the multilayer of the circuit board.

In the fifth to seventh embodiments, when a through hole is formed at a predetermined position of the circuit board member, a laser can be used, but a drill may be used. As a laser, a carbon dioxide laser, a YAG laser, an excimer laser, or the like can be used.

In Embodiments 5 to 7, when a polymer film having a diamond-like carbon film layer or the like is peeled from a prepreg from a circuit board member, the circuit board member filled with the conductive paste is heated. The heating temperature is preferably 40 to 100 ° C.

In Embodiments 5 to 7, the conductive paste preferably comprises at least conductive particles and a thermosetting resin, and the conductive particles include gold, silver, copper, and the like.
Palladium, indium, and the like are preferable, and the thermosetting resin is preferably a liquid thermosetting resin, specifically, an epoxy resin. Alternatively, a commercially available solder paste may be used.

In Embodiments 5 to 7, the metal foil and the prepreg are integrated, but specifically, the metal foil is most preferably copper foil. Further, in Embodiments 5 to 7, using a metal foil, preferably a copper foil, on which a circuit pattern is formed in advance by etching or plating on the support, and integrating by heating and pressing, the support is removed. Thus, a double-sided or multilayer circuit board can be obtained. As a support, a metal plate such as aluminum or stainless steel, PPS
Alternatively, a heat-resistant polymer film such as PPO is preferable.

The present invention is not limited to the fifth to seventh embodiments, but can provide a double-sided or multilayer circuit board obtained by the manufacturing method of the present invention. Further, in the manufacturing method of the present invention, the polymer film provided on the circuit board member can serve as a mask film when filling the conductive paste.

When the polymer film is peeled off from the circuit board member of the present invention after printing the conductive paste, the prepreg and the polymer film are not fused at the through holes, so that the polymer film is promptly peeled off. Can be. For this reason,
Since unnecessary torque is not generated at the time of peeling, there is no damage to the periphery of the through hole forming the via hole of the circuit board. That is, by using the circuit board member and the circuit board manufacturing method of the present invention, a double-sided or multilayer circuit board having highly reliable via holes can be provided.

[0057]

EXAMPLE A prepreg used for a circuit board member of this example will be described. Papermaking is performed by a wet method using Kevlar fiber (fiber diameter: 1.5 denier, fiber length: 3 mm) manufactured by DuPont, and then, at a temperature of 300 ° C. and a pressure of 200 kg / c.
and calendered in m ² nonwoven aramid fabric (basis weight 72g
/ M ² , thickness 100 μm). F
An epoxy resin equivalent to R5 was impregnated and dried at 130 ° C. for 8 minutes to prepare a prepreg in which a non-woven fabric was impregnated with an epoxy resin in a semi-cured state (B stage). The composition of the used FR5 resin is shown below, and the resin amount of the prepreg is 54 ± 1 wt%.

35 parts by weight of brominated bisphenol A type epoxy resin (23% by weight of bromine, epoxy equivalent of 270) Trifunctional epoxy resin 35 parts by weight (23% by weight of bromine, epoxy equivalent of 270) 30 parts by weight of phenol novolac type curing agent (OH) (Equivalent 120) 2-Ethyl-4-methylimidazole 0.2 part by weight Examples of the circuit board member of the present invention will be described below.

(Example 1) A polyethylene terephthalate having a thickness of 15 µm was coated on both surfaces or one surface thereof with a thickness of 500 to 5000 mm by a plasma injection CVD method.
Was formed. Temperature 12
Roll lamination was performed on the prepreg at 0 ° C. and a pressure of 3 kg / cm ² to prepare a circuit board member.

(Example 2) A polyethylene terephthalate having a thickness of 15 µm was coated on both sides or one side thereof by plasma injection CVD to a thickness of 500 to 5000Å.
After the formation of the diamond-like carbon film layer, a silicone release agent was applied to one surface thereof (if the diamond-like carbon film layer is one surface, the surface of the diamond-like carbon film). This was roll-laminated at a temperature of 120 ° C. and a pressure of 3 kg / cm ² on the above prepreg such that the release surface was on the prepreg side, thereby producing a circuit board member.

(Example 3) A polyethylene terephthalate having a thickness of 15 µm was coated on both surfaces or one surface thereof by plasma injection CVD to a thickness of 500 to 5000Å.
After forming the diamond-like carbon film layer, an epoxy resin is applied on one surface thereof (if the diamond-like carbon film layer is one surface, on the opposite side to the diamond-like carbon film surface) so that the film thickness when dried becomes 1 μm. And dried. This is heated to
The laminate was roll-laminated on the prepreg at a temperature of 3 ° C. and a pressure of 3 kg / cm ^{2 so} that the surface of the epoxy resin layer was on the opposite side of the prepreg, thereby producing a circuit board member.

Example 4 Using the film provided with the diamond-like carbon film layer and the epoxy resin layer of Example 3, a silicone release agent was applied to the film surface opposite to the epoxy resin layer. This is at a temperature of 120 ° C and a pressure of 3 kg
/ Cm ² was roll-laminated on the prepreg so that the release surface was on the prepreg side, to produce a circuit board member.

Comparative Example 1 A silicone release agent was applied to one surface of a polyethylene terephthalate having a thickness of 15 μm. This was roll-laminated at a temperature of 120 ° C. and a pressure of 3 kg / cm ² on the above prepreg such that the release surface was on the prepreg side, thereby producing a circuit board member.

In the circuit board members of Examples 1 to 4 and Comparative Example 1, through holes having a diameter of 200 μm were formed using a carbon dioxide gas laser. Then, the diameter of the through-hole of the polymer film and the diameter of the through-hole of the prepreg were measured, and their ratio was determined. In Comparative Example 1, the hole diameter of the film was 1.2 times the hole diameter of the prepreg.
In contrast, in Examples 1 to 4, the hole diameter of the film was 1.1 times or less the hole diameter of the prepreg. The peelability of the polymer film was also evaluated. Regarding the releasability, the polymer film was peeled off by heating the circuit board member to 60 ° C., and the surface of the prepreg was observed to see whether or not the polymer film and the prepreg were fused. In the circuit board member of Comparative Example 1, fusion between the polymer film and the prepreg was observed, but in Examples 1 to 4, fusion between the polymer film and the prepreg was not observed.

When the thickness is 500 to 5000 °, the effect can be obtained regardless of the thickness of the diamond-like carbon film layer.
Further, the effect was obtained irrespective of the formation surface of the diamond-like carbon film layer (it is essential to provide the diamond-like carbon film layer on the prepreg side). However, for a sample having a diamond-like carbon film thickness of 100 to 500 °, no film fusion was performed, but the effect of suppressing the shrinkage of the polymer film was slightly reduced. Further, when the diamond-like carbon film layer has a double-sided structure and has a thickness of more than 5000 mm, the effect of suppressing film shrinkage and the effect of preventing fusion of the film are observed, but a large taper is formed in the through-hole of the circuit board member. . Therefore, the thickness of the diamond-like carbon film layer provided on the polymer film in the circuit board member of the present invention is preferably 500 to 5000 °.

In each of the samples, the effect was observed irrespective of the release layer provided other than the diamond-like carbon film layer. Further, the surface on which the diamond-like carbon film layer was formed (the diamond-like carbon film layer was provided on the prepreg side). This is essential), but the effect was seen.

As described above, in the present embodiment, regardless of the thickness and the formation surface of the diamond-like carbon film layer (the provision of the diamond-like carbon film layer on the prepreg side is essential), And the effect of preventing fusion between the polymer film and the prepreg can be realized. Note that the present invention is not limited to the configuration described in the present embodiment, but is a circuit board member having a polymer film on both sides of a prepreg, and at least a diamond-like member on both sides or one side of the polymer film. Any structure may be used as long as the carbon film layer is provided, and the polymer film has a diamond-like carbon film layer-side surface in contact with the prepreg.

Next, an embodiment of a method for manufacturing a double-sided and multilayer circuit board according to the present invention will be described.

First, the conductive paste used in this example and the comparative example will be described. The following materials were premixed with a Simpson mill for 15 minutes, and then
The paste was kneaded to prepare a conductive paste.

Copper powder (average particle size: 5 μm) 87.5 parts by weight Bisphenol F type epoxy resin 3.0 parts by weight Glycidyl esterified dimer acid epoxy resin 7.0 parts by weight Amine adduct type curing agent 2.5 parts by weight Examples of the double-sided circuit board of the present invention will be described below.

Example 5 A through-hole having a diameter of 200 μm was formed in the circuit board member manufactured in Example 1 by using a carbon dioxide gas laser, and the conductive paste was filled in the through-hole by a printing method. Subsequently, the circuit board member filled with the conductive paste was heated to 60 ° C. to peel off the polymer film. Next, a prepreg filled with conductive paste is sandwiched between copper foils having a thickness of 35 μm, and heated and pressed at a temperature of 200 ° C. and a pressure of 50 kg / cm ² for about 1 hour in a vacuum using a hot press to obtain a laminate. Was. A dry film was laminated on both sides of the laminate with a hot roll, a mask film having a desired pattern was arranged on the laminate, and the film was cured by exposure to ultraviolet light only in the circuit pattern portion. Thereafter, the film in the uncured portion was removed by a development treatment, and the copper foil other than the circuit pattern portion was etched with a copper chloride aqueous solution. Finally, the film of the circuit pattern portion was peeled off to produce a double-sided circuit board.

Example 6 A double-sided circuit board was manufactured in exactly the same manner as in Example 5 except that the circuit board member manufactured in Example 2 was used.

Example 7 A double-sided circuit board was manufactured in exactly the same manner as in Example 5 except that the circuit board member manufactured in Example 3 was used.

Example 8 A double-sided circuit board was manufactured in exactly the same manner as in Example 5 except that the circuit board member manufactured in Example 4 was used.

Comparative Example 2 A double-sided circuit board was produced in exactly the same manner as in Example 5, except that the circuit board member produced in Comparative Example 1 was used.

The double-sided circuit boards prepared in Examples 5 to 8 and Comparative Example 2 were subjected to a liquid phase thermal shock test (−65 ° C.).
(A temperature cycle of 125 ° C. for 5 minutes each) was performed 1000 times, and the resistance value of the via hole at that time was measured and evaluated. Samples were prepared by testing 50 double-sided circuit boards each having 500 via holes. as a result,
In Comparative Example 2, one out of 50 pieces showed a change rate of 10% or more, and 5 pieces showed a change rate of 5 to 10%. On the other hand, in the double-sided circuit board of this example, the change rate of all samples was 5% or less. Therefore, a highly reliable double-sided circuit board can be provided by using the circuit board member of the present embodiment and further manufacturing a double-sided circuit board by the manufacturing method of the present embodiment.

Hereinafter, examples of the member for a multilayer circuit board of the present invention will be described. First, a method for manufacturing a glass epoxy circuit board used in the following examples will be described.

A glass woven fabric was impregnated with an epoxy resin of FR5, dried at 130 ° C. for 8 minutes, and a prepreg (thickness 0.6 mm) impregnated with a semi-cured epoxy resin in a glass woven fabric (B stage) was obtained. Produced. Next, the prepreg was sandwiched between copper foils having a thickness of 18 μm, and heated and pressed at a temperature of 200 ° C. and a pressure of 30 kg / cm ² for about 1 hour in a vacuum using a hot press to obtain a laminate. A through hole having a diameter of 0.6 mm was formed at a predetermined position of the laminate using a drilling machine, and a copper plating film was formed on the inner wall of the through hole and the entire surface of the copper foil by copper plating.

Next, a dry film was laminated on both sides of the laminate by a hot roll, a mask film having a desired pattern was arranged on the laminate, and the film was cured only in the circuit pattern portion by exposing to ultraviolet light. Thereafter, the film in the uncured portion was removed by a development treatment, and the copper foil other than the circuit pattern portion was etched with a copper chloride aqueous solution.

Finally, the film of the circuit pattern portion was peeled off to produce a glass epoxy double-sided circuit board. In addition, the resin shown above was used for the composition of the used FR5 resin, and the resin amount of the prepreg was 45 ± 1 wt%.

Example 9 A through hole having a diameter of 200 μm was formed in the circuit board member manufactured in Example 1 with a carbon dioxide gas laser, and the conductive paste was filled in the through hole by a printing method. Subsequently, the circuit board member was heated to 60 ° C., the polymer film was peeled off, and a prepreg filled with a conductive paste was produced.

Next, the above-mentioned glass epoxy double-sided circuit board was sandwiched between the two prepregs, and both sides thereof were sandwiched between two 35 μm copper foils. The laminate was obtained by heating and pressing at 50 kg / cm ² for about 1 hour. A dry film was laminated on both sides of the laminate with a hot roll, a mask film having a desired pattern was arranged on the laminate, and the film was cured by exposure to ultraviolet light only in the circuit pattern portion.

Thereafter, the uncured portion of the film was removed by a developing treatment, and the copper foil other than the circuit pattern portion was etched with a copper chloride aqueous solution. Finally, the film of the circuit pattern portion was peeled off to produce a four-layer circuit board.

In this manufacturing method, a six-layer circuit board can be manufactured by using the four-layer circuit board manufactured by this manufacturing method instead of the glass epoxy double-sided circuit board, and by repeating this manufacturing method. A multilayer substrate having a desired number of layers can be obtained. Also, instead of a glass epoxy double-sided circuit board, a glass epoxy multilayer circuit board,
Alternatively, a double-sided or multilayer circuit board obtained by the production method of the present invention can be used.

Example 10 A multilayer circuit board was manufactured in exactly the same manner as in Example 9 except that the circuit board member manufactured in Example 2 was used.

Example 11 A multilayer circuit board was manufactured in exactly the same manner as in Example 9 except that the circuit board member manufactured in Example 3 was used.

(Example 12) A multilayer circuit board was manufactured in exactly the same manner as in Example 9 except that the circuit board member manufactured in Example 4 was used.

Comparative Example 3 A multilayer circuit board was manufactured in exactly the same manner as in Example 9 except that the circuit board member manufactured in Comparative Example 1 was used.

The liquid-phase thermal shock test (−65) was performed on the multilayer circuit boards prepared in Examples 9 to 12 and Comparative Example 3.
(Temperature cycle of 5 ° C. to 125 ° C., 5 minutes each), and the resistance value of the via hole at that time was measured and evaluated. The sample was a multilayer circuit board having 500 via holes, and 50 samples were prepared and tested. As a result, in Comparative Example 3, 3 out of 50 pieces were 10% or more and 8
The individual showed a change rate of 5 to 10%. On the other hand, in the multilayer circuit board of this embodiment, the total number of all the samples was 5%.
The rate of change was as follows. Therefore, a highly reliable multilayer circuit board can be provided by using the circuit board member of the present embodiment and further manufacturing a multilayer circuit board by the manufacturing method of the present embodiment.

Example 13 A through-hole having a diameter of 200 μm was formed in the circuit board member manufactured in Example 1 using a carbon dioxide gas laser, and the conductive paste was filled in the through-hole by a printing method. Subsequently, the circuit board member is heated to 60 ° C.
The polymer film was peeled off to prepare a prepreg filled with a conductive paste.

Next, this prepreg is sandwiched between the above two glass epoxy double-sided circuit boards, and both outer sides thereof are made of the same two-sided epoxy.
Sandwiched between two prepregs.
It was sandwiched between copper foils of 5 μm. The laminate was obtained by heating and pressing at a temperature of 200 ° C. and a pressure of 50 kg / cm ² for about 1 hour in a vacuum using a hot press. A dry film was laminated on both sides of the laminate with a hot roll, a mask film having a desired pattern was arranged on the laminate, and the film was cured by exposure to ultraviolet light only in the circuit pattern portion.

Thereafter, the uncured portion of the film was removed by a developing treatment, and the copper foil other than the circuit pattern portion was etched with a copper chloride aqueous solution. Finally, the film of the circuit pattern portion was peeled off to produce a six-layer circuit board.

According to this manufacturing method, a desired number of glass epoxy double-sided or multi-layer circuit boards and prepregs are alternately arranged and finally sandwiched by a copper foil to obtain a multi-layer circuit having a desired number of layers. A substrate can be manufactured. Further, a double-sided or multilayer circuit board obtained by the manufacturing method of the present invention can be used.

(Example 14) A multilayer circuit board was manufactured in exactly the same manner as in Example 13 except that the circuit board member manufactured in Example 2 was used.

Example 15 A multilayer circuit board was manufactured in exactly the same manner as in Example 13 except that the circuit board member manufactured in Example 3 was used.

Example 16 A multilayer circuit board was manufactured in exactly the same manner as in Example 13 except that the circuit board member manufactured in Example 4 was used.

Comparative Example 4 A multilayer circuit board was manufactured in exactly the same manner as in Example 13 except that the circuit board member manufactured in Comparative Example 1 was used.

For the multilayer circuit boards produced in Examples 13 to 16 and Comparative Example 4, a liquid phase thermal shock test (-6
5 ° C. to 125 ° C., 5 minutes each)
The cycle was performed, and the resistance value of the via hole at that time was measured and evaluated. The sample was a multilayer circuit board having 500 via holes, and 50 samples were prepared and tested. As a result, in Comparative Example 4, 2 out of 50 pieces were 10% or more,
The individual showed a change rate of 5 to 10%. On the other hand, in the multilayer circuit board of this embodiment, the total number of all the samples was 5%.
The rate of change was as follows. Therefore, a highly reliable multilayer circuit board can be provided by using the circuit board member of the present embodiment and further manufacturing a multilayer circuit board by the manufacturing method of the present embodiment.

The use of the circuit board member of the present invention is as follows.
The present invention is not limited to the manufacturing method of this embodiment. Also,
The method for manufacturing double-sided and multilayer circuit boards of the present invention is not limited to the manufacturing method of this embodiment.

[0100]

As described above, according to the present invention, in a circuit board member having a polymer film on both surfaces of a prepreg, at least a diamond-like carbon film layer is provided on both surfaces or one surface of the polymer film, When the through-hole is formed by a laser or the like in the circuit board member by positioning the surface of the polymer film on the diamond-like carbon film layer side on the prepreg side, the diamond-like carbon of the polymer film provided on the prepreg is formed. The film layer can dissipate excessive heat during processing, and can further suppress or prevent the shrinkage of the polymer film. Further, since the diamond-like carbon film layer exists between the polymer film and the prepreg, fusion between the polymer film and the prepreg can be prevented. Therefore, by using this circuit board member, the diameter of the via hole of the circuit board can be reduced, and the connection reliability of the via hole of the circuit board can be further improved. As a result, the reliability of the circuit board can be improved. it can.

Further, using the circuit board member of the present invention,
A through hole is formed at a predetermined position of the member, a conductive paste is filled into the through hole, and then a polymer film having at least a diamond-like carbon film layer is peeled to obtain a prepreg, and the prepreg is formed of a metal foil. And a method for manufacturing a double-sided circuit board formed by heating under pressure, whereby a highly reliable double-sided circuit board can be manufactured.

Further, using the circuit board member of the present invention,
A through hole is formed at a predetermined position of the member, a conductive paste is filled into the through hole, and then a polymer film having at least a diamond-like carbon film layer is peeled to obtain a prepreg, and the prepreg and a circuit pattern are obtained. A method for manufacturing a multilayer circuit board formed by alternately arranging a desired number of circuit boards having two or more layers and arranging them so that the metal foil is the outermost layer, and by heating under pressure. In addition, a highly reliable multilayer circuit board can be manufactured by this method.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a circuit board member according to Embodiment 1 of the present invention.

FIG. 2 is a schematic sectional view of a circuit board member according to Embodiment 2 of the present invention.

FIG. 3 is a schematic cross-sectional view of a circuit board member according to Embodiment 3 of the present invention.

FIG. 4 is a schematic sectional view of a circuit board member according to a fourth embodiment of the present invention.

[Explanation of symbols]

Reference Signs List 1 polymer film provided with diamond-like carbon film layer 2 polymer film 3a diamond-like carbon film layer in contact with prepreg 3b diamond-like carbon film layer located on opposite side of prepreg 4 prepreg 5 diamond-like carbon film layer and mold release Polymer film provided with layer 6 Release layer 7 Polymer film provided with diamond-like carbon film layer and resin layer 8 Resin layer 9 Polymer film provided with diamond-like carbon film layer, release layer and resin layer

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Fumio Echigo 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E317 AA24 CC25 CD21 CD27 CD32 GG17 5E346 AA42 AA43 CC08 CC16 EE09 GG15 HH07 HH17

Claims (12)

[Claims] 1. A member for a circuit board comprising a polymer film on both surfaces of a prepreg, wherein a diamond-like carbon film layer is provided on both surfaces or one surface of the polymer film, and a diamond formed on the polymer film is provided. A member for a circuit board, wherein the surface on the side of the carbon film layer contacts the prepreg. 2. The circuit board member according to claim 1, wherein a release layer is provided on the outermost layer on the side of the polymer film in contact with the prepreg. 3. The circuit board member according to claim 1, wherein a layer mainly composed of a thermosetting resin is provided on the surface of the polymer film opposite to the surface in contact with the prepreg. 4. The circuit board according to claim 3, wherein the thermosetting resin is at least one selected from an epoxy resin, a phenol resin, a polyimide resin, a polyester resin, a silicone resin and a melamine resin. Element. 5. A diamond-like carbon film layer having a thickness of 100 to 100.
The circuit board member according to any one of claims 1 to 4, wherein the angle is 5000 °. 6. The prepreg is a composite material obtained by impregnating a woven or non-woven fabric containing at least one of heat-resistant organic fibers and inorganic fibers as a main component with a thermosetting resin to make a semi-cured state. Item 6. A circuit board member according to any one of Items 1 to 5. 7. The circuit board member according to claim 6, wherein the heat-resistant organic fiber is at least one selected from aromatic polyamide, aromatic polyester, polyphenylene benzobisoxazole, and polyphenylene benzobisthiazole. . 8. The composite material according to claim 1, wherein the prepreg is provided with an adhesive layer on both sides of a heat-resistant polymer film, and is a composite material in which the adhesive is in a semi-cured state. 4. The circuit board member according to claim 1. 9. The circuit board member according to claim 1, wherein the polymer film is selected from polyethylene naphthalate, polyphenylene sulphite, polyethylene terephthalate, polypropylene, and polyphenylene oxide. 10. A step of forming a through hole in a predetermined position of the circuit board member according to claim 1, a step of filling the through hole with a conductive paste, and Removing a polymer film from the filled circuit board member to obtain a prepreg, arranging metal foils on both surfaces of the prepreg, and then heating and pressing to obtain a laminate, A method for manufacturing a double-sided circuit board, comprising a step of forming a pattern. 11. A step of forming a through hole at a predetermined position of the circuit board member according to claim 1, a step of filling the through hole with a conductive paste, and a step of filling the through hole with a conductive paste. A step of peeling a polymer film from the filled circuit board member to obtain a prepreg, arranging the prepregs on both surfaces of at least two or more circuit boards having a circuit pattern, and further, an outer surface side of the prepreg A method for manufacturing a multilayer circuit board, comprising: repeating a step of obtaining a laminated board by arranging metal foils on each of the above and heating and pressing to form a circuit pattern on the laminated board at least once or more. 12. A step of forming a through hole at a predetermined position of the circuit board member according to claim 1, a step of filling the through hole with a conductive paste, and a step of filling the conductive paste with the conductive paste. A step of removing a polymer film from the filled circuit board member to obtain a prepreg, at least two or more circuit boards having at least two circuit patterns, and one more than the number of the circuit boards The prepreg and the prepreg are alternately arranged, and furthermore, after arranging the metal foil at the outermost position, a step of obtaining a laminated board by heating and pressing and thermocompression, and at least a step of forming a circuit pattern on the laminated board A method for manufacturing a multilayer circuit board, comprising: