CN206004995U - A kind of multilayer circuit board - Google Patents
A kind of multilayer circuit board Download PDFInfo
- Publication number
- CN206004995U CN206004995U CN201621012156.2U CN201621012156U CN206004995U CN 206004995 U CN206004995 U CN 206004995U CN 201621012156 U CN201621012156 U CN 201621012156U CN 206004995 U CN206004995 U CN 206004995U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- multilayer circuit
- cavity
- wiring board
- backplate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of multilayer circuit board of multilayer circuit board technical field，Including backplate，The top of described backplate is provided with cavity，The left and right sides wall of described cavity is provided with locating dowel，The left and right sides wall of described backplate is provided with louvre，Compared with existing multilayer circuit board，This utility model structure is simple，There is good radiating effect，Instead of conventional in plate face，And this open up single registration holes and carry out the mode of para-position to easily cause para-position direction unclear，Bit errors are larger，Matched with the size of monolayer wiring board group by cavity，Make to be not in dislocation during para-position，Which reduces bit errors，And on the basis of original multilayer circuit board，This utility model increased multiple heat abstractors，As louvre and radiating groove，And locating dowel is also adopted by thermal grease post，Make multilayer circuit board has good radiating effect.
Description
Technical field：
This utility model is related to multilayer circuit board technical field, specially a kind of multilayer circuit board.
Background technology：
1961, the U.S. was the pioneer first opening multi-layer sheet exploitation, this kind of mode with make multilamellar using plated-through-hole legal system now
The mode of plate is almost identical.Behind Japanese this field across foot in 1963, relevant multiple-plate various conception schemes, manufacture method, then
Gradually popularize in the whole world.Because marching toward the IC epoch with by electric crystal, after the application of computer is increasingly popular, because of Gao Gong
The demand of energyization becomes multiple-plate demand emphasis so that wiring capability is big, transmission characteristic is good.Multi-layer sheet was with gap method originally
Method, Layer increasing method, the logical three kinds of manufacture methods of method of plating are disclosed.When very being taken a lot of work on manufacturing due to clearance hole method, and densification is subject to
Limit, therefore not practical.Layer increasing method is considerably complicated because of manufacture method, though adding the advantage of tool densification, because right at that time
Densification demand and not as now urgently, unknown to the public always, you near then because of the demand day Yin of high density circuit board, then
Degree becomes the emphasis of Ge Jia manufacturer research and development.Lead to method as the plating with the same processing procedure of dual platen, be still multiple-plate main flow system at present
Make method, and positioned between needing lamina when carrying out and plating logical, not so the phenomenon of dislocation easily occurs, causes multilayer wire
Road plate cannot use, and the radiating effect of multiple plate is generally poor, easily cause internal wiring and cannot be carried out normally
Work, for this reason, a kind of it is proposed that multilayer circuit board.
Utility model content：
The purpose of this utility model is to provide a kind of multilayer circuit board, to solve the radiating proposing in above-mentioned background technology
The problem of effect difference.
For achieving the above object, this utility model provides following technical scheme：A kind of multilayer circuit board, including backplate, institute
The top stating backplate is provided with cavity, and the left and right sides wall of described cavity is provided with locating dowel, the left and right sides of described backplate
Wall is provided with louvre, described cavity be internally provided with monolayer wiring board group, and the size of monolayer wiring board group and cavity
Size match, the left and right sides wall of described monolayer wiring board group is provided with the locating slot matching with locating dowel, described
Monolayer wiring board group includes multigroup monolayer wiring board, is provided with insulating barrier described in two groups between monolayer wiring board, described insulating barrier
Surface be provided with radiating groove.
Preferably, the inwall of described cavity is provided with compound adhesive block film.
Preferably, described locating dowel is thermal grease post.
Preferably, the rectangular array-like of described louvre is arranged on the left and right sides wall of backplate, and louvre runs through shield
The left and right sides wall of plate.
Preferably, the rectangular array-like of described radiating groove is arranged in the surface of insulating barrier.
Preferably, the thickness size of described monolayer wiring board group is identical with the depth size of cavity.
Compared with prior art, the beneficial effects of the utility model are：Compared with existing multilayer circuit board, this practicality is new
Type structure is simple, has good radiating effect, by the locating dowel in the cavity and cavity on backplate to monolayer wiring board group
Carry out positioning action, instead of conventional in plate face, and this open up single registration holes and carry out the mode of para-position easily make
Become that para-position direction is unclear, bit errors are larger, matched with the size of monolayer wiring board group by cavity so that will not during para-position
Dislocation occurs, which reduces bit errors, and on the basis of original multilayer circuit board, this utility model increased
Multiple heat abstractors, such as louvre and radiating groove, and locating dowel is also adopted by thermal grease post so that having of multilayer circuit board is good
Good radiating effect.
Brief description：
Fig. 1 is this utility model structural representation；
Fig. 2 is this utility model lamina group structural representation.
In figure：1 backplate, 2 cavitys, 3 locating dowels, 4 louvres, 5 monolayer wiring board groups, 6 locating slots, 7 monolayer wiring boards, 8
Insulating barrier, 9 radiating grooves.
Specific embodiment：
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely description is it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of making creative work
The every other embodiment being obtained, broadly falls into the scope of this utility model protection.
Refer to Fig. 1-2, this utility model provides a kind of technical scheme：A kind of multilayer circuit board, including backplate 1, described
The top of backplate 1 is provided with cavity 2, and the left and right sides wall of described cavity 2 is provided with locating dowel 3, the left and right two of described backplate 1
Side wall is provided with louvre 4, described cavity 2 be internally provided with monolayer wiring board group 5, and the size of monolayer wiring board group 5
Match with the size of cavity 2, the left and right sides wall of described monolayer wiring board group 5 is provided with and determining that locating dowel 3 matches
Position groove 6, described monolayer wiring board group 5 includes multigroup monolayer wiring board 7, is provided with insulation described in two groups between monolayer wiring board 7
Layer 8, the surface of described insulating barrier 8 is provided with radiating groove 9.
Wherein, the inwall of described cavity 2 is provided with compound adhesive block film, prevents monolayer wiring board group 5 and cavity 2 during rubber alloy
It is bonded together, is not easy to later stage assembling and keeps in repair, described locating dowel 3 is thermal grease post, the rectangular array of described louvre 4
Shape is arranged on the left and right sides wall of backplate 1, and louvre 4 runs through the left and right sides wall of backplate 1, and described radiating groove 9 is rectangular
Array-like is arranged in the surface of insulating barrier 8, and the thickness size of described monolayer wiring board group 5 is identical with the depth size of cavity 2.
Operation principle：Monolayer wiring board 7 and insulating barrier 8 are alternately mounted in the cavity 2 on backplate 1, form single-layer wire
Road plate group 5, arranges radiating groove 9 on the surface of insulating barrier 8, facilitates monolayer wiring board group 5 to be radiated, and improves monolayer wiring board
The radiating effect of group 5, when installation monolayer wiring board group 5 is installed in cavity 2, by the locating dowel 3 on cavity 2 side wall and list
Locating slot 6 in sandwich circuit board group 5 is positioned, then matching by the shapes and sizes of cavity 2 and monolayer wiring board group 5
Close so that whole multilayer circuit board will not occur the phenomenon misplacing in para-position, improve the accuracy of positioning, and utility model
The when thermal grease post that adopts of locating dowel 3, and the outer wall in backplate 1 offers the louvre 4 of insertion so that multilayer circuit board
Radiating effect be greatly improved, this utility model structure is simple, easy to operate, has good heat dispersion and precisely
Positioning.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with multiple changes in the case of without departing from principle of the present utility model and spirit, repair
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of multilayer circuit board, including backplate (1) it is characterised in that：The top of described backplate (1) is provided with cavity (2), institute
The left and right sides wall stating cavity (2) is provided with locating dowel (3), and the left and right sides wall of described backplate (1) is provided with louvre
(4), described cavity (2) be internally provided with monolayer wiring board group (5), and the size of monolayer wiring board group (5) and cavity (2)
Size matches, and the left and right sides wall of described monolayer wiring board group (5) is provided with the locating slot matching with locating dowel (3)
(6), described monolayer wiring board group (5) includes multigroup monolayer wiring board (7), is provided with described in two groups between monolayer wiring board (7)
Insulating barrier (8), the surface of described insulating barrier (8) is provided with radiating groove (9).
2. a kind of multilayer circuit board according to claim 1 it is characterised in that：The inwall of described cavity (2) is provided with multiple
Close adhesive block film.
3. a kind of multilayer circuit board according to claim 1 it is characterised in that：Described locating dowel (3) is thermal grease post.
4. a kind of multilayer circuit board according to claim 1 it is characterised in that：The rectangular array-like of described louvre (4)
It is arranged on the left and right sides wall of backplate (1), and louvre (4) runs through the left and right sides wall of backplate (1).
5. a kind of multilayer circuit board according to claim 1 it is characterised in that：The rectangular array-like of described radiating groove (9)
It is arranged in the surface of insulating barrier (8).
6. a kind of multilayer circuit board according to claim 1 it is characterised in that：The thickness of described monolayer wiring board group (5)
Size is identical with the depth size of cavity (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621012156.2U CN206004995U (en) | 2016-08-30 | 2016-08-30 | A kind of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621012156.2U CN206004995U (en) | 2016-08-30 | 2016-08-30 | A kind of multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206004995U true CN206004995U (en) | 2017-03-08 |
Family
ID=58192484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621012156.2U Expired - Fee Related CN206004995U (en) | 2016-08-30 | 2016-08-30 | A kind of multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206004995U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
-
2016
- 2016-08-30 CN CN201621012156.2U patent/CN206004995U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102883558B (en) | Manufacturing method of single plating hole copper | |
| CN107484356B (en) | Manufacturing method of thick copper sandwich aluminum substrate | |
| CN103384453B (en) | The processing method of the reliable hole of a kind of printed circuit internal layer and line | |
| WO2015078345A1 (en) | Boss-type metal-based sandwich rigid-flex board and preparation method therefor | |
| WO2017107535A1 (en) | Rigid-flex board and preparation method therefor | |
| CN103188890B (en) | A kind of manufacture method of pcb board and a kind of pcb board | |
| CN102802365B (en) | Manufacturing method for embedding copper heat sink into circuit board | |
| CN106572609A (en) | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate | |
| CN103987187A (en) | PCB inlaid with copper block and manufacturing method thereof | |
| CN105517370A (en) | Circuit board pad machining method | |
| CN203696553U (en) | core plate drilling positioning device | |
| CN206004995U (en) | A kind of multilayer circuit board | |
| CN208300107U (en) | A kind of multilayer circuit board | |
| CN104254196A (en) | Asymmetric copper thickness double-sided aluminum substrate and processing method thereof | |
| CN101600298B (en) | Production method of circuit board | |
| CN100596255C (en) | Making method and structure for high power thin line carrier board | |
| CN208400495U (en) | A kind of radiator and a kind of solid state hard disk | |
| TWI749954B (en) | Method for manufacturing circuit board with embedded copper block structure | |
| CN204795855U (en) | Wet -type plated metal base plate of prebored hole | |
| CN204634152U (en) | A kind of quick heat radiating high frequency mixed pressure wiring board | |
| CN102427665B (en) | Manufacturing technology of three-dimensional double-face aluminium substrate | |
| CN103687321A (en) | Machining method for hollow metal graph | |
| CN102814868B (en) | Method for processing graphene plate and processing device thereof | |
| CN111683475A (en) | Production method of composite high-frequency circuit board | |
| CN207460615U (en) | A kind of polytetrafluoroethylene (PTFE) ladder printed circuit board lamination design device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170308 Termination date: 20180830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |