CN111465168A - Method for improving deviation of pressed buried copper block - Google Patents
Method for improving deviation of pressed buried copper block Download PDFInfo
- Publication number
- CN111465168A CN111465168A CN202010147594.4A CN202010147594A CN111465168A CN 111465168 A CN111465168 A CN 111465168A CN 202010147594 A CN202010147594 A CN 202010147594A CN 111465168 A CN111465168 A CN 111465168A
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- Prior art keywords
- copper
- block
- embedded
- buried
- supporting
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention discloses a method for improving the deviation of a pressed copper block, which comprises the following steps: after the core plate and the PP sheet are cut, windowing is carried out on the core plate and the PP sheet at positions corresponding to the copper blocks, and a plurality of convex columns which are convex and vertically arranged along the wall surface are arranged on the wall surface at intervals around the window; in the pressing process, the core plate and the PP sheet are sequentially overlapped according to requirements, copper-embedded groove holes are formed at corresponding windowing positions, then copper-embedded blocks are placed in the copper-embedded groove holes and placed among the surrounding convex columns, and then pressing is carried out. According to the invention, the plurality of supporting convex points are arranged on the peripheral wall surface of the formed copper-embedded groove hole at intervals to position the copper-embedded block, so that the copper-embedded block is limited between the convex columns, gaps for filling glue are formed between the whole body of the copper-embedded block and peripheral plates, the peripheral filling glue of the copper-embedded block is good, various quality problems caused by poor filling glue of the peripheral filling glue of the copper-embedded block are solved, and the quality of the pressed copper-embedded plate is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for improving the deviation of a pressed copper-buried block.
Background
With the ever-increasing integration of electronic systems, circuit boards are becoming more and more integrated and functional. Meanwhile, with the coming of the 5G era, the application of high-frequency and high-speed products is more and more extensive; therefore, the application of heat dissipation technology in the PCB industry is increasing, and relatively speaking, it is a good choice to adopt an embedded copper block (buried copper block or buried copper for short) in the PCB based on the good heat dissipation performance of the copper block.
In the manufacturing process of the printed circuit board, the heat dissipation performance of copper is stronger than that of solidified PP, resin, printing ink and the like, a high-end PCB product rapidly generates heat under the high-voltage high-frequency and long-time electric action, the heat has serious loss on a machine, and in order to improve and increase the heat dissipation function, a square copper block is buried in the area of the high-end product under an SMT paster; the copper block embedding process is to notch a PCB where components or chips are mounted, put a copper block in the notch during board stacking, and then press the copper block together with a core board and a prepreg, wherein the PCB can be called as a copper plate.
The design idea of the embedded copper plate in the prior art is to directly open a groove on a core plate, wherein the size of the groove is slightly larger than that of the embedded copper block, and the shape of the groove is the same as that of the embedded copper block; in fact, the copper-embedded block cannot be fixed by the groove, the copper-embedded block can move freely in the groove, the side wall of the copper-embedded block is easy to lean against the side with the long side or the short side, so that gaps for filling glue are not formed between the copper-embedded block and surrounding plates or the gap difference is large, the pp glue amount to be filled is inconsistent, and as a result, the defects of sinking, hollowing, excessive glue overflow or copper skin foaming in a later process are generated at the periphery of the copper-embedded block due to poor glue filling.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method for improving the deviation of a pressed embedded copper block, which ensures that the peripheral filling glue of the embedded copper block is good by positioning the position of the embedded copper block in a groove, thereby solving various quality problems caused by poor filling glue of the peripheral of the embedded copper block and improving the quality of the pressed embedded copper plate.
In order to solve the technical problem, the invention provides a method for improving the deviation of a pressed and embedded copper block, which comprises the following steps:
s1, after the core board and the PP sheet are cut, windowing is carried out on the core board and the PP sheet at positions corresponding to the copper blocks;
s2, in the pressing procedure, the core plate and the PP sheet are sequentially overlapped according to requirements to form copper-embedded slotted holes at the corresponding windowing positions, and then are riveted and fixed by rivets;
s3, arranging a plurality of arc-shaped supporting salient points at intervals in the middle of the inner wall of the periphery of the copper-embedded groove hole;
s4, placing the copper embedding block into the copper embedding groove hole, placing the copper embedding block between the supporting salient points on the periphery, enabling gaps to exist between the periphery of the copper embedding block and the wall surface of the copper embedding groove hole, and then pressing.
Further, in step S1, the size of the window is larger than the size of the copper embedded block.
Furthermore, the size unilateral of windowing is greater than the size of copper embedding piece by 0.5 mm.
Furthermore, one end of the supporting salient point is a plane, the other end of the supporting salient point is a spherical surface, and the plane of the supporting salient point is pasted on the wall surface around the copper-embedded groove hole.
Further, the vertical height from the plane of the support salient point to the top point of the spherical surface is 0.1 mm.
Further, when the shape of the copper embedding block and the copper embedding groove hole is circular, the radius of the window is 0.25mm larger than the radius of the copper embedding block, the number of the supporting salient points is four, and the four supporting salient points are distributed in the middle of the circumferential wall surface in the copper embedding groove hole in an annular array equidistant interval mode.
Furthermore, when the embedded copper block and the embedded copper slot are square, the supporting salient points are arranged at the centers of four wall surfaces around the embedded copper slot.
Further, in step S3, the supporting bumps are adhered to the peripheral wall surfaces of the copper-embedded slots by glue.
Furthermore, the supporting salient points are made of soft rubber.
Further, in step S1, before the window is opened, an inner layer circuit is formed on the core board.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, after the core plate and the PP are superposed and riveted into a whole, the embedded copper blocks are positioned by arranging the plurality of supporting convex points on the peripheral wall surfaces of the formed embedded copper slot holes at intervals, so that the embedded copper blocks are limited between the supporting convex points, gaps for filling are formed between the whole bodies of the embedded copper blocks and peripheral plates, the peripheral filling of the embedded copper blocks is good, the problem of large difference of the distances between the copper blocks and two sides of the edge of the groove is reduced, various quality problems caused by poor filling of the peripheral filling of the embedded copper blocks are solved, and the quality of the laminated embedded copper plates is improved; in addition, the supporting salient points are fixed on the wall surface in a later stage in an additional fixing mode, compared with a mode that convex columns are milled on the inner wall of each core plate and PP when windows are directly opened on each core plate and PP, the convex column milling mode is slow in efficiency and complex in process, and the problem that copper blocks cannot be placed into copper-embedded slotted holes in the later stage due to the fact that the convex column milling process is easily influenced by process error displacement is solved; according to the invention, through controlling the thickness, size and number of the supporting salient points, glue overflow caused by excessive PP glue amount due to the added supporting salient points is avoided, so that the risk of quality hidden trouble is reduced.
Drawings
FIG. 1 is a schematic view illustrating an embodiment of adhering a supporting bump on an inner wall of a buried copper slot;
FIG. 2 is a schematic diagram of the embodiment after the copper block is placed in the copper slot.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and explained with reference to the accompanying drawings and specific embodiments.
Examples
The method for manufacturing the copper-embedded circuit board in this embodiment can realize the positioning of the embedded copper block, and sequentially includes the following processing steps:
(1) cutting, namely cutting a core plate and a PP sheet according to the size of a jointed board of 320mm × 420mm, wherein the thickness of the core plate is 0.5mm, and the thickness of the outer copper surface of the core plate is 0.5 OZ.
(2) And manufacturing an inner layer circuit (negative film process): coating a photosensitive film on the core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of an inner layer circuit by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching an inner layer circuit on the exposed and developed core plate, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And brown oxidation: and carrying out brown oxidation treatment on the copper block for enhancing the binding force between the copper block and the prepreg in the later period.
(4) And windowing: windowing is carried out on the positions, corresponding to the copper embedding blocks, of the core plate and the PP sheet; when the window is opened, a 0.5-2.4 mm milling cutter is used for slotting, but a 0.8-1.0 mm milling cutter is preferred.
When the embedded copper block is circular, the radius of the window is 0.25mm larger than that of the embedded copper block; when the embedded copper block is square, the size of the window is 0.5mm larger than that of the embedded copper block on one side; in this embodiment, the shape of the window is square.
(5) And (3) superposing: the browning speed is browned according to the thickness of the copper at the bottom, a plurality of core plates and a plurality of PP sheets are overlapped in sequence in a staggered mode according to requirements, copper-embedded slotted holes are formed at the positions, corresponding to the core plates and the PP sheets, of windows, and then the laminated plates are fixed together in a riveting and fusing mode through rivets.
The mode of plate stacking can be Pin-L am, riveting + Pin-lam and fusing + Pin-lam.
(6) And pasting: an arc-shaped supporting salient point 2 (shown in figure 1) is pasted at the central points of four inner walls around the copper-embedded groove hole 1 through glue, and is used for reducing the moving space of a copper-embedded block, so that the copper-embedded block is centered, and the problem of large distance difference between the copper block and two sides of a groove is solved; in other embodiments, when the copper buried slot is circular, the number of the supporting protrusions is also four, and the four supporting protrusions are distributed in the middle of the circumferential wall surface of the copper buried slot in a circular array at equal intervals.
In the above, one end of the supporting salient point is a plane, the other end is a spherical surface, the plane of the supporting salient point is adhered to the wall surface around the copper-embedded groove hole, and the vertical height from the plane to the top point of the spherical surface in the supporting salient point is 0.1mm, namely the thickness of the supporting salient point is 0.1mm, because the single side of the windowing size is 0.5mm larger than that of the copper-embedded block, the distance between the two symmetrically arranged supporting salient points is also larger than the size of the copper-embedded block, so that the copper-embedded block can be placed in the copper-embedded groove hole; through the thickness, size and the quantity of control support bump, avoid causing the excessive glue that causes of PP volume to overflow to glue because of the support bump that increases to the hidden danger risk of quality has been reduced.
In the above, the supporting salient points are made of PP soft rubber, have certain elastic deformation characteristic and are convenient for placing the embedded copper blocks.
(7) And pressing: the copper embedding block 3 is placed in the copper embedding groove hole and is placed between the supporting salient points on the periphery (as shown in figure 2), and gaps for filling glue are formed between the whole body of the copper embedding block and the plates on the periphery due to the limiting effect of the supporting salient points, so that the filling glue on the periphery of the copper embedding block is good, various quality problems caused by poor filling glue on the periphery of the copper embedding block are solved, and the quality of the copper embedding plate after being pressed is improved; when the outer layer copper foil is not needed to be laminated, the laminated plate with the embedded copper blocks is directly laminated to form a multilayer plate; when an outer copper foil is needed to be laminated, the laminated plate is laminated with a prepreg and an outer copper foil (the outer copper foil, the prepreg, the laminated plate, the prepreg and the outer copper foil are generally arranged in sequence) according to requirements, and then the laminated plate is laminated under proper laminating conditions according to the characteristics of the plate to form the multilayer plate.
(8) And outer layer drilling, namely drilling by using drilling data.
(9) And copper deposition, namely metallizing the holes on the multilayer board, and testing the backlight to 10 levels, wherein the thickness of the copper deposition in the holes is 0.5 mu m.
(10) And electroplating the whole plate: the plate was electroplated for 20min at a current density of 1.8 ASD.
(11) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer circuit exposure by using a full-automatic exposure machine and a positive film circuit film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit pattern on the multilayer board through development; and (3) outer-layer pattern electroplating, then respectively plating copper and tin on the multilayer board, wherein the copper plating is performed for 60min by using a current density of 1.8ASD, the tin plating is performed for 10min by using a current density of 1.2ASD, the tin thickness is 3-5 mu m, then film stripping, etching and tin stripping are performed in sequence, an outer-layer circuit and an outer-layer AOI are etched on the multilayer board, then defects of the outer-layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, are detected, the defective scrapping treatment is performed, and the product without defects is discharged to the next process.
(12) Solder resist and silk screen printing of characters: according to the prior art and according to the design requirements, a solder mask is manufactured on a multilayer board and characters are silk-screened.
(13) Surface treatment (nickel-gold deposition): the copper surface of the solder resisting windowing level is communicated with a chemical principle, and nickel and gold with certain required thickness are uniformly deposited.
(14) And forming: and (4) routing the shape according to the design requirement according to the prior art to obtain the buried copper circuit board.
(15) And electrical performance testing: detecting the electrical performance of the step plate, and enabling the qualified circuit board to enter the next processing link;
(16) and final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A method for improving the deviation of a pressed buried copper block is characterized by comprising the following steps:
s1, after the core board and the PP sheet are cut, windowing is carried out on the core board and the PP sheet at positions corresponding to the copper blocks;
s2, in the pressing procedure, the core plate and the PP sheet are sequentially overlapped according to requirements to form copper-embedded slotted holes at the corresponding windowing positions, and then are riveted and fixed by rivets;
s3, arranging a plurality of arc-shaped supporting salient points at intervals in the middle of the inner wall of the periphery of the copper-embedded groove hole;
s4, placing the copper embedding block into the copper embedding groove hole, placing the copper embedding block between the supporting salient points on the periphery, enabling gaps to exist between the periphery of the copper embedding block and the wall surface of the copper embedding groove hole, and then pressing.
2. The method as claimed in claim 1, wherein in step S1, the window is larger than the buried copper block.
3. The method as claimed in claim 2, wherein the one side of the window is 0.5mm larger than the buried copper block.
4. The method as claimed in claim 1, wherein the supporting protrusions have a flat surface at one end and a spherical surface at the other end, and the flat surfaces of the supporting protrusions are adhered to the peripheral wall surfaces of the embedded copper slot holes.
5. The method as claimed in claim 4, wherein the vertical height from the plane of the supporting bump to the top of the spherical surface is 0.1 mm.
6. A method as claimed in any one of claims 1 to 5, wherein when the shape of the buried copper block and the buried copper slot is circular, the radius of the window is 0.25mm larger than the radius of the buried copper block, and the number of the supporting protrusions is four, and the four supporting protrusions are distributed in the middle of the circumferential wall surface of the buried copper slot in a circular array at equal intervals.
7. A method for improving the misalignment of a pressed copper buried block according to any one of claims 1 to 5, wherein when the shape of the copper buried block and the copper buried slot is square, one supporting bump is provided at the center of four walls around the copper buried slot.
8. The method as claimed in claim 1, wherein in step S3, the supporting protrusions are adhered to the peripheral walls of the copper embedded slots by glue.
9. The method as claimed in claim 1, wherein the supporting bumps are made of soft plastic.
10. The method as claimed in claim 1, wherein in step S1, before the window is opened, an inner layer circuit is formed on the core board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010147594.4A CN111465168A (en) | 2020-03-05 | 2020-03-05 | Method for improving deviation of pressed buried copper block |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010147594.4A CN111465168A (en) | 2020-03-05 | 2020-03-05 | Method for improving deviation of pressed buried copper block |
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| CN111465168A true CN111465168A (en) | 2020-07-28 |
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| CN202010147594.4A Pending CN111465168A (en) | 2020-03-05 | 2020-03-05 | Method for improving deviation of pressed buried copper block |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194600A (en) * | 2021-04-27 | 2021-07-30 | 四川普瑞森电子有限公司 | Copper block embedding tool and method for circuit board |
| TWI749954B (en) * | 2020-12-18 | 2021-12-11 | 健鼎科技股份有限公司 | Method for manufacturing circuit board with embedded copper block structure |
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| CN208300107U (en) * | 2018-04-24 | 2018-12-28 | 深圳市丰达兴线路板制造有限公司 | A kind of multilayer circuit board |
| CN208956361U (en) * | 2018-09-06 | 2019-06-07 | 东莞市普上实业有限公司 | A kind of PCB substrate formula power supply |
| CN110708873A (en) * | 2019-09-20 | 2020-01-17 | 深圳崇达多层线路板有限公司 | Manufacturing method for realizing positioning of embedded copper block |
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| US20040156175A1 (en) * | 2002-11-26 | 2004-08-12 | Nokia Corporation | Heat dissipating structure of printed circuit board and fabricating method thereof |
| CN101384134A (en) * | 2008-10-09 | 2009-03-11 | 敬鹏(常熟)电子有限公司 | Method for embedding heat conductive element on circuit board |
| CN202535637U (en) * | 2012-04-27 | 2012-11-14 | 深圳市盛创新精密电子有限公司 | Printed circuit board with good heat dissipation effect |
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| TWI749954B (en) * | 2020-12-18 | 2021-12-11 | 健鼎科技股份有限公司 | Method for manufacturing circuit board with embedded copper block structure |
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Application publication date: 20200728 |